Inductor with high heat dissipation performance

By combining the heat sink fin cover with a miniature fan, using a ball and spring retaining assembly, and reinforcing guide posts, the problems of poor heat dissipation and unstable connection of traditional inductors in high-vibration environments are solved, achieving efficient heat dissipation and stable electrical connection of the inductor.

CN224203944UActive Publication Date: 2026-05-05东莞市洋懿电子科技有限公司
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Patent Information

Application Number
CN202521272973.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-06-20
Publication Date
2026-05-05
Estimated Expiration
2035-06-20

AI Technical Summary

Technical Problem

Traditional inductors are prone to increased contact resistance due to friction and wear between the pins and the circuit board in high-vibration environments. This leads to a high risk of localized overheating and poor heat dissipation, causing heat to accumulate and exceed the tolerance limit of the insulation material.

Method used

It adopts a passive heat dissipation and active air cooling mode that combines heat dissipation fin cover and miniature fan. The limiting group composed of ball and spring prevents the pins from becoming loose. The pins fit tightly with the holes on the circuit board. The reinforced guide post enhances the structural stability. The start and stop of the miniature fan is controlled by a temperature sensor to achieve precise heat dissipation.

Benefits of technology

Stable electrical connection and efficient heat dissipation of inductors are achieved in high vibration environments, avoiding local overheating and poor contact, and improving circuit stability and energy efficiency.

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Abstract

The utility model relates to the technical field of inductors, in particular to an inductor with high heat dissipation performance, which comprises a circuit board, a lower mounting rack, an upper mounting rack, a heat dissipation fin cover, a miniature electric fan, a shielding cover and an inductor body, the top of the circuit board is clamped with the lower mounting rack, and the top of the lower mounting rack is clamped with the upper mounting rack; a heat dissipation fin cover is clamped between the upper mounting frame and the lower mounting frame, a micro electric fan is arranged at the top of the upper mounting frame, a shielding cover is clamped on the inner side of the heat dissipation fin cover, and an inductor body is arranged in the shielding cover. According to the utility model, the dual modes of passive heat dissipation and active air cooling are realized through the synergistic effect of the heat dissipation fin cover and the micro electric fan; a limiting group consisting of a spring and a clamping ball is arranged in the clamping seat, and the clamping ball is embedded into a pin groove to form mechanical occlusion, so that the pin is prevented from loosening or falling off in a vibration environment; the pins are tightly matched with the hole sites of the circuit board, and the bottom end of the clamping seat is flush with the reinforcing guide columns, so that stress is dispersed, and stable contact between the pins and the circuit board is ensured.
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