Ball grid array packaging and ball mounting jig

Abstract

The utility model relates to the field of ball grid array packaging, in particular to a ball grid array packaging ball mounting jig which comprises a clamp base and an upper die, the clamp base comprises a base table and a chip table, the chip table is fixed at the upper end of the base table, a chip groove is formed in the middle of the chip table, and the upper die comprises a frame body, a steel mesh and a transparent cover plate. The frame body is connected to the upper end of the base table in a clamped mode, a groove is formed in the upper end of the frame body, a first magnetic attraction strip is embedded in the groove, second magnetic attraction strips magnetically connected with the first magnetic attraction strip are fixed to the two sides of the transparent cover plate, the transparent cover plate is arranged in the groove, and the steel mesh is arranged at the lower end of the frame body. The lower end face of the steel mesh is in contact with the upper end face of the chip table, tin balls cannot fall out due to the existence of the transparent cover plate, meanwhile, the condition of the tin balls can be observed through the transparent cover plate, the structure is simple, and the risk problem that the tin balls fall out is effectively solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the ball grid array package field relates to a ball grid array package ball mounting jig. BACKGROUND

[0002] With the development of modern electronic components, ball grid array package (BGA) devices are more and more widely used in airborne electronic products, and the corresponding electrical assembly process is more and more complex. The process control requirement is higher when replacing components during product repair, especially in the equipment support repair industry. Because it cannot be lead-free process, the components on the market are mainly lead-free process, and the original lead-free tin ball needs to be removed before use, and the tin-lead ball needs to be re-planted. When replacing the common ball grid array package (BGA) device, the mesh is usually used for alignment, tin balls are scattered, the mesh is removed, and the ball is planted by heating. The conventional ball mounting jig is composed of a jig base and an upper mold. The upper mold is composed of a steel mesh and a frame. During the chip ball planting process, the chip is placed on the jig base, and then the upper mold is covered. The tin ball is placed in the frame, and the tin ball passes through the fine hole of the steel mesh to enter the chip below. The conventional way is to manually tilt back and forth to shake the upper mold so that the steel ball passes through the hole to enter the chip. During the shaking process, on the one hand, the tin ball is easy to fall out of the upper mold, and the pouring process needs to be careful.

[0003] Therefore, in order to solve the problem in the prior art, a ball grid array package ball mounting jig with simple structure needs to be designed. INVENTION CONTENTS

[0004] The utility model discloses a ball grid array package ball mounting jig to solve the problem of the prior art.

[0005] The utility model discloses a ball grid array package ball mounting jig can be realized through the following technical scheme: a ball grid array package ball mounting jig includes: jig base and upper mold, the jig base includes base and chip platform, the chip platform is fixed on the upper end of base and is equipped with chip groove in the middle, the upper mold includes frame, steel mesh and transparent cover plate, the frame is clamped on the upper end of base, the upper end of frame is equipped with recess, the recess is inlayed with magnetic attraction strip no.

[0006] Further improvement, the four corners of the chip groove are provided with the avoiding groove, and the chip groove is symmetrically provided with the material taking groove.

[0007] Further improvement, the magnetic attraction strip no. and the magnetic attraction strip no. 2 are symmetrically provided with two groups.

[0008] Further improvement, the upper end of the base is provided with a guide column located outside the chip platform, and the lower end of the frame is provided with a plug hole matched with the guide column.

[0009] Further improvement, the transparent cover plate side is equipped with pull rod.

[0010] Compared with the prior art, the ball grid array packaging ball planting jig has the beneficial effects of:

[0011] The chip is placed in the chip groove of the chip table, then the upper mold is covered on the clamp base, the tin balls are added on the steel mesh above the frame body, the transparent cover plate is placed in the groove, and then the magnetic attraction strip two is magnetically connected through the magnetic attraction strip one, so that the transparent cover plate is fixed, the tin balls fall on the upper surface of the chip from the fine holes on the steel mesh during the process of artificial tilting and shaking the clamp base and the upper mold, and the tin balls cannot fall outwards due to the existence of the transparent cover plate during the shaking process, and meanwhile, the condition of the tin balls can be observed through the transparent cover plate, so that the risk problem of tin ball falling is effectively solved. BRIEF DESCRIPTION OF DRAWINGS

[0012] Fig. 1 It is a structural schematic view of the utility model

[0013] Fig. 2 It is a structural schematic view of the utility model explosion diagram

[0014] Fig. 3 It is a structural schematic view of the utility model cross section view

[0015] In the figure, 1 is a clamp base, 11 is a base, 12 is a chip table, 13 is a chip groove, 131 is a avoiding groove, 132 is a material taking groove, 14 is a guide column, 2 is an upper mold, 21 is a frame body, 211 is a recess, 212 is a magnetic attraction strip one, 22 is a steel mesh, 23 is a transparent cover plate, 231 is a magnetic attraction strip two, 24 is a pull rod, and 25 is a jack. DETAILED DESCRIPTION

[0016] In the description of the utility model, it should be explained that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the utility model.

[0017] In the description of the utility model, it should be explained that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0018] The following describes the embodiments and appendices. Figs. 1-3 The technical solution of this utility model will be further described below.

[0019] Example 1

[0020] A ball grid array (BGA) packaging ball-mounting fixture includes: a clamping base 1 and an upper mold 2. The clamping base 1 includes a base 11 and a chip stage 12. The chip stage 12 is fixed to the upper end of the base 11 and has a chip slot 13 in the middle. The upper mold 2 includes a frame 21, a steel mesh 22 and a transparent cover plate 23. The frame 21 is snapped onto the upper end of the base 11. The upper end of the frame 21 has a groove 211. A magnetic strip 212 is embedded in the groove 211. Magnetic strips 231 that are magnetically connected to the magnetic strips 212 are fixed on both sides of the transparent cover plate 23. The transparent cover plate 23 is disposed in the groove 211. The steel mesh 22 is disposed at the lower end of the frame 21, and the lower end surface of the steel mesh 22 is in contact with the upper end surface of the chip stage 12.

[0021] like Figs. 1-3 As shown, the working principle of this utility model is as follows: The chip is placed in the chip slot 13 of the chip stage 12, and then the upper mold 2 is placed on the fixture base 1. Solder balls are added above the frame 21 onto the stencil 22. The transparent cover plate 23 is placed in the groove 211 and then magnetically connected to the magnetic strip 231 by the magnetic strip 212, thereby fixing the transparent cover plate 23. During the process of manually tilting and shaking the fixture base 1 and the upper mold 2, the solder balls fall from the fine holes of the stencil onto the upper surface of the chip. During the shaking process, the solder balls will not fall out due to the presence of the transparent cover plate 23. At the same time, the condition of the solder balls can be observed through the transparent cover plate 23. The structure is simple and effectively solves the risk of solder balls falling out.

[0022] As a further preferred embodiment, the chip slot 13 is provided with clearance grooves 131 at the four corners, and the chip slot 13 is provided with pick-up grooves 132 symmetrically on the top and bottom. The clearance grooves 131 can protect the four corners of the chip and prevent it from being worn due to impact. At the same time, the pick-up grooves 132 facilitate the chip to be taken out of the chip slot 13.

[0023] As a further preferred embodiment, two sets of magnetic strips 212 and 231 are symmetrically arranged. The attraction force is increased by connecting the two sets of magnetic strips 212 and 231, which further improves the stability of the transparent cover 23 placed on the frame 21.

[0024] As a further preferred embodiment, the upper end of the base 11 is provided with a guide post 14 located outside the chip stage 12, and the lower end of the frame 21 is provided with a matching insertion hole 25. Positioning and installation are achieved through the cooperation of the guide post 14 and the insertion hole 25, thereby improving the accuracy of alignment.

[0025] As a further preferred embodiment, a pull rod 24 is provided on one side of the transparent cover plate 23, which makes it easier to remove the transparent cover plate 23.

[0026] The preferred embodiments of this utility model have been described in detail above. It should be understood that those skilled in the art can make numerous modifications and variations based on the concept of this utility model without creative effort. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of this utility model through logical analysis, reasoning, or limited experimentation on the basis of existing technology should be within the scope of protection defined by the claims.

Claims

1. A ball grid array encapsulation ball-planting fixture, characterized in that, include: The fixture base includes a base platform and a chip platform. The chip platform is fixed to the upper part of the base platform and has a chip slot in the middle. The upper mold includes a frame, a steel mesh, and a transparent cover plate. The frame is snapped onto the upper part of the base platform. The upper end of the frame has a groove. A magnetic strip is embedded in the groove. Magnetic strips are fixed on both sides of the transparent cover plate and are magnetically connected to the magnetic strips. The transparent cover plate is set in the groove. The steel mesh is set at the lower end of the frame, and the lower end face of the steel mesh contacts the upper end face of the chip platform.

2. The ball grid array encapsulation ball-planting fixture according to claim 1, characterized in that, The chip slot has clearance grooves at its four corners and material picking grooves symmetrically arranged at the top and bottom.

3. The ball grid array encapsulation ball-planting fixture according to claim 1, characterized in that, The magnetic strips one and two are symmetrically arranged in two sets.

4. The ball grid array encapsulation ball-planting fixture according to claim 1, characterized in that, The upper end of the base is provided with a guide post located outside the chip stage, and the lower end of the frame is provided with a socket matching the guide post.

5. The ball grid array encapsulation ball-planting fixture according to claim 1, characterized in that, A pull rod is provided on one side of the transparent cover.

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