Cooling and caching equipment for PCB (Printed Circuit Board) production

Abstract

The utility model provides cooling cache equipment for PCB (Printed Circuit Board) production. The cooling temporary storage equipment for PCB production comprises a machine base, a carrier, a feeding conveying mechanism, a temporary storage frame, a carrying mechanism, an air conditioner cooling device, a discharging conveying mechanism, an upper plate clamping mechanism and a lower plate clamping mechanism, wherein the upper plate clamping mechanism and the lower plate clamping mechanism are sequentially arranged on the temporary storage frame in the carrying direction of the carrying mechanism. A cooling cache cavity is formed in the cache frame; the feeding and conveying mechanism is used for conveying the carriers into the cooling and buffering cavity from the connection table; the upper plate clamping mechanism is used for clamping the carrier and upwards conveying the carrier to a first preset height position when the carrier moves to a corresponding position; the carrying mechanism is used for clamping the carrier at the first preset height position to a second preset height position; and the lower plate clamping mechanism is used for downwards conveying the carrier at the second preset height position to the discharging conveying mechanism, so that the carrier is output from the cooling buffer cavity through the discharging conveying mechanism. According to the cooling cache equipment for PCB production, the production efficiency of batch PCBs is relatively high.

Description

Technical Field

[0001] This disclosure relates to the technical field of circuit board manufacturing equipment, and in particular to a cooling buffer device for PCB manufacturing. Background Technology

[0002] Cooling buffer equipment for PCB manufacturing is an industrial device used to cool and buffer PCBs (Printed Circuit Boards). It is widely used in consumer electronics, automotive electronics, industrial control, medical electronics, communication equipment, and aerospace industries.

[0003] The cooling buffer equipment for PCB production in related technologies includes a frame, a loading mechanism, a unloading mechanism, and an unloading mechanism. The loading mechanism, unloading mechanism, and unloading mechanism are all connected to the frame. The unloading mechanism is located between the loading mechanism and the unloading mechanism. The unloading mechanism is equipped with a carrier assembly, which is used to carry the buffered PCB. A fan assembly is provided on the frame, which is used to blow air to cool the PCB in the carrier assembly, thus completing the PCB cooling process, such as Chinese Patent No. CN201510720001.8.

[0004] However, since the fan assembly is used to cool the PCBs inside the carrier assembly, the cooling buffer equipment used for PCB production cools batches of PCBs for an extended period of time using the fan assembly. After the cooling process of the same batch of PCBs is completed, the workers stop the cooling buffer equipment and process the batch of PCBs in batches. Then, the cooling buffer equipment is restarted to process the next batch of PCBs. This cycle continues, resulting in a long time required for manual intervention when processing PCBs. This makes it impossible for the cooling buffer equipment to process PCBs without stopping, thus resulting in low production efficiency for batch PCBs. Utility Model Content

[0005] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a cooling buffer device for PCB production that enables high production efficiency in mass production of PCBs.

[0006] The purpose of this disclosure is achieved through the following technical solution:

[0007] A cooling buffer device for PCB manufacturing, comprising:

[0008] Base;

[0009] A carrier used to support the PCB;

[0010] A feeding and conveying mechanism is mounted on the machine base;

[0011] A buffer rack is connected to the machine base, and the buffer rack forms a cooling buffer cavity; the feeding conveying mechanism is used to input the carrier from the docking platform into the cooling buffer cavity;

[0012] A transport mechanism is installed on top of the buffer rack, and the transport mechanism is located inside the cooling buffer cavity;

[0013] An air conditioning cooling device is located outside the buffer rack, and the output end of the cooling medium of the air conditioning cooling device is connected to the cooling buffer cavity;

[0014] A material discharge conveying mechanism is mounted on the machine base;

[0015] The cooling buffer device for PCB production further includes an upper plate clamping mechanism and a lower plate clamping mechanism sequentially arranged on the buffer frame along the conveying direction of the conveying mechanism. The upper plate clamping mechanism is used to clamp the carrier and convey it upward to a first predetermined height position when the carrier moves to the corresponding position. The conveying mechanism is used to clamp the carrier at the first predetermined height position to a second predetermined height position. The lower plate clamping mechanism is used to convey the carrier at the second predetermined height position downward to the discharge conveying mechanism, so that the carrier is output from the cooling buffer cavity through the discharge conveying mechanism.

[0016] In one embodiment, the cooling buffer device for PCB production further includes a control processing system, a first sensor, a second sensor, a third sensor, and a fourth sensor. The control processing system is installed on the buffer rack. Each of the sensors, the feeding conveyor, the transport mechanism, the air conditioning cooling device, the discharging conveyor, the upper board clamping mechanism, and the lower board clamping mechanism are electrically connected to the control processing system. The first sensor is installed on the feeding conveyor near the upper board clamping mechanism. The second sensor is installed on the upper board clamping mechanism near the loading end of the transport mechanism. The third sensor is installed on the lower board clamping mechanism near the unloading end of the transport mechanism. The fourth sensor is installed on the discharging conveyor near the lower board clamping mechanism. Each sensor is used to sense the carrier.

[0017] In one embodiment, the conveying mechanism includes a conveying drive assembly and a conveying gripper assembly. The conveying drive assembly is mounted on the top of the buffer rack, and the power output end of the conveying drive assembly is connected to the conveying gripper assembly. The conveying gripper assembly is used to clamp or release the carrier, and the conveying drive assembly is used to drive the conveying gripper assembly to move along a first direction to clamp the carrier from the first predetermined height position to the second predetermined height position.

[0018] In one embodiment, the transport drive assembly includes a transport drive motor and a synchronous belt drive component. Both the transport drive motor and the synchronous belt drive component are mounted on the buffer frame. The power output end of the transport drive motor is connected to the synchronous belt drive component. The transport drive motor is used to drive the synchronous belt of the synchronous belt drive component to reciprocate along the first direction. The synchronous belt is fixedly connected to the transport gripper assembly.

[0019] In one embodiment, the transport gripper assembly includes a connector and a clamping member. The connector and the clamping member are connected to form a connecting groove, which communicates with the cooling buffer cavity. The synchronous belt passes through the connecting groove and is fixedly connected to the connector. The clamping member is used to clamp or release the carrier.

[0020] In one embodiment, the buffer rack is provided with an air inlet and an air outlet, both of which are connected to the cooling buffer cavity. The air inlet is connected to the output end of the cooling medium of the air conditioning cooling device, and the air outlet is used to discharge hot air.

[0021] In one embodiment, the upper plate clamping mechanism includes two upper plate clamping assemblies arranged opposite each other, with an upper plate channel between the two upper plate clamping assemblies; each upper plate clamping assembly includes an upper plate frame, an upper plate drive assembly, an upper plate chain drive assembly, and multiple upper plate clamping bodies; the upper plate drive assembly is mounted on the upper plate frame, the upper plate chain drive assembly is movably disposed on the upper plate frame, and the power output end of the upper plate drive assembly is connected to the upper plate chain drive assembly; the upper plate drive assembly is used to drive the upper plate chain drive assembly relative to each other. As the upper plate frame moves, the upper plate chain drive assembly moves upward within the upper plate channel, and multiple upper plate clamping bodies are spaced apart circumferentially along the upper plate chain drive assembly; each upper plate clamping body of two upper plate clamping assemblies moves synchronously with the corresponding upper plate chain drive assembly, and each upper plate clamping body of the two upper plate clamping assemblies is correspondingly positioned during the upward movement within the upper plate channel to form an upper plate clamping area, which is used to clamp the two sides of the carrier; the upper plate frame is connected to the buffer frame.

[0022] In one embodiment, the upper plate chain drive assembly includes a first driving sprocket, an upper plate chain, and a first driven sprocket. The upper plate chain is respectively sleeved on the first driving sprocket and the first driven sprocket. The first driving sprocket and the first driven sprocket are rotatably connected to the upper plate frame. The first driving sprocket is connected to the power output end of the upper plate drive assembly. A plurality of upper plate clamps are arranged at circumferential intervals along the upper plate chain.

[0023] In one embodiment, the lower plate clamping mechanism includes two lower plate clamping assemblies arranged opposite each other, with a lower plate channel between the two lower plate clamping assemblies; each lower plate clamping assembly includes a lower plate frame, a lower plate drive assembly, a lower plate chain drive assembly, and multiple lower plate clamping bodies; the lower plate drive assembly is mounted on the lower plate frame, the lower plate chain drive assembly is movably disposed on the lower plate frame, and the power output end of the lower plate drive assembly is connected to the lower plate chain drive assembly; the lower plate drive assembly is used to drive the lower plate chain drive assembly relative to each other. As the lower plate frame moves, the lower plate chain drive assembly moves downward within the lower plate channel. Multiple lower plate clamping bodies are spaced circumferentially along the lower plate chain drive assembly. Each lower plate clamping body of two lower plate clamping assemblies moves synchronously with its corresponding lower plate chain drive assembly, and each lower plate clamping body of the two lower plate clamping assemblies is correspondingly positioned during its downward movement within the lower plate channel to form a lower plate clamping area. This lower plate clamping area is used to clamp the two sides of the carrier. The lower plate frame is connected to the buffer frame.

[0024] In one embodiment, the lower plate chain drive assembly includes a second driving sprocket, a lower plate chain, and a second driven sprocket. The lower plate chain is respectively sleeved on the second driving sprocket and the second driven sprocket. The second driving sprocket and the second driven sprocket are rotatably connected to the lower plate frame. The second driving sprocket is connected to the power output end of the lower plate drive assembly. A plurality of lower plate clamps are arranged at circumferential intervals along the lower plate chain.

[0025] Compared with the prior art, this disclosure has at least the following advantages:

[0026] 1. The carrier is used to carry the PCB so that the PCB is placed on the carrier and moves with the carrier. The feeding conveyor mechanism is used to input the carrier from the docking platform into the cooling buffer cavity, so that the PCB enters the cooling buffer cavity with the carrier. The output end of the cooling medium of the air conditioning cooling device is connected to the cooling buffer cavity, so that the cooling medium enters the cooling buffer cavity, so that the cooling medium is in continuous contact with the PCB on the carrier, thereby cooling the PCB on the carrier, thus completing the cooling process of the PCB.

[0027] 2. The feeding conveyor mechanism is used to input the carrier from the docking station into the cooling buffer cavity. The upper plate clamping mechanism is used to clamp the carrier when it moves to the corresponding position and convey it upward to the first predetermined height position. That is, the feeding conveyor mechanism is used to convey the carrier to the corresponding position in the cooling buffer cavity, the upper plate clamping mechanism is used to clamp the carrier at the corresponding position and convey it upward to the first predetermined height position, the conveying mechanism is used to clamp the carrier at the first predetermined height position to the second predetermined height position, and the lower plate clamping mechanism is used to convey the carrier at the second predetermined height position downward to the discharge conveyor mechanism. The carrier passes through the discharge conveyor mechanism and exits the cooling buffer cavity, so that the PCB is discharged from the cooling buffer cavity along with the carrier, completing the PCB unloading process.

[0028] 3. The carrier, through the combined action of the feeding conveyor mechanism, the upper plate clamping mechanism, the conveying mechanism, the lower plate clamping mechanism, and the discharge conveyor mechanism, achieves automatic feeding and discharging of PCBs. This allows the PCBs to be automatically fed and discharged along with the carrier, and automatically discharged from the cooling buffer cavity along with the carrier. This avoids the problem of workers having to stop the cooling buffer equipment used for PCB production in the prior art. Furthermore, the cooling buffer equipment disclosed in this invention does not require manual intervention, thus solving the problem of long manual intervention time during PCB loading and unloading in the prior art. This enables the cooling buffer equipment used for PCB production to load and unload without stopping the machine, thereby saving loading and unloading time for batch PCBs and resulting in higher production efficiency for batch PCBs. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of a cooling buffer device for PCB manufacturing according to one embodiment.

[0031] Figure 2 for Figure 1 A partial structural schematic diagram of a cooling buffer device used in PCB manufacturing, shown from another perspective;

[0032] Figure 3 for Figure 2 An enlarged schematic diagram of point A of the cooling buffer device used in PCB manufacturing is shown.

[0033] Figure 4 for Figure 2The diagram shows the structural schematic of the handling mechanism for a cooling buffer device used in PCB manufacturing.

[0034] Figure 5 for Figure 4 An enlarged schematic diagram of point B of the conveying mechanism shown;

[0035] Figure 6 for Figure 1 A partial structural schematic diagram of a cooling buffer device used in PCB manufacturing, shown from one perspective;

[0036] Figure 7 for Figure 6 An enlarged schematic diagram of point C of the cooling buffer device used in PCB manufacturing is shown.

[0037] Figure 8 for Figure 1 This is a partial structural diagram of a cooling buffer device used in PCB manufacturing, shown from another perspective.

[0038] Figure 9 for Figure 8 The diagram shows an enlarged view of point D of the cooling buffer device used in PCB manufacturing.

[0039] Figure 10 for Figure 4 The diagram shows the structural schematic of the transport gripper assembly of the transport mechanism. Detailed Implementation

[0040] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0041] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0043] like Figures 1 to 10 As shown, a cooling buffer device 10 for PCB production in one embodiment includes a base 100, a carrier 200, a feeding conveying mechanism 300, a buffer rack 400, a handling mechanism 500, an air conditioning cooling device 600, and an unloading conveying mechanism 700. The carrier 200 is used to carry the PCB. The feeding conveying mechanism 300 is disposed on the base 100. The buffer rack 400 is connected to the base 100 and forms a cooling buffer cavity 410. The feeding conveying mechanism 300 is used to input the carrier 200 from the docking station into the cooling buffer cavity 410. The handling mechanism 500 is installed on the top of the buffer rack 400 and is located inside the cooling buffer cavity 410. The air conditioning cooling device 600 is located outside the buffer rack 400, and the output end of the cooling medium of the air conditioning cooling device 600 is connected to the cooling buffer cavity 410. The unloading conveying mechanism 700 is disposed on the base 100.

[0044] Furthermore, the cooling buffer device 10 for PCB production also includes an upper plate clamping mechanism 800 and a lower plate clamping mechanism 900 sequentially arranged on the buffer frame 400 along the conveying direction of the conveying mechanism 500. The upper plate clamping mechanism 800 is used to clamp the carrier 200 and convey it upward to a first predetermined height position when the carrier 200 moves to the corresponding position. The conveying mechanism 500 is used to clamp the carrier 200 at the first predetermined height position to a second predetermined height position. The lower plate clamping mechanism 900 is used to convey the carrier 200 at the second predetermined height position downward to the discharge conveying mechanism 700, so that the carrier 200 is output from the cooling buffer cavity 410 through the discharge conveying mechanism 700.

[0045] In this embodiment, the air conditioning cooling device 600 is electrically connected to an external power source so that the air conditioning cooling device 600 is powered on and generates a cooling medium, which is cold air. The carrier 200 has a carrier groove 210 for carrying the PCB. When the carrier 200 passes through the cooling buffer cavity 410, the carrier groove 210 communicates with the cooling buffer cavity 410.

[0046] The aforementioned PCB production cooling buffer device 10 uses a carrier 200 to support the PCB, allowing the PCB to be placed and buffered on the carrier 200 as it moves. The feeding conveyor 300 feeds the carrier 200 from the docking station into the cooling buffer chamber 410, so that the PCB enters the cooling buffer chamber 410 along with the carrier 200. The output end of the cooling medium of the air conditioning cooling device 600 is connected to the cooling buffer chamber 410, allowing the cooling medium to enter the cooling buffer chamber 410, so that the cooling medium is in continuous contact with the PCB on the carrier 200, thereby cooling the PCB on the carrier 200, thus completing the PCB cooling process.

[0047] Since the feeding conveyor 300 is used to input the carrier 200 from the docking station into the cooling buffer cavity 410, the upper plate clamping mechanism 800 is used to clamp the carrier 200 when it moves to the corresponding position and convey it upward to the first predetermined height position. That is, the feeding conveyor 300 is used to convey the carrier 200 to the corresponding position in the cooling buffer cavity 410, the upper plate clamping mechanism 800 is used to clamp the carrier 200 at the corresponding position and convey it upward to the first predetermined height position, the conveying mechanism 500 is used to clamp the carrier 200 at the first predetermined height position to the second predetermined height position, and the lower plate clamping mechanism 900 is used to convey the carrier 200 at the second predetermined height position downward to the discharge conveyor 700, so that the carrier 200 passes through the discharge conveyor 700 and exits the cooling buffer cavity 410, thereby making the PCB exit the cooling buffer cavity 410 along with the carrier 200 and completing the PCB unloading process;

[0048] The carrier 200, under the combined action of the feeding conveyor 300, the upper plate clamping mechanism 800, the conveying mechanism 500, the lower plate clamping mechanism 900, and the discharge conveyor 700, achieves automatic feeding and discharging of PCBs. This allows the PCBs to be automatically fed and discharged along with the carrier 200, and automatically discharged from the cooling buffer cavity 410 along with the carrier 200. This avoids the problem of workers having to stop the cooling buffer equipment 10 used for PCB production in the prior art. Furthermore, the cooling buffer equipment 10 of this disclosure does not require manual intervention, thus solving the problem of long manual intervention time during PCB loading and unloading in the prior art. This allows the cooling buffer equipment 10 used for PCB production to load and unload without stopping, saving loading and unloading time for batch PCBs and resulting in higher production efficiency for batch PCBs.

[0049] like Figures 1 to 8As shown, in one embodiment, the cooling buffer device 10 for PCB production further includes a control processing system 10a, a first sensor 20a, a second sensor 50a, a third sensor 60a, and a fourth sensor 70a. The control processing system 10a is installed on the buffer rack 400. Each sensor, the feeding conveyor 300, the conveying mechanism 500, the air conditioning cooling device 600, the discharging conveyor 700, the upper board clamping mechanism 800, and the lower board clamping mechanism 900 are electrically connected to the control processing system 10a. The first sensor 20a is installed on the feeding conveyor 300 near the upper board clamping mechanism 800. The second sensor 50a is installed on the upper board clamping mechanism 800 near the loading end of the conveying mechanism 500. The third sensor 60a is installed on the lower board clamping mechanism 900 near the unloading end of the conveying mechanism 500. The fourth sensor 70a is installed on the discharging conveyor 700 near the lower board clamping mechanism 900. Each sensor is used to sense the carrier 200. In this embodiment, the control processing system 10a is used to be electrically connected to an external power source.

[0050] Furthermore, each sensor is an infrared sensor; each sensor is electrically connected to the control processing system 10a so that each sensor feeds back the position information of the vehicle 200 to the control processing system 10a in real time, so that the staff can better know the real-time position of the vehicle 200.

[0051] Furthermore, the first sensor 20a is installed on the feeding conveyor 300 near the upper plate clamping mechanism 800. When the first sensor 20a senses the carrier 200, the control processing system 10a controls the upper plate clamping mechanism 800 to move and clamp the carrier 200.

[0052] The second sensor 50a is installed at the loading end of the upper plate clamping mechanism 800 near the conveying mechanism 500. When the second sensor 50a senses the carrier 200, the control processing system 10a controls the conveying mechanism 500 to move and clamp the carrier 200.

[0053] The third sensor 60a is installed at the unloading end of the lower plate clamping mechanism 900 near the conveying mechanism 500. When the third sensor 60a senses the carrier 200, the control processing system 10a controls the lower plate clamping mechanism 900 to move and clamp the carrier.

[0054] The fourth sensor 70a is installed near the lower plate clamping mechanism 900 of the discharge conveying mechanism 700. When the fourth sensor 70a senses the carrier 200, the control processing system 10a controls the movement of the discharge conveying mechanism 700 to transport the carrier 200.

[0055] It should be noted that the working principle of each sensor used to sense the vehicle 200 is existing technology.

[0056] like Figures 2 to 5 and Figure 10 As shown, in one embodiment, the conveying mechanism 500 includes a conveying drive assembly 510 and a conveying gripper assembly 520. The conveying drive assembly 510 is mounted on the top of the buffer rack 400, and its power output end is connected to the conveying gripper assembly 520. The conveying gripper assembly 520 is used to grip or release the carrier 200, and the conveying drive assembly 510 is used to drive the conveying gripper assembly 520 to move along a first direction x, so as to grip the carrier 200 from a first predetermined height position to a second predetermined height position. In this embodiment, the first direction x is the conveying direction of the conveying mechanism 500; the conveying drive assembly 510 is used to drive the conveying gripper assembly 520 to move along the first direction x, so that the movement of the conveying gripper assembly 520 along the first direction x has high reliability.

[0057] like Figures 2 to 5 As shown, in one embodiment, the transport drive assembly 510 includes a transport drive motor 511 and a synchronous belt drive component 512. Both the transport drive motor 511 and the synchronous belt drive component 512 are mounted on the buffer frame 400. The power output end of the transport drive motor 511 is connected to the synchronous belt drive component 512. The transport drive motor 511 drives the synchronous belt of the synchronous belt drive component 512 to reciprocate along a first direction x. The synchronous belt is fixedly connected to the transport gripper assembly 520. In this embodiment, the transport drive motor 511 drives the synchronous pulley of the synchronous belt drive component 512 to rotate through the transport belt drive assembly 513, causing the synchronous pulley to drive the synchronous belt to reciprocate along the first direction x, resulting in better transmission stability of the transport drive assembly 510.

[0058] Furthermore, such as Figure 4 As shown, in one embodiment, the transport drive assembly 510 further includes a transport belt drive assembly 513. The transport belt drive assembly 513 includes a transport drive pulley 5131, a transport conveyor belt 5132, and a transport driven pulley 5133. The transport drive pulley 5131 is mounted on the power shaft of the transport drive motor 511. The transport conveyor belt 5132 is respectively sleeved on the transport drive pulley 5131 and the transport driven pulley 5133. The transport driven pulley 5133 is sleeved on the drive shaft of the synchronous pulley, so that the transport drive motor 511 drives the synchronous pulley to rotate through the transport drive pulley 5131, the transport conveyor belt 5132, and the transport driven pulley 5133, thereby making the transmission reliability of the transport drive assembly 510 high.

[0059] like Figures 4 to 5 and Figure 10As shown, in one embodiment, the transport gripper assembly 520 includes a connector 521 and a clamping member 522. The connector 521 and the clamping member 522 are connected to form a connecting groove 5211, which communicates with the cooling buffer cavity 410. A timing belt passes through the connecting groove 5211 and is fixedly connected to the connector 521. The clamping member 522 is used to clamp or release the carrier 200. In this embodiment, the connector 521 and the clamping member 522 are welded, resulting in a high connection strength between the connector 521 and the clamping member 522, thereby improving the structural stability of the transport gripper assembly 520.

[0060] like Figure 1 As shown, in one embodiment, the buffer rack 400 is provided with an air inlet 30a and an air outlet 40a, both of which are connected to the cooling buffer cavity 410. The air inlet 30a is connected to the output end of the cooling medium of the air conditioning cooling device 600, and the air outlet 40a is used to discharge hot air. In this embodiment, the cooling medium is cold air. The air inlet 30a is connected to the output end of the cooling medium of the air conditioning cooling device 600, so that the cooling medium is introduced into the cooling buffer cavity 410 along the air inlet 30a, so that the cooling medium comes into contact with the high-temperature PCB to generate hot air. The hot air is discharged from the cooling buffer cavity 410 along the air outlet 40a, ensuring that the cooling buffer cavity 410 maintains a low-temperature cooling environment, so that the cooling buffer equipment 10 used for PCB production has a better cooling effect on the PCB.

[0061] like Figures 6 to 7As shown, in one embodiment, the upper plate clamping mechanism 800 includes two upper plate clamping assemblies 810 arranged opposite each other, with an upper plate channel 810a between the two upper plate clamping assemblies 810; each upper plate clamping assembly 810 includes an upper plate frame 811, an upper plate drive assembly 812, an upper plate chain drive assembly 813, and multiple upper plate clamping bodies 814. The upper plate drive assembly 812 is mounted on the upper plate frame 811, and the upper plate chain drive assembly 813 is movably disposed on the upper plate frame 811. The power output end of the upper plate drive assembly 812 is connected to the upper plate chain drive assembly 813, and the upper plate drive assembly 812 is used to drive the upper plate chain drive assembly. The component 813 moves relative to the upper plate frame 811. The upper plate chain drive assembly 813 moves upward within the upper plate channel 810a. Multiple upper plate clamping bodies 814 are spaced apart circumferentially along the upper plate chain drive assembly 813. Each upper plate clamping body 814 of the two upper plate clamping assemblies 810 moves synchronously with the corresponding upper plate chain drive assembly 813. Each upper plate clamping body 814 of the two upper plate clamping assemblies 810 is correspondingly positioned during the upward movement within the upper plate channel 810a to form an upper plate clamping area 8141. The upper plate clamping area 8141 is used to clamp the two sides of the carrier 200. The upper plate frame 811 is connected to the buffer frame 400. In this embodiment, when the upper board drive assembly 812 drives the upper board chain transmission assembly 813 to move upward along the second direction in the upper board channel 810a, each upper board clamping body 814 of the two upper board clamping assemblies 810 is correspondingly arranged in the upper board channel 810a and moves upward synchronously with the corresponding upper board chain transmission assembly 813, forming an upper board clamping area 8141 for clamping the carrier 200, thereby realizing the upward movement of the carrier 200, that is, realizing the upward buffer transport of the PCB. The second direction is parallel to the z-axis direction.

[0062] Furthermore, such as Figures 6 to 7 As shown, in one embodiment, each upper plate clamping assembly 810 includes an upper plate drive assembly 812 comprising an upper plate drive motor 8121 and an upper plate belt drive assembly 815. The upper plate belt drive assembly 815 includes an upper plate drive wheel 8151, an upper plate conveyor belt 8152, and an upper plate driven wheel 8153. The upper plate drive wheel 8151 is mounted on the drive shaft of the upper plate drive motor 8121. The upper plate conveyor belt 8152 is respectively sleeved on the upper plate drive wheel 8151 and the upper plate driven wheel 8153. The upper plate driven wheel 8153 is sleeved on the drive shaft of the upper plate chain drive assembly 813, so that the upper plate drive motor 812 drives the upper plate chain drive assembly 813 to move relative to the upper plate frame 811 through the upper plate drive wheel 8151, the upper plate conveyor belt 8152, and the upper plate driven wheel 8153, thereby making the transmission reliability of the upper plate clamping assembly 810 high.

[0063] like Figures 6 to 7As shown, in one embodiment, the upper plate chain drive assembly 813 includes a first drive sprocket 8131, an upper plate chain 8132, and a first driven sprocket 8133. The upper plate chain 8132 is respectively sleeved on the first drive sprocket 8131 and the first driven sprocket 8133. The first drive sprocket 8131 and the first driven sprocket 8133 are both rotatably connected to the upper plate frame 811. The first drive sprocket 8131 is connected to the power output end of the upper plate drive assembly 812. A plurality of upper plate clamping bodies 814 are arranged circumferentially along the upper plate chain 8132, so that the upper plate clamping assembly 810 can synchronously drive multiple PCBs onto the upper plate.

[0064] like Figures 8 to 9 As shown, in one embodiment, the lower plate clamping mechanism 900 includes two lower plate clamping assemblies 910 arranged opposite each other, with a lower plate channel 910a between the two lower plate clamping assemblies 910; each lower plate clamping assembly 910 includes a lower plate frame 911, a lower plate drive assembly 912, a lower plate chain drive assembly 913, and a plurality of lower plate clamping bodies 914. The lower plate drive assembly 912 is mounted on the lower plate frame 911, and the lower plate chain drive assembly 913 is movably disposed on the lower plate frame 911. The power output end of the lower plate drive assembly 912 is connected to the lower plate chain drive assembly 913, and the lower plate drive assembly 912 is used to drive the lower plate chain drive assembly. The component 913 moves relative to the lower plate frame 911. The lower plate chain drive assembly 913 moves downward within the lower plate channel 910a. Multiple lower plate clamping bodies 914 are spaced apart circumferentially along the lower plate chain drive assembly 913. Each lower plate clamping body 914 of the two lower plate clamping assemblies 910 moves synchronously with the corresponding lower plate chain drive assembly 913. Each lower plate clamping body 914 of the two lower plate clamping assemblies 910 is correspondingly positioned during the downward movement within the lower plate channel 910a to form a lower plate clamping area 9141. The lower plate clamping area 9141 is used to clamp the two sides of the carrier 200. The lower plate frame 911 is connected to the buffer frame 400. In this embodiment, when the lower board drive assembly 912 drives the lower board chain transmission assembly 913 to move downward in the lower board channel 910a along the second direction, each lower board clamping body 914 of the two lower board clamping assemblies 910 is correspondingly arranged in the lower board channel 910a and moves downward synchronously with the corresponding lower board chain transmission assembly 913, forming a lower board clamping area 9141 for clamping the carrier 200, thereby realizing the downward movement of the carrier 200, that is, realizing the downward buffer transport of the PCB.

[0065] Furthermore, such as Figures 8 to 9As shown, in one embodiment, each lower plate clamping assembly 910 includes a lower plate drive assembly 912 comprising a lower plate drive motor 9121 and a lower plate belt drive assembly 915. The lower plate belt drive assembly 915 includes a lower plate drive wheel 9151, a lower plate conveyor belt 9152, and a lower plate driven wheel 9153. The lower plate drive wheel 9151 is mounted on the drive shaft of the lower plate drive motor 9121. The lower plate conveyor belt 9152 is respectively sleeved on the lower plate drive wheel 9151 and the lower plate driven wheel 9153. The lower plate driven wheel 9153 is sleeved on the drive shaft of the lower plate chain drive assembly 913, so that the lower plate drive motor 912 drives the lower plate chain drive assembly 913 to move relative to the lower plate frame 911 through the lower plate drive wheel 9151, the lower plate conveyor belt 9152, and the lower plate driven wheel 9153, thereby making the transmission reliability of the lower plate clamping assembly 910 high.

[0066] like Figures 8 to 9 As shown, in one embodiment, the lower plate chain drive assembly 913 includes a second drive sprocket 9131, a lower plate chain 9132, and a second driven sprocket 9133. The lower plate chain 9132 is respectively sleeved on the second drive sprocket 9131 and the second driven sprocket 9133. The second drive sprocket 9131 and the second driven sprocket 9133 are both rotatably connected to the lower plate frame 911. The second drive sprocket 9131 is connected to the power output end of the lower plate drive assembly 912. A plurality of lower plate clamping bodies 914 are arranged circumferentially along the lower plate chain 9132, so that the lower plate clamping assembly 910 can synchronously drive multiple PCBs for lower plate removal.

[0067] Compared with the prior art, this disclosure has at least the following advantages:

[0068] 1. Since the carrier 200 is used to carry the PCB, the PCB is placed on the carrier 200 and moves with the carrier 200. The feeding conveyor mechanism 300 is used to input the carrier 200 from the docking platform into the cooling buffer cavity 410, so that the PCB enters the cooling buffer cavity 410 with the carrier 200. The output end of the cooling medium of the air conditioning cooling device 600 is connected to the cooling buffer cavity 410, so that the cooling medium enters the cooling buffer cavity 410, so that the cooling medium is in continuous contact with the PCB on the carrier 200, thereby cooling the PCB on the carrier 200, thus completing the cooling process of the PCB.

[0069] 2. The feeding conveyor 300 is used to input the carrier 200 from the docking station into the cooling buffer cavity 410. The upper plate clamping mechanism 800 is used to clamp the carrier 200 when it moves to the corresponding position and convey it upward to the first predetermined height position. That is, the feeding conveyor 300 is used to convey the carrier 200 to the corresponding position in the cooling buffer cavity 410, the upper plate clamping mechanism 800 is used to clamp the carrier 200 at the corresponding position and convey it upward to the first predetermined height position, the conveying mechanism 500 is used to clamp the carrier 200 at the first predetermined height position to the second predetermined height position, and the lower plate clamping mechanism 900 is used to convey the carrier 200 at the second predetermined height position downward to the discharge conveyor 700. The carrier 200 is then discharged from the cooling buffer cavity 410 through the discharge conveyor 700, so that the PCB is discharged from the cooling buffer cavity 410 along with the carrier 200, thus completing the PCB unloading process.

[0070] 3. Under the combined action of the feeding conveyor mechanism 300, the upper plate clamping mechanism 800, the conveying mechanism 500, the lower plate clamping mechanism 900, and the discharge conveyor mechanism 700, the carrier 200 achieves automatic feeding and discharging of PCBs. This allows the PCBs to be automatically fed and discharged along with the carrier 200, and the PCBs to be automatically discharged from the cooling buffer cavity 410 along with the carrier 200. This avoids the problem of workers having to stop the cooling buffer equipment 10 used for PCB production in the prior art. Moreover, the cooling buffer equipment 10 of this disclosure does not require manual intervention, thus solving the problem of long manual intervention time when handling PCB loading and unloading in the prior art. This allows the cooling buffer equipment 10 used for PCB production to load and unload without stopping the machine, thereby saving the loading and unloading time of batch PCBs and thus making the production efficiency of batch PCBs higher.

[0071] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A cooling buffer device for PCB manufacturing, characterized in that, include: Base; A carrier used to support the PCB; A feeding and conveying mechanism is mounted on the machine base; A buffer rack is connected to the machine base, and the buffer rack forms a cooling buffer cavity; the feeding conveying mechanism is used to input the carrier from the docking platform into the cooling buffer cavity; A transport mechanism is installed on top of the buffer rack, and the transport mechanism is located inside the cooling buffer cavity; An air conditioning cooling device is located outside the buffer rack, and the output end of the cooling medium of the air conditioning cooling device is connected to the cooling buffer cavity; A material discharge conveying mechanism is mounted on the machine base; The cooling buffer device for PCB production further includes an upper plate clamping mechanism and a lower plate clamping mechanism sequentially arranged on the buffer frame along the conveying direction of the conveying mechanism. The upper plate clamping mechanism is used to clamp the carrier and convey it upward to a first predetermined height position when the carrier moves to the corresponding position. The conveying mechanism is used to clamp the carrier at the first predetermined height position to a second predetermined height position. The lower plate clamping mechanism is used to convey the carrier at the second predetermined height position downward to the discharge conveying mechanism, so that the carrier is output from the cooling buffer cavity through the discharge conveying mechanism.

2. The cooling buffer device for PCB production according to claim 1, characterized in that, The cooling buffer equipment for PCB production further includes a control processing system, a first sensor, a second sensor, a third sensor, and a fourth sensor. The control processing system is installed on the buffer rack. Each of the sensors, the feeding conveyor mechanism, the transport mechanism, the air conditioning cooling device, the discharging conveyor mechanism, the upper board clamping mechanism, and the lower board clamping mechanism are electrically connected to the control processing system. The first sensor is installed on the feeding conveyor mechanism near the upper board clamping mechanism. The second sensor is installed on the upper board clamping mechanism near the loading end of the transport mechanism. The third sensor is installed on the lower board clamping mechanism near the unloading end of the transport mechanism. The fourth sensor is installed on the discharging conveyor mechanism near the lower board clamping mechanism. Each sensor is used to sense the carrier.

3. The cooling buffer device for PCB production according to claim 1, characterized in that, The transport mechanism includes a transport drive assembly and a transport gripper assembly. The transport drive assembly is mounted on the top of the buffer rack. The power output end of the transport drive assembly is connected to the transport gripper assembly. The transport gripper assembly is used to grip or release the carrier. The transport drive assembly is used to drive the transport gripper assembly to move along a first direction to grip the carrier from the first predetermined height position to the second predetermined height position.

4. The cooling buffer device for PCB production according to claim 3, characterized in that, The transport drive assembly includes a transport drive motor and a synchronous belt drive component. Both the transport drive motor and the synchronous belt drive component are mounted on the buffer frame. The power output end of the transport drive motor is connected to the synchronous belt drive component. The transport drive motor is used to drive the synchronous belt of the synchronous belt drive component to reciprocate along the first direction. The synchronous belt is fixedly connected to the transport gripper assembly.

5. The cooling buffer device for PCB production according to claim 4, characterized in that, The transport gripper assembly includes a connector and a clamping member. The connector and the clamping member are connected to form a connecting groove. The connecting groove communicates with the cooling buffer cavity. The synchronous belt passes through the connecting groove and is fixedly connected to the connector. The clamping member is used to clamp or release the carrier.

6. The cooling buffer device for PCB production according to claim 1, characterized in that, The buffer rack is provided with an air inlet and an air outlet, both of which are connected to the cooling buffer cavity. The air inlet is connected to the output end of the cooling medium of the air conditioning cooling device, and the air outlet is used to discharge hot air.

7. The cooling buffer device for PCB production according to claim 1, characterized in that, The upper plate clamping mechanism includes two upper plate clamping assemblies arranged opposite each other, with an upper plate channel between the two upper plate clamping assemblies; each upper plate clamping assembly includes an upper plate frame, an upper plate drive assembly, an upper plate chain drive assembly, and multiple upper plate clamping bodies. The upper plate drive assembly is mounted on the upper plate frame, and the upper plate chain drive assembly is movably disposed on the upper plate frame. The power output end of the upper plate drive assembly is connected to the upper plate chain drive assembly, and the upper plate drive assembly is used to drive the upper plate chain drive assembly relative to the upper plate. The frame moves, and the upper plate chain drive assembly moves upward within the upper plate channel. Multiple upper plate clamping bodies are spaced circumferentially along the upper plate chain drive assembly. Each upper plate clamping body of two upper plate clamping assemblies moves synchronously with its corresponding upper plate chain drive assembly, and each upper plate clamping body of the two upper plate clamping assemblies is correspondingly positioned during its upward movement within the upper plate channel to form an upper plate clamping area. This upper plate clamping area is used to clamp the two sides of the carrier. The upper plate frame is connected to the buffer frame.

8. The cooling buffer device for PCB production according to claim 7, characterized in that, The upper plate chain drive assembly includes a first driving sprocket, an upper plate chain, and a first driven sprocket. The upper plate chain is respectively sleeved on the first driving sprocket and the first driven sprocket. The first driving sprocket and the first driven sprocket are rotatably connected to the upper plate frame. The first driving sprocket is connected to the power output end of the upper plate drive assembly. A plurality of upper plate clamping bodies are arranged at circumferential intervals along the upper plate chain.

9. The cooling buffer device for PCB production according to claim 1, characterized in that, The lower plate clamping mechanism includes two lower plate clamping assemblies arranged opposite each other, with a lower plate channel between the two lower plate clamping assemblies; each lower plate clamping assembly includes a lower plate frame, a lower plate drive assembly, a lower plate chain drive assembly, and multiple lower plate clamping bodies. The lower plate drive assembly is mounted on the lower plate frame, and the lower plate chain drive assembly is movably disposed on the lower plate frame. The power output end of the lower plate drive assembly is connected to the lower plate chain drive assembly, and the lower plate drive assembly is used to drive the lower plate chain drive assembly relative to the lower plate. The frame moves, and the lower plate chain drive assembly moves downward within the lower plate channel. Multiple lower plate clamping bodies are spaced circumferentially along the lower plate chain drive assembly. Each lower plate clamping body of two lower plate clamping assemblies moves synchronously with its corresponding lower plate chain drive assembly, and each lower plate clamping body of the two lower plate clamping assemblies is correspondingly positioned during the downward movement within the lower plate channel to form a lower plate clamping area. This lower plate clamping area is used to clamp the two sides of the carrier. The lower plate frame is connected to the buffer frame.

10. The cooling buffer device for PCB production according to claim 9, characterized in that, The lower plate chain drive assembly includes a second driving sprocket, a lower plate chain, and a second driven sprocket. The lower plate chain is respectively sleeved on the second driving sprocket and the second driven sprocket. The second driving sprocket and the second driven sprocket are rotatably connected to the lower plate frame. The second driving sprocket is connected to the power output end of the lower plate drive assembly. A plurality of lower plate clamping bodies are arranged at circumferential intervals along the lower plate chain.

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