Laser water-cooling heat dissipation structure with microchannels

Abstract

The utility model relates to laser heat radiation structure technical field discloses a kind of laser water cooling heat radiation structure with microchannel, including cover, shunt plate, interface plate and piezoelectric fan, wherein, the cover, the shunt plate and the interface plate are sequentially arranged longitudinally, and fixedly connected between two two;One side of the interface plate is provided with water inlet channel, and the other side of the interface plate opposite the water inlet channel is provided with water outlet channel;Microchannel is formed in the top surface of the shunt plate recess, and flow area is formed in the bottom surface of the shunt plate recess;When being in intermittent operation mode, instantaneous heat is smaller than continuous operation mode, water cooling system dormancy, piezoelectric fan starts, forced air convection is formed in microchannel using its vibration, and the little heat generated intermittently is quickly dissipated, reduce the mechanical wear and tear and pressure fluctuation caused by frequent start and stop of equipment, prolong the service life of water cooling system component, increase the stability of overall operation, reduce use cost.

Description

Technical Field

[0001] This utility model relates to the field of laser heat dissipation structure technology, and in particular to a laser water-cooling heat dissipation structure with microchannels. Background Technology

[0002] Lasers are essential core components in industries such as fiber optic communication and data transmission. The "heart" of a laser is the laser chip, which generates a significant amount of heat during operation, in addition to converting electrical energy into light energy. If this heat cannot be dissipated quickly, it can cause a series of problems, such as reduced efficiency, decreased power, and increased threshold current. Therefore, heat dissipation structures are needed to cool the laser and ensure its lifespan and reliability.

[0003] For example, Chinese utility model patent with publication number CN210806308U discloses a heat dissipation structure for a water-cooled stacked semiconductor laser.

[0004] The above technical solutions do not have differentiated heat dissipation methods for the continuous or intermittent operation modes of the laser. They all adopt water cooling. When the laser is in intermittent operation mode, the water cooling system starts and stops frequently, which increases mechanical wear and pressure fluctuations, shortens the service life of water pumps and valve components, reduces the overall operational stability, and increases the cost of use. Utility Model Content

[0005] To overcome at least one of the defects described in the prior art, this invention provides a laser water-cooling structure with microchannels. In intermittent operation mode, the instantaneous heat generation is smaller compared to continuous operation mode. The water-cooling system is put into sleep mode, and the piezoelectric fan is activated. Its vibration creates forced air convection within the microchannels, quickly dissipating the small amount of intermittently generated heat. This reduces mechanical wear and pressure fluctuations caused by frequent start-stop cycles, extends the service life of the water-cooling system components, increases overall operational stability, and reduces operating costs.

[0006] The technical solution of this utility model is implemented as follows:

[0007] A water-cooled heat dissipation structure for a laser with microchannels includes a cover plate, a distribution plate, an interface plate, and a piezoelectric fan. The cover plate, the distribution plate, and the interface plate are arranged longitudinally in sequence and fixedly connected in pairs. One side of the interface plate has a water inlet channel, and the other side opposite the water inlet channel has a water outlet channel. The top surface of the distribution plate is recessed to form microchannels, and the bottom surface of the distribution plate is recessed to form flow regions. These flow regions are connected to the water inlet channel and the water outlet channel, respectively, to form water flow paths. The piezoelectric fan is disposed within the microchannels to provide cooling airflow within them.

[0008] Based on the above technical solutions, preferably, multiple microchannels are provided, the number of fan blades of the piezoelectric fan is the same as the number of microchannels, and each microchannel is provided with one fan blade.

[0009] Based on the above technical solutions, preferably, the multiple microchannels are spaced apart.

[0010] Based on the above technical solutions, preferably, the cover plate, the diverter plate, and the interface plate are all made of oxygen-free copper.

[0011] Based on the above technical solutions, preferably, the fixed connection between the cover plate and the diverter plate is welding, and the fixed connection between the diverter plate and the interface plate is welding.

[0012] Based on the above technical solutions, preferably, the flow area includes a first groove, a second groove, and a through groove. The through groove is disposed inside the flow divider plate. The first groove and the second groove are located below the through groove, and one end of the through groove is connected to the first groove, and the other end is connected to the second groove.

[0013] Based on the above technical solutions, preferably, the water inlet channel is provided with a first water inlet and a first water outlet, wherein the first water inlet is located on one side of the interface plate and is connected to an external water supply device; the first water outlet is located on the top surface of the interface plate and is connected to the first water inlet and the first water outlet is connected to the first groove.

[0014] Based on the above technical solutions, preferably, the water outlet channel is provided with a second water inlet and a second water outlet, wherein the second water outlet is located on the other side of the interface plate; the second water inlet is located on the top surface of the interface plate, and the second water inlet is connected to the second groove.

[0015] Based on the above technical solutions, preferably, the top surface of the interface plate is provided with a first overflow groove and a second overflow groove at intervals. The bottom of the first overflow groove is connected to the first outlet, the top of the first overflow groove is connected to the first groove, the top of the second overflow groove is connected to the second groove, and the bottom of the second overflow groove is connected to the second inlet.

[0016] Based on the above technical solutions, preferably, the length of the first overflow trough is longer than the length of the first outlet, and the length of the second overflow trough is longer than the length of the second inlet.

[0017] In summary, the microchannel-based laser water-cooling structure provided by this invention has the following advantages over existing technologies:

[0018] (1) Two heat dissipation methods, water cooling and air cooling, were designed. Compared with a single water cooling structure, it can more flexibly and effectively meet different heat dissipation needs and ensure that the laser chip can operate stably under various working conditions.

[0019] (2) In the intermittent working mode, the air flow generated in the microchannel by the piezoelectric fan is used to dissipate heat, reduce the dependence on water cooling mode, avoid frequent start and stop of the water cooling system, and extend the service life of components such as water pumps and valves.

[0020] (3) In continuous working mode, efficient heat dissipation is achieved through the inlet and outlet channels of the piezoelectric fan and the flow area of ​​the interface board and the flow distribution plate, realizing dual heat dissipation of water cooling and air cooling, and the heat dissipation effect is better.

[0021] (4) Through the water inlet and outlet channels set at intervals in the interface plate, and the connection design between the flow area on the split plate and the water inlet and outlet channels, an orderly water cooling circulation path is formed, ensuring that the cooling water can flow through the interface plate and the split plate efficiently, take away heat, and improve the water cooling heat dissipation efficiency. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present utility model;

[0024] Figure 2 This is a first-view perspective three-dimensional structural diagram of the diverter plate according to an embodiment of the present utility model;

[0025] Figure 3 This is a top view of the splitter plate according to an embodiment of the present utility model;

[0026] Figure 4 This is a schematic diagram of the front cross-sectional structure of an embodiment of the present utility model;

[0027] Figure 5 This is a two-dimensional structural diagram of the diverter plate from the second perspective of an embodiment of the present utility model;

[0028] Figure 6 This is a bottom view of an embodiment of the present utility model;

[0029] Figure 7 This is a side sectional view of an embodiment of the present invention.

[0030] The meanings of the reference numerals in the attached drawings are as follows: 1. Cover plate; 2. Diverter plate; 21. Flow area; 211. First groove; 2111. First drainage groove; 2112. First guide hole; 212. Second groove; 2121. Second drainage groove; 2122. Second guide hole; 213. Through groove; 2131. Guide groove; 22. Microchannel; 3. Interface plate; 31. Water inlet channel; 311. First water inlet; 312. First water outlet; 32. Water outlet channel; 321. Second water inlet; 322. Second water outlet; 33. First overflow groove; 34. Second overflow groove; 35. Mounting hole; 4. Piezoelectric fan; 41. Base; 42. Fan blade; 5. First partition plate; 6. Second partition plate; 7. Third partition plate; 8. Fourth partition plate. Detailed Implementation

[0031] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0032] See Figures 1-7 This utility model discloses a laser water-cooling heat dissipation structure with microchannel 22, including a cover plate 1, a flow divider 2, an interface plate 3, and a piezoelectric fan 4.

[0033] See Figure 1 As shown, in this embodiment, one end of the shunt plate 2 is connected to the cover plate 1, and the other end is connected to the interface plate 3. The cover plate 1, shunt plate 2, and interface plate 3 are arranged longitudinally in sequence and fixedly connected to each other. Furthermore, the top wall of the shunt plate 2 is welded to the cover plate 1, and the bottom wall of the shunt plate 2 is welded to the interface plate 3. This connection method allows heat to be rapidly transferred from the chip to the cover plate 1, and then further conducted to the shunt plate 2. More specifically, the welding and fixing method between the cover plate 1 and the shunt plate 2 is brazing, and the welding and fixing method between the shunt plate 2 and the interface plate 3 is also brazing. The cover plate 1, shunt plate 2, and interface plate 3 are formed into a whole through brazing, ensuring the heat transfer efficiency of the laser chip. This ensures that the connection between the components is stable under long-term use and complex operating conditions, preventing easy loosening or separation, and ensuring the integrity and reliability of the heat dissipation structure. Moreover, brazing provides good sealing performance, which can prevent cooling water leakage and ensure the normal operation of the laser.

[0034] See Figure 1As shown, in this embodiment, the upper surface of the cover plate 1 is in direct contact with the laser chip. When the laser chip is working, heat is conducted downwards along the cover plate 1. The surface of the cover plate 1 is flat and smooth to ensure a good fit with the laser chip, reduce thermal resistance, and quickly absorb the heat generated by the laser chip, providing a basis for subsequent heat conduction. Specifically, the cover plate 1 is made of oxygen-free copper, which has a thermal conductivity of about 400 W / (m·K). This allows for rapid transfer of heat from the laser chip to the cover plate 1. Furthermore, oxygen-free copper is soft, has good ductility, and is easy to precision machine, meeting the structural precision requirements for laser heat dissipation.

[0035] See Figure 2 As shown, in this embodiment, the shunt plate 2 is also made of oxygen-free copper. The thermal conductivity of oxygen-free copper is about 400W / (m·K), which can quickly transfer the heat of the laser chip. Moreover, oxygen-free copper is soft and has good ductility, which makes it easy to perform precision machining and can meet the structural precision requirements of laser heat dissipation.

[0036] See Figure 1 and Figure 4 As shown, in this embodiment, the interface board 3 is made of oxygen-free copper. The thermal conductivity of oxygen-free copper is about 400W / (m·K), which can quickly transfer heat from the laser chip. Moreover, oxygen-free copper is soft, has good ductility, and is easy to perform precision machining, which can meet the structural precision requirements of laser heat dissipation.

[0037] See Figure 2 and Figure 3 As shown, in this embodiment, the piezoelectric fan 4 includes a base 41 and multiple fan blades 42. The multiple fan blades 42 are distributed sequentially along the length of the base 41. This design allows multiple fan blades 42 to vibrate simultaneously through signals generated by the circuit, resulting in better performance.

[0038] See Figure 2 and Figure 3 As shown, in this embodiment, the top surface of the flow divider 2 is recessed to form microchannels 22. Multiple microchannels 22 are provided, and the number of fan blades 42 of the piezoelectric fan 4 is the same as the number of microchannels 22. Each microchannel 22 contains one fan blade 42, which provides cooling airflow within the microchannel 22. The presence of one fan blade 42 in each microchannel 22 allows for precise provision of cooling airflow according to the heat dissipation requirements of the corresponding area. The microchannels 22 are formed by an inward recess on the side of the flow divider 2 closest to the cover plate 1. The multiple microchannels 22 are spaced apart, increasing the contact area between the flow divider 2 and the air. Under the action of the piezoelectric fan 4, more cooling airflow contacts the sidewalls of the microchannels 22 and the flow divider 2, accelerating heat exchange and dissipation, and improving overall heat dissipation efficiency.

[0039] See Figure 2 and Figure 3 As shown, in this embodiment, the two ends of the microchannel 22 are connected to the flow divider 2. This design allows the cooling airflow to flow smoothly through the entire microchannel 22. Specifically, the base 41 is located at one end of the microchannel 22 and is fixedly connected to the flow divider 2, thereby improving the structural strength of the connection between the piezoelectric fan 4 and the flow divider 2.

[0040] See Figure 4 As shown, in this embodiment, an inlet channel 31 is provided on one side of the interface plate 3, and an outlet channel 32 is provided on the other side of the interface plate 3 opposite to the inlet channel 31. The inlet channel 31 and the outlet channel 32 are spaced apart and separated by a first partition plate 5. Both the inlet channel 31 and the outlet channel 32 are hollow channels to facilitate the flow of cooling water.

[0041] See Figure 4 As shown, in this embodiment, specifically, the water inlet channel 31 is provided with a first water inlet 311 and a first water outlet 312. The first water outlet 312 is connected to the first water inlet 311 to facilitate the flow of cooling water. The water inlet channel 31 is L-shaped, with the first water inlet 311 and the first water outlet 312 located at opposite ends of the water inlet channel 31. The first water inlet 311 is located on one side of the interface plate 3 and is connected to an external water supply device. The water supply device includes a water supply pipe for connecting to external cooling water and a water pump. The first water outlet 312 is located on the top surface of the interface plate 3, and the top surface of the interface plate 3 is provided with... The first overflow groove 33 corresponds to the position of the first outlet 312. The first overflow groove 33 is formed by an inward indentation from the top wall of the interface plate 3. The bottom of the first overflow groove 33 is connected to the first outlet 312, and the top of the first overflow groove 33 is connected to the first groove 211. In this embodiment, the length of the first overflow groove 33 is longer than the length of the first outlet 312. This design facilitates the entry of cooling water from the first outlet 312 into the first overflow groove 33, which facilitates the subsequent introduction of cooling water into the diverter plate 2, increases the contact area between the cooling water and the internal part of the interface plate 3, and improves the heat exchange efficiency.

[0042] See Figure 4As shown, in this embodiment, specifically, a second inlet 321 and a second outlet 322 are provided on the water outlet channel 32. The water outlet channel 32 is L-shaped. The second outlet 322 and the second inlet 321 are located at the two ends of the water outlet channel 32, respectively. The second outlet 322 is located on the side of the interface plate 3 opposite to the first inlet 311. The second inlet 321 is located on the top surface of the interface plate 3. A second overflow groove 34 is provided on the top surface of the interface plate 3. The position of the second overflow groove 34 corresponds to that of the second inlet 321. Specifically, the second overflow groove 34 is formed by recessing inward from the top wall of the interface plate 3. The top of the second overflow groove 34 is connected to the second groove 212, and the bottom of the second overflow groove 34 is connected to the second inlet 321. Moreover, in this embodiment, the length of the second overflow channel 34 is longer than the length of the second inlet 321. This design facilitates the export of cooling water from the diversion plate 2 and gathers the cooling water flowing out of the diversion plate 2 into the outlet channel 32, thereby improving the uniformity of the water flow.

[0043] It should also be noted that the first overflow channel 33 and the second overflow channel 34 are set apart to prevent them from being connected, which would cause cooling water to flow directly from the first outlet 312 to the second inlet 321 and affect the heat exchange efficiency.

[0044] See Figure 1 and Figure 4 As shown, in some embodiments, the interface board 3 is provided with mounting holes 35 for easy installation of lasers. The mounting holes 35 are provided through the interface board 3. This design allows the interface board 3 to be connected quickly, simplifies the assembly process, and improves installation efficiency.

[0045] See Figure 4As shown, in this embodiment, the bottom surface of the diversion plate 2 is recessed to form a flow area 21. It can also be said that the diversion plate 2 is provided with a flow area 21 on the side away from the cover plate 1. The flow area 21 is connected to the water inlet channel 32 and the water outlet channel 31 respectively to form a water flow path. That is, one end of the flow area 21 is connected to the water inlet channel 31 and the other end is connected to the water outlet channel 32. Specifically, the flow area 21 includes a first groove 211, a second groove 212 and a through groove 213. The first water outlet 213 is connected to the first groove 211, and the second water inlet 321 is connected to the second groove 212. The through groove 213 is disposed inside the diversion plate 2. The first groove 211 and the second groove 212 are located below the through groove 213. One end of the through groove 213 is connected to the first groove 211 and the other end is connected to 212. The first groove 211 and the second groove 212 are both recessed inward from the side of the diversion plate 2 away from the cover plate 1, and the first groove 211 and the second groove 212 are spaced apart. In this embodiment, the first groove 211 and the second groove 212 are separated by a second partition plate 6. The first partition plate 5 and the second partition plate 6 are in contact to prevent cooling water from flowing directly from the first groove 211 into the second groove 212, which would affect the heat exchange efficiency. The first groove 211 includes a first drain groove 2111 and a first guide hole 2112 arranged sequentially. Specifically, the first drain groove 2111 is located on one side of the first groove 211, and the first guide hole 2112 is located on the other side of the first groove 211. The first drain groove 2111 and the first guide hole 2112 are arranged in sequence. Occupying the space of the first groove 211, the second groove 212 includes a second drainage groove 2121 and a second guide hole 2122 arranged sequentially. Specifically, the second drainage groove 2121 is located on one side of the second groove 212, and the second guide hole 2122 is located on the other side of the second groove 212. The second drainage groove 2121 and the second guide hole 2122 occupy the space of the second groove 212. The through groove 213 includes a guide groove 2131. One end of the guide groove 2131 is connected to the first guide hole 2112, and the other end of the guide groove 2131 is connected to the second guide hole 2122. With this design, the water pump delivers cooling water from the external water supply pipe through the first inlet 311. The cooling water then passes through the first outlet 312 and sequentially enters the first overflow trough 33, the first drain trough 2111, the first guide hole 2112, and the guide trough 2131. It then passes through the second guide hole 2122, the second drain trough 2121, the second inlet 321, and the second outlet 322 before being discharged. This design involves multiple components and a long flow path for the cooling water, resulting in higher heat exchange efficiency.

[0046] See Figure 5 and Figure 6As shown, in this embodiment, multiple first guide holes 2112 are provided. The first guide holes 2112 are spaced apart along the first groove 211. Multiple parallel third partition plates 7 are provided between adjacent first guide holes 2112. The length of the third partition plate 7 is less than the side length of the first groove 211. The multiple spaced first guide holes 2112 can disperse the water flow and avoid local water flow concentration or excessive flow rate. In conjunction with the third partition plates 7 between adjacent first guide holes 2112, the water flow direction is straightened, so that the water flow enters the subsequent guide groove 2131 more evenly, ensuring that the cooling water and each part of the heat dissipation structure are in full contact.

[0047] See Figure 5 and Figure 6 As shown, in this embodiment, multiple second guide holes 2122 are provided. The second guide holes 2122 are spaced apart along the second groove 212, and multiple parallel fourth partition plates 8 are provided between adjacent second guide holes 2122. The length of the fourth partition plate 8 is less than the side length of the first groove 211. The multiple spaced second guide holes 2122 can disperse the water flow, avoid local water flow concentration or excessive flow velocity. In conjunction with the fourth partition plates 8 between adjacent second guide holes 2122, the water flow direction is straightened, so that the water flowing in from the guide groove 2131 enters the second guide hole 2122 more evenly, ensuring that the cooling water is in full contact with all parts of the heat dissipation structure.

[0048] See Figure 7 As shown, in this embodiment, multiple guide channels 2131 are provided. The guide channels 2131 are spaced apart along the through channel 213, and the number of guide channels 2131 is the same as the number of first guide holes 2112 and second guide holes 2122, and they are set in a one-to-one correspondence. The multiple guide channels 2131 correspond one-to-one with the first guide holes 2112 and the second guide holes 2122, which can accurately distribute the cooling water flowing in from the first guide hole 2112 to each guide channel 2131, and then discharge it through the corresponding second guide hole 2122. This avoids the problem of concentrated or uneven water flow in the traditional structure and ensures that each area of ​​the diversion plate 2 can be covered by cooling water.

[0049] In this embodiment, it should also be noted that the laser has two operating modes: an intermittent operating mode and a continuous operating mode. In the intermittent operating mode, the laser is not continuously emitted, but rather emitted and stopped periodically at certain time intervals. Since the laser emission time is short, the heat generated is relatively small, and the temperature rise inside the laser is small. Therefore, in the intermittent operating mode, the piezoelectric fan 4 generates airflow in the microchannel 22 to dissipate heat. The piezoelectric fan 4 creates forced air convection in the microchannel 22, which quickly dissipates the small amount of heat generated intermittently, reducing the dependence on water cooling mode, avoiding frequent start-stop of the water cooling system, and extending the service life of components such as water pumps and valves. In the continuous operating mode, the laser emits laser continuously. Since heat needs to be continuously generated in the continuous operating mode, efficient heat dissipation is achieved through the piezoelectric fan 4, the water inlet channel 31 and water outlet channel 32 of the interface board 3, and the flow area 21 of the diversion plate 2. This achieves dual heat dissipation of water cooling and air cooling, resulting in better heat dissipation. In this embodiment, a current sensor, such as a Hall effect current sensor, can be connected in series in the laser power supply circuit to convert the current signal into a voltage signal. This voltage signal is then acquired and analyzed using a data acquisition card or oscilloscope. If the acquired signal is continuously stable, it indicates that the laser is in continuous operation mode; if the signal exhibits periodic high and low fluctuations, it indicates intermittent operation mode. This signal is used to control the piezoelectric fan 4 and the water supply pipe. This reduces mechanical wear and pressure fluctuations caused by frequent start-stop cycles, extends the service life of water-cooling system components such as water pumps and valves, and improves overall operational stability.

[0050] Specific implementation steps

[0051] In intermittent operation mode, the cover plate 1 contacts the laser chip, and the laser chip generates a small amount of heat which is transferred to the cover plate 1. The piezoelectric fan 4 is activated, but the water supply pipe does not supply water to the first inlet 311. The piezoelectric fan 4 drives the air to flow in the microchannel 22 through high-frequency vibration to achieve heat dissipation. In continuous operation mode, the cover plate 1 contacts the laser chip, and the heat from the laser chip is transferred to the cover plate 1, the diverter plate 2, and the interface plate 3. The water pump sends cooling water from the external water supply pipe into the first inlet 311. The cooling water passes through the first outlet 312 and enters the first overflow trough 33, the first drain trough 2111, the first guide hole 2112, and the guide trough 2131 in sequence. Then, it passes through the second guide hole 2122, the second drain trough 2121, the second inlet 321, and the second outlet 322 in sequence to be discharged. The piezoelectric fan 4 drives the air to flow in the microchannel 22 through high-frequency vibration to achieve dual heat dissipation and heat exchange.

[0052] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A water-cooled heat dissipation structure for a laser with microchannels, characterized in that, Includes a cover plate (1), a flow divider plate (2), an interface plate (3), and a piezoelectric fan (4), wherein, The cover plate (1), the diverter plate (2) and the interface plate (3) are arranged longitudinally in sequence and are fixedly connected to each other in pairs; A water inlet channel (31) is provided on one side of the interface plate (3), and a water outlet channel (32) is provided on the other side of the interface plate (3) opposite to the water inlet channel (31); The top surface of the diversion plate (2) is recessed to form a microchannel (22), and the bottom surface of the diversion plate (2) is recessed to form a flow area (21). The flow area (21) is connected to the water inlet channel (31) and the water outlet channel (32) respectively to form a water flow path. The piezoelectric fan (4) is disposed in the microchannel (22) and is used to provide cooling airflow in the microchannel (22).

2. The water-cooled heat dissipation structure for a laser with microchannels according to claim 1, characterized in that, Multiple microchannels (22) are provided, and the number of fan blades (42) of the piezoelectric fan (4) is the same as the number of microchannels (22). Each microchannel (22) is provided with one fan blade (42).

3. The water-cooled heat dissipation structure for a laser with microchannels according to claim 2, characterized in that, Multiple microchannels (22) are spaced apart.

4. The water-cooled heat dissipation structure for a laser with microchannels according to claim 1, characterized in that, The cover plate (1), the diverter plate (2), and the interface plate (3) are all made of oxygen-free copper.

5. A water-cooled heat dissipation structure for a laser with microchannels according to claim 1 or 4, characterized in that, The fixed connection between the cover plate (1) and the diverter plate (2) is by welding, and the fixed connection between the diverter plate (2) and the interface plate (3) is by welding.

6. The water-cooled heat dissipation structure for a laser with microchannels according to claim 1, characterized in that, The flow area (21) includes a first groove (211), a second groove (212), and a through groove (213). The through groove (213) is disposed inside the flow divider (2). The first groove (211) and the second groove (212) are located below the through groove (213), and one end of the through groove (213) is connected to the first groove (211), and the other end is connected to the second groove (212).

7. A water-cooled heat dissipation structure for a laser with microchannels according to claim 6, characterized in that, The water inlet channel (31) is provided with a first water inlet (311) and a first water outlet (312), wherein, The first water inlet (311) is located on one side of the interface plate (3), and the first water inlet (311) is connected to the external water supply equipment; The first outlet (312) is located on the top surface of the interface plate (3). The first outlet (312) is connected to the first inlet (311) and the first outlet (312) is connected to the first groove (211).

8. The water-cooled heat dissipation structure for a laser with microchannels according to claim 7, characterized in that, The water outlet channel (32) is provided with a second water inlet (321) and a second water outlet (322), wherein, The second outlet (322) is located on the other side of the interface plate (3); The second water inlet (321) is located on the top surface of the interface plate (3), and the second water inlet (321) is connected to the second groove (212).

9. A water-cooled heat dissipation structure for a laser with microchannels according to claim 8, characterized in that, The top surface of the interface plate (3) is provided with a first overflow groove (33) and a second overflow groove (34) at intervals. The bottom of the first overflow groove (33) is connected to the first outlet (312), the top of the first overflow groove (33) is connected to the first groove (211), the top of the second overflow groove (34) is connected to the second groove (212), and the bottom of the second overflow groove (34) is connected to the second inlet (321).

10. A water-cooled heat dissipation structure for a laser with microchannels according to claim 9, characterized in that, The length of the first overflow trough (33) is longer than the length of the first outlet (312), and the length of the second overflow trough (34) is longer than the length of the second inlet (321).

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