A MEMS atomic gas chamber

Abstract

This invention provides a MEMS atomic gas chamber, which is a transparent, sealed cavity comprising a transparent gas chamber substrate, a transparent gas chamber top layer, and a transparent gas chamber bottom layer. The transparent gas chamber substrate includes at least one chamber. The transparent gas chamber substrate and the transparent gas chamber bottom layer are integral components or connected by laser welding, and the transparent gas chamber substrate and the transparent gas chamber top layer are connected by laser welding. Compared to existing MEMS atomic gas chamber structures, the transparent MEMS atomic gas chamber proposed in this invention has a longer optical path length and can achieve triaxial light transmission.

Description

Technical Field

[0001] This invention relates to the field of quantum precision measurement technology, and in particular to a MEMS atomic gas chamber. Background Technology

[0002] Atomic gas cells are crucial components in many quantum sensor devices, such as atomic clocks, atomic magnetometers, and atomic gyroscopes. They can be enclosed cavities made of materials like glass and silicon. Atomic gas cells typically require an optical path in at least one direction. Under laser pumping, the energy levels of the working atoms (such as Rb, Cs, He, and Xe) confined within the atomic gas cell undergo transitions. The frequency of these transitions can then be detected by a detector to obtain information about external physical quantities, such as time, magnetic field, and rotational speed.

[0003] The structures of atomic gas cells prepared by different methods are usually different. The steps for preparing atomic gas cells using the traditional glass-blown method typically include: softening a specific area of ​​a glass tube at high temperature, shaping it into a hollow cavity with a pre-drilled opening using air blowing, filling the opening with atoms, and then evacuating the vacuum. However, the traditional glass-blown method requires manual blowing and sealing, and has disadvantages such as complex processes, reliance on operator skill, difficulty in controlling consistency, difficulty in mass production, and high preparation costs. Therefore, the preparation of atomic gas cells using micro-electro-mechanical systems (MEMS) has gradually become a research focus. Atomic gas cells prepared by this method can be called MEMS atomic gas cells. When sealing MEMS atomic gas cells using vacuum anodic bonding technology, atoms can be filled in a vacuum using a direct filling method, or a chemical reaction method can be used to seal compounds containing alkali metal atoms or wax pellets containing alkali metal elements inside the atomic gas cell. After vacuum sealing is completed, the alkali metal atoms are released through high temperature or ultraviolet light. However, since most existing MEMS atomic gas cells adopt sandwich structures such as "glass-silicon-glass" or "silicon-glass-silicon", MEMS atomic gas cells have the following disadvantages:

[0004] ① Material limitations: Existing MEMS atomic gas cells often use borosilicate glass with a coefficient of thermal expansion matching that of silicon. This means that most existing MEMS atomic gas cells rely on bonding between the glass substrate and the silicon substrate. ② Limited optical path length: Generally, the longer the optical path of the gas cell, the more atoms can interact with the probe light during operation, resulting in a higher signal-to-noise ratio for the entire quantum sensing system. However, the optical path length of existing MEMS atomic gas cell structures is limited by the thickness of the silicon wafer. Thicker silicon wafers are more expensive and more difficult to etch, resulting in optical path lengths of most existing MEMS atomic gas cells being less than 2 mm. Although methods such as five-layer anodic bonding, adding mirrors, and molten glass reflow can be used to increase the optical path length, these additional processes significantly increase the fabrication cost and complexity of the MEMS atomic gas cell. ③ Limited optical path direction: Existing MEMS atomic gas cells mainly adopt the "glass-silicon-glass" or "silicon-glass-silicon" structure. The presence of silicon wafers prevents the atomic gas cells from achieving triaxial light transmission. However, triaxial light transmission is of great significance to the application of atomic gas cells. For example, it can be used in applications such as vector magnetometers, gyroscopes and accelerometers to simultaneously measure physical quantities in multiple directions. Or, it can be used in applications of cold atoms to simplify the structure of magneto-optical traps. This leads to the limitation of the application of atomic gas cells.

[0005] Therefore, there is an urgent need for a new MEMS atomic gas chamber to overcome the defects of existing atomic gas chamber structures. Utility Model Content

[0006] In view of this, the present invention provides a MEMS atomic gas chamber with a longer optical path length and more optical path directions, and without the need for soldering or high temperature welding, nor the need to leave a filling tube for filling alkali atoms and evacuating the gas chamber.

[0007] One aspect of this utility model provides a MEMS atomic gas chamber, which is a transparent closed cavity comprising a transparent gas chamber substrate, a transparent gas chamber top layer, and a transparent gas chamber bottom layer;

[0008] The transparent air chamber substrate includes at least one chamber. The transparent air chamber substrate and the bottom layer of the transparent air chamber are integral components or connected by laser welding. The transparent air chamber substrate and the top layer of the transparent air chamber are connected by laser welding.

[0009] In some embodiments of this invention, the MEMS atomic gas chamber is a glass gas chamber or a sapphire gas chamber, and the glass gas chamber is a quartz glass gas chamber, a borosilicate glass gas chamber, an aluminosilicate glass gas chamber, or a soda-lime glass gas chamber.

[0010] In some embodiments of this invention, the inner wall of the MEMS atomic gas chamber is coated with an anti-relaxation agent layer.

[0011] In some embodiments of this invention, the MEMS atomic chamber contains an atomic release device; the interior of the atomic chamber is filled with atomic vapor and a buffer gas.

[0012] In some embodiments of this utility model, the atom release device is an alkali atom release device, which is a container holding an alkali atom release agent.

[0013] In some embodiments of this utility model, the transparent gas chamber substrate includes at least one chamber, comprising: the transparent gas chamber substrate includes a first chamber and a second chamber, the first chamber and the second chamber being connected through a microchannel; the first chamber serves as a functional chamber, and the second chamber is used to house the atom release device.

[0014] In some embodiments of this invention, the cross-sectional shape of the microchannel, the first chamber, and the second chamber along a specific direction is circular or polygonal.

[0015] In some embodiments of this invention, the height of the first chamber is greater than 3 mm.

[0016] In some embodiments of this utility model, the first chamber is a functional chamber capable of triaxial light transmission.

[0017] In some embodiments of this invention, the MEMS atomic gas chamber is mass-produced by dicing wafers obtained from wafer-level processing.

[0018] The MEMS atomic gas chamber proposed in this invention relies on a transparent gas chamber substrate, a transparent gas chamber top layer, and a transparent gas chamber bottom layer. Furthermore, it utilizes laser welding technology to weld the independent components together in an air-isolated environment, thereby forming an airtight chamber. The MEMS atomic gas chamber proposed in this application overcomes the shortcomings of atomic gas chambers prepared by glass blowing and existing MEMS atomic gas chamber structures.

[0019] Additional advantages, objects, and features of this invention will be set forth in part in the description which follows, and will in part become apparent to those skilled in the art upon review of the description, or may be learned by practice of the invention. The objects and other advantages of this invention can be realized and obtained by means of the structures specifically pointed out in the description and drawings.

[0020] Those skilled in the art will understand that the objectives and advantages achievable with this invention are not limited to those specifically described above, and that the above and other objectives achievable with this invention will become clearer from the following detailed description. Attached Figure Description

[0021] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, do not constitute a limitation thereof. The components in the drawings are not drawn to scale but are merely for illustrating the principles of the present invention. For ease of illustration and description of certain parts of the present invention, corresponding portions in the drawings may be enlarged, i.e., may appear larger relative to other components in an exemplary device actually manufactured according to the present invention. In the drawings:

[0022] Figure 1 This is a schematic diagram of the atomic gas chamber and its optical path in one embodiment of the present invention.

[0023] Figure 2 This is a schematic diagram of the integrated air chamber bottom layer and air chamber substrate in one embodiment of the present invention.

[0024] Figure 3 This is a schematic diagram of a component obtained by laser welding of an independent gas chamber bottom layer and a gas chamber substrate in one embodiment of the present invention.

[0025] Figure 4 This is a schematic diagram of the preparation process of the atomic gas chamber in one embodiment of the present invention.

[0026] Figure 5 This is a cross-sectional schematic diagram of an atomic gas chamber with an inner wall covered by an anti-relaxant layer in one embodiment of the present invention.

[0027] Figure 6 This is a schematic diagram of the batch preparation of atomic gas chambers in one embodiment of the present invention.

[0028] Figure label:

[0029] 100. Atomic gas chamber; 110. Gas chamber shell; 111. Gas chamber bottom layer; 113. Gas chamber base; 115. Gas chamber top layer; 120. Atomic release device Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the embodiments and accompanying drawings. Here, the illustrative embodiments and descriptions of this utility model are used to explain the present utility model, but are not intended to limit the present utility model.

[0031] It should also be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and / or processing steps closely related to the solution according to the present invention are shown in the accompanying drawings, while other details that are not closely related to the present invention are omitted.

[0032] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, element, step, or component, but does not exclude the presence or addition of one or more other features, elements, steps, or components.

[0033] In the following description, embodiments of the present invention will be illustrated with reference to the accompanying drawings. In the drawings, the same reference numerals represent the same or similar parts, or the same or similar steps.

[0034] Traditional glass-blown atomic cells have drawbacks such as complex processes, reliance on operator skill, difficulty in controlling consistency, difficulty in mass production, and high manufacturing costs. Moreover, the atomic cells currently being fabricated using MEMS technology also have many defects. For example, the choice of glass material in MEMS atomic cells is limited by the thermal expansion coefficient of silicon wafers, the thickness of silicon wafers results in the optical path length of atomic cells being mostly less than 2 mm, and the existing sandwich structure of MEMS atomic cells cannot achieve triaxial light transmission, which limits the application of atomic cells in vector magnetometers, gyroscopes, and accelerometers.

[0035] To address the aforementioned problems, this utility model proposes a MEMS atomic gas chamber, which is a transparent, sealed cavity. This application uses a transparent material to fabricate the shell (also referred to as the gas chamber shell) 110 of the atomic gas chamber, thereby obtaining a transparent, sealed cavity. The gas chamber shell 110 mentioned in this application refers to the external structure of the atomic gas chamber, used to encapsulate and protect the atomic vapor and buffer gas inside the chamber. Furthermore, the transparent gas chamber shell 110 in this application can be composed of multiple components made of transparent material, including a transparent gas chamber substrate, a transparent gas chamber top layer, and a transparent gas chamber bottom layer.

[0036] Furthermore, laser welding is a relatively novel packaging technology that utilizes a high-energy-density laser beam as a heat source. Through the focusing effect of the laser, materials are melted and bonded together. Laser welding technology is widely known for its high precision, low heat input, rapid welding, and wide range of applications. By optimizing laser parameters and processes, high-quality welding results can be achieved. Therefore, considering that this application uses transparent components to form a transparent, sealed cavity, laser welding technology, which does not introduce magnetic substances such as solder, can be used to process and form the atomic gas chamber. The laser welding method can not only weld the various transparent components constituting the gas chamber shell 110 together to form the gas chamber shell 110, but also ensure that the formed sealed gas chamber has good airtightness.

[0037] Compared to traditional glass-blown gas chambers, the MEMS atomic gas chambers proposed in this application do not require high-temperature softening and blowing shaping; they can be fabricated using laser welding technology on the substrate or substrate. They also do not require skilled operators; instead, they can be mass-produced through wafer-level processing to solve the problem of high manufacturing costs. Furthermore, they do not require cold fingers or pins, thus exhibiting high consistency. Furthermore, compared to existing MEMS atomic gas cell structures, the transparent atomic gas cell structure proposed in this application can be formed by processing various components made of transparent materials using laser welding to create the gas cell shell, thus breaking the material limitations of existing MEMS atomic gas cells. Moreover, thick glass perforation is a relatively mature process with lower costs than silicon wafer perforation, so the MEMS atomic gas cell proposed in this application can more easily achieve a longer optical path length. Since the various components that make up the gas cell shell can be made of transparent materials, after polishing the inner and outer walls of the atomic gas cell, the transparent atomic gas cell proposed in this application can achieve triaxial light transmission, and thus be applied to vector magnetometers, gyroscopes, and accelerometers, etc. In addition, in the application of cold atoms, it is not necessary to add complex structures such as micromirrors or gratings in the magneto-optical trap.

[0038] Specifically, the transparent material used to prepare the gas chamber shell 110 in this application can be an inorganic transparent material, such as glass or sapphire, which have advantages such as high melting temperature and resistance to deformation. This application does not specifically limit the type of transparent material used to prepare the gas chamber shell 110, and it can be selected according to the requirements.

[0039] As an example, if all components constituting the gas chamber shell 110 (including the gas chamber substrate, the top layer of the gas chamber, and the bottom layer of the gas chamber) are made of glass material, then the atomic gas chamber is a transparent glass atomic gas chamber, and the glass material used to prepare the shell of the atomic gas chamber can be quartz glass, borosilicate glass, aluminosilicate glass, or soda-lime glass, etc. Further, if all components are prepared using the same type of transparent material (e.g., all using quartz glass), then the atomic gas chamber 100 is an atomic gas chamber prepared using a single glass material. In this case, the MEMS atomic gas chamber can be a quartz glass gas chamber, a borosilicate glass gas chamber, aluminosilicate glass gas chamber, or soda-lime glass gas chamber, etc.; if one component and another component are prepared using different types of glass materials, then the atomic gas chamber 100 is an atomic gas chamber prepared by combining different glass materials. That is, in this application, the components constituting the gas chamber shell 110 can be prepared using the same type of transparent material, or different types of transparent materials, or even different components can be prepared using a certain type of glass material and sapphire material respectively. The materials used in the preparation of the aforementioned components are merely examples. Any inorganic transparent material that can be transmitted through a laser and can be processed using laser welding methods can be selected. This utility model is not limited to these.

[0040] Since the gas chamber shell 110 in this application is made of transparent material, it can also be polished to improve the light transmittance of the atomic gas chamber. Furthermore, unlike the sandwich structure of existing MEMS atomic gas chambers, the gas chamber shell 110 in this application is made of transparent material. Therefore, laser light incident from any direction into the atomic gas chamber can pass through and exit, meaning the atomic gas chamber proposed in this application has multiple pump light paths. To demonstrate the light transmittance of the atomic gas chamber proposed in this application, it can be considered that the atomic gas chamber prepared in this application is a transparent gas chamber capable of achieving triaxial light transmission, such as... Figure 1 As shown, the optical paths in these three directions can be perpendicular to each other.

[0041] Furthermore, since the gas chamber shell is a hollow, closed cavity, it can be formed by combining multiple components. That is, the gas chamber shell 110 can be assembled by laser welding multiple components. The components that make up the shell 110 of the atomic gas chamber may include a transparent gas chamber bottom layer 111, a transparent gas chamber substrate 113, and a transparent gas chamber top layer 115. That is, the MEMS atomic gas chamber proposed in this application adopts the existing three-layer structure, with the bottom layer being the gas chamber bottom layer 111, the middle layer being the gas chamber substrate 113, and the top layer being the gas chamber top layer 115.

[0042] In some embodiments of this utility model, before processing using laser welding technology, the gas chamber substrate 113, the gas chamber top layer 115, and the gas chamber bottom layer 111 can be independent components or may include an integrated component. The integrated component mentioned in this application refers to a structure where multiple components in the gas chamber substrate 113, the gas chamber top layer 115, and the gas chamber bottom layer 111 are combined into one component without bonding or welding processes, but rather obtained by slotting the original transparent material. Specifically, if the gas chamber substrate 113, the gas chamber top layer 115, and the gas chamber bottom layer 111 are independent components, then all three structures can be prepared using a substrate made of inorganic transparent material (e.g., a glass substrate); if the gas chamber substrate 113, the gas chamber top layer 115, and the gas chamber bottom layer 111 involve an integrated structure, then the gas chamber substrate 113 and the gas chamber bottom layer 111 can be an integrated structure, in which case the gas chamber top layer 115 is an independent component. For example, as... Figure 2 As shown, the gas chamber substrate 113 and the gas chamber bottom layer 111 can be an integrated structure. This integrated structure can be prepared by grooving the entire transparent material block. In this case, the atomic gas chamber 110 can be obtained by laser welding the integrated gas chamber substrate 113 and gas chamber bottom layer 111 and the independent gas chamber top layer 115.

[0043] As an example, the independent air chamber substrate 113 can be an integrated structure obtained through a grooving process; after obtaining the air chamber substrate 113 by processing the entire transparent material block through a grooving process, the air chamber substrate 113 can be placed on top of the air chamber bottom layer 111, and the air chamber substrate 113 and the air chamber bottom layer 111 can be welded together by laser welding to obtain the following... Figure 3 The structure shown is then connected to the air chamber base 113 and the air chamber top layer 115 by laser welding. Furthermore, this application does not specifically limit the thickness of the air chamber shell 110. Taking glass as an example of a transparent material, even drilling holes in a thicker glass material (e.g., using through holes as microchannels) is a relatively mature process that can greatly reduce process complexity and cost.

[0044] The air chamber substrate 113 of this application includes at least one chamber. Figure 1 This is a cross-sectional schematic diagram of a MEMS atomic gas chamber in one embodiment of this application, as shown below. Figure 1 As shown, the gas chamber substrate 113 includes a first chamber and a second chamber, which are connected by a microchannel. The first chamber serves as a functional chamber for measuring physical quantities within it using pump light; for example, the first chamber can be a triaxially passable functional chamber. The second chamber houses an atomic release device. When applying the MEMS atomic gas chamber proposed in this application, atomic vapor can be released from the atomic release device placed in the second chamber using methods such as laser decomposition of the release agent, thereby filling the first chamber with atomic vapor. For example, ultraviolet irradiation can be used to decompose alkali metal azides placed in the second chamber, causing them to release alkali metal atomic vapor. Furthermore, with atomic vapor present in the first chamber, emitting pump light through it allows detection of physical quantities within the first chamber. Additionally, this application limits the height of the first chamber to be greater than 3 mm, meaning the path length of the pump light in the three directions of the optical path interacting with the atomic vapor within the atomic gas chamber must be greater than 3 mm.

[0045] In some embodiments of this utility model, the atomic gas chamber 100 proposed in this application may contain an atomic release device 120. The atomic release device may be an alkali atomic release device; wherein, the alkali atomic release device may be a container holding an alkali atom releasing agent such as a compound containing alkali metal atoms, a mixture of alkali metal compounds, or paraffin coated with alkali metals. Furthermore, the microchannel, the first chamber, and the second chamber are aligned along a specific optical axis (for example, the specific optical axis may be...). Figure 1 The cross-sectional shape of any optical path in the microchannel can be circular or polygonal. This application does not specifically limit the shape of the microchannel, the first chamber, and the second chamber, nor does it specifically limit the type of microchannel. For example, the microchannel can be a through hole, etc., and can be designed according to the requirements.

[0046] Furthermore, in addition to the external structure of the atomic gas chamber, the gas chamber shell 110 may also include a substrate between the first chamber and the second chamber, that is, the gas chamber substrate 113 may also include a substrate for dividing the MEMS atomic gas chamber into two connected chambers.

[0047] As an example, such as Figure 4 As shown, if the gas chamber substrate 113, the gas chamber top layer 115, and the gas chamber bottom layer 111 are all separate components, the process of fabricating a fully transparent MEMS atomic gas chamber in this application may include the following steps: Step S01: Place the gas chamber substrate 113 above the gas chamber bottom layer 111 in a predetermined direction, and weld the gas chamber substrate 113 and the gas chamber bottom layer 111 together using a laser welding process to form a two-layer prefabricated component; Step S02: Place an atomic release device in the welded component obtained in Step S01; Step S03: In an air-isolated environment, perform laser welding on the component containing the atomic release device and the gas chamber top layer 115 to obtain an atomic gas chamber with a closed cavity. After further irradiating the release agent in the atomic release device with a laser of a specific power, the gas chamber can contain atomic vapor.

[0048] Furthermore, similar to the existing MEMS process for fabricating the chamber shell, to ensure the internal environment of the atomic gas chamber, the process of welding the various components to obtain a sealed atomic gas chamber in this application can be carried out in a vacuum environment or a buffer atmosphere. That is, the atomic gas chamber needs to be assembled by laser welding each independent component in an air-isolated environment to obtain a sealed atomic gas chamber 100. Specifically, if the atomic gas chamber is obtained by laser welding in a vacuum environment, atomic vapor is filled inside the atomic gas chamber after using laser decomposition to release the agent; if the atomic gas chamber is obtained by laser welding in a buffer atmosphere, atomic vapor and a buffer gas are filled inside the atomic gas chamber after using laser decomposition to release the agent. Among them, the atomic vapor can be atomic vapor of alkali metals (such as rubidium and cesium) or atomic vapor of rare gases (such as helium and xenon), and the buffer gas can be a stable gas such as nitrogen or an inert gas (such as argon).

[0049] In some embodiments of this utility model, such as Figure 5 As shown, the inner wall of the atomic gas chamber can be coated with an anti-relaxation agent layer. For example, the anti-relaxation agent layer can be a paraffin film layer, a silane film layer, or a rubidium hydride film layer, etc., and is used to increase the coherent relaxation time of the atoms inside the atomic gas chamber. In addition to the anti-relaxation agent layer, the inner wall of the atomic gas chamber can also be coated with an alumina film layer, which is used to increase the lifetime of the atomic gas chamber.

[0050] As an example, with the aid of microelectromechanical systems (MEMS), the fully transparent atomic gas cells proposed in this application can be mass-produced by laser welding and dicing of wafers. The mass production method for atomic gas cells is as follows: Step S11: Provide a first parent layer, a second parent layer, and a third parent layer; wherein the first parent layer has N periodically arranged gas cell bottom layers 111, the second parent layer has N periodically arranged gas cell substrates 113, and the third parent layer has N periodically arranged gas cell top layers 115; Step S12: Sequentially weld the first parent layer, the second parent layer, and the third parent layer using a laser welding process; Step S13: Divide the wafer-level structure obtained in step S12 to obtain... Figure 6 The diagram shows N MEMS atomic gas chambers. To enhance the light transmittance of the atomic gas chambers, the method may further include step S14: polishing the inner and outer walls of the N MEMS atomic gas chambers.

[0051] The fully transparent MEMS atomic gas chamber proposed in this application enables triaxial light transmission and, relying on laser welding technology, allows for the welding of individual components forming the gas chamber shell 110 together in an air-isolated environment (such as a vacuum or buffer atmosphere) to form an airtight chamber. Compared to existing MEMS atomic gas chamber structures, the atomic gas chamber proposed in this application has a longer optical path length and more optical path directions, and eliminates the need for welding with solder or high temperatures, as well as the need for a filling tube for filling alkali atoms and evacuating the gas chamber.

[0052] It should be clarified that this utility model is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of this utility model is not limited to the specific steps described and shown. Those skilled in the art can make various changes, modifications, and additions, or change the order of steps, after understanding the spirit of this utility model.

[0053] In this invention, features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, and / or combined with or in place of features of other embodiments.

[0054] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. For those skilled in the art, various modifications and variations can be made to the embodiments of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A MEMS atomic gas chamber, characterized in that, The MEMS atomic gas chamber is a transparent and closed cavity, which includes a transparent gas chamber substrate, a transparent gas chamber top layer, and a transparent gas chamber bottom layer; The transparent air chamber substrate includes at least one chamber. The transparent air chamber substrate and the bottom layer of the transparent air chamber are integral components or connected by laser welding. The transparent air chamber substrate and the top layer of the transparent air chamber are connected by laser welding.

2. The MEMS atomic gas chamber according to claim 1, characterized in that, The MEMS atomic gas chamber is a glass gas chamber or a sapphire gas chamber, and the glass gas chamber is a quartz glass gas chamber, a borosilicate glass gas chamber, an aluminosilicate glass gas chamber, or a soda-lime glass gas chamber.

3. The MEMS atomic gas chamber according to claim 1, characterized in that, The inner wall of the MEMS atomic gas chamber is coated with an anti-relaxation agent layer.

4. The MEMS atomic gas chamber according to claim 1, characterized in that, The MEMS atomic chamber contains an atomic release device; the interior of the atomic chamber is filled with atomic vapor and a buffer gas.

5. The MEMS atomic gas chamber according to claim 4, characterized in that, The atom release device is an alkaline atom release device, which is a container holding an alkaline atom release agent.

6. The MEMS atomic gas chamber according to claim 1, characterized in that, The transparent gas chamber substrate includes at least one chamber, comprising: the transparent gas chamber substrate includes a first chamber and a second chamber, the first chamber and the second chamber being connected by a microchannel; the first chamber serves as a functional chamber, and the second chamber is used to house an atom release device.

7. The MEMS atomic gas chamber according to claim 6, characterized in that, The height of the first chamber is greater than 3 mm.

8. The MEMS atomic gas chamber according to claim 6, characterized in that, The first chamber is a functional chamber capable of transmitting light along three axes.

9. The MEMS atomic gas chamber according to claim 1, characterized in that, The MEMS atomic gas chamber is mass-produced by dicing wafers obtained from wafer-level processing.

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