ETSSOP20-10L lead frame and power module

Abstract

The application provides an ETSSOP20-10L lead frame and a power module. The middle part of the packaging unit of the lead frame has a base island. One side has a first pin, a second pin, a third pin, a fourth pin, a fifth pin and a sixth pin. The other side has a seventh pin, an eighth pin, a ninth pin and a tenth pin. The seventh pin, the eighth pin and the ninth pin are connected to the base island, and the remaining pins are arranged at intervals from the base island. The width of the seventh pin, the eighth pin and the ninth pin is greater than the width of the remaining pins. The distance between the first pin and the second pin, the distance between the fifth pin and the sixth pin and the distance between the tenth pin and the ninth pin are all greater than the distance between the remaining adjacent pins. The power module is packaged by the ETSSOP20-10L lead frame. The scheme of the application omits and widens some pins, meets the application requirements and ensures the heat dissipation effect, and reasonably arranges the position relationship between the base island and the specific pins to meet the dielectric requirements.

Description

Technical Field

[0001] This application relates to the field of semiconductor device packaging technology, specifically to an ETSSOP20-10L lead frame and power module. Background Technology

[0002] Traditional power devices are discrete components, which have disadvantages such as large size when mounted on circuit boards. With the increasing demand for miniaturization in the electronics industry, integrating multifunctional small-size devices has become a key challenge. Currently, given the market demand for integrated driver ICs and MOS chips, designing a framework that meets these requirements and offers high compatibility and performance within a limited package size is a pressing technical problem. Existing solutions that integrate driver ICs and MOS chips within the same framework suffer from drawbacks such as unsatisfactory structural stability, inadequate heat dissipation, and inability to meet specified pin dielectric requirements, necessitating improvements. Utility Model Content

[0003] To address the shortcomings of the aforementioned prior art, this application provides an ETSSOP20-10L lead frame and power module, which omits and widens some pins to meet application requirements and ensure heat dissipation, and rationally arranges the positional relationship between the base island and specific pins to meet dielectric requirements.

[0004] To achieve the above objectives, the present invention employs the following technology:

[0005] An ETSSOP20-10L lead frame includes packaging units arrayed in the frame body. The packaging unit has a base island in the middle, six pins on one side and four pins on the other side. The base island is connected to three of the pins on the other side, and the remaining pins on both sides are spaced apart from the base island. The width of the three pins connected to the base island is greater than the width of the remaining pins.

[0006] Furthermore, the packaging unit has a first pin, a second pin, a third pin, a fourth pin, a fifth pin, and a sixth pin on one side, and a seventh pin, an eighth pin, a ninth pin, and a tenth pin on the other side. The first pin and the tenth pin are opposite each other, and the seventh pin, the eighth pin, and the ninth pin are connected to the base island.

[0007] Furthermore, the spacing between the first and second pins, the spacing between the fifth and sixth pins, and the spacing between the tenth and ninth pins are all greater than the spacing between the other adjacent pins.

[0008] Furthermore, the seventh, eighth, and ninth pins are provided with locking holes.

[0009] Furthermore, the two ends of the base island are connected to the main frame structure by reinforcing bars.

[0010] Furthermore, multiple locking seams are formed on the base island, with the seams recessed from both sides of the connecting rib towards the interior of the base island. The locking seams have an arc-shaped concave structure.

[0011] Furthermore, the base island has a rectangular structure arranged along the length of the package unit, and its apex corner adjacent to the tenth pin is recessed.

[0012] A power module includes an injection molded body and the ETSSOP20-10L lead frame encapsulated within the injection molded body, wherein a driver IC chip and a MOS chip are bonded together at intervals on a first base island.

[0013] The beneficial effects of this utility model are as follows:

[0014] 1. Some pins are omitted or widened to meet application requirements and ensure heat dissipation. The base island is arranged reasonably and the top corner of the base island is recessed to adjust the spacing with the tenth pin, thereby meeting the dielectric requirements of the tenth pin.

[0015] 2. By defaulting on the pins, the number of pins that need to be tested can be reduced, and it is also easier to install when adapting to downstream applications.

[0016] 3. The design of the locking hole and locking blade can improve the locking ability of the widened pins and base island, thereby preventing the risk of delamination and improving the stability of the package. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the packaging unit structure according to an embodiment of this application.

[0018] Figure 2 This is a partial schematic diagram of the overall structure of the lead frame according to an embodiment of this application. Detailed Implementation

[0019] To make the objectives, technical solutions and advantages of the present utility model clearer, the implementation methods of the present utility model will be described in detail below with reference to the accompanying drawings. However, the embodiments described in the present utility model are only some embodiments of the present utility model, and not all embodiments.

[0020] This application provides an ETSSOP20-10L lead frame, including packaging units 2 arrayed on the frame body 1, specifically as follows: Figure 2 As shown, it includes multiple rows and columns arranged in a rectangular array.

[0021] like Figure 1As shown, the packaging unit 2 has a base island 3 in the middle, with six pins on one side and four pins on the other side. The base island 3 is connected to three of the pins on the other side, and the remaining pins on both sides are spaced apart from the base island 3. The width of the three pins connected to the base island 3 is greater than the width of the remaining pins.

[0022] Specifically, package unit 2 has a first pin A1, a second pin A2, a third pin A3, a fourth pin A4, a fifth pin A5, and a sixth pin A6 on one side, and a seventh pin A7, an eighth pin A8, a ninth pin A9, and a tenth pin A10 on the other side. The first pin A1 and the tenth pin A10 are opposite each other. The seventh pin A7, the eighth pin A8, and the ninth pin A9 are connected to the base island 3, and their widths are all greater than the widths of the other pins. That is, the pins on one side have been widened, thereby providing a larger heat flow channel for better heat dissipation.

[0023] The spacing between the first pin A1 and the second pin A2, the spacing between the fifth pin A5 and the sixth pin A6, and the spacing between the tenth pin A10 and the ninth pin A9 are all greater than the spacing between the other adjacent pins. This means that some unnecessary pins are omitted on each side, which makes the product formed by the package better adaptable to the needs of downstream applications and also reduces the number of pins that need to be tested in the package.

[0024] Pin 7 (A7), pin 8 (A8), and pin 9 (A9) are provided with locking holes 4 to improve the locking ability of these widened pins during packaging and enhance structural stability.

[0025] The base island 3 is connected to the frame body 1 at both ends by connecting ribs 5 to improve the structural stability of the base island 3. Preferably, in order to improve the adhesive locking ability of the base island 3 during encapsulation and prevent the risk of delamination, multiple adhesive locking slits 6 are formed on the base island 3, which are recessed into the base island 3 from both sides of the connecting ribs 5. Figure 1 As shown, the adhesive-locking blade 6 has an arc-shaped concave structure. More preferably, another adhesive-locking blade 6 is formed by recessing from the side of the ninth pin A9 near the tenth pin A10 into the base island 3, further improving the adhesive-locking capability of the base island 3 from more points.

[0026] The first pin A1, the sixth pin A6, and the tenth pin A10 extend along the width direction of the packaging unit 2 toward the base island 3, and then extend along the length direction of the packaging unit 2 toward the middle of the base island 3. This is to shorten the lead span when these pins are bonded to the chip on the base island 3, so as to avoid the risk of collapse caused by excessive span.

[0027] The base island 3 has a rectangular structure arranged along the length of the packaging unit 2, which facilitates the placement of the driver IC chip and the MOS chip along the length direction, so that the two chips have sufficient space for layout and can be easily bonded to adjacent pins. Preferably, the top corner of the base island 3 adjacent to the tenth pin A10 is recessed, thereby increasing the distance between the base island 3 and the tenth pin A10, so that the dielectric requirements of the tenth pin A10 are met. Specifically, the recessed top corner can be adjusted to adapt the design.

[0028] This application also provides a power module, including an injection-molded body and the ETSSOP20-10L lead frame described in the previous embodiment encapsulated within the injection-molded body. A driver IC chip and a MOS chip are bonded at intervals on the first base island 21. The driver IC chip can be arranged on the left side and the MOS chip on the right side. The driver IC chip is connected to the first pin A1, the second pin A2, the third pin A3, the fourth pin A4, the fifth pin A5, and the tenth pin A10 via wire bonding. The MOS chip is bonded to the base island 3 and connected to the sixth pin A6, so that the large amount of heat generated by the MOS chip is closer to the three widened pins, which is beneficial for heat dissipation.

[0029] The above description is only a preferred embodiment of this application and is not intended to limit this application. Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application.

Claims

1. An ETSSOP20-10L lead frame, comprising packaging units (2) arrayed on a frame body (1), characterized in that: The packaging unit (2) has a base island (3) in the middle, six pins on one side and four pins on the other side. The base island (3) is connected to three of the pins on the other side, and the remaining pins on both sides are spaced apart from the base island (3). The width of the three pins connected to the base island (3) is greater than the width of the remaining pins. The packaging unit (2) has a first pin (A1), a second pin (A2), a third pin (A3), a fourth pin (A4), a fifth pin (A5), and a sixth pin (A6) on one side, and a seventh pin (A7), an eighth pin (A8), a ninth pin (A9), and a tenth pin (A10) on the other side. The first pin (A1) and the tenth pin (A10) are opposite each other, and the seventh pin (A7), the eighth pin (A8), and the ninth pin (A9) are connected to the base island (3). The spacing between the first pin (A1) and the second pin (A2), the spacing between the fifth pin (A5) and the sixth pin (A6), and the spacing between the tenth pin (A10) and the ninth pin (A9) are all greater than the spacing between the other adjacent pins. The base island (3) is a rectangular structure arranged along the length of the package unit (2), and its apex corner adjacent to the tenth pin (A10) is recessed.

2. The ETSSOP20-10L lead frame according to claim 1, characterized in that, Locking holes (4) are provided on the seventh pin (A7), the eighth pin (A8), and the ninth pin (A9).

3. The ETSSOP20-10L lead frame according to claim 1, characterized in that, The two ends of the base island (3) are connected to the main frame (1) by connecting ribs (5).

4. The ETSSOP20-10L lead frame according to claim 3, characterized in that, Multiple locking cuts (6) are formed on the base island (3). The locking cuts (6) are formed by recessing from both sides of the connecting rib (5) into the base island (3).

5. The ETSSOP20-10L lead frame according to claim 4, characterized in that, There is also a locking blade (6) formed from the side of the ninth pin (A9) near the tenth pin (A10) into the base island (3).

6. The ETSSOP20-10L lead frame according to claim 1, characterized in that, The first pin (A1), the sixth pin (A6), and the tenth pin (A10) extend along the width direction of the packaging unit (2) toward the base island (3) and then extend along the length direction of the packaging unit (2) toward the middle of the base island (3).

7. A power module, characterized in that, The device includes an injection molded body and an ETSSOP20-10L lead frame as described in any one of claims 1-6 encapsulated within the injection molded body. A driver IC chip and a MOS chip are bonded together at intervals on the first base island (21).

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