Battery management function board applied to mobile phone

Abstract

The utility model provides a management function board applied to a mobile phone battery, which belongs to the technical field of mobile phone battery function boards and comprises a battery management module, a battery management module and a battery management module. An FPC flexible circuit layer and a PCB hard circuit layer; the through hole windows are formed in the upper end of the FPC flexible circuit layer, line conduction is achieved through alignment of the multiple layers of through hole windows, the overall mechanical stability of the provided mobile phone battery management function board is remarkably enhanced by adopting the integrated forming and pressing design of the FPC flexible circuit layer and the PCB rigid circuit layer, the FPC and the PCB are tightly combined through the pressing technology, and the reliability of the mobile phone battery management function board is improved. Compared with the prior art, the power management system has the advantages that the interlayer separation risk caused by long-term use or external impact is reduced, the durability and reliability of the whole power management system are improved, in addition, the high reliability of electrical connection is ensured through the accurate via hole windowing design and the SMT high-temperature processing technology, signal transmission is more stable, and power transmission is more efficient.

Description

Technical Field

[0001] This utility model belongs to the field of mobile phone battery function board technology, specifically relating to a function board for mobile phone battery management. Background Technology

[0002] With the development of mobile communication technology, smartphones have become an indispensable part of people's daily lives. However, as mobile phone functions become increasingly sophisticated and user habits change, the demands on battery life are also constantly rising. To meet this demand, mobile phone manufacturers not only need to improve the energy density of the battery itself, but also need to optimize the battery management system to improve energy efficiency.

[0003] Traditional battery management systems typically rely on soldering or other mechanical fixing methods to connect the battery to the main circuit board. This method may lead to poor contact due to thermal expansion and contraction during repeated charging processes over long-term use, affecting the battery's lifespan and the system's reliability. Utility Model Content

[0004] The purpose of this utility model is to provide a battery management function board for mobile phones, which aims to solve the problem that in the existing battery management system, when connecting the battery to the main circuit board, the welding or other mechanical fixing methods are usually used. This method may lead to poor contact due to thermal expansion and contraction during repeated charging during long-term use, which affects the battery's lifespan and the system's reliability.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A battery management board for mobile phones includes:

[0007] FPC flexible circuit layer and PCB rigid circuit layer;

[0008] Via openings are made on the upper end of the FPC flexible circuit layer. Multiple via openings are aligned to achieve circuit continuity. The SMT process is used to process the vias at a high temperature of at least 230 degrees Celsius to ensure the continuity of the vias.

[0009] The pads are located on the upper side of the rigid circuit layer of the PCB, and the via openings are flush with the pads.

[0010] As a preferred embodiment of this utility model, a pad is provided at the lower end of the FPC flexible circuit layer, and the pad is flush with the PCB rigid circuit layer.

[0011] In a preferred embodiment of this utility model, the thickness of the FPC flexible circuit layer is 0.2 mm, and the thickness of the PCB rigid circuit layer is 0.8 mm.

[0012] As a preferred embodiment of this utility model, both the FPC flexible circuit layer and the PCB rigid circuit layer are integrally molded and laminated.

[0013] In a preferred embodiment of this invention, the rigid PCB layer is used to connect the flexible FPC layer to the positive and negative terminals of the battery, and is pressed together with the flexible FPC layer to enhance the overall structural strength.

[0014] As a preferred embodiment of this utility model, the lamination between the PCB rigid circuit layer and the FPC flexible circuit layer enhances the mechanical stability of the entire power management functional board.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. In this solution, the integrated molding and lamination design of the FPC flexible circuit layer and the PCB rigid circuit layer significantly enhances the overall mechanical stability of the mobile phone battery management board. The lamination process ensures a tight bond between the FPC and the PCB, reducing the risk of interlayer separation due to long-term use or external impact, and improving the durability and reliability of the entire power management system. Furthermore, the precise via opening design and SMT high-temperature processing ensure high reliability of electrical connections, resulting in more stable signal transmission and more efficient power transmission, thereby extending battery life.

[0017] 2. In this design, the flush mounting plate with the rigid circuit layers of the PCB further optimizes the structural layout, providing better support and flatness. This avoids deformation or displacement of the FPC during use, simplifies the assembly process, and ensures good contact between the FPC and the PCB at all times, enhancing the accuracy of signal transmission and the precision of power management. The compactness and integration of the overall design allow this functional board to achieve optimal performance within a limited space, making it suitable for the requirements of modern smartphones for thinness, lightness, and high performance. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0019] Figure 1 This is a front perspective view of the present invention;

[0020] Figure 2 This is an exploded view of the present invention;

[0021] Figure 3 For the present utility model Figure 2 Enlarged view of the rigid circuit layer in the middle PCB;

[0022] In the diagram: 1. FPC flexible circuit layer; 2. PCB rigid circuit layer; 3. Pad; 4. Via opening; 5. Solder pad. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Example 1

[0025] Please see Figures 1-3 The present invention provides the following technical solution:

[0026] A battery management board for mobile phones includes:

[0027] FPC flexible circuit layer 1 and PCB rigid circuit layer 2;

[0028] Via opening 4 is opened at the top of the FPC flexible circuit layer 1. Multiple via openings 4 are aligned to achieve circuit conduction, and the SMT process is used to process at a high temperature of at least 230 degrees to ensure the conduction of the disk hole.

[0029] Pad 5 is located on the upper side of the rigid circuit layer 2 of the PCB, and via opening 4 is flush with pad 5.

[0030] In a specific embodiment of this utility model, the FPC flexible circuit layer 1 uses a highly flexible polyimide material with good heat resistance and wear resistance. This layer is mainly responsible for connecting the signal transmission between the mobile phone motherboard and the battery. The PCB rigid circuit layer 2 uses glass fiber reinforced epoxy resin as the substrate to ensure the stability of the circuit board. This layer carries the main electronic components. The FPC flexible circuit layer 1 and the PCB rigid circuit layer 2 are connected together using a vacuum lamination process. The multi-layer via windows 4 are aligned vertically, and electrical connections between different layers are achieved through metallization. To ensure good conductivity of the vias, SMT technology was used, and the vias were treated at a high temperature of over 230 degrees Celsius. This effectively melts the solder and fills the vias, thus forming a reliable electrical connection. The pad 5 is aligned with the via opening 4 to ensure that the signal transmitted from the FPC flexible circuit layer 1 can be accurately connected to the electronic components on the PCB rigid circuit layer 2. The entire assembly is placed in a reflow oven and cured at a temperature of at least 230 degrees Celsius to ensure the stability of all solder joints. This device uses a vacuum pressing process to ensure a tight connection and guarantee the reliability of the connection.

[0031] Please refer to the details. Figures 1-3 A pad 3 is provided at the lower end of the FPC flexible circuit layer 1, and the pad 3 is flush with the PCB rigid circuit layer 2.

[0032] In this embodiment, the pad 3 is used to assist in the pressing of the PCB rigid circuit layer 2 and the FPC flexible circuit layer 1 to prevent deformation or displacement during the connection process. After the pressing is completed, the pad 3 is removed.

[0033] Please refer to the details. Figures 1-3 The thickness of the FPC flexible circuit layer 1 is 0.2mm, and the thickness of the PCB rigid circuit layer 2 is 0.8mm.

[0034] In this embodiment, the thickness of the FPC flexible circuit layer 1 is set to 0.2 mm. This thickness ensures sufficient flexibility without affecting the efficiency of signal transmission. The thickness of the PCB rigid circuit layer 2 is set to 0.8 mm. This thickness provides sufficient mechanical strength and also facilitates the installation and heat dissipation of components.

[0035] Please refer to the details. Figures 1-3 Both the FPC flexible circuit layer 1 and the PCB rigid circuit layer 2 are integrally molded and laminated designs.

[0036] In this embodiment, both the FPC flexible circuit layer 1 and the PCB rigid circuit layer 2 are integrally molded, which enhances the consistency and durability of the overall structure.

[0037] Please refer to the details. Figures 1-3The rigid PCB layer 2 is used to connect the flexible FPC layer 1 to the positive and negative terminals of the battery, and is pressed together with the flexible FPC layer 1 to enhance the overall structural strength.

[0038] In this embodiment, the PCB rigid circuit layer 2 is used to connect the FPC flexible circuit layer 1 with the positive and negative terminals of the battery. They are tightly bonded together using lamination technology to improve the overall mechanical strength and reliability.

[0039] Please refer to the details. Figures 1-3 The bonding between the PCB rigid circuit layer 2 and the FPC flexible circuit layer 1 enhances the mechanical stability of the entire power management functional board.

[0040] In this embodiment, an integral molding and pressing design is adopted to enhance the strength and stability of the overall structure. Through the pressing process, the tight bond between the PCB rigid circuit layer 2 and the FPC flexible circuit layer 1 significantly enhances the mechanical stability of the entire power management functional board, making it more robust and durable when facing external stress.

[0041] The working principle and usage process of this utility model are as follows: First, the FPC flexible circuit layer 1 and the PCB rigid circuit layer 2 are pre-treated to ensure that the surface is clean and free of impurities. The FPC flexible circuit layer 1 and the PCB rigid circuit layer 2 are precisely aligned using a precision positioning device. The components to be installed are soldered onto the PCB rigid circuit layer 2 using SMT technology. At the same time, it is ensured that there is good electrical contact between the via opening 4 and the pad 5. The entire assembly is placed in a reflow oven and cured at a temperature of at least 230 degrees Celsius to ensure the stability of all solder joints. This device uses a vacuum pressing process to ensure a tight connection and guarantee the reliability of the connection.

[0042] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A battery management function board for mobile phones, characterized in that, include: FPC flexible circuit layer (1) and PCB rigid circuit layer (2); Via opening (4), the via opening (4) is opened at the upper end of the FPC flexible circuit layer (1), and the circuit is made through alignment of multiple via openings (4), and the SMT process is used to process at least 230 degrees Celsius to ensure the circuit is connected. The pad (5) is located on the upper side of the rigid circuit layer (2) of the PCB, and the via opening (4) is flush with the pad (5).

2. The battery management function board for mobile phones according to claim 1, characterized in that: The lower end of the FPC flexible circuit layer (1) is provided with a pad (3), which is flush with the PCB rigid circuit layer (2).

3. The mobile phone battery management function board according to claim 2, characterized in that: The thickness of the FPC flexible circuit layer (1) is 0.2 mm, and the thickness of the PCB rigid circuit layer (2) is 0.8 mm.

4. The battery management function board for mobile phones according to claim 3, characterized in that: The FPC flexible circuit layer (1) and the PCB rigid circuit layer (2) are both integrally molded and laminated.

5. A mobile phone battery management function board according to claim 4, characterized in that: The PCB rigid circuit layer (2) is used to connect the FPC flexible circuit layer (1) to the positive and negative terminals of the battery, and is pressed together with the FPC flexible circuit layer (1) to enhance the overall structural strength.

6. A mobile phone battery management function board according to claim 5, characterized in that: The bonding between the PCB rigid circuit layer (2) and the FPC flexible circuit layer (1) enhances the mechanical stability of the entire power management functional board.

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