A material guiding unit and a chip bonding apparatus for chip bonding

Abstract

The utility model relates to chip processing field, specifically disclose a material guiding unit and chip bonding device for chip bonding, the material guiding unit among them includes material guiding frame and drive mechanism, the material guiding frame is set up and is opened to material guiding groove, the material guiding groove one end open setting forms material guiding export, the material guiding groove be equipped with the pressing piece, the pressing piece with the bottom surface rotatory movable joint of material guiding groove, just the pressing piece with material guiding frame between be equipped with elastic part, the pressing piece is equipped with first inclined plane away from material guiding export one end, first inclined plane towards one of the side walls of material guiding groove set, the drive mechanism includes drive insert plate and driving piece, drive insert plate insert into material guiding groove, just the one end of drive insert plate is equipped with with first inclined plane corresponding second inclined plane, the material guiding unit above can reliably guide and limit metal lead, effectively improve the bonding reliability.

Description

Technical Field

[0001] This utility model relates to the field of chip processing, specifically to a feeding unit and a chip bonding device for chip bonding. Background Technology

[0002] Wire bonding is one of the key technologies in the field of chip packaging. Specifically, it involves using metal wires to connect chips and between chips and substrates. This technology has the advantages of high maturity, low equipment cost, and good flexibility.

[0003] Chinese invention patent application CN 115863244 A discloses a chip-to-chip wire bonding process apparatus for deep cavity devices, including a marble reference platform. A motion platform is set on the marble reference platform, including a Y-axis moving slider, an X-axis moving slider, and a Z-axis connecting plate. A bonding head mechanism for wire bonding is fixed on the Z-axis motion plate. The bonding head mechanism is equipped with an ultrasonic transducer assembly, which includes a transducer, a bonding wedge, a bonding wire, and a 90-degree wire feed clamp. The bonding wedge passes through a vertical hole at the tip of the transducer and is locked by a flat-end set screw. The 90-degree wire feed clamp is fixed behind the bonding wedge. The bonding wire passes through the gap formed by the bonding wedge and the 90-degree wire feed clamp. The transducer converts electrical signals into mechanical vibrations, and ultrasonic energy is transferred to the bonding wedge, causing the bonding wedge to rub the bonding wire against the pads of the chip or substrate, ultimately bonding them together. The 90-degree wire feed clamp is very small and fits closely to the bonding wedge. Therefore, during wire bonding, the 90-degree wire feed clamp can extend into the cavity of the integrated circuit device with a certain depth along with the bonding wedge to complete the wire bonding process.

[0004] However, the bonding head in the aforementioned inter-chip wire bonding process equipment lacks a mechanism for constraining and limiting the bonding wires. The limiting of the bonding wires after entering the bonding head is not reliable enough, which will affect the feeding accuracy of the bonding wires to a certain extent, and thus affect the bonding reliability. Summary of the Invention

[0005] The technical problem to be solved by this utility model is to provide a feeding unit and a chip bonding device for chip bonding, which can reliably guide and limit the metal leads, effectively improving the bonding reliability.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a feeding unit for chip bonding, comprising a feeding frame and a driving mechanism, wherein the feeding frame has a feeding groove, one end of which is open to form a feeding outlet; a pressing member is provided inside the feeding groove, and a pressing channel is formed between the pressing member and one side wall of the feeding groove; the pressing member is rotatably connected to the bottom surface of the feeding groove, and an elastic member is provided between the pressing member and the feeding frame; a first inclined surface is provided at the end of the pressing member away from the feeding outlet, and the first inclined surface is directed toward one side wall of the feeding groove;

[0007] The driving mechanism includes a driving plate and a driving component. The driving plate is inserted into the guide groove, and one end of the driving plate is provided with a second inclined surface corresponding to the first inclined surface. The driving component is used to drive the guide frame and the driving plate to move relative to each other along the extension direction of the guide groove.

[0008] During bonding, the metal lead extends into the guide groove, passes through the clamping channel, and extends from the guide outlet for bonding. By driving the relative movement between the drive plate and the guide frame, the clamping component can be rotated, opening and closing the clamping channel, thereby achieving the clamping and releasing operation of the metal lead. During bonding, the clamping channel is opened, allowing the metal lead to be automatically fed; during bonding intervals, the clamping channel is closed, maintaining a stable clamping limit on the metal lead. The guide unit of this application can reliably guide and limit the metal lead, effectively improving bonding reliability.

[0009] Preferably, the pressing component is elongated and divided into a driving section and a pressing section with the rotation center as the midpoint. The pressing section corresponds to the material guide outlet, and the first inclined surface is provided at the end of the driving section.

[0010] Preferably, the elastic element is disposed between the side wall of the guide trough and the drive section, and the elastic element is located on the side of the drive section away from the first inclined surface.

[0011] Preferably, the guide frame is detachably connected to a cover plate, which covers the rotation center of the pressing component and also covers the elastic element and the pressing channel. The cover plate can protect the rotation and reset movement of the pressing component, prevent impurities from entering, and improve the reliability of the pressing component's movement.

[0012] Preferably, the device also includes a discharge nozzle, which is detachably connected to the guide frame; the discharge nozzle has a discharge channel inside, which is aligned with the guide outlet and communicates with the guide trough.

[0013] Preferably, the driving component includes an electromagnetic coil and a core column, with the core column disposed within the electromagnetic coil. One of the electromagnetic coil and the core column is connected to the guide frame, and the other is connected to the drive plate. Through the cooperation of the electromagnetic coil and the core column, bidirectional relative movement between the guide frame and the drive plate can be automatically realized, thereby automatically realizing the clamping and releasing of the metal leads.

[0014] Preferably, the guide frame includes a main body, the guide groove is disposed on the main body and extends through the main body along its length, and the end of the guide groove away from the guide outlet is the operating end; the main body is provided with mounting arms on both sides, the mounting arms are disposed near the operating end, and the mounting arms are provided with a mounting position and a first drive connection position;

[0015] The drive plate includes a connecting section and an operating section. The operating section is inserted into the guide groove from the operating end, and the second inclined surface is provided at the end of the operating section. The connecting section is located outside the guide groove, and the connecting section is provided with a second drive connection position that corresponds one-to-one with the first drive connection position.

[0016] The driving component corresponds one-to-one with the mounting arm, and one of the electromagnetic coil and the core column is located at the first driving connection position, and the other is located at the second driving connection position.

[0017] A chip bonding apparatus includes a feeding unit as described above. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the material feeding unit used for chip bonding in this embodiment;

[0019] Figure 2 This is an exploded view of the feeding unit used for chip bonding in this embodiment;

[0020] Figure 3 This is a front view of the feeding unit used for chip bonding in this embodiment;

[0021] Figure 4 for Figure 3 A magnified view of a section at point A in the middle;

[0022] Figure 5 This is a schematic diagram of the material guide frame in the material guiding unit used for chip bonding in this embodiment. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model. Example

[0024] like Figures 1-3 As shown, a feeding unit for chip bonding includes a feeding frame 2 and a driving mechanism. The feeding frame 2 has a feeding groove 22, and one end of the feeding groove 22 is open to form a feeding outlet.

[0025] Specifically, such as Figure 5 As shown, the guide frame 2 includes a main body 23, and a guide groove 22 is disposed on the main body 23 and extends through the main body 23 along its length. The end of the guide groove 22 away from the guide outlet is the operating end. Mounting arms 21 are respectively provided on both sides of the main body 23. The mounting arms 21 are located near the operating end and are provided with a mounting position 24 and a first drive connection position 25.

[0026] Furthermore, such as Figures 1-3 As shown, it also includes a discharge nozzle 5, which is detachably connected to the guide frame 2; the discharge nozzle 5 is provided with a discharge channel, which is aligned with the guide outlet and communicates with the guide groove 22.

[0027] like Figures 2-4 As shown, a pressing component 6 is provided inside the guide trough 22, and a pressing channel 61 is formed between the pressing component 6 and one of the side walls of the guide trough 22. The pressing component 6 is rotatably connected to the bottom surface of the guide trough 22, and an elastic element is provided between the pressing component 6 and the guide frame 2.

[0028] Specifically, such as Figures 2-4 As shown, the pressing component 6 is elongated and divided into a driving section and a pressing section with the rotation center as the midpoint. The pressing section corresponds to the material guide outlet, and the first inclined surface is disposed at the end of the driving section. The elastic element is disposed between the side wall of the material guide groove 22 and the driving section, and the elastic element is located on the side of the driving section away from the first inclined surface.

[0029] like Figures 2-4 As shown, the end of the pressing component 6 away from the material guide outlet has a first inclined surface, which faces one side wall of the material guide groove 22. The driving mechanism includes a driving plate 3 and a driving component 1. The driving plate 3 is inserted into the material guide groove 22, and one end of the driving plate 3 has a second inclined surface corresponding to the first inclined surface. The driving component 1 is used to drive the relative movement between the material guide frame 2 and the driving plate 3 along the extension direction of the material guide groove 22.

[0030] Specifically, such as Figure 1 and Figure 2As shown, the drive plate 3 includes a connecting segment 31 and an operating segment 32. The operating segment 32 is inserted into the guide groove 22 from the operating end, and the second inclined surface is disposed at the end of the operating segment 32. The connecting segment 31 is located outside the guide groove 22, and the connecting segment 31 is provided with a second drive connection position corresponding to the first drive connection position 25.

[0031] like Figure 1 and Figure 2 As shown, the driving component 1 includes an electromagnetic coil 11 and a core 12. The core 12 is disposed within the electromagnetic coil 11. One of the electromagnetic coil 11 and the core 12 is connected to the guide frame 2, and the other is connected to the driving plate 3. Through the cooperation of the electromagnetic coil 11 and the core 12, bidirectional relative movement between the guide frame 2 and the driving plate 3 can be automatically realized, thereby automatically realizing the clamping and releasing of the metal lead. The driving component 1 corresponds one-to-one with the mounting arm 21, and one of the electromagnetic coil 11 and the core 12 is disposed at the first driving connection position 25, and the other is disposed at the second driving connection position.

[0032] Specifically, the electromagnetic coil 11 is bolted to the drive plate 3, and the core column 12 is bolted to the guide frame 2. When the type of metal lead wire changes, it can be quickly adapted by replacing the guide frame 2 and the drive plate 3, while the drive component 1 is universal.

[0033] During bonding, the metal lead extends into the guide groove 22, passes through the clamping channel 61, and extends from the guide outlet for bonding. By driving the relative movement between the drive plate 3 and the guide frame 2, the clamping member 6 can be rotated, opening and closing the clamping channel 61, thereby achieving the clamping and releasing operation of the metal lead. During bonding, the clamping channel 61 is opened, allowing the metal lead to be automatically fed; during bonding intervals, the clamping channel 61 is closed, maintaining a stable clamping limit on the metal lead. The guide unit of this application can reliably guide and limit the metal lead, effectively improving bonding reliability.

[0034] As a specific implementation method, such as Figure 1 and Figure 2 As shown, a cover plate 4 is detachably connected to the guide frame 2. The cover plate 4 covers the rotation center of the pressing component 6 and also covers the elastic element and the pressing channel 61. The cover plate 4 can protect the rotation and reset movement of the pressing component 6, prevent impurities from entering, and improve the reliability of the movement of the pressing component 6.

[0035] A chip bonding apparatus includes a feeding unit as described above.

[0036] In summary, the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A material guiding unit for die bonding, characterized by: The device includes a guide frame and a drive mechanism. The guide frame has a guide groove, one end of which is open to form a guide outlet. A pressing component is provided inside the guide groove, forming a pressing channel between the pressing component and one side wall of the guide groove. The pressing component is rotatably connected to the bottom surface of the guide groove, and an elastic element is provided between the pressing component and the guide frame. The end of the pressing component away from the guide outlet has a first inclined surface, which faces one side wall of the guide groove. The driving mechanism includes a driving plate and a driving component. The driving plate is inserted into the guide groove, and one end of the driving plate is provided with a second inclined surface corresponding to the first inclined surface. The driving component is used to drive the guide frame and the driving plate to move relative to each other along the extension direction of the guide groove.

2. The material guiding unit according to claim 1, characterized in that: The pressing component is elongated and divided into a driving section and a pressing section with the rotation center as the midpoint. The pressing section corresponds to the material guide outlet, and the first inclined surface is set at the end of the driving section.

3. The material guiding unit according to claim 2, characterized in that: The elastic element is disposed between the side wall of the guide trough and the drive section, and the elastic element is located on the side of the drive section away from the first inclined surface.

4. The material guiding unit according to claim 1, characterized in that: The guide frame is detachably connected to a cover plate, which covers the rotation center of the pressing component and the elastic component and pressing channel.

5. The material guiding unit according to claim 1, characterized in that: It also includes a discharge nozzle, which is detachably connected to the guide frame; the discharge nozzle is provided with a discharge channel, which is aligned with the guide outlet and connected to the guide trough.

6. The material guiding unit according to any one of claims 1 - 5, characterized in that: The driving component includes an electromagnetic coil and a core column, with the core column disposed inside the electromagnetic coil. One of the electromagnetic coil and the core column is connected to the guide frame, and the other is connected to the driving plate.

7. The material guiding unit according to claim 6, characterized in that: The material guide frame includes a main body, and the material guide groove is disposed on the main body and extends through the main body along its length. The end of the material guide groove away from the material guide outlet is the operating end. Mounting arms are respectively provided on both sides of the main body. The mounting arms are located near the operating end and are provided with a mounting position and a first drive connection position. The drive plate includes a connecting section and an operating section. The operating section is inserted into the guide groove from the operating end, and the second inclined surface is provided at the end of the operating section. The connecting section is located outside the guide groove, and the connecting section is provided with a second drive connection position that corresponds one-to-one with the first drive connection position. The driving component corresponds one-to-one with the mounting arm, and one of the electromagnetic coil and the core column is located at the first driving connection position, and the other is located at the second driving connection position.

8. A die bonding apparatus characterized by comprising: Includes the feeding unit as described in any one of claims 1-7.

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