Composite heat-conducting gasket

Abstract

The utility model discloses a composite heat conduction gasket, including graphene heat conduction gasket layer, the graphene heat conduction gasket layer one side is provided with first liquid metal layer, the graphene heat conduction gasket layer another layer is provided with second liquid metal layer. This structure is formed by liquid metal and graphene heat conduction gasket compound, effectively combines the advantage of both, significantly reduces the interface thermal resistance, gives product high heat conduction performance, and has certain compressibility.

Description

Technical Field

[0001] This utility model relates to the field of thermal conductive pads, and in particular to a composite thermal conductive pad. Background Technology

[0002] Current graphene thermal pads possess low density and a degree of compressibility, allowing them to better adapt to minor unevenness on various contact surfaces in practical applications. Furthermore, this product employs advanced directional alignment technology, ensuring that the graphene sheets are arranged in an orderly manner according to a specific orientation, thus providing a continuous and efficient heat conduction path. Thanks to these technological innovations, its thermal conductivity is significantly improved, reaching more than 10 times that of conventional thermal interface materials, demonstrating superior heat dissipation capabilities. However, this product also has a drawback: its surface lacks wettability. This means that during installation and testing, the thermal resistance between interfaces becomes very high, leading to a significant decrease in actual thermal conductivity and preventing it from fully realizing its intended heat dissipation effect.

[0003] In contrast, pure liquid metal performs exceptionally well in ultra-thin applications. Its excellent wettability allows it to quickly and evenly cover the contact surface, significantly reducing contact thermal resistance and ensuring efficient heat transfer. However, a drawback of pure liquid metal is its lack of compressibility. This means that when faced with uneven contact surfaces, it may not be able to effectively fill gaps like graphene thermal pads, thus affecting its overall heat dissipation performance. Utility Model Content

[0004] The technical problem solved by this utility model is to provide a composite thermally conductive pad with low interfacial thermal resistance, high overall thermal conductivity, and a certain degree of compressibility.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a composite thermal conductive pad, including a graphene thermal conductive pad layer, a first liquid metal layer disposed on one side of the graphene thermal conductive pad layer, and a second liquid metal layer disposed on the other side of the graphene thermal conductive pad layer.

[0006] Furthermore, the first liquid metal layer is surrounded by a first foam dam, one end of which is connected to the graphene thermal pad layer, so that the first liquid metal will not overflow from between the first foam dam and the graphene thermal pad layer.

[0007] Furthermore, the second liquid metal layer is surrounded by a second foam dam, one end of which is connected to the graphene thermal pad layer, so that the second liquid metal will not overflow from between the second foam dam and the graphene thermal pad layer.

[0008] Furthermore, the thickness of the first foam dam is greater than or equal to the thickness of the first liquid metal, etc.

[0009] The thickness of the second foam dam is greater than or equal to the thickness of the second liquid metal, etc.

[0010] Furthermore, the thickness of the graphene thermal pad layer is 0.2–1.0 mm.

[0011] Furthermore, the thickness of the first liquid metal layer and the second liquid metal layer is 0.03 to 0.1 mm.

[0012] Furthermore, the width of the first foam dam or the second foam dam is 2.5 to 3 mm, and the thickness of the first foam dam or the second foam dam is 0.15 mm.

[0013] The beneficial effects of this utility model are: this structure is composed of liquid metal and graphene thermal conductive pad, which effectively combines the advantages of both, significantly reduces the interfacial thermal resistance, gives the product high thermal conductivity, and has a certain degree of compressibility. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the composite thermal pad according to an embodiment of this application.

[0015] Figure 2 This is a top view of a composite thermally conductive pad according to an embodiment of this application.

[0016] Figure 3 This is a bottom view of the composite thermal pad according to an embodiment of this application.

[0017] The diagram is labeled as follows: Graphene thermal pad layer 1, first liquid metal layer 2, second liquid metal layer 3, first foam dam 4, and second foam dam 5. Detailed Implementation

[0018] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0019] like Figure 1 As shown, an embodiment of this application is a composite thermal pad, including a graphene thermal pad layer 1, a first liquid metal layer 2 disposed on one side of the graphene thermal pad layer 1, and a second liquid metal layer 3 disposed on the other side of the graphene thermal pad layer 1.

[0020] Specifically, in this structure, although the liquid metal has a relatively high surface tension, it exhibits excellent wettability on the graphene thermal pad surface, allowing it to spread well on both sides of the graphene thermal pad. In practical applications, this composite thermal pad can be used in contact with high-power chips or within chip packaging structures. The combination of the high thermal conductivity of the graphene thermal pad layer 1 and the good wettability of the liquid metal significantly improves heat transfer efficiency. Simultaneously, the inclusion of the first liquid metal layer 2 and the second liquid metal layer 3 further enhances the thermal conductivity between the pad and the contact surface, reducing interfacial thermal resistance.

[0021] In this embodiment, the first liquid metal layer 2 is surrounded by a first foam dam 4, and one end of the first foam dam 4 is connected to the graphene thermal pad layer 1, so that the first liquid metal will not overflow from between the first foam dam 4 and the graphene thermal pad layer 1.

[0022] Specifically, the first foam dam 4 not only effectively prevents the liquid metal of the first liquid metal layer 2 from overflowing and contaminating electronic components, but also provides the gasket with a certain degree of compressibility, allowing it to better adapt to uneven contact surfaces and further improve heat dissipation. Furthermore, the material and structural design of the first foam dam 4 ensures that it maintains a stable shape during use and does not negatively impact the thermal conductivity of the gasket.

[0023] In this embodiment, the second liquid metal layer 3 is surrounded by a second foam dam 5, and one end of the second foam dam 5 is connected to the graphene thermal pad layer 1, so that the second liquid metal will not overflow from between the second foam dam 5 and the graphene thermal pad layer 1.

[0024] Specifically, the second foam dam 5 is designed on the same principle as the first foam dam 4, which is to prevent the liquid metal from overflowing and to provide compressibility to accommodate uneven contact surfaces. Furthermore, the second foam dam 5 further enhances the structural stability of the gasket, ensuring that the liquid metal layer is not damaged by external factors during prolonged use, thereby maintaining the gasket's long-lasting thermal conductivity.

[0025] In this embodiment, the thickness of the first foam dam 4 is greater than or equal to the thickness of the first liquid metal, etc.

[0026] The thickness of the second foam dam 5 is greater than or equal to the thickness of the second liquid metal, etc.

[0027] Specifically, the above design ensures that the foam dam effectively encapsulates the liquid metal layer, preventing leakage during use, while also guaranteeing the overall flatness and compressibility of the gasket. By precisely controlling the thickness of the foam dam, the thermal conductivity and adaptability of the gasket to different contact surfaces can be further optimized.

[0028] In this embodiment, the thickness of the graphene thermal pad layer 1 is 0.2 to 1.0 mm.

[0029] Specifically, the thickness of the graphene thermal conductive pad layer 1 can be 0.2mm, 0.5mm, 1.0mm, etc. By selecting an appropriate thickness, the thermal conductivity can be guaranteed while also taking into account the flexibility and compressibility of the pad, making it better adaptable to various complex application scenarios. In addition, the graphene thermal conductive pad layer 1 within this thickness range can also reduce the weight of the pad while ensuring strength, meeting the requirements of lightweight design.

[0030] In this embodiment, the thickness of the first liquid metal layer 2 and the second liquid metal layer 3 is 0.03 to 0.1 mm.

[0031] Specifically, the thicknesses of the first liquid metal layer 2 and the second liquid metal layer 3 can be 0.03 mm, 0.06 mm, 0.1 mm, etc. By precisely controlling the thickness of the liquid metal layer, good wettability and thermal conductivity can be ensured while avoiding the adverse effects of an excessively thick liquid metal layer on the overall thermal conductivity and structural stability of the gasket. Furthermore, liquid metal layers within this thickness range can minimize the gasket's volume while maintaining thermal conductivity, meeting the requirements of compact design.

[0032] In this embodiment, the width of the first foam dam 4 or the second foam dam 5 is 2.5 to 3 mm, and the thickness of the first foam dam 4 or the second foam dam 5 is 0.15 mm.

[0033] Specifically, the width of the first foam dam 4 or the second foam dam 5 can be 2.5mm, 2.7mm, 3mm, etc. The design of the thickness and width of the above materials ensures that the foam dam can effectively prevent the leakage of liquid metal, and also ensures that the foam dam has a certain strength and stability, and will not deform or be damaged during long-term use. By rationally designing the width and thickness of the foam dam, the thermal conductivity and structural stability of the gasket can be further optimized, enabling it to exhibit excellent heat dissipation performance in various complex application environments.

[0034] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above descriptions are merely specific embodiments of this utility model and are not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A composite thermally conductive pad, characterized in that: It includes a graphene thermal pad layer (1), a first liquid metal layer (2) is provided on one side of the graphene thermal pad layer (1), and a second liquid metal layer (3) is provided on the other side of the graphene thermal pad layer (1).

2. The composite thermally conductive pad as described in claim 1, characterized in that: The first liquid metal layer (2) is surrounded by a first foam dam (4), one end of which is connected to the graphene thermal pad layer (1), so that the first liquid metal will not overflow from between the first foam dam (4) and the graphene thermal pad layer (1).

3. The composite thermally conductive pad as described in claim 2, characterized in that: The second liquid metal layer (3) is surrounded by a second foam dam (5), one end of which is connected to the graphene thermal pad layer (1), so that the second liquid metal will not overflow from between the second foam dam (5) and the graphene thermal pad layer (1).

4. The composite thermally conductive pad as described in claim 3, characterized in that: The thickness of the first foam dam (4) is greater than or equal to the thickness of the first liquid metal; The thickness of the second foam dam (5) is greater than or equal to the thickness of the second liquid metal.

5. The composite thermal pad as described in claim 1, characterized in that: The thickness of the graphene thermal pad layer (1) is 0.2~1.0 mm.

6. The composite thermally conductive pad as described in claim 3, characterized in that: The thickness of the first liquid metal layer (2) and the second liquid metal layer (3) is 0.03~0.1mm.

7. The composite thermally conductive pad as described in claim 6, characterized in that: The width of the first foam dam (4) or the second foam dam (5) is 2.5 to 3 mm, and the thickness of the first foam dam (4) or the second foam dam (5) is 0.15 mm.

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