High-efficiency plasma processing device for semiconductor parts
By designing a plasma processing device that includes clamping plates, a fan, and a ring electrode, the problems of uneven plasma distribution and inflexible fixation were solved, achieving uniformity and adaptability of surface treatment for semiconductor parts and expanding the application range of the device.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- KUNSHAN KETIAN PRECISION MASCH CO LTD
- Filing Date
- 2025-06-13
- Publication Date
- 2026-05-22
AI Technical Summary
Existing plasma processing devices exhibit uneven plasma distribution on semiconductor components, resulting in inconsistent surface treatment effects. Furthermore, the fixing methods are not flexible enough to adapt to components of different specifications and shapes, thus limiting the scope of application.
A device comprising a housing, partition, mounting bracket, gas tank, fan, turntable, and radio frequency plasma generator is designed. Semiconductor components are clamped by the cooperation of clamps and springs, and gas is transported by the fan and pipes to make the plasma uniformly distributed in the processing chamber. The rotation of the turntable ensures uniform contact between the components and the gas. The electrodes of the radio frequency plasma generator are distributed in a ring array.
It achieves uniform surface treatment of semiconductor parts and flexible fixation and adaptation capabilities, improving the practicality of the processing device and adapting to the processing needs of parts of different sizes.
Smart Images
Figure CN224266981U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of plasma processing technology, and in particular to a high-efficiency plasma processing device for semiconductor components. Background Technology
[0002] In the manufacturing process of semiconductor components, plasma treatment is one of the key processes, used for surface cleaning, etching, and coating to improve the performance and quality of semiconductor components. Existing plasma treatment devices suffer from uneven plasma distribution when processing semiconductor components, leading to inconsistent surface treatment results and affecting product uniformity. Furthermore, some devices lack flexibility in fixing semiconductor components, making it difficult to adapt to parts of different specifications and shapes, thus limiting their application range. Therefore, we propose a high-efficiency plasma treatment device for semiconductor components. Utility Model Content
[0003] To address the aforementioned problems, this invention provides a high-efficiency plasma treatment device for semiconductor components. This invention solves the problems of uneven plasma distribution in existing plasma treatment devices when processing semiconductor components, leading to inconsistent surface treatment results and affecting product uniformity. Furthermore, some devices lack flexibility in fixing semiconductor components, making it difficult to adapt to components of different specifications and shapes, thus limiting their application range.
[0004] This utility model discloses a high-efficiency plasma treatment device for semiconductor components, comprising a housing, a partition in the middle of the housing, a mounting bracket on one side of the housing below the partition, a gas tank fixedly mounted on the mounting bracket, a fan on one side of the mounting bracket, the gas tank being connected to the fan input end via a first pipe, the fan output end extending above the partition via a second pipe and connected to an outlet plate, a U-shaped support frame in the middle of the upper part of the partition, a motor in the middle of the lower end of the U-shaped support frame, the motor rotation shaft passing through the U-shaped support frame and fixedly connected to a turntable, two sets of symmetrical positioning components above the turntable, and a radio frequency plasma generator at the bottom of the housing.
[0005] In the above solution, the positioning component includes a fixing plate, and there are two fixing plates. The lower end of the fixing plates that are close to each other is provided with a limiting groove. A clamping plate is provided in the limiting groove, and the clamping plate is fixedly connected to the inner wall of the limiting groove by a spring.
[0006] In the above scheme, a rubber pad is provided at the end of the clamping plate away from the spring.
[0007] In the above scheme, a solenoid valve is installed on the second pipeline.
[0008] In the above scheme, the gas tank is provided with an air inlet pipe on the side away from the blower, and the air inlet pipe is provided with a first valve on the side outside the shell.
[0009] In the above scheme, the shell has a door on the side above the partition, and the door has a transparent observation window.
[0010] In the above scheme, an air outlet pipe is provided on one side of the upper end of the housing, and a second valve is provided on the air outlet pipe.
[0011] Compared with related technologies, this utility model has the following beneficial effects:
[0012] This invention provides a high-efficiency plasma treatment device for semiconductor components. When the semiconductor component is placed between two clamping plates, the plates hold it in place under the action of spring force. The cooperation between the two clamping plates ensures the semiconductor component is stably positioned above a turntable. A fan transports gas from inside a gas tank through a first and second pipe, allowing the gas to enter the treatment chamber formed by the partition and the upper part of the housing via an outlet plate. A motor drives the turntable to rotate, ensuring the semiconductor component, fixed to the positioning assembly, makes uniform contact with the gas. The electrodes of the radio frequency plasma generator are distributed in a ring array at the top of the treatment chamber, enabling more uniform plasma distribution within the chamber and ensuring consistent surface treatment of the semiconductor component. This treatment device has a simple structure, good positioning effect, can clamp semiconductor components of different sizes, and provides good plasma uniformity, effectively improving the practicality of the treatment device. Attached Figure Description
[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0014] Figure 1 This is a schematic diagram of the structure of this utility model;
[0015] Figure 2 This is a cross-sectional view of the present invention;
[0016] Figure 3 This is a cross-sectional view of the positioning component of this utility model.
[0017] In the diagram: 1. Shell; 2. Partition; 3. Mounting bracket; 4. Gas tank; 5. Fan; 6. First pipe; 7. Second pipe; 8. Gas outlet plate; 9. U-shaped support frame; 10. Motor; 11. Turntable; 12. Positioning assembly; 121. Fixing plate; 122. Limiting groove; 123. Spring; 124. Clamping plate; 125. Rubber pad; 13. Radio frequency plasma generator; 14. Solenoid valve; 15. Inlet pipe; 16. First valve; 17. Door; 18. Transparent observation window; 19. Gas outlet pipe; 20. Second valve. Detailed Implementation
[0018] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings and examples. The following examples are only used to more clearly illustrate the technical solution of this utility model and should not be construed as limiting the scope of protection of this utility model.
[0019] like Figure 1-3 As shown, this utility model is a high-efficiency plasma processing device for semiconductor components, including a housing 1. The housing 1 has a partition 2 in its central part, and a mounting frame 3 is located on one side of the housing 1 below the partition 2. A gas tank 4 is fixedly mounted on the mounting frame 3, which stores the gas to be used. A fan 5 is located on one side of the mounting frame 3. The gas tank 4 is connected to the input end of the fan 5 via a first pipe 6, and the output end of the fan 5 extends above the partition 2 via a second pipe 7, connecting to an outlet plate 8. When the fan 5 is operating, it transports the gas inside the gas tank 4. Through the transmission via the first pipe 6 and the second pipe 7, the gas can enter the processing chamber formed by the partition 2 and the upper part of the housing 1 through the outlet plate 8. A U-shaped support frame 9 is provided at the upper center of the partition 2. A motor 10 is provided at the lower center of the U-shaped support frame 9. The rotation shaft of the motor 10 passes through the U-shaped support frame 9 and is fixedly connected to the turntable 11. When the motor 10 is working, the motor 10 drives the turntable 11 to rotate. Through the rotating turntable 11, the semiconductor parts fixed on the positioning components 12 can be evenly contacted with the gas. Two sets of symmetrical positioning components 12 are provided above the turntable 11. The positioning components 12 can fix the semiconductor parts. A radio frequency plasma generator 13 is provided at the bottom of the housing 1. The electrodes of the radio frequency plasma generator 13 are distributed at the top of the processing chamber and are arranged in a ring array, which can make the plasma more evenly distributed in the processing chamber and ensure the consistency of the surface treatment of the semiconductor parts.
[0020] The positioning component 12 includes two fixing plates 121. Each fixing plate 121 has a limiting groove 122 at its lower end on one side close to the other. A clamping plate 124 is provided in the limiting groove 122. The clamping plate 124 can move horizontally inside the limiting groove 122. The clamping plate 124 is fixedly connected to the inner wall of the limiting groove 122 by a spring 123. When the semiconductor component is placed between the two clamping plates 124, the two clamping plates 124 clamp the semiconductor component under the action of the spring force of the spring 123. Through the mutual cooperation between the two clamping plates 124, the semiconductor component can be stably placed above the turntable 11.
[0021] A rubber pad 125 is provided at the end of the clamping plate 124 away from the spring 123. The rubber pad 125 is elastic and can effectively protect the contact surface between the clamping plate 124 and the semiconductor component.
[0022] The second pipe 7 is equipped with a solenoid valve 14, which can control the opening and closing of the second pipe 7.
[0023] The gas tank 4 is provided with an air inlet pipe 15 on the side away from the fan 5. The air inlet pipe 15 is provided with a first valve 16 on the side outside the housing 1. The required gas can be added into the gas tank 4 through the air inlet pipe 15. The first valve 16 can control the opening and closing of the air inlet pipe 15.
[0024] The housing 1 is provided with a door 17 on one side above the partition 2. The door 17 is provided with a transparent observation window 18, through which the working status inside the processing device can be observed.
[0025] The upper end of the housing 1 is provided with an exhaust pipe 19, and a second valve 20 is provided on the exhaust pipe 19. The gas inside the processing chamber can be discharged through the exhaust pipe 19. At the same time, the processing chamber can be vacuumed through the exhaust pipe 19. The second valve 20 can control the opening and closing of the exhaust pipe 19.
[0026] Specifically, when the semiconductor component is placed between the two clamping plates 124, the two clamping plates 124 clamp the semiconductor component under the action of the spring force 123. Through the cooperation between the two clamping plates 124, the semiconductor component can be stably placed above the turntable 11. When the fan 5 is working, the fan 5 can transport the gas inside the gas tank 4. Through the transmission of the first pipe 6 and the second pipe 7, the gas can enter the processing chamber formed by the partition 2 and the upper end of the shell 1 through the gas outlet plate 8. The motor 10 drives the turntable 11 to rotate. Through the rotating turntable 11, the semiconductor component fixed on the positioning component 12 can be evenly contacted with the gas. The electrodes of the radio frequency plasma generator 13 are distributed on the top of the processing chamber and are arranged in a ring array, which can make the plasma more evenly distributed in the processing chamber and ensure the consistency of the surface treatment of the semiconductor component.
[0027] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A high-efficiency plasma processing device for semiconductor components, comprising a housing (1), characterized in that, The housing (1) has a partition (2) in the middle. The housing (1) has a mounting bracket (3) on the side below the partition (2). A gas tank (4) is fixedly installed on the mounting bracket (3). A fan (5) is provided on one side of the mounting bracket (3). The gas tank (4) is connected to the input end of the fan (5) through a first pipe (6). The output end of the fan (5) extends to the top of the partition (2) through a second pipe (7) and is connected to the air outlet plate (8). A U-shaped support frame (9) is provided in the middle of the upper part of the partition (2). A motor (10) is provided in the middle of the lower end of the U-shaped support frame (9). The rotating shaft of the motor (10) passes through the U-shaped support frame (9) and is fixedly connected to the turntable (11). Two sets of symmetrical positioning components (12) are provided above the turntable (11). A radio frequency plasma generator (13) is provided at the bottom of the housing (1).
2. The plasma high-efficiency processing device for semiconductor components according to claim 1, characterized in that, The positioning component (12) includes a fixing plate (121), and there are two fixing plates (121). The lower end of the fixing plates (121) close to each other is provided with a limiting groove (122). A clamping plate (124) is provided in the limiting groove (122). The clamping plate (124) is fixedly connected to the inner wall of the limiting groove (122) by a spring (123).
3. The plasma high-efficiency processing device for semiconductor components according to claim 2, characterized in that, A rubber pad (125) is provided at the end of the clamp (124) away from the spring (123).
4. The plasma high-efficiency processing device for semiconductor components according to claim 1, characterized in that, The second pipe (7) is equipped with a solenoid valve (14).
5. The plasma high-efficiency processing device for semiconductor components according to claim 1, characterized in that, The gas tank (4) is provided with an air inlet pipe (15) on the side away from the blower (5), and the air inlet pipe (15) is provided with a first valve (16) on the side outside the shell (1).
6. The plasma high-efficiency processing device for semiconductor components according to claim 1, characterized in that, The housing (1) has a door (17) on one side above the partition (2), and the door (17) has a transparent observation window (18).
7. The plasma high-efficiency processing device for semiconductor components according to claim 1, characterized in that, The upper end of the housing (1) is provided with an air outlet pipe (19), and a second valve (20) is provided on the air outlet pipe (19).