Wafer dotting device capable of preventing ink splashing

Abstract

The utility model relates to an anti-ink-splashing wafer dotting device, which belongs to the technical field of semiconductor wafer testing and comprises a basic support, an adjustable support, a fixed support, a coil, a funnel, a connecting rod, a spring, an ink guide wire, a limit screw I and a limit screw II. The spring is axially and fixedly connected below the connecting rod, the coil is axially and fixedly connected below the spring, the funnel is axially arranged below the coil, and the ink guide wire is arranged below the funnel. An ink fixing pipe is arranged in the funnel, the position for fixing the ink fixing pipe is higher than the upper edge of the funnel, the slender ink fixing pipe can ensure that the ink guide wire does not generate large deformation bending and ink splashing when moving up and down in the coil and the connecting rod, and the inner wall of the part, extending into the funnel, of the ink fixing pipe is provided with a round hole, so that the ink in the funnel is not blocked. The ink fixing pipe prevents ink on the ink guide wire from splashing to the surface of the wafer, and the ink on the ink guide wire falls into the ink fixing pipe when splashing, so that the ink cannot be splashed to the surface of the wafer to contaminate the surface of the wafer, and the product quality and the production efficiency are improved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor wafer testing technology, and in particular, it is an anti-splatter wafer dotting device. Background Technology

[0002] After semiconductor wafers are manufactured, they need to undergo CP testing. In the CP testing process, a probe station and a testing machine are used to screen each die on the wafer one by one using a specific testing program. At the same time, the dotting device on the probe station marks the die that does not meet the requirements with ink dots, which is a prerequisite for the subsequent packaging and die bonding.

[0003] Existing wafer dotting devices are mounted on a probe station using a base. The probe station outputs a high-level signal, and the coil on the dotting device generates a magnetic field that causes the dotting device linkage to engage. The linkage, along with the ink guide wire, moves downwards. The ink guide wire passes through a funnel containing ink and carries the ink to the chip surface. When the coil magnetic field disappears, the linkage, under the influence of the spring force, moves the ink guide wire upwards, away from the chip surface. As the dotting device frequently dots, the up-and-down movement of the ink guide wire causes ink to adhere to the ink guide wire. Some ink droplets splash onto other wafers as the ink guide wire moves, causing contamination. This requires cleaning the entire wafer and performing a second dotting process.

[0004] Chinese utility model patent CN212010910U proposes a wafer dotting device. This patent application proposes to set the dotting device in a rectangular groove provided on the worktable to solve the problem of reduced lifespan. However, during operation, ink droplets may splash onto other chips as the ink guide filament moves, causing contamination.

[0005] To solve the above problems, there is an urgent need to invent an ink-splatter-resistant wafer dotting device. Utility Model Content

[0006] The purpose of this invention is to provide a design for an ink-resistant wafer dotting device. By setting a high-temperature resistant buffer layer, it can support the newly produced high-temperature wheel hub and protect the outer surface of the high-temperature wheel hub. This device solves the above-mentioned technical problems existing in the prior art.

[0007] This utility model discloses an ink-splatter-resistant wafer dotting device, comprising: a base support, an adjustable support, a fixed support, a coil, a funnel, a connecting rod, a spring, an ink guide wire, a limiting screw one and a limiting screw two. The spring is axially fixedly connected below the connecting rod, and the coil is axially fixedly connected below the spring. A funnel is axially provided below the coil, and the funnel is fixedly connected to the adjustable support. An ink-fixing tube is provided inside the funnel to prevent ink on the ink guide wire from splashing onto the wafer surface.

[0008] Preferably, the base support and the adjustable support are movably bolted together at the middle, the adjustable support is fixedly connected to the fixed support at the middle, and the fixed support is fixedly engaged with the connecting rod by a limiting screw.

[0009] Preferably, the adjustable bracket has an "L" shaped structure, and a limiting screw two is bolted to the tail end of the adjustable bracket. A frustum structure is fixed to the top of the limiting screw two. The frustum structure is used to adjust the vertical position of the connecting rod, and the limiting screw one is used to limit the horizontal position of the connecting rod.

[0010] Preferably, the fixed bracket fixes the coil laterally on the adjustable bracket.

[0011] Preferably, there are multiple ink-solidifying tubes arranged in a circle around the axis of the funnel. The ink-solidifying tubes are located inside the funnel with their tops positioned higher than the upper edge of the funnel. The inner wall of the portion of the ink-solidifying tube that extends into the funnel has multiple circular holes.

[0012] Preferably, the ink guide wire passes sequentially through the funnel, coil, spring, and connecting rod at their axial positions, and is clamped and fixed by the connecting rod.

[0013] Beneficial effects

[0014] This invention develops an ink-splatter-resistant wafer dotting device. The device features a tubular ink-fixing tube with multiple circular holes inside a funnel. The ink-fixing tube is positioned above the upper edge of the funnel. The slender tube prevents the ink guide wire from bending or splattering excessively during its movement within the coil and connecting rod. The inner wall of the portion of the ink-fixing tube extending into the funnel has circular holes to prevent ink blockage. Furthermore, when ink adhering to the ink guide wire splashes, it falls into the ink-fixing tube, preventing ink from splashing onto the wafer surface and causing contamination. This invention improves product quality and increases production efficiency. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of an ink-splatter-resistant wafer dotting device;

[0017] Figure 2 A schematic diagram of the structure of the wafer dotting device funnel and coil to prevent ink splattering.

[0018] In the diagram: 1. Basic support, 2. Adjustable support, 3. Fixed support, 4. Coil, 5. Funnel, 6. Connecting rod, 7. Spring, 8. Ink guide wire, 9. Limiting screw one, 10. Limiting screw two, 11. Frustum structure, 12. Rotating shaft, 13. Ink tube. Detailed Implementation

[0019] This utility model discloses an ink-splatter-resistant wafer dotting device, comprising: a base support 1, an adjustable support 2, a fixed support 3, a coil 4, a funnel 5, a connecting rod 6, a spring 7, an ink guide wire 8, a first limiting screw 9 and a second limiting screw 10. The spring 7 is axially fixedly connected below the connecting rod 6, and the coil 4 is axially fixedly connected below the spring 7. The spring 7 stretches when the coil 4 is energized and displaced, and the spring 7 restores the coil 4 to its original position when the coil 4 is de-energized. The funnel 5 is axially provided below the coil 4 and is used to hold ink. An ink-fixing tube 13 is provided inside the funnel 5. When the coil 4 pulls the spring 7 and the connecting rod 6 to move up and down, the ink on the ink guide wire 8 is splashed into the ink-fixing tube 13, and the ink-fixing tube 13 prevents the ink on the ink guide wire 8 from splashing onto the wafer surface.

[0020] In some embodiments, the base bracket 1 and the adjustable bracket 2 are movably bolted together at the middle. The base bracket 1 is fixed, while the adjustable bracket 2 can be angled around the pivot 12. A fixed bracket 3 is fixedly connected to the middle of the adjustable bracket 2. The fixed bracket 3 fixes the coil 4 laterally on the adjustable bracket 2. The fixed bracket 3 is fixed to the connecting rod 6 by a limit screw 9.

[0021] In some embodiments, the adjustable bracket 2 has an "L" shaped structure. The front end of the adjustable bracket 2 is fixed to the position of the funnel 5, and the tail end of the adjustable bracket 2 is bolted with a limiting screw 10. A frustum structure 11 is fixed to the top of the limiting screw 10. An anti-slip groove is provided on the outer side of the frustum structure 11. By rotating the frustum structure 11, the position of the limiting screw 10 is adjusted, so that the frustum structure 11 can adjust the vertical direction of the connecting rod 6, and the limiting screw 9 limits the horizontal direction of the connecting rod 6.

[0022] In some embodiments, there are multiple ink tubes 13, which are arranged in a circle around the axis of the funnel 5. The ink tubes 13 have a tubular structure and are located inside the funnel 5 with their tops higher than the upper edge of the funnel 5. The slender ink tubes 13 can ensure that the ink guide wire 8 does not bend or splash ink when it moves up and down inside the funnel 5. The inner wall of the portion of the ink tube 13 that extends into the funnel 5 has multiple round holes to ensure that the ink in the funnel 5 does not become clogged. The ink that splashes onto the ink guide wire 8 inside the funnel 5 flows back into the ink tube 13 and does not splash ink onto the wafer surface.

[0023] In some embodiments, the ink guide wire 8 passes sequentially through the funnel 5, coil 4, spring 7 and connecting rod 6 at their axial positions. The ink guide wire 8 moves back and forth within the device. The ink guide wire 8 is clamped and fixed with the connecting rod 6. The ink guide wire 8 is pulled by the connecting rod 6 to achieve wafer dotting.

[0024] Example 1

[0025] In one specific embodiment provided by this utility model, such as Figure 1 , 2 As shown, the base bracket 1 and adjustable bracket 2 are responsible for fixing the dotting device, the fixed bracket 3 is responsible for fixing the coil 4, the limit screw 1 9 is responsible for fixing the connecting rod 6 to prevent horizontal movement, the limit screw 2 10 is responsible for fixing the vertical movement distance of the connecting rod 6, the spring 7 and the coil 4 are responsible for the up and down movement of the connecting rod 6, and the funnel 5 is responsible for storing ink.

[0026] This invention provides a tubular ink-fixing tube 13 with a round hole inside the funnel 5. The position of the ink-fixing tube 13 is higher than the upper edge of the funnel 5. The ink-fixing tube 13 can ensure that the ink guide wire 8 does not bend or splash ink when it moves up and down inside. The inner wall of the part of the ink-fixing tube 13 that extends into the funnel 5 has a round hole, which can prevent the ink inside the funnel 5 from becoming blocked.

[0027] Using this invention, the ink on the ink guide wire 8 is sprayed into the ink tube 13, ensuring that the ink will not splash onto the wafer surface and cause secondary pollution.

Claims

1. A splash-proof ink crystal wafer dotter, characterized by, It includes: The base support, adjustable support, fixed support, coil, funnel, connecting rod, spring, ink guide wire, limit screw one and limit screw two, the connecting rod is fixedly connected with the spring below, the spring is fixedly connected with the coil below, the coil is provided with the funnel below, the funnel is fixedly connected with the adjustable support, the funnel is provided with the ink fixing tube, the ink fixing tube prevents the ink on the ink guide wire from splashing on the wafer surface.

2. The sprocketless inked wafer dotter of claim 1, wherein: The base support is movably connected with the middle part of the adjustable support, the middle part of the adjustable support is fixedly connected with the fixed support, and the fixed support is clamped and fixed with the connecting rod through the limit screw one.

3. The sputter-resistant inked wafer dotter of claim 2, wherein: The adjustable support is an "L" type structure, the adjustable support is clamped with the limit screw two at the tail end, the top of the limit screw two is fixedly connected with a circular table structure, the circular table structure is used for adjusting the vertical position of the connecting rod, and the limit screw one is used for limiting the horizontal position of the connecting rod.

4. The sprocketless inked wafer dotter of claim 3, wherein: The fixed support transversely fixes the coil on the adjustable support.

5. The sputter-resistant inked wafer dotter of claim 4, wherein: The ink fixing tube has a plurality of ink fixing tubes, the ink fixing tubes are arranged in a circular shape around the shaft of the funnel, the ink fixing tubes are arranged in the funnel and the top of the ink fixing tube is higher than the upper edge of the funnel, and a plurality of circular holes are arranged on the inner wall of the part of the funnel into which the ink fixing tube penetrates.

6. The sprocketless inked wafer dotter of claim 5, wherein: The ink guide wire passes through the shaft positions of the funnel, coil, spring and connecting rod in sequence, and is fixed by clamping with the connecting rod.

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