Wafer scanning device

Abstract

The utility model discloses a wafer scanning device which comprises a reflection sensor and a reflection plate, and the reflection sensor can receive signals reflected by the reflection plate. The interfaces T1 to T4 are used for transmitting signals IN-1 to IN-4 of the reflection sensor to the chip U1; the interface P1 is used for sending a signal OUT-1 and a signal OUT-2 of the chip U1 to an original interface of equipment, and the interface P4 is used for sending a signal OUT-3 and a signal OUT-4 of the chip U1 to the original interface of the equipment. The device is suitable for etching equipment, thin film deposition equipment and the like, adopts a reflection sensor and a special processing circuit, can process wafers made of different materials such as Si, SiC and the like, and is simple to adjust, low in cost and high in stability.

Description

Technical Field

[0001] This utility model relates to a wafer scanning device, specifically a wafer scanning device. Background Technology

[0002] Current wafer scanning devices use simple through-beam LED arrays, which are installed on both sides of the wafer stage. The installation requirements are high, and the LEDs must be aligned to detect the position of the wafer. The received signals are then processed by a dedicated and relatively complex circuit board.

[0003] The device has the following defects:

[0004] 1. Through-beam LEDs have a short lifespan;

[0005] 2. Due to the use of simple LEDs, the selection of various semiconductor materials is relatively limited. Apart from silicon wafers, it cannot fully cover wafers made of other materials (SiC, CaN, etc.).

[0006] 3. Using a complex dedicated circuit board to process the received signal, and then using software settings to confirm the specific location, makes the debugging process cumbersome. Utility Model Content

[0007] To address the shortcomings of the prior art, this invention provides a wafer scanning device. This invention is applicable to equipment such as etching and thin film deposition. It employs a reflective sensor and a dedicated processing circuit, and can process wafers made of different materials such as Si and SiC. It is simple to adjust, low in cost, and highly stable.

[0008] To achieve the above technical objectives, the present invention adopts the following technical solution: a wafer scanning device, comprising a reflection sensor and a reflection plate, wherein the reflection sensor is capable of receiving signals reflected by the reflection plate and generating signals IN-1 to IN-4; and further comprising a chip U1, interfaces T1 to T4, interface P1 and interface P4;

[0009] The input terminals of the chip U1 are respectively connected to interfaces T1 to T4, and interfaces T1 to T4 are all connected to the reflection sensor. Interfaces T1 to T4 are used to transmit the signals IN-1 to IN-4 of the reflection sensor to the chip U1.

[0010] The output terminals of the chip U1 are connected to the interface P1 and the interface P4 respectively. Both the interface P1 and the interface P4 are connected to the original interface of the device. The interface P1 is used to send the signals OUT-1 and OUT-2 of the chip U1 to the original interface of the device, and the interface P4 is used to send the signals OUT-3 and OUT-4 of the chip U1 to the original interface of the device.

[0011] The reflection sensor used is model KEYENCE LV-NH62.

[0012] Interfaces T1 to T4 are respectively connected to pins AL, AR, BL, and BR of the reflection sensor.

[0013] Pin 3 of chip U1 is connected to pin 3 of interface T1 to receive signal IN-1; pin 5 of chip U1 is connected to pin 3 of interface T2 to receive signal IN-2; pin 10 of chip U1 is connected to pin 3 of interface T3 to receive signal IN-3; and pin 12 of chip U1 is connected to pin 3 of interface T4 to receive signal IN-4.

[0014] Pin 2 of the chip U1 is connected to variable resistor P2 and resistor R5 respectively. The other end of variable resistor P2 is connected to pin 1 of the chip U1. At the same time, pin 1 of the chip U1 outputs signal OUT-1. The other end of resistor R5 is divided into three paths: the first path is connected to resistor R6, which is connected to +15V; the second path is connected to variable resistor P1, which is grounded; and the third path is connected to capacitor C2, which is grounded.

[0015] Pin 6 of chip U1 is connected to variable resistor P5 and resistor R9 respectively. The other end of variable resistor P5 is connected to pin 7 of chip U1. At the same time, pin 7 of chip U1 outputs signal OUT-2. The other end of resistor R9 is divided into three paths: the first path is connected to resistor R10, which is connected to +15V; the second path is connected to variable resistor P6, which is grounded; and the third path is connected to capacitor C4, which is grounded.

[0016] Pin 9 of chip U1 is connected to variable resistor P8 and resistor R11 respectively. The other end of variable resistor P8 is connected to pin 8 of chip U1. At the same time, pin 8 of chip U1 outputs signal OUT-3. The other end of resistor R11 is divided into three paths: the first path is connected to resistor R12, which is connected to +15V; the second path is connected to variable resistor P7, which is grounded; and the third path is connected to capacitor C5, which is grounded.

[0017] Pin 13 of chip U1 is connected to variable resistor P4 and resistor R7 respectively. The other end of variable resistor P4 is connected to pin 14 of chip U1. At the same time, pin 14 of chip U1 outputs signal OUT-4. The other end of resistor R7 is divided into three paths: the first path is connected to resistor R8, which is connected to +15V; the second path is connected to variable resistor P3, which is grounded; and the third path is connected to capacitor C3, which is grounded.

[0018] In summary, this utility model achieves the following technical effects:

[0019] 1. The new reflective sensor is adopted. As long as the reflector is installed in a suitable position, no adjustment is required. The sensor can receive the signal by shining on the reflector. Compared with the through-beam sensor in the previous structure, the reflective sensor of this utility model is simple and convenient to install, has low installation space requirements, and has a long service life.

[0020] 2. It can be adapted to existing equipment, enabling existing equipment to process wafers of different materials, thereby reducing the cost of the entire processing process and making it simple and convenient. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a wafer scanning device provided in an embodiment of the present invention;

[0022] Figure 2 This is a schematic diagram of four interface Ts;

[0023] Figure 3 This is a schematic diagram of two interfaces P;

[0024] Figure 4 This is a schematic diagram of chip U1. Detailed Implementation

[0025] The present invention will be further described in detail below with reference to the accompanying drawings.

[0026] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.

[0027] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0031] Example:

[0032] Figure 1This is a wafer scanning device, including a reflective sensor and a reflective plate. The reflective sensor can receive the signal reflected by the reflective plate and generate signals IN-1 to IN-4. In this invention, the reflective plate and the reflective sensor are respectively installed on both sides of the wafer cassette. The reflective sensor can emit light, and after the light is reflected by the reflective plate, it is received again by the reflective sensor, which can record the position of the wafer when the light is blocked by the wafer.

[0033] Figure 1 In this context, Wafers represents wafer slabs, NEW SENSOR represents a reflective sensor, Reflect Board represents a reflective plate, Cassette represents a wafer box, and Indexer represents a wafer stage.

[0034] In this embodiment, the reflective sensor is model KEYENCE LV-NH62. The reflector plate is selected with a reflectivity greater than 95% that comes with the reflective sensor. As long as the reflector plate is installed in a suitable position, no adjustment is required. The reflective sensor can receive the signal by shining on the reflector plate. Compared with the through-beam sensor in the previous structure, the reflective sensor in this utility model is simple and convenient to install and has low requirements for installation space.

[0035] It also includes a circuit board on which processing circuitry is configured.

[0036] The circuit board is configured with chip U1, interfaces T1 to T4, interface P1, and interface P4. Chip U1 is an LM324, interfaces T1 to T4 are KF128-3P, and interfaces P1 and P4 are TE640500-3.

[0037] Figure 2 This is a schematic diagram of four interfaces T. Interfaces T1 to T4 are: interface T1, interface T2, interface T3, and interface T4, respectively. These four interfaces are used to transmit input signals from the reflection sensor. In this embodiment, there are four input signals, namely signal IN-1, signal IN-2, signal IN-3, and signal IN-4.

[0038] Figure 3 This is a schematic diagram of two interfaces P. Interfaces P1 and P4 are used to output the signals processed by chip U1 to the original interface of the device. There are a total of four output signals, namely signal OUT-1, signal OUT-2, signal OUT-3, and signal OUT-4.

[0039] Figure 4 This is a schematic diagram of chip U1. The input terminals of chip U1 are connected to interfaces T1 to T4 respectively. Interfaces T1 to T4 are all connected to the reflection sensor. Interfaces T1 to T4 are used to transmit the signals IN-1 to IN-4 from the reflection sensor to chip U1.

[0040] The output terminals of chip U1 are connected to interface P1 and interface P4 respectively. Both interface P1 and interface P4 are connected to the original interface of the device. Interface P1 is used to send the signals OUT-1 and OUT-2 of chip U1 to the original interface of the device, and interface P4 is used to send the signals OUT-3 and OUT-4 of chip U1 to the original interface of the device.

[0041] This application uses four interfaces T to connect to the reflection sensor for transmitting the reflection sensor's signal, and two interfaces P to connect to the device's original interface for transmitting the processed signal. The connection to the reflection sensor is convenient, and the connection to the device's original interface is equally convenient, making the operation simple.

[0042] Furthermore, interfaces T1 to T4 are connected to pins AL, AR, BL, and BR of the reflection sensor, respectively, corresponding to the four input signals IN-1, IN-2, IN-3, and IN-4. These four input signals represent the on / off duration of the sensor, which is used to indirectly reflect the thickness of the wafer.

[0043] Pin 3 of chip U1 connects to pin 3 of interface T1 to receive signal IN-1; pin 5 of chip U1 connects to pin 3 of interface T2 to receive signal IN-2; pin 10 of chip U1 connects to pin 3 of interface T3 to receive signal IN-3; and pin 12 of chip U1 connects to pin 3 of interface T4 to receive signal IN-4. Pin 4 of the chip is connected to +15V, and pin 11 is connected to -15V.

[0044] Variable resistors are set on pins 2, 6, 9, and 13 of chip U1. When there is a deviation in the target position or a change in the material, the amplitude of the output waveform voltage can be finely adjusted.

[0045] Specifically as follows:

[0046] Pins 2 of chip U1 are connected to variable resistor P2 and resistor R5 respectively. The other end of variable resistor P2 is connected to pin 1 of chip U1. At the same time, pin 1 of chip U1 outputs signal OUT-1. The other end of resistor R5 is divided into three paths: the first path is connected to resistor R6, which is connected to +15V; the second path is connected to variable resistor P1, which is grounded; and the third path is connected to capacitor C2, which is grounded.

[0047] Pin 6 of chip U1 is connected to variable resistor P5 and resistor R9 respectively. The other end of variable resistor P5 is connected to pin 7 of chip U1. At the same time, pin 7 of chip U1 outputs signal OUT-2. The other end of resistor R9 is divided into three paths: the first path is connected to resistor R10, which is connected to +15V; the second path is connected to variable resistor P6, which is grounded; and the third path is connected to capacitor C4, which is grounded.

[0048] Pin 9 of chip U1 is connected to variable resistor P8 and resistor R11 respectively. The other end of variable resistor P8 is connected to pin 8 of chip U1. At the same time, pin 8 of chip U1 outputs signal OUT-3. The other end of resistor R11 is divided into three paths. The first path is connected to resistor R12, which is connected to +15V. The second path is connected to variable resistor P7, which is grounded. The third path is connected to capacitor C5, which is grounded.

[0049] Pin 13 of chip U1 is connected to variable resistor P4 and resistor R7 respectively. The other end of variable resistor P4 is connected to pin 14 of chip U1. At the same time, pin 14 of chip U1 outputs signal OUT-4. The other end of resistor R7 is divided into three paths: the first path is connected to resistor R8, which is connected to +15V; the second path is connected to variable resistor P3, which is grounded; and the third path is connected to capacitor C3, which is grounded.

[0050] In this embodiment, pin 1 of interface P1 is connected to pin 7 of U1 to receive signal OUT-2, pin 2 of interface P1 is grounded, pin 3 of interface P1 is connected to fuse F2, pin 4 of interface P1 is grounded, pin 5 of interface P1 is connected to fuse F1, and pin 6 of interface P1 is connected to pin 1 of U1 to receive signal OUT-1. Interface P1 is connected to the J1 interface of the original device.

[0051] Pin 1 of interface P4 is connected to pin 14 of U1 to receive signal OUT-4. Pin 2 of interface P4 is grounded. Pin 3 of interface P4 is connected to fuse F2. Pin 4 of interface P4 is grounded. Pin 5 of interface P4 is connected to fuse F1. Pin 6 of interface P4 is connected to pin 8 of U1 to receive signal OUT-3. Interface P4 is connected to the J4 interface of the original device.

[0052] The operating voltage of this invention is provided by the device through interfaces P1 and P4, and is protected by fuses F1 and F2.

[0053] This application uses a reflection sensor and a reflector to replace the original simple LED, thus solving the problem that simple LEDs can only process silicon wafers and cannot process wafers of other materials.

[0054] This application uses a simple circuit to process signals, making debugging easy.

[0055] When the equipment starts running, the wafer indexer moves at a constant speed from top to bottom. The reflection sensor receives the light reflected back from the reflector, thereby receiving the real-time signal waveform. Where there is a wafer, the voltage is low, and where there is no wafer, the voltage is high.

[0056] Interface T receives the signal from the reflection sensor, processes it through chip U1, and then connects it to the device's original interface. After processing the corresponding information, the device provides the wafer's position information and completes the scanning operation.

[0057] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall fall within the scope of the technical solution of the present utility model.

Claims

1. A wafer scanning device, characterized in that: It includes a reflection sensor and a reflector, wherein the reflection sensor is capable of receiving signals reflected by the reflector and generating signals IN-1 to IN-4; it also includes a chip U1, interfaces T1 to T4, interface P1 and interface P4; The input terminals of the chip U1 are respectively connected to interfaces T1 to T4, and interfaces T1 to T4 are all connected to the reflection sensor. Interfaces T1 to T4 are used to transmit the signals IN-1 to IN-4 of the reflection sensor to the chip U1. The output terminals of the chip U1 are connected to the interface P1 and the interface P4 respectively. Both the interface P1 and the interface P4 are connected to the original interface of the device. The interface P1 is used to send the signals OUT-1 and OUT-2 of the chip U1 to the original interface of the device, and the interface P4 is used to send the signals OUT-3 and OUT-4 of the chip U1 to the original interface of the device.

2. The wafer scanning device according to claim 1, characterized in that: The reflection sensor used is model KEYENCE LV-NH62.

3. The wafer scanning device according to claim 2, characterized in that: Interfaces T1 to T4 are respectively connected to pins AL, AR, BL, and BR of the reflection sensor.

4. The wafer scanning device according to claim 1, characterized in that: Pin 3 of chip U1 is connected to pin 3 of interface T1 to receive signal IN-1; pin 5 of chip U1 is connected to pin 3 of interface T2 to receive signal IN-2; pin 10 of chip U1 is connected to pin 3 of interface T3 to receive signal IN-3; and pin 12 of chip U1 is connected to pin 3 of interface T4 to receive signal IN-4.

5. A wafer scanning device according to claim 4, characterized in that: Pin 2 of the chip U1 is connected to variable resistor P2 and resistor R5 respectively. The other end of variable resistor P2 is connected to pin 1 of the chip U1. At the same time, pin 1 of the chip U1 outputs signal OUT-1. The other end of resistor R5 is divided into three paths: the first path is connected to resistor R6, which is connected to +15V; the second path is connected to variable resistor P1, which is grounded; and the third path is connected to capacitor C2, which is grounded.

6. A wafer scanning device according to claim 5, characterized in that: Pin 6 of chip U1 is connected to variable resistor P5 and resistor R9 respectively. The other end of variable resistor P5 is connected to pin 7 of chip U1. At the same time, pin 7 of chip U1 outputs signal OUT-2. The other end of resistor R9 is divided into three paths: the first path is connected to resistor R10, which is connected to +15V; the second path is connected to variable resistor P6, which is grounded; and the third path is connected to capacitor C4, which is grounded.

7. A wafer scanning device according to claim 6, characterized in that: Pin 9 of chip U1 is connected to variable resistor P8 and resistor R11 respectively. The other end of variable resistor P8 is connected to pin 8 of chip U1. At the same time, pin 8 of chip U1 outputs signal OUT-3. The other end of resistor R11 is divided into three paths: the first path is connected to resistor R12, which is connected to +15V; the second path is connected to variable resistor P7, which is grounded; and the third path is connected to capacitor C5, which is grounded.

8. A wafer scanning device according to claim 7, characterized in that: Pin 13 of chip U1 is connected to variable resistor P4 and resistor R7 respectively. The other end of variable resistor P4 is connected to pin 14 of chip U1. At the same time, pin 14 of chip U1 outputs signal OUT-4. The other end of resistor R7 is divided into three paths: the first path is connected to resistor R8, which is connected to +15V; the second path is connected to variable resistor P3, which is grounded; and the third path is connected to capacitor C3, which is grounded.

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