A cabinet internal compartment air duct flow guide device
By installing a compartmentalized airflow guide device inside the chassis, and using the guide plate to guide the cold air to flow in the placement chamber along a preset path, the problem of low chassis heat dissipation efficiency is solved, and a highly efficient cooling effect is achieved.
Patent Information
- Application Number
- CN202521349290.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-27
- Publication Date
- 2026-06-23
- Estimated Expiration
- 2035-06-27
AI Technical Summary
Existing chassis have poor heat dissipation efficiency, especially in high power density, miniaturization and multiple heat source scenarios. The mixing of hot and cold air causes some cold air to be discharged directly without flowing past the heat-generating components.
The system employs an internal compartmentalized airflow guiding device, including a cooling fan, a baffle plate, and a rectangular chassis. The baffle plate guides the cool air to flow along a preset path within the placement chamber, reducing eddies and heat cross-interference, avoiding airflow chaos or heat accumulation, and improving heat dissipation efficiency.
It effectively improves the heat dissipation efficiency of the chassis, reduces eddy currents and heat cross-interference, prevents overheating, and enhances the cooling effect.
Smart Images
Figure CN224399815U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of installation technology, and in particular to a compartmentalized air duct guide device inside a chassis. Background Technology
[0002] With the continuous development of technology, electronic devices are increasingly required to be miniaturized and highly integrated, and the internal space of the chassis is becoming more and more compact. High-density electronic components generate a lot of heat, and the demand for heat dissipation of electronic devices is increasing, especially in high power density, miniaturization and multi-heat source scenarios.
[0003] In existing related technologies, cooling fans and air ducts are generally installed inside the chassis. Electronic components are placed in the air ducts, and the cooling fans blow cool air into the air ducts, so that the electronic components can be effectively cooled.
[0004] Regarding the aforementioned technologies, in actual use, traditional open air ducts mix hot and cold air, and some cold air is directly discharged without flowing past the heat-generating components, resulting in low heat dissipation efficiency of the chassis. Summary of the Invention
[0005] To improve the heat dissipation efficiency of the chassis, this application provides a compartmentalized airflow guiding device inside the chassis.
[0006] The technical solution of the internal compartmentalized air duct guiding device provided in this application is as follows:
[0007] An internal compartmentalized airflow guiding device for a chassis includes a chassis, a cooling fan, and a guide plate, wherein the cooling fan and the guide plate are both fixedly installed inside the chassis;
[0008] The chassis is rectangular in shape and has an air inlet. The air inlet has several first heat dissipation holes that are connected to the inside of the chassis. The chassis has an air outlet with several second heat dissipation holes that are connected to the inside of the chassis. A fan plate is fixedly installed inside the chassis. The fan plate is vertically arranged on one side of the air inlet and has several third heat dissipation holes.
[0009] The cooling fan is provided in a plurality of ways, and the plurality of cooling fans are fixedly installed on the fan plate, and the cooling fan is relative to the third heat dissipation hole;
[0010] The air guide plate includes a main air guide plate, a first sub-plate, and a second sub-plate. The main air guide plate, the first sub-plate, the second sub-plate, and the fan plate surround a placement chamber for placing electronic components. The main air guide plate is fixedly installed on the chassis and is installed at an angle along the height of the chassis. The space of the placement chamber gradually decreases along the angle of the main air guide plate. The first and second sub-plates are both vertically fixedly installed on the main air guide plate. The placement chamber has an air duct opening, through which cold air flows sequentially through the air inlet, the placement chamber, the air duct opening, and the air outlet.
[0011] By adopting the above technical solution, the cooling fan draws in cool outside air through the air inlet. The cool air then enters the mounting chamber through the third heat dissipation vent, and the cooling fan blows it directly onto the electronic components within the mounting chamber. After cooling, the air is exhausted through the air duct to the air outlet. The cool air passing the electronic components is guided by the air deflector, allowing it to flow along a preset path within the mounting chamber. This reduces eddies and heat cross-interference, preventing airflow chaos or heat accumulation, effectively dissipating heat to prevent overheating, and thus improving the chassis's heat dissipation efficiency.
[0012] Optionally, the area of the air duct opening is smaller than the total area of the third heat dissipation holes.
[0013] By adopting the above technical solution, the cold air driven by the cooling fan can flow directly out of the air duct, which helps to increase the flow speed of the cold air and thus help to remove heat more quickly.
[0014] Optionally, the first sub-plate has a plurality of lead holes, the second sub-plate has a plurality of lead holes, and the plurality of lead holes are connected to the placement chamber.
[0015] By adopting the above technical solution, electronic components placed in the chamber can be connected to the chassis through several lead holes, allowing them to communicate with the outside world without affecting heat dissipation.
[0016] Optionally, one end of the first sub-board is fixedly connected to the main board by rivets and a bend plate, and the other end of the first sub-board is fixedly connected to the inside of the chassis by rivets and a bend plate.
[0017] By adopting the above technical solution, the fixed connection of the rivets makes the docking of the first sub-board and the main board of the flow guide more compact, which increases the rigidity of the placement chamber and reduces the impact resonance generated during the movement of the chassis.
[0018] Optionally, one end of the second sub-board is fixedly connected to the main board by rivets and a bend plate, and the other end of the second sub-board is fixedly connected to the inside of the chassis by rivets and a bend plate.
[0019] By adopting the above technical solution, not only is the fixation of the second plate more stable and the impact resonance reduced, but the rivet connection also makes the installation simpler.
[0020] Optionally, a number of auxiliary handles are fixedly installed at one end of the chassis.
[0021] By adopting the above technical solution, users can move the chassis by hand using the auxiliary handle, which improves convenience.
[0022] Optionally, a rubber shock-absorbing strip is fixedly installed inside the chassis, and the rubber shock-absorbing strip is fixedly connected to the mainboard.
[0023] By adopting the above technical solutions, the rubber damping strips can not only optimize the rigidity structure of the placement chamber, but also reduce the resonance frequency generated when the chassis moves, thereby improving the stability of the placement chamber.
[0024] Optionally, the rubber damping strip has a positioning groove, one end of the flow guide main board can be inserted into the positioning groove, and the flow guide main board is fixed to the rubber damping strip by rivets.
[0025] By adopting the above technical solution, the mainboard can be inserted into the positioning slot first, and then rivets can be driven into the mainboard and the positioning slot, thereby improving the installation efficiency of the mainboard.
[0026] In summary, this application includes at least one of the following beneficial technical effects:
[0027] 1. The cooling fan draws in cool outside air through the intake vent, and then the cool air enters the mounting chamber through the third vent. The cooling fan blows directly onto the electronic components in the mounting chamber, and after cooling, the cool air is exhausted through the air duct to the exhaust vent. The cool air passing through the electronic components is guided by the baffle plate, allowing it to flow along a preset path within the mounting chamber, reducing eddies and heat cross-interference, avoiding airflow chaos or heat accumulation, effectively exhausting the air to prevent overheating, and thus improving the chassis's heat dissipation efficiency;
[0028] 2. The rivet fixing connection makes the docking of the first sub-board and the main flow guide board tighter, increasing the rigidity of the placement chamber while reducing the impact resonance generated during the movement of the chassis;
[0029] 3. This allows the mainboard to be inserted into the positioning slot before rivets are driven into the mainboard and positioning slot during installation, thereby improving the installation efficiency of the mainboard. Attached Figure Description
[0030] Figure 1 This is an overall schematic diagram of the internal compartmentalized air duct guide device in Embodiment 1 of this application.
[0031] Figure 2 This is a schematic diagram of the interior of the chassis in Embodiment 1 of this application.
[0032] Figure 3 This is a schematic diagram of the cooling fan in Embodiment 1 of this application.
[0033] Figure 4 This is a schematic diagram of the placement chamber in Embodiment 1 of this application.
[0034] Figure 5 This is a schematic diagram of the rubber shock-absorbing strip in Embodiment 2 of this application.
[0035] Explanation of reference numerals in the attached diagram: 1. Chassis; 101. Air inlet; 102. Air outlet; 103. First heat dissipation hole; 104. Second heat dissipation hole; 11. Auxiliary handle; 2. Cooling fan; 201. Third heat dissipation hole; 21. Fan plate; 3. Air guide plate; 301. Lead wire hole; 31. Air guide main board; 32. First sub-board; 33. Second sub-board; 34. Rivet; 35. Corner plate; 36. Rubber shock absorber strip; 4. Placement chamber; 401. Air duct opening; 402. Positioning groove. Detailed Implementation
[0036] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.
[0037] Example 1:
[0038] Embodiment 1 of this application discloses a compartmentalized air duct guiding device within a chassis. (Refer to...) Figure 1 and Figure 2 The internal compartment air duct guiding device of the chassis 1 includes the chassis 1, the cooling fan 2 and the guide plate 3, and the cooling fan 2 and the guide plate 3 are both fixedly installed inside the chassis 1.
[0039] Reference Figure 1 and Figure 2 The chassis 1 is rectangular in shape, with an air inlet 101 at one end and an air outlet 102 at the other end. The air inlet 101 has several first ventilation holes 103 connected to the interior of the chassis 1. The air outlet 102 at the other end has several second ventilation holes 104 connected to the air inlet 101, forming an airflow channel at both ends. Two auxiliary handles 11 are also fixedly installed on the outside of the chassis 1, allowing users to move the chassis 1 by hand, thus improving the convenience of the equipment.
[0040] Reference Figure 3A fan plate 21 is fixedly installed inside the chassis 1. The fan plate 21 is vertically positioned at the air inlet 101 and fixedly installed in the chassis 1. Two cooling fans 2 are provided, and the stators of the two cooling fans 2 are both fixedly installed in parallel on the fan plate 21. Both cooling fans 2 are directly opposite the air inlet 101, and the fan plate 21 has several third heat dissipation holes 201 arranged in a circle, which is adapted to fit the cooling fans 2. Cold air from the outside can be drawn in by the cooling fans 2 and discharged through the third heat dissipation holes 201.
[0041] Reference Figure 4 The flow guide plate 3 includes a main flow guide plate 31, a first sub-plate 32, and a second sub-plate 33. One end of the first sub-plate 32 is fixedly connected to the main flow guide plate 31 by a rivet 34 and a bend plate 35, while the other end of the first sub-plate 32 is fixedly connected to the inside of the chassis 1 by the same rivet 34 and bend plate 35. One end of the second sub-plate 33 is fixedly connected to the main flow guide plate 31 by the same rivet 34 and bend plate 35, while the other end of the second sub-plate 33 is fixedly connected to the inside of the chassis 1 by the same rivet 34 and bend plate 35. The rivet 34 connection is simple and convenient, and the fixing of the rivet 34 and bend plate 35 makes the connection between the first sub-plate 32 and the second sub-plate 33 and the main flow guide plate 31 more tightly, increasing the rigidity of the flow guide plate 3 while reducing the impact resonance generated during the movement of the chassis 1. The first sub-plate 32 has two lead wire holes 301, and the second sub-plate 33 has one lead wire hole 301. All three lead wire holes 301 are connected to the placement chamber 4. The chassis 1 is provided with several interfaces, which are electrically connected to the electronic components inside the placement chamber 4. Through the lead hole 301, the electronic components inside the placement chamber 4 can be connected to the interfaces without affecting heat dissipation, thus improving the compactness of the chassis 1.
[0042] Reference Figure 4A rubber damping strip 36 is fixedly installed inside the chassis 1. The rubber damping strip 36 is sheet-shaped and is also fixed to the top of the main board 31 by rivets 34. The rubber damping strip 36 not only optimizes the rigidity structure of the air guide plate 3, but also reduces the resonance frequency generated when the chassis 1 moves, thereby improving the stability of the air guide plate 3. The main board 31, the first sub-board 32, and the second sub-board 33 form a placement chamber 4 for placing electronic components. The main board 31 is installed at an angle along the height direction of the chassis 1, and the first sub-board 32 and the second sub-board 33 are tapered along the width direction of the chassis 1, so that the space of the placement chamber 4 gradually decreases along the tilt direction of the main board 31. This air guide plate 3 design allows cold air to be directly blown onto the electronic components installed in the placement chamber 4, reducing turbulence and heat cross-interference, avoiding airflow chaos or heat accumulation, effectively dissipating heat to prevent overheating, and improving the cooling efficiency of the chassis 1. The guide plate 3 is made of epoxy phenolic glass cloth laminate, which is an excellent insulating material with a heat resistance temperature of up to 130 degrees Celsius. It can still maintain stable electrical and mechanical properties at high temperatures.
[0043] Reference Figure 4 The placement chamber 4 has an air duct opening 401. The area of the air duct opening 401 is smaller than the total area of several third heat dissipation holes 201, allowing the cold air blown in by the cooling fan 2 to flow out through the smaller air duct opening 401, thereby increasing the airflow speed and improving heat dissipation efficiency. The cold air flows sequentially through the air inlet 101, the placement chamber 4, the air duct opening 401, and the air outlet 102, allowing the cold air to flow along a preset path within the placement chamber 4, reducing eddies and heat cross-interference, avoiding airflow chaos or heat accumulation, effectively dissipating heat to prevent overheating, and thus improving the heat dissipation efficiency of the chassis 1.
[0044] The implementation principle of the compartmentalized airflow guiding device in this embodiment of the application is as follows: Electronic components generate a large amount of heat during startup. After the cooling fan 2 is turned on, it blows directly onto the electronic components in the placement chamber 4 to achieve the effect of heat dissipation. In addition, the cooling fan 2 draws in cold air from the outside through the air inlet 101, and then the cold air enters the placement chamber 4 through the third heat dissipation hole 201. Finally, after the cold air has been cooled, it is discharged to the air outlet 102 through the air duct 401. The guide plate 3 can guide the cold air in the chamber, so that it can flow in the placement chamber 4 along a preset path, reducing eddies and heat cross-interference, avoiding airflow chaos or heat accumulation, effectively dissipating heat to prevent overheating, thereby improving the heat dissipation efficiency of the chassis 1.
[0045] Example 2:
[0046] Embodiment 2 of this application discloses a compartmentalized air duct guide device in the chassis, the difference being that the specific arrangement of the rubber shock-absorbing strip 36 is different.
[0047] Reference Figure 5 The rubber damping strip 36 is arranged along the width of the chassis 1, and its two ends are fixedly installed on both sides of the chassis 1. The rubber damping strip 36 has a positioning groove 402, which is U-shaped and adapts to the main flow guide 31. One end of the main flow guide 31 can be inserted into the positioning groove 402. When the main flow guide 31 needs to be installed, one end of the main flow guide 31 can be inserted into the positioning groove 402, and then rivets 34 can be driven into the main flow guide 31 and the positioning groove 402 to fix the main flow guide 31 and the rubber damping strip 36 together, thereby improving the installation efficiency of the main flow guide 31.
[0048] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A compartmentalized air duct guiding device within a chassis, characterized in that: It includes a chassis (1), a cooling fan (2) and a baffle plate (3), wherein the cooling fan (2) and the baffle plate (3) are fixedly installed inside the chassis (1); The chassis (1) is rectangular in shape. The chassis (1) is provided with an air inlet (101). The air inlet (101) is provided with a plurality of first heat dissipation holes (103). The plurality of first heat dissipation holes (103) are connected to the interior of the chassis (1). The chassis (1) is provided with an air outlet (102). The air outlet (102) is provided with a plurality of second heat dissipation holes (104). The plurality of second heat dissipation holes (104) are connected to the interior of the chassis (1). A fan plate (21) is fixedly installed inside the chassis (1). The fan plate (21) is vertically arranged on one side of the air inlet (101). The fan plate (21) is provided with a plurality of third heat dissipation holes (201). The cooling fan (2) is provided in a plurality of them, and the plurality of cooling fans (2) are fixedly installed on the fan plate (21), and the cooling fan (2) is relative to the third heat dissipation hole (201); The guide plate (3) includes a main guide plate (31), a first sub-plate (32) and a second sub-plate (33). The main guide plate (31), the first sub-plate (32), the second sub-plate (33) and the fan plate (21) surround to form a placement chamber (4). The placement chamber (4) is used for placing electronic components. The main guide plate (31) is fixedly installed on the chassis (1). The main guide plate (31) is installed at an angle along the height direction of the chassis (1). The space of the placement chamber (4) gradually decreases along the angle direction of the main guide plate (31). The first sub-plate (32) and the second sub-plate (33) are both vertically fixedly installed on the main guide plate (31). The placement chamber (4) has an air duct opening (401). Cold air flows sequentially through the air inlet (101), the placement chamber (4), the air duct opening (401) and the air outlet (102).
2. The internal compartmentalized air duct guiding device according to claim 1, characterized in that: The area of the air duct opening (401) is smaller than the total area of the third heat dissipation holes (201).
3. The internal compartmentalized air duct guiding device according to claim 1, characterized in that: The first partition plate (32) has a plurality of lead wire holes (301), and the second partition plate (33) has a plurality of lead wire holes (301), and the plurality of lead wire holes (301) are connected to the placement chamber (4).
4. The internal compartmentalized air duct guiding device according to claim 1, characterized in that: One end of the first sub-board (32) is fixedly connected to the main board (31) by a rivet (34) and a corner plate (35), and the other end of the first sub-board (32) is fixedly connected to the inside of the chassis (1) by a rivet (34) and a corner plate (35).
5. The internal compartmentalized air duct guiding device according to claim 1, characterized in that: One end of the second sub-board (33) is fixedly connected to the main board (31) by a rivet (34) and a corner plate (35), and the other end of the second sub-board (33) is fixedly connected to the inside of the chassis (1) by a rivet (34) and a corner plate (35).
6. The internal compartmentalized air duct guiding device according to claim 1, characterized in that: Several auxiliary handles (11) are fixedly installed at one end of the chassis (1).
7. The internal compartmentalized air duct guiding device according to claim 1, characterized in that: A rubber damping strip (36) is fixedly installed inside the chassis (1). The rubber damping strip (36) is in the form of a sheet and is fixedly connected to the main board (31).
8. The internal compartmentalized air duct guiding device according to claim 7, characterized in that: The rubber damping strip (36) has a positioning groove (402), one end of the flow guide main board (31) can be inserted into the positioning groove (402), and the flow guide main board (31) is fixed to the rubber damping strip (36) by rivets (34).