A sand belt structure

Abstract

This utility model discloses an abrasive belt structure, comprising a substrate and an abrasive layer disposed on the substrate. The substrate is a metal wire mesh substrate, which includes a plurality of warp metal wires and a plurality of weft metal wires. The weft metal wires are arranged sequentially at intervals along the warp direction, and the warp metal wires are arranged sequentially along the weft direction and interwoven with each other. The diameter of the weft metal wires is larger than the diameter of the warp metal wires. In this utility model, the substrate is a metal wire mesh substrate, formed by the interweaving of warp and weft metal wires. The diameter of the weft metal wires is larger than the diameter of the warp metal wires, and the warp density is greater than the weft density, allowing for a densely woven metal mesh with high tensile strength and low elongation, meeting the requirements for long-term, high-volume grinding applications.

Description

Technical Field

[0001] This utility model relates to the field of coated abrasive technology, and in particular to an abrasive belt structure. Background Technology

[0002] Abrasives are tools used for grinding, lapping, and polishing. They consist of abrasive grains, a binder, and a substrate. Specifically, the abrasive grains are adhered to the substrate using a binder. Abrasive belts belong to the category of coated abrasives, also known as flexible abrasives. To meet specific requirements, the substrate of abrasive belts needs to have high strength, good toughness, and low elongation. Commonly used substrates include paper, plastic film, inorganic fiber cloth, mesh cloth, and non-woven fabric. However, these substrates generally have low strength and high elongation, making them unsuitable for long-duration, high-volume grinding operations. Therefore, a new abrasive belt structure is urgently needed to address these issues. Utility Model Content

[0003] To address the aforementioned problems, this utility model provides an abrasive belt structure, comprising a substrate and an abrasive layer disposed on the substrate. The substrate is a metal wire mesh substrate, which includes a plurality of warp metal wires and a plurality of weft metal wires. The weft metal wires are arranged sequentially at intervals along the warp direction, and the warp metal wires are arranged sequentially along the weft direction and interwoven with each of the weft metal wires. The diameter of the weft metal wires is larger than the diameter of the warp metal wires.

[0004] Furthermore, the arrangement density of the warp wires is greater than that of the weft wires.

[0005] Furthermore, the metal wire mesh substrate includes a first substrate segment and a second substrate segment, the first substrate segment and the second substrate segment are adjacent to each other, the weaving density of the first substrate segment is greater than the weaving density of the second substrate segment, and an abrasive layer is provided on the first substrate segment and the second substrate segment respectively.

[0006] Furthermore, the abrasive particle size of the abrasive layer on the first substrate segment is smaller than that of the abrasive particle size of the abrasive layer on the second substrate segment.

[0007] Furthermore, an abrasive layer is provided on both surfaces of the metal wire mesh substrate.

[0008] Furthermore, the surfaces of the warp and weft metal wires facing the abrasive layer are rough surfaces with roughness.

[0009] Furthermore, the diameter of each of the warp wires is 0.01-0.2 mm, and the diameter of each of the weft wires is 0.02-0.4 mm.

[0010] Furthermore, the abrasive layer includes several abrasive units, with each pair of adjacent abrasive units spaced apart to form a chip removal groove.

[0011] Furthermore, the abrasive unit is a hexagonal unit, a circular unit, a triangular unit, or a cross-shaped unit.

[0012] Furthermore, the thickness of the abrasive layer is 400-1000 µm.

[0013] By adopting the above technical solution, this utility model has the following beneficial effects compared with the prior art:

[0014] 1) The abrasive belt structure provided by this utility model has a metal wire mesh matrix, which is formed by interweaving warp and weft metal wire mesh. The diameter of the weft metal wire is larger than that of the warp metal wire, which can be densely woven into a metal wire mesh. It has high tensile strength and low elongation, which can meet the needs of long-term and high-volume grinding.

[0015] 2) The abrasive belt structure provided by this utility model can be provided with two abrasive layers with different abrasive particle sizes on the metal wire mesh substrate, which can perform different degrees of grinding on the workpiece to meet different grinding needs. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A schematic diagram of the abrasive belt structure provided by this utility model;

[0018] Figure 2 This is a schematic diagram of the matrix structure in the abrasive belt structure provided by this utility model;

[0019] Figure 3 This is a side view of the substrate in the sand belt structure provided by this utility model.

[0020] 1-Substrate; 11-Warp wire; 12-Weft wire; 13-Opening; 2-Abrasive layer; 21-Abrasive unit; 22-First chip removal groove; 23-Second chip removal groove. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model. In the accompanying drawings, the dimensions and relative dimensions of certain parts may be enlarged for clarity.

[0022] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connection" and "connected" should be interpreted broadly. For example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0023] In the description of this utility model, the terms "upper", "lower", "left", "right", "front", "back", "center", "horizontal", "vertical", "top", "bottom", "inner", and "outer" are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] Furthermore, in the description of this utility model, the terms "first" and "second" are used merely for descriptive distinction and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Additionally, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0025] As per the instruction manual Figure 1 and 2 As shown, this utility model provides an abrasive belt structure, including a substrate 1 and an abrasive layer 2 disposed on the substrate 1. The substrate 1 is a metal wire mesh substrate, which includes a plurality of warp metal wires 11 and a plurality of weft metal wires 12. The weft metal wires 12 are arranged sequentially at intervals along the warp direction, and the warp metal wires 11 are arranged sequentially along the weft direction and interwoven with the weft metal wires 12. The diameter of the weft metal wires 12 is larger than the diameter of the warp metal wires 11.

[0026] Specifically, the substrate is a metal wire mesh substrate, which has high tensile strength and low elongation, meeting the requirements for long-term, high-volume grinding. The abrasive layer is set on the metal wire mesh substrate and is used to grind the workpiece. The abrasive in the abrasive layer can be diamond abrasive. The warp wires 11 and weft wires 12 can be stainless steel wire, preferably 201, 304, or 316 stainless steel wire. The diameter of the weft wire 12 is larger than the diameter of the warp wire 11. Adjacent weft wires 12 are spaced apart, and adjacent warp wires 11 are bonded together. A relatively dense metal wire mesh can be formed by weaving. The aperture of this metal wire mesh is much smaller than that of traditional cloth substrates, and adhesive can be directly applied to the metal wire mesh to make grinding tools or abrasive belts.

[0027] Optimized implementation methods, as shown in the appendix to the instruction manual. Figure 2 As shown, the arrangement density of the warp wires 11 in the wire matrix is ​​greater than the arrangement density of the weft wires 12, that is, the number of warp wires 11 per unit area is greater than the number of weft wires 12. (See attached specification.) Figure 3 As shown, an opening 13 is formed between two adjacent warp wires 11 and weft wires 12. The opening 13 is a wedge-shaped hole with a small diameter. When planting sand, there is no need to block the wedge-shaped hole of the wire mesh, and the abrasive layer 2 can be directly set on the wire mesh substrate.

[0028] As one specific implementation, the weaving density is the same in all parts of the metal wire mesh substrate, and the abrasive layer 2 on the metal wire mesh substrate uses abrasive with the same particle size. The abrasive particle size can be set according to requirements to meet grinding needs.

[0029] As one specific implementation, the wire mesh substrate can be made with different weaving densities, resulting in wire mesh substrates with varying weaving densities. A higher density weaving structure makes the mesh tighter, providing stronger tensile and tear resistance, making it suitable for environments with high mechanical stress or frequent friction. Simultaneously, the tight weaving reduces the risk of mesh deformation, ensuring the wire mesh substrate remains undeformed and meeting diverse application requirements. Preferably, the wire mesh substrate has two sections with different weaving densities, specifically including a first substrate section and a second substrate section. The second substrate section is adjacent to and connected to the first substrate section. The weaving density of the first substrate section is greater than that of the second substrate section. Abrasive layers are respectively provided on the first and second substrate sections. The first and second substrate sections can meet different grinding requirements, extending the service life of the abrasive belt. A higher weaving density in the first substrate section can be achieved by reducing the diameter of the warp and weft wires, or by increasing the number of warp and weft wires.

[0030] To further improve grinding efficiency, the abrasive grain size of the abrasive layer 2 on the first substrate section is smaller than that of the abrasive grain size of the abrasive layer 2 on the second substrate section. That is, fine-grained abrasive is set on the first substrate section to meet the fine grinding requirements of the workpiece, and coarse-grained abrasive is set on the second substrate section to meet the rough grinding requirements of the workpiece. By setting abrasives of different grain sizes on the substrate, the rough grinding and fine grinding requirements of the workpiece can be met, eliminating the need for frequent belt replacement and improving grinding efficiency and grinding quality.

[0031] In some embodiments, an abrasive layer 2 is provided on both surfaces of the metal wire mesh substrate, and both sides of the metal wire mesh substrate can be used for grinding of workpieces, which can save the consumption of the metal wire mesh substrate and save costs.

[0032] To improve the adhesion reliability of the abrasive, the surface of the metal wire mesh substrate on which the abrasive layer is located is roughened, that is, the warp and weft wires are roughened to obtain a rough surface with roughness. After the abrasive adheres to the rough surface of the metal wire mesh substrate, the adhesion reliability of the abrasive can be improved, thus improving the quality of the abrasive belt.

[0033] In the optimized implementation, the diameter of each warp wire 11 is 0.01-0.2 mm, and the diameter of each weft wire 12 is 0.02-0.4 mm. The weft wire 12 has a larger diameter, and each weft wire 12 can serve as the skeleton base of the wire mesh. The warp wires 11 are interlaced on the skeleton base to obtain the wire mesh matrix.

[0034] In an optimized implementation, the abrasive layer 2 includes several abrasive units 21. Each pair of adjacent abrasive units 21 is spaced apart to form a chip removal groove. The chip removal groove between the abrasive units 21 facilitates the discharge of abrasive materials generated during the grinding process, ensuring the normal operation of the abrasive belt.

[0035] Specifically, see the instruction manual. Figure 1 As shown, the abrasive belt has multiple first chip removal grooves 22 arranged on its side opposite to the abrasive layer 2. The multiple first chip removal grooves 22 are evenly spaced along the warp direction of the abrasive layer 2 and divide the abrasive layer 2 into multiple abrasive strips. Each abrasive strip is divided into multiple abrasive units 21 by multiple second chip removal grooves 23. The first chip removal grooves 22 are arranged along the weft direction, and the second chip removal grooves 23 are arranged along the warp direction. The first chip removal grooves 22 and the second chip removal grooves 23 are arranged between the abrasive units 21 to ensure that the generated abrasive material can be smoothly discharged and to ensure the normal grinding of the abrasive belt.

[0036] Preferably, the abrasive unit 21 is a hexagonal unit, a circular unit, a triangular unit, or a cross-shaped unit. The shape of the abrasive unit 21 can be set as needed to meet different grinding requirements.

[0037] Preferably, the width of the first chip removal groove 22 is greater than the width of the second chip removal groove 23. The second chip removal groove is connected to the first chip removal groove, which can improve the chip removal efficiency. Under the premise of ensuring the chip removal effect, the area of ​​the abrasive unit is larger, thus ensuring the grinding effect.

[0038] In the optimized implementation, the thickness of the metal wire mesh substrate is 0.2-1 mm, the thickness of the abrasive layer 2 is 400-1000 µm, and the abrasive is bonded to the metal wire mesh substrate by an adhesive.

[0039] In this embodiment, the abrasive unit 21 is described as a hexagonal unit. Preferably, the abrasive unit 21 is a regular hexagonal unit. The abrasive and adhesive are mixed evenly and then bonded to the metal wire mesh substrate to obtain the abrasive belt. The preparation process of the abrasive belt is as follows:

[0040] S1, Prepare a metal wire mesh substrate and prepare a corresponding wire mesh frame according to the pattern of the abrasive layer 2;

[0041] S2, Mix the abrasive and adhesive evenly and set aside; the adhesive is preferably glue;

[0042] S3, place the abrasive and adhesive prepared in S2 on the screen frame, and apply it by scraping with a scraper. The abrasive is transferred to the metal screen substrate through the pattern of the screen frame. Remove the screen frame to obtain the semi-finished product.

[0043] S4. Place the semi-finished product obtained in S3 into a drying oven for drying. After the adhesive has fully cured, the sanding belt roll is obtained.

[0044] S5, the sanding belt roll is made into sanding belts of different specifications according to the required size by using the field joint.

[0045] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0046] Those skilled in the art will understand that this invention can be implemented in many other specific forms without departing from the spirit and scope of this invention. Although embodiments of this invention have been described, it should be understood that this invention is not limited to these embodiments, and those skilled in the art can make changes and modifications within the spirit and scope of this invention as defined in the appended claims.

Claims

1. A belt structure comprising a base and an abrasive layer provided on the base, characterized in that, The substrate is a metal wire mesh substrate, which includes a plurality of warp metal wires and a plurality of weft metal wires. The weft metal wires are arranged sequentially at intervals along the warp direction, and the warp metal wires are arranged sequentially along the weft direction and interwoven with each other. The diameter of the weft metal wires is larger than the diameter of the warp metal wires.

2. The sand belt structure according to claim 1, characterized in that, The arrangement density of the warp wires is greater than that of the weft wires.

3. The sand belt structure according to claim 1, characterized in that, The metal wire mesh substrate includes a first substrate segment and a second substrate segment, which are adjacent to each other. The weaving density of the first substrate segment is greater than that of the second substrate segment, and an abrasive layer is provided on the first substrate segment and the second substrate segment respectively.

4. The sand belt structure according to claim 3, characterized in that, The abrasive particle size of the abrasive layer on the first substrate segment is smaller than that of the abrasive particle size of the abrasive layer on the second substrate segment.

5. The sand belt structure according to claim 1, characterized in that, An abrasive layer is provided on both surfaces of the metal wire mesh substrate.

6. The sand belt structure according to claim 1, characterized in that, The surfaces of the warp and weft metal wires facing the abrasive layer are rough surfaces with a roughness.

7. The sand belt structure according to claim 1, characterized in that, The diameter of each of the warp wires is 0.01-0.2 mm, and the diameter of each of the weft wires is 0.02-0.4 mm.

8. The sand belt structure according to claim 1, characterized in that, The abrasive layer includes several abrasive units, with each pair of adjacent abrasive units spaced apart to form a chip removal groove.

9. The sand belt structure according to claim 8, characterized in that, The abrasive unit can be a hexagonal unit, a circular unit, a triangular unit, or a cross-shaped unit.

10. The abrasive belt structure according to claim 1, characterized in that, The thickness of the abrasive layer is 400-1000 µm.

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