Compatible tin-coated chip test seat

Abstract

The utility model discloses a compatible tin-coated chip test seat, which comprises a frame-shaped test seat main body, a needle plate main body and a needle plate bottom plate, a pressure head is arranged above the needle plate main body, a pressure plate is arranged above the pressure head, flanges are arranged on two sides of the lower end of the pressure head, and first wave-shaped end surfaces are arranged on the upper end surfaces of the flanges; a pressurizing frame is arranged between the upper end face of the flange and the lower end face of the pressing plate. Second wavy end faces are arranged on the lower end faces of the two sides of the pressurizing frame. A kidney-shaped hole extending along the second wave-shaped end face is formed in the pressurizing frame, a first locking hole is formed in the flange, a second locking hole is formed in the pressing plate, the flange, the pressurizing frame and the pressing plate are locked and fixed through a bolt penetrating through the first locking hole, the kidney-shaped hole and the second locking hole, and a screw rod between a bolt cap of the bolt and the pressing plate is sleeved with a spring. The compatible tin-coated chip test socket is high in chip packaging compatibility and simple to assemble.

Description

Technical Field

[0001] This utility model relates to the field of test sockets, and more particularly to a test socket compatible with solder-attached chips. Background Technology

[0002] In chip testing and packaging laboratories, for small-batch chip testing, due to the variety of chip sizes, such as some chips with solder balls and some without, the thickness of the test cavity required for the chip test socket is not suitable. The pressure head of the conventional test socket is an integrated structure. For multi-item testing, multiple special pressure heads need to be customized, resulting in a huge waste of costs. Utility Model Content

[0003] To overcome the above-mentioned shortcomings, the purpose of this utility model is to provide a compatible soldering chip test socket with strong chip packaging compatibility and simple assembly.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is: a compatible solder-attached chip test socket, comprising a frame-shaped test socket body, a pin plate body and a pin plate base plate being fixed sequentially at the bottom of the test socket body, a pressure head being disposed above the pin plate body, the lower end of the pressure head passing through the test socket body, and a pressure plate being disposed above the pressure head for pressing the pressure head against the pin plate body, the lower end surfaces of the pressure plate being forced to press against the upper end surfaces of the test socket body; flanges are provided on both sides of the lower end of the pressure head, and the upper end surface of the flanges is provided with a first wavy end face, the first wavy end face being composed of a first protrusion and a first recess; A pressure frame is provided between the upper end face of the flange and the lower end face of the pressure plate. The lower end faces on both sides of the pressure frame are provided with a second wavy end face. The second wavy end face is composed of a second protrusion and a second recess. The first protrusion can be inserted into the second recess, and the second protrusion can be inserted into the first recess. The pressure frame is provided with a waist hole extending along the second wavy end face. The flange is provided with a first locking hole, and the pressure plate is provided with a second locking hole. The flange, the pressure frame, and the pressure plate are locked and fixed by bolts passing through the first locking hole, the waist hole, and the second locking hole. A spring is sleeved on the screw between the bolt head and the pressure plate.

[0005] The beneficial effects of this utility model of a compatible solder-mounted chip test socket are:

[0006] It is suitable for chips with solder balls (soldered chips). While ensuring the stress of the test socket body is suitable, it also takes into account the manufacturability and compatibility of the test socket body. The traditional integrated pressure head is optimized into a pressure head, pressure plate, and pressure frame. A wavy end face is set between the flange of the pressure head and the pressure frame to realize the switching of testing for chips with and without solder balls. It does not require complex disassembly and assembly of the test socket body. Only the horizontal position of the pressure frame needs to be adjusted, and then the height position of the pressure head can be adjusted to complete the switching of test pressure and stroke for switching chips. A single test socket body can complete the testing of two packages, which greatly reduces processing time, improves delivery efficiency, and optimizes the product process.

[0007] Preferably, a first pressure strip is provided between the lower end face of the pressure plate and the upper end face of the test base body. Two first pressure strips are provided and fixed to the lower end face of both sides of the pressure plate by bolts. The two first pressure strips abut against the upper end face of the test base body. When it is necessary to adjust the height of the pressure head, smaller pressure strips of different thicknesses can be replaced.

[0008] Preferably, a second pressure strip is provided between the lower end face of the pressure plate and the upper end face of the test base body. The second pressure strip is installed on the lower end face of the pressure plate by bolts. A gap is left between the second pressure strip and the test base body. A heating rod and a temperature sensor are installed inside the pressure head. The free end of the heating rod wire passes through the gap, and the heating rod wire is pressed into the gap to prevent the heating rod wire from breaking due to back-and-forth dragging.

[0009] Preferably, the pressure plate is rotatably provided with small elastic buckles on both its front and rear sides. Each small elastic buckle comprises an integrally formed vertical plate and a horizontal plate arranged in an L-shape. The vertical plate is rotatably mounted on the pressure plate, and the horizontal plate is located below the pressure plate. A return spring is provided between the horizontal plate and the pressure plate. A pressure frame is provided above the pressure plate, and the left and right sides of the pressure frame can be fastened to the upper surface of the pressure plate by two small elastic buckles.

[0010] Preferably, the front side of the test base body is rotatably provided with a large elastic buckle, and the rear side of the pressure frame is rotatably mounted on the test base body via a rotating shaft. A torsion spring for resetting is sleeved on the rotating shaft, and the front end of the pressure frame is fastened by the large elastic buckle and the front end of the pressure frame is pressed tightly by the elastic buckle.

[0011] Preferably, the upper end face of the elastic buckle is provided with an inwardly inclined first guide slope, and the lower end faces of the left and right sides of the pressure frame are provided with second guide slopes that match the first guide slope; this facilitates the pressure plate to engage with the elastic buckle.

[0012] The upper end face of the elastic buckle is provided with an inwardly inclined third guide slope, and the lower end face of the pressure frame is provided with a fourth guide slope that matches the third guide slope; this facilitates the pressure frame to be engaged with the elastic buckle.

[0013] Preferably, a pull rod is rotatably provided on the front side of the test seat body. The pull rod has three connected rods forming a ring. Limiting holes are provided on two opposite rods of the pull rod, and limiting protrusions are provided on the left and right side walls of the pressure frame. When the pull rod is rotated to a horizontal position, the limiting protrusions engage with the limiting holes. When the external force is greater than the frictional force of the limiting protrusion engaging with the limiting hole, the pull rod can disengage from the limiting protrusions. The pull rod is used to press the pressure frame.

[0014] Preferably, the pressure frame includes an upper frame and a lower frame, which are locked together. The outer dimensions of the upper frame are smaller than those of the lower frame. The lower frame is plate-shaped, and the annular pull rod surrounds the upper frame and is located above the lower frame. When the limiting protrusion engages with the limiting hole, the pull rod limits the lower frame to the pressure plate. More preferably, the pull rod is used to press the lower frame tightly. Attached Figure Description

[0015] Figure 1 This is a perspective view of this embodiment;

[0016] Figure 2 This is an exploded view of this embodiment;

[0017] Figure 3 This is a bottom perspective view of the test stand body and its components in this embodiment.

[0018] Figure 4 This is a top perspective view of the test stand body and its components in this embodiment.

[0019] Figure 5 This is a top perspective view of the test stand body and its upper components in this embodiment.

[0020] Figure 6 This is a perspective view of the test seat body and the pressure plate in this embodiment.

[0021] Figure 7 This is a perspective view of the main body of the test stand in this embodiment;

[0022] Figure 8 This is a perspective view of the pressure head and pressure frame in this embodiment.

[0023] Figure 9 for Figure 8 Exploded view.

[0024] Attached Figure

[0025] 1. Test base body; 2. Needle plate body; 3. Needle plate base plate; 4. Pressure head; 5. Pressure plate; 6. Flange; 7. First wavy end face; 7a. First protrusion; 7b. First recess; 8. Pressure frame; 9. Second wavy end face; 9a. Second protrusion; 9b. Second recess; 10. Waist hole; 11. First locking hole; 12. Second locking hole; 13. Bolt; 14. Spring; 15. First pressure strip; 16. 17. Second pressure strip; 18. Rotating shaft; 19. Elastic small buckle; 10. Vertical plate; 11. Horizontal plate; 12. Return spring; 13. Pressure frame; 14. Upper frame; 15. Lower frame; 26. Torsion spring; 27. Elastic large buckle; 28. First guide slope; 29. ​​Second guide slope; 20. Third guide slope; 21. Fourth guide slope; 22. Limiting protrusion; 23. Limiting hole; 24. Pull rod. Detailed Implementation

[0026] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0027] See Figures 1 to 9 As shown, this embodiment discloses a compatible solder-attached chip test socket, including a frame-shaped test socket body 1. A pin plate body 2 and a pin plate base plate 3 are sequentially fixed to the bottom of the test socket body 1. A pressure head 4 is disposed above the pin plate body 2, with its lower end passing through the test socket body 1. A pressure plate 5 is disposed above the pressure head 4 to press the pressure head 4 against the pin plate body 2. The lower end surfaces of the pressure plate 5 are forced to press against the upper end surfaces of the test socket body 1. Flanges 6 are provided on both sides of the lower end of the pressure head 4. A first wavy end face 7 is provided on the upper end surface of the flange 6, which is composed of a first protrusion 7a and a first recess 7b. The upper end surface of the flange 6 and the lower end surface of the pressure plate 5 are... A pressure frame 8 is provided in the middle, and the lower end faces on both sides of the pressure frame 8 are provided with second wavy end faces 9. The second wavy end faces 9 are composed of a second protrusion 7a and a second recess 9b. The first protrusion 7a can be inserted into the second recess 9b, and the second protrusion 9a can be inserted into the first recess 7b. The pressure frame 8 is provided with a waist hole 10 extending along the second wavy end face 9. The flange 6 is provided with a first locking hole 11, and the pressure plate 5 is provided with a second locking hole 12. The flange 6, the pressure frame 8 and the pressure plate 5 are locked and fixed by bolts 13 passing through the first locking hole 11, the waist hole 10 and the second locking hole 12. A spring 14 is sleeved on the screw between the bolt head of the bolt 13 and the pressure plate 5.

[0028] Two first pressure strips 15 are provided between the lower end face of the pressure plate 5 and the upper end face of the test base body 1. They are fixed to the lower end face of both sides of the pressure plate 5 by bolts 13, and the two first pressure strips 15 abut against the upper end face of the test base body 1. When the height of the pressure head 4 needs to be adjusted, small pressure strips of different thicknesses can be replaced.

[0029] A second pressure strip 16 is provided between the lower end face of the pressure plate 5 and the upper end face of the test base body 1. The second pressure strip 16 is fastened to the lower end face of the pressure plate 5 by bolts 13. A gap is left between the second pressure strip 16 and the test base body 1. A heating rod and a temperature sensor are installed inside the pressure head 4. The free end of the heating rod wire passes through the gap and is pressed into the gap to prevent the heating rod wire from breaking due to being dragged back and forth.

[0030] The pressure plate 5 has small elastic buckles 18 rotatably mounted on its front and rear sides. Each small elastic buckle 18 includes an integrally formed vertical plate 18a and a horizontal plate 18b arranged in an L-shape. The vertical plate 18a is rotatably mounted on the pressure plate 5, and the horizontal plate 18b is located below the pressure plate 5. A return spring 18c is provided between the horizontal plate 18b and the pressure plate 5. A pressure frame 19 is provided above the pressure plate 5. The left and right sides of the pressure frame 19 can be fastened to the upper surface of the pressure plate 5 by two small elastic buckles 18. The front side of the test seat body 1 has a large elastic buckle 21 rotatably mounted on its front side. The rear side of the pressure frame 19 is rotatably mounted on the test seat body 1 via a rotating shaft 17. A torsion spring 20 for reset is sleeved on the rotating shaft 17. The front end of the pressure frame 19 is fastened by the large elastic buckle 21. The rear side of the pressure frame 19 is rotatably connected to the test seat body 1, the front end is fastened by the large elastic buckle 21, and the left and right sides are fastened to the pressure plate 5 by two small elastic buckles 18.

[0031] To facilitate the insertion of the small elastic buckles 18 on the left and right sides and the large elastic buckle 21 at the front end into the pressure frame 19, the upper end surface of the small elastic buckle 18 is provided with an inwardly inclined first guide slope 22, and the lower end surfaces on the left and right sides of the pressure frame 19 are provided with a second guide slope 23 that matches the first guide slope 22; the upper end surface of the large elastic buckle 21 is provided with an inwardly inclined third guide slope 24, and the lower end surface of the pressure frame 19 is provided with a fourth guide slope 25 that matches the third guide slope 24.

[0032] A pull rod 28 is rotatably mounted on the front side of the test base body 1. The pull rod 28 has three connected rods forming a ring. Limiting holes 27 are provided on two opposite rods of the pull rod 28. Limiting protrusions 26 are provided on the left and right side walls of the pressure frame 19. When the pull rod 28 is rotated to the horizontal position, the limiting protrusions 26 engage with the limiting holes 27. When the external force is greater than the frictional force of the limiting protrusions 26 engaging with the limiting holes 27, the pull rod 28 can disengage from the limiting protrusions 26. The pull rod 28 is used to press the pressure frame 19. The pressure frame 19 includes an upper frame 19a and a lower frame 19b, which are locked together. The outer dimensions of the upper frame 19a are smaller than those of the lower frame 19b. The lower frame 19b is plate-shaped. An annular pull rod 28 surrounds the upper frame 19a and is located above the lower frame 19b. When the limiting protrusion 26 engages with the limiting hole 27, the pull rod 28 limits the lower frame 19b to the pressure plate 5. More preferably, the pull rod 28 is used to press the lower frame 19b tightly.

[0033] The working principle of this embodiment is as follows:

[0034] During testing, the chip to be tested is installed in the test socket body 1, located between the pressure head 4 and the needle plate body 2. The probe on the needle plate body 2 is used to test the chip. When testing a chip with solder balls, the test space between the pressure head 4 and the needle plate body 2 needs to be higher because the chip has solder balls. Loosen the bolts 13 of the first locking hole 11, the waist hole 10, and the second locking hole 12, and adjust the pressure frame 8 so that the first protrusion 7a on the flange 6 and the second protrusion 9a on the pressure frame 8 correspond vertically. At this time, the pressure head 4 is raised, and then the bolts 13 are tightened. At the same time, a thicker first pressure strip 15 can be replaced to raise the height of the high pressure plate 5, which can also increase the height of the test space. Conversely, when testing chips without solder balls, the height of the test space can be reduced by shifting the pressure frame 8 so that the first protrusion 7a on the flange 6 corresponds to the second recess 9b on the pressure frame 8, and the corresponding first recess 7b on the flange 6 corresponds to the second protrusion 9a on the pressure frame 8; the first pressure strip 15 can also be replaced with a thinner one to reduce the height of the pressure plate 5.

[0035] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it. They cannot be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the protection scope of this utility model.

Claims

1. A compatible solder-mounted chip test socket, comprising a frame-shaped test socket body (1), wherein a pin plate body (2) and a pin plate base plate (3) are sequentially fixed to the bottom of the test socket body (1), a pressure head (4) is disposed above the pin plate body (2), the lower end of the pressure head (4) passes through the test socket body (1), and a pressure plate (5) is disposed above the pressure head (4), wherein the lower end surfaces of the pressure plate (5) are forced to press against the upper end surfaces of the test socket body (1); characterized in that: The lower end of the pressure head (4) is provided with flanges (6) on both sides, and the upper end surface of the flange (6) is provided with a first wavy end face (7), which is composed of a first protrusion (7a) and a first recess (7b). A pressure frame (8) is provided between the upper end face of the flange (6) and the lower end face of the pressure plate (5). The lower end faces on both sides of the pressure frame (8) are provided with second wavy end faces (9). The second wavy end face (9) is composed of a second protrusion (9a) and a second recess (9b). The first protrusion (7a) can be inserted into the second recess (9b), and the second protrusion (9a) can be inserted into the first recess (7b). The pressure frame (8) is provided with a waist hole (10) extending along the second wavy end face (9), the flange (6) is provided with a first locking hole (11), and the pressure plate (5) is provided with a second locking hole (12). The flange (6), the pressure frame (8) and the pressure plate (5) are locked and fixed by bolts (13) passing through the first locking hole (11), the waist hole (10) and the second locking hole (12). A spring (14) is sleeved on the screw between the bolt head of the bolt (13) and the pressure plate (5).

2. The compatible solder-attached chip test socket according to claim 1, characterized in that: A first pressure strip (15) is provided between the lower end face of the pressure plate (5) and the upper end face of the test seat body (1). There are two first pressure strips (15), which are fixed to the lower end face of both sides of the pressure plate (5) by bolts (13). The two first pressure strips (15) abut against the upper end face of the test seat body (1).

3. The compatible solder-attached chip test socket according to claim 2, characterized in that: A second pressure strip (16) is provided between the lower end face of the pressure plate (5) and the upper end face of the test seat body (1). The second pressure strip (16) is fastened to the lower end face of the pressure plate (5) by bolts (13). A gap is left between the second pressure strip (16) and the test seat body (1). A heating rod and a temperature sensor are installed inside the pressure head (4). The free end of the heating rod wire passes through the gap and the heating rod wire is pressed into the gap.

4. The compatible solder-attached chip test socket according to claim 1, characterized in that: The front and rear sides of the pressure plate (5) are rotatably provided with elastic small buckles (18). The elastic small buckles (18) include an integrally formed vertical plate (18a) and a horizontal plate (18b) distributed in an L shape. The vertical plate (18a) is rotatably disposed on the pressure plate (5). The horizontal plate (18b) is located below the pressure plate (5). A return spring (18c) is provided between the horizontal plate (18b) and the pressure plate (5). A pressure frame (19) is provided above the pressure plate (5). The left and right sides of the pressure frame (19) can be fastened to the upper surface of the pressure plate (5) by two elastic small buckles (18).

5. The compatible solder-attached chip test socket according to claim 4, characterized in that: The front side of the test seat body (1) is rotatably provided with an elastic buckle (21), and the rear side of the pressure frame (19) is rotatably provided on the test seat body (1) via a rotating shaft (17). A torsion spring (20) for resetting is sleeved on the rotating shaft (17), and the front end of the pressure frame (19) is fastened by the elastic buckle (21).

6. The compatible solder-attached chip test socket according to claim 5, characterized in that: The upper end face of the elastic buckle (18) is provided with an inwardly inclined first guide slope (22), and the lower end faces of the left and right sides of the pressure frame (19) are provided with a second guide slope (23) that matches the first guide slope (22). The upper end face of the elastic buckle (21) is provided with an inwardly inclined third guide slope (24), and the lower end face of the pressure frame (19) is provided with a fourth guide slope (25) that matches the third guide slope (24).

7. The compatible solder-attached chip test socket according to claim 5, characterized in that: The front side of the test seat body (1) is rotatably provided with a pull rod (28). The pull rod (28) has three connected rods forming a ring. Limiting holes (27) are provided on the two opposite rods of the pull rod (28). Limiting protrusions (26) are provided on the left and right side walls of the pressure frame (19). When the pull rod (28) is rotated to a horizontal position, the limiting protrusions (26) are engaged in the limiting holes (27). When the external force is greater than the frictional force of the limiting protrusions (26) engaging in the limiting holes (27), the pull rod (28) can disengage from the limiting protrusions (26).

8. The compatible solder-attached chip test socket according to claim 7, characterized in that: The pressure frame (19) includes an upper frame (19a) and a lower frame (19b), which are locked together. The outer dimensions of the upper frame (19a) are smaller than those of the lower frame (19b). The lower frame (19b) is plate-shaped. The annular pull rod (28) surrounds the upper frame (19a) and is located above the lower frame (19b). When the limiting protrusion (26) is engaged with the limiting hole (27), the pull rod (28) limits the lower frame (19b) to the pressure plate (5).

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