Armored temperature and pressure integrated sensor

Abstract

The utility model relates to an armored temperature and pressure integrated sensor, and the sensor comprises an armored housing which comprises a housing body and a sleeve connected with the housing body, and the sleeve is internally provided with a closed cavity; the circuit board is arranged in the armored shell; the temperature sensing element is mounted in the closed cavity; the support is arranged in the armored shell and comprises a support body, a metal terminal is arranged in the support body, one end of the metal terminal extends into the armored shell to be connected with the temperature sensing element, and the other end of the metal terminal extends out of the support body to be connected with the circuit board; and the pressure sensing element is mounted in the bracket and connected with the circuit board, and the pressure sensing element is used for detecting the pressure of an external pressure source. While temperature and pressure are measured synchronously, the excellent performance of the armored shell effectively protects internal elements from external physical impact, electromagnetic interference, severe temperature fluctuation and the like, it is ensured that the sensor can work stably and reliably in a complex environment and a complex medium, and the measurement precision is ensured.

Description

Technical Field

[0001] This application relates to the field of sensor technology, and in particular to an armored temperature and pressure integrated sensor. Background Technology

[0002] With the rapid development of the new energy industry, real-time monitoring of the internal temperature and pressure of key equipment such as electric vehicles and new energy storage systems is crucial for safe operation and efficiency optimization. However, existing sensors still have significant shortcomings, specifically in the following aspects:

[0003] 1. Insufficient Single-Parameter Measurement and Integration: Traditional sensors can typically only measure temperature or pressure parameters individually. If both data points need to be acquired simultaneously, multiple independent sensors must be installed (e.g., temperature and pressure sensors are set up separately). This not only increases equipment cost and size but may also lead to problems such as asynchronous measurement data and decreased accuracy due to differences in installation location, making it difficult to meet the high requirements of new energy equipment for multi-parameter collaborative monitoring.

[0004] 2. Poor adaptability to complex environments: In the actual application scenarios of new energy equipment, sensors often face complex working conditions such as strong electromagnetic interference, drastic temperature fluctuations, high-frequency vibrations and media containing impurities. Existing sensors are prone to problems such as signal drift, response delay or insufficient stability under long-term operation under complex working conditions, resulting in a significant reduction in measurement accuracy and reliability.

[0005] 3. Limitations of existing integrated solutions: For example, Chinese patent application CN22410657405.6 discloses an integrated temperature and pressure sensor, which adopts an open structure design, directly exposing the temperature sensing element to the measured medium. Although this solution achieves integrated measurement of temperature and pressure, it still has the following drawbacks:

[0006] Poor media compatibility: When the measured medium is a conductive liquid or gas, the temperature sensing element may fail due to short circuit, leading to functional paralysis; Weak anti-contamination ability: If the cleanliness of the medium is low (such as containing particulate impurities or conductive contaminants), impurities are easy to accumulate inside the open protective cap, causing the sensor response time to be prolonged, or even causing abnormal resistance of the temperature sensing element due to the adhesion of conductive impurities, leading to system misjudgment; Insufficient long-term reliability: The open design makes it difficult to ensure the structural stability and measurement consistency of the sensor in harsh environments such as high temperature and vibration.

[0007] There is currently no effective solution to the aforementioned problems in the existing technology. Summary of the Invention

[0008] To address the aforementioned issues, this application provides an armored temperature and pressure integrated sensor. While achieving simultaneous temperature and pressure measurement, the excellent performance of the armored shell effectively protects the internal components from external physical impacts, electromagnetic interference, and drastic temperature fluctuations, ensuring that the sensor can operate stably and reliably in complex environments and media, thus guaranteeing measurement accuracy.

[0009] Specifically, the following technical solutions are included:

[0010] This application provides an armored temperature and pressure integrated sensor, including:

[0011] An armored shell includes a shell body and a sleeve connected to the shell body. The shell body is provided with at least one first pressure-inlet hole arranged around the sleeve and an annular groove communicating with the first pressure-inlet hole. The first pressure-inlet hole communicates with the outside and is used to introduce an external pressure source. The sleeve is provided with a closed cavity.

[0012] The circuit board is disposed inside the armored housing;

[0013] A temperature sensing element is installed inside the enclosed cavity;

[0014] A bracket, disposed within the armored housing, includes a bracket body. A metal terminal is disposed within the bracket body. One end of the metal terminal extends into the armored housing and is connected to the temperature sensing element, while the other end extends out of the bracket body and is connected to the circuit board. The metal terminal is used to transmit the temperature signal detected by the temperature sensing element to the circuit board.

[0015] A pressure sensing element is installed inside the bracket and connected to the circuit board. The pressure sensing element is connected to the annular groove. The pressure sensing element is used to detect the pressure of the external pressure source introduced by the first pressure inlet and transmit the detected pressure signal to the circuit board.

[0016] In one embodiment of this application, the bracket body is provided with a receiving groove, a second sealing element mounting groove adjacent to the receiving groove, and a second pressure-sensing hole. A second sealing element is provided in the second sealing element mounting groove. The pressure sensing element is placed in the receiving groove and is sealed to the bracket body through the second sealing element. The second sealing element is a hollow structure. The second pressure-sensing hole passes through the hollow structure of the second sealing element and communicates with the pressure sensing element. The second pressure-sensing hole communicates with the annular groove of the armor shell. An external pressure source communicates with the pressure sensing element through the first pressure-sensing hole, the annular groove, and the second pressure-sensing hole in sequence, so that the pressure sensing element detects the pressure of the external pressure source introduced by the first pressure-sensing hole.

[0017] In one embodiment of this application, a connector is further included. The housing body has an opening in the mounting cavity. One end of the connector is inserted into the mounting cavity through the opening and is sealed to the housing body by a first sealing element. The connector has a plurality of pins inserted into the mounting cavity of the armored housing and connected to the circuit board. The circuit board, pressure sensing element, and bracket are mounted in the mounting cavity.

[0018] In one embodiment of this application, a fifth sealing element mounting groove and a threaded portion are provided on the outer side of the outer shell body away from the mounting cavity. The fifth sealing element mounting groove is equipped with a fifth sealing element, and the threaded portion is used to connect the outer shell body to an external device and to seal it through the fifth sealing element.

[0019] In one embodiment of this application, a fourth sealing element mounting groove is provided at one end of the sleeve near the mounting cavity, a fourth sealing element is installed in the fourth sealing element mounting groove, and the sleeve and the bracket are sealed and connected by the fourth sealing element.

[0020] In one embodiment of this application, the outer shell body is provided with a third sealing element mounting groove communicating with the mounting cavity, the third sealing element mounting groove is equipped with a third sealing element, and the bracket and the outer shell body of the armored shell are sealed and connected by the third sealing element; the annular groove is located between the third sealing element and the fourth sealing element, so as to seal and connect the annular groove with the second pressure hole.

[0021] In one embodiment of this application, the sleeve and the outer shell body have the same axis, so that the sleeve, the first pressure-guiding hole on the outer periphery of the sleeve and the outer shell body are concentric, and the first pressure-guiding hole on the outer periphery of the sleeve is evenly distributed in the circumferential direction; or, the sleeve and the outer shell body have different axes, so that the sleeve, the first pressure-guiding hole on the outer periphery of the sleeve and the outer shell body are eccentric.

[0022] In one embodiment of this application, the temperature sensing element is a negative temperature coefficient thermistor, and the space between the sleeve and the temperature sensing element is filled with a thermally conductive insulating material; the pressure sensing element is a piezoresistive ceramic module; and the circuit board is a flexible printed circuit board.

[0023] In one embodiment of this application, the bracket body has buckles on both sides, and the connector has a slot at its end. The bracket and the connector are connected by the buckles and the slots engaging. One end of the circuit board has a hanging ear structure, and the bracket body has protrusions on both sides facing the circuit board. The metal terminal extends out of the protrusion and connects to the circuit board, and the protrusion is adapted to the hanging ear structure. One end of the metal terminal that connects to the temperature sensing element has a pad structure. One end of the pad structure has a guide groove for inserting the pins of the temperature sensing element. The guide groove is a semi-circular structure to prevent the pins of the temperature sensing element from slipping out. The other end of the pad structure has a positioning groove for fixing the pins of the temperature sensing element.

[0024] In one embodiment of this application, a flange structure is provided at the bottom of the armored outer shell, and a positioning plane is provided on one side of the flange structure.

[0025] Compared with the prior art, the beneficial effects of this application are:

[0026] Integrated Design: The armored temperature and pressure integrated sensor provided in this application integrates high-precision temperature and pressure sensing elements within the armored housing. The temperature sensing element uses a thermistor, measuring temperature based on the characteristic of its resistance changing with temperature. The pressure sensing element uses a piezoresistive ceramic module, converting pressure changes into electrical signals, providing high sensitivity and accurate pressure measurement capabilities. The spatial layout of these two sensing elements is carefully designed to ensure both independence from interference and synchronous measurement of temperature and pressure at the same monitoring point. This avoids the increased cost, larger size, and poor data synchronization issues associated with installing multiple separate sensors, providing a simple and efficient temperature and pressure monitoring solution for the equipment.

[0027] High reliability: The armored temperature and pressure integrated sensor provided in this application has an excellent armored shell that effectively protects the internal components from external physical impacts, electromagnetic interference, and drastic temperature fluctuations, ensuring that the sensor can work stably and reliably in complex environments and media, and ensuring measurement accuracy.

[0028] High accuracy: It adopts advanced piezoresistive pressure sensing technology, combined with signal conditioning and conversion of precision flexible printed circuit board and data fusion processing, so that the measured temperature and pressure data and the final output temperature and pressure comprehensive data have high accuracy, which can meet the strict requirements of relevant equipment for temperature and pressure monitoring. Attached Figure Description

[0029] Figure 1 An exploded view of an armored thermo-barometric sensor provided in an embodiment of this application.

[0030] Figure 2 This is a cross-sectional view of an armored thermo-pressure integrated sensor provided in an embodiment of this application.

[0031] Figure 3 This is a cross-sectional view of an armored outer shell provided in an embodiment of this application.

[0032] Figure 4 A perspective view of an armored shell provided in an embodiment of this application.

[0033] Figure 5 This is a perspective view of a bracket provided in an embodiment of this application.

[0034] Figure 6 This is a perspective view of the bracket provided in one embodiment of this application.

[0035] Figure 7 This is a cross-sectional view of a bracket provided in one embodiment of this application.

[0036] Figure 8 A bottom view of a bracket provided in an embodiment of this application.

[0037] Figure 9 This is a schematic diagram of the assembly of a bracket provided in one embodiment of this application.

[0038] Figure 10 A perspective view of a flexible printed circuit board provided in an embodiment of this application.

[0039] Figure 11 This is a schematic diagram of the assembly of a connector provided in an embodiment of this application.

[0040] Figure 12 A perspective view of an armored thermo-pressure integrated sensor provided in another embodiment of this application.

[0041] Figure 13 A cross-sectional view of an armored outer shell provided in yet another embodiment of this application.

[0042] Figure 14 This is a schematic diagram of the assembly of a connector provided in another embodiment of this application.

[0043] In the diagram: 1. Connector; 11. First seal; 12. Second seal; 13. Third seal; 14. Fourth seal; 15. Fifth seal; 16. Slot; 17. Pin; 2. Bracket; 20. Bracket body; 21. Metal terminal; 22. Receiving groove; 23. Second pressure hole; 24. Second seal mounting groove; 25. Pad structure; 26. Guide groove; 27. Positioning groove; 28. Boss; 29. ​​Buckle; 3. Armored housing; 31. First pressure hole; 32. Annular groove; 33. Sleeve; 331. Fourth seal mounting groove; 34. Threaded part; 35. Housing body; 36. Mounting cavity; 37. Third seal mounting groove; 38. Fifth seal mounting groove; 39. Closed cavity; 310. Flange structure; 311. Positioning plane; 4. Circuit board; 41. Lug structure; 5. Temperature sensing element; 6. Pressure sensing element. Detailed Implementation

[0044] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0045] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0046] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0047] This application provides an armored temperature and pressure integrated sensor for accurate and reliable synchronous monitoring of temperature and pressure within equipment.

[0048] like Figures 1 to 11As shown, in some embodiments, the armored temperature and pressure integrated sensor includes a connector 1 and an armored housing 3 connected to the connector 1. The armored housing 3 is provided with a flexible printed circuit board 4, a pressure sensing element 6, a bracket 2 and a temperature sensing element 5. The pressure sensing element 6 is installed in the bracket 2 and connected to the flexible printed circuit board 4. The temperature sensing element 5 is connected to the flexible printed circuit board 4 through the bracket 2.

[0049] In some embodiments, the armored housing 3 includes a housing body 35, and the housing body 35 is provided with an installation cavity 36 having an opening. One end of the connector 1 is inserted into the installation cavity 36 through the opening of the installation cavity 36 and is sealed to the housing body 35 by a first sealing member 11. The flexible printed circuit board 4, the pressure sensing element 6, and the bracket 2 are installed in the installation cavity 36.

[0050] Furthermore, a sleeve 33 is connected to one end of the outer shell 35 away from the mounting cavity 36. A closed cavity 39 is provided inside the sleeve 33. The temperature sensing element 5 is installed in the closed cavity 39. Thermally conductive insulating material is filled between the sleeve 33 and the temperature sensing element 5.

[0051] In this embodiment, the closed cavity 39 of the sleeve 33 is used to install the temperature sensing element 5, and the space between the sleeve 33 and the temperature sensing element 5 is filled with a thermally conductive insulating material. This arrangement isolates the temperature sensing element 5 from the outside world, so that the sleeve 33 can protect the temperature sensing element 5 from external physical impacts, electromagnetic interference, and drastic temperature fluctuations, ensuring that the temperature sensing element 5 can work stably and reliably in complex environments and media, and ensuring its measurement accuracy.

[0052] The outer shell 35 and the sleeve 33 can be integrally machined into a single unit, or they can be machined separately and then assembled into a single unit using processes not limited to welding and riveting, or other special processes. When the sleeve 33 is machined independently, different materials can be used depending on the operating conditions to give it high strength, excellent electromagnetic shielding performance, and excellent resistance to drastic temperature fluctuations. The surface of the sleeve 33 can also be specially treated to give it better corrosion resistance and adapt to the complex operating environments of more equipment.

[0053] Furthermore, at least one first pressure-inducing hole 31 is provided at the end of the outer shell body 35 away from the mounting cavity 36, which is arranged around the sleeve 33. The first pressure-inducing hole 31 is connected to the outside and is used to introduce an external pressure source. The outer shell body 35 is also provided with an annular groove 32 that communicates with the first pressure-inducing hole 31.

[0054] Optionally, the sleeve 33 and the outer shell body 35 have the same axis, so that the sleeve 33, the first pressure-guiding hole 31 on the outer periphery of the sleeve 33 and the outer shell body 35 are concentric; the first pressure-guiding hole 31 on the outer periphery of the sleeve 33 can be evenly distributed in the circumferential direction; or, the sleeve 33 and the outer shell body 35 have different axes, so that the sleeve 33, the first pressure-guiding hole 31 on the outer periphery of the sleeve 33 and the outer shell body 35 are eccentric.

[0055] Since the sleeve 33 requires an environmental seal and is not allowed to communicate with the outside world, when the sensor installation interface size boundary conditions are limited, the sleeve 33 and the first pressure hole 31 and the outer shell body 35 can be designed as an eccentric structure to achieve the functionality of the sensor while successfully completing the sensor installation.

[0056] Optionally, the outer side of the housing body 35 away from the mounting cavity 36 is provided with a fifth sealing element mounting groove 38 and a threaded portion 34 adjacent to the fifth sealing element mounting groove 38. The fifth sealing element mounting groove 38 is equipped with a fifth sealing element 15. The threaded portion 34 is used to connect the housing body 35 to an external device and to seal it through the fifth sealing element 15.

[0057] The fifth sealing element 15 can be installed on the housing body 35 or on the mating interface valve seat of the external equipment. The sealing form includes, but is not limited to, end face sealing and radial sealing.

[0058] Optionally, a fourth sealing element mounting groove 331 is provided at one end of the sleeve 33 near the mounting cavity 36, and a fourth sealing element 14 is installed in the fourth sealing element mounting groove 331. The sleeve 33 and the bracket 2 are sealed together by the fourth sealing element 14.

[0059] In this embodiment, a fourth sealing element 14 is provided between the sleeve 33 and the bracket 2 to seal the environment inside the closed cavity 39 within the sleeve 33, thereby ensuring the environmental sealing of the space where the temperature sensing element 5 is located. The sealing method is not limited to end face sealing or radial sealing, and the mounting groove for placing the fourth sealing element 14 can be provided on the bracket 2 in addition to being provided on the sleeve 33 as described above.

[0060] Optionally, the armor shell 3 is made of metal, and the other components can be assembled inside the armor shell 3 by means of riveting, snap rings, threads, etc.

[0061] In some embodiments, the bracket 2 includes a bracket body 20, and a metal terminal 21 is provided inside the bracket body 20. One end of the metal terminal 21 extends into the closed cavity 39 of the armor shell 3 and is connected to the temperature sensing element 5, and the other end extends out of the bracket body 20 and is connected to the flexible printed circuit board 4. The metal terminal 21 is used to transmit the temperature signal detected by the temperature sensing element 5 to the flexible printed circuit board 4.

[0062] Furthermore, the bracket body 20 is provided with a receiving groove 22, a second sealing element mounting groove 24 adjacent to the receiving groove 22, and a second pressure-sensing hole 23. A second sealing element 12 is provided in the second sealing element mounting groove 24. The pressure sensing element 6 is placed in the receiving groove 22 and is sealed to the bracket body 20 through the second sealing element 12. The second sealing element 12 is a hollow structure. The second pressure-sensing hole 23 passes through the hollow structure of the second sealing element 12 and communicates with the pressure sensing element 6. The second pressure-sensing hole 23 communicates with the annular groove 32 of the armor shell 3. An external pressure source communicates with the pressure sensing element 6 through the first pressure-sensing hole 31, the annular groove 32, and the second pressure-sensing hole 23 in sequence.

[0063] In this embodiment, the first pressure-inlet hole 31 of the outer shell 35 communicates with the outside to introduce an external pressure source. The first pressure-inlet hole 31 communicates with the second pressure-inlet hole 23 through the annular groove 32. The second sealing member 12 has a hollow structure, and the second pressure-inlet hole 23 passes through the hollow structure of the second sealing member 12 to communicate with the pressure sensing element 6. Thus, the external pressure source is introduced into the pressure sensing element 6 through the pressure channel formed by the first pressure-inlet hole 31, the annular groove 32, and the second pressure-inlet hole 23 in sequence. The pressure sensing element 6 then measures the pressure of the external pressure source. The second sealing member 12 can achieve a sealed connection between the pressure sensing element 6 and the bracket body 20, preventing pressure leakage from the gap at the connection between the pressure sensing element 6 and the bracket body 20, thereby ensuring the accuracy of the sensor pressure measurement. The design of the annular groove 32 makes it easier to assemble the bracket 2 and the armored shell 3 without considering circumferential positioning.

[0064] Alternatively, the bracket 2 can be manufactured using an injection molding process.

[0065] Optionally, the outer shell body 35 is provided with a third sealing element mounting groove 37 communicating with the mounting cavity 36, and a third sealing element 13 is installed in the third sealing element mounting groove 37. The bracket 2 and the outer shell body 35 of the armored outer shell 3 are sealed and connected by the third sealing element 13. The annular groove 32 is located between the third sealing element 13 and the fourth sealing element 14 so that the annular groove 32 is sealed and connected to the second pressure hole 23.

[0066] In this embodiment, the third sealing element 13 enables a sealed connection between the bracket 2 and the armored housing 3, and the fourth sealing element 14 enables a sealed connection between the bracket 2 and the sleeve 33. The annular groove 32 is located between the third sealing element 13 and the fourth sealing element 14. Thus, under the dual sealing effect of the third sealing element 13 and the fourth sealing element 14, the annular groove 32 and the second pressure hole 23 are sealed together, preventing pressure leakage from the gap between the bracket 2 and the armored housing 3 and the gap between the sleeve 33 and the bracket 2, further ensuring the accuracy of the sensor pressure measurement.

[0067] Optionally, the temperature sensing element 5 is a negative temperature coefficient (NTC) thermistor.

[0068] Optionally, the pressure sensing element 6 is a piezoresistive ceramic module.

[0069] Furthermore, the bracket body 20 is provided with buckles 29 on both sides, and the connector 1 is provided with a slot 16 at its end. The bracket 2 and the connector 1 are connected by the buckles 29 and the slot 16.

[0070] In this embodiment, the connector 1 and the bracket 2 are assembled and connected by the matching slot 16 and buckle 29 to realize the combination and positioning of the parts during pre-assembly, and at the same time fix the pressure sensing element 6.

[0071] Furthermore, a pad structure 25 is provided at one end of the metal terminal 21 that is connected to the temperature sensing element 5. A guide groove 26 is provided at one end of the pad structure 25 for the insertion of the pins of the temperature sensing element 5. The guide groove 26 is a semi-circular structure to prevent the pins of the temperature sensing element 5 from slipping out. A positioning groove 27 is provided at the other end of the pad structure 25 to fix the pins of the temperature sensing element 5.

[0072] In some embodiments, the connector 1 is provided with a plurality of pins 17, which are inserted into the mounting cavity 36 of the armor housing 3 and connected to the flexible printed circuit board 4.

[0073] In this embodiment, connector 1 may be provided with 4 pins 17, which correspond to power +, ground, pressure signal output, and temperature signal output, respectively.

[0074] In some embodiments, one end of the flexible printed circuit board (FPC) 4 is provided with a hanging ear structure 41, and the bracket body 20 is provided with protrusions 28 on both sides facing one end of the flexible printed circuit board 4. The metal terminal 21 extends out of the protrusions 28 and is connected to the flexible printed circuit board 4. The protrusions 28 are adapted to the hanging ear structure 41.

[0075] In this embodiment, a boss 28 is provided at the contact position between the bracket body 20 and the ear structure 41, which can reduce the twisting of the flexible printed circuit board 4 during the welding process and improve the welding yield.

[0076] Furthermore, the flexible printed circuit board 4 is fitted with an ASIC conditioning chip and protection circuitry using a surface mount technology. The conditioning chip includes a signal conditioning and conversion module. The pressure sensing element 6 uses a piezoresistive ceramic sensing element, which, when subjected to pressure, generates a small (millivolt-level) electrical signal change proportional to the pressure via a Wheatstone bridge. The signal conditioning and conversion module located on the flexible printed circuit board 4 amplifies, filters, and linearizes the raw voltage signal output by the sensing element. The signal conditioning and conversion module incorporates a high-precision programmable operational amplifier to amplify the weak analog signal output by the sensing element. The amplification factor is adjustable, with a maximum of 512 times depending on the actual situation. The signal conditioning and conversion module also incorporates low-pass and band-pass filters to eliminate external noise interference that the sensor may encounter in the actual environment, such as electromagnetic interference. To ensure measurement accuracy, the signal conditioning and conversion module incorporates linearization circuitry and algorithms to compensate for nonlinear components, ensuring a good linear relationship between the sensor output signal and pressure over a wide range. To minimize the impact of temperature variations on the sensor output, a temperature sensor is integrated into the signal conditioning and conversion module, and the pressure signal is corrected using a temperature compensation circuit or algorithm. The module is also equipped with a voltage regulator circuit to ensure that the power supply voltage of components such as amplifiers and filters is unaffected by external power fluctuations, guaranteeing their optimal operation. After signal conditioning, the analog signal is sent to a high-resolution analog-to-digital converter (ADC) for digitization. Finally, the digitized pressure signal can be output as either an analog voltage signal or a SENT signal, depending on the specific engineering requirements, and transmitted to the main control system or other devices.

[0077] Therefore, this application employs a high-temperature resistant and vibration-resistant flexible printed circuit board 4, which integrates a signal conditioning and conversion module and peripheral circuits to cope with the complex automotive environment. Given the varying electromagnetic environments of different vehicle models and the inconsistent standards among different automakers, the additional peripheral circuitry on the flexible printed circuit board 4 provides anti-interference support against interference from high-voltage surges, reverse connections, and electrostatic discharge, as well as specifically addressing interference from radio frequency signals in specific frequency bands, ensuring excellent sensor performance.

[0078] like Figures 12 to 14As shown, in some embodiments, the sensor and device pressure interface do not use a threaded connection, that is, the armor housing 3 no longer has a threaded portion 34. A fifth seal mounting groove 38 for placing the fifth seal 15 is provided on the armor housing 3. This design can reduce the depth of the first pressure hole 31 of the armor housing 3, reduce processing difficulty, and lower costs. Furthermore, a flange structure 310 can be provided at the bottom of the armor housing 3 for axial positioning. Positioning methods include, but are not limited to, riveting, snap rings, and press-fitting of threaded connections.

[0079] In this embodiment, the connector 1 can be a pin type, and the mating end can be a PCB board or flexible circuit. The signal output is achieved by through-hole soldering. A positioning plane 311 is provided on one side of the flange structure 310 of the armor shell 3 for circumferential positioning to ensure the relative position of the pin and the mating hole.

[0080] Therefore, the sensor provided in this embodiment of the present application has a more compact structure and can be used as a built-in temperature and pressure integrated sensor. The system integrated with the sensor has a higher degree of system integration and a smaller size.

[0081] In use, the armored temperature and pressure integrated sensor provided in this application is installed at the monitoring point inside the device. The armored shell primarily serves a protective function, resisting adverse external factors. The temperature sensing element changes its own resistance and other characteristics according to changes in the ambient temperature, thereby generating a corresponding change in electrical signal; similarly, the pressure sensing element generates a corresponding change in electrical signal according to changes in the pressure it bears. These electrical signals are transmitted to a flexible printed circuit board (PCB), where they are processed and converted into the required temperature and pressure signals. These signals are then output to the device's control system via connectors, enabling the system to perform corresponding regulatory operations based on this accurate and comprehensive monitoring information. For example, in an electric vehicle battery thermal management system, the system adjusts heat dissipation and charging / discharging strategies based on comprehensive temperature and pressure data.

[0082] Furthermore, this application also proposes a method for manufacturing the aforementioned armored thermobaric sensor, which, in some embodiments, includes the following steps:

[0083] Step 1: Manufacture the armored outer shell 3 using machining and stamping processes according to the design requirements; it can be machined as a whole or in parts, and then the sleeve 33 and the outer shell body 35 are assembled into one piece through welding, riveting or special structures.

[0084] Step 2: Inject the metal terminal 21 into the bracket body 20 according to the design requirements, wherein the metal terminal 21 is formed by stamping;

[0085] Step 3: Insert the pins of the temperature sensing element 5 into the guide groove 26 and into the pad structure 25, and continue inserting them until they enter the positioning groove 27. Connect the pins of the temperature sensing element 5 to the pad structure 25 by soldering to achieve electrical signal connection.

[0086] Step 4: Connect the flexible printed circuit board 4 and the pressure sensing element 6 by soldering to achieve signal communication, and install the pressure sensing element 6 into the receiving groove 22. A second seal 12 is installed between the pressure sensing element 6 and the bracket 2, and the second seal 12 is placed in the second seal mounting groove 24.

[0087] Step 5: Solder the flexible printed circuit board 4 to the metal terminal 21 of the bracket 2 and the PIN pin 17 of the connector 1 to achieve overall electrical signal connection of the product.

[0088] Step 6: Assemble connector 1 and bracket 2, using the matched slots 16 and buckles 29 for positioning, and assemble them into a pre-assembled unit;

[0089] Step 7: Fill the sleeve 33 with insulating and thermally conductive material; if the pins of the temperature sensing element 5 have an insulating layer, the insulation can be disregarded.

[0090] Step 8: Install the pre-assembled body obtained in Step 6 into the armored shell 3 obtained in Step 1. A fourth sealing element 14 is installed between the bracket 2 and the sleeve 33 to achieve environmental sealing of the space where the temperature sensing element 5 is located. A third sealing element 13 is installed between the bracket 2 and the armored shell 3 to achieve environmental sealing between the bracket 2 and the armored shell 3.

[0091] Step 9: Fix the pre-assembled body obtained in Step 8 into the armored housing 3 by means including but not limited to riveting, snap rings, threads, etc., to ensure reliability within the range of violent pressure. A first sealing element 11 is installed between the armored housing 3 and the connector 1.

[0092] Step 10: Install the fifth seal 15 in the fifth seal mounting groove 38 of the armor shell 3.

[0093] When using this armored pressure regulator sensor, determine the installation location based on the specific temperature and pressure monitoring requirements. During installation, ensure a tight and secure connection between the sensor and the equipment's pressure interface to avoid measurement errors caused by seal failure. Threaded interfaces and end faces can be used for sealing.

[0094] During operation, sensors continuously monitor temperature and pressure changes, and after a series of processing steps, output comprehensive temperature and pressure data to the equipment's control system. The control system then performs corresponding adjustments based on this data; for example, in new energy storage systems, the comprehensive temperature and pressure data can be used to adjust the energy storage status and safety protection strategies.

[0095] In summary, the armored temperature and pressure integrated sensor provided in this application can effectively meet the high precision, high reliability, and integration requirements of related industries for simultaneous temperature and pressure monitoring, providing strong support for the safe and efficient operation of equipment.

[0096] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A sheathed temperature-pressure integrated sensor, characterized by, The application relates to a temperature and pressure sensor, which comprises the following parts: an armored shell (3) comprising a shell body (35) and a sleeve (33) connected to the shell body (35), the shell body (35) is provided with at least one first pressure lead hole (31) arranged around the sleeve (33) and an annular groove (32) in communication with the first pressure lead hole (31), the first pressure lead hole (31) is in communication with the outside world and is used for leading an external pressure source into the armored shell (3), and a closed cavity (39) is arranged in the sleeve (33); a circuit board (4) arranged in the armored shell (3); a temperature sensing element (5) arranged in the closed cavity (39); a support (2) arranged in the armored shell (3) and comprising a support body (20), a metal terminal (21) arranged in the support body (20), one end of the metal terminal (21) is arranged in the armored shell (3) and is connected to the temperature sensing element (5), the other end of the metal terminal (21) is arranged outside the support body (20) and is connected to the circuit board (4), and the metal terminal (21) is used for transmitting a temperature signal detected by the temperature sensing element (5) to the circuit board (4); a pressure sensing element (6) arranged in the support (2) and connected to the circuit board (4), the pressure sensing element (6) is in communication with the annular groove (32), and the pressure sensing element (6) is used for detecting the pressure of the external pressure source led into the first pressure lead hole (31) and transmitting a detected pressure signal to the circuit board (4).

2. The armored pressure and temperature integrated sensor according to claim 1, wherein The support body (20) is provided with a containing groove (22), a second sealing element mounting groove (24) arranged adjacent to the containing groove (22) and a second pressure lead hole (23), the second sealing element mounting groove (24) is provided with a second sealing element (12), the pressure sensing element (6) is arranged in the containing groove (22) and is sealedly connected to the support body (20) through the second sealing element (12); the second sealing element (12) is a hollow structure, the second pressure lead hole (23) is in communication with the pressure sensing element (6) through the hollow structure of the second sealing element (12), and the second pressure lead hole (23) is in communication with the annular groove (32) of the armored shell (3); the external pressure source is in communication with the pressure sensing element (6) through the first pressure lead hole (31), the annular groove (32) and the second pressure lead hole (23) in sequence, so that the pressure sensing element (6) detects the pressure of the external pressure source led into the first pressure lead hole (31).

3. The armored pressure and temperature integrated sensor according to claim 1, wherein The connector (1) is inserted into the mounting cavity (36) from the opening of the mounting cavity (36) and is sealingly connected with the shell body (35) through the first sealing member (11), and a plurality of PIN pins (17) are arranged in the connector (1) and are inserted into the mounting cavity (36) of the armored shell (3) and connected with the circuit board (4); the circuit board (4), the pressure sensing element (6) and the bracket (2) are mounted in the mounting cavity (36).

4. The armored pressure and temperature integrated sensor according to claim 3, wherein The outer side of the shell body (35) away from the mounting cavity (36) is provided with a fifth sealing member mounting groove (38) and a threaded portion (34) adjacent to the fifth sealing member mounting groove (38), the fifth sealing member mounting groove (38) is provided with a fifth sealing member (15), and the threaded portion (34) is used for connecting the shell body (35) with an external device and sealingly connected through the fifth sealing member (15).

5. The armored pressure and temperature integrated sensor according to claim 4, wherein The end of the sleeve (33) close to the mounting cavity (36) is provided with a fourth sealing member mounting groove (331), and the fourth sealing member mounting groove (331) is provided with a fourth sealing member (14), and the sleeve (33) and the bracket (2) are sealingly connected through the fourth sealing member (14).

6. The armored pressure and temperature integrated sensor according to claim 5, wherein The shell body (35) is provided with a third sealing member mounting groove (37) communicating with the mounting cavity (36), the third sealing member mounting groove (37) is provided with a third sealing member (13), and the bracket (2) and the shell body (35) of the armored shell (3) are sealingly connected through the third sealing member (13); the annular groove (32) is located between the third sealing member (13) and the fourth sealing member (14), so that the annular groove (32) and the second pressure introduction hole (23) are sealingly connected.

7. The armored pressure and temperature integrated sensor of claim 1, wherein, The sleeve (33) has the same axis as the shell body (35), so that the sleeve (33), the first pressure introduction hole (31) on the outer periphery of the sleeve (33) and the shell body (35) are concentric structures, and the first pressure introduction hole (31) on the outer periphery of the sleeve (33) is uniformly distributed in the circumferential direction; or the sleeve (33) has a different axis from the shell body (35), so that the sleeve (33), the first pressure introduction hole (31) on the outer periphery of the sleeve (33) and the shell body (35) are eccentric structures.

8. The armored pressure and temperature integrated sensor of claim 1, wherein, The temperature sensing element (5) is a negative temperature coefficient thermistor, and the sleeve (33) and the temperature sensing element (5) are filled with a heat-conducting insulating material; the pressure sensing element (6) is a piezoresistive ceramic module; and the circuit board (4) is a flexible printed circuit board.

9. The armored pressure and temperature integrated sensor of claim 6, wherein, The bracket body (20) is provided with buckles (29) on both sides, the connector (1) is provided with a clamping groove (16) at the end, the bracket (2) and the connector (1) are connected by the cooperation of the buckles (29) and the clamping groove (16); one end of the circuit board (4) is provided with a hanging ear structure (41), both sides of the bracket body (20) towards one end of the circuit board (4) are provided with bosses (28), the metal terminal (21) extends out of the boss (28) and is connected with the circuit board (4), the boss (28) is matched with the hanging ear structure (41); one end of the metal terminal (21) connected with the temperature sensing element (5) is provided with a solder pad structure (25), one end of the solder pad structure (25) is provided with a guide groove (26) for the insertion of the pin of the temperature sensing element (5), the guide groove (26) is a half circular structure for preventing the pin of the temperature sensing element (5) from sliding out; the other end of the solder pad structure (25) is provided with a positioning groove (27) for fixing the pin of the temperature sensing element (5).

10. The armored pressure and temperature integrated sensor of claim 1, wherein, The bottom of the armored shell (3) is provided with a flange structure (310), one side of the flange structure (310) is provided with a positioning plane (311).

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