A highly integrated wide and narrow band RF transceiver module

Abstract

A highly integrated wide- and narrow-band RF transceiver module includes a housing made of aluminum alloy with a flat structure. An upper cavity is formed with an opening on the housing's surface, and a lower cavity is formed with an opening on the lower surface of the housing. An upper control card and an upper partition are located at the bottom of the upper cavity, with the upper partition fixed to the bottom of the upper cavity by screws. Multiple compartments are formed on the upper partition. An upper cover is fixed to the upper end of the upper cavity. A lower control card and a lower partition are located at the bottom of the lower cavity, with the lower partition located below the lower control card and fixed to the bottom of the lower cavity. Multiple holes are formed on the lower partition, with electronic components on the lower control card located within each hole. A lower cover is fixed to the lower end of the lower cavity. This invention's dual-cavity design evenly distributes the gain in the RF link across both sides, achieving physical isolation and increasing electromagnetic shielding. Simultaneously, power amplifiers and RF front-end circuits arranged on the same side are physically isolated through the upper and lower partitions, ensuring electromagnetic shielding effectiveness.

Description

Technical Field

[0001] This utility model relates to the field of microwave radio frequency technology, and in particular to a highly integrated wide and narrow band radio frequency transceiver module. Background Technology

[0002] In traditional wideband and narrowband RF transceiver module designs, considering heat dissipation, high-output-power power amplifiers are typically designed as independent modules, then connected to the RF front-end module via cables. However, with the increasing demands for smaller size, higher integration, and higher reliability in systems, this design approach is no longer suitable for the miniaturization and high reliability requirements of modern electronic devices.

[0003] Traditional designs separate the power amplifier module, occupying extra space and resulting in a bulky RF system that is difficult to meet the needs of highly integrated devices. At the same time, the independent power amplifier relies on its own heat dissipation structure for heat dissipation, which has low heat dissipation efficiency and is prone to overheating of the power amplifier after long-term use, affecting performance stability. Furthermore, the poor reliability of the connection between the power amplifier and the RF front-end module via cable and the complexity of assembly and debugging make it difficult to adapt to the development requirements of miniaturization and high reliability of modern electronic devices. Utility Model Content

[0004] This invention provides a highly integrated wide and narrow band RF transceiver module to address the shortcomings of the prior art, and to solve the problems of low integration and heat dissipation difficulties caused by the independent design of power amplifiers in traditional wide and narrow band RF transceiver modules.

[0005] In order to achieve the purpose of this utility model, the following technology is proposed to be adopted: A highly integrated wide and narrow band radio frequency transceiver module includes a housing made of aluminum alloy. The housing has a flat structure. An upper cavity is formed with an opening on the upper surface of the housing. An indium sheet is attached to the bottom of the upper cavity. A lower cavity is formed with an opening on the lower surface of the housing. Indium sheets are attached to the bottom of the upper and lower cavities. The bottom of the upper chamber is provided with an upper control card and an upper partition. The upper partition is located on the upper side of the upper control card and is fixed to the bottom of the upper chamber by screws. The lower end of the upper partition abuts against the upper wall of the upper control card. Multiple compartments are opened on the upper partition. The electronic components on the upper control card are located in each compartment, and at least one side of the electronic components on the upper control card abuts against the inner wall of the compartment. An upper cover plate is fixed to the upper end of the upper chamber. The bottom of the lower chamber is provided with a lower control card and a lower partition. The lower partition is located below the lower control card and is fixed to the bottom of the lower chamber by screws. The upper end of the lower partition abuts against the lower wall of the lower control card. Multiple partition holes are opened on the lower partition. The electronic components on the lower control card are located in each partition hole, and at least one side of the electronic components on the lower control card abuts against the inner wall of the partition hole. A lower cover is fixed to the lower end of the lower chamber.

[0006] Furthermore, the upper control card is also equipped with multiple pressure strips, which are fixed to the bottom of the upper chamber by screws, and the lower wall of the pressure strip abuts against the upper end of the electronic components on the upper control card.

[0007] Furthermore, an inner groove is formed on the inner circumference of the upper chamber, and an inner cover is provided on the inner side of the upper cover plate, with the inner cover embedded in the inner groove.

[0008] Furthermore, an inner annular groove is formed on the inner circumference of the lower chamber, and a sealing cap is provided on the inner side of the lower cover, with the sealing cap embedded in the inner annular groove.

[0009] Furthermore, the upper control card and the lower control card are electrically connected to multiple radio frequency connectors. The lower ends of the radio frequency connectors are all located on the lower cover, and the radio frequency connectors on the upper control card pass through the bottom of the upper chamber and the lower control card and / or the lower partition.

[0010] Furthermore, low-frequency connectors are connected to the upper control card and the lower control card respectively. The lower ends of the low-frequency connectors are respectively inserted through the lower cover. The low-frequency connector on the upper control card is inserted through the bottom of the upper chamber and the lower control card.

[0011] The advantages of the above technical solution are: This invention employs a dual-cavity design, dividing the internal circuitry into two sides. It includes two RF circuit boards: an upper control card and a lower control card, integrating an SMP RF connector and a J63A low-frequency connector. The main RF functions are implemented using SiP integration technology. The dual-cavity design evenly distributes the gain of the RF link across both sides, achieving physical isolation and enhancing electromagnetic shielding. Simultaneously, the power amplifier and RF front-end circuitry, located on the same side, are physically isolated by the upper and lower partitions, ensuring effective electromagnetic shielding.

[0012] This invention involves attaching 0.05mm thick indium sheets to the bottom of the upper and lower chambers and using a sintering process to weld the power amplifier module onto the heat sink of the chamber, thereby shortening the heat conduction path and achieving a contact thermal resistance ≤0.5℃ / W, thus ensuring efficient heat conduction. Attached Figure Description

[0013] To make the objectives, technical solutions, and advantages of this utility model clearer, the following will provide a further detailed description of this utility model in conjunction with the accompanying drawings.

[0014] Figure 1 A three-dimensional structure of one embodiment is shown. Figure 1 .

[0015] Figure 2 A three-dimensional structure of one embodiment is shown. Figure 2 .

[0016] Figure 3 A three-dimensional structure of one embodiment is shown. Figure 3 .

[0017] Figure 4 A three-dimensional structure of one embodiment is shown. Figure 4 . Detailed Implementation

[0018] like Figures 1-4 As shown, a highly integrated wide and narrow band radio frequency transceiver module includes a housing 1. The housing 1 has a flat structure. An upper chamber 10 is formed with an opening on the upper surface of the housing 1, and a lower chamber 12 is formed with an opening on the lower surface of the housing 1.

[0019] The upper chamber 10 has an upper control card 4 and an upper partition 5 at its bottom. The upper partition 5 is located on the upper side of the upper control card 4 and is fixed to the bottom of the upper chamber 10 by screws. The lower end of the upper partition 5 abuts against the upper wall of the upper control card 4. The upper partition 5 has multiple cavities 51. The electronic components on the upper control card 4 are located in each cavity 51, and at least one side of the electronic components on the upper control card 4 abuts against the inner wall of the cavity 51. The upper cover 2 is fixed to the upper end of the upper chamber 10.

[0020] The bottom of the lower chamber 12 is provided with a lower control card 6 and a lower partition 7. The lower partition 7 is located below the lower control card 6 and is fixed to the bottom of the lower chamber 12 by screws. The upper end of the lower partition 7 abuts against the lower wall of the lower control card 6. Multiple partition holes 70 are opened on the lower partition 7. The electronic components on the lower control card 6 are located in each partition hole 70, and at least one side of the electronic components on the lower control card 6 abuts against the inner wall of the partition hole 70. A lower cover 3 is fixed to the lower end of the lower chamber 12. In this way, the heat dissipation effect of the electronic components is improved.

[0021] The upper control card 4 is also provided with multiple pressure strips 50. The pressure strips 50 are fixed to the bottom of the upper chamber 10 by screws. The lower wall of the pressure strip 50 abuts against the upper end of the electronic components on the upper control card 4. The pressure strip 50 not only serves to fix the electronic components, but also has the effect of improving the heat dissipation of high-power devices.

[0022] The upper chamber 10 has an inner groove 11 formed on its inner circumference, and the upper cover plate 2 has an inner cover on its inner side, which is embedded in the inner groove 11. The lower chamber 12 has an inner ring groove 13 formed on its inner circumference, and the lower cover 3 has a sealing cover on its inner side, which is embedded in the inner ring groove 13, thereby improving the sealing effect.

[0023] Multiple radio frequency (RF) connectors 8 are electrically connected to the upper control card 4 and the lower control card 6. The lower ends of the RF connectors 8 are all located on the lower cover 3, and the RF connectors 8 on the upper control card 4 pass through the bottom of the upper chamber 10 and the lower control card 6 and / or the lower partition 7. Low-frequency connectors 9 are connected to the upper control card 4 and the lower control card 6, respectively. The lower ends of the low-frequency connectors 9 pass through the lower cover 3, and the low-frequency connectors 9 on the upper control card 4 pass through the bottom of the upper chamber 10 and the lower control card 6. The low-frequency connectors are used for power input and transmission of related control signals, while the RF connectors are used for transmission of antenna signals.

[0024] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations of this utility model fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A highly integrated wide and narrowband radio frequency transceiver module, characterized in that, Includes a shell (1), which has a flat structure. An upper chamber (10) is formed on the upper surface of the shell (1), and a lower chamber (12) is formed on the lower surface of the shell (1). The upper chamber (10) is provided with an upper control card (4) and an upper partition (5) at the bottom. The upper partition (5) is located on the upper side of the upper control card (4). The upper partition (5) is fixed to the bottom of the upper chamber (10) by screws. The lower end of the upper partition (5) abuts against the upper wall of the upper control card (4). Multiple cavities (51) are opened on the upper partition (5). The electronic components on the upper control card (4) are located in each cavity (51). At least one side of the electronic components on the upper control card (4) abuts against the inner wall of the cavity (51). The upper end of the upper chamber (10) is fixed with an upper cover plate (2). The bottom of the lower chamber (12) is provided with a lower control card (6) and a lower partition (7). The lower partition (7) is located on the lower side of the lower control card (6). The lower partition (7) is fixed to the bottom of the lower chamber (12) by screws. The upper end of the lower partition (7) abuts against the lower wall of the lower control card (6). Multiple partition holes (70) are opened on the lower partition (7). The electronic components on the lower control card (6) are located in each partition hole (70), and at least one side of the electronic components on the lower control card (6) abuts against the inner wall of the partition hole (70). The lower end of the lower chamber (12) is fixed with a lower cover (3).

2. The highly integrated wide and narrowband RF transceiver module according to claim 1, characterized in that, The upper control card (4) is also provided with multiple pressure strips (50). The pressure strips (50) are fixed to the bottom of the upper chamber (10) by screws, and the lower wall of the pressure strips (50) abuts against the upper end of the electronic components on the upper control card (4).

3. The highly integrated wide and narrowband RF transceiver module according to claim 1, characterized in that, The inner circumferential side of the upper chamber (10) is formed with an inner groove (11), and the inner side of the upper cover plate (2) is provided with an inner cover, which is embedded in the inner groove (11).

4. The highly integrated wide and narrowband RF transceiver module according to claim 1, characterized in that, The inner circumferential side of the lower chamber (12) is formed with an inner ring groove (13), and the inner side of the lower cover (3) is provided with a sealing cover, which is embedded in the inner ring groove (13).

5. The highly integrated wide and narrowband RF transceiver module according to claim 1, characterized in that, Multiple radio frequency connectors (8) are electrically connected to the upper control card (4) and the lower control card (6). The lower ends of the radio frequency connectors (8) are all located on the lower cover (3), and the radio frequency connectors (8) located on the upper control card (4) pass through the bottom of the upper chamber (10) and the lower control card (6) and / or the lower partition (7).

6. The highly integrated wide and narrowband RF transceiver module according to claim 1, characterized in that, Low-frequency connectors (9) are connected to the upper control card (4) and the lower control card (6) respectively. The lower ends of the low-frequency connectors (9) are respectively inserted through the lower cover (3). The low-frequency connectors (9) on the upper control card (4) are inserted through the bottom of the upper chamber (10) and the lower control card (6).

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