Door and window auxiliary frame structure and door and window
By adding multi-cavity thermal insulation strips between door and window subframes and embedding them in the wall, the thermal bridging problem of door and window subframes is solved, achieving energy-saving effects with ultra-low energy consumption and stable connection.
Patent Information
- Application Number
- CN202520641805.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-07
- Publication Date
- 2026-05-26
- Estimated Expiration
- 2035-04-07
AI Technical Summary
Existing door and window subframe structures can create thermal bridges in winter and summer, leading to excessively rapid heat exchange between indoors and outdoors, increasing the burden on heating and cooling systems, and hindering energy conservation in buildings.
Multi-cavity thermal insulation strips are added between the outer and inner subframes of doors and windows to block the heat conduction path, and the connection stability is enhanced by pre-embedding the insulation strip hooks in the wall.
It effectively blocks thermal bridges, reduces indoor and outdoor heat exchange, lowers energy consumption, improves building stability and connection strength, and ensures comprehensive performance with ultra-low energy consumption.