Carbon dioxide laser packaging device

Abstract

The utility model provides a carbon dioxide laser packaging device, which relates to the technical field of packaging devices and comprises a packaging box and a carbon dioxide laser mechanism, the carbon dioxide laser mechanism is embedded in the carbon dioxide laser mechanism, and the packaging box is provided with a packaging bottom plate at an opening at one end of the carbon dioxide laser mechanism. A packaging top plate is arranged at the opening of the other end of the packaging box, first heat dissipation fins are arranged at the end, close to the carbon dioxide laser mechanism, of the packaging box, the heat dissipation effect of the first heat dissipation fins is improved through a heat dissipation assembly, and during use, by starting a heat dissipation mechanism, external air enters a heat dissipation pipe after passing through an air inlet and a connecting pipe; at the moment, air in the heat dissipation pipe is distributed to each heat dissipation fin under the action of the air outlet, heat volatilization of the second heat dissipation fins is accelerated, in the exhaust process of the heat dissipation pipe, under the action of the sound absorption sleeve, airflow vibration is reduced, and sound generated by airflow blowing out is weakened.

Description

TECHNICAL FIELD

[0001] The utility model relates to encapsulation device technical field especially relates to a carbon dioxide laser encapsulation device. BACKGROUND

[0002] Carbon dioxide laser is a commonly used gas laser, is widely used in industrial cutting, welding, engraving and medical field, and its encapsulation device is the key to guarantee the stability, performance and life of the laser.

[0003] Therefore carbon dioxide laser needs to use the encapsulation device that is compatible with it to protect and seal carbon dioxide laser in the process of using, avoids the device from being damaged when using, since carbon dioxide laser will produce heat in the process of using, therefore needs to set up a heat dissipation mechanism on the encapsulation device and carries out heat dissipation, prevents the temperature of encapsulation device from being too high.

[0004] However, the existing encapsulation heat dissipation mechanism mostly adopts heat dissipation fin to carry out heat dissipation, and this mode can effectively export the heat in the encapsulation device, but the heat dissipation effect is low, therefore increases the fan blade near the heat dissipation fin to improve the heat dissipation effect, but only depends on the increase of fan blade and can not effectively improve the heat dissipation effect, because the fan blade has heat dissipation dead angle.

[0005] Therefore the utility model provides a carbon dioxide laser encapsulation device. UTILITY MODEL CONTENT

[0006] The utility model aims at solving the shortcomings in the prior art, and provides a carbon dioxide laser encapsulation device.

[0007] In order to realize the above purpose, the utility model adopts the following technical scheme: a carbon dioxide laser encapsulation device, including encapsulation box and carbon dioxide laser mechanism, carbon dioxide laser mechanism is inlaid and is installed with carbon dioxide laser mechanism, the encapsulation box is located at the opening of carbon dioxide laser mechanism one end and is provided with encapsulation bottom plate, the other end opening of the encapsulation box is provided with encapsulation top plate, the one end of the encapsulation box close to carbon dioxide laser mechanism is provided with first heat dissipation fin, the one end of the encapsulation box close to encapsulation top plate is provided with second heat dissipation fin, and the top of the encapsulation top plate is provided with heat dissipation assembly.

[0008] The heat dissipation assembly includes heat dissipation mechanism and heat dissipation pipe, the heat dissipation mechanism is connected with the encapsulation top plate, the heat dissipation pipe is inlaid and is installed in the second heat dissipation fin, and the heat dissipation pipe and the heat dissipation mechanism are fixedly connected and communicated with the connecting pipe, the two ends of the connecting pipe are communicated with the heat dissipation pipe and the heat dissipation mechanism respectively, and the heat dissipation pipe is provided with air outlet.

[0009] As a preferred implementation form, the heat dissipation pipe is embedded with a sound absorbing sleeve, the sound absorbing sleeve is provided with through holes, and the through holes are arranged at the same positions as the air outlets.

[0010] The beneficial effect of the further scheme is that, due to the structural design of the air outlet, when the airflow passes through the air outlet, the vortex generated will periodically fall off, thereby causing vibration, which will generate sound waves, and then form a whistle sound, which will produce noise, so the sound absorbing sleeve is needed to reduce the noise, thereby reducing the noise generated during use of the heat dissipation pipe.

[0011] As a preferred implementation form, the top of the heat dissipation mechanism is fixedly connected with air inlets, the air inlets are arranged in pairs, and the air inlets are symmetrically arranged at the center of the heat dissipation mechanism, and the air inlets are provided with protective covers.

[0012] The beneficial effect of the further scheme is that when the heat dissipation mechanism is turned on, external airflow enters the inside of the heat dissipation mechanism through the air inlets, and at this time, the airflow about to enter the heat dissipation mechanism is blocked under the action of the protective cover, so as to prevent large dust from entering the inside of the heat dissipation mechanism.

[0013] As a preferred implementation form, the bottom of the packaging top plate is provided with limiting pins, the limiting pins are arranged in four, and the limiting pins are arranged in a rectangular shape, the top of the packaging box is provided with a plug hole, and the limiting pins are slidably connected in the plug hole.

[0014] The beneficial effect of the further scheme is that the limiting pins arranged at the bottom of the packaging top plate are used to position the packaging top plate and the packaging box under the action of the limiting pins when the two are attached, so as to prevent displacement of the packaging top plate and the packaging box after the two are clamped by the lock catch seat and the lock catch.

[0015] As a preferred implementation form, the heat dissipation mechanism is provided with lock catch seats at both ends, the top of the packaging box is provided with lock catches at both ends, and the lock catch seats and the lock catches are clamped with each other.

[0016] The beneficial effect of the further scheme is that the lock catch and the lock catch seat are clamped with each other to achieve the effect of quick disassembly, thereby improving the convenience of later maintenance of the electronic components in the packaging box.

[0017] As a preferred implementation form, the copper sheet is arranged outside the carbon dioxide laser mechanism in the packaging box and arranged in a rectangular shape.

[0018] The beneficial effect of adopting the further scheme is that the copper sheet arranged outside the carbon dioxide laser mechanism mainly functions to enhance heat dissipation, the copper has excellent heat conduction performance, can effectively conduct the heat generated inside the carbon dioxide laser mechanism out, thereby helping the carbon dioxide laser mechanism to maintain a suitable working temperature and preventing overheating, so that the stability and service life of the carbon dioxide laser mechanism are improved.

[0019] Compared with the prior art, the advantages and positive effects of the utility model lie in that:

[0020] 1、the utility model discloses, through the heat dissipation subassembly increase the heat dissipation effect of first radiating fin, when using, through the opening of heat dissipation mechanism, at this time, the air of outside enters the inside of the heat dissipation pipe after passing through the air inlet and the connecting pipe, at this time, the air in the heat dissipation pipe under the action of the air outlet, shunt to every radiating fin, accelerate the heat volatilization of second radiating fin, in the process of the exhaust of heat dissipation pipe, under the action of the sound absorbing sleeve, reduce the airflow vibration, make the sound that the airflow blows out produces weaken.

[0021] 2、the utility model discloses, the packaging top board and the packaging box are the split type structure, the advantage of this structure is that, when maintaining electronic component later, after separating lock catch and lock catch seat, can separate the packaging top board and the packaging box, when lock catch and lock catch seat are in the interlocking state, limit pin and slot are mutually connected, and the packaging top board is positioned, prevent the left and right displacement of the packaging top board in the process of using. DRAWINGS

[0022] Figure 1 It is a front view of the carbon dioxide laser packaging device of the utility model;

[0023] Figure 2 It is a split view of the carbon dioxide laser packaging device of the utility model;

[0024] Figure 3 It is a packaging box bottom structure schematic view in the carbon dioxide laser packaging device of the utility model;

[0025] Figure 4 It is a split view of the heat dissipation assembly in the carbon dioxide laser packaging device of the utility model;

[0026] Figure 5 It is a split view of the heat dissipation in the carbon dioxide laser packaging device of the utility model.

[0027] REFERENCE NUMERALS

[0028] 1, packaging box;11, carbon dioxide laser mechanism;12, first radiating fin;13, second radiating fin;14, lock catch;15, packaging top board;16, limit pin;17, packaging bottom plate;171, copper sheet;

[0029] 2. Heat dissipation components; 21. Heat dissipation mechanism; 22. Air inlet; 23. Protective cover; 24. Connecting pipe; 25. Heat dissipation pipe; 251. Air outlet; 252. Sound-absorbing sleeve; 26. Locking seat. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] like Figures 1-5 As shown, this utility model provides a technical solution: a carbon dioxide laser packaging device, including a packaging box 1 and a carbon dioxide laser mechanism 11. A carbon dioxide laser mechanism 11 is embedded within the packaging box 1. A packaging bottom plate 17 is provided at one end opening of the packaging box 1, and a packaging top plate 15 is provided at the other end opening of the packaging box 1. A first heat dissipation fin 12 is provided at one end of the packaging box 1 near the carbon dioxide laser mechanism 11, and a second heat dissipation fin 13 is provided at one end of the packaging box 1 near the packaging top plate 15. A heat dissipation assembly 2 is provided on the top of the packaging top plate 15; the heat dissipation assembly 2 includes a heat dissipation mechanism 21 and a heat dissipation pipe 25. The heat dissipation mechanism 21 is connected to the packaging top plate 15, and the heat dissipation pipe 25 is embedded in the second heat dissipation fin 13. Inside the heat sink 13, a connecting pipe 24 is fixedly connected between the heat sink 25 and the heat dissipation mechanism 21. The two ends of the connecting pipe 24 are respectively connected to the heat sink 25 and the heat dissipation mechanism 21. An air outlet 251 is provided on the heat sink 25. A copper sheet 171 is embedded and installed in the outer side of the carbon dioxide laser mechanism 11 inside the encapsulation box 1. The copper sheet 171 is rectangularly distributed. The heat dissipation effect of the first heat sink 12 is increased by the heat dissipation component 2. When in use, by opening the heat dissipation mechanism 21, the outside air enters the heat sink 25 through the air inlet 22 and the connecting pipe 24. At this time, the air inside the heat sink 25 is diverted to each heat sink fin under the action of the air outlet 251, which accelerates the heat dissipation of the second heat sink 13 and solves the technical problem of poor heat dissipation effect of the second heat sink 13.

[0032] Going further, such as Figure 1 - Figure 2As shown: the bottom of the packaging top plate 15 is provided with a limiting pin 16, the limiting pin 16 is provided with four, and the four limiting pins 16 are distributed in a rectangular shape, the top of the packaging box 1 is provided with a insertion hole, the limiting pin 16 is slidably connected in the insertion hole, the both ends of the heat dissipation mechanism 21 are provided with a lock seat 26, the both ends of the top of the packaging box 1 are provided with a lock 14, the lock seat 26 and the lock 14 are mutually clamped, the packaging top plate 15 and the packaging box 1 are of a split structure, the advantage of the structure is that when the electronic element is maintained in the later period, the lock 14 and the lock seat 26 are separated, then the packaging top plate 15 and the packaging box 1 can be separated, when the lock 14 and the lock seat 26 are in the clamped state, the limiting pin 16 and the insertion slot are mutually clamped, the packaging top plate 15 is limited, the left and right displacement of the packaging top plate 15 in the using process is prevented, and the technical problem that the packaging box 1 is inconvenient to disassemble is solved.

[0033] The above scheme still has the problem that dust is easy to enter when the heat dissipation mechanism 21 inhales, for example, Figure 1 As shown: the top of the heat dissipation mechanism 21 is fixedly connected with an air inlet 22, the air inlet 22 is provided with two, and the two air inlets 22 are mutually symmetrical at the center of the heat dissipation mechanism 21, the two air inlets 22 are provided with a protective cover 23, when the heat dissipation mechanism 21 is opened, external airflow enters the inside of the heat dissipation mechanism 21 through the air inlet 22, at this time, under the action of the protective cover 23, the airflow about to enter the inside of the heat dissipation mechanism 21 is blocked, and large dust is prevented from entering the inside of the heat dissipation mechanism 21.

[0034] The above scheme still has the problem that noise is large when the heat dissipation pipe 25 exhales, for example, Figure 5 As shown: the heat dissipation pipe 25 is embedded with a sound absorbing sleeve 252, the sound absorbing sleeve 252 is provided with a through hole, the distribution position of the through hole is same as that of the air outlet 251, due to the structural design of the air outlet 251, when airflow passes through the air outlet 251, the vortex generated will periodically fall off, thereby causing vibration, the vibration will generate sound waves, and then form a whistle sound, and noise will be generated, therefore, the sound absorbing sleeve 252 is needed to reduce the noise, thereby reducing the noise generated when the heat dissipation pipe 25 is used.

[0035] In the utility model, the side of the packaging box 1 close to the packaging top plate 15 is embedded with a circuit panel, the circuit panel is electrically connected with the carbon dioxide laser mechanism 11, and the carbon dioxide laser mechanism 11 is controlled to open or close through the circuit panel.

[0036] In the utility model, the sound absorbing sleeve 252 is made of polyurethane or polyethylene foam material, and the inner wall of the sound absorbing sleeve 252 has a complex shape such as a wedge shape and a foam shape, which can effectively absorb high-frequency sound waves.

[0037] In this utility model, the heat dissipation mechanism 21 consists of fan blades and a power mechanism. The power mechanism is connected to the fan blades. When the power mechanism is turned on, it drives the fan blades to rotate. Under the action of the fan blades, external air is drawn into the air inlet 22 and introduced into the heat dissipation pipe 25 through the connecting pipe 24.

[0038] Working principle:

[0039] like Figures 1-5 As shown, the device is first set in a designated position, and then the heat dissipation mechanism 21 is turned on. At this time, the air in the heat dissipation pipe 25 is diverted to each heat dissipation fin under the action of the air outlet 251, which accelerates the heat dissipation of the second heat dissipation fin 13. During the exhaust process of the heat dissipation pipe 25, the airflow vibration is reduced under the action of the sound-absorbing sleeve 252, which weakens the sound generated by the airflow. The carbon dioxide laser mechanism 11 is turned on to work. When the carbon dioxide laser mechanism 11 works, the heat rises. At this time, under the action of the first heat dissipation fin 12 and the second heat dissipation fin 13, the heat in the encapsulation box 1 is absorbed, and the heat dissipation component 2 accelerates the heat dissipation.

[0040] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A carbon dioxide laser packaging device, comprising a packaging box (1) and a carbon dioxide laser mechanism (11), the carbon dioxide laser mechanism (11) is embeddedly arranged with the carbon dioxide laser mechanism (11), characterized in that, The packaging box (1) is provided with a packaging bottom plate (17) at one end opening of the carbon dioxide laser mechanism (11), the other end opening of the packaging box (1) is provided with a packaging top plate (15), the packaging box (1) is provided with a first heat dissipation fin (12) close to one end of the carbon dioxide laser mechanism (11), the packaging box (1) is provided with a second heat dissipation fin (13) close to one end of the packaging top plate (15), and the top of the packaging top plate (15) is provided with a heat dissipation assembly (2); The heat dissipation assembly (2) comprises a heat dissipation mechanism (21) and a heat dissipation pipe (25), the heat dissipation mechanism (21) is connected with the packaging top plate (15), the heat dissipation pipe (25) is embeddedly installed in the second heat dissipation fin (13), and the heat dissipation pipe (25) and the heat dissipation mechanism (21) are fixedly and communicatively connected with the connecting pipe (24), the two ends of the connecting pipe (24) are respectively communicated with the heat dissipation pipe (25) and the heat dissipation mechanism (21), and the heat dissipation pipe (25) is provided with an air outlet (251).

2. A carbon dioxide laser package as claimed in claim 1, characterized in that: The sound absorbing sleeve (252) is embeddedly installed in the heat dissipation pipe (25), the sound absorbing sleeve (252) is provided with a through hole, and the distribution position of the through hole is the same as that of the air outlet (251).

3. The carbon dioxide laser package of claim 1, wherein: The heat dissipation mechanism (21) is fixedly and communicatively connected with the air inlet (22) at the top, the air inlet (22) is provided with two, and the two air inlets (22) are symmetrically arranged at the center of the heat dissipation mechanism (21), and the two air inlets (22) are provided with protective covers (23).

4. The carbon dioxide laser package of claim 1, wherein: The bottom of the packaging top plate (15) is provided with four limiting pins (16), the limiting pins (16) are arranged in a rectangular shape, and the top of the packaging box (1) is provided with a plug hole, and the limiting pins (16) are slidably connected in the plug hole.

5. The carbon dioxide laser package of claim 1, wherein: The two ends of the heat dissipation mechanism (21) are provided with lock seats (26), and the top of the packaging box (1) is provided with lock buckles (14), and the lock seats (26) and the lock buckles (14) are mutually clamped.

6. The carbon dioxide laser package of claim 1, wherein: The copper sheet (171) is embeddedly installed outside the carbon dioxide laser mechanism (11) in the packaging box (1), and the copper sheet (171) is arranged in a rectangular shape.

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