Silicon wafer sorting system and electronic device

Abstract

This disclosure relates to a silicon wafer sorting system and electronic device. The system includes: a feeding module, a detection module, a sorting module, a first conveying component, and a second conveying component. The feeding module, the detection module, and the sorting module are sequentially connected via the first conveying component. The detection module is also connected to the sorting module via the second conveying component. The feeding module is used to transfer a target silicon wafer to be detected to the detection module via the first conveying component. The detection module is used to transfer the normal silicon wafer to the sorting module via the first conveying component if the target silicon wafer is determined to be a normal silicon wafer; or, if the target silicon wafer is determined to be an abnormal silicon wafer, transfer the abnormal silicon wafer to the sorting module via the second conveying component.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and more specifically, to a silicon wafer sorting system and electronic device. Background Technology

[0002] Silicon wafers are the fundamental material in the semiconductor field, on which various circuit components can be fabricated. To ensure the performance and quality of silicon wafers, sorting equipment is typically used to inspect and sort them.

[0003] However, current sorting equipment has a low level of automation and low sorting efficiency for silicon wafers, which does not meet the needs of sorting large quantities of silicon wafers. Utility Model Content

[0004] To address the aforementioned problems, this disclosure provides a silicon wafer sorting system and electronic device.

[0005] According to a first aspect of the present disclosure, a silicon wafer sorting system is provided. The system includes: a feeding module, a detection module, a sorting module, a first conveying component, and a second conveying component; the feeding module, the detection module, and the sorting module are sequentially connected via the first conveying component; the detection module is also connected to the sorting module via the second conveying component; the feeding module is used to transfer a target silicon wafer to be detected to the detection module via the first conveying component; the detection module is used to, if it determines that the target silicon wafer is a normal silicon wafer, transfer the normal silicon wafer to the sorting module via the first conveying component; or, if it determines that the target silicon wafer is an abnormal silicon wafer, transfer the abnormal silicon wafer to the sorting module via the second conveying component.

[0006] Optionally, the detection module includes multiple detection components; the multiple detection components are connected sequentially through the first transport component, and each detection component is also connected to the sorting module through the second transport component; the detection module is used to sequentially detect multiple indicators to be detected on the target silicon wafer through the multiple detection components.

[0007] Optionally, the plurality of detection components includes at least one of a thickness detection component, a flatness detection component, a crack detection component, a dirt detection component, a dimensional information detection component, and a warpage detection component.

[0008] Optionally, the thickness detection component includes a thickness detector and a first controller connected to the thickness detector; the thickness detector is used to detect the thickness of the target silicon wafer; the first controller is used to transfer the normal silicon wafer to the flatness detection component via the first transport component if the target silicon wafer is determined to be a normal silicon wafer based on the thickness detection result; or, if the target silicon wafer is determined to be an abnormal silicon wafer based on the thickness detection result, transfer the abnormal silicon wafer to the sorting module via the second transport component.

[0009] Optionally, the flatness detection component includes a first laser emitting device and a second controller connected to the first laser emitting device; the first laser emitting device is used to detect the surface flatness of the target silicon wafer; the second controller is used to transfer the normal silicon wafer to the crack detection component via the first transport component if the target silicon wafer is determined to be a normal silicon wafer based on the surface flatness detection result; or, if the target silicon wafer is determined to be an abnormal silicon wafer based on the surface flatness detection result, transfer the abnormal silicon wafer to the sorting module via the second transport component.

[0010] Optionally, the crack detection component includes an infrared emitting device and a third controller connected to the infrared emitting device; the infrared emitting device is used to detect hidden cracks in the target silicon wafer; the third controller is used to, if the target silicon wafer is determined to be a normal silicon wafer based on the hidden crack detection result, transfer the normal silicon wafer to the dirtiness detection component via the first transport component; or, if the target silicon wafer is determined to be an abnormal silicon wafer based on the hidden crack detection result, transfer the abnormal silicon wafer to the sorting module via the second transport component.

[0011] Optionally, the contamination detection component includes an LED array and a fourth controller connected to the LED array; the LED array is used to detect the contamination level of the target silicon wafer; the fourth controller is used to transfer the normal silicon wafer to the size information detection component via the first transport component if the target silicon wafer is determined to be a normal silicon wafer based on the contamination detection result; or, if the target silicon wafer is determined to be an abnormal silicon wafer based on the contamination detection result, transfer the abnormal silicon wafer to the sorting module via the second transport component.

[0012] Optionally, the size information detection component includes a second laser emitting device and a fifth controller connected to the second laser emitting device; the second laser emitting device is used to detect the size information of the target silicon wafer; the size information detection component is used to transfer the normal silicon wafer to the warpage detection component via the first transport component if the size information detection result determines that the target silicon wafer is a normal silicon wafer; or, if the size information detection result determines that the target silicon wafer is an abnormal silicon wafer, the abnormal silicon wafer is transferred to the sorting module via the second transport component.

[0013] Optionally, the warpage detection component includes a third laser emitting device and a sixth controller connected to the third laser emitting device; the third laser emitting device is used to detect the warpage of the target silicon wafer; the sixth controller is used to, if the target silicon wafer is determined to be a normal silicon wafer based on the warpage detection result, transfer the normal silicon wafer to the sorting module via the first transport component; or, if the target silicon wafer is determined to be an abnormal silicon wafer based on the warpage detection result, transfer the abnormal silicon wafer to the sorting module via the second transport component.

[0014] According to a second aspect of the present disclosure, an electronic device is provided, including the silicon wafer sorting system described in the first aspect of the present disclosure.

[0015] The above technical solution enables the feeding module to transport the target silicon wafers to be inspected to the inspection module via a first conveying component. The inspection module then detects normal silicon wafers and transports them to the sorting module via the same first conveying component. Conversely, the inspection module detects abnormal silicon wafers and transports them to the sorting module via a second conveying component. By using different conveying components to transport normal and abnormal silicon wafers to the sorting module, the automation level of the equipment is improved. The subsequent sorting module then sorts the wafers from different conveying components, increasing the sorting efficiency and meeting the requirements for large-volume silicon wafer sorting.

[0016] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0018] Figure 1 This is a schematic diagram of a silicon wafer sorting system according to an exemplary embodiment.

[0019] Figure 2This is a schematic diagram illustrating the structure of another silicon wafer sorting system according to an exemplary embodiment.

[0020] Figure 3 This is a schematic diagram of another silicon wafer sorting system according to an exemplary embodiment.

[0021] Figure 4 This is a schematic diagram of another silicon wafer sorting system according to an exemplary embodiment.

[0022] Figure 5 This is a schematic diagram of another silicon wafer sorting system according to an exemplary embodiment.

[0023] Figure 6 This is a schematic diagram of another silicon wafer sorting system according to an exemplary embodiment.

[0024] Figure 7 This is a schematic diagram of another silicon wafer sorting system according to an exemplary embodiment.

[0025] Figure 8 This is a schematic diagram of another silicon wafer sorting system according to an exemplary embodiment.

[0026] Figure 9 This is a block diagram of an electronic device provided according to an exemplary embodiment of the present disclosure.

[0027] Explanation of reference numerals in the attached figures

[0028] 100-Silicon wafer sorting system; 101-Feeding module; 102-Detection module; 1021-Thickness detection component; 211-Thickness detector; 212-First controller; 1022-Flatness detection component; 221-First laser emitting device; 222-Second controller; 1023-Crack detection component; 231-Infrared emitting device; 232-Third controller; 1024-Dirtyness detection component; 241-LED array; 242-Fourth controller; 1025-Dimensional information detection component; 251-Second laser emitting device; 252-Fifth controller; 1026-Warp detection component; 261-Third laser emitting device; 262-Sixth controller; 103-Sorting module; S1-First conveying component; S2-Second conveying component; 900-Electronic equipment. Detailed Implementation

[0029] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0030] In the following description, the words "first" and "second" are used only to distinguish the purpose of the description and should not be interpreted as indicating or implying relative importance or order.

[0031] In related technologies, silicon wafers are the fundamental material in the semiconductor field, on which various circuit element structures can be fabricated. To ensure the performance and quality of silicon wafers, sorting equipment is typically used for inspection and sorting. However, current sorting equipment has a low degree of automation and low sorting efficiency, which does not meet the requirements for sorting large quantities of silicon wafers.

[0032] To address the aforementioned issues, this disclosure provides a silicon wafer sorting system. The system can transport target silicon wafers to be inspected via a feeding module to a detection module through a first conveying component. The detection module then detects normal silicon wafers within the target wafers and transports them to a sorting module via the first conveying component. Conversely, the detection module detects abnormal silicon wafers within the target wafers and transports them to the sorting module via a second conveying component. By transporting normal and abnormal silicon wafers to the sorting module via different conveying components, the automation level of the equipment can be improved. The subsequent sorting module sorts the silicon wafers from different conveying components, thereby increasing the sorting efficiency and meeting the requirements for sorting large quantities of silicon wafers.

[0033] The present disclosure will now be described in conjunction with specific embodiments.

[0034] Figure 1 This is a schematic diagram of the structure of a silicon wafer sorting system 100 according to an exemplary embodiment, as shown below. Figure 1 As shown, the silicon wafer sorting system 100 may include a feeding module 101, a detection module 102, a sorting module 103, a first conveying component S1, and a second conveying component S2. The feeding module 101, the detection module 102, and the sorting module 103 are sequentially connected via the first conveying component S1. The detection module 102 is also connected to the sorting module 103 via the second conveying component S2. The feeding module 101 is used to transfer the target silicon wafer to be detected to the detection module 102 via the first conveying component S1. The detection module 102 is used to transfer the normal silicon wafer to the sorting module 103 via the first conveying component S1 if the target silicon wafer is determined to be a normal silicon wafer; or, if the target silicon wafer is determined to be an abnormal silicon wafer, transfer the abnormal silicon wafer to the sorting module 103 via the second conveying component S2.

[0035] The first conveying component S1 can be a conveyor belt, which carries silicon wafers along the direction of the feeding module 101, the detection module 102, and the sorting module 103. The feeding module 101 can place the target silicon wafers on the first conveying component S1 according to a preset placement time. The width of the first conveying component S1 can be set according to the width of the target silicon wafer; for example, the width of the first conveying component S1 can be set to 1.5 times the width of the target silicon wafer. The second conveying component S2 is a conveyor belt arranged parallel to the first conveying component S1, and the width of the second conveying component S2 is not limited in this disclosure. The sorting module 103 receives normal silicon wafers transported by the first conveying component S1 and abnormal silicon wafers transported by the second conveying component S2, respectively, for grading and packaging the silicon wafers.

[0036] Using the above scheme, the target silicon wafers to be inspected can be transferred from the feeding module to the inspection module via the first conveying component. The inspection module then detects normal silicon wafers and transfers them to the sorting module via the first conveying component. Conversely, the inspection module detects abnormal silicon wafers and transfers them to the sorting module via the second conveying component. This method of transferring normal and abnormal silicon wafers to the sorting module via different conveying components improves the automation level of the equipment. The subsequent sorting module further improves the sorting efficiency by separating the silicon wafers from those transported via different components, thus meeting the requirements for sorting large quantities of silicon wafers.

[0037] In some embodiments, the detection module 102 may include a plurality of detection components, which are sequentially connected via the first transport component S1, and each detection component is also connected to the sorting module 103 via the second transport component S2; the detection module 102 is used to sequentially detect a plurality of test indicators of the target silicon wafer through the plurality of detection components.

[0038] For example, if a detection component determines that the target silicon wafer is a normal silicon wafer based on the detection result, the normal silicon wafer is transferred to the next detection component through the first transport component S1 for the next detection index to be detected. If any detection component determines that the target silicon wafer is an abnormal silicon wafer based on the detection result, the abnormal silicon wafer is directly transferred to the sorting module 103 through the second transport component S2 without the need for subsequent component detection. This can improve the sorting efficiency of silicon wafers and meet the sorting requirements of large batches of silicon wafers.

[0039] In some embodiments, such as Figure 2 As shown, the plurality of detection components may include at least one of the following: thickness detection component 1021, flatness detection component 1022, crack detection component 1023, dirtiness detection component 1024, dimensional information detection component 1025, and warpage detection component 1026.

[0040] For example, with Figure 2 For example, the thickness detection component 1021, the flatness detection component 1022, the crack detection component 1023, the dirt detection component 1024, the size information detection component 1025, and the warpage detection component 1026 are sequentially connected through the first transport component S1, and the thickness detection component 1021, the flatness detection component 1022, the crack detection component 1023, the dirt detection component 1024, the size information detection component 1025, and the warpage detection component 1026 are respectively connected to the sorting module 103 through the second transport component S2. The detection module 102 sequentially detects the thickness, surface flatness, hidden cracks, dirtiness, size information, and warpage of the target silicon wafer through the thickness detection component 1021, the flatness detection component 1022, the crack detection component 1023, the dirtiness detection component 1024, the size information detection component 1025, and the warpage detection component 1026.

[0041] In some embodiments, such as Figure 3 As shown, the thickness detection component 1021 may include a thickness detector 211 and a first controller 212 connected to the thickness detector 211.

[0042] The thickness detector 211 is used to detect the thickness of the target silicon wafer. For example, it can detect the thickness at multiple preset locations on the target silicon wafer using a capacitive coupling method, calculate the average thickness of the target silicon wafer, and obtain the thickness detection result. The first controller 212 is used to transfer the normal silicon wafer to the flatness detection component 1022 via the first transport component S1 when the thickness detection result determines that the target silicon wafer is a normal silicon wafer, for the next step of detecting the indicators to be detected; or, if the thickness detection result determines that the target silicon wafer is an abnormal silicon wafer, it is transferred to the sorting module 103 via the second transport component S2. In this way, target silicon wafers that do not meet the thickness standard are identified as abnormal silicon wafers and directly transferred to the sorting module for sorting without the need for subsequent component detection, which can improve the sorting efficiency of silicon wafers.

[0043] It should be noted that the capacitive coupling method and the method for calculating the average thickness can be found in existing technologies, and will not be elaborated here.

[0044] In some embodiments, such as Figure 4 As shown, the flatness detection component 1022 may include a first laser emitting device 221 and a second controller 222 connected to the first laser emitting device 221.

[0045] The first laser emitting device 221 is used to detect the surface flatness of the target silicon wafer. For example, the first laser emitting device 221 can emit a laser at a preset angle to acquire an image of the first silicon wafer, and calculate the silicon wafer line marks based on the image to obtain the surface flatness detection result of the target silicon wafer. The second controller 222 is used to, if the target silicon wafer is determined to be a normal silicon wafer based on the surface flatness detection result, transfer the normal silicon wafer to the crack detection component 1023 via the first transport component S1 for further detection of the target indicators; or, if the target silicon wafer is determined to be an abnormal silicon wafer based on the surface flatness detection result, transfer the abnormal silicon wafer to the sorting module 103 via the second transport component S2. In this way, target silicon wafers that do not meet the surface flatness standard are identified as abnormal silicon wafers and directly transferred to the sorting module for sorting without the need for subsequent component detection, which can improve the sorting efficiency of silicon wafers.

[0046] It should be noted that the calculation method for silicon wafer traces can refer to relevant methods in existing technologies, and will not be elaborated here.

[0047] In some embodiments, such as Figure 5 As shown, the crack detection component 1023 may include an infrared emitting device 231 and a third controller 232 connected to the infrared emitting device 231.

[0048] The infrared emitting device 231 is used to detect hidden cracks in the target silicon wafer. For example, infrared light can be emitted towards the target silicon wafer through the infrared emitting device 231 to detect microcracks and impurities, thus obtaining the hidden crack detection result. The third controller 232 is used to, if the target silicon wafer is determined to be a normal silicon wafer based on the hidden crack detection result, transfer the normal silicon wafer to the dirtiness detection component 1024 via the first transport component S1 for further detection of the target indicators; or, if the target silicon wafer is determined to be an abnormal silicon wafer based on the hidden crack detection result, transfer the abnormal silicon wafer to the sorting module 103 via the second transport component S2. In this way, target silicon wafers that do not meet the hidden crack standard are identified as abnormal silicon wafers and directly transferred to the sorting module for sorting without the need for subsequent component detection, thereby improving the silicon wafer sorting efficiency.

[0049] It should be noted that the calculation methods for microcracks and impurities can refer to relevant methods in the existing technology, which will not be elaborated here.

[0050] In some embodiments, such as Figure 6 As shown, the dirt detection component 1024 may include an LED (Light-Emitting Diode) array 241 and a fourth controller 242 connected to the LED array 241.

[0051] The LED array 241 is used to detect the dirtiness of the target silicon wafer. For example, the target silicon wafer can be illuminated by the LED array 241, and the grayscale differences in different areas of the target silicon wafer can be compared to obtain the dirtiness detection result. The fourth controller 242 is used to transfer the normal silicon wafer to the size information detection component 1025 via the first transport component S1 when the target silicon wafer is determined to be a normal silicon wafer based on the dirtiness detection result, so as to perform the next step of detection of the target index; or, if the target silicon wafer is determined to be an abnormal silicon wafer based on the dirtiness detection result, the abnormal silicon wafer is transferred to the sorting module 103 via the second transport component S2. In this way, the target silicon wafer that does not meet the dirtiness standard is identified as an abnormal silicon wafer and directly transferred to the sorting module for sorting without the need for subsequent component detection, which can improve the sorting efficiency of silicon wafers.

[0052] It should be noted that the comparison method for grayscale differences can refer to relevant methods in the existing technology, which will not be elaborated here.

[0053] In some embodiments, such as Figure 7 As shown, the size information detection component 1025 may include a second laser emitting device 251 and a fifth controller 252 connected to the second laser emitting device 251.

[0054] The second laser emitting device 251 is used to detect the size information of the target silicon wafer. For example, it can emit a laser to the target silicon wafer to obtain an image of the second silicon wafer, and determine the edge size information of the target silicon wafer based on the image to obtain the size information detection result of the target silicon wafer. The fifth controller 252 is used to transfer the normal silicon wafer to the warpage detection component 1026 via the first transport component S1 when the size information detection result determines that the target silicon wafer is a normal silicon wafer, so as to perform the next step of detecting the indicator to be detected; or, if the size information detection result determines that the target silicon wafer is an abnormal silicon wafer, it is transferred to the sorting module 103 via the second transport component S2. In this way, the target silicon wafer that does not meet the size information standard is identified as an abnormal silicon wafer and directly transferred to the sorting module for sorting without the need for subsequent component detection, which can improve the sorting efficiency of silicon wafers.

[0055] It should be noted that the method for determining edge size information can refer to relevant methods in the existing technology, which will not be elaborated here.

[0056] In some embodiments, such as Figure 8 As shown, the warpage detection component 1026 may include a third laser emitting device 261 and a sixth controller 262 connected to the third laser emitting device 261.

[0057] The third laser emitting device 261 is used to detect the warpage of the target silicon wafer. For example, the third laser emitting device 261 can emit a laser to the target silicon wafer to obtain a third image of the silicon wafer, and determine the warpage information of the target silicon wafer based on the third image to obtain the warpage detection result of the target silicon wafer. The sixth controller 262 is used to, when the target silicon wafer is determined to be a normal silicon wafer based on the warpage detection result, transmit the normal silicon wafer to the sorting module 103 through the first transport component S1 so that the sorting module 103 can sort the normal silicon wafer; or, when the target silicon wafer is determined to be an abnormal silicon wafer based on the warpage detection result, transmit the abnormal silicon wafer to the sorting module 103 through the second transport component S2 so that the sorting module 103 can sort the abnormal silicon wafer, thereby improving the sorting efficiency and accuracy of the silicon wafers.

[0058] It should be noted that the method for determining the warpage can refer to relevant methods in the existing technology, which will not be elaborated here.

[0059] The following is combined Figure 8 The silicon wafer sorting system 100 shown is described below. The working principle of the silicon wafer sorting system 100 is explained as follows:

[0060] First, when the target silicon wafer to be inspected needs to be sorted by the silicon wafer sorting system 100, the feeding module 101 receives the target silicon wafer and transfers it to the inspection module 102 through the first transport component S1.

[0061] Subsequently, after receiving the target silicon wafer, the detection module 102 sequentially detects the thickness, surface flatness, hidden cracks, dirtiness, size information, and warpage of the target silicon wafer through the thickness detection component 1021, flatness detection component 1022, crack detection component 1023, contamination detection component 1024, size information detection component 1025, and warpage detection component 1026. Specifically, the thickness of the target silicon wafer is first detected by the thickness detection component 1021. The thickness detector 211 detects the average thickness of the target silicon wafer using a capacitive coupling method, obtaining the thickness detection result. The first controller 212 then transmits normal silicon wafers with normal thickness detection results to the flatness detection component 1022 via the first transport component S1, while abnormal silicon wafers with abnormal thickness detection results are transmitted to the sorting module 103 via the second transport component S2. After receiving the target silicon wafer, the flatness detection component 1022 uses a first laser emitting device 221 to detect the line marks on the target silicon wafer, obtaining a surface flatness detection result. The second controller 222 then transmits normal silicon wafers with normal surface flatness detection results to the crack detection component 1023 via the first transport component S1, while transmitting abnormal silicon wafers with abnormal surface flatness detection results to the sorting module 103 via the second transport component S2. After receiving the target silicon wafer, the crack detection component 1023 uses an infrared emitting device 231 to detect microcracks and impurities on the target silicon wafer, obtaining a hidden crack detection result. The third controller 232 then transmits normal silicon wafers with normal hidden crack detection results to the contamination detection component 1024 via the first transport component S1, while transmitting abnormal silicon wafers with abnormal hidden crack detection results to the sorting module 103 via the second transport component S2. After receiving the target silicon wafer, the dirtiness detection component 1024 uses the LED array 241 to compare the grayscale differences in different areas of the target silicon wafer to obtain the dirtiness detection result. The fourth controller 242 then transmits normal silicon wafers with normal dirtiness detection results to the size information detection component 1025 via the first transport component S1, while transmitting abnormal silicon wafers with abnormal dirtiness detection results to the sorting module 103 via the second transport component S2. After receiving the target silicon wafer, the size information detection component 1025 uses the second laser emitting device 251 to determine the edge size information of the target silicon wafer to obtain the size information detection result. The fifth controller 252 then transmits normal silicon wafers with normal size information detection results to the warpage detection component 1026 via the first transport component S1, while transmitting abnormal silicon wafers with abnormal size information detection results to the sorting module 103 via the second transport component S2.After receiving the target silicon wafer, the warpage detection component 1026 uses the third laser emitting device 261 to determine the warpage information of the target silicon wafer and obtain the warpage detection result. The sixth controller 262 then transmits the normal silicon wafers with normal warpage detection results to the sorting module 103 through the first transport component S1, while transmitting the abnormal silicon wafers with abnormal warpage detection results to the sorting module 103 through the second transport component S2.

[0062] Finally, the sorting module 103 sorts the normal silicon wafers transported by the warpage detection component 1026 through the first transport component S1, and sorts the abnormal silicon wafers transported by the thickness detection component 1021, flatness detection component 1022, crack detection component 1023, dirtiness detection component 1024, size information detection component 1025 and warpage detection component 1026 through the second transport component S2.

[0063] In this way, normal and abnormal silicon wafers in the target silicon wafers are transported to the sorting module through different transport components, which can improve the automation level of the equipment. The subsequent sorting module sorts the silicon wafers from different transport components, which can improve the sorting efficiency of silicon wafers and meet the sorting needs of large batches of silicon wafers.

[0064] Figure 9 This is a block diagram of an electronic device 900 provided according to an exemplary embodiment of the present disclosure, such as... Figure 9 As shown, the electronic device 900 includes the silicon wafer sorting system 100 described above.

[0065] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0066] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0067] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A silicon wafer sorting system, comprising: The system includes: a feeding module, a detection module, a sorting module, a first conveying component, and a second conveying component; the feeding module, the detection module, and the sorting module are sequentially connected via the first conveying component; the detection module is also connected to the sorting module via the second conveying component; The feeding module is used to transfer the target silicon wafer to be inspected to the inspection module through the first conveying component; The detection module is used to transfer the normal silicon wafer to the sorting module via the first transport component when the target silicon wafer is determined to be a normal silicon wafer; or, when the target silicon wafer is determined to be an abnormal silicon wafer, to transfer the abnormal silicon wafer to the sorting module via the second transport component.

2. The system of claim 1, wherein, The detection module includes multiple detection components; the multiple detection components are connected sequentially through the first transport component, and each detection component is also connected to the sorting module through the second transport component. The detection module is used to sequentially detect multiple indicators of the target silicon wafer through the multiple detection components.

3. The system of claim 2, wherein, The plurality of detection components includes at least one of a thickness detection component, a flatness detection component, a crack detection component, a dirt detection component, a dimensional information detection component, and a warpage detection component.

4. The system of claim 3, wherein, The thickness detection component includes a thickness detector and a first controller connected to the thickness detector; The thickness measuring instrument is used to detect the thickness of the target silicon wafer; The first controller is configured to, if the target silicon wafer is determined to be a normal silicon wafer based on the thickness detection result, transfer the normal silicon wafer to the flatness detection component via the first transport component; or, if the target silicon wafer is determined to be an abnormal silicon wafer based on the thickness detection result, transfer the abnormal silicon wafer to the sorting module via the second transport component.

5. The system of claim 4, wherein, The flatness detection component includes a first laser emitting device and a second controller connected to the first laser emitting device; The first laser emitting device is used to detect the surface flatness of the target silicon wafer; The second controller is configured to, if the target silicon wafer is determined to be a normal silicon wafer based on the surface flatness detection result, transfer the normal silicon wafer to the crack detection component via the first transport component; or, if the target silicon wafer is determined to be an abnormal silicon wafer based on the surface flatness detection result, transfer the abnormal silicon wafer to the sorting module via the second transport component.

6. The system of claim 5, wherein, The crack detection component includes an infrared emitting device and a third controller connected to the infrared emitting device; The infrared emitting device is used to detect hidden cracks in the target silicon wafer; The third controller is configured to, if the target silicon wafer is determined to be a normal silicon wafer based on the hidden crack detection result, transfer the normal silicon wafer to the dirtiness detection component via the first transport component; or, if the target silicon wafer is determined to be an abnormal silicon wafer based on the hidden crack detection result, transfer the abnormal silicon wafer to the sorting module via the second transport component.

7. The system according to claim 6, characterized in that, The dirtiness detection component includes an LED array and a fourth controller connected to the LED array; The LED array is used to detect the degree of dirtiness of the target silicon wafer; The fourth controller is used to transfer the normal silicon wafer to the size information detection component via the first transport component when the target silicon wafer is determined to be a normal silicon wafer based on the dirtiness detection result; or, when the target silicon wafer is determined to be an abnormal silicon wafer based on the dirtiness detection result, transfer the abnormal silicon wafer to the sorting module via the second transport component.

8. The system of claim 7, wherein, The size information detection component includes a second laser emitting device and a fifth controller connected to the second laser emitting device; The second laser emitting device is used to detect the size information of the target silicon wafer; The size information detection component is used to transfer the normal silicon wafer to the warpage detection component via the first transport component when the size information detection result determines that the target silicon wafer is a normal silicon wafer; or, when the size information detection result determines that the target silicon wafer is an abnormal silicon wafer, the abnormal silicon wafer is transferred to the sorting module via the second transport component.

9. The system of claim 8, wherein, The warpage detection component includes a third laser emitting device and a sixth controller connected to the third laser emitting device; The third laser emitting device is used to detect the warpage of the target silicon wafer; The sixth controller is used to transfer the normal silicon wafer to the sorting module via the first transport component when the target silicon wafer is determined to be a normal silicon wafer based on the warp detection result; or, when the target silicon wafer is determined to be an abnormal silicon wafer based on the warp detection result, to transfer the abnormal silicon wafer to the sorting module via the second transport component.

10. An electronic device, comprising: The system includes any one of claims 1-9 above.

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