Wafer cutting machine material frame clamping device

Abstract

The utility model relates to wafer processing technology field discloses wafer cutting machine material frame clamping device, including base, the base outer surface fixedly connected with the limiting ring, the base top fixedly connected with the heat conduction plate, the heat conduction plate top is provided with crystal, the base outer surface is provided with the fixed ring, the fixed ring outer surface fixedly connected with the evenly distributed air cylinder, a plurality of the air cylinder outer surface all fixedly connected with the connecting block, a plurality of the connecting block outer surface all fixedly connected silica gel gasket. In the utility model, through fixing a plurality of air cylinders on the fixed ring, and setting the fixed ring through the sliding block and the sliding slot on the outer surface of base, make the fixed ring can slide freely on the base, and when installing, only need to make the connecting ring push out the stop block through rotating by poking the poking piece, the fixed ring is clamped between the stop block and the limiting ring, solved the problem of time -consuming of being troublesome when replacing the assembly of clamping part.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer dicing machine material frame clamping device. Background Technology

[0002] The wafer dicing machine's material frame clamping device is mainly used to precisely fix and clamp the material frame during the wafer dicing process, ensuring that the wafer maintains a stable position and posture during dicing to meet the requirements of high-precision dicing. It plays an important role in ensuring the quality and efficiency of chip manufacturing.

[0003] The existing wafer dicing machine's material frame clamping device places the material frame on the mounting base, then places the wafer on the ceramic surface and the material frame, and fixes the wafer by adjusting the adjustment component before proceeding with subsequent operations. However, when facing different work requirements, the wafer clamping part also needs to be replaced, and replacing multiple clamping parts individually is time-consuming. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides a wafer dicing machine material frame clamping device, which aims to solve the problem of cumbersome and time-consuming replacement of clamping components.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a wafer dicing machine material frame clamping device, including a base, a limiting ring fixedly connected to the lower middle part of the outer diameter of the base, a fixing ring provided at the top of the limiting ring, cylinders uniformly distributed fixedly connected to the outer diameter of the fixing ring, connecting blocks fixedly connected to the output ends of the cylinders, silicone pads fixedly connected to one side of the connecting blocks, sliders uniformly distributed fixedly connected to the inner diameter of the fixing ring, a uniformly distributed sliding groove longitudinally opened on the top of the base, a stop block slidably connected between the top and bottom of the inner wall of the sliding groove, a connecting ring slidably connected to the top of the stop block, a lever fixedly connected to the outer diameter of the connecting ring, an adjusting groove opened at the upper middle part of the outer diameter of the base, a heat-conducting plate fixedly connected to the top of the base, a crystal provided on the top of the heat-conducting plate, and a cooling component provided at the bottom of the inner wall of the base.

[0006] Preferably, the cooling component includes four temperature detectors, each of which has a detection probe slidably connected to its top. Each of the four detection probes is fixedly connected to a spring between itself and the temperature detector. A cooler is fixedly connected between the four temperature detectors. A vacuum adsorber is fixedly connected to the bottom of the cooler. A uniformly distributed adsorption head is fixedly connected to the top of the vacuum adsorber.

[0007] Preferably, the fixing ring and the limiting ring are tightly fitted together, the slider is tightly fitted together with the base and the stop, and the slider is slidably connected to the slide groove.

[0008] Preferably, the outer surface of the connecting ring is provided with uniformly distributed guide grooves, and the connecting ring is slidably connected to the base.

[0009] Preferably, the paddle passes through the adjustment groove and extends to the outer surface of the base, and the paddle rotates the connecting ring by being paddled outside the base.

[0010] Preferably, the bottom of the crystal is in close contact with both the adsorption head and the heat-conducting plate, and the outer surface of the crystal is in close contact with the silicone pad.

[0011] Preferably, the heat-conducting plate is fixedly connected to the refrigeration unit, and the top of the adsorption head extends through and to the top of the heat-conducting plate.

[0012] Preferably, the detection probe is in close contact with the crystal.

[0013] This utility model has the following beneficial effects:

[0014] 1. In this utility model, by fixing multiple cylinders on a fixed ring and setting the fixed ring on the outer surface of the base through a slider and a groove, the fixed ring can slide freely on the base. During installation, it is only necessary to move the lever to make the connecting ring rotate and push out the stop block, thereby locking the fixed ring between the stop block and the limiting ring, which solves the problem of cumbersome and time-consuming replacement of the clamping components.

[0015] 2. In this utility model, by setting a temperature detector and a detection probe on the outer surface of the base, the temperature of the crystal during the processing is detected. When the crystal temperature is too high, the cooler starts to cool and transfers the temperature to the crystal through the heat conduction plate, thereby completing the cooling of the crystal and solving the problem of crystal damage due to excessive temperature during the cutting process. Attached Figure Description

[0016] Figure 1 This is a perspective view of the wafer dicing machine material frame clamping device proposed in this utility model;

[0017] Figure 2 This is a schematic diagram of the base of the wafer dicing machine material frame clamping device proposed in this utility model;

[0018] Figure 3 This is a schematic diagram of the connecting ring of the wafer dicing machine material frame clamping device proposed in this utility model;

[0019] Figure 4 This is a schematic diagram of the refrigeration unit of the wafer dicing machine material frame clamping device proposed in this utility model;

[0020] Figure 5 This is a schematic diagram of the spring in the wafer dicing machine material frame clamping device proposed in this utility model.

[0021] Legend:

[0022] 1. Base; 2. Crystal; 3. Fixing ring; 4. Cylinder; 5. Connecting block; 6. Silicone gasket; 7. Connecting ring; 8. Stop block; 9. Slider; 10. Slide groove; 11. Limiting ring; 12. Paddle; 13. Adjustment groove; 14. Vacuum adsorber; 15. Adsorption head; 16. Refrigeration unit; 17. Temperature detector; 18. Detection probe; 19. Heat-conducting plate; 20. Spring. Detailed Implementation

[0023] The technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0024] Reference Figures 1-3 This utility model provides an embodiment of a wafer dicing machine material frame clamping device, including a base 1. A limiting ring 11 is fixedly connected to the lower part of the outer diameter of the base 1. A fixing ring 3 is provided on the top of the limiting ring 11. A uniformly distributed cylinder 4 is fixedly connected to the outer diameter of the fixing ring 3. A connecting block 5 is fixedly connected to the output end of each cylinder 4. A silicone pad 6 is fixedly connected to one side of each connecting block 5. A uniformly distributed slider 9 is fixedly connected to the inner diameter of the fixing ring 3. A uniformly distributed sliding groove 10 is longitudinally opened on the top of the base 1. A stop block 8 is slidably connected between the top and bottom of the inner wall of each sliding groove 10. A connecting ring 7 is slidably connected to the top of each stop block 8. A lever 12 is fixedly connected to the outer diameter of the connecting ring 7. An adjustment groove 13 is opened at the upper part of the outer diameter of the base 1. A heat-conducting plate 19 is fixedly connected to the top of the base 1. A crystal 2 is provided on the top of the heat-conducting plate 19. A cooling component is provided at the bottom of the inner wall of the base 1.

[0025] Specifically, by fixing multiple cylinders 4 to the fixing ring 3, when processing the crystal 2, the multiple cylinders 4 unfold, placing the crystal 2 on the heat-conducting plate 19. When the multiple cylinders 4 retract, the connecting block 5 on the cylinder 4 drives the silicone pad 6 to retract, and the multiple cylinders 4 lock the crystal 2. After the cutting work is completed, the cylinders 4 open, releasing the lock on the crystal 2, and the crystal 2 is removed through an external device. When it is necessary to change to a different type of clamping assembly to accommodate a crystal 2 of a special specification, the lever 12 is turned to... The connecting ring 7 is rotated, and the stop 8 is retracted into the base 1 through the rotational connection between the connecting ring 7 and the stop 8, losing its engagement with the fixed ring 3. This allows the fixed ring 3 to drive the cylinder 4 to slide out of the base 1 by sliding in the slide groove 10. Finally, after aligning the slider 9 in the new clamping assembly with the slide groove 10 and installing it, the lever 12 is turned again to make the stop 8 engage the fixed ring 3 between the stop 8 and the limit ring 11, completing the replacement. This solves the problem of tedious and time-consuming replacement of the clamping components.

[0026] Reference Figure 4 and Figure 5 The cooling component includes four temperature detectors 17, each with a slidably connected detection probe 18 on its top. Each of the four detection probes 18 is fixedly connected to a spring 20. A cooler 16 is fixedly connected between the four temperature detectors 17. A vacuum adsorber 14 is fixedly connected to the bottom of the cooler 16. A uniformly distributed adsorption head 15 is fixedly connected to the top of the vacuum adsorber 14.

[0027] Specifically, by setting a temperature detector 17 and a detection probe 18 on the base 1, the temperature of the crystal 2 is detected in real time by the detection probe 18 when the crystal 2 is being cut. When the temperature of the crystal 2 is too high, the temperature detector 17 feeds back to the cooler 16, and the cooler 16 performs cooling operation according to the temperature of the crystal 2. The heat conduction plate 19 can quickly transfer heat to the crystal 2, so that the crystal 2 is always kept within a suitable temperature range during the cutting process, avoiding thermal deformation of the crystal 2 due to temperature changes, which would affect the cutting accuracy. This solves the problem of damage to the crystal 2 due to excessive temperature during the cutting process.

[0028] Reference Figure 2 The fixed ring 3 and the limiting ring 11 are tightly fitted together, the slider 9 is tightly fitted together with the base 1 and the stop block 8, and the slider 9 is slidably connected to the slide groove 10.

[0029] Specifically, when the fixing ring 3 is installed, the slider 9 on its inner wall is aligned with the slide groove 10 and then moved downward until it is tightly fitted with the limiting ring 11. Then, the stop block 8 is extended and locked into the connecting block 5 by moving the lever 12, thus completing the installation.

[0030] Reference Figure 3The outer surface of the connecting ring 7 is provided with evenly distributed guide grooves, and the connecting ring 7 is slidably connected to the base 1.

[0031] Specifically, the stop block 8 is slidably connected to the guide groove on the outer surface of the connecting ring 7. When the connecting ring 7 rotates, the stop block 8 is driven to expand and contract by the arc-shaped guide groove through the connection between the two.

[0032] Reference Figure 2 The paddle 12 passes through the adjustment groove 13 and extends to the outer surface of the base 1. The paddle 12 rotates the connecting ring 7 by being paddled outside the base 1.

[0033] Specifically, when replacing the clamping components, the stop block 8 is unfolded by moving the lever 12 to remove the retaining ring 3. When installing, the lever 12 is moved back after the retaining ring 3 is installed, so that the stop block 8 re-engages with the slider 9 to complete the fixation.

[0034] Reference Figure 1 The bottom of crystal 2 is in close contact with the adsorption head 15 and the heat-conducting plate 19, and the outer surface of crystal 2 is in close contact with the silicone pad 6.

[0035] Specifically, after the external device places the crystal 2 on the heat-conducting plate 19, the vacuum adsorber 14 adsorbs the crystal 2 through the adsorption head 15, so that the crystal 2 is fixed on the heat-conducting plate 19, while the crystal 2 is engaged by connecting blocks 5 and silicone pads 6 around it.

[0036] Reference Figure 4 The heat-conducting plate 19 is fixedly connected to the cooler 16, and the top of the adsorption head 15 extends through and to the top of the heat-conducting plate 19.

[0037] Specifically, when cooling crystal 2, the cooler 16 transfers the temperature to crystal 2 through heat conduction plate 19, while the adsorption head 15 is set around the outer ring of heat conduction plate 19, passes through heat conduction plate 19, and is flush with the top of heat conduction plate 19, thereby adsorbing crystal 2.

[0038] Reference Figure 4 and Figure 5 The detection probe 18 is tightly fitted to the crystal 2.

[0039] Specifically, the top of the detection probe 18 is higher than the heat-conducting plate 19. When the crystal 2 is placed on the heat-conducting plate 19, the detection probe 18 retracts under the gravity of the crystal 2. When the crystal 2 is removed, it returns to its original position under the elastic force of the spring 20, preventing the detection probe 18 from not contacting the crystal 2.

[0040] Working principle: When processing crystal 2, multiple cylinders 4 are first controlled to unfold. After crystal 2 is placed on heat-conducting plate 19, when multiple cylinders 4 retract, the connecting block 5 on cylinder 4 drives the silicone pad 6 to retract, and multiple cylinders 4 lock crystal 2. At the same time, vacuum adsorber 14 is activated and adsorbs crystal 2 through adsorption head 15. When the cutting work is completed, cylinder 4 opens and releases the lock on crystal 2. Crystal 2 is taken out through external device. When it is necessary to change to a different type of clamping component to adapt to crystal 2 of special specifications, the connecting ring 7 is rotated by moving the lever 12. Thus, the rotating connection between the connecting ring 7 and the stop block 8 causes the stop block 8 to retract into the base 1, losing the lock on the fixing ring 3. This allows the fixing ring 3 to drive cylinder 4 to slide in the slide groove 10 to disengage from the base 1. Finally, after the slider 9 in the new clamping component is aligned with the slide groove 10 and installed, the lever 12 is moved again to make the stop block 8 lock the fixing ring 3 between the stop block 8 and the limit ring 11, completing the replacement.

[0041] When crystal 2 is being cut, the temperature of crystal 2 is detected in real time by the detection probe 18. When the temperature of crystal 2 is too high, the temperature detector 17 feeds back to the cooler 16, which then performs a cooling operation based on the temperature of crystal 2. The heat conduction plate 19 can quickly transfer heat to crystal 2, keeping crystal 2 within a suitable temperature range during the cutting process and preventing thermal deformation of crystal 2 due to temperature changes.

[0042] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer dicing machine material frame clamping device, comprising a base (1), characterized in that: A limiting ring (11) is fixedly connected to the lower middle part of the outer diameter of the base (1). A fixing ring (3) is provided on the top of the limiting ring (11). A uniformly distributed cylinder (4) is fixedly connected to the outer diameter of the fixing ring (3). A connecting block (5) is fixedly connected to the output end of each of the cylinders (4). A silicone gasket (6) is fixedly connected to one side of each of the connecting blocks (5). A uniformly distributed slider (9) is fixedly connected to the inner diameter of the fixing ring (3). A uniformly distributed slider is longitudinally opened on the top of the base (1). The sliding groove (10) has a stop block (8) slidably connected between the top and bottom of the inner wall of the sliding groove (10). The top of the stop block (8) is slidably connected to a connecting ring (7). The outer diameter of the connecting ring (7) is fixedly connected to a paddle (12). The outer diameter of the base (1) is provided with an adjustment groove (13) at the upper part of the middle. The top of the base (1) is fixedly connected to a heat-conducting plate (19). The top of the heat-conducting plate (19) is provided with a crystal (2). The bottom of the inner wall of the base (1) is provided with a cooling component.

2. The wafer dicing machine material frame clamping device according to claim 1, characterized in that: The cooling assembly includes four temperature detectors (17), each of which has a probe (18) slidably connected to its top. Each of the four probes (18) is fixedly connected to a spring (20) between it and the temperature detector (17). A cooler (16) is fixedly connected between the four temperature detectors (17). A vacuum adsorber (14) is fixedly connected to the bottom of the cooler (16), and uniformly distributed adsorption heads (15) are fixedly connected to the top of the vacuum adsorber (14).

3. The wafer dicing machine material frame clamping device according to claim 1, characterized in that: The fixed ring (3) is tightly fitted with the limiting ring (11), the slider (9) is tightly fitted with the base (1) and the stop (8), and the slider (9) is slidably connected with the slide groove (10).

4. The wafer dicing machine material frame clamping device according to claim 1, characterized in that: The outer surface of the connecting ring (7) is provided with uniformly distributed guide grooves, and the connecting ring (7) is slidably connected to the base (1).

5. The wafer dicing machine material frame clamping device according to claim 1, characterized in that: The paddle (12) passes through the adjustment groove (13) and extends to the outer surface of the base (1). The paddle (12) rotates the connecting ring (7) by being paddled outside the base (1).

6. The wafer dicing machine material frame clamping device according to claim 1, characterized in that: The bottom of the crystal (2) is in close contact with the adsorption head (15) and the heat-conducting plate (19), and the outer surface of the crystal (2) is in close contact with the silicone pad (6).

7. The wafer dicing machine material frame clamping device according to claim 2, characterized in that: The heat-conducting plate (19) is fixedly connected to the refrigeration unit (16), and the top of the adsorption head (15) extends through and to the top of the heat-conducting plate (19).

8. The wafer dicing machine material frame clamping device according to claim 2, characterized in that: The detection probe (18) is tightly fitted to the crystal (2).

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