Kit refrigeration device

Abstract

This application relates to a reagent kit refrigeration device for refrigerating reagent kits. The reagent kit refrigeration device includes a housing and a refrigeration component. A refrigeration channel is formed inside the housing. Along the height direction z of the housing, the refrigeration component is installed at the top of the housing and connects to the top of the refrigeration channel. A dispensing port is opened on the side wall of the housing, located near the bottom of the housing and connecting to the refrigeration channel from the side. The refrigeration component is used to circulate cold air from the top of the refrigeration channel to the refrigeration channel and forms an air curtain at the dispensing port. The reagent kit refrigeration device provided by this application can prevent the external environment from impacting the temperature inside the housing through the dispensing port, thereby helping to reduce temperature fluctuations inside the housing caused by the presence of the dispensing port.

Description

Technical Field

[0001] This application relates to the field of reagent kit storage equipment technology, and in particular to a reagent kit refrigeration device. Background Technology

[0002] The reagents in kits used for sample testing are generally biologically active and sensitive to temperature and light. Prolonged exposure to high temperatures or light can easily cause the reagents to deteriorate, resulting in inaccurate testing or incorrect test results, which in turn affects the accuracy of diagnosis. Therefore, before use, the reagents in the kits need to be sealed in a sealed bag with a desiccant and stored in a refrigerated container at a constant temperature.

[0003] The refrigeration equipment has a discharge port on the side wall of the cabinet. When it is necessary to take the reagent kit from the refrigeration equipment, the reagent kit can be pushed out through the discharge port. However, the cold air inside the refrigeration equipment is easily lost through the discharge port, which leads to large temperature fluctuations inside the refrigeration equipment. Utility Model Content

[0004] Therefore, it is necessary to provide a solution that can reduce the large temperature fluctuations inside refrigeration equipment during shipment.

[0005] A reagent kit refrigeration device is provided for refrigerating reagent kits. The reagent kit refrigeration device includes a box and a refrigeration component. A refrigeration channel is formed inside the box. Along the height direction z of the box, the refrigeration component is installed on the top of the box and connects to the top of the refrigeration channel. A discharge port is opened on the side wall of the box. The discharge port is located near the bottom of the box and connects to the refrigeration channel from the side. The refrigeration component is used to circulate cold air from the top of the refrigeration channel to the refrigeration channel and form an air curtain at the discharge port.

[0006] In one embodiment, the refrigeration assembly includes a mounting bracket, a refrigeration component, and a heat dissipation component. The refrigeration component and the heat dissipation component are located inside the mounting bracket and are detachably mounted to the housing via the mounting bracket. An air outlet is provided on the top of the housing, which is connected to the refrigeration channel. The refrigeration component is positioned relative to the air outlet along the height z direction of the housing and is used to circulate cold air to the refrigeration channel through the air outlet.

[0007] In one embodiment, the cooling component includes a thermoelectric cooler and a heat conductor, wherein the thermoelectric cooler has a cold end and a hot end, and the heat dissipation component includes a heat sink for heat exchange with the hot end, and the heat conductor for heat exchange with the hot end.

[0008] In one embodiment, the cooling assembly further includes a heat insulation pad that covers the stencil circumferentially along the stencil.

[0009] In one embodiment, the cooling assembly further includes fasteners, and the cooler, thermoelectric cooler, heat insulation pad and heat sink are connected and fixed by the fasteners.

[0010] In one embodiment, the cooler has a plurality of spaced-apart first corrugated fins; and / or, the radiator has a plurality of spaced-apart second corrugated fins.

[0011] In one embodiment, the cooling assembly further includes a cooling fan and a cooling fan. The cooling fan is mounted on the side of the heat sink away from the thermoelectric cooler and is used to blow air onto the heat sink. The cooling fan is mounted on the side of the cooler away from the thermoelectric cooler and is used to blow air toward the air outlet.

[0012] In one embodiment, the number of thermoelectric coolers, the number of coolers, and the number of cooling fans are all configured to be two, and the thermoelectric coolers, coolers, and cooling fans are arranged in a one-to-one correspondence.

[0013] In one embodiment, the reagent kit refrigeration device further includes a main control system, which is detachably mounted on a mounting bracket. The refrigeration assembly also includes a temperature sensor, which is installed on a cooler. The thermoelectric cooler and the temperature sensor are respectively connected to the main control system.

[0014] In one embodiment, the box has a replenishment port on one side, and the reagent kit refrigeration device also includes a replenishment door assembly and a dispensing door assembly. The replenishment door assembly is hinged to the box and is used to open or close the replenishment port, and the dispensing door assembly is movably connected to the box and is used to open or close the dispensing port.

[0015] Compared with existing technologies, the reagent kit refrigeration equipment provided in this application uses a refrigeration component to circulate cold air from the top of the refrigeration channel to the refrigeration channel, forming an air curtain at the outlet. This air curtain isolates the external environment from the internal space of the container, thereby preventing temperature shocks from the external environment passing through the outlet. This helps reduce temperature fluctuations inside the container caused by the presence of the outlet. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A schematic diagram of the structure of the refrigeration device for the reagent kit provided in this application from one perspective;

[0018] Figure 2Another structural schematic diagram of the refrigeration device for the reagent kit provided in this application;

[0019] Figure 3 An exploded view of the refrigeration equipment for the reagent kit provided in this application;

[0020] Figure 4 A cross-sectional view of the refrigeration equipment for the reagent kit provided in this application;

[0021] Figure 5 for Figure 4 An enlarged view at point A;

[0022] Figure 6 An exploded view of the refrigeration component provided in this application;

[0023] Figure 7 A flowchart of the workflow for the refrigeration equipment for the reagent kit provided in this application.

[0024] Attached label: 100, Reagent kit refrigeration equipment; 110, Cabinet; 111, Discharge port; 112, Air outlet; 114. Replenishment port; 120. Shipping assembly; 121. Storage compartment; 122. Cargo aisle; 140. Refrigeration aisle; 150. Replenishment door assembly; 160. Shipping door assembly; 180. Refrigeration assembly; 181. Mounting bracket; 182. Refrigeration component; 1821. Semiconductor refrigeration chip; 1822. Cold end; 1823. Hot end; 1824. Cooler; 1825. First corrugated fin; 183. Heat sink; 1831. Heat sink; 1832. Second corrugated fin; 184. Thermal insulation pad; 185. Cooling fan; 186. Cooling fan; 187. Fan guard; 188. Temperature sensor; 190. Main control system; 191. Main control board; 192. Temperature control panel; 200. Reagent kit. Detailed Implementation

[0025] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0026] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0028] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0029] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0030] Please see Figures 1 to 4This application provides a reagent kit refrigeration device 100 for refrigerating reagent kits 200. The reagent kit refrigeration device 100 includes a housing 110 and a refrigeration component 180. A refrigeration channel 140 is formed inside the housing 110. Along the height direction z of the housing 110, the refrigeration component 180 is installed on the top of the housing 110 and connects to the top of the refrigeration channel 140. A discharge port 111 is opened on the side wall of the housing 110. The discharge port 111 is located near the bottom of the housing 110 and connects to the side of the refrigeration channel 140. The refrigeration component 180 is used to circulate cold air from the top of the refrigeration channel 140 to the refrigeration channel 140 and form an air curtain at the discharge port 111.

[0031] Understandably, the refrigeration unit 180 circulates cold air from the top of the refrigeration aisle 140, forming an air curtain at the outlet 111. This air curtain isolates the external environment from the internal space of the container 110, thus preventing temperature shocks from the external environment passing through the outlet 111. This helps reduce temperature fluctuations inside the container 110 caused by the presence of the outlet 111.

[0032] In one embodiment, such as Figure 6 As shown, the refrigeration assembly 180 includes a mounting bracket 181, a refrigeration component 182, and a heat sink 183. The refrigeration component 182 and the heat sink 183 are located within the mounting bracket 181 and are detachably mounted to the housing 110 via the mounting bracket 181. An air outlet 112 is provided at the top of the housing 110, connecting to the refrigeration channel 140. The refrigeration component 182 is positioned relative to the air outlet 112 along the height z-direction of the housing 110, and is used to circulate cool air into the refrigeration channel 140 via the air outlet 112. Specifically, the mounting bracket 181 is detachably mounted to the top of the housing 110 using screws.

[0033] Optionally, in one embodiment, the cooling component 182 includes a semiconductor cooling chip 1821 and a cooler 1824, and the semiconductor cooling chip 1821 has a cold end 1822 and a hot end 1823. The heat dissipation component 183 includes a heat sink 1831, which is used to exchange heat with the hot end 1823, and the cooler 1824 is used to exchange heat with the hot end 1823.

[0034] It should be noted that the thermocouple 1821 is a heat transfer device. When current flows through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer occurs between the two ends, creating a temperature difference between the two ends of the thermocouple 1821, forming a cold end 1822 and a hot end 1823. The heat sink 1831 dissipates heat from the hot end 1823 through contact heat exchange. The cooler 1824 transfers the cold energy from the hot end 1823 to the cooling channel 140 through contact heat exchange. The thermocouple 1821 does not require any refrigerant, can operate continuously, has no pollution sources, no rotating parts, does not produce a rotational effect, and has no sliding parts. As a solid-state component, the thermocouple 1821 operates without vibration or noise, has a long lifespan, and is easy to install. The 1821 thermoelectric cooler is a current-transducer type device. It achieves high-precision temperature control through input current, with a wide temperature range, from 90°C to 130°C. Furthermore, the amount of heat absorbed at the cold end 1822 and the amount of heat released at the hot end 1823 can be determined by the magnitude of the current and the number of N and P element pairs in the semiconductor material.

[0035] Optionally, in one embodiment, the cooling assembly 180 further includes a heat insulation pad 184, which covers the stoker chip 1821 circumferentially. The heat insulation pad 184 serves to insulate the stoker chip 1821 to prevent heat from the air from affecting its cooling efficiency. The heat insulation pad 184 can be a silicone pad with good heat insulation properties.

[0036] Optionally, in one embodiment, the cooling assembly 180 further includes fasteners, and the cooler 1824, the thermoelectric cooler 1821, the heat insulation pad 184, and the heat sink 1831 are connected and fixed by the fasteners. In this way, the thermoelectric cooler 1821, the heat insulation pad 184, and the heat sink 1831 are assembled into a whole by the fasteners, which helps to ensure the heat exchange effect between the heat sink 1831 and the hot end 1823, and also ensures the heat exchange effect between the cooler 1824 and the cold end 1822.

[0037] The fasteners can be configured as screws. Thermal grease is applied between the heat sink 1831 and the hot end 1823, and thermal grease is applied between the coolant 1824 and the cold end 1822. The thermal pad 184 is bonded to the heat sink 1831 with adhesive backing.

[0038] like Figure 5 and Figure 6As shown, optionally, the cooler 1824 is configured as a finned cooler. Specifically, the cooler 1824 has a plurality of spaced-apart first corrugated fins 1825. Specifically, the plurality of first corrugated fins 1825 are spaced-apart along the depth direction y of the housing 110.

[0039] Specifically, the cross-section of the first corrugated fin 1825 is wavy. This wavy shape is achieved by pressing a wave pattern into a flat fin. The first corrugated fin 1825 guides the airflow to continuously change direction. This change in flow direction destabilizes the airflow, disrupting the boundary layer and thus improving heat transfer. Furthermore, the constantly changing airflow direction increases the contact area between the first corrugated fin 1825 and the airflow, facilitating the transfer of heat from the airflow to the first corrugated fin 1825, thereby improving heat exchange efficiency. Additionally, the first corrugated fin 1825 undergoes slight elastic changes during heat transfer with the airflow, further enhancing the heat exchange between the first corrugated fin 1825 and the airflow.

[0040] In another embodiment, such as Figure 5 and Figure 6 As shown, the radiator 1831 can also be configured as a finned heatsink. The radiator 1831 has a plurality of spaced-apart second corrugated fins 1832. Specifically, a plurality of first corrugated fins 1825 are spaced-apart along the depth direction y of the housing 110.

[0041] Specifically, the cross-section of the second corrugated fin 1832 is wavy. This wavy shape is achieved by pressing a wave pattern into a flat fin. The second corrugated fin 1832 guides the airflow to continuously change direction. This change in flow direction destabilizes the airflow, disrupting the boundary layer and thus improving heat transfer. Furthermore, the constantly changing airflow direction increases the contact area between the second corrugated fin 1832 and the airflow, facilitating the transfer of heat from the airflow to the second corrugated fin 1832, thereby improving heat exchange efficiency. Additionally, the second corrugated fin 1832 undergoes slight elastic changes during heat transfer with the airflow, further enhancing the heat exchange between them.

[0042] Optionally, in one embodiment, the heat sink 1831 and the cooler 1824 are made of aluminum, which has a high thermal conductivity and can quickly transfer heat. Furthermore, aluminum is lightweight and has significant cost advantages. Moreover, aluminum's good thermal diffusivity ensures even heat distribution, preventing localized overheating of the heat sink 1831 or the cooler 1824. This contributes to improved heat dissipation efficiency and equipment stability.

[0043] In one embodiment, such as Figure 6As shown, the cooling assembly 180 also includes a cooling fan 185 and a cooling fan 186. The cooling fan 185 is installed on the side of the heat sink 1831 away from the thermoelectric cooler 1821 and is used to blow air onto the heat sink 1831. The cooling fan 186 is installed on the side of the cooler 1824 away from the thermoelectric cooler 1821 and is used to blow air toward the air outlet 112.

[0044] Optionally, in one embodiment, the cooling assembly 180 further includes a fan shield 187, which is located on the side of the cooling fan 185 away from the heat sink 1831, and the fan shield 187 is connected to the mounting bracket 181 by screws. By providing the fan shield 187, the air intake volume can be guaranteed while preventing accidental contact with the cooling fan 185.

[0045] Optionally, in one embodiment, the number of thermoelectric coolers 1821, the number of coolers 1824, and the number of cooling fans 186 are all configured to be two, and the thermoelectric coolers 1821, coolers 1824, and cooling fans 186 are arranged in a one-to-one correspondence. In this way, the cooling channel 140 can be circulated by section.

[0046] In one embodiment, such as Figure 3 As shown, the reagent kit refrigeration device 100 also includes a main control system 190, which is detachably mounted on the mounting bracket 181. The refrigeration component 180 also includes a temperature sensor 188, which is mounted on the cooler 1824. The semiconductor cooling chip 1821, the cooling fan 185, the cooler fan 186, and the temperature sensor 188 are respectively connected to the main control board 191.

[0047] The temperature sensor 188 is used to detect the temperature at the cooler 1824. Specifically, the temperature sensor 188 is located between two adjacent second corrugated fins 1832.

[0048] The main control system 190 is used to regulate the current flowing through the thermoelectric cooler 1821, thereby regulating the heat absorption and release of the thermoelectric cooler 1821. The main control system 190 can also be used to regulate the speed of the cooling fan 185 and the heat-conducting fan 186. Specifically, the main control system 190 includes a main control board 191 and a temperature control panel 192. The main control board 191 is installed inside the mounting bracket 181, and the temperature control panel 192 is installed on the mounting bracket 181 and at least partially exposed; the temperature control panel 192 is used for user command interaction.

[0049] Optionally, the refrigeration unit 180 can also employ a PID (Proportional Integral Derivative) constant temperature control system to maintain a constant temperature inside the chamber 110. With the PID constant temperature control system, the controllable temperature range inside the chamber 110 can reach 10℃-25℃±1℃. The PID constant temperature control system is a new type of low-temperature freezer control method that continuously adjusts the temperature through signal feedback, using proportional, integral, and derivative parameters. It allows the temperature inside the chamber 110 to approach the set temperature in the fastest and most efficient way. When the temperature approaches the set temperature, the PID constant temperature controller outputs a stable frequency signal to maintain this temperature, offering advantages such as precise temperature control and a small temperature fluctuation range. After the reagent kit refrigeration equipment 100 is operating stably, the temperature fluctuation range is ±1℃. Simultaneously, it ensures that the refrigeration unit 180 remains continuously powered on, avoiding frequent on / off cycles.

[0050] like Figure 3 and Figure 4 As shown, the box 110 has a replenishment port 114 on one side. The reagent kit refrigeration equipment also includes a replenishment door assembly 150 and a discharge door assembly 160. The replenishment door assembly 150 is hinged to the box 110 and is used to open or close the replenishment port 114. The discharge door assembly 160 is movably connected to the box 110 and is used to open or close the discharge port 111.

[0051] like Figure 3 and Figure 4 As shown, the reagent kit refrigeration device 100 also includes a dispensing component 120. The dispensing component 120 is installed inside the housing 110 and includes a storage compartment 121 and a conveyor 122 located at the bottom of the storage compartment 121 along the height direction of the housing 110. The storage compartment 121 is used to store reagent kits 200, and the conveyor 122 is used to push the reagent kits 200 to the dispensing port 111. The dispensing component 120 and the dispensing door component 160 are respectively connected to the main control system 190. The dispensing component 120 is used to respond to instructions from the main control system 190 to push the reagent kits 200 to the dispensing port 111 via the conveyor 122. The dispensing door component 160 is used to open or close the dispensing port 111 in response to instructions from the main control system 190. The reagent kit refrigeration device may also include a robotic arm connected to the main control system 190 and used to retrieve reagent kits 200 from the dispensing port 111 in response to instructions from the main control system 190.

[0052] Specifically, such as Figure 7As shown, the workflow of the reagent kit refrigeration equipment 100 is as follows: Step 1, the maintenance personnel open the replenishment door assembly 150; Step 2, the maintenance personnel place the reagent kit 200 into the storage compartment 121; Step 3, the maintenance personnel close the replenishment door assembly 150; Step 4, the main control system 190 receives the shipment instruction; Step 5, the main control system 190 controls the shipment door assembly 160 to automatically open the shipment port 111; Step 6, the main control system 190 controls the shipment assembly 120 to eject one reagent kit 200; Step 7, the user or the main control system 190 controls the robotic arm to retrieve the reagent kit 200 for later use; Step 8, the main control system 190 controls the shipment door assembly 160 to automatically close the shipment port 111. Simultaneously, throughout the entire process, the main control system uses a PID temperature control algorithm to control the cooling assembly 180, maintaining a constant temperature inside the chamber 110.

[0053] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0054] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A reagent kit refrigeration device for refrigerating reagent kits (200), characterized in that, The reagent kit refrigeration device (100) includes a box (110) and a refrigeration component (180). A refrigeration channel (140) is formed inside the box (110). Along the height direction z of the box (110), the refrigeration component (180) is installed on the top of the box (110) and connected to the top of the refrigeration channel (140). A discharge port (111) is opened on the side wall of the box (110). The discharge port (111) is located near the bottom of the box (110) and is connected to the refrigeration channel (140) from the side of the refrigeration channel (140). The refrigeration component (180) is used to circulate cold air from the top of the refrigeration channel (140) into the refrigeration channel (140) and to form an air curtain at the outlet (111).

2. The reagent kit refrigeration device according to claim 1, characterized in that, The refrigeration assembly (180) includes a mounting bracket (181), a refrigeration component (182), and a heat sink (183). The refrigeration component (182) and the heat sink (183) are located inside the mounting bracket (181) and can be detachably installed on the housing (110) through the mounting bracket (181). The top of the housing (110) is provided with an air outlet (112), which is connected to the cooling channel (140). The cooling component (182) is arranged along the height direction z of the housing (110) and close to the air outlet (112), and is used to circulate cold air to the cooling channel (140) through the air outlet (112).

3. The reagent kit refrigeration device according to claim 2, characterized in that, The cooling component (182) includes a semiconductor cooling chip (1821) and a cooler (1824), and the semiconductor cooling chip (1821) has a cold end (1822) and a hot end (1823). The heat dissipation component (183) includes a heat sink (1831), which is used to exchange heat with the hot end (1823), and the cooler (1824) is used to exchange heat with the hot end (1823).

4. The reagent kit refrigeration device according to claim 3, characterized in that, The cooling assembly (180) further includes a heat insulation pad (184) that covers the semiconductor cooling chip (1821) circumferentially.

5. The reagent kit refrigeration device according to claim 4, characterized in that, The cooling assembly (180) also includes fasteners, through which the cooler (1824), the semiconductor cooling chip (1821), the heat insulation pad (184) and the heat sink (1831) are connected and fixed.

6. The reagent kit refrigeration device according to claim 3, characterized in that, The cooler (1824) has a plurality of first corrugated fins (1825) arranged at intervals. And / or, the radiator (1831) has a plurality of spaced-apart second corrugated fins (1832).

7. The reagent kit refrigeration device according to claim 3, characterized in that, The cooling assembly (180) further includes a cooling fan (185) and a cooling fan (186). The cooling fan (185) is installed on the side of the heat sink (1831) away from the semiconductor cooling chip (1821) and is used to blow air onto the heat sink (1831). The cooling fan (186) is installed on the side of the cooler (1824) away from the semiconductor cooling chip (1821) and is used to blow air toward the air outlet (112).

8. The reagent kit refrigeration device according to claim 7, characterized in that, The number of the semiconductor cooling chip (1821), the number of the cooler (1824), and the number of the cooling fan (186) are all configured to be two, and the semiconductor cooling chip (1821), the cooler (1824), and the cooling fan (186) are arranged in a one-to-one correspondence.

9. The reagent kit refrigeration device according to claim 3, characterized in that, The reagent kit refrigeration device also includes a main control system (190), which is detachably installed on the mounting bracket (181). The refrigeration component (180) also includes a temperature sensor (188), which is installed on the cooler (1824). The semiconductor refrigeration chip (1821) and the temperature sensor (188) are respectively connected to the main control system (190).

10. The reagent kit refrigeration device according to claim 1, characterized in that, The box (110) has a replenishment port (114) on one side. The reagent kit refrigeration equipment also includes a replenishment door assembly (150) and a discharge door assembly (160). The replenishment door assembly (150) is hinged to the box (110) and is used to open or close the replenishment port (114). The discharge door assembly (160) is movably connected to the box (110) and is used to open or close the discharge port (111).

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