Integrated heat sink for semiconductor fluidic component and fluidic component

Abstract

The utility model provides a kind of integrated radiator and flow control component for semiconductor flow control component, it is related to control valve technical field, and flow control component includes valve body, valve rod and electric control system, one end of valve rod is inserted into valve body for installing valve plate, electric control system is used to drive valve rod rotation to drive valve plate rotation to realize fluid control, radiator is sleeved on valve rod and is located between valve body and the electric control system to carry out heat dissipation, radiator includes: integrally formed valve body connecting seat, at least one piece of fin and electric control system connecting platform, the central position of radiator is provided with valve rod passage, to be sleeved on valve rod with radiator;Valve body connecting seat is used to be fixedly connected with valve body;Fin is used to dissipate excess heat in valve body;Electric control system connecting platform is used to install electric control system.The utility model can replace traditional heat dissipation system by the integrated radiator of aluminium alloy die casting, significantly reduce material, processing, assembly and quality cost.

Description

Technical Field

[0001] This utility model relates to the field of control valve technology, specifically to an integrated heat sink and flow control component for semiconductor flow control components. Background Technology

[0002] In the semiconductor industry, flow control components are widely used in various process technologies to achieve precise control of the flow rate of various media. For example, butterfly valves are commonly used to control the flow rate of fluids in gas pipelines. In specific applications, some scenarios involve high-temperature media flowing through the pipeline, while others require heating treatment, necessitating the integration of heating components into the butterfly valve. However, the system controlling the butterfly valve's operation contains critical electrical components that cannot withstand high temperatures; therefore, the butterfly valve must be equipped with a corresponding heat dissipation system.

[0003] The existing butterfly valve with heat dissipation function has the following structure for its heat dissipation system: 1. Uses 4 stainless steel heat sinks; 2. The heat sink is mounted on a stainless steel heat sink bracket; 3. Stainless steel supports and spacers are placed between the heat sinks to support and separate them; 4. Configure wave springs to achieve preload and compensate for gaps caused by part precision deviations; 5. Connect the heat sink and the heat sink bracket via the waist-shaped connector; 6. Use round nuts to press and fix the heat sink to the heat sink bracket.

[0004] The existing heat dissipation system described above has the following technical defects: 1. High material costs: The entire heat dissipation system consists of 16 components, all of which are made of precious metals; 2. High processing costs: Stainless steel is inherently difficult to process, and the large number of components leads to higher overall processing costs. 3. High assembly cost: The large number of components makes the assembly process complicated and the workload large. 4. High quality costs: On the one hand, there is a scrap rate in the processing of each component, and the accumulation of multiple components leads to an increase in the total scrap rate; on the other hand, the large number of components increases the difficulty of controlling assembly accuracy, further pushing up the quality control costs. Utility Model Content

[0005] In view of the deficiencies in the prior art, this utility model provides an integrated heat sink and flow control component for semiconductor flow control components.

[0006] According to the present invention, an integrated heat sink and flow control component for semiconductor flow control are provided, the solution is as follows: In a first aspect, an integrated heat sink is provided for a semiconductor flow control component, the flow control component including a valve body, a valve stem, and an electronic control system. One end of the valve stem extends into the valve body for mounting a valve plate. The electronic control system drives the valve stem to rotate, thereby rotating the valve plate to achieve fluid control. The heat sink is sleeved on the valve stem and located between the valve body and the electronic control system for heat dissipation. The heat sink is characterized in that... The radiator includes: an integrally formed valve body connecting seat, at least one heat sink, and an electronic control system connecting platform. A valve stem channel is provided through the center of the radiator so that the radiator can be sleeved on the valve stem. The valve body connector is used for fixed connection with the valve body; the heat sink is used for dissipating excess heat inside the valve body; the electronic control system connection platform is used for installing the electronic control system.

[0007] Preferably, there are multiple heat sinks, and adjacent heat sinks are connected by reinforcing ribs, which are laterally connected between adjacent heat sinks along the length of the heat sink.

[0008] Preferably, the system further includes stiffeners for fixing the electrical control system connection platform and / or the valve body connection seat to the adjacent heat sink, and the stiffeners are arranged along the length of the heat sink. Preferably, it further includes a heat dissipation ring sleeved on the valve stem, the heat dissipation ring being integrally formed between the heat dissipation fin and the valve body connecting seat.

[0009] Preferably, the outer edges of the two opposite sides of the electronic control system connection platform are respectively provided with arc-shaped bosses. The arc-shaped bosses are adapted to the mounting base of the electronic control system, and the arc-shaped bosses are coaxially arranged with the valve stem channel to facilitate the installation of the valve stem and the electronic control system.

[0010] Preferably, the two arc-shaped protrusions are disposed on both sides of the electronic control system connection platform along the length direction of the heat sink.

[0011] Preferably, the radiator is a one-piece die-cast aluminum alloy structure.

[0012] Preferably, the outer surface of the heat dissipation ring is provided with a plurality of axial heat dissipation grooves.

[0013] Preferably, the electrical control system connection platform is provided with multiple fastener mounting holes; The fastener mounting holes are located on both sides of the electronic control system connection platform along the length of the heat sink.

[0014] Secondly, a flow control component is provided, the flow control component including: a valve body, a valve stem, an electronic control system, and the aforementioned integrated heat sink; One end of the valve stem extends into the valve body for mounting the valve plate. The electronic control system drives the valve stem to rotate, thereby rotating the valve plate to achieve fluid control. The radiator is sleeved on the valve stem and located between the valve body and the electronic control system for heat dissipation.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. Material costs are significantly reduced. The existing heat dissipation system consists of 16 stainless steel components, which are precious metals. In contrast, this utility model adopts an integrated structure of die-cast aluminum alloy, which is only a single component. By volume, the material price of die-cast aluminum alloy is much lower than that of stainless steel, which directly and significantly reduces the amount of precious metals used and reduces material procurement costs from the source. 2. Processing costs are significantly reduced. Stainless steel is inherently difficult to process, while aluminum alloy has better processing performance. Die casting can directly complete most of the structure, reducing complex machining steps and lowering processing difficulty. Existing technology requires the individual processing of 13 stainless steel parts, which is a huge workload. This utility model is only a single integrated component, which greatly reduces the amount of processing and the processing cost can be reduced by more than 95%. 3. Assembly costs are reduced to the minimum. Existing heat dissipation systems contain 16 components, which require precise assembly to avoid deviations. The assembly process is cumbersome, labor-intensive, and time-consuming. However, this utility model integrates the original multi-component system into a single integrated heat sink, eliminating the need for assembly operations between components. The assembly workload is reduced to zero, completely eliminating the labor and time costs in the assembly process. 4. Quality costs are effectively controlled. In existing technologies, each of the 13 processed parts has a processing scrap rate of 13‰, and the cumulative scrap rate of multiple components leads to a high overall scrap risk. However, the processing scrap rate of a single component in this utility model is much lower than the cumulative scrap rate of multiple components, significantly improving the processing qualification rate by 13 times and significantly reducing the processing scrap rate. Secondly, due to the large number of components in existing technologies, it is difficult to control the assembly accuracy and assembly errors are prone to occur. However, this utility model eliminates the need for assembly, fundamentally avoiding the assembly accuracy problem, further improving the overall product quality stability, reducing the rework and scrap costs caused by quality problems, and improving the assembly qualification rate.

[0016] Other beneficial effects of this utility model will be explained in detail through the introduction of specific technical features and technical solutions in the specific embodiments. Those skilled in the art should be able to understand the beneficial technical effects brought about by the technical features and technical solutions through the introduction of these technical features and technical solutions. Attached Figure Description

[0017] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0018] Reference numerals: 1. Valve body connecting seat; 2. Heat sink; 3. Heat sink ring; 31. Heat sink groove; 4. Valve stem channel; 5. Electrical control system connection platform; 51. Arc-shaped boss; 52. Fastener mounting hole; 6. Rib plate; 7. Reinforcing rib. Detailed Implementation

[0019] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the present invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0020] This utility model provides an integrated heat sink for semiconductor flow control components, see reference. Figure 1 As shown, this radiator is a one-piece die-cast aluminum alloy structure used in heat-dissipating butterfly valves for heat dissipation and connection to electrical control components. Alternatively, this one-piece radiator can also be made of cast stainless steel or cast copper, or forged stainless steel or forged copper.

[0021] Specifically, the flow control component includes a valve body, a valve stem, and an electronic control system. One end of the valve stem extends into the valve body for mounting a valve plate. The electronic control system drives the valve stem to rotate, thereby rotating the valve plate and achieving fluid control. A radiator is fitted onto the valve stem and located between the valve body and the electronic control system for heat dissipation. The radiator includes: a valve body connecting seat 1, multiple heat sinks 2, heat dissipation rings 3, a valve stem channel 4, and an electrical control system connecting platform 5. In this embodiment, the number of heat sinks 2 is set to three, and the number of heat dissipation rings 3 is set to five. The specific number can be set according to the actual application scenario and requirements.

[0022] Specifically, the functions of each component are as follows: valve body connecting seat 1 is used for fixed connection with the valve body of the butterfly valve; heat sink 2 is used to dissipate excess heat inside the butterfly valve body to prevent the electrical control system from overheating; valve stem channel 4 is for the valve stem of the butterfly valve to pass through, so that the electrical control system can control the butterfly valve through the valve stem; electrical control system connecting platform 5 is used to install the electrical control system of the butterfly valve, and the electrical control system controls the butterfly valve through the valve stem.

[0023] In some embodiments, a stiffener 6 is fixedly connected between the radiator's electrical control system connection platform 5 and / or valve body connection seat 1 and its adjacent heat sink 2. The stiffener 6 is arranged along the length direction of the heat sink 2 to increase the structural strength between the heat sink 2 structure and the electrical control system connection platform 5 and / or valve body connection seat 1. In this embodiment, the number of stiffeners 6 is set to two.

[0024] In some embodiments, a reinforcing rib 7 is also provided between adjacent heat sink fins 2. The reinforcing rib 7 is arranged along the length of the heat sink fin 2 and is laterally connected to the two adjacent heat sink fins 2 to maintain the structural rigidity of the heat sink fin 2, taking into account both strength and heat dissipation effect. The specific number and size of the heat sink fins 2 are calculated based on the heat dissipation efficiency under actual working conditions. A preset gap is maintained between adjacent heat sink fins 2 to ensure heat dissipation effect and facilitate manufacturing process (demolding). The stiffening plate 6 is located at the end of the heat sink fin 2 near the electrical control system connection platform 5, and the reinforcing rib 7 is located in the middle area of ​​the heat sink fin 2, together forming a support for the heat sink fin 2. In this embodiment, the reinforcing rib 7 is located between adjacent heat sink fins 2, and the setting direction is consistent with that of the stiffening plate 6, with four symmetrically arranged ribs 7.

[0025] A heat dissipation ring 3 is fitted around the outer circumference of the valve stem. The heat dissipation ring 3 is integrally formed between the heat sink 2 and the valve body connecting seat 1, providing fixed support for the heat sink 2 while also ensuring heat dissipation. This further enhances the overall heat dissipation capacity and reduces the size of the heat sink 2. The cross-sectional area of ​​the heat dissipation ring 3 is smaller than that of the heat sink 2, and the outer surface of the heat dissipation ring 3 has several axial heat dissipation grooves 31. The axis of the heat dissipation ring 3 is collinear with the axis of the valve stem channel 4, and the outer diameter of the heat dissipation ring 3 is smaller than the outer diameter of the valve body connecting seat 1. This avoids spatial interference between the heat dissipation ring 3 and the valve body's connecting surface, bolt holes, or surrounding pipe structures during the assembly of the radiator and valve body, ensuring smooth assembly. Simultaneously, it reduces the material usage of the heat dissipation ring while maintaining its auxiliary heat dissipation function.

[0026] The electrical control system connection platform 5 is located at the end of the radiator away from the valve body connection seat 1, and the valve stem channel 4 passes through the electrical control system connection platform 5 and extends to the valve body connection seat 1. Simultaneously, arc-shaped bosses 51 are provided on the opposite outer edges of the electrical control system connection platform 5. Specifically, these bosses can be located on both sides of the electrical control system connection platform along the length of the heat sink 2. The arc-shaped bosses 51 are adapted to the mounting base of the electrical control system, and are coaxially arranged with the valve stem channel 4 to facilitate the positioning and installation of the valve stem and the electrical control system. Furthermore, the electrical control system connection platform 5 is also provided with multiple fastener mounting holes 52. These fastener mounting holes 52 are specifically located on both sides of the electrical control system connection platform 5 along the length of the heat sink 2. In actual processing, the fastener mounting holes 52 are integrally formed with the reinforcing ribs 7 and rib plates 6, thereby improving the structural strength of the radiator.

[0027] This utility model also provides a flow control component, which includes a valve body, a valve stem, an electronic control system, and the aforementioned integrated radiator; wherein, one end of the valve stem extends into the valve body for mounting a valve plate, the electronic control system is used to drive the valve stem to rotate, thereby driving the valve plate to rotate to achieve fluid control, and the radiator is sleeved on the valve stem and located between the valve body and the electronic control system for heat dissipation.

[0028] This utility model provides an integrated heat sink and flow control component for semiconductor flow control, significantly reducing material costs. Existing technologies use stainless steel, while the new structure uses die-cast aluminum alloy, resulting in a substantial reduction in material costs for the same volume. Secondly, existing technologies using stainless steel involve significant processing work, are difficult to manufacture, and have numerous components. The new structure of this utility model reduces the number of components, resulting in a cost reduction of over 95%. Existing heat dissipation systems consist of 16 components requiring careful assembly to prevent deviations. The new structure of this utility model uses only one component, eliminating the original assembly workload and significantly reducing it. Of the 16 components in existing heat dissipation systems, 13 are machined. Assuming a 13‰ scrap rate for each machined component, the quality pass rate is increased by 13 times. Due to simplified assembly, the assembly pass rate is also improved, resulting in a significant reduction in quality costs.

[0029] Those skilled in the art will understand that, besides implementing the system and its various devices, modules, and units provided by this utility model in the form of purely computer-readable program code, the same functions can be achieved entirely through logical programming of the method steps, enabling the system and its various devices, modules, and units to function in the form of logic gates, switches, application-specific integrated circuits, programmable logic controllers, and embedded microcontrollers. Therefore, the system and its various devices, modules, and units provided by this utility model can be considered a hardware component, and the devices, modules, and units included therein for implementing various functions can also be considered structures within the hardware component; alternatively, the devices, modules, and units for implementing various functions can be considered both software modules implementing the method and structures within the hardware component.

[0030] The specific embodiments of this utility model have been described above. It should be understood that this utility model is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the substantive content of this utility model. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. An integrated heat sink for a semiconductor flow control component, the flow control component comprising a valve body, a valve stem, and an electronic control system, one end of the valve stem extending into the valve body for mounting a valve plate, the electronic control system for driving the valve stem to rotate to rotate the valve plate thereby achieving fluid control, the heat sink being sleeved on the valve stem and located between the valve body and the electronic control system for heat dissipation, characterized in that, The radiator includes: an integrally formed valve body connecting seat (1), at least one heat sink (2) and an electronic control system connecting platform (5). A valve stem channel (4) is provided through the center of the radiator so as to fit the radiator onto the valve stem. The valve body connecting seat (1) is used to fix the valve body; the heat sink (2) is used to dissipate excess heat inside the valve body; the electronic control system connecting platform (5) is used to install the electronic control system.

2. The integrated heat sink for semiconductor flow control components according to claim 1, characterized in that, There are multiple heat sinks (2), and adjacent heat sinks (2) are connected by reinforcing ribs (7). The reinforcing ribs (7) are laterally connected between adjacent heat sinks (2) along the length direction of the heat sink (2).

3. The integrated heat sink for semiconductor flow control components according to claim 1, characterized in that, It also includes a stiffener (6), which is used to fix the electrical control system connection platform (5) and / or the valve body connection seat (1) to the heat sink (2) adjacent to it. The stiffener (6) is arranged along the length direction of the heat sink (2).

4. The integrated heat sink for semiconductor flow control components according to claim 1, characterized in that, It also includes a heat dissipation ring (3) sleeved on the valve stem, the heat dissipation ring (3) being integrally formed between the heat dissipation fin (2) and the valve body connecting seat (1).

5. The integrated heat sink for semiconductor flow control components according to claim 1, characterized in that, The two outer edges of the connecting platform (5) of the electronic control system are respectively provided with arc-shaped bosses (51). The arc-shaped bosses (51) are adapted to the mounting base of the electronic control system, and the arc-shaped bosses (51) are coaxially arranged with the valve stem channel (4) to facilitate the installation of the valve stem and the electronic control system.

6. The integrated heat sink for semiconductor flow control components according to claim 5, characterized in that, The two arc-shaped protrusions (51) are disposed on both sides of the electronic control system connection platform (5) along the length direction of the heat sink (2).

7. The integrated heat sink for semiconductor flow control components according to claim 1, characterized in that, The radiator is a one-piece die-cast aluminum alloy structure.

8. The integrated heat sink for semiconductor flow control components according to claim 4, characterized in that, The outer surface of the heat dissipation ring (3) is provided with several axial heat dissipation grooves (31).

9. The integrated heat sink for semiconductor flow control components according to claim 8, characterized in that, The electronic control system connection platform (5) is provided with multiple fastener mounting holes (52). The fastener mounting holes (52) are located on both sides of the electronic control system connection platform (5) along the length of the heat sink (2).

10. A flow control component, characterized in that, Includes a valve body, valve stem, electronic control system, and an integrated radiator as described in any one of claims 1-9; One end of the valve stem extends into the valve body for mounting the valve plate. The electronic control system drives the valve stem to rotate, thereby rotating the valve plate to achieve fluid control. The radiator is sleeved on the valve stem and located between the valve body and the electronic control system for heat dissipation.

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