Solid laser crystal heat sink structure

Abstract

The utility model provides a solid laser crystal heat sink structure, which relates to the field of laser crystal heat dissipation and comprises a first shell and a second shell combined with the first shell to form an accommodating space, a TEC semiconductor cooler and a pipeline are arranged in the accommodating space, a gap is reserved between the pipeline and the TEC semiconductor cooler, and the gap is filled with heat-conducting silica gel. The device further comprises a third shell arranged in the TEC semiconductor refrigerator, a laser crystal is arranged in the third shell, the laser crystal and the third shell form an interlayer, and an indium layer is arranged in the interlayer. According to the utility model, the TEC semiconductor cooler can accurately control the temperature of each part of the laser crystal, so that the heat dissipation capability of each part is matched with the heat distribution of the laser crystal.

Description

Technical Field

[0001] This utility model relates to the field of laser crystal heat dissipation, and more particularly to solid-state laser crystal heat sink structures. Background Technology

[0002] With the continuous expansion of applications for solid-state lasers in recent years, solid-state lasers are developing towards higher power and higher pulse energy. As one of the core components of solid-state lasers, the performance requirements for laser crystals are also becoming increasingly stringent. In high-power solid-state lasers, the higher the energy, the greater the heat flux density of the laser crystal. This necessitates that the heat sink of the laser crystal possess excellent thermal conductivity to dissipate heat from within the laser crystal and ensure the normal operation of the laser.

[0003] In existing technologies, for crystal heat dissipation in high-power lasers, indium is typically filled between the crystal and a copper heat sink using a specific process. Due to the temperature difference, the indium foil conducts waste heat from the crystal to the copper heat sink via thermal conduction. The heat sink usually has an internal water circulation channel to remove the heat. However, if the heat is too high, a larger and more complex water-cooling system needs to be designed, which is detrimental to the indium sealing of the crystal and heat sink, makes pipe fabrication difficult, and poses a risk of leakage. Furthermore, the above heat dissipation methods lack specificity and cannot match the heat dissipation capacity to the crystal's heat distribution, easily leading to excessive thermal tension at the pump end face, which is extremely detrimental to the crystal's condition. Therefore, this paper proposes a significantly improved solid-state laser crystal heat sink structure. Utility Model Content

[0004] The purpose of this invention is to provide a solid-state laser crystal heat sink structure to solve the above-mentioned technical problems.

[0005] To solve the above-mentioned technical problems, this utility model adopts the following technical solution:

[0006] A solid-state laser crystal heat sink structure includes a first outer shell and a second outer shell that merges with the first outer shell to form an accommodating space. The accommodating space contains a TEC semiconductor cooler and a pipe. There is a gap between the pipe and the TEC semiconductor cooler, and the gap is filled with thermally conductive silicone.

[0007] It also includes a third housing disposed within the TEC semiconductor cooler, the third housing containing a laser crystal, the laser crystal and the third housing forming a sandwich layer, the sandwich layer containing an indium layer.

[0008] Preferably, the TEC semiconductor cooler has a number of semiconductor patches corresponding to the number of sides of the laser crystal.

[0009] Preferably, the conduit includes a first pipe located in a first housing and a second pipe disposed in a second housing, both the first pipe and the second pipe being metal pipes.

[0010] Preferably, the ends of the first pipe and the second pipe extend outward from the first housing and the second housing, respectively. The pipe also includes a connecting pipe that connects one end of the first pipe and the second pipe.

[0011] Preferably, the first tube and the second tube are welded into the first housing and the second housing, respectively.

[0012] Preferably, the first housing has a first housing extension, the second housing has a second housing extension corresponding to the position of the first housing extension, and also includes a screw and a nut. The screw passes through the first housing extension and the second housing extension and extends outward, and the outward extension is secured by a nut.

[0013] Preferably, the cooling surface of the TEC semiconductor cooler is in close contact with the third housing, and the heat dissipation surface of the TEC semiconductor cooler is in contact with the thermally conductive silicone.

[0014] Preferably, the first outer shell, the second outer shell, and the third outer shell are all made of copper.

[0015] Preferably, the third shell, laser crystal, and indium layer are bonded together by welding.

[0016] The beneficial effects of this utility model are:

[0017] 1. In this utility model, the TEC semiconductor cooler can precisely control the temperature of various parts of the laser crystal, so as to match the heat dissipation capacity of each part with the heat distribution of the laser crystal.

[0018] 2. This utility model uses a welding method to weld the third shell, the indium layer and the laser crystal together. Compared with the previous simple stacking method, this method can make the three parts more tightly bonded, achieve better heat transfer effect, improve thermal effect, and limit the deformation of the laser crystal caused by heat. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a solid-state laser crystal heat sink structure.

[0020] Figure 2 for Figure 1 A cross-sectional view of the structure shown;

[0021] Figure 3 for Figure 2 The diagram shows the structure after the thermally conductive silicone is removed.

[0022] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0023] Figure 5 for Figure 1 Side sectional view of the structure shown;

[0024] Reference numerals: 1. First housing; 2. First tube; 3. Extension of first housing; 4. Connecting tube; 5. Second housing; 6. Second tube; 7. Extension of second housing; 8. Screw; 9. Nut; 10. Laser crystal; 11. TEC semiconductor cooler; 12. Thermally conductive silicone; 13. Indium layer; 14. Third housing. Detailed Implementation

[0025] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0027] The specific embodiments of this utility model are described below with reference to the accompanying drawings.

[0028] Example 1

[0029] This embodiment presents a solid-state laser crystal heat sink structure; please refer to [link / reference]. Figures 1-5 The solid-state laser crystal heat sink structure includes a first outer shell 1 and a second outer shell 5, which, when merged with the first outer shell 1, forms an accommodating space. A TEC semiconductor cooler 11 is located within the accommodating space. In this embodiment, the TEC semiconductor cooler 11 has four semiconductor cooling pads. Please refer to... Figure 2 , Figure 3 and Figure 5 The accommodating space also contains pipes, with gaps between the pipes and the TEC semiconductor cooler 11, which are filled with thermally conductive silicone 12. Further explanation: the pipes within the accommodating space include a first pipe 2 fixed to the first housing 1 by welding, and a second pipe 6 fixed to the second housing 5 by welding. It should be noted that both the first pipe 2 and the second pipe 6 are metal pipes. It should also be added that the ends of the first pipe 2 and the second pipe 6 extend outwards from the first housing 1 and the second housing 5, respectively. The two closest outward extensions of the first pipe 2 and the second pipe 6 are connected by... Figure 1 The connecting pipe 4 shown is connected, and after connection, the first pipe 2, connecting pipe 4, and second pipe 6 form a passage for coolant flow. Please refer to [link / reference]. Figure 4The TEC semiconductor cooler 11 contains a third outer shell 14, within which a laser crystal 10 is housed. The laser crystal 10 and the third outer shell 14 form a sandwich layer, filled with an indium layer 13. In this embodiment, the TEC semiconductor cooler 11 penetrates through the first outer shell 1 and the second outer shell 5, exposing the end of the laser crystal 10 located inside. In this embodiment, a first outer shell extension 3 is provided on the first outer shell 1, and a second outer shell extension 7 corresponding to the location of the first outer shell extension 3 is provided on the second outer shell 5. A screw 8 and a nut 9 are also provided. The screw 8 penetrates through the first outer shell extension 3 and the second outer shell extension 7 and extends outward, with the outward extension portion secured by the nut 9. Thus, by tightening the screw 8 and the nut 9, the TEC semiconductor cooler 11 located in the accommodating space can be fastened to prevent loosening. In this embodiment, it should be further noted that the first outer shell 1, the second outer shell 5, and the third outer shell 14 are all made of copper.

[0030] The solid-state laser crystal heat sink structure proposed in this embodiment has two core features. First, the TEC semiconductor cooler 11 can precisely control the temperature of various parts of the laser crystal 10, ensuring that the heat dissipation capacity of each part matches the heat distribution of the laser crystal 10. In addition, the gap between the TEC semiconductor cooler 11 and the pipe is filled with thermally conductive silicone 12, allowing heat to be quickly transferred to the pipe, where it is then carried away by the coolant. Second, the third outer shell 14, the indium layer 13, and the laser crystal 10 are welded together. Compared with the previous simple stacking method, this method allows for a tighter bond between the three components, achieving better heat transfer and improving thermal effects. Furthermore, because welding is used, it better limits the deformation of the laser crystal 10 caused by heat.

[0031] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0032] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A solid-state laser crystal heat sink structure, characterized in that: It includes a first outer shell and a second outer shell that merges with the first outer shell to form an accommodating space. The accommodating space contains a TEC semiconductor cooler and a pipe. There is a gap between the pipe and the TEC semiconductor cooler, and the gap is filled with thermally conductive silicone. It also includes a third outer shell disposed within the TEC semiconductor cooler. The third outer shell contains a laser crystal. The laser crystal and the third outer shell form an interlayer, and the interlayer contains an indium layer.

2. The solid-state laser crystal heat sink structure according to claim 1, characterized in that: TEC semiconductor coolers have a corresponding number of semiconductor patches on the side of the laser crystal.

3. The solid-state laser crystal heat sink structure according to claim 1, characterized in that: The conduit includes a first pipe located in a first housing and a second pipe disposed in a second housing, both of which are metal pipes.

4. The solid-state laser crystal heat sink structure according to claim 3, characterized in that: The ends of the first pipe and the second pipe extend outward from the first outer shell and the second outer shell, respectively. The pipe also includes a connecting pipe that connects one end of the first pipe and the second pipe.

5. The solid-state laser crystal heat sink structure according to claim 3, characterized in that: The first tube and the second tube are respectively welded into the first outer shell and the second outer shell.

6. The solid-state laser crystal heat sink structure according to claim 1, characterized in that: The first housing has a first housing extension, and the second housing has a second housing extension corresponding to the position of the first housing extension. It also includes a screw and a nut. The screw passes through the first housing extension and the second housing extension and extends outward. The outward extension is secured by a nut.

7. The solid-state laser crystal heat sink structure according to claim 1, characterized in that: The cooling surface of the TEC semiconductor cooler is in close contact with the third housing, and the heat dissipation surface of the TEC semiconductor cooler is in contact with thermally conductive silicone.

8. The solid-state laser crystal heat sink structure according to claim 1, characterized in that: The first, second, and third outer shells are all made of copper.

9. The solid-state laser crystal heat sink structure according to claim 1, characterized in that: The third outer shell, laser crystal, and indium layer are bonded together using welding.

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