Sintering fixture

Abstract

This disclosure relates to the field of semiconductor packaging sintering technology, specifically to a sintering fixture, including a base, a first positioning plate, and a second positioning plate. A bearing area on the base is configured to support a sintering substrate. The first positioning plate is pressed onto the base. A first positioning hole on the first positioning plate is configured to allow the bottom end of a first workpiece to be sintered to pass through and connect to the sintering substrate on the base. A second positioning hole is configured to allow a second workpiece to be sintered to pass through and connect to the sintering substrate on the base. The second positioning plate is pressed onto the first positioning plate, and a third positioning hole on the second positioning plate is configured to allow the top end of the first workpiece to be sintered to pass through and connect to the sintering substrate on the base. The first positioning hole can limit the top end of the first workpiece to be sintered. By providing the first and third positioning holes, this disclosure can limit the top and bottom ends of the first workpiece to be sintered. By providing the second positioning hole, it can limit the second workpiece to be sintered, thereby improving the overall yield and production efficiency of the sintered products.

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