Miniature loudspeaker and circuit system

Abstract

The utility model relates to a miniature loudspeaker, comprising an induction chip which is manufactured through a semiconductor manufacturing process and is connected with a vibrating diaphragm; the control chip is manufactured through a semiconductor manufacturing process and is electrically connected with the sensing chip; a gap for the sensing chip to bear the vibration diaphragm to move is formed between the magnetic element and the sensing chip; wherein the control chip is used for receiving an electrical signal, the polarity of the electrical signal is changed and input to the sensing chip so as to form a variable magnetic field on the sensing chip, a force for driving the vibrating diaphragm to move is formed between the magnetic element and the sensing chip, and the moving vibrating diaphragm generates sound waves output by the miniature loudspeaker. An induction chip formed by a micro coil element is manufactured through a semiconductor manufacturing process, and the purpose of microminiaturization of the loudspeaker is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of micro loudspeaker, especially a kind of micro loudspeaker and circuit system formed by encapsulating control chip and using metal micro line segment to form inductive chip. BACKGROUND

[0002] Loudspeaker is important sounding element in electronic equipment, and the working principle of loudspeaker is transducer for converting electrical signal into sound signal, and with the demand of miniaturization of electronic equipment, loudspeaker also has the necessity of miniaturization.

[0003] The structure of current loudspeaker generally includes magnet, conducting coil and diaphragm connected with conducting coil, and conducting coil generates magnetic field when electrified, so that the force of conducting coil in the magnetic field of magnet changes, and when the size of electrified current of conducting coil changes, the force of conducting coil also changes, so that vibration occurs, and the diaphragm connected with conducting coil also vibrates, thereby emitting sound, completing the conversion from electrical signal to sound signal.

[0004] In the structure of current loudspeaker, magnet and conducting coil constitute its magnetic structure, and the magnetic structure occupies a large space, so that the volume of loudspeaker structure is large, which limits its use in handheld electronic devices and ultra-thin electronic devices. Therefore, how to provide a miniaturized loudspeaker structure to meet the demand of ultra-thin or miniaturization of electronic devices has become a problem to be solved. UTILITY MODEL CONTENT

[0005] The utility model provides a kind of micro loudspeaker and circuit system, wherein the purpose of miniaturization is realized by making elements in micro loudspeaker by semiconductor process.

[0006] A kind of micro loudspeaker, comprising:

[0007] Inductive chip is formed by semiconductor process and is connected with diaphragm;

[0008] Control chip is formed by semiconductor process and is electrically connected with the inductive chip; and

[0009] Magnetic element has gap between the inductive chip to provide the inductive chip to bear the movement of the diaphragm;

[0010] Wherein the control chip is used to accept electrical signal, and the inductive chip is inputted by changing the polarity of the electrical signal to form varying magnetic field, and the force between the magnetic element drives the movement of the diaphragm, and the diaphragm in movement generates sound wave output by the micro loudspeaker.

[0011] Further, a substrate is provided, and an inductive circuit layer with an inductive chip is formed on the substrate by semiconductor processing, and the magnetic element and the inductive circuit layer have the gap therebetween; and the control chip is formed on a control circuit layer by semiconductor processing.

[0012] Further, the inductive circuit layer and the control circuit layer are formed on the substrate by semiconductor processing.

[0013] Further, a connection layer is formed on the inductive circuit layer, and the control circuit layer is formed on the connection layer by semiconductor processing in a stacked manner, and the control chip is formed in one or more of the micro-speakers in the control circuit layer; and the control chip is electrically connected to the inductive chip through the connection layer.

[0014] Further, the inductive circuit layer is exposed to one or more precursors by chemical vapor deposition process to form the connection layer by chemical reaction deposition.

[0015] Further, the connection layer is a structure formed on the inductive circuit layer by an insulating material, and a through hole is formed in the insulating material by a through silicon via technology; and then the control circuit layer is formed on the insulating material, and the through hole is used to electrically connect the inductive circuit layer and the control circuit layer.

[0016] Further, the magnetic element is a magnet, a material with magnetism, or made by semiconductor processing.

[0017] Further, the micro-speaker is provided with a carrier plate, and a control circuit layer with one or more control chips is formed on the carrier plate by semiconductor processing.

[0018] Further, the micro-speaker has a housing, and the control chip is one or more and is arranged in the housing or on the outer surface of the housing.

[0019] Further, the inductive chip is formed by one or more micro-coil elements, and each micro-coil element includes:

[0020] a wiring layer provided with a plurality of metal wire segments that form a plurality of continuous windings starting from a starting point and surrounding the starting point, and each metal wire segment has a first electrode end and a second electrode end, wherein the starting point is a first electrode of the micro-coil element, and the end of the plurality of continuous windings is a second electrode of the micro-coil element; and

[0021] an electrode layer provided with at least one first electrode area and at least one second electrode area, the at least one first electrode area is used to collect the first electrode ends of the metal wire segments, and the at least one second electrode area is used to collect the second electrode ends of the metal wire segments.

[0022] Further, the one or more control chips implement a communication circuit, a digital signal processor, an amplifier, and / or a voltage stabilizer and current stabilizer of the micro speaker.

[0023] Further, the one or more control chips are used to receive the electrical signal from a signal source, perform analog-digital conversion or digital-analog conversion, amplify the signal, and / or equalize the signal.

[0024] Further, the micro speaker is electrically connected to the signal source through one or more electrical contacts, a flexible circuit board, or wire bonding provided on the substrate.

[0025] The utility model also provides a circuit system of micro speaker, include:

[0026] The induction circuit layer is connected to the diaphragm, wherein the induction circuit layer is formed with an induction chip by semiconductor process;

[0027] The control circuit layer is electrically connected to the induction circuit layer and includes one or more control chips made by semiconductor process to implement a communication circuit, a digital signal processor, an amplifier, and / or a voltage stabilizer and current stabilizer of the micro speaker; and

[0028] The magnetic element has a gap between the induction circuit layer to provide the induction circuit layer to carry the diaphragm movement;

[0029] Wherein the control chip receives electrical signal from signal source, by changing the polarity of the electrical signal and transport to induction chip to form the induction circuit layer variable magnetic field, and the magnetic element forms the force to drive the diaphragm movement, the diaphragm in motion produces the sound wave output by the micro speaker.

[0030] Therefore, the induction chip and the control chip made by semiconductor process achieve the purpose of miniaturized speaker. The speaker using traditional coil adopts copper coil vertical winding, so that interference is caused when the coil moves up and down, the overall space is limited and there is not much extra free space to set the control chip. Unlike this, the micro speaker proposed in the utility model adopts semiconductor to form the induction chip, and the stacked characteristics of the chip make the overall chip thinner, so that there is extra available space to set additional control chips without interference.

[0031] To further understand the features and technical contents of the utility model, please refer to the following detailed description and drawings of the utility model. However, the provided drawings are only used for reference and illustration, and are not used to limit the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 It is a packaging structure schematic diagram of the micro speaker of the utility model embodiment 1.

[0033] Figure 2 Figure 1 is a side view of the packaging structure of a micro speaker according to an embodiment of the present application;

[0034] Figure 3 Figure 2 is a side view of the packaging structure of a micro speaker according to another embodiment of the present application;

[0035] Figure 4 Figure 3 is a top view of the packaging structure of a micro speaker according to the embodiment of the present application;

[0036] Figure 5 Figure 4 is a block diagram of the circuit system of a micro speaker according to another embodiment of the present application;

[0037] Figure 6 Figure 5 is a side view of the semiconductor structure of a micro speaker according to another embodiment of the present application;

[0038] Figure 7 Figure 6 is a side view of the semiconductor structure of a micro speaker according to another embodiment of the present application;

[0039] Figure 8 Figure 7 is a schematic diagram of a micro speaker according to another embodiment of the present application, showing the micro speaker formed in a stacked manner;

[0040] Figure 9 Figure 8 is a schematic diagram of a micro speaker according to another embodiment of the present application, showing the formation of multiple control chips on a carrier plate during packaging;

[0041] Figure 10 Figure 9 is a schematic diagram of the wiring layer of a micro coil element of a magnetic element of a micro speaker according to another embodiment of the present application;

[0042] Figure 11 Figure 10 is a schematic diagram of the contact unit of a micro coil element according to another embodiment of the present application;

[0043] Figure 12 Figure 11 is a schematic diagram of the negative collection layer of a micro coil element according to another embodiment of the present application;

[0044] Figure 13 Figure 12 is a schematic diagram of the positive collection layer of a micro coil element according to another embodiment of the present application.

[0045] Label explanation:

[0046] Embodiment 1

[0047] 10: micro speaker; 101: shell; 103: first magnetic element; 105: second magnetic element; 107: inductive chip;

[0048] 109: structure internal control chip; 110: diaphragm; 111: first control chip; 112: second control chip;

[0049] 115: first power connection structure; 116: second power connection structure;

[0050] Embodiment 2

[0051] 20: micro speaker; 201: housing; 203: magnetic element; 205: inductive chip; 207: diaphragm; 212: control chip;

[0052] Embodiment 3

[0053] 30: control chip; 301: signal source; 303: digital signal processor; 305: amplification circuit; 307: speaker unit;

[0054] Embodiment 4

[0055] 411: power connection structure; 401: inductive circuit layer; 403: connection layer; 405: control circuit layer;

[0056] Embodiment 5

[0057] 511: power connection structure; 501: substrate; 513: first connection layer; 503: inductive circuit layer; 515: second connection layer;

[0058] 505: control circuit layer;

[0059] Embodiment 6

[0060] 601: control circuit layer; 603: inductive circuit layer; 605: magnetic element;

[0061] Embodiment 7

[0062] 71: diaphragm; 73: carrier plate; 701: control chip;

[0063] Embodiment 8

[0064] 80: micro coil element; 81: first electrode; 82: second electrode; 801: metal wire segment; 83: contact unit;

[0065] 81': first electrode contact; 82': second electrode contact; 85: contact; 87: negative electrode collection layer; 811: first electrode region; 813: first metal wire; 89: positive electrode collection layer; 812: second electrode region; 815: second metal wire. DETAILED DESCRIPTION

[0066] The following is the embodiment of the present application by specific examples, the person skilled in the art can understand the advantages and effects of the present application from the disclosure of the present application. The present application can be implemented or applied by other different specific embodiments, and the details in the specification can be modified and changed based on different viewpoints and applications without departing from the concept of the present application. In addition, the drawings of the present application are only simple schematic illustrations, not the actual size description, and the prior declaration. The following embodiments will further illustrate the related technical content of the present application, but the disclosed content is not used to limit the protection scope of the present application.

[0067] It should be understood that although the terms "first", "second", "third" and the like may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items.

[0068] The present application provides a micro speaker and related circuit system, an inductive chip formed by a micro coil element is made by semiconductor process, and can be matched with a magnetic element made by semiconductor process and a related control circuit to achieve the purpose of miniaturization of the speaker.

[0069] Embodiment 1

[0070] Figure 1 The schematic diagram of the packaging structure of the micro speaker is shown in Figure 1.

[0071] The micro speaker 10 is shown in the figure, which includes a diaphragm 110, a shell 101 and a plurality of elements packaged in the shell 101.

[0072] The plurality of elements include a first magnetic element 103, a second magnetic element 105, an inductive chip 107 and a structure control chip 109.

[0073] The first magnetic element 103 can be made of magnetic material, which can be used to concentrate and strengthen the use of magnetism.

[0074] The second magnetic element 105 can be made of magnet or magnetic material, and the second magnetic element 105 can also be a magnetic element formed on the substrate by semiconductor process.

[0075] The inductive chip 107 is formed on the second magnetic element 105. The inductive chip 107 can be made by semiconductor process, and can be composed of one or more micro coil elements, and is coupled to the second magnetic element 105 by a special connection structure. The special connection structure refers to a flexible circuit board or a wire disposed on the inductive chip 107 to form an integral connection with the second magnetic element 105. The arc-shaped piece in the figure is only one example, and is not limited thereto.

[0076] The electrical signal imported to the inductive chip 107 can form a magnetic field interacting with the second magnetic element 105.

[0077] The structure control chip 109 is formed on the inductive chip 107. In the figure, the structure control chip 109 is made on the inductive chip 107 by semiconductor process in a stacked manner. The structure control chip 109 can be used as a controller in the micro speaker 10, and is designed to be consistent with the inductive chip 107, and can be attached to each other to achieve the purpose of miniaturization. The structure control chip 109 is used to receive an external electrical signal, process it, and then input it to the inductive chip 107.

[0078] Further, the inductive chip 107 or the structure control chip 109 stacked with it can be connected to the diaphragm 110 of the micro speaker 10.

[0079] Further, according to the embodiment of the micro speaker 10, in addition to the structure control chip 109 described above, the result of miniaturization produces an internal excess space, which can accommodate an additional control chip, or a first control chip 111 and a second control chip 112 formed outside the housing 101 of the micro speaker 10.

[0080] In the embodiment, each control chip (such as the structure control chip 109, the first control chip 111, and the second control chip 112) is electrically connected to the inductive chip 107. The first control chip 111 and the second control chip 112 can be arranged at a free position inside or outside the housing 101 of the micro speaker 10, such as on the inner surface or the outer surface of the housing 101, and the structure control chip 109 can be formed on the inductive chip 107.

[0081] Each control chip can be used to process the received electrical signal into an electrical signal (such as current) input to the inductive chip 107, so that the inductive chip 107 generates a magnetic field by the current. It can also achieve voltage / current control or CPU, operational amplifier, etc.

[0082] Next, reference can be made to Figure 2The figure shows a side view of the package structure of the miniature speaker. This figure shows a side view of the miniature speaker 10, including a diaphragm 110 coupled to a sensing chip 107, and a first control chip 111 disposed outside the housing. The miniature speaker has one or more electrical contacts electrically connected to an external signal source (such as a power supply or external device). These electrical contacts can be the first power connection structure 115 and the second power connection structure 116 shown in the figure, and the first power connection structure 115 and the second power connection structure 116 are electrically connected to the sensing chip 107. Of course, the miniature speaker 10 can also be connected to an external signal source via a flexible printed circuit (FPC), wire bonding, or other methods capable of receiving signals.

[0083] Example 2

[0084] Figure 3 A schematic diagram of the packaging structure of the miniature speaker, Example 2.

[0085] The figure shows that the miniature speaker 20 has a housing 201, a magnetic element 203 encapsulated therein, and a ring-shaped sensing chip 205 made by semiconductor process. A diaphragm 207 can be coupled to the sensing chip 205. A control chip 212 electrically connected to the sensing chip 205 is disposed in an empty space inside the housing 201.

[0086] The control chip 212 receives electrical signals, such as voltage or current signals, from a specific signal source. After analog-to-digital conversion and further processing, it forms an electrical signal supplied to the sensing chip 205, creating a magnetic field on the sensing chip 205. This magnetic field interacts with the magnetic element 203, which is enveloped by the magnetic field. Changing the electrical signal input to the sensing chip 205 causes a change in the magnetic field, generating a force that drives the diaphragm 207 to move. The diaphragm 207 vibrates according to the magnitude of the force, producing sound waves.

[0087] like Figure 4 As shown in the figure, this diagram illustrates a circular miniature speaker 20, which includes a diaphragm 207 connected to a sensing chip 205 and magnetic elements 203 coupled thereto. A control chip 212 is also located at a specific position on the miniature speaker 20. In this example, the control chip 212 is attached to the inner surface of the miniature speaker 20's housing; alternatively, it could be located on the outer surface of the speaker.

[0088] Example 3

[0089] Figure 5 Next, a block diagram of the circuit system that drives the miniature speaker is displayed.

[0090] The circuit system driving the micro speaker includes a signal source 301, a control chip 30 and a speaker unit 307 connected in sequence.

[0091] The control chip 30 is connected to and receives the electrical signal of the signal source 301, and includes circuit elements such as a digital signal processor 303 and an amplification circuit 305, and the actual implementation is not limited to the illustrated examples.

[0092] The speaker unit 307 connected to the control chip 30 mainly includes the inductive chip, the magnetic element and the diaphragm as described in Embodiments 1 and 2.

[0093] In the present embodiment, the control chip 30 and the inductive chip in the speaker unit 307 can be formed on the substrate by semiconductor process to constitute a semiconductor structure. Specifically, the semiconductor structure can be formed with an inductive circuit layer having the inductive chip and connected with the diaphragm. In addition, the control circuit layer having the control chip can be formed on the inductive circuit layer in the same layer or in a stacked manner. Specifically, a logic layer is made on the control circuit layer by semiconductor process, and one or more control chips are formed after design, and the number of control chips is determined according to actual needs to realize the communication circuit, the digital signal processor, the amplifier and / or the voltage and current stabilizing circuit of the micro speaker.

[0094] The magnetic element and the inductive circuit layer have a gap providing the inductive circuit layer to bear the movement of the diaphragm. The control chip 30 receives an electrical signal from a signal source, changes the polarity of the electrical signal and inputs it to the inductive chip to form a varying magnetic field in the inductive circuit layer, and forms a driving force between the magnetic element and the diaphragm to move. The moving diaphragm generates the sound wave output by the micro speaker.

[0095] Embodiment 4

[0096] Figure 6 The semiconductor structure side view of the micro speaker of the above embodiment is shown.

[0097] The semiconductor structure of the micro speaker of the present embodiment mainly includes an inductive circuit layer 401, a connecting layer 403 and a control circuit layer 405, and can form an electrical connection structure 411 connected to an external signal source at one end.

[0098] In particular, the inductive circuit layer 401 can be made into an inductive chip by semiconductor process of metal wire segments, which can generate an inductive magnetic field after being introduced into an electrical signal, so as to interact with the magnetic element in the micro speaker. Then, the connecting layer 403 made of an insulating material is formed on the inductive circuit layer 401, and then the control circuit layer 405 is formed on the connecting layer 403 in a stacked manner. The control circuit layer 405 is a logic layer providing circuit design, which can realize the circuit function in the micro speaker.

[0099] Example 5

[0100] Figure 7 Another semiconductor structure side view of the micro-speaker of the above example is shown.

[0101] This example shows that in the semiconductor process, the substrate 501 is first provided, and then the first connection layer 513 is first made on the surface of the substrate 501. The inductive circuit layer 503 can be formed on the first connection layer 513 by using the semiconductor process. For example, a copper layer is first formed on the first connection layer 513, and then metal wire segments can be made on the copper layer by etching, or the metal wire segments can be formed by using the printing process. Referring to FIG. 5A, the inductive chip that can generate a magnetic field by introducing a current is finally formed. Then, the second connection layer 515 is formed on the inductive circuit layer 503 to connect the control circuit layer 505, and the control circuit layer 505 is formed on the second connection layer 515 in a stacked manner by using the semiconductor process. Figures 10 to 13

[0102] The method for forming the above-mentioned first connection layer 513 and the second connection layer 515 includes chemical vapor deposition (CVD) or through silicon via (TSV). The chemical vapor deposition (CVD) process is to expose the substrate 501 to one or more different precursors to deposit a connection structure on the surface of the substrate 501 by a chemical reaction, so as to form the first connection layer 513 on the substrate 501, or to form the second connection layer 515 on the surface of the inductive circuit layer 503. Thus, the inductive circuit layer 503 can be exposed to the one or more precursors by using the chemical vapor deposition process to deposit by a chemical reaction to form the second connection layer 515, and then the second connection layer 515 on the control circuit layer 505 is formed.

[0103] Another method is that the first connection layer 513 and the second connection layer 515 are formed by two layers of insulating materials, and then the through silicon via (TSV) technology is applied to drill holes in the insulating materials, and then conductive materials are filled in the holes to connect the inductive circuit layer 503 and the control circuit layer 505. Specifically, the insulating material structure is first formed on the inductive circuit layer 503, and then the through silicon via technology is applied to drill holes in the insulating material, and then conductive materials are filled in the holes to form vias, and then the control circuit layer 505 is formed on the insulating material, that is, the inductive circuit layer 503 and the control circuit layer 505 are connected through the vias formed by the through silicon via technology.

[0104] ​Speakers using traditional coils employ vertically wound copper coils, which cause interference when the coils move up and down. This results in limited overall space and insufficient space for setting up control chips. In contrast, the miniature speaker proposed in this invention utilizes the stackable nature of chips, making the overall chip thinner. This allows for extra space to be used to set up additional control chips without causing interference.

[0105] Example 6

[0106] Combining the above embodiments 4 and 5, and for example... Figure 8 As shown, this embodiment provides a partial cross-section of a three-dimensional miniature loudspeaker.

[0107] The diagram shows a control circuit layer 601 stacked on top of the sensing circuit layer 603. Other structural details are not described here. It is evident that the magnetic element 605, surrounded by both the sensing circuit layer 603 and the control circuit layer 601, has a gap between it and the sensing circuit layer 603 to support the movement of the diaphragm (not shown in this figure). That is, when the magnetic element 605 is energized in the sensing chip formed in the sensing circuit layer 603, they interact and move relative to each other. For example, the sensing chip formed in the sensing circuit layer 603 connects to the diaphragm, and the sensing chip is coupled to the magnetic element 605, separated by a distance. When current is introduced, a magnetic field is formed on the sensing chip. By changing the current and direction, the polarity of the magnetic field is changed. By reversing the magnetic field, the diaphragm moves, thereby pushing air to produce sound. The actual movement amplitude can be 0.01~5mm, depending on the amplitude and frequency of the audio signal.

[0108] According to the description of the above embodiments, after the sensing circuit layer 603 receives the electrical signal input from the control circuit layer 601, the polarity of the electrical signal can be changed by the control chip formed on the control circuit layer 601, thereby forming a changing magnetic field in the sensing circuit layer 603. A force is formed between the sensing circuit layer 603 and the adjacent magnetic element 605 to drive the diaphragm to move. The moving diaphragm generates sound waves output by the miniature speaker.

[0109] Example 7

[0110] like Figure 9 As shown in the figure, this embodiment is a schematic diagram of forming multiple control chips on a carrier board during packaging.

[0111] The example shows that the micro-speaker can be provided with multiple control chips 701, and the control chips 701 do not necessarily form the substrate as described in the above embodiments, but can be on a carrier board 73, which is a structural layer on a sensing chip (not shown in the figure) connected to the diaphragm 71 in the figure. In this way, multiple control chips 701 can respectively realize various circuit functions in the micro-speaker, such as communication circuits (such as Bluetooth communication circuits), digital signal processors, amplifiers, and / or voltage and current stabilizing circuits, etc., and can be used to perform analog-digital or digital-analog conversion, amplify signals, equalize signals, and / or digital-analog conversion, etc. Audio processing programs.

[0112] In this way, when the sensing chip receives the electrical signal input by the control chip 701, one of the control chips can change the polarity of the electrical signal according to the signal emitted by the signal source, so as to form a varying magnetic field on the sensing chip, so as to form a driving force between the magnetic element (not shown in the figure) to drive the diaphragm 71 to move. The moving diaphragm 71 generates sound waves output by the micro-speaker.

[0113] Embodiment 8

[0114] According to the miniaturization requirement, one or both of the sensing chip and the magnetic element in the micro-speaker is composed of one or more micro-coil elements, especially the sensing chip is formed by one or more micro-coil elements on the sensing circuit layer, as shown in particular. Figures 10 to 13

[0115] The micro-speaker provided by the utility model is miniaturized, and the micro-coil element formed by the metal micro-line segment is used to realize the sensing chip, and the micro-coil element formed by the metal micro-line segment is also used to realize the magnetic element.

[0116] The micro-coil element can be a component (such as a chip) made by plating, metallization or etching, and electrically connected to its control circuit by wire bonding or flip chip. The magnetic element of each of the above embodiments can adopt the micro-coil element, or an array type micro-coil element formed by multiple micro-coil elements, or one of them can be used, and the other can be a specific magnetic object (such as a magnet).

[0117] Figure 10 ​The diagram shows the wiring layer of a microcoil element 80. The wiring layer of the microcoil element 80 consists of continuous or discontinuous metal lines. The illustration shows multiple breaks in the metal lines as required. The wiring layer has multiple metal lines 801 that start from a starting point and form multiple continuous loops around this starting point. The starting point can be located at any position within the microcoil element, preferably near the central region, but is not limited to this; the starting point position can be determined according to actual needs. The starting point forms the first electrode 81, for example, the negative electrode of the microcoil element, while the end of the metal line segment, that is, the end of the multiple continuous metal lines, forms the second electrode 82 of the microcoil element, which can be the positive electrode of the microcoil element.

[0118] As shown in the figure, each of the multiple metal segments has two endpoints, one of which is the first electrode, such as the end of the first electrode 81 formed closer to the starting point; the other end is the second electrode, which is the end closer to the end of the metal segment, namely the second electrode 82.

[0119] For example Figure 11 The contact unit 83 shown is as follows: Figure 10 This diagram shows another contact surface of the microcoil element. The contact unit 83 shown in this figure includes multiple contacts 85 at both ends of multiple metal line segments on the wiring layer corresponding to the microcoil element, and the other side electrode corresponding to the first electrode 81 and the second electrode 82, namely the first electrode contact 81' and the second electrode contact 82'.

[0120] In addition to the wiring layer described in the above embodiments, the microcoil element 80 may also have an electrode layer, such as... Figure 12 and Figure 13 As shown.

[0121] Figure 12 The negative electrode collection layer 87, which is shown as a collection layer for the first electrode terminals (e.g., negative terminals) of each metal line segment on the wiring layer, includes a first electrode region 811 that collects the first electrode terminals of each metal line segment. For example, an electrode pad is implemented. The electrode pad needs to have sufficient area to connect multiple first metal lines 813 (corresponding to the metal line segments in the wiring layer). The first metal lines 813 in this negative electrode collection layer 87 are used to guide the connection of the negative terminals in each metal line segment in the wiring layer.

[0122] Figure 13 The positive electrode collection layer 89, which is shown as the second electrode (e.g., positive electrode) of each metal line segment of the wiring layer, includes a second electrode region 812 that collects the second electrode of each metal line segment. Similarly, it should be an electrical pad with sufficient area to connect multiple second metal lines 815. The second metal lines 815 shown are used in this positive electrode collection layer 89 to guide the connection of the positive electrode in each metal line segment of the wiring layer.

[0123] The above-mentioned way of gathering the electrode ends of the metal wire segments on the electrode layer is through vias or wire guides on the substrate of the electrode layer to the first electrode area 811 and the second electrode area 812.

[0124] In summary, according to the micro speaker described in the above embodiment, the inductive chip in the micro speaker is implemented by using the micro coil element, the magnetic chip is also implemented by using the micro coil element, and the inductive chip and the control chip are combined in a stacking manner to achieve the purpose of miniaturization. In this way, the inductive chip is connected to the diaphragm of the micro speaker, and through the operation of the circuit system, the inductive chip forms a magnetic field after being powered on, and interacts with the magnetic element to drive the diaphragm to move, thereby generating sound. It is pointed out that, unlike the speaker made of a traditional coil, the characteristics of the inductive chip can reduce the area of the magnetic element (such as a magnet), so that the control chip can be placed in the remaining space, so that the micro speaker will have the effects of saving space and reducing signal delay due to short transmission path.

[0125] The above disclosed content is only the preferred feasible embodiment of the utility model, and does not limit the patent application range of the utility model, so equivalent technical changes made by applying the utility model specification and drawing content are all included in the patent application range of the utility model.

Claims

1. A micro speaker, characterized by, The micro-speaker comprises: a sensing chip formed by semiconductor process and connected to the diaphragm; a control chip formed by semiconductor process and electrically connected to the sensing chip; a magnetic element having a gap with the sensing chip for allowing the diaphragm to move; wherein the control chip is configured to receive an electrical signal, change the polarity of the electrical signal and input the changed electrical signal to the sensing chip to form a varying magnetic field, and generate a force between the magnetic element and the diaphragm to drive the diaphragm to move and generate sound waves. The micro-speaker further comprises a substrate, a sensing circuit layer formed on the substrate by semiconductor process and having the sensing chip, and a magnetic element having a gap with the sensing circuit layer; and the control chip is formed on a control circuit layer by semiconductor process.

2. The microspeaker of claim 1, wherein: The sensing circuit layer and the control circuit layer are formed on the substrate by semiconductor process.

3. The microspeaker of claim 2, wherein: The sensing circuit layer has a connection layer formed thereon, and the control circuit layer is formed on the connection layer by semiconductor process in a stacked manner and has one or more control chips formed therein.

4. The micro speaker of claim 2, wherein: The control chip is electrically connected to the sensing chip through the connection layer. The connection layer is formed by chemical vapor deposition process or silicon through hole technology on an insulating material.

5. The microspeaker of claim 4, wherein: The magnetic element is a magnet, a magnetic material or formed by semiconductor process.

6. The microspeaker of claim 1, wherein: The micro-speaker has a carrier substrate, and a control circuit layer having one or more control chips formed on the carrier substrate by semiconductor process.

7. The microspeaker of claim 1, wherein: The micro-speaker has a housing, and the control chip is one or more and disposed in the housing or on the outer surface of the housing.

8. The microspeaker of claim 1, wherein: The sensing chip is formed by one or more micro-coil elements, and each micro-coil element comprises:

9. The microspeaker of claim 1, wherein: a wiring layer having a plurality of metal wire segments each having a first electrode end and a second electrode end, and a starting point, wherein the starting point is a first electrode of the micro-coil element, and the end of the plurality of metal wire segments is a second electrode of the micro-coil element; and an electrode layer having at least one first electrode area for collecting the first electrode ends of the metal wire segments and at least one second electrode area for collecting the second electrode ends of the metal wire segments. The one or more control chips implement a communication circuit, a digital signal processor, an amplifier and / or a voltage and current stabilizing circuit of the micro-speaker.

10. The micro speaker according to any one of claims 4-9, wherein: The one or more control chips are configured to receive the electrical signal from a signal source, perform analog-to-digital conversion or digital-to-analog conversion, amplify the signal and / or equalize the signal.

11. The micro speaker according to any one of claims 4-9, wherein: The micro-speaker is electrically connected to the signal source by one or more electrical contacts, a flexible circuit board or wire bonding on a substrate.

12. The microspeaker of claim 11, wherein: The micro-speaker comprises:

13. Circuitry for a micro loudspeaker, characterized by a sensing circuit layer connected to a diaphragm, wherein the sensing circuit layer has a sensing chip formed by semiconductor process; a control circuit layer electrically connected to the sensing circuit layer, comprising one or more control chips formed by semiconductor process, and implementing a communication circuit, a digital signal processor, an amplifier and / or a voltage and current stabilizing circuit of the micro-speaker; and ​ a magnetic element, and a gap between the magnetic element and the inductive circuit layer for allowing the inductive circuit layer to carry the diaphragm movement; wherein the control chip receives an electrical signal from a signal source, changes the polarity of the electrical signal, and transmits the changed electrical signal to the inductive chip to form a variable magnetic field in the inductive circuit layer, and a force between the magnetic element and the inductive circuit layer for driving the diaphragm movement, and the moving diaphragm generates sound waves for the micro-speaker output.

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