An LED filament and a bulb applying the same

Abstract

The application relates to the lighting field and discloses an LED filament and a bulb applying the LED filament, the LED filament comprising an LED chip, a light conversion layer and two electrodes, characterized in that the light conversion layer covers the LED chip and at least part of the two electrodes; an external surface of the light conversion layer is provided with a layered body, the layered body covers the light conversion layer and covers at least part of the electrodes; the light conversion layer comprises a top layer and a base layer, the layered body comprises an upper layered body and a lower layered body, the lower layered body, the base layer, the top layer and the upper layered body are sequentially stacked; a plurality of first wires are further included, the two electrodes and the LED chip, the LED chip and the LED chip are connected through the first wires, the LED chip comprises a plurality of first LED chips and a plurality of second LED chips, the plurality of first LED chips and the plurality of second LED chips are connected in series between the two electrodes, the two electrodes, the plurality of first LED chips and the plurality of second LED chips form a conductive path in the top layer and the base layer.

Description

Technical Field

[0001] This application relates to the field of lighting, and more particularly to an LED filament and a light bulb using an LED filament. Background Technology

[0002] LEDs have advantages such as being environmentally friendly, energy-saving, highly efficient, and having a long lifespan, which is why they have received widespread attention in recent years and are gradually replacing traditional lighting fixtures. However, the light emitted by traditional LED light sources is directional, unlike traditional lamps which can provide wide-angle illumination. Therefore, applying LEDs to traditional lamps presents corresponding challenges depending on the type of lamp.

[0003] In recent years, LED filaments, which enable LED light sources to emit light similarly to traditional tungsten bulbs and achieve 360° omnidirectional illumination, have gained increasing attention in the industry. These LED filaments are manufactured by connecting multiple LED chips in series and fixing them onto a narrow, elongated glass substrate. The entire glass substrate is then encased in silicone doped with phosphor, and finally, electrical connections are made. In addition, there is a type of flexible LED filament, similar in structure to the above, but the glass substrate is replaced with a flexible printed circuit board (FPC), allowing the filament to have a certain degree of bending. However, flexible filaments made using FPCs have drawbacks, such as the difference in thermal expansion coefficients between the FPC and the silicone covering the filament, leading to LED chip displacement or even delamination over time. Alternatively, FPCs are not conducive to flexible changes in manufacturing processes.

[0004] Currently, a substrate-free flexible filament structure replaces the traditional structure that requires mounting the chip on a substrate before coating phosphor / encapsulation with a flexible phosphor package that has wavelength conversion capabilities. However, some filament structures present challenges to the stability of the metal wire bonding between the chips when bent. When the chips are densely arranged in the filament, connecting adjacent LED chips via metal wire bonding can easily lead to excessive stress concentration in specific parts of the filament during bending, causing damage or even breakage of the metal wire bonding connecting the LED chips. Therefore, some embodiments still have room for improvement in quality.

[0005] In existing flexible filament products, different bulb housing types impose different requirements on the shape of the LED filament, resulting in varying filament lengths. For the same filament using the same number of LED chips, a longer filament means a larger spacing between adjacent LED chips. When the filament is lit, the visible light spots (or graininess) become more pronounced, severely impacting user comfort.

[0006] In existing technologies, most LED lights use a combination of blue LED chips and yellow phosphors to emit white light. However, the emission spectrum of LED lights is weak in the red light region, resulting in a low color rendering index (CRI) and difficulty in achieving low color temperatures. To improve the CRI, green and red phosphors are typically added. However, red phosphors have a relatively low conversion rate, which usually leads to a decrease in the overall luminous flux of the LED light, i.e., a decrease in luminous efficacy. Secondly, the red, green, and blue cone cells in the human eye have different sensitivities. If red light is lacking, green and blue light will create a cyan image in the human eye, reducing the color gamut and making the lighting scene not only dull and uninteresting but also affecting the quality of the lighting environment. Furthermore, using lighting with high CRI can improve people's perception of space, while low CRI affects the ability to distinguish objects and accurately perceive the surrounding environment.

[0007] Existing LED filaments typically only have a mixture of phosphor adhesive coated on their outer surface. Since different color temperatures of the phosphor adhesive will produce different colors after drying, when multiple LED filaments of different color temperatures are installed, the result is a chaotic mix of colors, making the LED lights less aesthetically pleasing when used as decorative lights. Some solutions incorporate graphene adhesive layers on both the top and bottom of the substrate, using graphene in different colors to address the visual impact of varying phosphor adhesive colors. However, graphene production is expensive and can pollute the environment.

[0008] LED chips have a first light-emitting surface and a second light-emitting surface, which are opposite to each other. Light emitted from the first light-emitting surface (front side) is directed toward the top layer, and light emitted from the second light-emitting surface (back side) is directed toward the carrier layer. Generally, the back side of flip-chip or back-plated positive LED chips is basically opaque. The brightness difference between the front and back sides of the LED chip is large. If the above-mentioned LED chip is used in the LED filament, the luminous flux in some directions will be less after the LED filament is wound, and the light output of the LED bulb will be uneven.

[0009] Furthermore, LED filaments are typically incorporated into LED bulbs. To achieve an aesthetically pleasing appearance and to ensure more uniform and widespread illumination, the filaments are often bent into various curves. However, since LED chips are arranged within the filament, and LED chips are relatively rigid, it's difficult to bend the filament into the desired shape. Additionally, LED filaments are prone to cracking due to stress concentration during bending.

[0010] In addition, LED filaments are generally arranged in a straight line around the core column. The LED filaments emit very little light near the two ends. When one end of multiple LED filaments is installed close to each other near the top of the bulb's light emission point, a dark area will be formed in the direction of light emission from the bulb's central axis. This will result in uneven spatial distribution of output light, uneven illuminance distribution, and problems such as "darkness under the lamp".

[0011] Currently, LED filament lamps typically use a driver power supply to convert AC to DC before driving the light emission. However, the process of rectifying AC to DC in the driver power supply introduces ripple, which can cause flickering when the LED filament is emitting light. To reduce or even eliminate the flickering during LED filament illumination, electrolytic capacitors for ripple reduction are usually added to the driver power supply. However, the heat generated by the heating elements in the driver power supply can significantly impact the lifespan of these electrolytic capacitors.

[0012] When a lighting device contains multiple LED components, each LED component needs to be driven by a different current. This inevitably increases the circuit complexity and cost if multiple drivers are used. Therefore, a shunt circuit is needed to distribute the current among the multiple LED components.

[0013] This application is a further optimization of the above application to better meet the needs of various processes and products. Summary of the Invention

[0014] It should be noted that this disclosure may actually include one or more inventive embodiments that are currently claimed or have not yet been claimed, and in order to avoid confusion caused by unnecessary distinctions between these inventions in the course of drafting the specification, the various possible inventive embodiments herein may be collectively referred to as "this application".

[0015] Many embodiments of this application are briefly described herein. However, the term "this application" is used only to describe certain embodiments disclosed herein (whether or not they are included in the claims), and not a complete description of all possible embodiments. Certain embodiments of various features or aspects of this application described below may be combined in different ways to form an LED light bulb or a portion thereof.

[0016] This application provides an LED filament, which includes an LED chip, a light conversion layer, and two electrodes, characterized in that:

[0017] The light conversion layer covers the LED chip and at least part of the two electrodes;

[0018] The light conversion layer has a layered structure on its outer surface, which covers the light conversion layer and at least a portion of the electrode. The light conversion layer includes a top layer and a base layer, and the layered structure includes an upper layer and a lower layer, which are stacked sequentially. The light conversion layer also includes multiple first wires, which connect the two electrodes to the LED chip and to each other. The LED chip includes multiple first LED chips and multiple second LED chips, which are connected in series between the two electrodes. The two electrodes, the multiple first LED chips, and the multiple second LED chips form a conductive path between the top layer and the base layer.

[0019] In one embodiment of this application, the first LED chip in the top layer and the second LED chip in the base layer are arranged alternately.

[0020] In one embodiment of this application, each first LED chip includes a first electrical connection portion and a second electrical connection portion, and each second LED chip includes a third electrical connection portion and a fourth electrical connection portion, wherein the first electrical connection portion, the second electrical connection portion, the third electrical connection portion and the fourth electrical connection portion all face the upper layer.

[0021] In one embodiment of this application, the first electrical connection portion of the first LED chip is connected to the fourth electrical connection portion of an adjacent second LED chip via the first wire, and the second electrical connection portion of the first LED chip is connected to the third electrical connection portion of another adjacent second LED chip via the first wire.

[0022] In one embodiment of this application, the first LED chip and / or the second LED chip adjacent to the two electrodes are connected to the two electrodes via the first wire.

[0023] In one embodiment of this application, the thickness of the layered body is less than or equal to the thickness of the light conversion layer.

[0024] In one embodiment of this application, the thickness of the layered body is less than or equal to the thickness of the top layer.

[0025] In one embodiment of this application, the first conductor is located in the top layer.

[0026] This application provides an LED filament, which includes an LED chip, a light conversion layer, and two electrodes, characterized in that:

[0027] The light conversion layer covers the LED chip and at least part of the two electrodes;

[0028] A layered structure is disposed on the outer surface of the light conversion layer, the layered structure covering the light conversion layer and at least a portion of the electrode; the light conversion layer includes a top layer and a base layer, the layered structure includes an upper layer and a lower layer, the lower layer, the base layer, the top layer and the upper layer are stacked sequentially; the top layer is disposed of a plurality of first LED chips, the base layer is disposed of a plurality of second LED chips, the first LED chips in the top layer and the adjacent second LED chips in the base layer at least partially overlap, the first LED chips and the adjacent second LED chips are directly conductive, the plurality of first LED chips and the plurality of second LED chips are connected in series between the two electrodes, the two electrodes, the plurality of first LED chips and the plurality of second LED chips form a conductive path in the top layer and the base layer.

[0029] In one embodiment of this application, each first LED chip includes a first electrical connection portion and a second electrical connection portion, and each second LED chip includes a third electrical connection portion and a fourth electrical connection portion, wherein the first electrical connection portion, the second electrical connection portion, the third electrical connection portion and the fourth electrical connection portion all face the upper layer.

[0030] In one embodiment of this application, the first LED chip and the adjacent second LED chip are connected by a first electrical connection portion of the first LED chip to a fourth electrical connection portion of the adjacent second LED chip, or the third connection portion of the second LED chip is directly connected to a second electrical connection portion of the first LED chip.

[0031] In one embodiment of this application, the first LED chip and / or the second LED chip adjacent to the two electrodes are connected to the two electrodes via the first wire.

[0032] In one embodiment of this application, the fourth electrical connection portion of the second LED chip is connected to the first electrical connection portion of the first LED chip, and the second electrical connection portion of the first LED chip is connected to the third electrical connection portion of the second LED chip via conductive silver paste or solder paste.

[0033] In one embodiment of this application, the top layer and the bottom layer form a current path through the first LED chip and the second LED chip.

[0034] In one embodiment of this application, the thickness of the layered body is less than or equal to the thickness of the top layer.

[0035] This application provides an LED filament bulb, characterized in that it includes: a lamp holder, a lamp housing connected to the lamp holder, at least two conductive supports, a cantilever, a core post and at least one LED filament disposed in the lamp housing, wherein the LED filament includes an LED chip, a light conversion layer and two electrodes;

[0036] The light conversion layer has a layered structure on its outer surface, which covers the light conversion layer and at least a portion of the electrode. The light conversion layer includes a top layer and a base layer, and the layered structure includes an upper layer and a lower layer, which are stacked sequentially. The light conversion layer also includes multiple first wires, which connect the two electrodes to the LED chip and to each other. The LED chip includes multiple first LED chips and multiple second LED chips, which are connected in series between the two electrodes. The two electrodes, the multiple first LED chips, and the multiple second LED chips form a conductive path between the top layer and the base layer.

[0037] In one embodiment of this application, the first LED chip in the top layer and the second LED chip in the base layer are arranged alternately.

[0038] In one embodiment of this application, each first LED chip includes a first electrical connection portion and a second electrical connection portion, and each second LED chip includes a third electrical connection portion and a fourth electrical connection portion, wherein the first electrical connection portion, the second electrical connection portion, the third electrical connection portion and the fourth electrical connection portion all face the upper layer.

[0039] In one embodiment of this application, the first electrical connection portion of the first LED chip is connected to the fourth electrical connection portion of an adjacent second LED chip via the first wire, and the second electrical connection portion of the first LED chip is connected to the third electrical connection portion of another adjacent second LED chip via the first wire.

[0040] In one embodiment of this application, the first LED chip and / or the second LED chip adjacent to the two electrodes are connected to the two electrodes via the first wire.

[0041] In one embodiment of this application, the thickness of the layered body is less than or equal to the thickness of the light conversion layer.

[0042] In one embodiment of this application, the thickness of the layered body is less than or equal to the thickness of the top layer.

[0043] In one embodiment of this application, the first conductor is located in the top layer.

[0044] This application provides an LED filament bulb, characterized in that it includes: a lamp holder, a lamp housing connected to the lamp holder, at least two conductive supports, a cantilever, a core post and at least one LED filament disposed in the lamp housing, wherein the LED filament includes an LED chip, a light conversion layer and two electrodes;

[0045] A layered structure is disposed on the outer surface of the light conversion layer, the layered structure covering the light conversion layer and at least a portion of the electrode; the light conversion layer includes a top layer and a base layer, the layered structure includes an upper layer and a lower layer, the lower layer, the base layer, the top layer and the upper layer are stacked sequentially; the top layer is disposed of a plurality of first LED chips, the base layer is disposed of a plurality of second LED chips, the first LED chips in the top layer and the adjacent second LED chips in the base layer at least partially overlap, the first LED chips and the adjacent second LED chips are directly conductive, the plurality of first LED chips and the plurality of second LED chips are connected in series between the two electrodes, the two electrodes, the plurality of first LED chips and the plurality of second LED chips form a conductive path in the top layer and the base layer.

[0046] In one embodiment of this application, each first LED chip includes a first electrical connection portion and a second electrical connection portion, and each second LED chip includes a third electrical connection portion and a fourth electrical connection portion, wherein the first electrical connection portion, the second electrical connection portion, the third electrical connection portion and the fourth electrical connection portion all face the upper layer.

[0047] In one embodiment of this application, the first LED chip and the adjacent second LED chip are connected by a first electrical connection portion of the first LED chip to a fourth electrical connection portion of the adjacent second LED chip, or the third connection portion of the second LED chip is directly connected to the first electrical connection portion of the first LED chip.

[0048] In one embodiment of this application, the first LED chip and / or the second LED chip adjacent to the two electrodes are connected to the two electrodes via the first wire.

[0049] In one embodiment of this application, the fourth electrical connection portion of the second LED chip is connected to the first electrical connection portion of the first LED chip, and the second electrical connection portion of the first LED chip is connected to the third electrical connection portion of the second LED chip via conductive silver paste or solder paste.

[0050] In one embodiment of this application, the top layer and the bottom layer form a current path through the first LED chip and the second LED chip.

[0051] In one embodiment of this application, the thickness of the layered body is less than or equal to the thickness of the top layer.

[0052] This application, through the above technical solutions, has the following or any combination of technical effects: (1) By filling the lamp housing with a combination of nitrogen and oxygen, the service life of the base layer can be effectively improved due to the interaction between oxygen and the groups in the base layer; (2) By designing the relationship between the diameter of the lamp head, the maximum diameter of the lamp housing, and the maximum width of the LED filament in the Y-axis direction of the YZ plane or the maximum width in the X-axis direction of the XZ plane, the heat dissipation effect of the bulb can be effectively improved; (3) The thickness of the base layer is less than the thickness of the top layer. Since the thermal conductivity of the top layer is greater than that of the base layer, and the path of heat conduction from the LED chip to the outer surface of the base layer is relatively short, heat is not easy to accumulate, and the heat dissipation effect of the LED filament is good; (4) The carrier layer includes a transparent layer and a base layer. The transparent layer supports a part of the base layer, thereby enhancing the strength of the base layer and facilitating die bonding and wire bonding. The part of the base layer not covered by the transparent layer can support a part of the LED chip. The heat generated is directly dissipated after passing through the base layer; (5) The transparent layer includes a first transparent layer and a second transparent layer. When the LED filament is bent, the area near the electrode is prone to detachment from the light conversion layer or cracks are prone to appear in the part where the light conversion layer contacts the electrode. The first transparent layer and the second transparent layer can provide structural reinforcement for the part where the light conversion layer contacts the electrode, preventing cracks from appearing in the part where the light conversion layer contacts the electrode; (6) The conductor includes a covered part and an exposed part. When the LED filament is bent, the exposed part will undergo slight deformation under stress. The bending area is small and the degree of deformation is small, which is conducive to maintaining the bending shape of the LED filament; (7) By mixing different materials, the filament can present different colors, or the filament can present different colors when lit and not lit, improving the aesthetics and light output effect of the lamps using the filament; (7) Direct connection of LED chips increases the number of LED chips arranged per unit length, while reducing the thickness of the filament. (8) LED chips are set in both the top layer and the base layer to increase the lumen value per unit length of the filament. Attached Figure Description

[0053] Figure 1 The present invention provides a schematic diagram of the structure of an LED filament in some embodiments.

[0054] Figure 2 According to Figure 1 A bottom view.

[0055] Figure 3 According to Figure 1 A partial cross-sectional view of position AA in the middle.

[0056] Figure 4 The following is a schematic diagram (II) of the structure of an LED filament in some embodiments according to this application.

[0057] Figure 5 The present invention provides a schematic diagram (III) of the structure of an LED filament in some embodiments.

[0058] Figure 6 The present invention provides a schematic diagram of the structure of an LED filament in some embodiments (IV).

[0059] Figure 7 The present invention provides a schematic diagram of the structure of an LED filament in some embodiments (V).

[0060] Figure 8 The present invention provides a schematic diagram (VI) of the structure of an LED filament in some embodiments.

[0061] Figure 9 The present invention provides a schematic diagram (VII) of the structure of an LED filament in some embodiments.

[0062] Figure 10 The present invention provides a schematic diagram (VIII) of the structure of an LED filament in some embodiments.

[0063] Figure 11 This is a top view of an LED filament after the top layer has been removed, according to some embodiments of this application.

[0064] Figure 12 The present invention provides a schematic diagram (IX) of the structure of an LED filament in some embodiments.

[0065] Figure 13 The present invention provides a schematic diagram (x) of the structure of an LED filament in some embodiments.

[0066] Figure 14 This is a schematic diagram of the structure of LED chip bonding wires in some embodiments according to this application.

[0067] Figure 15 This is a top view (a) of the LED filament after removing the top layer, in some embodiments of this application, with the filament unbent.

[0068] Figure 16 This is a top view (II) of the LED filament after removing the top layer in some embodiments of this application, with the filament unbent.

[0069] Figure 17 This is a schematic diagram (a) of the structure of an LED filament in an unbent state according to some embodiments of this application.

[0070] Figure 18 This is a schematic diagram (II) of the structure of an LED filament in an unbent state according to some embodiments of this application.

[0071] Figure 19 This is a partial structural diagram of an LED filament according to some embodiments of this application (I).

[0072] Figure 20 for Figure 19 A cross-sectional structural diagram.

[0073] Figure 21 This is a partial structural schematic diagram (II) of an LED filament in some embodiments according to this application.

[0074] Figure 22 This is a partial structural schematic diagram (III) of an LED filament according to some embodiments of this application.

[0075] Figure 23 The present invention provides a schematic diagram of the structure of an LED filament in some embodiments (XI).

[0076] Figure 24 The present invention provides a schematic diagram (XII) of the structure of an LED filament in some embodiments.

[0077] Figure 25 The present invention provides a schematic diagram (XIII) of the structure of an LED filament in some embodiments.

[0078] Figure 26 The present invention provides a schematic diagram (XIV) of the structure of an LED filament in some embodiments.

[0079] Figure 27 The present invention provides a schematic diagram (XV) of the structure of an LED filament in some embodiments.

[0080] Figure 28 The present invention provides a schematic diagram of the structure of an LED filament in some embodiments (XVI).

[0081] Figure 29 This is a schematic diagram of the heat dissipation path of an LED filament in some embodiments according to this application, wherein the left side of the figure shows an example of a layered structure with added materials of different particle sizes, and the right side of the figure shows an example of a layered structure with added materials of a single particle size.

[0082] Figure 30 The present invention provides a schematic diagram of the structure of an LED filament in some embodiments (XVII).

[0083] Figure 31A This is a schematic diagram of the structure of an LED filament according to some embodiments of this application.

[0084] Figure 31B In some embodiments according to this application, Figure 31A A schematic diagram of a variant structure of the LED filament; Figure 31C For the LED filament along its length direction according to another embodiment of this application;

[0085] Figure 31DFor the LED filament along its length direction according to another embodiment of this application;

[0086] Figure 31E For the LED filament along its length direction according to another embodiment of this application;

[0087] Figure 31F For the LED filament along its length direction according to another embodiment of this application;

[0088] Figure 31G For the LED filament along its length direction according to another embodiment of this application;

[0089] Figure 31H For the LED filament along its length direction according to another embodiment of this application;

[0090] Figure 31I For the LED filament along its length direction according to another embodiment of this application;

[0091] Figure 31J For the LED filament along its length direction according to another embodiment of this application;

[0092] Figure 32A The present invention provides a schematic diagram (XIX) of the structure of an LED filament in some embodiments.

[0093] Figure 32B This is a cross-sectional schematic diagram of the LED filament along its length in some embodiments according to this application.

[0094] Figure 32C This is a cross-sectional schematic diagram of the LED filament along its length in some embodiments according to this application.

[0095] Figure 32D This is a cross-sectional schematic diagram of an LED filament in the radial direction according to some embodiments of this application.

[0096] Figure 32E This is a schematic cross-sectional view of the LED filament with its length direction parallel to the maximum surface of the LED chip in some embodiments according to this application.

[0097] Figure 32F This is a schematic cross-sectional view of the LED filament with its length direction parallel to the maximum surface of the LED chip in some embodiments according to this application.

[0098] Figure 32G This is a schematic cross-sectional view of the LED filament with its length direction parallel to the maximum surface of the LED chip in some embodiments according to this application.

[0099] Figure 32HThis is a schematic cross-sectional view of the LED filament with its length direction parallel to the maximum surface of the LED chip in some embodiments according to this application.

[0100] Figure 32I This is a schematic cross-sectional view of the LED filament with its length direction parallel to the maximum surface of the LED chip in some embodiments according to this application.

[0101] Figure 32J This is a cross-sectional schematic diagram of the LED filament along its length in some embodiments according to this application.

[0102] Figure 32K This is a cross-sectional schematic diagram of an LED filament in the radial direction according to some embodiments of this application.

[0103] Figure 32L This is a cross-sectional schematic diagram of an LED filament in the radial direction according to some embodiments of this application.

[0104] Figure 32M This is a cross-sectional schematic diagram of an LED filament in the radial direction according to some embodiments of this application.

[0105] Figure 32N This is a cross-sectional schematic diagram of an LED filament in the radial direction according to some embodiments of this application.

[0106] Figure 32O This is a cross-sectional schematic diagram of an LED filament in the radial direction according to some embodiments of this application.

[0107] Figure 32P This is a cross-sectional schematic diagram of an LED filament in the radial direction according to some embodiments of this application.

[0108] Figure 32Q This is a cross-sectional schematic diagram of an LED filament in the radial direction according to some embodiments of this application.

[0109] Figure 32R This is a cross-sectional schematic diagram of an LED filament in the radial direction according to some embodiments of this application.

[0110] Figure 32S This is a cross-sectional schematic diagram of an LED filament in the radial direction according to some embodiments of this application.

[0111] Figure 32T This is a cross-sectional schematic diagram of an LED filament in the radial direction according to some embodiments of this application.

[0112] Figure 33 The following is a schematic diagram of the cross-sectional structure of an LED filament in some embodiments according to this application (I).

[0113] Figure 34 The following is a schematic diagram (II) of the cross-sectional structure of an LED filament in some embodiments according to this application.

[0114] Figures 35a to 35d are schematic diagrams of the cross-sectional structure of LED filaments in some embodiments according to this application (III) to (VI).

[0115] Figure 36 This is a schematic diagram (a) of an LED bulb in some embodiments according to this application.

[0116] Figure 37 for Figure 36 Side view of the LED bulb.

[0117] Figure 38 for Figure 36 Another side view of the LED bulb.

[0118] Figure 39 for Figure 36 Top view of the LED bulb.

[0119] Figure 40 This is a schematic diagram (II) of an LED bulb according to some embodiments of this application.

[0120] Figure 41 The present invention provides a schematic diagram of a lamp holder in some embodiments.

[0121] Figure 42 for Figure 41 A schematic diagram of the lamp holder at section AA.

[0122] Figure 43 The following is a schematic diagram (III) of the lamp holder in some embodiments according to this application.

[0123] Figure 44 for Figure 43 Schematic diagram of the lamp holder at section BB (I).

[0124] Figure 45 for Figure 43 Schematic diagram of the lamp holder at section BB (II).

[0125] Figure 46A The following is a schematic diagram (iii) of an LED bulb in some embodiments according to this application.

[0126] Figure 46B This is a schematic diagram (a) of an LED bulb with a buffer structure according to some embodiments of this application.

[0127] Figure 46C This is a schematic diagram (II) of an LED bulb with a buffer structure according to some embodiments of this application.

[0128] Figure 46D This is a perspective view of an LED bulb according to some embodiments of this application.

[0129] Figure 47 for Figure 46A The image shows a side view of an LED bulb.

[0130] Figure 48 for Figure 46A In the middle, another view of the LED bulb.

[0131] Figure 49 for Figure 46A The image shows a top view of an LED bulb.

[0132] Figure 50 The following is a schematic diagram (four) of an LED bulb according to some embodiments of this application.

[0133] Figure 51 for Figure 50 The image shows a side view of an LED bulb.

[0134] Figure 52 for Figure 50 The image shows the other side view of the LED bulb.

[0135] Figure 53 for Figure 50 The image shows a top view of an LED bulb.

[0136] Figure 54 This is a schematic diagram (III) of the structure of an LED filament in an unbent state according to some embodiments of this application.

[0137] Figure 55 for Figure 54 A schematic diagram of an LED bulb with an LED filament.

[0138] Figure 56 This is a schematic diagram (V) of an LED bulb in some embodiments of this application.

[0139] Figure 57 for Figure 56 An enlarged schematic diagram of section 62.

[0140] Figure 58 The present invention provides a circuit diagram of a first constant current circuit in some embodiments.

[0141] Figure 59 The present invention provides a circuit diagram of a second constant current circuit in some embodiments.

[0142] Figure 60 The circuit diagram of a third constant current circuit is shown in some embodiments of this application.

[0143] Figure 61 The present invention provides a circuit block diagram of an LED bulb in some embodiments.

[0144] Figure 62 The circuit structure diagram of an LED bulb is shown in some embodiments according to this application (I).

[0145] Figure 63 The circuit structure diagram of an LED bulb in some embodiments according to this application is shown in Figure 2.

[0146] Figure 64 The circuit structure diagram of an LED bulb in some embodiments according to this application is shown in Figure 3.

[0147] R1 to R4 are the first to fourth resistors, respectively; M1 is the main switching element, and Q1 is the secondary switching element, which can be a field-effect transistor, a transistor, or other switching device; 31, 32, D1 to D3 are LED chip units or LED chips; PTC is a PTC resistor; V2 is a voltage source. Detailed Implementation

[0148] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0149] Please see Figures 1 to 3 , Figure 1 The present invention provides a schematic diagram of the structure of an LED filament in some embodiments. Figure 2 According to Figure 1 A bottom view. Figure 3 According to Figure 1 A partial cross-sectional view of position AA in the middle. (See diagram below.) Figures 1 to 3As shown, the LED filament 100 includes multiple LED chip units (102, 104), electrodes (106, 108), and a light conversion layer 110. The LED chip units (102, 104) are electrically connected to each other. The electrodes (106, 108) are configured corresponding to the LED chip units (102, 104) and are electrically connected to the LED chip units (102, 104) through a first conductive portion 112. The light conversion layer 110 encloses the LED chip units (102, 104) and the electrodes (106, 108), and exposes at least a portion of two of the electrodes (106, 108). The light conversion layer 110 includes silicone, phosphor, and heat dissipation particles. In some embodiments, the LED chip units (102, 104) include at least one LED chip (described later), and the phosphor concentration corresponding to each face of the LED chip is the same, so that the light conversion efficiency of each face is the same, thereby enabling the LED filament 100 to obtain better light uniformity. Of course, in some other embodiments of this application, the concentration of phosphor corresponding to each face of the LED chip is at least two kinds, thereby realizing the directional adjustment of the light conversion rate of each face, so that the LED filament 100 can control the light output difference of each face according to the design requirements.

[0150] like Figure 2 As shown, the LED chip unit (102, 104) includes at least one LED chip 111. The LED chip unit (102, 104) respectively has a first electrical connection portion 114 and a second electrical connection portion 116. At least a portion of the first electrical connection portion 114 and the second electrical connection portion 116 is in contact with the light conversion layer 110.

[0151] In some embodiments, such as Figure 1As shown, the light conversion layer 110 includes a top layer 120 and a carrier layer 122. The top layer 120 encloses the LED chip units (102, 104) and electrodes (106, 108), and exposes at least a portion of two electrodes (106, 108). The carrier layer 122 includes a base layer 124, which includes an upper surface 124a and a lower surface 124b opposite to the upper surface 124a. Relative to the lower surface 124b of the base layer 124, the upper surface 124a of the base layer 124 is closer to the top layer 120. One of the first conductive part 112 and the second conductive part 118 is in contact with the upper surface 124a of the base layer 124 (direct contact or indirect contact). When the LED filament 100 is bent, the radius of curvature of the base layer 124 after bending is relatively small, and the first conductive part 112 and the second conductive part 118 are not easily broken. In some embodiments, the first electrical connection portion 114 and the second electrical connection portion 116 are in contact (direct or indirect contact) with the upper surface 124a of the base layer 124. In some embodiments, the LED chip unit (102, 104) may be a flip chip or a standard chip. In some embodiments, the LED chip unit (102, 104) may be a micro LED or a sub-millimeter LED, wherein a sub-millimeter LED refers to an LED with a package size in the range of 0.1-0.2 mm.

[0152] In some embodiments, the first conductive part 112 and the second conductive part 118 may be in the form of wires, films, adhesives, etched circuits, sintered circuits, such as copper wires, gold wires, circuit films, copper foils, conductive silver paste, etc.

[0153] Please see Figures 4 to 16 , Figures 4 to 10 , Figures 12 to 13 The following are schematic diagrams (ii) to (x) of the structure of an LED filament in some embodiments according to this application. Figure 11 This is a top view of an LED filament after the top layer has been removed, according to some embodiments of this application. Figure 14 This is a schematic diagram of the structure of LED chip bonding wires in some embodiments according to this application. Figure 15 This is a top view (a) of the LED filament after removing the top layer, in some embodiments of this application, with the filament unbent. Figure 16 This is a top view (II) of the LED filament after removing the top layer, in some embodiments according to this application, with the filament unbent. In some embodiments, such as Figures 4 to 16As shown, the LED filament 100 has multiple LED chip units (102, 104), two electrodes (106, 108), and a light conversion layer 110. The light conversion layer 110 encloses the LED chip units (102, 104) and part of the electrodes (106, 108), with some electrodes (106, 108) exposed outside the light conversion layer 110. Adjacent LED chip units (102, 104) are electrically connected to each other, and LED chip units (102, 104) are electrically connected to electrodes (106, 108).

[0154] The LED filament 100 includes at least two LED chips 111, adjacent LED chips 111 are electrically connected to each other, and the LED chip unit (102, 104) includes at least one LED chip 111. In some embodiments, multiple LED chip units 102 can form an LED segment 113, and multiple LED chip units 104 can form an LED segment 115 (described later). Figures 5 to 16 Note that the LED chip units (102, 104) are omitted and are instead indicated by LED segments (113, 115).

[0155] The light conversion layer 110 includes a top layer 120 and a carrier layer 122, which may each be at least one layered structure. The layered structure is preferably one of a phosphor adhesive with high formability (relative to the phosphor film), a phosphor film with low formability, or a transparent layer, or any combination of at least two of the aforementioned layered structures. The phosphor adhesive or phosphor film comprises the following components: silicone-modified polyimide and / or adhesive; the phosphor adhesive / phosphor film may also include phosphor, inorganic oxide nanoparticles (or heat dissipation particles). The transparent layer 420c may be composed of a light-transmitting resin (e.g., silicone, polyimide) or a combination thereof. The adhesive may be, but is not limited to, silicone. In one embodiment, the top layer 120 and the carrier layer 122 are made of the same material.

[0156] In one embodiment, the carrier layer 122 includes a base layer 124, which is located in the height direction of the LED filament 100. Figure 4(In the Z-axis direction), the height of the top layer 120 is greater than the height of the base layer 124. The base layer 124 includes an upper surface 124a and a lower surface 124b, and the top layer 120 includes an upper surface 120a and a lower surface 120b. The upper surface 124a of the base layer 124 is in contact with a portion of the lower surface 120b of the top layer 120. LED chip 111 includes an upper surface 111a and a lower surface 111b. The upper surface 111a of LED chip 111 is closer to the upper surface 120a of top layer 120 than the lower surface 111b of LED chip 111. The distance from the lower surface 111b of LED chip 111 to the lower surface 124b of base layer 124 is less than the distance from the lower surface 111b of LED chip 111 to the upper surface 120a of top layer 120. Since the thermal conductivity of top layer 120 is greater than that of base layer 124, the heat generated by LED chip 111 is conducted to the outer surface of base layer 124 through a shorter path, thus heat is less likely to accumulate, and LED filament 100 achieves better heat dissipation.

[0157] In most applications, filament lamps are no longer simply for illumination but have become an integral part of environmental decoration. That is, when the filament lamp is not lit, consumers are concerned with the filament shape and its appearance (including the filament's color (or the color of the filament body) and the bulb's color); while when the filament lamp is lit, the focus shifts to whether the color temperature and illuminance meet environmental requirements. In some embodiments, the main body of the LED filament 100 may not include the portion of the electrodes exposed in the light conversion layer 110. In some embodiments, when the LED filament 100 is not lit, its surface is white, gray, black, blue, green, purple, or other colors. In some embodiments, the surface of the LED filament 100 may be the same as the surface of the light conversion layer 110. When the LED filament 100 is lit, it can emit light of a different color than when it is not lit, thus allowing bulbs with this LED filament 100 to be used in different scenarios (described later) to achieve different decorative effects. In some embodiments, the LED filament 100 includes a coating (not shown) in colors such as white, gray, black, blue, green, and purple. The coating covers at least a portion of the surface of the light conversion layer 110, preferably the entire surface. For example, if a red coating is used to cover the surface of the light conversion layer 110, the surface of the LED filament 100 will appear red when the LED filament 100 is not lit, but will emit white light when the LED filament 100 is lit. Alternatively, the LED filament 100 can emit light of the same color when lit as when it is not lit. For example, if a white coating is used to cover the surface of the light conversion layer 110, the surface of the LED filament 100 will appear white when the LED filament 100 is not lit, and will also emit white light when the LED filament 100 is lit. The white coating can be aluminum oxide. In some embodiments, the surfaces of the top layer 120 and / or the carrier layer 122 are covered with a thin film in colors such as black, gray, and red. Most materials have a certain degree of light absorption. A thin film with high light transmittance is preferred; for example, the transmittance of the film should be at least greater than 80%, to prevent a decrease in luminous flux after the LED filament 100 is lit. In some embodiments, the thickness of the film is less than the thickness of the top layer 120, so that the heat emitted by the LED chip 111 is less likely to accumulate in the film, balancing the requirements of the LED filament 100's appearance and heat dissipation. The film may or may not contain phosphor. When the film contains phosphor, the phosphor content is less than the phosphor concentration of the top layer 120 or the carrier layer 122. If the top layer 120 or the carrier layer 122 is a multilayer structure, the phosphor content of the film is at least less than the phosphor content of one of the layers. Due to the presence of the film, the thickness of the LED filament 100 increases, and the heat conduction path of the LED filament 100 becomes longer.If the phosphor content in the film is increased to improve the heat dissipation performance of the LED filament 100, the increased phosphor content will increase the film's hardness, making the LED filament 100 less flexible and increasing the likelihood of cracks when bent. In some embodiments, adding a certain amount of phosphor to the film can change the color of the LED filament 100 when it is not lit, while maintaining both heat dissipation performance and flexibility. In some embodiments, after the top layer 120 and / or the base layer 124 are covered with a film, the main body of the LED filament 100 is grayish-black (close to the original color of tungsten filament) when it is not lit, and emits white light when it is lit. In some embodiments, the color of the light conversion layer 110, the main body of the LED filament 100, etc., when the LED filament 100 is not lit, or the color of the light emitted when the LED filament 100 is lit, includes primary colors and colors mixed from at least two primary colors, such as the three primary colors of light (RGB).

[0158] Please see Figure 25 , Figure 25 The diagram below (XIII) shows the structure of an LED filament in some embodiments according to this application. Figure 25 As shown, the aforementioned coatings or films are all layered bodies 1101 disposed on the outer surface of the light conversion layer 110. In some embodiments, the hardness of the layered body 1101 is less than that of the light conversion layer 110 to prevent the layered body 1101 from being too hard, thereby affecting the normal bending of the LED filament 100. In some embodiments, the hardness of the layered body 1101 can be greater than that of the light conversion layer 110 to provide further support for the entire LED filament 100. Regardless of the hardness of the layered body 1101, the overall support of the LED filament 100 can be improved by the provision of the layered body 1101.

[0159] The bulb housing of an LED filament bulb is filled with gas (explained later), and the refractive indices of the light conversion layer 110, the layered body 1101, and the filling gas in the bulb housing decrease sequentially. Without the layered body 1101, the large difference in refractive index between the light conversion layer 110 and the filling gas would result in significant light loss. However, through the aforementioned arrangement of the layered body 1101 in this embodiment, the LED chip 111 exhibits lower light loss along its light emission path.

[0160] The layer 1101 can be made of silicone or a silicone-based material. When silicone is used directly, the layer 1101 can appear white due to the natural color of the silicone, thus giving the LED filament 100 a white appearance. Adding a colorant to the silicone can give the layer 1101 different colors as described above. In addition, a photoreactive substance can be added to the layer 1101. After the LED chip 111 emits light, it undergoes a first light conversion through the light conversion layer 110, and then a second light conversion through the photoreactive substance in the layer 1101. This allows the LED filament 100 to have a first color when not lit, and a second color different from the first color when lit, with the first and second colors having a primary color difference.

[0161] In some embodiments, such as Figure 4 As shown, the light conversion layer 110 includes a top layer 120 and a carrier layer 122. The top layer 120 and the carrier layer 122 can each be a layered structure with at least one layer. The upper surface 120a of the top layer 120 and the lower surface 122b of the carrier layer 122 are different colors. Since the LED filament 100 presents two different colors when it is not lit, it can be applied to multi-color application scenarios.

[0162] In some embodiments, the layer 1101 may also be made of other materials besides silicone or silicone-based materials, such as resin, plastic, polyimide (PI), silicone-modified polyimide resin composition, polyvinyl alcohol (PVA), polyester (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), etc.

[0163] In some embodiments, the layer 1101 may be primarily composed of silica gel mixed with other solid powders (particles). These solid powder particles may be non-conductive white powders, such as titanium dioxide powder, but are not limited to this; for example, a mixture of inorganic oxide nanoparticles may be used. The fixed powder particles constitute a certain proportion of the total weight of the layer 1101 to meet the overall filament performance requirements. In some embodiments, a certain amount of titanium dioxide powder (particles) is mixed into the layer 1101, and the titanium dioxide powder (particles) are relatively uniformly distributed within the layer 1101. The layered body 1101 is prepared from silica gel and titanium dioxide powder (particles). When the silica gel exhibits liquid properties under certain conditions, a certain amount of titanium dioxide is added to the silica gel. Common mixing methods, such as stirring, high-speed vibration, and planetary mixer processing, are used to ensure that the titanium dioxide powder (particles) are evenly distributed in the silica gel. While the silica gel and titanium dioxide mixture is in a liquid state, the layered body 1101 is applied to the surface of the light conversion layer 110 using methods such as spin coating, spraying, doctor blade coating, and immersion (immersing the entire material in the liquid and then removing it, with the liquid coating the material surface). Then, exposure, baking, and natural curing are used to solidify the layered body 1101 onto the surface of the light conversion layer 110. The thickness of the layered body 1101 is less than or equal to the thickness of the light conversion layer 110 (thickness refers to...). Figure 4 The length along the Z-axis is considered to avoid excessive thickness of the layered body 1101, which could affect the light output and flexibility of the LED filament 100. The mass of titanium dioxide accounts for 0.2% to 10% of the total mass of the layered body 1101, and more specifically, 0.7% to 5%. Titanium dioxide powder (particles) is white in color and has the lowest relative density among commonly used white pigments. For the same mass of white pigment, titanium dioxide has the largest surface area and the highest pigment volume, making it more effective at producing mixed materials that closely approximate the color of titanium dioxide. For example, if a mixed material needs to be nearly white, less titanium dioxide is required compared to other materials. Titanium dioxide has a high reflectivity (e.g., over 80%) and refractive index (e.g., 2.5 to 2.8). It is uniformly distributed in the layer 1101. The light excited by the LED chip 111 is converted by the light conversion layer 110 and then reaches the layer 1101. After being refracted and reflected multiple times by the titanium dioxide powder (particles) distributed therein, it is finally emitted from the layer 1101. The specific directionality of the emitted light is greatly reduced, and the emitted light is more uniform and softer.

[0164] Please see Figure 27 , Figure 27 This is a schematic diagram (XV) illustrating the structure of an LED filament in some embodiments according to this application. Figure 27As shown, a certain amount of titanium dioxide is disposed in the layered body 1101. Referring to the magnified part (within the circle), it can be seen that the light processed by the light conversion layer 110 is further disordered in the layered body 1101, which greatly reduces the specific directionality of the final emitted light, forming an effect similar to diffuse reflection. The light emitted from the layered body 1101 is uniform and soft. Of course, the amount of titanium dioxide added should not be too much, as too much will lead to greater light loss. For example, when the total mass of titanium dioxide is greater than 10% of the layered body 1101, further increasing the amount of titanium dioxide will not further improve the soft light effect, but will cause greater light loss, resulting in the light output not meeting the requirements. The amount of titanium dioxide added should also not be too little, as too little will not achieve the function of uniformizing the light and will not obtain the ideal color effect. For example, when the total mass of titanium dioxide is less than 0.2% of the layered body 1101... Titanium dioxide, while providing soft light, can, with a small amount, make the LED filament 100 (or layer 1101) appear white or near-white. More precisely, it enables the LED filament 100 (or layer 1101) to have a color value within the range of R (235-255), G (235-255), and B (235-255) under the RGB standard when not lit. The absolute value of the difference between any two of R, G, and B is less than or equal to 10% of the smaller or larger value. Furthermore, the absolute value of the difference between any two of R, G, and B is less than or equal to 5% of the smaller or larger value. Of course, the material added to the layer 1101 can also be other color-developing materials or photoconversion materials, such as one or more combinations of alumina, silicon dioxide, magnesium oxide, titanium dioxide, graphene, phosphor, sulfate, silicate, nitride, nitrogen oxide, oxysulfate, or garnet. For example, it can be a combination of one of alumina and silicon dioxide with titanium dioxide, wherein the mass percentage of titanium dioxide is 5% to 15% of all solid particles, preferably 8%. It can also be a combination of one of alumina and silicon dioxide with magnesium oxide or a sulfate (such as barium sulfate), and is not limited thereto; one or more materials can be combined. In some embodiments, the color setting of the filament when not lit can be achieved by using a variety of different phosphors, for example, by mixing different phosphors to achieve a series of colors such as white, gray, and black when the filament is not lit.

[0165] In some embodiments, light conversion particles, such as phosphors, may also be provided in the layer 1101. The mass ratio of the light conversion particles is 2% to 10% of the total solid particles in the layer 1101, preferably 4%, so that the layer 1101 has a light conversion effect. This allows the light that has not been converted by the light conversion layer 110 in the light excited by the LED chip 111 to be converted by the layer 1101 and then emitted, thereby improving the overall light conversion rate of the LED filament 100. In other words, a high light conversion effect is achieved through two independent light conversions.

[0166] In some embodiments, the layered body 1101 is uniformly thick and disposed on both surfaces of the light conversion layer 110 that are substantially parallel to the light-emitting surface of the LED chip 111, as referenced. Figure 4 The upper surface 111a and the lower surface 111b of the parallel LED chip 111.

[0167] In some embodiments, the layered body 1101 is uniformly thick and is disposed on two surfaces of the light conversion layer 110 that are substantially parallel to the light-emitting surface of the LED chip 111 and on the long side perpendicular to the light-emitting surface of the LED chip 111 (the surface through which the electrodes (106, 108) pass), as referenced. Figure 4 The upper and lower surfaces of the parallel LED chip 111 and the long side of the light-emitting surface of the LED chip 111.

[0168] Please see Figure 28 , Figure 28 This is a schematic diagram (xvii) of the structure of an LED filament according to some embodiments of this application. In some embodiments, the layered body 1101 completely covers the light conversion layer 110 and at least covers a portion of the electrodes (106, 108), such as... Figure 28 As shown, the layered body 1101 has a certain strength and toughness, which can enhance the overall strength of the LED filament 100.

[0169] In some embodiments, the layer 1101 may be at least a portion of one side of the light conversion layer 110 parallel to the LED chip 111 and the corresponding surface of the electrodes (106, 108).

[0170] In some embodiments, the filling material in the layered body 1101 may be selected from alumina or silicon dioxide, combined with titanium dioxide and graphene, wherein titanium dioxide accounts for 0.5% to 5% of the total solid particles in the layered body 1101, preferably 1.25%. Titanium dioxide accounts for 0.1% to 3% of the total weight of the layered body 1101, more preferably 0.4% to 2.5%. Graphene accounts for 0.1% to 1% of the total weight of the layered body 1101, preferably 0.5%. In some embodiments, the graphene may be fluorinated graphene, which has excellent non-conductive properties, excellent thermal conductivity and thermal stability, and good dispersion stability, and can maintain a relatively stable position in some materials. In terms of particle size selection, the particle size of alumina (or silicon dioxide) is larger than that of titanium dioxide, and the particle size of titanium dioxide is larger than that of graphene. That is, there are three particle sizes in the layered body 1101. When the three particles are mixed and evenly distributed in the layered body 1101, it is difficult for them to form gaps or thermally conductive break areas, resulting in better heat dissipation.

[0171] Please see Figure 29 , Figure 29This is a schematic diagram of the heat dissipation path of an LED filament in some embodiments according to this application, wherein the left side of the figure shows an example of a layered structure with additive materials of different particle sizes, and the right side shows an example of a layered structure with additive materials of a single particle size. Figure 29 As shown, particle 1102 represents the largest particle size (e.g., alumina or silicon dioxide), particle 1103 represents the medium-sized particle size (e.g., titanium dioxide), and particle 1104 represents the smallest particle size (e.g., graphene). When different particle sizes are used, smaller particles fill the gaps between larger particles. The heat dissipation path can extend and interweave between smaller particles (particle 1104), medium particles (particle 1103), and larger particles (particle 1102) to form a complete heat dissipation path. Particle 1103 exhibits the best heat dissipation effect, while silicone has a relatively poor effect. The path length through the heat-dissipating particles is much longer than the path length through silicone (or another material replacing silicone as the substrate), meaning that the proportion of high-heat-dissipation paths in the overall heat dissipation path is high, resulting in good heat dissipation. On the other hand, during heat transfer, areas with large temperature differences and good thermal conductivity dissipate heat quickly, with heat preferentially dissipating (losing) from these areas. In layered bodies 1101 with different particle sizes, the particles have good thermal conductivity, allowing heat to dissipate quickly. Therefore, particles at different distances from the heat source will have a certain temperature difference. Heat is preferentially transferred between particles with this temperature difference. Silicone, however, has poor heat dissipation and heat tends to accumulate, resulting in a smaller temperature difference. Consequently, heat dissipation will preferentially follow the paths formed by the particles, minimizing the paths formed by the silicone. (Comparison) Figure 29The heat dissipation paths on the left and right sides of the diagram are preferably paths formed by particles connected in series. Under the same path length conditions, as shown in path PA1, the left side has layered bodies 1101 with particles of different sizes, where the particle path length accounts for a higher proportion, resulting in better heat dissipation. In contrast, the right side diagram shows a single particle with no smaller particles filling the gaps between particles, meaning its heat dissipation path can only use silicone. Under the same path length conditions, silicone occupies a higher proportion of the heat dissipation path, resulting in inferior heat dissipation compared to the left side diagram. By mixing different particles (at least two particle sizes, for example, in some embodiments, alumina or magnesium oxide with particle sizes between 2.5mm and 25mm, titanium dioxide between 0.3mm and 1mm, and graphene between 5nm and 300nm) with silicone, the proportion of particles with direct contact on the outermost surface of the heat dissipation surface is increased. Simultaneously, smaller particles fill the gaps between large-diameter particles, optimizing the microscopic heat dissipation path and improving the overall heat dissipation effect. Graphene (or fluorinated graphene) is often chosen as an additive material due to its good thermal conductivity, insulation, and thermal stability. In some embodiments, the layer 1101 can be made to appear gray or close to gray (i.e., the filament appears gray or close to gray). More precisely, the LED filament 100 (or layer 1101) under non-illuminated conditions has color values ​​within the range of R (100-234), G (100-234), and B (100-234) according to the RGB standard. The absolute value of the difference between any two of the R, G, and B values ​​is less than or equal to 10% of the smaller or larger value. Furthermore, the absolute value of the difference between any two of the R, G, and B values ​​is less than or equal to 5% of the smaller or larger value.

[0172] In some embodiments, the light conversion layer 110 has a top layer 120 and a bottom layer 124, and a layered body 1101 may be disposed on the top layer 120. See also [link to embodiments]. Figure 30 , Figure 30 The diagram (XVII) shows the structure of an LED filament in some embodiments according to this application. Figure 30 As shown, the layered body 1101 can completely cover the top layer 120 and at least cover at least a portion of the surface of the electrodes (106, 108) facing the top layer 120.

[0173] In some embodiments, the layer 1101 may cover only the top layer 120 without contacting at least a portion of the surface of the electrodes (106, 108) facing the top layer 120.

[0174] In some embodiments, please refer to Figure 31A , Figure 31A This is a schematic diagram (XVIII) illustrating the structure of an LED filament in some embodiments according to this application. Figure 31AAs shown, the layered body 1101 can completely cover the top layer 120 and the base layer 124, while at least covering at least a portion of the surfaces of the electrodes (106, 108) facing the top layer 120 and the base layer 124.

[0175] See Figure 31B In some embodiments of this application, the structure of the LED filament is shown in the schematic diagram. The layered body 1101 can be divided into an upper layered body 1101' covering the top layer 120 and a lower layered body 1101" covering the base layer 124. The body material of the upper layered body 1101' and the lower layered body 1101" can be the same or different materials, and the same or different materials can also be added to the upper layered body 1101' and the lower layered body 1101".

[0176] In one embodiment, the upper layer 1101' is made of silicone, wherein heat-dissipating particles and / or color-developing particles may be added, such as one or more of the following as described above: alumina, silicon dioxide, magnesium oxide, titanium dioxide, titanium dioxide, titanium black, graphene, phosphor, sulfate, silicate, nitride, nitrogen oxide, oxysulfate, or garnet.

[0177] In one embodiment, the lower layer 1101” main material is polyimide (PI) or a silicone-modified polyimide resin composition (see other paragraphs described herein), wherein heat-dissipating particles and / or color-developing particles may be added, such as one or more of the following as described above: alumina, silica, magnesium oxide, titanium dioxide, titanium dioxide, titanium dioxide, titanium black, graphene, phosphor, sulfate, silicate, nitride, nitrogen oxide, oxysulfate, or garnet.

[0178] In one embodiment, the upper layer 1101' is mainly made of silicone with added titanium dioxide; the lower layer 1101" is mainly made of polyimide (PI) with added titanium dioxide and white thermally conductive particles (including but not limited to alumina or silicon dioxide).

[0179] In one embodiment, the upper layer 1101' is mainly made of silicone with added titanium black powder; the lower layer 1101" is mainly made of polyimide (PI) with added titanium black powder (or other gray-black colored particles) and thermally conductive particles (including but not limited to alumina or silicon dioxide).

[0180] In one embodiment, the top layer 120 is silicone with added phosphor; the bottom layer 124 is polyimide (PI) with added phosphor and thermally conductive particles.

[0181] In one embodiment, the top layer 120 is silicone with added phosphor; the bottom layer 124 is polyimide (PI) with added phosphor, thermally conductive particles, and titanium dioxide.

[0182] See Figure 31B The LED filament can be divided into four layers: the lower layer 1101", the base layer 124, the top layer 120 and the upper layer 1101'. The four layers are stacked in sequence and can be made of the same or different materials.

[0183] See Figure 31C Figure 1 shows a cross-sectional view of an LED filament along its length in another embodiment of this application. In this embodiment, LED chips 111 are provided in both the top layer 120 and the base layer 124, which are the two middle layers of the four-layer structure of the LED filament. Each layer encloses at least one LED chip. The top layer 120 encloses at least part of the electrodes and includes multiple first LED chips 111'. The base layer 124 includes multiple second LED chips 111'". The LED chip surfaces are provided with electrical connection portions for electrical connection to the outside. Specifically, the first LED chip 111' has a first LED chip first electrical connection portion 114' and a first LED chip second electrical connection portion 116' on its surface; the second LED chip 111' has a third electrical connection portion 114' and a fourth electrical connection portion 116' on its surface. That is, the first LED chip and the adjacent second LED chip are connected by a first wire, which connects the first LED chip first electrical connection portion to the adjacent second chip second electrical connection portion, or by a first wire, which connects the second LED chip first connection portion to the adjacent first LED chip first electrical connection portion. The first LED chip 111' located in the top layer 120 and the second LED chip 111" in the base layer 124 are arranged vertically and vertically, and the corresponding chips are interconnected. Only the first LED chip 111' in the top layer 120 needs to be connected to simultaneously connect the second LED chip 111" in the base layer 124. The first LED chips 111' in the top layer 120 are connected and connected through the first wire 128. The first LED chip 111' in the top layer 120 is connected and connected to the electrodes (106, 108) through the first wire 128. That is, the first wire 128 only exists in the top layer 120. The first LED chip 111' in the top layer 120 and the second LED chip 111" in the base layer 124 are connected in series.

[0184] In another embodiment of the present invention, the electrodes (106, 108) are disposed in the base layer 124, that is, the base layer 124 covers at least a portion of the electrodes (106, 108), and the first wire 128 is completely disposed in the base layer 124, that is, the first wire 128 connects and conducts the electrodes (106, 108) and the second LED chip 111 located in the base layer 124.

[0185] See Figure 31DThe figure shows a cross-sectional view of the LED filament along its length in another embodiment of this application. As shown, the first LED chip 111' and the second LED chip 111" located between the top layer 120 and the bottom layer 124 are not directly connected, i.e., they are electrically isolated from each other. The first LED chips 111' in the top layer 120 and the first LED chips 111' and the electrodes (106, 108) are interconnected and connected through the first wires 128. That is, the multiple first LED chips 111' in the top layer 120 and the electrodes (106, 108) form a complete path through the multiple first wires 128. The multiple first wires 128 in this path are all located in the top layer 120.

[0186] The second LED chips 111” located in the base layer 124 are interconnected and conductive with the electrodes (106, 108) via first wires 128. That is, multiple second LED chips 111” in the base layer 124 and the electrodes (106, 108) form a complete circuit through multiple first wires 128, all of which are located in the base layer 124. In other words, the first LED chip 111' in the top layer 120 and the second LED chips 111” in the base layer 124 are connected in parallel. In this embodiment, the electrical connection portions of the first LED chip 111' in the top layer 120 and the second LED chip 111” in the base layer 124 face different directions.

[0187] In such Figure 31D In one embodiment, the two electrodes (106, 108) are located in the top layer 120 (i.e., most of them are wrapped or covered by the top layer 120). In another embodiment, the electrodes (106, 108) are located in the base layer 124 (i.e., most of them are wrapped or covered by the base layer 124). Alternatively, the electrodes (106, 108) may be partially wrapped by the LED filament, with one part located in the top layer 120 and the other part located in the base layer 124. See details below. Figure 31E A schematic diagram of the electrode positions.

[0188] See Figure 31FFigure 100 is a cross-sectional view of the LED filament along its length in another embodiment of this application. The LED filament 100 has a coordinate system established with the direction from the base layer 124 to the top layer 120 as the positive Z-axis. The LED filament 100 comprises four layers from bottom to top: a lower layer 1101”, a base layer 124, a top layer 120, and an upper layer 1101’. The lower layer 1101” encloses at least a portion of the base layer 124, and the upper layer 1101’ encloses at least a portion of the top layer 120. Electrodes (106, 108) are disposed in the top layer 120 and expose at least one surface for electrical connection to the LED chip. Multiple first LED chips 111' are disposed in the top layer 120; multiple second LED chips 111" are also disposed in the base layer 124. The LED chips 111' in the top layer 120 and the LED chips 111" in the base layer 124 are arranged alternately, that is, along the Z-axis direction, the projections of the LED chips 111' in the top layer 120 and the LED chips 111" in the base layer 124 do not overlap, that is, they are spaced apart from each other. Figure 31F As shown, the first electrical connection portion 114' and the second electrical connection portion 116' of the first LED chip 111' located in the top layer 120 both face the positive Z-axis direction, that is, the second LED chip faces the upper layer 1101'; the first electrical connection portion 114' and the fourth electrical connection portion 116' of the second LED chip 111" located in the bottom layer 124 also face the positive Z-axis direction, that is, they also face the upper layer 1101'. The electrical connection portions of the first LED chip 111' located in the top layer 120 and the second LED chip 111" located in the bottom layer 124 face the same direction, thereby facilitating the connection and conduction between the electrodes (106, 108) and the first LED chip 111' (second LED chip 111"), and between the first LED chip 111' and the second LED chip 111"; wherein the first LED chip 111' and the second LED chip 111" are electrically connected through the first wire 128, that is, the second electrical connection portion of one LED chip is connected to the first electrical connection portion of an adjacent LED chip (or, in other words, the adjacent first and second electrical connection portions of LED chips are connected and conduction is achieved through the first wire 128), and so on, to achieve conduction between multiple LED chips. Figure 31FThe electrode 106 at one end of the LED filament of the second LED chip is electrically connected to the first electrical connection portion 114' of the first LED chip 111' via a first wire 128. The second electrical connection portion 116' of the first LED chip 111' is connected to the third electrical connection portion 114' of the adjacent second LED chip 111" via the first wire 128. The fourth electrical connection portion 116' of the second LED chip 111" is connected to the first electrical connection portion 114' of another adjacent first LED chip 111' via the first wire 128. This process is repeated until the second electrical connection portion 116" of the LED chip at one end along the positive Y-axis is connected to the electrode 108 at the other end of the LED filament via the first wire 128. In this embodiment, multiple first LED chips, multiple second LED chips, and two... The side electrode enables current flow between the top layer 120 and the base layer 124. In the four-layer structure of the LED filament 100, current can flow between the two middle layers. Current can flow from the top layer 120 to the base layer 124, and vice versa, forming a complete current path between the top layer 120 and the base layer 124. This means the LED filament includes continuous paths passing through both the top layer 120 and the base layer 124. Multiple first LED chips 111' and multiple second LED chips 111" are connected in series between the two electrodes. The two electrodes, the multiple first LED chips 111', and the multiple second LED chips 111" form a conductive path between the top layer 120 and the base layer 124. The second LED chips 111" are located in the base layer 124, and the electrode 108 is located in the top layer 120. The first wire 128 between them is also located in the top layer 120. In this embodiment, the electrodes (106, 108) at both ends of the LED filament 100 are also located in the top layer 120. In one embodiment, the electrodes (106, 108) at both ends are located on the base layer 124. In another embodiment, one electrode is located on the top layer 120, while the other electrode is located on the base layer 124. Furthermore, the LED chips adjacent to the electrodes 106 and 108 respectively can be on the same layer or a different layer from the electrodes.

[0189] See Figure 31G This is a schematic diagram of the LED filament 100 in another embodiment of this application. As shown in the figure, in this embodiment, the first conductor 128 is located in the base layer 124. The positions of other components are described as follows: Figure 31F The description in the text will not be repeated here.

[0190] See Figure 31HThis is a schematic diagram of an LED filament 100 in another embodiment of this application. As shown, the first LED chip 111' located in the top layer 120 has its first LED chip first electrical connection portion 114' and first LED chip second electrical connection portion 116' facing the base layer 124, i.e., facing the negative direction of the Z-axis; the second LED chip 111' located in the base layer 124 has its third electrical connection portion 114' and fourth electrical connection portion 116' facing the top layer 120, i.e., facing the positive direction of the Z-axis. The first LED chip 111' located in the top layer 120 and the adjacent second LED chip 111' located in the base layer 124... Between the LED chips 111”, there is at least a partial overlap in their projections along the Z-axis. That is, the first LED chip 111' in the top layer 120 at least partially overlaps with the adjacent second LED chip 111” located in the base layer. Furthermore, the electrical connection portions of the first LED chip 111' in the top layer 120 and the second LED chip 111” in the base layer 124 are correspondingly arranged, with the electrical connection portion of the first LED chip 111' in the top layer 120 facing the base layer 124, and the electrical connection portion of the second LED chip 111” in the base layer 124 facing the top layer 120. Figure 31HFor example, the second LED chip 111” located on the base layer 124 has its third electrical connection portion 114” and fourth electrical connection portion 116” pointing towards the top layer 120. The electrode 106 is connected to the first electrical connection portion 114” of the second LED chip 111” via the first wire 128. The fourth electrical connection portion 116” of the second LED chip 111” is connected to the first electrical connection portion 114” of the adjacent first LED chip 111’ located on the top layer 120. The two can be electrically connected by conductive silver paste, solder paste, etc. That is, the second electrical connection portion of the second LED chip is connected to the first electrical connection portion of the first LED chip, and the second electrical connection portion of the first LED chip is connected to the second electrical connection portion of the second LED chip via conductive silver paste or silicone. The second electrical connection portion 116” of the first LED chip 111’ located on the top layer 120 is also connected to the third electrical connection portion 114” of another adjacent second LED chip 111” located on the base layer 124. That is, among the adjacent LED chips, the first electrical connection portion of one of the LED chips is connected to its third electrical connection portion 114”. The second electrical connection portion of the adjacent LED chip is connected, and this process is repeated until the second electrical connection portion 111” of the second LED chip 111” at the other end is connected to the electrode 108 at the other end via the first wire 128. In this embodiment, the LED chip and the electrode are connected via the first wire, and the first LED chip 111' and the second LED chip 111” are directly connected to the second LED chip 111” via their respective electrical connection portions (i.e., the first electrical connection portion and the second electrical connection portion). Alternatively, the first LED chip and the adjacent second LED chip can be connected via the first electrical connection portion of the first LED chip to the second electrical connection portion of the adjacent second chip, or via the first wire connecting the first connection portion of the second LED chip to the first electrical connection portion of the adjacent first LED chip.In other words, the middle two layers of the four-layer structure of the LED filament are conductive, meaning that current can pass between the two middle layers. Current can flow from the top layer 120 to the base layer 124, or from the base layer 124 to the top layer 120, forming a complete current path between the top layer 120 and the base layer 124. This means that the LED filament includes continuous paths passing through the top layer 120 and the base layer 124 respectively. Specifically, the first LED chip 111' is directly conductive to the adjacent second LED chip 111" and multiple first LED chips 111' and multiple second LED chips 111" are connected in series between the two electrodes (106, 108). The two electrodes (106, 108), multiple first LED chips 111', and multiple second LED chips 111" form a conductive path between the top layer and the base layer. The first LED chip is conductive to the adjacent second LED chip, and the top layer 120 and the base layer 124 form a current path only through the first LED chip and the second LED chip. Alternatively, it can be said that a current path is formed only through the electrodes and the LED chip.

[0191] See Figure 31I The figure shows a schematic diagram of the LED filament 100 in another embodiment of this application. In the embodiment shown in the figure, the electrodes and the LED chips are also directly connected through electrical connection parts. That is, the electrode 106 is directly connected to the first electrical connection part 114” of the LED chip 111” located at the end, and the electrode 108 is directly connected to the second electrical connection part 116” of the LED chip 111” at the other end. That is, the electrodes (106, 108) are directly connected to the first electrical connection part or the second electrical connection part, and the electrodes (106, 108) are both located on the top layer 120.

[0192] See Figure 31J The figure shows a schematic diagram of an LED filament 100 in another embodiment of this application. In the embodiment shown in the figure, electrode 106 is directly connected to the first electrical connection portion 114' of the LED chip 111' located at one end, and electrode 108 is directly connected to the second electrical connection portion 116' of the LED chip 111' located at the other end. Both electrodes (106 and 108) are located on the base layer 124.

[0193] In some embodiments, please refer to Figure 32A , Figure 32A The diagram (XIX) shows the structure of an LED filament in some embodiments according to this application. Figure 32AAs shown, the light conversion layer 110 includes a top layer 120 and a base layer 124, wherein the layered body 1101 can completely cover the top layer 120 and at least cover at least a portion of the surface of the electrodes (106, 108) facing the top layer 120, and the base layer 124 is uncovered. The thickness of the layered body 1101 along the radial direction of the LED filament 100 is less than or equal to the thickness of the top layer 120 along the radial direction of the LED filament 100, further less than or equal to one-half the thickness of the top layer 120 along the radial direction of the filament, and even further less than or equal to one-third.

[0194] In some embodiments, the thickness of the top layer 120 can be set to 0.2mm to 0.7mm, and more specifically, 0.35mm to 0.5mm. The thickness of the base layer 124 can be set to 0.05mm to 0.15mm, and more specifically, 0.08mm to 0.15mm, to ensure that the LED filament 100 has sufficient flexibility.

[0195] In some embodiments, due to differences in the materials added between the base layer 124 and the top layer 120, there are differences in deflection and strength per unit volume between the base layer 124 and the top layer 120. When the thicknesses of the base layer 124 and the top layer 120 are similar, the cumulative difference can lead to an excessively large difference in the overall deflection or strength of the base layer 124 and the top layer 120, making them prone to delamination or breakage when bent. For example, when the ratio of the thickness of the base layer 124 to the thickness of the top layer 120 is greater than one-half, the overall flexibility and reliability of the LED filament 100 are insufficient, and the LED filament may exhibit the aforementioned lack of flexibility and susceptibility to delamination or breakage when bent. Therefore, in this embodiment, the ratio of the thickness of the base layer 124 to the thickness of the top layer 120 is less than or equal to one-half, and more specifically, less than or equal to three-eighths. Therefore, in this embodiment, when the ratio of the thickness of the base layer 124 to the thickness of the top layer 120 is controlled within the aforementioned ratio range, better flexibility can be achieved. That is, by controlling the thickness, the physical properties such as deflection and strength of the base layer 124 and the top layer 120 caused by the difference in the added materials can be adjusted, so that the base layer 124 and the top layer 120 have similar physical properties, which can prevent delamination or breakage when the LED filament 100 is bent.

[0196] In some embodiments, the ratio of the thickness of the layer 1101 to the thickness of the base layer 124 is less than or equal to one-half, and even more specifically less than or equal to three-quarters. For example, if the thickness ratio is greater than one-half, the layer 1101 may affect the overall light output of the filament (solid particles are added to the layer 1101).

[0197] In some embodiments, the thickness of the layer 1101 can be set to 0.05mm to 0.4mm, and more specifically, 0.1mm to 0.2mm. In some embodiments, if the thickness of the base layer 124 is too large, for example, if the thickness of the base layer 124 is greater than one-quarter of the sum of the thicknesses of the layer 1101, the top layer 120, and the base layer 124, it will affect the heat dissipation of the base layer 124, meaning that the heat dissipation path of the LED filament 100 is long and heat accumulation is easily caused. Therefore, in this embodiment, the thickness of the base layer 124 is less than or equal to one-quarter of the thickness of the LED filament 100. Specifically, as shown in the figure... Figure 32A As shown, the thickness of the base layer 124 is less than or equal to one-quarter of the sum of the thicknesses of the layered body 1101, the top layer 120, and the base layer 124. This maintains the heat dissipation of the base layer 124, shortens the heat dissipation path of the LED filament 100, and prevents heat buildup.

[0198] In some embodiments, such as Figure 32A As shown, the light conversion layer 110 includes a top layer 120 and a base layer 124. The layer 1101 can completely cover the top layer 120 and at least cover at least a portion of the surface of the electrodes (106, 108) facing the top layer 120. The base layer 124 is uncovered. The same or similar additive materials as those in the layer 1101 are added to the base layer 124 so that the base layer 124 and the layer 1101 are ultimately displayed in the same RGB value range. For example, if titanium dioxide is added to the original materials, the layer 1101 and the base layer 124 will both appear white or close to white, and the color value will be in the R value range (235~255). The G value (235-255) and B value (235-255) are within the range, or graphene is added to make the layer 1101 and the base layer 124 appear gray or close to gray, with color values ​​within the range of R value (100-234), G value (100-254), and B value (235-254). For example, white powder particles are added to both the layer 1101 and the base layer 124. For example, titanium dioxide is added to the layer 1101 and the base layer 124. At the same time, the amount of titanium dioxide added is 1% to 20% of the total weight of solid particles (powder) in the base layer 124, and further to 3% to 15%.

[0199] In some embodiments, the base layer 124 further comprises at least one phosphor, which accounts for 1% to 15% of the total weight of the solid particles (powder) in the base layer 124, and more specifically 2% to 8%. The average particle size of the phosphor particles is controlled to be less than approximately 20 μm. In some embodiments, the base layer 124 may also comprise a certain amount of thermally conductive particles, including but not limited to alumina and silicon dioxide, to improve heat dissipation. The total weight of the thermally conductive particles accounts for 80% to 95% of the total weight of the solid particles in the base layer 124. The particle size of the thermally conductive particles can be a combination of various particle sizes, selected from 1 μm to 30 μm, and more specifically from 2 μm to 25 μm, with an average particle size between 1 μm and 20 μm, and more specifically between 5 μm and 15 μm.

[0200] In some embodiments, the total weight of thermal particles in the base layer 124 accounts for 80% to 95% of the total weight of solid particles in the base layer 124.

[0201] In some embodiments, the light conversion layer 110 includes a top layer 120 and a base layer 124, wherein the layered body 1101 can completely cover the top layer 120 and at least cover at least a portion of the surface of the electrodes (106, 108) facing the top layer 120, and the base layer 124 is uncovered, wherein different additive materials are added to the base layer 124 than to the layered body 1101, so that the colors ultimately displayed by the base layer 124 and the layered body 1101 are displayed in different RGB value ranges. In some embodiments, the RGB color standard can be converted to other color standards.

[0202] In some embodiments, the substrate 124 and the layered body 1101 are made of the same material, so that the substrate 124 and the layered body 1101 have the same color, for example, the substrate 124 is white. After the light conversion layer 110 is formed on the substrate 124, the layered body 1101 is formed on the light conversion layer 110, and the layered body 1101 completely covers part of the light conversion layer 110, so that the formed filament appears white when not lit. Of course, the layered body 1101 may at least cover part of the light conversion layer 110.

[0203] In some other embodiments of this application, silver-gray or silver-white thermally conductive particles are added to the base layer 124. These thermally conductive particles include, but are not limited to, aluminum powder or aluminum oxide, silver powder, or aluminum-silver mixture powder. These silver-gray or silver-white thermally conductive particles can be disposed on the base layer 124 or the layered body 1101, such that at least one side of the flexible filament is silver-gray or silver-white.

[0204] When silver-gray or silver-white thermally conductive particles are set in the base layer 124, the thermally conductive particles account for 0.15% to 10% of the total proportion of solid particles in the base layer 124, and further 0.3% to 5%. The total weight of the thermally conductive particles (including but not limited to alumina or silicon dioxide) and phosphor particles in the base layer 124 is 95% to 99% of the total weight of solid particles in the base layer 124. By controlling the proportion of solid particles in the base layer 124, the thermal conductivity of the substrate 124 is improved, thereby improving the heat conduction when the LED chip 111 emits light.

[0205] The silver-gray or silver-white thermally conductive particles are distinguished from the thermally conductive particles themselves; the silver-gray or silver-white thermally conductive particles can be called color-developing particles. These color-developing particles account for 0.15% to 10% of the total solid particles in the base layer 124, and further, 0.3% to 5%. Of course, the silver or silver-gray thermally conductive particles, thermally conductive particles, and fluorescent powder particles can also be added to the base layer 124 in different proportions.

[0206] In one embodiment of this application, silver or silver-gray thermally conductive particles are disposed in the layered body 1101, accounting for 0.05% to 10% of the total weight of the layered body 1101, and more specifically 0.15% to 5%. The thickness of the top layer 120 disposed on the surface of the base layer 124 facing the LED chip is 0.2mm to 0.6mm, and more specifically 0.35mm to 0.5mm; the thickness of the base layer 124 is 0.05mm to 0.3mm, and more specifically 0.1mm to 0.2mm; the thickness of the base layer 124 is 0.04mm to 0.3mm, and more specifically 0.08mm to 0.15mm; and the thickness of the base layer 124 is less than one-third, and more specifically one-quarter, of the sum of the thicknesses of the base layer 124, the top layer 120, and the layered body 1101. This satisfies both the appearance requirements and the light-emitting and heat-dissipating requirements.

[0207] In one embodiment of this application, the base layer 124 may also include a multi-layer structure, such as at least two layers, with thermally conductive particles and phosphor particles added in the layer closest to the LED chip, and silver-gray / silver-white thermally conductive particles added in the outermost layer, that is, in the finished filament, the outermost surface that can be observed by the naked eye, so that the surface appears silver-gray / silver-white.

[0208] In this embodiment of the application, the LED chips 111 can be connected by conductive metal wires, such as gold wires, silver wires, copper wires, aluminum wires, etc., and the LED chips 111 can be electrically connected by wire bonding. Of course, the LED chips 111 and the electrodes (106, 108) can also be connected by conductive metal wire bonding.

[0209] In another embodiment of this application, a copper foil circuit is provided on the base layer 124. The copper foil circuit extends along the length direction of the base layer 124. The LED chip 111 is disposed on the copper foil circuit by flip-chip and is connected to the copper foil circuit. The LED chip 111 extends along the copper foil circuit or the length direction of the base layer 124. At the same time, the two ends of the copper foil circuit are electrically connected to the electrodes (106, 108), thereby realizing the conduction and lighting of the entire filament.

[0210] In some other embodiments of this application, gold-colored thermally conductive particles are added to the base layer 124. These particles include, but are not limited to, bronze powder, brass powder, gold powder, or combinations thereof. The gold-colored thermally conductive particles can be disposed on the base layer 124 or the layer 1101, such that at least one side of the flexible filament is gold.

[0211] When gold-colored thermally conductive particles are incorporated into the base layer 124, these particles constitute 0.5% to 15% of the total solid particles in the base layer 124, and more specifically, 1% to 10%. The combined weight of the thermally conductive particles (including but not limited to alumina or silica) and phosphor particles in the base layer 124 is 90% to 99% of the total weight of the solid particles. The gold-colored thermally conductive particles are distinguished from the silver-gray or silver-white particles; they can be referred to as color-developing particles. These color-developing particles constitute 0.5% to 15% of the total solid particles in the base layer 124, and more specifically, 1% to 10%. Of course, the gold-colored thermally conductive particles, thermally conductive particles, and phosphor particles can be added to the base layer 124 in different proportions.

[0212] In one embodiment of this application, gold-colored thermally conductive particles are disposed in the layered body 1101, accounting for 0.05% to 10% of the total weight of the layered body 1101, and more specifically 0.1% to 5%. The thickness of the top layer 120 disposed on the surface of the base layer 124 facing the LED chip is 0.1mm to 1mm, and more specifically 0.35mm to 0.5mm; the thickness of the base layer 124 is 0.05mm to 0.3mm, and more specifically 0.1mm to 0.2mm; the thickness of the base layer 124 is 0.04mm to 0.3mm, and more specifically 0.08mm to 0.15mm; and the thickness of the base layer 124 is less than or equal to one-third, and more specifically one-quarter, of the sum of the thicknesses of the base layer 124, the top layer 120, and the layered body 1101. This satisfies both aesthetic requirements and the requirements for light emission and heat dissipation.

[0213] In one embodiment of this application, the base layer 124 may also include a multi-layer structure, such as at least two layers, with thermally conductive particles and phosphor particles added in the layer closest to the LED chip, and gold thermally conductive particles added in the outermost layer, which is the outermost surface that can be observed by the naked eye in the finished filament, so that the surface appears gold.

[0214] In this embodiment of the application, the LED chips 111 can be connected by conductive metal wires, such as gold wires, silver wires, copper wires, aluminum wires, etc., and the LED chips 111 can be electrically connected by wire bonding. Of course, the LED chips 111 and the electrodes (106, 108) can also be connected by conductive metal wire bonding.

[0215] In another embodiment of this application, a copper foil circuit is provided on the base layer 124. The copper foil circuit extends along the length direction of the base layer 124. The LED chip 111 is disposed on the copper foil circuit by flip-chip and is connected to the copper foil circuit. The LED chip 111 extends along the copper foil circuit or the length direction of the base layer 124. At the same time, the two ends of the copper foil circuit are electrically connected to the electrodes (106, 108), thereby realizing the conduction and lighting of the entire filament.

[0216] In another embodiment of this application, the base layer 124 is implemented using BT resin substrate material (hereinafter referred to as BT substrate) as the main material. BT substrate, or BT (Bismaleimide Triazine) board, is a resin substrate material synthesized from bismaleimide (BMI) and cyanate ester (CE) resin. In one embodiment of this application, the base layer 124 includes a BT substrate, which is located at the bottom of the base layer 124. Copper foil lines are disposed on the top of the BT substrate, extending along the length direction of the BT substrate, and at least 70% of the length direction of the BT substrate is provided with copper foil lines. Electrodes (106, 108) are disposed at both ends of the copper foil lines, i.e., the BT substrate. The copper foil lines are connected to the electrodes (106, 108) by wire bonding or soldering. The copper foil circuit can be fitted with an anti-oxidation layer on its surface as needed. This anti-oxidation layer can be formed by electroplating silver or gold, or by passivation. Of course, during the formation of the anti-oxidation layer, the copper foil circuit still reserves electrical connection points for electrical connection with the LED chip 111. The LED chip 111 is set on the copper foil circuit in a flip-chip manner, that is, solder paste is applied to the reserved electrical connection points on the copper foil circuit. The leads of the LED chip 111 face the copper foil circuit and contact the solder paste on the electrical connection points. Through reflow soldering, laser soldering, or other methods, the solder paste melts and fully combines with the leads of the LED chip 111. Then, it is cooled and cured to fix the LED chip 111 to the copper foil circuit and achieve electrical conduction, thereby realizing the conduction and lighting of the LED filament. An encapsulating adhesive is disposed above the LED chip 111 and the copper foil circuit. The encapsulating adhesive can be silicone, resin, polyimide, or other adhesives as described above. The adhesive contains at least one of phosphor particles, heat dissipation particles, or solid particles as described above. The adhesive completely covers the LED chip 111 and at least covers a portion of the copper foil circuit, as well as at least a portion of the electrodes (106, 108), thereby forming a top layer 120 covering the base layer 124. The top layer 120, through the various particles mixed therein and its own material, has at least efficient heat dissipation and light conversion functions. A layer 1101 is disposed on the top layer 120, that is, on the surface away from the chip 111. The layer 1101 completely or at least covers a part of the top layer 120. White fixing powder is added to the layer 1101, including but not limited to titanium dioxide, aluminum oxide, magnesium oxide, silicon dioxide, etc., as described in the preceding and following text, so that the layer 1101 appears white when the filament is not lit, that is, under the RGB standard, its color value is in the range of R (235~255), G (235~255), B (235~255).The weight of white solid powder particles in the layered body 1101 can account for 0.7-3% of the total weight of the layered body 1101. Of course, other colored solid powder particles can also be set in the layered body 1101, so that the layered body 1101 presents other colors such as red, orange, yellow, green, blue, indigo, purple, gray, black, gold, silver and so on.

[0217] In this embodiment of the application, the BT substrate has light transmission and light conversion functions, and its color is also white. That is, under the RGB standard, its color value is in the range of R (235~255), G (235~255), B (235~255). And it is located on the outermost side of the filament. Therefore, there is no need to provide an additional white coating (such as the aforementioned layer 1101) on the side of the base layer 124, that is, the side of the BT substrate away from the chip 111. It can work with the layer 1101 to make the LED filament appear white when it is not lit. That is, under the RGB standard, its color value is in the range of R (235~255), G (235~255), B (235~255).

[0218] In one embodiment of this application, the light transmittance of the BT substrate is ≥30%.

[0219] In another embodiment of this application, the light transmittance of the BT substrate is ≥35%.

[0220] In another embodiment of this application, the light transmittance of the BT substrate is ≥80%.

[0221] Of course, in some other embodiments of this application, different colored BT substrates can also be used to make the filament present different colors when it is not lit, such as yellow BT substrate, blue BT substrate, gray BT substrate, black BT substrate, red BT substrate, green BT substrate, purple BT substrate, gold BT substrate, silver BT substrate, etc., so that the filament presents the corresponding color when it is not lit.

[0222] In some embodiments of this application, the BT substrate and the layer 1101 can be the same color, that is, the filaments are of the same color.

[0223] In some embodiments of this application, the BT substrate and the layer 1101 can be different colors, that is, the filament is different colors or at least two colors.

[0224] In one embodiment of this application, the thickness of the base layer 124 is less than or equal to 0.20 mm, and can be further controlled to be less than or equal to 0.15 mm. Under this thickness condition, the base layer 124 can have good light transmittance and heat dissipation performance, with a light transmittance greater than or equal to 50% and a thermal conductivity greater than or equal to 1 W / (mK). By setting a color layer on the outer side of the base layer 124, an even thinner thickness and better heat dissipation performance can be achieved. At the same time, the thinner thickness can also meet the flexibility requirements of the flexible filament.

[0225] In another embodiment of this application, during the BT substrate molding process, phosphor particles, heat dissipation particles, or other solid particles as described above can be added to the side of the BT substrate facing the LED chip 111, enabling the BT substrate body to have light conversion capability. On the side of the BT substrate facing away from the LED chip 111, titanium dioxide (or other powder particles with a specific color), heat dissipation particles, phosphor particles, or other solid particles as described above can be provided to give it the desired color and achieve a specific function. For example, if titanium dioxide particles are provided on the side of the BT substrate facing away from the LED chip 111, it will appear white.

[0226] In one embodiment of this application, during the molding process of the BT substrate, the side facing the LED chip 111 and the side facing away from the LED chip 111 exhibit the same color.

[0227] In another embodiment of this application, during the BT substrate molding process, by adding different solid particles, the side of the BT substrate facing away from the LED chip 111 and the side facing the LED chip 111 can exhibit different colors. For example, the side facing away from the LED chip 111 can be white, and the side facing the LED chip 111 can be yellow. When making the filament white, the side facing away from the LED chip 111 does not need to be additionally coated with a white coating. The solid particles added can be distributed in different positions by controlling their density and by being subjected to a magnetic field or an electric field.

[0228] Of course, solid particles can be omitted during the BT substrate molding process.

[0229] In one embodiment of this application, the color of the filament when it is not lit is the same as the color of the filament when it is lit or the color of the emitted light.

[0230] In one embodiment of this application, the color of the filament when it is not lit is different from the color of the filament when it is lit or the color of the emitted light.

[0231] Please see Figure 32B and 32C , Figure 32B and 32C This is a cross-sectional view of a filament along its length, using a BT substrate as the main material, in some embodiments of this application. For example... Figure 32BAs shown, in this embodiment of the application, a BT board is used as the main material of the substrate 124 for the filament. The BT substrate is disposed on the lower side of the base layer 124, that is, the side away from the LED chip 111, more specifically, the outermost side, that is, at least one side of the BT substrate serves as the outer surface of the LED filament. A copper foil line 1241 is provided on the upper surface of the substrate 124 (the side facing the LED chip 111). The copper foil line 1241 extends along the length of the LED filament and forms electrodes (106, 108) at both ends of the LED filament. That is, the base layer 124 has positive and negative electrodes at both ends when it is formed. The base layer 124 covers at least part of the electrodes (106, 108), so there is no need to set additional positive and negative electrodes during the LED filament encapsulation process. Moreover, the electrodes are integrally formed into the substrate 124 when the substrate 124 is formed, and have good bonding strength. During the bending process of the LED filament, it is not easy to break or peel off.

[0232] In one embodiment of this application, the LED chip 111 and the copper foil circuit 1241 are fixed and connected by solder paste. See [link to relevant documentation]. Figure 32C As shown in the figure, the upper layer of the base layer 124, i.e., the side closest to the LED chip 111, is the surface where the copper foil circuit 1241 is formed. The LED chip 111 is fixed to the copper foil circuit 1241 by solder paste. As shown in the enlarged portion of the figure, the LED chip 111 is fixed and connected to the copper foil circuit 1241 through at least two points of solder paste, or in other words, at least two pins on the LED chip 111 are fixed and conductive to the copper foil circuit 1241. Above the copper foil circuit 1241 and the LED chip 111, i.e., on the side of the LED chip 111 away from the base layer 124, a top layer 120 is provided. This top layer 120 completely covers the LED chip on the base layer 124 and covers at least a portion of the electrodes (106, 108). In another embodiment of this application, the top layer 120 covers at least a portion of the copper foil circuit.

[0233] A layered body 1101 is provided on the side of the top layer 120 away from the LED chip 111 or away from the base layer 124. The layered body 1101 completely covers or at least covers the surface of the top layer 120 away from the base layer 124, and the layered body 1101 at least covers a portion of the electrode (106, 108) or copper foil circuit 1241.

[0234] In another embodiment of this application, the layer 1101 is not in contact with the electrodes (106, 108) or the copper foil circuit 1241 at all, that is, the contact area between the layer 1101 and the base layer 124 is zero.

[0235] LED chips 111 extend at uniform intervals along the axial direction of the LED filament, i.e., the length of the LED filament, until both ends of the LED filament, i.e., the electrode (106, 108). LED chips 111 and electrodes (106, 108) are fixed and connected via flip-chip bonding and solder paste, thereby enabling the entire LED filament, or the LED chips 111 on the entire LED filament, to conduct and illuminate. Specifically, in the direction perpendicular to the maximum surface area of ​​the LED chip 111 or the maximum surface area of ​​the electrode (106, 108), the projections of the LED chip 111 and the electrode (106, 108) at least partially overlap.

[0236] In this application, solder paste can also be replaced with other materials that have similar conductive and fixing functions, such as conductive adhesive.

[0237] In another embodiment of this application, the LED chips 111 are arranged with non-equal spacing along the axial direction of the LED filament, that is, the length direction of the LED filament, that is, there are at least two types of spacing between the LED chips 111.

[0238] In another embodiment of this application, the LED chip 111 and the electrodes (106, 108) can also be electrically connected by a metal wire using a wire bonding method. That is, in the direction perpendicular to the maximum surface of the LED chip 111 or the maximum surface of the electrodes (106, 108), the projections of the LED chip 111 and the electrodes (106, 108) do not overlap, or the overlap area is zero.

[0239] In another embodiment of this application, copper foil circuitry 1241 may not be provided on the base layer 124. When the LED chip 111 is fixed to the base layer 124, it directly contacts the BT substrate. When fixing the LED chip 111, die-bonding adhesive is provided on the surface of the base layer 124 or the BT substrate. After the die-bonding adhesive is applied to the surface of the base layer 124, the LED chip 111 is arranged in a certain pattern on the die-bonding adhesive. At the same time, an appropriate pressure is applied to the LED chip 111, so that the LED chip 111 is embedded in the die-bonding adhesive, that is, at least a part of the area is covered with die-bonding adhesive. In other words, the LED chip 111 is at least partially accommodated or embedded in the die-bonding adhesive in the direction perpendicular to the base layer 124. After the die-bonding adhesive cures, the LED chip 111 and the base layer 124 are fixed. As described above, the LED chip is embedded or recessed in the die-bonding adhesive, and its fixing strength is high, making it difficult for the chip and the base layer 124 to fall off or delaminate. Of course, in some other embodiments, excess die-bonding adhesive can also be washed away with a specific solvent.

[0240] Electrodes are set at both ends of the LED filament, either at the same time as setting the LED chip 111, or before or after setting the LED chip 111.

[0241] After the LED chips 111 and electrodes are set up, electrical conduction or signal transmission between the LED chips 111 is achieved by bonding metal wires. Electrical conduction between the LED chips 111 and the electrodes (106, 108) is also achieved by bonding wires, thereby enabling the LED filament to conduct and light up. The metal wires can be single metal wires, such as gold, silver, aluminum, or copper wires; or they can be alloy wires, i.e., made from at least two metals in a certain proportion, such as gold-silver alloy wires.

[0242] After wire bonding is completed, adhesive is applied or applied to the side of the base layer 124 where the LED chip 111 is located to form the top layer 120. The top layer 120 completely encapsulates the LED chip 111 and the metal wires onto the base layer 124. That is, the top layer 120 covers the LED chip 111 and the metal wires and is combined with the base layer 124, isolating the LED chip 111 and the metal wires from the external environment, and at least covering a portion of the electrodes (106, 108).

[0243] In another embodiment of this application, the base layer 124 also includes a copper foil line 1241, which forms electrodes (106, 108) at both ends of the filament. When the LED chip 111 is set, the LED chip 111 is fixed to the copper foil line 1241 by die bond adhesive. However, electrical conduction and signal transmission are achieved between LED chips 111 and between LED chips 111 and electrodes (106, 108) by wire bonding with metal wires.

[0244] In one embodiment of this application, a top layer 120 is disposed above the LED chip 111 and the base layer 124. The outer surface of the top layer 120 is covered with a layered body 1101. Along the radial direction of the LED filament, the top layer 120 is arc-shaped or arc-shaped protrusion, and the layered body 1101 is arc-shaped and fits against it (e.g., Figure 33 This design minimizes the use of raw materials and eliminates sharp edges, avoiding stress concentration and reducing costs. Furthermore, the arc shape of the top layer 120 and the layered body 1101 preferably matches the beam diffusion angle of the LED chip 111. This ensures that the light emitted from the LED chip 111, reaching the top layer 120 and the layered body 1101, travels along roughly the same path (the path of light in the top layer 120 and the layered body 1101), resulting in similar light conversion and light loss. This ensures that the light output at each location is essentially uniform. Additionally, the arc-shaped surface, especially the convex surface, has a light diffusion effect, spreading the beam rather than concentrating it, resulting in a wider light output range and a softer light output due to the non-concentrated optical diffusion. Of course, the cross-sections of the top layer 120 and the layered body 1101 can also be rectangular, conical, or other shapes.

[0245] like Figure 32BAs shown, in one embodiment of this application, the thickness of the base layer 124 is 0.04-0.12 mm, the thickness of the top layer 120 is 0.35-0.5 mm, and the thickness of the layered body 1101 is 0.1-0.2 mm. Figure 32B As shown in the embodiment, the thickness of the base layer 124 is less than or equal to one-quarter of the sum of the thickness of the base layer 124, the thickness of the top layer 120, and the thickness of the layered body 1101, which ensures the bending performance of the LED filament while preventing delamination.

[0246] In some other embodiments, the layered body 1101 contains various solid powder particles, such as heat dissipation particles and photoluminescent particles.

[0247] See 32D, which is a cross-sectional view of the LED filament in the radial direction according to an embodiment of this application. Figure 32C As can be seen, along the Z-axis direction, or in other words, in the direction from the base layer 124 to the LED chip 111, the bottom layer is the base layer 124, on which copper foil lines 1241 (or electrodes 106 or 108) are embedded. At least a portion of the copper foil lines 1241 is exposed outside the base layer 124. The LED chip 111 is fixed to the copper foil lines 1241 by at least two solder pastes. The top layer 120 completely covers the LED chip 111 and covers at least a portion of the base layer 124. The layered body 1101 is disposed on the side of the top layer 120 away from the base layer 124 and covers at least a portion of the top layer 120.

[0248] See Figure 32K In some embodiments of this application, the LED filament is arc-shaped or rectangular in cross-section along the radial direction. As shown in the figure, the layer 1101 covers both sides of the top layer 120 and is arc-shaped; in some embodiments, the layer 1101 only covers the side of the top layer 120 away from the LED chip and does not cover the side of the top layer 120. Of course, it can also be said that the layer 1101 covers or encloses at least a portion of the top layer 120 (the chip and wires are not shown in the figure).

[0249] In one embodiment of this application, the LED filament can present different color area combinations arranged in a certain pattern when it is not lit. More specifically, different color area combinations are presented on the same LED filament. However, when the LED filament is lit and emits light, the emitted light color is consistent, or the emitted light is the same color. For example, the LED filament presents at least two color areas when it is not lit, such as yellow areas and white areas, but when it is lit, it emits white light.

[0250] In another embodiment of this application, the LED filament presents a combination of different color areas arranged in a certain pattern when it is not lit, and when the filament is lit, its emitted light is also of multiple colors.

[0251] In one embodiment of this application, the LED filament has at least two color regions when it is not lit, and emits at least two colors of light when the LED filament is lit, and the emitted light color of each light-emitting region is the same as the color of the corresponding light-emitting region when it is not lit.

[0252] In another embodiment of this application, the LED filament has at least two color regions when it is not lit, and emits at least two colors of light when the LED filament is lit, but the color of the light emitted by each of its light-emitting regions is inconsistent with the color of the corresponding light-emitting region when it is not lit at least once.

[0253] Please see Figure 32B and Figure 32E , Figure 32B This is a cross-sectional schematic diagram of one embodiment of the present application, showing the LED filament along its length, i.e., the axial direction of the LED filament and perpendicular to the largest surface of the LED chip. Figure 32E This is a schematic cross-sectional view along the length of the LED filament and parallel to the largest surface of the LED chip in one embodiment of this application. Figure 32B At least one row of LED chips 111 arranged along the length of the filament is disposed on the base layer 124, meaning that the LED filament has at least one row of LED chips 111 arranged along the length of the filament. In this embodiment of the application, three rows of LED chips 111 arranged along the length of the filament are disposed on the base layer 124. The three rows of LED chips arranged along the length of the filament can be of the same type or of different types, for example... Figure 32E As shown.

[0254] As described above, a base layer 124 is formed using a white BT substrate as the substrate. Electrodes (106, 108) are formed at both ends of the base layer 124, and LED chips 111 are placed on top of it. A top layer 120 is then used to form the LED filament. Electrical conductivity is achieved between the LED chips 111 and between the LED chips 111 and the electrodes (106, 108) through wire bonding with metal wires. Please refer to [link to relevant documentation]. Figure 32E Multiple rows of LED chips extending along the length of the LED filament can be arranged on a single LED filament, wherein there are at least two or more types of LED chips. See also Figure 32EThree rows of LED chip arrays are arranged side-by-side on a single filament. LED chip 111 forms the first row of the LED array, LED chip 111' forms the second row, and LED chip 111" forms the third row. The circuits between the three rows of LED arrays are independent of each other. The spacing between the LED chips is at least one type, and the lines connecting the three rows of LED arrays do not intersect. LED chip 111 is a blue light chip, LED chip 111' is a red light chip, and LED chip 111" is a green light chip. An adhesive layer is applied above the LED chips. This adhesive layer includes, but is not limited to, materials such as silicone, resin, and polyimide described in this context, forming the top layer 120 as described above. This top layer 120 is a transparent adhesive layer, ensuring that the LED filament emits light of ≥3 colors when lit.

[0255] In another embodiment of this application, the emitted light color after the LED chip is lit may be ≥3, but the final emitted light after the LED filament is lit is still one.

[0256] In another embodiment of this application, the final output light, i.e., the mixed light, can be achieved by adjusting the light output ratio, relative positional relationship, light intensity ratio, or the number ratio of blue, red, and green light chips. For example, when controlling the light intensity, the ratio of blue light intensity to red light intensity to green light intensity is 1:3:6.

[0257] See Figure 32F and 32G , Figure 32F and Figure 32G These are schematic cross-sectional views of the LED filament along its length (axial direction), parallel to the largest surface of the LED chip. In one embodiment, as... Figure 32F As shown, the top layer 120 can be set independently relative to each row of LED chips, and the top layers 120 between each row of LED chip arrays are independent of each other and do not contact each other. In another embodiment, as... Figure 32G As shown, the top layer 120 is positioned above the multi-row LED chip array, meaning that the top layer 120 covers at least one row of LED chips.

[0258] See Figure 32E In one embodiment of this application, multiple electrodes are provided at both ends of the LED filament, that is, each segment of the LED filament, or in other words, each end is provided with electrodes greater than or equal to the number of rows of the LED chip array. The LED chip array is connected to its corresponding electrodes, and the circuits between each row of LED chip arrays are independent. That is, along the length of the filament, the current direction of each row of LED chip arrays is unidirectional. Each row of LED chip arrays can be controlled individually or simultaneously. By controlling different LED chip arrays in the LED filament, the light output and color temperature of the LED filament can be controlled.

[0259] In another embodiment of this application, an electrode (i.e., a positive electrode and a negative electrode) is respectively provided at both ends of the LED filament, and multiple rows of LED chip arrays share a single positive and negative electrode, such as... Figure 32H As shown, the multi-row LED chip array is connected in parallel, meaning that there are multiple current channels on one LED filament, and these current channels are independent of each other. The failure of one current channel does not affect the other current channels. Furthermore, there is only one current direction along the length of the LED filament, and each row of LED chips is controlled simultaneously.

[0260] In another embodiment of this application, an electrode (i.e., a positive electrode and a negative electrode) is respectively provided at both ends of the LED filament, and multiple rows of LED chip arrays share a single positive and negative electrode, such as... Figure 32I As shown, the multi-row LED chip array is connected in series. Each LED filament has a circuit channel, but the current channel has multiple current directions or at least one current direction along the length (axial direction) of the LED filament.

[0261] In some other embodiments of this application, at least one blue light chip, at least one red light chip, and at least one green light chip can be connected in series or in parallel to form a multicolor light chip array, and then the multicolor light chip array can be connected in series or in parallel.

[0262] In some other embodiments of this application, phosphor is mixed in the top layer 120 (or light conversion layer 110) to enable the top layer 120 to have light conversion function, see reference. Figure 32F In one embodiment of this application, the top layer 120 on the first row of LED chip array formed by LED chip 111 contains phosphor particles, which only correspond to the first row of LED chip array, i.e., the blue light chip. The added phosphor can convert the light emitted by the blue light chip in the first row into white light. For example, if the added phosphor is yellow, the adhesive layer on the first row of LED chip array, i.e., the top layer 120 (or light conversion layer 110), is yellow. When the LED filament is lit, this area emits white light, and the color of the light emitted when lit is different from the color of the area when it is not lit. Similarly; the second row consists of an LED chip array composed of LED chips 111', and the corresponding adhesive layer, i.e., the top layer 120 (or light conversion layer 110), is supplemented with corresponding red phosphor, so that the light emitted by the red chip is converted by the top layer 120 and the final emitted light is white light; the third row consists of an LED chip array composed of LED chips 111”, and the corresponding adhesive layer, i.e., the top layer 120 (or light conversion layer 110), is supplemented with corresponding green phosphor, so that the light emitted by the green chip is converted by the top layer 120 and the final emitted light is white light; ultimately, the entire LED filament emits white light.

[0263] In one embodiment of this application, LED chips 111 with multiple light-emitting colors (i.e., at least two types of LED chips 111) and different phosphors (i.e., at least two types of phosphors) can be used to make the LED filament present different colors when it is not lit, and emit white light when the LED filament is lit.

[0264] In one embodiment of this application, an LED chip 111 with a light-emitting color can be used in combination with at least one phosphor to make the overall light emitted by the filament white. For example, a blue LED chip can be used in combination with different phosphors to make the light emitted by the LED filament white when it is lit. For example, three rows of blue LED chips can be used with red phosphor, green phosphor and yellow phosphor respectively, so that the filament can mix light to produce white light when it is lit.

[0265] In another embodiment of this application, an LED chip 111 with a specific light-emitting color can be used in conjunction with at least one phosphor to make the overall light emitted by the filament white. For example, a blue LED chip can be used with different phosphors to make the light emitted by the LED filament white when it is lit. For example, three rows of blue LED chips can be used, corresponding to red phosphor, green phosphor, and yellow phosphor respectively. This allows the filament to control the three rows of blue LED chips individually or simultaneously when it is lit, so that the LED filament is lit in blue, red, green, blue and red, blue and green, red and green, blue-green-red tricolor light, or white light, etc.

[0266] See Figure 32J In one embodiment of this application, the base layer 124 includes a BT substrate 1242 as a substrate, copper foil lines 1241 disposed on the surface of the BT substrate 1242 facing the LED chip, and a bottom layer 1243 located on the side of the BT substrate away from the LED chip. The copper foil lines 1241 form electrodes at both ends of the LED filament. The LED chip 111 is disposed on the copper foil lines 1241, and the LED chip 111 is first connected to the copper foil lines 1241 through metal wires, and then the copper foil lines 1241 are connected to the next LED chip 111 through metal wires. That is, the LED chips 111 are electrically connected to each other through metal wires and copper foil lines 1241, and the copper foil lines 1241 are used for switching to improve its reliability and prevent the performance impact caused by excessively long wires. The LED chip 111 is also connected to the electrodes (106, 108) through metal wires.

[0267] See Figure 32L The diagram shows a radial cross-section of an LED filament in one embodiment, which includes a top layer 120 and a bottom layer 1243, both of which are arc-shaped adhesive layers, and the thickness gradually decreases outward along the diameter direction.

[0268] In some embodiments of this application, a BT substrate is used as the main substrate to form a base layer 124, wherein the BT substrate 1242 can be a white high thermal conductivity substrate with a filament having a thermal conductivity ≥0.8W / (mK) and a thickness ≤0.12mm, and the wavelength range of the light emitted by the formed LED filament is 360nm~830nm.

[0269] See Figure 32M This is a schematic diagram of the axial cross-section of an LED filament in one embodiment of this application, illustrating the relationship between the layered body 1101 and other structures within the filament. The basic structure of the LED filament is the same as described above, such as the filament with conductor segment 117 and conductor 119, which will not be repeated here. Figure 32M As shown, the layered body 1101 can directly cover the upper surface of the top layer 120, or rather, cover the opposite upper surface 120a of the top layer 120, completely covering the opposite upper surface of the top layer 120 and also completely covering the conductor segment 117.

[0270] See also Figure 32N and Figure 32O The diagram shows a cross-section of the LED filament along its axial direction in one embodiment of this application. The LED filament structure is basically similar to that described above and will not be repeated here. Figure 32N As shown, the top layer 120 at least covers a portion of the conductor 119, and the conductor segment 117 is not completely covered by the top layer 120. That is, the conductor 119 is at least partially exposed in the top layer 120 or exposed in the light conversion layer 110. The top layer 120 is divided into multiple segments, and the layered body 1101 covers each segment of the top layer 120 separately, and covers at least a portion of the exposed portion 123 of the conductor 119, and at least a portion of the electrodes (106, 108).

[0271] See Figure 32O The top layer 120 includes multiple segments spaced apart from each other. The layer 1101 completely covers the top layer 120 and completely covers the exposed portion 123 of the conductor 119 facing the top layer. However, the layer 1101 does not completely fill the gaps between the mutually separated top layers 120. The LED filament has spaced grooves along the outermost surface of the top layer 120 in the outward direction, that is, along the outermost surface of the top layer 120. The grooves correspond to the conductor 119.

[0272] See Figure 32P The layered body 1101 can also completely fill the gaps formed by the division of the top layer 120 into multiple segments. The layered body 1101 completely fills the gaps between the mutually separated top layers 120. The LED filament has a flat or relatively flat surface along the direction outward from the top layer 120, that is, along the outermost surface outward from the top layer 120.

[0273] The above Figure 32N ,32O In the 32P embodiment, both the top layer 120 and the transparent layer 126 have multiple segments, which are spaced apart from each other.

[0274] See below Figure 32Q , 32R Figure 32S shows a cross-sectional view of the LED filament along the axial direction in other embodiments of this application, and... Figure 32N , 32O Corresponding to 32P, the difference is that the top layer 120 of 32Q, 32R, and 32S includes multiple segments that are spaced apart from each other, but the transparent layer 126 is a single unit, and the implementation of its layered structure 1101 is the same as described above. Figure 32N , 32O The description is the same as that in page 32, so it will not be repeated here and can be used as is. Figure 32N , 32O The description of 32P can be distinguished by its transparent layer 126.

[0275] See Figure 32T This is a schematic cross-sectional view of the LED filament along the axial direction in another embodiment of this application, which is relatively... Figure 32M In this embodiment, the other structures are the same, the difference being... Figure 32T The transparent layer 126 comprises multiple segments spaced apart from each other, and Figure 32M The transparent layer 126 is integrated into one piece.

[0276] In some embodiments, please refer to Figure 33 , Figure 33 This is a schematic diagram (a) of the cross-sectional structure of an LED filament in some embodiments according to this application. Figure 33 As shown, when a base layer 124 is present, it is first formed by coating, scraping, spraying, self-leveling, etc. Then, die bonding is performed on the surface of the base layer 124, i.e., fixing the LED chip 111. After the LED chip 111 is wire-connected, a top layer 120 with an arc-shaped surface is formed by spraying, dispensing, or other methods. The top layer 120 completely covers the chip 111 and its wires. Next, a layered structure 1101 is set on the surface of the top layer 120 along its arc and contacts the base layer 124. After curing, it is cut to form a single filament, such as... Figure 33 The diagram shown is a cross-sectional view of the operation. The diagram is a cross-sectional view of the entire sheet produced from the drawing, where the arc shape represents a raised structure.

[0277] In one embodiment, please refer to Figure 34 , Figure 34 This is a schematic diagram (II) of the cross-sectional structure of an LED filament in some embodiments according to this application. Figure 34 As shown, the cross-section of the top layer 120 can be arc-shaped, and the cross-section of the layered body 1101 is rectangular.

[0278] In one embodiment, the cross-section of the top layer 120 can be rectangular, and the cross-sectional shape of the layered body 1101 is arc-shaped.

[0279] In one embodiment, the cross-section of the top layer 120 can be rectangular, and the cross-sectional shape of the layered body 1101 is rectangular.

[0280] Preferably, the top layer 120 is arc-shaped, and the layered body 1101 is an overlapping arc shape (e.g. Figure 33 This design minimizes the use of raw materials and eliminates sharp edges, avoiding stress concentration and reducing costs. Furthermore, the arc shape of the top layer 120 and the layered body 1101 preferably matches the arc shape of the beam angle of the LED chip 111. This ensures that the light emitted from the LED chip 111, reaching the top layer 120 and the layered body 1101, travels along roughly the same path (the path of light in the top layer 120 and the layered body 1101), resulting in similar light conversion efficiency and light loss. This ensures that the light emitted from each position is essentially uniform, guaranteeing light uniformity. Additionally, the arc-shaped surface, especially the convex surface, has a light-diffusing effect, spreading the beam rather than concentrating it, resulting in a wider light emission range and a softer light emission due to the non-concentrated optical diffusion.

[0281] Please refer to Figures 35a, 35b, 35c, and 35d. Figures 35a to 35d are schematic diagrams (iii) to (vi) of the cross-sectional structure of the LED filament according to some embodiments of this application. In some embodiments, the light conversion layer 110 does not have a distinction between the top layer 120 and the bottom layer 124. The LED chip 111 is completely encapsulated in the light conversion layer 110 and is formed by molding or injection molding. As shown in Figure 35a, the cross-section of the light conversion layer 110 is circular or nearly circular, and the cross-section of the layered body 1101 is an annular (nearly annular) shape covering the light conversion layer 110. As shown in Figure 35b, the cross-section of the light conversion layer 110 is circular or nearly circular, and the cross-section of the layered body 1101 is a rectangle (ring) or nearly a rectangle (ring) shape covering the light conversion layer 110. As shown in Figure 35c, the cross-section of the light conversion layer 110 is rectangular (ring) or nearly rectangular (ring), and the cross-section of the layered body 1101 is rectangular (ring) or nearly rectangular (ring) covering the light conversion layer 110. As shown in Figure 35d, the cross-section of the light conversion layer 110 is rectangular (ring) or nearly rectangular (ring), and the cross-section of the layered body 1101 is circular or nearly circular covering the light conversion layer 110. Of course, the light conversion layer 110 and the layered body 1101 can also be other shapes. When the cross-section of the light conversion layer 110 is circular or nearly circular, it is preferable to use a ring-shaped (nearly ring-shaped) cross-section of the layered body 1101, so that its emitted light has a diffusion and softening effect, while saving materials and reducing costs. Moreover, the layered body has uniform thickness in the radial direction, and the length of the light path or the number of particles encountered (probability or quantity) are approximately the same. Its light processing, light loss, and light divergence effects are basically equivalent, and the emitted light is uniform and soft. A rectangular structure may exhibit a significant difference in light effect compared to other locations at certain angles (such as at the right angle of the cross section).

[0282] In some embodiments, the light conversion layer 110 and the layered body 1101 can be integrated into one unit, that is, aluminum oxide, silicon dioxide, magnesium oxide, titanium dioxide, graphene, phosphor, sulfate, silicate, nitride, nitrogen oxide, oxysulfate or garnet, etc., but not limited to one or more of these, can be added to the light conversion layer 110.

[0283] In some embodiments, please refer to Figure 5 , Figure 5 This is a schematic diagram (III) of the structure of an LED filament in some embodiments according to this application. When the LED chips 111 in the width direction of the LED filament 100 have only one row (e.g.) Figure 5 As shown, the LED chips 111 are arranged in the same direction. The LED filament 100 has a bendable section and a non-bendable section along its length. The total length of the bendable section is less than the total length of the non-bendable section, which allows the entire LED filament to have better support.

[0284] In some embodiments, the total length of the bendable section in the longitudinal direction of the LED filament 100 is at least 30% of the total length of the LED filament 100, so as to ensure the bendability of the LED filament 100.

[0285] In some embodiments, the total length of the bendable section in the longitudinal direction of the LED filament 100 is at least 30% and no more than 50% of the total length of the LED filament 100, thereby enabling the LED filament 100 to have both bendability and support.

[0286] In some embodiments, please refer to Figure 15 , Figure 15 This is a top view (a) of the LED filament without the top layer removed, in some embodiments according to this application, with the filament unbent. When the LED chips 111 in the width direction of the LED filament 100 have two columns, and these two columns of LED chips 111 are connected in parallel (e.g.) Figure 15 As shown), similarly, in the length direction of the LED filament 100 (as shown in the diagram), Figure 15 The LED filament 100 has bendable and non-bendable sections along the Y-axis, with the total length of the bendable sections being less than the total length of the non-bendable sections. This allows the entire LED filament 100 to have better support and flexibility.

[0287] In some embodiments, the total length of the bendable section is at least 0.001% and no more than 20% of the total length of the LED filament 100. In some embodiments, the portion of the LED filament 100 in the length direction where the LED chip 111 is disposed (i.e., attached) Figure 15 In the middle, the area between the leftmost LED chip 111 and the rightmost LED chip 111 may not have a bendable section, but it can still have a certain degree of bendability because the adjacent LED chips 111 are staggered.

[0288] In some embodiments, please refer to Figure 16 , Figure 16 This is a top view (II) of the LED filament after removing the top layer, in some embodiments according to this application, with the filament unbent. Figure 16 As shown, when the LED chips 111 in the width direction of the LED filament 100 have two columns, and these two columns of LED chips 111 are connected in series sequentially (e.g.) Figure 16 As shown, the LED filament 100 has a bendable section and a non-bendable section along its length, and the total length of the bendable section is less than the total length of the non-bendable section, thereby providing better support for the entire LED filament. In some embodiments, the total length of the bendable section along the length of the LED filament 100 accounts for at least 0.001% and no more than 30% of the total length of the LED filament 100, thereby enabling the LED filament 100 to possess both bendability and support.

[0289] by Figure 5 , Figure 15 , Figure 16 In the example embodiment, the non-bendable section is the total length of the LED filament 100 including the LED chip 111 or electrodes (106, 108) along its length direction, while the bendable section is the portion that only includes the light conversion layer 110 and / or wires (here, wires refer to wires connecting adjacent LED chips or wires connecting LED chip 111 and electrodes (106, 108)). That is, the bendable section is the portion of the LED filament 100 without LED chip 111 or electrodes (106, 108) along its length direction. Figure 5 , Figure 15 , Figure 16 It's not a restriction.

[0290] In some embodiments, the LED filament 100, whether it is provided with one or two rows of LED chips 111, has more than 0.5 LED chips 111 per unit length (per millimeter) so that a reasonable spacing can be provided between the LED chips 111 to meet the requirements of light uniformity and to prevent severe thermal effects between the LED chips 111.

[0291] In some embodiments, such as Figure 4 As shown, the LED filament 100 has a light conversion layer 110, multiple LED segments (113, 115), and two electrodes (106, 108). Each LED segment (113, 115) has at least one LED chip 111. Two adjacent LED chips 111 in the LED filament 100 are electrically connected to each other with respect to the two electrodes (106, 108), for example, through a circuit film, or as described later. Figure 5The aforementioned electrical connection can be achieved through a first wire 128 or similar means. The light conversion layer 110 includes a top layer 120 and a carrier layer 122. The carrier layer 122 includes a base layer 124 and a transparent layer 126. The base layer 124 is located between the top layer 120 and the transparent layer 126 (at least on a certain cross-section of the LED filament 100). A portion of the lower surface 124b of the base layer 124 is in contact with the transparent layer 126. The transparent layer 126 provides support for a portion of the base layer 124, thereby enhancing the strength of the base layer 124 and facilitating die bonding and wire bonding. The portion of the base layer 124 not covered by the transparent layer 126 allows some of the heat generated by the LED chip 111 to be directly dissipated through the base layer 124. In some embodiments, the transparent layer 126 includes a first transparent layer 1261 and a second transparent layer 1262, both of which extend along the length direction of the LED filament 100. In some embodiments, the light conversion layer 110 has a first end 1105 and a second end 1106 opposite to the first end 1105. In some embodiments, LED chips 111 are located between the first end 1105 and the second end 1106. If the LED chip 111 closest to the first end 1105 is denoted as LED chip n1, then the LED chips 111 from the first end 1105 to the second end 1106 are LED chips n2, n3, ... nm, where m is an integer and m≤800.

[0292] In some embodiments, such as Figure 5 As shown, the LED filament 100 has a light conversion layer 110, at least one LED segment (113, 115), electrodes (106, 108), and a conductor segment 117 for electrically connecting adjacent LED segments (113, 115). Each LED segment (113, 115) includes at least two LED chips 111, which are electrically connected to each other via a first wire 128. In this embodiment, the conductor segment 117 includes a conductor 119 connecting the LED segments (113, 115), wherein the shortest distance between two LED chips 111 located within adjacent LED segments (113, 115) is greater than the distance between two adjacent LED chips 111 within each LED segment (113, 115), and the length of the first wire 128 is less than the length of the conductor 119. This ensures that when two LED segments (113, 115) are bent, the resulting stress does not cause the conductor segment 117 to break.

[0293] In some embodiments, the light conversion layer 110 is coated on at least both sides of the LED chip 111 or the electrodes (106, 108).

[0294] In some embodiments, the light conversion layer 110 exposes a portion of the electrodes (106, 108).

[0295] Please see Figure 6 , Figure 6 This is a schematic diagram (four) illustrating the structure of an LED filament in some embodiments according to this application. Figure 6 As shown, in some embodiments, the conductor segment 117 is also located between two adjacent LED segments (113, 115), and the multiple LED chips 111 in the LED segments (113, 115) are electrically connected to each other through the first wire 128. However, Figure 6 The conductor 119 in conductor segment 117 is not in the form of a wire, but rather in the form of a sheet or film. In some embodiments, conductor 119 may be copper foil, gold foil, or other electrically conductive materials. In this embodiment, conductor 119 is attached to the surface of base layer 124 and adjacent to top layer 120, that is, it is located between base layer 124 and top layer 120. Furthermore, conductor segment 117 is electrically connected to LED segments (113, 115) via second wire 130, that is, the two LED chips 111 located in adjacent LED segments (113, 115) and having the shortest distance from conductor segment 117 are electrically connected to conductor 119 in conductor segment 117 via second wire 130. The length of conductor segment 117 is greater than the distance between adjacent LED chips 111 in LED segments (113, 115), and the length of first wire 128 is less than the length of conductor 119. This design, due to the relatively long length of conductor segment 117, ensures good bendability. Assuming the LED chip 111 is in the radial direction of the LED filament 100 (e.g., Figure 6 If the maximum thickness (in the Z-axis direction) is H, then the thickness of the electrodes (106, 108) and conductor 119 in the radial direction of the LED filament is 0.5H to 1.4H, preferably 0.5H to 0.7H. There is a height difference between the LED chip 111 and the electrodes (106, 108), and between the LED chip 111 and the conductor 119. This ensures the wire bonding process can be implemented, while also ensuring the quality of the wire bonding process (i.e., good strength), and improving product stability.

[0296] Please see Figure 7 , Figure 7 The diagram below (V) shows the structure of an LED filament in some embodiments according to this application. Figure 7As shown, the LED filament 100 has a light conversion layer 110, LED segments (113, 115), electrodes (106, 108), and a conductor segment 117 for electrically connecting two adjacent LED segments (113, 115). Each LED segment (113, 115) includes an LED chip 111. The conductor segment 117 is electrically connected to the LED segments (113, 115) via a second wire 130. Specifically, the two LED chips 111 located within adjacent LED segments (113, 115) and having the shortest distance from the conductor segment 117 are electrically connected to conductors 119 in the conductor segment 117 via the second wire 130. The LED chips 111 are electrically connected to each other via a first wire 128. The conductor segment 117 includes conductors 119 connecting the LED segments (113, 115). The conductor 119 is, for example, a conductive metal sheet or strip, such as a copper sheet or an iron sheet. The shortest distance between two LED chips 111 located in adjacent LED segments (113, 115) is greater than the distance between two adjacent LED chips 111 in LED segments (113, 115), and the length of the first wire 128 is less than the length of the conductor 119. This ensures that when the two LED segments are bent, the conductor segment 117 has a larger stress-bearing area, preventing the generated stress from causing the conductor segment 117 to break. The light conversion layer 110 covers at least both sides of the LED chip 111 or the electrodes (106, 108). The light conversion layer 110 exposes a portion of the electrodes (106, 108). The light conversion layer 110 includes a top layer 120 and a carrier layer 122. The carrier layer 122 includes a base layer 124 and a transparent layer 126. The base layer 124 is located between the top layer 120 and the transparent layer 126, and the base layer 124 and the top layer 120 cover at least both sides of the LED chip 111. The thermal conductivity of the transparent layer 126 is greater than that of the base layer 124. In some embodiments, the base layer 124 is in contact with at least one side of the LED chip 111 and one side of the conductor segment 117. In this embodiment, the LED chip 111 and the conductor 119 are located on different sides of the base layer 124.

[0297] Please refer to Figures 8 to 10 , Figure 8 The present invention provides a schematic diagram (VI) of the structure of an LED filament in some embodiments. Figure 9 The present invention provides a schematic diagram (VII) of the structure of an LED filament in some embodiments. Figure 10 This is a schematic diagram (eight) of the structure of an LED filament in some embodiments according to this application. Figures 8 to 10As shown, in some embodiments, the conductor 119 includes a covering portion 121 and an exposed portion 123. The exposed portion 123 includes a first exposed portion 1231 and a second exposed portion 1232. The portion of the top layer 120 exposing the conductor 119 is the first exposed portion 1231, and the portion of the transparent layer 126 exposing the conductor 119 is the second exposed portion 1232. In some embodiments, such as Figure 9 As shown, the exposed portion 123 only includes the first exposed portion 1231. In some embodiments, such as Figure 10 As shown, the exposed portion 123 only includes the second exposed portion 1232, which can alleviate stress concentration in the conductor 119.

[0298] Please see Figure 11 , Figure 11 This is a top view of an LED filament after the top layer has been removed, according to some embodiments of this application. In some embodiments, the LED filament 100 has a light conversion layer 110, LED segments (113, 115), electrodes (106, 108), and a conductor segment 117 for electrically connecting adjacent LED segments (113, 115). Each LED segment (113, 115) includes at least one LED chip 111. The conductor segment 117 is electrically connected to the LED segments (113, 115) via a second wire 130. Specifically, the two LED chips 111 located within adjacent LED segments (113, 115) and having the shortest distance to the conductor segment 117 are electrically connected to a conductor 119 in the conductor segment 117 via the second wire 130. The conductor segment 117 includes a conductor 119 connecting the LED segments (113, 115). The conductor 119 is, for example, a conductive metal sheet or strip, such as a copper sheet or an iron sheet. The shortest distance between two LED chips 111 located in adjacent LED segments (113, 115) is greater than the distance between two adjacent LED chips 111 in LED segments (113, 115). The LED chips 111 are electrically connected by a first wire 128, the length of which is less than the length of conductor 119. When the two LED segments (113, 115) are bent, the conductor segment 117 has a larger stress area, and the resulting stress will not cause the conductor segment 117 to break. The light conversion layer 110 covers at least two sides of the LED chips 111 or electrodes (106, 108). The light conversion layer 110 exposes a portion of the electrodes (106, 108). The light conversion layer 110 includes a top layer 120 (not shown in this figure) and a carrier layer 122. The carrier layer 122 includes a base layer 124 and a transparent layer 126. The LED chips 111 in the LED segments (113, 115) are connected along the radial direction of the LED filament 100 (e.g., ...). Figure 11 Arranged along the X-axis, each LED chip 111 in the LED segment (113, 115) is connected to conductor 119 and / or electrode (106, 108).

[0299] Please see Figures 12 to 13 , Figure 12 The present invention provides a schematic diagram (IX) of the structure of an LED filament in some embodiments. Figure 13 This is a schematic diagram (X) of the structure of an LED filament according to some embodiments of this application. In some embodiments, the LED filament 100 has a light conversion layer 110, LED segments (113, 115), and electrodes (106, 108). Each LED segment (113, 115) has at least one LED chip 111. Adjacent LED chips 111 in the LED filament 100 are electrically connected to each other, and to the electrodes (106, 108). Adjacent LED chips 111 are connected by a first conductor 128. The light conversion layer 110 covers each side of the first conductor 128, meaning the first conductor 128 is located within the light conversion layer 110, preventing breakage of the LED filament 100 due to accidental contact with instruments or workers during winding of the first conductor 128. The light conversion layer 110 encloses the LED segments (113, 115) and the electrodes (106, 108), and exposes at least a portion of two electrodes (106, 108). The light conversion layer 110 includes a top layer 120 and a carrier layer 122. The top layer 120 covers each surface of the first conductor 128, and the first conductor 128 and the carrier layer 122 have a certain spacing. The top layer 120 and the carrier layer 122 may each be a layered structure with at least one layer.

[0300] In some embodiments, phosphor layer 1201 wraps a portion of the first wire 128, phosphor film layer 1202 wraps another portion of the first wire 128, and phosphor layer 1201 and phosphor film layer 1202 together cover the first wire 128.

[0301] Please refer to 14. Figure 14 This is a schematic diagram of the LED chip bonding wire structure in some embodiments according to this application. Figure 14 As shown, in some embodiments, the quality of the bonding wire is mainly determined by... Figure 14 Points A, B, C, D, and E determine the connection. Point A is the connection between chip pad 1281 and gold ball 1282; point B is the connection between gold ball 1282 and first wire 128; point C is between the two segments of first wire 128; point D is the connection between first wire 128 and second solder joint 1283; and point E is between second solder joint 1283 and the surface of LED chip 111. Because point B is the first bend point of the first wire 128 during its trace arc, and the wire diameter of the first wire 128 is thinner at point D, the first wire 128 is prone to breakage at points B and D. Therefore, for example, in implementation... Figure 14When the LED filament 100 is bent, the force is mainly on the portion of the first conductor 128 located in the phosphor film layer 1202, while the force on the portion of the first conductor 128 located in the phosphor layer 1201 is smaller. Therefore, the thickness of the phosphor layer 1201 can be less than the thickness of the phosphor film layer 1202. The phosphor layer 1201 can cover points B and D of the first conductor 128. Due to the material properties (hardness, flexibility, or bendability) of the phosphor layer 1201, the breakage of the first conductor 128 at points B and D can be avoided.

[0302] For example Figure 12 As shown, in some embodiments, each LED chip 111 is covered with a phosphor layer 1201, and a portion of the phosphor film layer 1202 in the LED filament 100 is in direct contact with the carrier layer 122. In some embodiments, this portion is located between two adjacent LED chips 111, and the phosphor layer 1201 only covers the LED chip 111, which can achieve the above-mentioned light emission effect and reduce the production cost of LED bulbs.

[0303] For example Figure 13 As shown, the phosphor layer 1201 extends along the length of the LED filament 100. The phosphor layer 1201 can be applied to a single LED filament 100 or multiple LED filaments 100 can be coated simultaneously, resulting in a simple coating process and high production efficiency. A portion of the phosphor layer 1201 is in direct contact with the carrier layer within the LED filament. In some embodiments, this portion is located between two adjacent LED chips 111. Due to the increased area of ​​the phosphor layer 1201 (and consequently, the increased heat dissipation area), and its relatively thinness, the heat generated by the LED chip 111 is easily transferred from the phosphor layer 1201 to the phosphor film layer 1202.

[0304] The following section explains the design related to the wire bonding of LED filament chips. For example... Figure 15 As shown, in some embodiments, the LED filament 100 includes LED chip units (102, 104) and electrodes (106, 108). LED chip units 102 and 104 are electrically connected to the electrodes (106, 108), respectively. The extending direction of LED chip unit 102 is parallel to or substantially parallel to the extending direction of LED chip unit 104 (e.g., ...). Figure 15(In the Y-axis direction), LED chip unit 102 and LED chip unit 104 are connected in parallel. LED chip unit 102 and LED chip unit 104 each include a plurality of LED chips 111. The spacing between two adjacent LED chips 111 in LED chip unit 102 is equal to the spacing between two adjacent LED chips 111 in LED chip unit 104. In some embodiments, the spacing between two adjacent LED chips 111 in LED chip unit 102 may not be equal to the spacing between two adjacent LED chips 111 in LED chip unit 104. The light conversion layer 110 has a first end 1105 and a second end 1106 opposite to the first end 1105. LED chips 111 are located between the first end 1105 and the second end 1106. In LED chip unit 102, the LED chip closest to the first end is denoted as LED chip a1. Then, the LED chips 111 from the first end 1105 to the second end 1106 are sequentially named LED chips a2, a3, ..., am, where m is an integer. In LED chip unit 104, the LED chip 111 closest to the first end 1105 is denoted as LED chip b1. Then, the LED chips 111 from the first end 1105 to the second end 1106 are sequentially named LED chips b2, b3, ..., bn, where n is an integer. Along the length direction of the LED filament 100 (e.g., ...) Figure 15 In the Y-axis direction, LED chip bn is located between LED chip am and LED chip am+1 (for example, Figure 15 LED chip b1 is located between LED chip a1 and LED chip a2), and the projection of LED chip am in the width direction of the LED filament and LED chip bn in the width direction of the LED filament 100 (e.g., Figure 15 The projections on the X-axis direction do not have overlapping areas (n=m). That is, the LED chip 111 of LED chip unit 102 and the LED chip 111 in LED chip unit 104 are staggered in the length direction of LED filament 100.

[0305] In another embodiment, the projections of LED chip 111 in LED chip unit 102 and LED chip 111 in LED chip unit 104 overlap in the length direction of the LED filament. The projections of LED chip am and LED chip bn overlap in the length direction of the LED filament. Because the spacing between LED chip am and LED chip bn decreases in the width direction of the LED filament, the width of the LED filament becomes narrower, approaching the width of a traditional tungsten filament lamp, resulting in a more aesthetically pleasing LED filament winding. Specifically, LED chip am and LED chip bn each have multiple sides. In the length direction of the LED filament, one side of LED chip bn is located between the same side of LED chip am and LED chip am+1 (e.g., ...). Figure 15One side b11 of LED chip b1 is located between one side a11 of LED chip a1 and one side a21 of LED chip a2. In some embodiments, side a11 and side a21 are opposite each other. In some embodiments, in the width direction of LED filament 100 (e.g. Figure 15 Along the X-axis, the widths of LED chip am and LED chip bn are Wa and Wb, respectively, and the width W of LED filament 100 is not less than the sum of Wa and Wb, i.e., W≥Wa+Wb.

[0306] In some embodiments, such as Figure 4 As shown, the LED chip 111 has a first light-emitting surface 111c and a second light-emitting surface 111d. The first light-emitting surface 111c and the second light-emitting surface 111d are opposite each other. The light emitted from the first light-emitting surface 111c (which can refer to the side of the LED chip 111 facing the top layer 120) is directed toward the top layer 120, and the light emitted from the second light-emitting surface 111d (which can refer to the other side of the LED chip 111 facing the carrier layer) is directed toward the carrier layer 122. The luminous flux emitted from the first light-emitting surface 111c of the LED chip 111 is essentially equal to the luminous flux emitted from the LED chip 111 (the absolute value of the difference in luminous flux between the first light-emitting surface 111c and the second light-emitting surface 111d is ≤30lm). The brightness difference between the first light-emitting surface 111c and the second light-emitting surface 111d of the LED chip 111 is small. The LED filament 100 uses the above-mentioned LED chip 111. After the LED filament 100 is wound, the light emission in all directions is uniform, and the LED bulb has excellent light emission effect.

[0307] like Figure 16 As shown, the LED filament 100 includes electrodes (106, 108), LED chips 111, and a first wire 128. Multiple LED chips 111 are arranged in two rows on the LED filament 100 (i.e., adjacent LED chips 111 are positioned in the width direction of the LED filament 100). Figure 16 The LED chips 111 are arranged in an alternating manner along the X-axis direction, and these two columns of LED chips 111 are arranged along the length of the LED filament 100.

[0308] like Figure 16As shown, in this embodiment, the LED chip 111 has a length dimension wc along the length direction of the LED filament 100. The ratio of the sum of the lengths wc of all LED chips 111 (i.e., Σwc) to the length of the LED filament 100 is greater than 0.5, 0.6, 0.65, or 0.7 to ensure the arrangement density of LED chips 111 along the length direction of the LED filament 100, thereby increasing the total luminous flux and effectively reducing the graininess of the emitted light. The ratio of the sum of the lengths of the LED chips 111 to the length of the LED filament 100 is greater than 0.5, 0.6, 0.65, or 0.7.

[0309] Please see Figure 17 , Figure 17 This is a schematic diagram (I) of the LED filament in an unbent state according to some embodiments of this application. Figure 17 As shown, in some embodiments, the basic structure of the LED filament 100 can be the same as in the aforementioned embodiments. In this embodiment, at the junction of the light conversion layer 110 and the electrode 106, the light conversion layer 110 forms a junction portion 132. The junction portion 132 covers at least a portion of the electrode 106, and the junction portion 132 does not cover (or includes) the LED chip 111. Please refer to... Figure 19 and Figure 20 , Figure 19 This is a partial structural diagram of an LED filament according to some embodiments of this application (I). Figure 20 for Figure 19 A cross-sectional structural schematic diagram. In some embodiments, the electrode 106 has a second portion 1062 that is wrapped or covered by the light conversion layer 110 and a first portion 1061 exposed outside the light conversion layer 110. The area per unit length of the second portion 1062 is smaller than the area per unit length of the first portion 1061, so that the second portion 1062 has better bending performance.

[0310] The second part 1062 has an end 1063, a bent section 1064, and a connecting section 1065, which are arranged sequentially along the length of the second part 1062, and the connecting section 1065 is connected to the first part 1061. The area per unit length of the bent section 1064 is smaller than that of the end 1063 and the connecting section 1065, so that when the second part 1062 is subjected to force, the main bending portion is located in the bent section 1064.

[0311] The area per unit length of the connecting segment 1065 is larger than that of the connecting segment 1065 and the end segment 1063, respectively, so that the end of the light conversion layer 110 and the electrode 106 have a larger bonding area, thereby improving the bonding strength and preventing cracking at the bonding point between the end of the light conversion layer 110 and the electrode 106 when the LED filament 100 bends.

[0312] For example Figure 19 As shown, one or more sets of grooves 1066 are provided on one or both sides of the bending section 1064 in the width direction to reduce the area per unit length of the bending section 1064 and improve the overall bendability. In addition, by providing the grooves 1066, the material of the light conversion layer 110 can pass through the grooves 1066, so that the light conversion layers 110 on opposite sides of the electrode 106 are connected by the light conversion layer 110 material in the grooves 1066, forming an approximately riveted connection.

[0313] Please see Figure 21 , Figure 21 This is a partial structural schematic diagram (II) of an LED filament according to some embodiments of this application. Figure 21 As shown, one or more sets of holes 1067 are provided at the bending section 1064 to reduce the area per unit length of the bending section 1064. Specifically, the material of the light conversion layer 110 can pass through the holes 1067 so that the light conversion layers 110 on the front and back sides of the electrode 106 are connected through the light conversion layer 110 material in the holes 1067.

[0314] For example Figure 19 and Figure 20 As shown, a through hole 1068 can be provided at the end 1063 of the electrode 106 so that the light conversion layer 110 on the front and back sides of the electrode 106 can be connected through the light conversion layer 110 material in the through hole 1068 to form a connection method similar to riveting.

[0315] For example Figure 19 and Figure 21 As shown, the end of the electrode 106 1063 is provided with an arc surface 1069 to prevent stress concentration caused by the sharp corner formed at the end 1063, which could force the light conversion layer 110 to crack or even break. In some embodiments, the end of the end 1063 is provided with a spherical surface to achieve the same technical effect as described above.

[0316] In some embodiments, the second portion 1062 is made of a different material than the first portion 1061, thereby giving the second portion 1062 better bending properties than the first portion 1061.

[0317] Please see Figure 22 , Figure 22 This is a partial structural schematic diagram (III) of an LED filament according to some embodiments of this application. Figure 22 As shown, in some embodiments, the thickness (average thickness) of the second portion 1062 is less than the thickness (average thickness) of the first portion 1061, thereby giving the second portion 1062 better bending performance than the first portion 1061.

[0318] Please see Figure 23 , Figure 23 The diagram below (XI) shows the structure of an LED filament in some embodiments according to this application. Figure 23 As shown, in some embodiments, an LED filament 100 is provided, the basic structure of which is the same as in the aforementioned embodiments. That is, the LED filament 100 includes a light conversion layer 110, an LED chip 111, and an electrode 106. The LED chips 111 are connected to each other by a first wire 128, and the LED chips 111 and the electrodes 106 are connected by a second wire 130. The light conversion layer 110 encapsulates the LED chips 111 and at least a portion of the electrodes 106. Meanwhile, the basic structure or material composition of the light conversion layer 110 in this embodiment can also be the same as in the aforementioned embodiments.

[0319] In this embodiment, the first conductor 128 has a first portion 1284, which extends along the length of the LED filament 100. Figure 23 The X-axis direction is located between the two sets of LED chips 111 (in the projection direction of the width or thickness of the LED filament 100). Figure 23 (In the Z-axis direction), the first part 1284 is located between the edge tangents of the two sets of LED chips 111. In other words, the length of the first part 1284 is configured to be greater than the projected length of the first part 1284 in the width direction of the LED filament. This design provides the first conductor 128 with more slack when the LED filament 100 bends, thus avoiding breakage.

[0320] In some embodiments, the length of the first portion 1284 is equal to the distance D1 between the two sets of LED chips 111 (or the first portion 2284 is in the width direction of the LED filament). Figure 23 The ratio of the projected length (in the X-axis direction) to that of the projected length is greater than 1.1, 1.2, 1.3 or 1.4.

[0321] In some embodiments, the length of the first portion 1284 is equal to the distance D1 between the two sets of LED chips 111 (or the first portion 1284 is in the width direction of the LED filament 100). Figure 23 The ratio of the projected length (in the X-axis direction) to the projected length is less than 2.

[0322] In some embodiments, the first portion 1284 is configured to be arc-shaped such that its length is greater than the distance D1 between the two sets of LED chips 111 (the projected length of the first portion 1284 in the width direction of the LED filament).

[0323] Please see Figure 24 , Figure 24 The diagram (twelve) shows the structure of an LED filament in some embodiments according to this application. Figure 24As shown, in some embodiments, the first portion 1284 is configured as wavy or spiral, such that its length is greater than the distance between the two sets of LED chips 111 (the first portion 1284 is in the width direction of the LED filament (e.g., ...). Figure 24 The projected length (in the X-axis direction).

[0324] Please see Figure 26 , Figure 26 The diagram below (XIII) shows the structure of an LED filament in some embodiments according to this application. Figure 26 As shown, in some embodiments, the first portion 1284 (or the entire first conductor 128) is generally "m"-shaped when viewed from the LED filament side. This makes the first portion 1284 of the first conductor 128 longer per unit length, providing greater cushioning during bending with the LED filament to prevent the first portion 1284 from breaking.

[0325] Please refer to 41. Figure 39 , Figure 36 This is a schematic diagram (a) of an LED bulb in some embodiments according to this application. Figure 37 for Figure 36 Side view of the LED bulb. Figure 38 for Figure 36 Another side view of the LED bulb. Figure 39 for Figure 36 A top view of the LED bulb. Among them, Figures 36 to 39 The structure of the LED filament mentioned can be found in [reference]. Figures 1 to 3 The structure of the LED filament 100 in 5 types. In this embodiment, as shown... Figures 36 to 44 As shown, the LED bulb 200 includes a bulb housing 202, a bulb base 204 connected to the bulb housing 202, at least two conductive supports disposed within the bulb housing 202, a cantilever (not shown), a core post 206, and a single LED filament 100. The core post 206 includes opposing core post bottoms and core post tops. The core post bottoms are connected to the bulb base 204, and the core post tops extend into the bulb housing 202; for example, the top of the core post 206 may be located approximately at the center of the bulb housing 202. The conductive supports connect the core post 206. The LED filament 100 includes a filament body and the aforementioned electrodes (106, 108), wherein the electrodes (106, 108) are located at opposite ends of the filament body, which is the LED filament 100 excluding the electrodes (106, 108). The electrodes (106, 108) are respectively connected to the two conductive supports. One end of the cantilever is connected to the core post 206, and the other end is connected to the filament body.

[0326] In traditional light bulb manufacturing, to prevent the tungsten filament from oxidizing and breaking due to combustion in air, a glass structure with a horn-shaped core is designed and sintered to seal the opening of the glass bulb housing. A vacuum pump is then connected to the horn-shaped core to replace the air inside the bulb housing with nitrogen, preventing the tungsten filament from burning and oxidizing. Finally, the horn-shaped core is sintered to seal the opening. Therefore, the vacuum pump, through the core, can replace the air inside the bulb housing with pure nitrogen or a suitable combination of nitrogen and helium to improve the thermal conductivity of the gas inside the bulb housing and remove any water vapor hidden in the air. In one embodiment, a suitable combination of nitrogen and oxygen or nitrogen and air can also be used, with the oxygen or air content being 1-10% of the bulb housing volume, preferably 1-5%. When the substrate contains saturated hydrocarbons, during the use of the LED bulb, the saturated hydrocarbons will generate free radicals under the influence of light, heat, and stress. These free radicals or activated molecules combine with oxygen to form peroxide free radicals. Introducing oxygen into the bulb housing can improve the heat and light resistance of the saturated hydrocarbon-containing substrate.

[0327] During the manufacturing process of the LED bulb 200, to improve the refractive index of the bulb housing 202 for the light emitted by the LED filament 100, some foreign matter, such as rosin, can be attached to the inner wall of the bulb housing 202. The average thickness of the foreign matter deposit per square centimeter of the inner wall area of ​​the bulb housing 202 is 0.01 to 2 mm, preferably 0.01 to 0.5 mm. In one embodiment, the foreign matter content per square centimeter of the inner wall area of ​​the bulb housing 202 accounts for 1% to 30% of the total foreign matter content on the inner wall of the bulb housing 202, preferably 1% to 10%. The above-mentioned foreign matter content can be adjusted, for example, by vacuum drying the bulb housing 202. In another embodiment, a portion of impurities may be retained in the gas filling the lamp housing 202. The impurity content in the gas filling is 0.1% to 20% of the volume of the lamp housing 202, preferably 0.1% to 5%. The impurity content can be adjusted, for example, by vacuum drying the lamp housing 202. Because the gas filling contains a small amount of impurities, the light emitted by the LED filament 100 is emitted or refracted by the impurities, increasing the light emission angle, which is beneficial to improving the light emission effect of the LED filament 100.

[0328] The LED bulb 200 is located in a spatial coordinate system (X, Y, Z), where the Z-axis is parallel to the core column 206. The projected lengths of the LED filament 100 on the XY plane, YZ plane, and XZ plane are the first length, the second length, and the third length, respectively. In one embodiment, the ratio of the first length, the second length, and the third length is 0.8:1:0.9. In some embodiments, the ratio of the first length, the second length, and the third length is (0.5 to 0.9):1:(0.6 to 1). When the ratio of the first length, the second length, and the third length is close to 1:1:1, the LED bulb 200 has a better luminous effect and achieves omnidirectional light.

[0329] When the LED filament 100 is bent, it has at least one first bending point and at least two second bending points, with the first and second bending points spaced apart. The height of any first bending point on the Z-axis is greater than that of any second bending point. In some embodiments, the spacing between two adjacent first bending points on the Y-axis or X-axis is equal, resulting in a neat and aesthetically pleasing appearance for the LED filament 100. Figures 36 to 39 As shown, in this embodiment, the LED filament 100 has one conductor segment 117 and two LED segments (113, 115). Each pair of adjacent LED segments (113, 115) is connected via the conductor segment 117. The LED filament 100 bends at its highest point in an arc shape, meaning that the LED segments (113, 115) bend in an arc at their respective highest points, and the conductor segment 117 also bends in an arc at its lowest point. The LED filament 100 can be defined as having a segment following each bent conductor segment 117, thus forming corresponding segments for each LED segment (113, 115).

[0330] Furthermore, since the LED filament 100 uses a flexible base layer, the flexible base layer is preferably a silicone-modified polyimide resin composition, which includes silicone-modified polyimide, a thermosetting agent, heat dissipation particles, and phosphor. In this embodiment, the two LED segments 113 are bent into inverted U-shapes, and the conductor segment 117 is located between these two LED segments (113, 115), and the bending degree of the conductor segment 117 is the same as or greater than the bending degree of the LED segments (113, 115). That is, the two LED segments (113, 115) are bent into inverted U-shapes at the high point of the LED filament 100 and have a bending radius r1, and the conductor segment 117 is bent at the low point of the LED filament 100 and has a bending radius r2, where r1 is greater than r2. Through the arrangement of the conductor segment 117, the LED filament 100 can achieve a small turning radius bend within a limited space. In some embodiments, the bending points of LED segment 113 and LED segment 115 are at Figure 36 Since the LED filaments 100 are at the same height along the Z-axis, the LED bulb 200 emits light relatively uniformly due to the symmetry of the LED filaments 100. In one embodiment, the bending points of LED segments 113 and 115 are at... Figure 36The heights in the Z-axis direction differ; for example, the height of the bending point of LED segment 113 is greater than that of LED segment 115. When the LED filaments 100 are of the same length and are placed in the lamp housing in this manner, some LED filaments 100 will be more biased towards the lamp housing 202, thus improving heat dissipation. Furthermore, in the Z-axis direction, the support rod 2061 of this embodiment has a lower height than the support rod 2061 of the previous embodiment. This height of the support rod 2061 corresponds to the height of the conductor segment 117, or the support rod 2061 is approximately in contact with a portion of the conductor segment 117. For example, the lowest point of the conductor segment 117 can be connected to the top of the support rod 2061 to prevent deformation of the overall shape of the LED filaments 100. In different embodiments, the conductor segments 117 can be connected to each other through a perforation at the top of the support rod 2061, or the conductor segments 117 can be glued to the top of the support rod 2061, but are not limited to these methods. In one embodiment, the conductor segment 117 and the upright 2061 may be connected by a guide wire, for example, a guide wire is led out from the top of the upright 2061 to connect the conductor segment 117.

[0331] like Figure 37 As shown, in this embodiment, in Figure 37 In the Z-axis direction, the height of conductor segment 117 is higher than that of the two electrodes (106, 108), and the two LED segments (113, 115) extend upwards from the two electrodes (106, 108) to their highest points, then bend downwards to connect to conductor segment 117, which connects the two LED segments (113, 115). Figure 38 As shown, in this embodiment, the LED filament 100 has a V-shaped outline in the XZ plane, meaning the two LED segments 113 extend obliquely upwards and outwards, bend at their highest points, and then extend obliquely downwards and inwards to the conductor segment 117. Figure 39 As shown, in this embodiment, the LED filament 100 has an S-shaped profile in the XY plane. (As indicated...) Figure 37 and Figure 39 As shown, in this embodiment, conductor segment 117 is located between electrodes (106, 108). Figure 39 As shown, in this embodiment, on the XY plane, the bending points of LED segment 113 and LED segment 115, as well as the electrodes (106, 108), are approximately located on a circle centered on conductor segment 117 (or core post 206 or upright post 2061). For example, on the XY plane, the bending points of LED segment 113 and LED segment 115 are located on the same circle centered on core post 206 or upright post 2061. In some embodiments, on the XY plane, the bending points of LED segment 113 and LED segment 115, as well as the electrodes (106, 108), are located on the same circle centered on core post 206 or upright post 2061.

[0332] Please refer to 45. Figure 40 This is a schematic diagram (II) of an LED bulb according to some embodiments of the present application. The LED bulb 300 of this embodiment and... Figure 36 The basic structure of the LED bulb 200 is the same. The LED bulb 300 includes a bulb housing 202, a bulb head 204 connected to the bulb housing 202, at least two conductive supports disposed in the bulb housing 202, a cantilever (not shown), a core post 206 and a single LED filament 100. The difference is that the LED bulb 300 in this embodiment does not have a support post 2061. The core post 206 includes an inflation tube, through which gas is injected into the lamp housing 202. As shown in Figure 45, in the Z-axis direction, the shortest distance from the LED filament 100 (or the bending point of LED segment 113 or LED segment 115) to the lamp housing 202 is H1, and the shortest distance from the conductor segment 117 of the LED filament 100 to the core post 206 is H2. H2 is less than or equal to H1. The bending points of the LED segments (113, 115) are closer to the lamp housing 202, thus the heat dissipation path of the LED filament 100 is short, thereby improving the heat dissipation effect of the LED bulb 300. In other embodiments, H2 is greater than H1 (not shown in this figure), so the LED filament 300 is roughly located in the middle area of ​​the lamp housing, resulting in better light emission.

[0333] Please refer to Figure 41 and Figure 42 As shown, Figure 41 The present invention provides a schematic diagram of a lamp holder in some embodiments. Figure 42 for Figure 41A schematic diagram of the lamp holder in section AA. In this embodiment, the LED bulb can be any of the LED bulbs disclosed in the previous embodiments, and this LED bulb is provided with any of the LED filaments disclosed in the previous embodiments. In this embodiment, the LED bulb 200 is used as an example. The lamp holder 204 is provided with a power supply component 400 (or a driving power supply). The power supply component 400 is electrically connected to the LED filament 100 and the electrodes (106, 108) of the LED filament 100. The power supply assembly 400 includes a substrate 402. The substrate 402 has heating elements (components that generate significant heat during operation, such as integrated circuits, resistors, etc.) and heat-sensitive components (such as electrolytic capacitors). The lamp holder 204 has an inner surface and an outer surface opposite to the inner surface. The outer surface of the lamp holder 204 is away from the power supply assembly 400. The heating elements are closer to the inner surface of the lamp holder 204 than the heat-sensitive components. The heating elements have an insulating sheet 404 that contacts the inner surface of the lamp holder 204, for example, by welding or fastening. In some embodiments, the heating elements are integrally packaged into a single component with a heat sink that contacts the inner surface of the lamp holder 204. For example, the integrated circuit and rectifier bridge are packaged into a single component, and the heat sink is contacted to the inner surface of the lamp holder 204 by welding or fastening. The heat sink can be soldered to the inner surface of the lamp holder 204 as a negative electrode wire.

[0334] In some embodiments, such as Figure 42 As shown, the substrate 402 is in direct contact with the inner surface of the lamp holder 204. Compared with the substrate 402 being in indirect contact with the lamp holder 204 through adhesive, the direct contact method can improve the heat dissipation effect of the bulb while reducing the heat transfer medium.

[0335] In some embodiments, such as Figure 42 As shown, thermally conductive adhesive is applied to the heating element. For example, substrate 402 has a first surface 4021 and a second surface 4022. The second surface 4022 is away from the LED filament 100. The heating element and the heat-sensitive element are located on the first surface 4021 and the second surface 4022, respectively. Thermally conductive adhesive is applied to the first surface 4021. The heat generated by the heating element can be transferred to the lamp holder 204 through the thermally conductive adhesive, thereby improving the heat dissipation effect of the LED bulb (not shown in this figure).

[0336] In some embodiments, please refer to Figure 43 and Figure 44 , Figure 43 The following is a schematic diagram (III) of the lamp holder in some embodiments according to this application. Figure 44 for Figure 43 A schematic diagram of the lamp holder at section BB (I). (See diagram below.) Figure 43 and Figure 44As shown, in this embodiment, the LED bulb can be any of the LED bulbs disclosed in the previous embodiments, and this LED bulb is provided with any of the LED filaments disclosed in the previous embodiments. The power supply assembly can also be any of the power supply assemblies disclosed in the previous embodiments. A heat-conducting part 406 is provided on the inner surface of the lamp holder 204. The heat-conducting part 406 can be a mesh bag for accommodating the heating element or a metal part in contact with the heating element, etc. The thermal conductivity of the heat-conducting part 406 is greater than or equal to the thermal conductivity of the lamp holder 204. The heat generated by the heating element can be quickly transferred to the lamp holder 204 through the heat-conducting part 406, thereby improving the heat dissipation effect of the LED bulb (not shown in this figure).

[0337] In some embodiments, each surface of the power supply assembly 400 is covered with thermally conductive adhesive, and a portion of the thermally conductive adhesive contacts the inner surface of the lamp holder 204. For example, a flexible substrate can be used, with the entire flexible substrate inserted into the lamp holder 204, and the lamp holder 204 filled with thermally conductive adhesive. The overall coverage of the power supply assembly with thermally conductive adhesive increases the heat dissipation area, thereby greatly improving the heat dissipation effect.

[0338] In another embodiment, please refer to Figure 45 , Figure 45 for Figure 43 Schematic diagram of the lamp holder at section BB (II). (See diagram below.) Figure 45 As shown, in this embodiment, the LED bulb can be any of the LED bulbs disclosed in the previous embodiments, and this LED bulb is provided with any of the LED filaments disclosed in the previous embodiments. The power supply assembly can also be any of the power supply assemblies disclosed in the previous embodiments. The axial direction of the substrate 402 and the lamp holder 204 (see...) Figure 36 , Figure 40 , Figure 46A The core post 206 is parallel to the axial direction of the lamp holder. Since all the heating elements can be placed on the side of the substrate closest to the lamp holder, the heat generated by the heating elements can be quickly transferred to the lamp holder 204, thereby improving the heat dissipation efficiency of the power supply assembly 400. In addition, heat-sensitive and heat-resistant elements can be respectively placed on different surfaces of the substrate 402 to reduce the impact of heat generated by the heating elements on the heat-sensitive elements, thereby improving the overall reliability and lifespan of the power supply module. In one embodiment, the substrate 402 is provided with heating elements (elements that generate a lot of heat during operation, such as ICs, resistors, etc.) and heat-sensitive elements (such as electrolytic capacitors, etc.). Compared with other electronic components (such as heat-sensitive elements or other non-heat-sensitive components, such as capacitors), the heating elements are closer to the inner surface of the lamp holder 204. Therefore, compared with other electronic components, the heating elements have a shorter heat transfer distance with the lamp holder 204, which is more conducive to the heat generated by the heating elements during operation being conducted to the lamp holder 204 for heat dissipation, thereby improving the heat dissipation efficiency of the power supply assembly 400.

[0339] like Figures 40 to 45As shown, the projections of the inflation tube (not shown) and the substrate 402 on the XY plane overlap. In some embodiments, the projections of the inflation tube and the substrate 402 on the XZ and / or YZ planes are spaced apart (or do not overlap), or in the height direction of the lamp head 204 ( Figure 40 In the Z-axis direction, there is a certain distance between the inflation tube and the substrate 402, and the inflation tube and the substrate 402 do not contact each other, which increases the housing space of the power supply assembly 400 and improves the utilization rate of the substrate 402. In addition, when the substrate 402 contacts the inner surface of the lamp holder 204, a cavity is formed between the first surface 4021 of the substrate 402 and the core post 206. The heat generated by the heating element located on the first surface of the substrate 402 can be transferred through the cavity, reducing the thermal impact on the heat-sensitive elements located on the second surface, thereby improving the service life of the power supply assembly 400.

[0340] Please see Figures 46A to 49 , Figure 46A The following is a schematic diagram (iii) of an LED bulb in some embodiments according to this application. Figure 47 for Figure 46A The image shows a side view of an LED bulb. Figure 48 for Figure 46A In the middle, another view of the LED bulb. Figure 49 for Figure 46A The image shows a top view of an LED bulb. Figures 46A to 49 The LED filament 100 shown is for reference only. Figures 1 to 3 The structure of the LED filament 100 is 5. The LED bulb 500 of this embodiment and... Figure 36 The basic structure of the LED bulb 200 is the same. The LED bulb 500 includes a bulb housing 202, a bulb base 204 connected to the bulb housing 202, at least two conductive supports disposed within the bulb housing 202, at least one cantilever 205, a core post 206, and at least one LED filament 100. It should be noted that the cantilever 205... Figure 47 and Figure 48 Not shown in the figure. The core column 206 includes a pole 2061, and each cantilever 205 includes a first end and a second end opposite to each other. The first end of each cantilever 205 is connected to the pole 2061, and the second end of each cantilever 205 is connected to the LED filament 100. Figure 48 The LED bulb 500 shown is Figure 36 The difference between the LED bulb 200 shown is that: Figure 48 In the Z-axis direction, the height of the upright 2061 is greater than the distance between the bottom of the upright 2061 and the conductor segment 117. The upright 2061 includes a bottom and a top, with the bottom of the upright 2061 close to the inflation tube (not shown in this figure). Figure 49 As shown, in Figure 49In the XY plane, the central angles corresponding to the arcs containing at least two bending points of the LED filament 100 range from 170° to 220°, ensuring a suitable spacing between the bending points of the LED segments (113, 115) and guaranteeing the heat dissipation effect of the LED filament 100. At least one cantilever 205 is located at a bending point of the LED filament 100, for example, at the bending point of LED segment 113 or LED segment 115. Each cantilever 205 intersects with the LED filament 100. In the XY plane, at least two intersection points lie on a circle centered on the core post 206 (or the upright post 2061), thus ensuring a certain degree of symmetry in the LED filament 100, with approximately the same luminous flux in all directions, resulting in uniform light emission from the LED bulb 200. In some embodiments, at least one intersection point is connected to the bending point of the conductor segment 117 to form a straight line La, and the intersection point on the straight line La is connected to the electrodes (106, 108) of the LED filament 100 to form a straight line Lb. The angle α between the straight lines La and Lb is in the range of 0° < α < 90°, preferably 0° < α < 60°, so that the LED segments (113, 115) have a suitable spacing after bending, resulting in better light output and heat dissipation. The bending points of the LED segments (113, 115) have radii of curvature. For example, the bending point of LED segment 113 has a radius of curvature r3, and the bending point of LED segment 115 has a radius of curvature r4. r3 is equal to r4, resulting in uniform light output on each plane. Of course, r3 can also be set to be greater than r4 or less than r4 to meet the lighting and / or heat dissipation requirements in certain specific directions. The bending point of conductor segment 117 has a radius of curvature r5, which is less than the maximum value of r3 and r4, i.e. r5 < max(r3, r4). The LED filament 100 is less likely to break. Moreover, there is a certain gap between the LED segments (113, 115) that are closer to the core post to prevent the heat generated by the two LED segments (113, 115) from affecting each other.

[0341] Please refer to 51D, which is a perspective view of an embodiment of this application, as shown. Figure 46DAs shown, the LED bulb 500 includes a bulb housing 202, a bulb base 204 connected to the bulb housing 202, a support portion (including cantilever 205 and core post 206), at least two conductive supports 2065 and 2066 disposed within the bulb housing 202, a driving circuit 700, and a single light-emitting portion (i.e., LED filament) 100. The driving circuit 700 is electrically connected to the conductive supports 2065 and 2066 and the bulb base 204. The core post 206 also has a vertically extending pole 2061 to the center of the bulb housing 202. The pole 2061 is located on the central axis of the bulb base 204, or on the central axis of the LED bulb 500. Multiple cantilever 205s are located between the pole 2061 and the LED filament 100. These cantilever 205s support the LED filament 100 and allow the LED filament 100 to maintain a preset curve and shape. Each cantilever 205 includes a first end and a second end opposite to each other. The first end of each cantilever 205 is connected to the pole 2061, and the second end of each cantilever 205 is connected to the LED filament 100.

[0342] Generally, in an LED bulb 500, the number of cantilever 205s depends on the overall shape of the LED filament 100. That is, to maintain the shape of the flexible LED filament 100, the basic principle is that a cantilever 205 needs to be configured at each turning point of the LED filament 100. However, considering high-lumen LED filament lamp products, the overall length of the flexible LED filament 100 is relatively long. During the handling of the LED bulb 500, the filament 100 may be damaged due to shaking. Therefore, increasing the number of cantilever 205s reduces the degree of shaking of the filament 100 within the LED bulb 500, thereby reducing the probability of damage to the LED filament 100. More specifically, the aforementioned advantages can be achieved by designing the number of cantilever 205s and the number of turning points of the LED filament 100 according to the following relationship: the number of cantilever 205s in the LED bulb 500 is X, and the number of turning points formed by the LED filament 100 in the LED bulb 500 is Y, i.e.,

[0343] Y+5≥ X ≥Y+2

[0344] When the number of cantilever arms 205 is too small (i.e., less than Y+2), the reinforcement effect cannot be achieved; when the number of cantilever arms 205 is too large (i.e., greater than Y+5), it will inevitably block the light output, affecting the light output effect of the LED filament 100 when it is working, and increasing the product manufacturing cost. Therefore, designing the number of cantilever arms 205 as described above can simultaneously take into account product quality and lighting effect.

[0345] In some embodiments, please refer to Figures 40 to 44In this embodiment, the LED bulb can be any of the LED bulbs disclosed in the previous embodiments, and this LED bulb is provided with any of the LED filaments disclosed in the previous embodiments. The power supply component can also be any of the power supply components disclosed in the previous embodiments. In this embodiment, the LED filament 100 includes a top layer 120 and a carrier layer 122. When the LED filament 100 is bent, on any cross-section in the height direction of the LED filament 100, or on the cross-section of the central axis (or optical axis) of the LED chip 111, the carrier layer 122 is closer to the lamp housing 202 than the top layer 120. That is, the shortest distance from the carrier layer 122 to the lamp housing is less than the shortest distance from the top layer 120 to the lamp housing 202. In some embodiments, the LED filament 100 has a bending point (or bending area) when bent, at which the radius of curvature of the carrier layer 122 is greater than the radius of curvature of the top layer. In some embodiments, when the LED filament 100 is bent, on any cross-section of the LED filament 100 in any height direction, or on the cross-section of the central axis (or optical axis) of the LED chip 111, the top layer 120 is closer to the central axis (or core 206) of the LED bulb than the carrier layer 122, and the distance from the top layer 120 to the central axis (or core 206) of the LED bulb is less than the distance from the carrier layer to the central axis (or core 206) of the LED bulb. In some embodiments, the LED filament 100 has a bending point (or bending area) when bent, and at a bending point (or bending area), the light-emitting surface of the LED chip 111 faces the central axis (or core 206) of the LED bulb. With the above design, when any LED filament 100 in the LED bulb is bent, the wires in the LED filament 100 are subjected to small bending stress and are not prone to breakage. LED segment 113 or LED segment 115 includes a first segment and a second segment. The first segment extends upward from the electrodes (106, 108) (towards the top of the lamp housing 202) to the bending point, and the second segment extends downward from the bending point (towards the lamp holder 204) to the conductor segment 117 connecting the two LED segments (113, 115). The first segment and the second segment have a first distance and a second distance from the lamp housing 202, respectively. The first distance is smaller than the second distance. In the direction of the first distance, the base layer 124 of the LED filament is closer to the lamp housing 202, and the top layer 120 of the LED filament is farther away from the lamp housing 202. For example... Figure 47 In the LED segment 113, the first segment to the lamp housing 202 has a relative first distance D1 and a second distance D2, where the first distance D1 is smaller than the second distance D2. In the direction of the first distance D1, the base layer 124 of the LED filament is closer to the lamp housing 202, while the top layer 120 of the LED filament 100 is farther from the lamp housing 202. When the LED filament 100 is bent, the conductor in the LED filament 100 experiences less bending stress and is less prone to breakage, thus improving the production quality of the LED bulb.

[0346] Please refer to again Figures 46A to 49The lamp housing 202 is divided into an upper part and a lower part by a plane F. The lamp housing 202 has its maximum width at plane F, wherein... Figure 47 The planar shape formed by the center spacing (maximum horizontal spacing) lies on plane F. When the core column 206 intersects with plane F, the lamp housing 202 has a relative lamp housing top 2021 and lamp housing bottom 2022. The lamp housing bottom 2022 is close to the lamp head 204. The length of the LED filament 100 located between the lamp housing top 2021 and plane F (or in the height direction of the LED bulb 200, such as...) Figure 47 The distance from the highest point of the LED filament 100 to the plane F (in the Z-axis direction) is less than the length of the LED filament located between the plane F and the bottom of the lamp housing 2022 (or the distance from the lowest point of the LED filament 100 to the plane F in the height direction of the LED bulb 200). When the core post 206 intersects with the plane F, the inner diameter of the lamp housing 202 above the top of the core post 206 is small, and the volume of gas contained is small. If most of the LED filament 100 is located at the top of the core post 206, it will affect the overall heat dissipation effect of the LED filament 100, which will reduce the product quality. If the core post 206 has a certain distance from the plane F and the distance from the top of the core post 206 to the plane F is less than the height of the upright 2061 (the core post 206 includes a core post top 2062 and a core post bottom 2063, the core post bottom 2063 is connected to the lamp head 204, and the core post top 2062 extends towards the lamp housing top 2021), the length of the LED filament 100 located between the core post top 2062 and the lamp housing top 2021 (or the distance between the highest point of the LED filament 100 and the core post top 2062) is less than the length of the LED filament 100 located between the core post top 2062 and the lamp housing bottom 2022 (or the distance between the core post top 2062 and the lowest point of the LED filament 100). Most of the LED filaments 100 can be indirectly supported by the core post 206, thereby ensuring the stability of the LED filament 100 shape during the transportation of the LED bulb 200. In some embodiments, when there is a gap between the core post 206 and the plane F and the distance from the top of the core post 2062 to the plane F is greater than the height of the upright 2061, the core post 206 includes a core post top 2062 and a core post bottom 2063, the core post bottom 2063 is connected to the lamp holder 204, the core post top 2062 extends toward the top of the lamp housing 2021, and the length of the LED filament 100 located between the top of the core post 2062 and the top of the lamp housing 2021 is greater than the length of the LED filament 100 located between the top of the core post 2062 and the bottom of the lamp housing 2022. Since the gas volume contained between the top of the core post 2062 and the bottom of the lamp housing 2022 is large, and most of the LED filament 100 is located between the top of the core post 2062 and the bottom of the lamp housing 2022, it is beneficial to dissipate heat from the LED filament 100.

[0347] Please see Figure 46B and Figure 46C This is a schematic diagram of the structure of an LED bulb (without housing) with a buffer structure in some embodiments of this application. The main difference between this and other embodiments of this application is the buffer structure, while other structures can be basically the same. The LED bulb 500 (without housing) includes a lamp body 204, a core post 206 connected to the lamp holder 206, a cantilever 205, at least one LED filament 100, and at least one buffer 2064. The core column 206 includes a pole 2061, and each cantilever 205 includes a first end and a second end, the first end of each cantilever 205 being connected to the pole 2061, and the second end of each cantilever 205 being connected to the LED filament 100; it also includes a core column top 2062 and a core column bottom 2063, wherein the core column bottom 2063 is connected to the lamp body 204 and is approximately located at the center of the horizontal cross section (XY cross section) of the lamp head 204, and the core column top 2062 is connected to the pole 2061; the lamp head 204, the core column 206, and the pole 2061 may be coaxial (or approximately coaxial). In some embodiments of this application, the buffer 2064 may include a first buffer 2064' and a second buffer 2064''. The buffer 2064 has a certain deformation. In the event of vibration, it can absorb the kinetic energy generated by other connected devices during vibration (displacement) by deforming itself, thereby preventing the components in the LED bulb from being severely squeezed or collided during vibration and causing breakage or other damage.

[0348] In some embodiments of this application, one end of the LED filament 100 is connected to a first buffer 2064', and the other end of the LED filament is connected to a second buffer 2064''. The first buffer 2064'' and the second buffer 2064'' are respectively disposed at both ends of the LED filament 100, thus forming a fixed physical connection (i.e., meeting certain mechanical strength and not easily falling off) and also forming an electrically conductive connection. One end of the buffer 2064 is connected to the LED filament 100, and the other end is connected to the core post 206. The buffer 2064 and the core post 206 form a fixed physical connection and also an electrically conductive connection. In some embodiments of this application, the buffer 2064 includes a first buffer 2064' and a second buffer 2064''. One end of the first buffer 2064' is connected to the top of the core post 2062, and the other end is connected to the LED filament 100. The other end of the LED filament 100 is connected to one end of the second buffer 2064'', and the other end of the second buffer 2064'' is connected to the upright 2061. Together with the cantilever 205, the LED filament 100 is fixed. The second buffer 2064'' is arranged in the horizontal direction (XY plane), and the first buffer 2064' is arranged in the vertical direction (Z axis). In other words, the arrangement direction of the second buffer 2064'' is perpendicular to the length direction of the core post 206, and the arrangement direction of the first buffer 2064'' is parallel to the length direction of the core post 206. This configuration, combined with the bending shape of the LED filament 100, ensures that both the first buffer 2064' and the second buffer 2064'' have good deformation in the XYZ space. Of course, the angles of the first buffer 2064' and the second buffer 2064'' can also be designed according to requirements, such as tilting.

[0349] In some embodiments, the lamp holder 204, the core post 206, and the pole 2061 are fixed to each other and electrically connected. Furthermore, the buffer 2064 is made of conductive material and has electrical conductivity, connecting the LED filament 100 and the core post 206 or the pole 2061 to achieve electrical connection. In some embodiments of this application, the core post 206 has a conductive structure, such as conductive pins that can be used to connect to the buffer 2064 (or the first buffer 2064'). The pole 2061 has a conductive wire inside, with one end connected to the core post 206 or the lamp body 204, and the other end connected to the second buffer 2064'', so that at least two of the LED filament 100, buffer 2064, core post 206, pole 2061, and lamp holder 204 can form a conductive electrical circuit.

[0350] In some embodiments of this application, there are two first buffer members 2064' and one second buffer member 2064'', and the first buffer member 2064' and the second buffer member 2064'' are respectively connected to at least one LED filament. Figure 46B As shown in one embodiment of this application, the first buffer 2064' is connected to one LED filament 100, and the second buffer 2064'' is connected to two LED filaments 100. That is, the LED bulb includes at least one LED filament, or it can have two, three or other numbers.

[0351] In some other embodiments of this application, the number of first buffers 2064' can be one.

[0352] In some other embodiments of this application, the number of first buffers 2064' may be two or more.

[0353] In some other embodiments of this application, the number of second buffers 2064'' can be one.

[0354] In some other embodiments of this application, the number of second buffers 2064'' can be two or more.

[0355] In some other embodiments of this application, buffer 2064 includes only first buffer 2064'.

[0356] In some other embodiments of this application, buffer 2064 includes only the second buffer 2064''.

[0357] In some embodiments of this application, the buffer 2064 may be a spring structure with good deformation capacity, having good deformation capacity, such as tensile or compressive capacity, along both the axial and radial directions of the spring.

[0358] In some embodiments of this application, the buffer 2064 can be an adhesive material with good extensibility and resilience, such as silicone or resin, and conductive materials can be added to the adhesive material to achieve electrical conductivity.

[0359] In some other embodiments of this application, the buffer 2064 may be a suspension wire structure extending from the core post 206, such as a wavy suspension wire or a bent and extended suspension wire.

[0360] In some other embodiments of this application, the buffer 2064 may be a combination of suspension wires and adhesive material, with the adhesive material covering at least a portion of the suspension wires.

[0361] In some other embodiments of this application, the buffer 2064 may be a combination of suspension wires and adhesive material, with the adhesive material covering all the suspension wires.

[0362] In some other embodiments of this application, the buffer 2064 may be a combination of suspension wire and adhesive material, with the adhesive material covering at least a portion of the suspension wire.

[0363] In some other embodiments of this application, the buffer 2064 may be a suspension wire extending from the LED filament 100, such as a suspension wire extending directly or indirectly from the electrode of the LED filament 100.

[0364] In some other embodiments of this application, the buffer 2064 may be a combination of a spring and a rubber material, such as the rubber material wrapping at least or partially the spring, or the buffer 2064 may include a spring segment and a rubber material segment connected to each other.

[0365] In some other embodiments of this application, the buffer 2064 may also be disposed in other locations, such as one end of the buffer 2064 being directly connected to the lamp holder 204 and the other end being connected to the LED filament 100.

[0366] Please refer to Figures 50 to 58 , Figure 50 The following is a schematic diagram (four) of an LED bulb according to some embodiments of this application. Figure 51 for Figure 50 The image shows a side view of an LED bulb. Figure 52 for Figure 50 The image shows the other side view of the LED bulb. Figure 53 for Figure 50The image shows a top view of an LED bulb. In this embodiment, the LED bulb can be any of the LED bulbs disclosed in the previous embodiments, and this LED bulb contains any of the LED filaments disclosed in the previous embodiments. The power supply assembly can also be any of the power supply assemblies disclosed in the previous embodiments. In this embodiment, the LED bulb includes a bulb housing 202 and a bulb base 204 connected to the bulb housing 202. The bulb housing 202 contains multiple LED filaments C1, C2, C3, ..., Cn, where n is an integer. Each LED filament (C1, C2, C3) includes the aforementioned electrodes (106, 108) (not shown in this figure). Taking LED filament C1 as an example, after the LED filament C1 is bent, the vertical distance between the electrodes does not exceed the height of the core post 206. In some embodiments, when the LED filament C1 is not bent, it includes a first end C11 and a second end C12 opposite to each other. The first end C11 and the second end C12 are used to connect to a power supply component to supply power to the LED chip on the LED filament C1, and the length of the LED filament C1 is the distance from the first end C11 to the second end C12 (the same applies to the other LED filaments C2 and C3). When the LED filaments (C1, C2, C3) are bent, the first end and the second end of each LED filament (C1, C2, C3) are separated from each other, so that each LED filament (C1, C2, C3) is spatially distributed, for example, the first end C11 and the second end C12 of the LED filament C1 in the figure are separated from each other. In some embodiments, in the direction of the central axis of the LED bulb, the vertical distance between the first end of any LED filament (C1, C2, C3) and the first end of other LED filaments (C1, C2, C3) does not exceed 2cm, or / and the vertical distance between the second end of any LED filament (C1, C2, C3) and the second end of other LED filaments (C1, C2, C3) does not exceed 2cm. This allows the electrodes of multiple LED filaments (C1, C2, C3) to pass through (or substantially pass through) the first plane, and the electrodes of multiple LED filaments (C1, C2, C3) to pass through (or substantially pass through) the second plane. When the LED filaments (C1, C2, C3) are electrically connected, the first ends of the multiple LED filaments (C1, C2, C3) are connected together or the second ends are connected together, or the first end of one LED filament (C1, C2, C3) is connected to the second end of another LED filament. The electrical connection method is simple. Among them, the first plane is close to the top of the lamp housing 2021 and the second plane is close to the bottom of the lamp housing 2022. The first plane and the second plane are separated from each other. The first plane and the second plane are parallel to each other, or they may be at a certain angle to each other.

[0367] Each LED filament (C1, C2, C3) is spirally distributed, and each LED filament (C1, C2, C3) extends spirally around an axis (e.g., the central axis of the LED bulb). The second end of each LED filament (C1, C2, C3) rotates at an angle greater than 270 degrees relative to its first end around the central axis of the LED bulb (when the LED filaments (C1, C2, C3) are projected onto a plane along the central axis of the LED bulb, the central angle occupied by the LED filaments (C1, C2, C3) on that plane is greater than 270 degrees). Preferably, at least two LED filaments (e.g., LED filament C1 and LED filament C2) have axes that coincide, i.e., they all rotate around the same axis, or the axes of at least two LED filaments (e.g., LED filament C1 and LED filament C2) are parallel to each other or at an angle. The LED filaments (C1, C2, C3) extend around the axis in a smooth curve between the first and second ends, or in a zigzag line between the first and second ends. For example, the LED filament C1 extends in a smooth curve between the first end C11 and the second end C12 around an axis, or extends in a zigzag line between the first end C11 and the second end C12. In some embodiments, the axis around which the LED filaments (C1, C2, C3) are wound is parallel to the core post 206, or the LED filaments (C1, C2, C3) extend in a rotating manner around the core post 206.

[0368] At least one point on LED filament C1 has a distance from the core post 206 equal to or approximately equal to the distance from a point on LED filament Cn (n≠1) to the core post 206. In some embodiments, in the height direction of the LED bulb, LED filaments C1, C2, C3, ..., Cn are sequentially adjacent, and the distance between LED filament C1 and LED filament C2 is equal to or approximately equal to the distance between LED filament Cn and LED filament Cn+1 (n≥2). In the xy plane, the electrodes and / or electrodes of LED filaments C1, C2, C3, ..., Cn are located on a circle centered on the core post 206 (or the support rod 2061). On the XZ or YZ plane, the projections of LED filaments C1, C2, C3...Cn intersect each other, and the projection of a portion of LED filament Cn intersects with the projection of LED filament Cn+1 (n≥1). In some embodiments, on the XZ or YZ plane, the projection of one of the LED filaments intersects with the projections of the other LED filaments. For example, an LED bulb includes four LED filaments (C1, C2, C3, C4), and on the XZ or YZ plane, the projection of LED filament C2 intersects with the projections of LED filaments C1, C3, and C4. Of course, in other embodiments, the projection of LED filament C2 may intersect with the projections of at least two of LED filaments C1, C3, and C4.

[0369] Please refer to Figure 54 , 60 , Figure 54 This is a schematic diagram (III) of the structure of an LED filament in an unbent state according to some embodiments of this application. Figure 55 for Figure 54 A schematic diagram of an LED bulb with an LED filament. In this embodiment, the LED bulb can be any of the LED bulbs disclosed in the previous embodiments, and this LED bulb contains any of the LED filaments disclosed in the previous embodiments. The power supply component can also be any of the power supply components disclosed in the previous embodiments. Figure 54 and Figure 55As shown, a fixing part 203 is provided inside the lamp housing 202. The power module (not shown in this figure) is connected to the fixing part 203. The fixing part 203 has a first opening 2031. The filament body of each LED filament 100 is located in the first opening 2031. A part of the electrode 106 or electrode 108 of each LED filament 100 is connected to the fixing part 203 to fix the position of the LED filament 100. Specifically, the fixing part 203 has a first connecting part 2032 and a second connecting part 2033, the electrode 106 is connected to the first connecting part 2032, and the electrode 504 is connected to the second connecting part 2033. The first connecting part 2032 has a first end 2034 and a second end 2035, and the second connecting part 2033 has a third end 2036 and a fourth end 2037. Compared to the second end 2035, the first end 2034 of the first connecting part 2032 is closer to the third end 2036 of the second connecting part 2033. When the fixing part 203 is curled, the first end 2034 of the first connecting part 2032 moves closer to the second end 2035 of the first connecting part 2032, and the third end 2036 of the second connecting part 2033 moves closer to the fourth end 2037 of the second connecting part 2033. That is, the first connecting part 2032 and the second connecting part 2033 are curled in the same direction, and the LED filament 100 is in a straight strip shape. In some embodiments, when the fixing part 203 is curled, the first end 2034 of the first connecting part 2032 moves closer to the second end 2035 of the first connecting part 2032, and the fourth end 2037 of the second connecting part 2033 moves closer to the third end 2036 of the second connecting part 2033. That is, the first connecting part 2032 and the second connecting part 2033 are curled in opposite directions, and the LED filament 100 is in a bent shape. After the fixing part 203 is curled, the power module is electrically connected to the first connecting part 2032 and the second connecting part 2033 respectively. A carrier 201 is also provided inside the lamp housing 202. After the fixing part 203 is curled, the LED filament 100 is attached to the carrier 201. The carrier 201 is made of a material with a light transmittance of at least 70%. The material of the carrier 201 can be glass or the like, to reduce the absorption of light emitted by the LED filament 100 by the carrier 201. In other embodiments, the carrier 201 may be cylindrical, and the LED filament 100 may be fixed to the carrier 201 by means of adhesive or other methods.

[0370] Please refer to Figures 56 to 57 , Figure 56 This is a schematic diagram (V) of an LED bulb in some embodiments of this application. Figure 57 for Figure 56 An enlarged schematic diagram of part 62 is shown. In this embodiment, the LED bulb can be any of the LED bulbs disclosed in the previous embodiments, and this LED bulb is provided with any of the LED filaments disclosed in the previous embodiments. The power supply component can also be any of the power supply components disclosed in the previous embodiments. Figure 56 and Figure 57 As shown, a support unit 207 is provided on the core column 206. The support unit 207 is perpendicular to the core column 206 (or the central axis of the LED bulb). The support unit 207 extends along the central axis of the LED bulb toward the top of the lamp housing 202. The support unit 207 is provided with multiple support parts 2071. The support parts 2071 are provided with a second opening 2072. The height of the LED filament 100 is less than the width of the LED filament 100. The LED filament 100 can first enter the support part 2071 at an angle through the second opening 2072. Since the minimum distance of the second opening 2072 is greater than the width of the LED filament 100, it can prevent the LED filament 100 from coming out of the support part 2071, thereby fixing the shape of the LED filament 100.

[0371] Please refer to Figures 58 to 61 . Figure 58 The present invention provides a circuit diagram of a first constant current circuit in some embodiments. Figure 59 The present invention provides a circuit diagram of a second constant current circuit in some embodiments. Figure 60 The circuit diagram of a third constant current circuit is shown in some embodiments of this application. Figure 61 This is a circuit block diagram of an LED bulb according to some embodiments of this application. Following the general convention of circuit diagrams, optional parameters for each component are indicated in the diagram, in international standard units. In the following description, for brevity, the first resistor R1 will be referred to as R1, and the other components similarly. Furthermore, in this embodiment, the LED bulb can be any of the LED bulbs disclosed in the previous embodiments, and this LED bulb is provided with any of the LED filaments disclosed in the previous embodiments.

[0372] like Figure 58 In the circuit shown, after power-on, the voltage at point A is the voltage division of R4 across R3 and R4. Therefore, the current between the drain and source of the main switching element M1 (hereinafter referred to as M1) rises, making Vbe sufficiently large to turn on the secondary switching element Q1 (hereinafter referred to as Q1), thus pulling down the voltage at point A. This causes the current between the drain and source of M1 to decrease. Since R1 is very small, Vbe cannot reach the turn-on voltage of Q1, so Q1 turns off. When Q1 turns off, the voltage at point A returns to the voltage division of R4 across R3 and R4, causing the current between the drain and source of M1 to rise again. This process repeats until M1 remains on, and the current IR1 flowing through R1 remains approximately equal to the ratio of Vbe to R1. It can be seen that this achieves a constant current across the load D5.

[0373] like Figure 59 The structure of the circuit shown is similar to Figure 58 They are basically the same, the difference lies in Figure 59It includes a resistor PTC (hereinafter referred to as PTC), which can be a positive temperature coefficient thermistor. Figure 59 The diagram shows the voltage at some points and the current in some branches. The current flowing through resistor PTC is IPTC = (Vin - Vbe) / PTC. Since the current at the base of Q1 is almost zero, the current through PTC is IPTC = IR2, and IR2 = (Vbe - VB) / R2, where VB represents the voltage at point B. Therefore, we have (Vin - Vbe) / PTC = (Vbe - VB) / R2, where PTC represents the resistance of PTC. Transforming this equation, we get VB = Vbe - (Vin - Vbe)R2 / PTC. Figure 59 We know that VB = ID5 × R1, therefore ID5 × R1 = Vbe - (Vin - Vbe)R2 / PTC, thus obtaining Formula 1:

[0374] ID5=Vbe / R1-[(Vin-Vbe)×R2] / (PTC×R1).

[0375] As shown in Equation 1, the load current ID5 is also affected by the resistance of the PTC. Due to the physical properties of the transistor, its base voltage Vbe decreases as the temperature rises. Equation 1 shows that a decrease in Vbe will decrease ID5, meaning the load current will decrease, affecting the illumination of the LED bridge bulb (or the applied lighting fixture). On the other hand, the PTC increases with rising temperature. Equation 1 shows that an increase in PTC will also increase the current ID5, thus helping to offset the fluctuations in load current caused by the decrease in Vbe.

[0376] According to Formula 1, replacing the PTC resistor with a negative temperature coefficient thermistor will increase ID5 as the temperature decreases, thus achieving low-temperature protection for the LED bridge bulb (or the applied lighting fixture). Furthermore, Formula 1 also shows that resistor R1 directly affects ID5, meaning R1 directly affects the brightness of the LED bridge bulb. Therefore, with a constant power supply voltage, the load current can be set by selecting the value of R1.

[0377] according to Figure 58 and Figure 59 In the circuit shown, M1 acts as the main switching element (e.g., a metal field-effect transistor), and its current is affected by the negative feedback loop consisting of R1, R2, and Q1. Q1 acts as the secondary switching element, and is turned on or off under the action of the current of M1, ultimately maintaining the conduction current of M1 at a fixed level, thereby realizing a constant current circuit for the load. Figure 58 and Figure 59 This is just one example; other circuit topologies are also possible.

[0378] like Figure 60In the circuit shown, with the preferred embodiment of adding resistor PTC1 (hereinafter referred to as PTC1, where PTC1 can also be an NTC resistor), similar to the previous analysis, after power-on, the conduction current of M1 increases, causing Q3 to conduct. The conduction of Q3 then causes the conduction current of M1 to decrease, thus creating a similar situation to... Figure 58 and Figure 59 The negative feedback in the circuit keeps M1 in a constant on-current state, thus keeping the current flowing through the load LD1 constant.

[0379] In some embodiments, M1 and Q1 can also employ other types of switching devices. Besides using a DC voltage source, the power supply can also be a rectifier circuit, thereby converting the external AC input (usually mains power) into DC. Furthermore, a capacitor can be connected in parallel with the fourth resistor R4, so that the voltage at point A gradually increases upon power-up, achieving a delayed power-on function.

[0380] In some embodiments, a constant current circuit is achieved by using a main switching element and a negative feedback circuit to ensure that the current flowing through the main switching element is constant. This method requires only a few discrete components to implement a constant current circuit and does not involve electromagnetic compatibility issues. In specific circuit structures, PTC or NTC circuits can also be used to improve temperature drift. When this constant current circuit is applied to lighting fixtures, it occupies a small size and provides stable light emission.

[0381] In some embodiments, such as Figure 61 As shown, the LED bulb includes a constant current driving circuit 700, a shunt circuit 800, and an LED filament 100. The constant current driving circuit 700 is a constant current source, providing a constant current. The LED filament 100 includes LED chip units (102, 104). The LED chip units (102, 104) are electrically connected to the shunt circuit 800. The shunt circuit 800 receives the constant current from the constant current driving circuit 700 and distributes the current to the LED chip units 102 and 104. In this embodiment, the LED chip units (102, 104) can be a single LED chip or multiple LED chips connected in series.

[0382] In some embodiments, LED chip unit 102 and LED chip unit 104 are configured with different color temperatures. The brightness of LED chip unit 102 and LED chip unit 104 can be adjusted by adjusting the current flowing through LED chip unit 102 and LED chip unit 104. The color temperature can be adjusted by adjusting the brightness ratio of LED chip unit 102 and LED chip unit 104.

[0383] In some embodiments, LED chip unit 102 and LED chip unit 104 are configured to different colors.

[0384] In some embodiments, LED chip unit 102 and LED chip unit 104 contain different numbers of light-emitting diodes.

[0385] With the configuration described in the above embodiments, only one constant current drive circuit is needed to control at least two LED components, enabling the adjustment of color temperature or color. In particular, even when the number of light-emitting diodes in the LED components differs, current adjustment for each LED component can still be achieved.

[0386] Reference Figure 62 , Figure 62 This is a schematic diagram of the circuit structure of an LED bulb according to some embodiments of this application (I). In this embodiment, the LED bulb can be any of the LED bulbs disclosed in the previous embodiments, and this LED bulb is provided with any of the LED filaments disclosed in the previous embodiments. In this embodiment, the circuit of the LED bulb includes LED chip units (102, 104). The constant current drive circuit 700 includes a constant current source A1. The shunt circuit 800 includes Q1, R1, and R2. The anode of LED chip unit 102 is electrically connected to the anode of LED chip unit 104 and electrically connected to the first output terminal of constant current source A1. The cathode of LED chip unit 102 is electrically connected to the collector of Q1, the emitter of Q1 is electrically connected to a common ground terminal, the base of Q1 is electrically connected to the first pin of R2, and the second pin of R2 is electrically connected to the first pin of R1 and the cathode of LED chip unit 104. The second pin of R1 is electrically connected to a common ground terminal. The second output terminal of constant current source A1 is electrically connected to a common ground terminal.

[0387] In this embodiment, LED chip unit 102 and LED chip unit 104 include one light-emitting diode or multiple light-emitting diodes connected in series (i.e., LED chip 111 in the aforementioned embodiment).

[0388] The operating principle of the current shunt circuit 800 is explained below. In this embodiment, the constant current source A1 provides a constant current I1. After being shunt by the current shunt circuit 800, the current flowing through LED chip unit 102 is ID1, and the current flowing through LED chip unit 104 is ID2. The current flowing through resistor R1 is IR1, and the current flowing through resistor R2 is IR2. The voltage at the base of Q1 is Vbe, and the current at the emitter of Q1 is IQ1. These currents satisfy the following relationship:

[0389] I1 = ID1 + ID2

[0390] ID2 = IR1 + IR2

[0391] IQ1 = ID1 + IR2

[0392] In this embodiment, since the current of IR2 is small, it can be ignored.

[0393] ID2 ≈ IR1

[0394] IQ1 ≈ ID1

[0395] IR1 ≈ Vbe / R1

[0396] When ID2 tends to increase, VR1 and IR2 increase. According to the amplification principle of a transistor, ID1 increases because the sum of ID1 and ID2 equals a constant value I1. When ID1 increases, ID2 decreases. Therefore, when ID2 tends to increase, the shunt circuit 800 adjusts to suppress this increasing trend, causing ID2 to tend towards a stable value. Similarly, when ID2 tends to decrease, VR1 and IR2 decrease. According to the amplification principle of a transistor, ID1 decreases because ID1 + ID2 = I1. Therefore, when ID1 decreases, ID2 increases. Thus, when ID2 tends to decrease, the shunt circuit 800 adjusts to suppress this decreasing trend, causing ID2 to tend towards a stable value.

[0397] ID2 ≈ Vbe / R1

[0398] ID1 = I1 – ID2

[0399] In this embodiment, Vbe is a constant value, approximately 0.7V. The magnitudes of currents ID1 and ID2 can be adjusted by changing the value of resistor R1, thereby achieving the purpose of adjusting the brightness of LED chip unit 102 and LED chip unit 104.

[0400] In some embodiments, the number of LED chips included in LED chip unit 102 is less than or equal to the number of LED chips included in LED chip unit 104.

[0401] In some embodiments, LED chip unit 102 and LED chip unit 104 are configured to have different colors or color temperatures.

[0402] In some embodiments, the secondary switching element Q1 can be replaced by a field-effect transistor without affecting the technical effect to be achieved in this application.

[0403] Please refer to Figure 63 , Figure 63 This is a schematic diagram (II) of the circuit structure of an LED bulb according to some embodiments of this application. In this embodiment, the LED bulb can be any of the LED bulbs disclosed in the previous embodiments, and this LED bulb is provided with any of the LED filaments disclosed in the previous embodiments. Furthermore, the circuit structure of the LED bulb in this embodiment is similar to... Figure 62Similar to the previous embodiment, except that the LED bulb circuit in this embodiment further includes an LED chip unit 103, wherein the current flowing through the LED chip unit 103 is ID3. The shunt circuit 800 further includes a transistor Q2 and resistors R3 and R4. The anode of the LED chip unit 102 is electrically connected to the anodes of the LED chip unit 104 and the LED chip unit 103, and is also electrically connected to the first output terminal of the constant current source A1. The cathode of the LED chip unit 102 is electrically connected to the collector of Q1. The emitter of Q1 is electrically connected to the second pin of resistor R1, and its base is electrically connected to the first pin of resistor R2. The second pin of resistor R2 is electrically connected to the cathode of the LED chip unit 104 and the first pin of resistor R1. The collector of transistor Q2 is electrically connected to the second pin of resistor R1, its emitter is electrically connected to the common ground terminal, and its base is electrically connected to the first pin of resistor R4. The second pin of resistor R4 is electrically connected to the cathode of the LED chip unit 103 and the first pin of resistor R3. The second pin of resistor R3 is electrically connected to the common ground terminal. The second output terminal of constant current source A1 is electrically connected to the common ground terminal.

[0404] In this embodiment, the principle of the shunt circuit regulating the current of the three LED chip units (102, 103, 104) is the same as... Figure 62 The embodiments described above are similar. In this embodiment, the current relationship satisfies the following equation:

[0405] I1 = ID1 + ID2 + ID3

[0406] ID3 ≈ IR3

[0407] ID2 ≈ IR1

[0408] ID1 ≈ IQ1

[0409] In this embodiment, IR2 and IR4 can be ignored.

[0410] so:

[0411] ID3 ≈ Vbe / R3

[0412] ID2 ≈ Vbe / R1

[0413] ID1 = I1 – ID2 – ID3

[0414] In this embodiment, Vbe is a fixed value, approximately 0.7V. By adjusting the resistance values ​​of R1 and R3, the currents ID1, ID2, and ID3 can be adjusted, thereby regulating the brightness of the LED chip units (102, 103, 104).

[0415] In this embodiment, the number of diodes included in LED chip unit 102 is less than or equal to the number of LED chips included in LED chip unit 104. The number of LED chips included in LED chip unit 104 is less than or equal to the number of LED chips included in LED chip unit 103.

[0416] In some embodiments, the LED chip units (102, 103, 104) are configured with different colors or color temperatures.

[0417] In some embodiments, Q1 and Q2 can be replaced by field-effect transistors without affecting the technical effect to be achieved in this application.

[0418] With the configuration described in the above embodiments, only one constant current drive circuit is needed to control three LED chip units, enabling the adjustment of color temperature or color. In particular, even when the number of LED chips in an LED chip unit varies, current adjustment can still be achieved for each LED chip unit.

[0419] Please see Figure 64 , Figure 64 According to this application, in some embodiments, the circuit structure diagram of the LED bulb is shown in (III). The circuit structure of the LED bulb in this embodiment is similar to... Figure 62 The embodiments described above are similar, except that the shunt circuit 800 in this embodiment uses a PNP transistor, while Figure 62 The transistor used in the described embodiment is an NPN transistor. In this embodiment, the constant current drive circuit 700 includes a constant current source A1, the LED filament 100 includes LED chip unit 102 and LED chip unit 104, and the shunt circuit 800 includes Q1 and resistors R1 and R2. The emitter of Q1 is electrically connected to the first pin of R1 and the first output terminal of the constant current source A1, its collector is electrically connected to the anode of LED chip unit 102, and its base is electrically connected to the first pin of R2. The second pin of R2 is electrically connected to the second pin of R1 and the anode of LED chip unit 104. The cathodes of LED chip unit 102 and LED chip unit 104 are electrically connected and electrically connected to a common ground terminal. The second output terminal of the constant current source A1 is electrically connected to a common ground terminal.

[0420] The operating principle of the shunt circuit 800 in this embodiment is... Figure 62 , Figure 63 The embodiments described above are similar and will not be repeated here. In this embodiment, the current of IR2 is small and can be ignored. Its current satisfies the following relationship:

[0421] ID2 ≈ Vbe / R1

[0422] ID1 = I1 – ID2

[0423] The values ​​of currents ID1 and ID2 can be adjusted by adjusting the value of resistor R1, thereby adjusting the brightness of LED chip unit 102 and LED chip unit 104.

[0424] In some embodiments, the number of LED chips included in LED chip unit 102 is less than or equal to the number of LED chips included in LED chip unit 104.

[0425] In some embodiments, the LED chip units (102, 104) are configured with different colors or color temperatures, while the LED filaments can achieve dimming and color adjustment.

[0426] In some embodiments, Q1 can be replaced by a field-effect transistor without affecting the technical effect to be achieved in this application.

[0427] With the configuration described in the above embodiments, only one constant current drive circuit is needed to control two LED chip units, enabling the adjustment of color temperature or color. In particular, even when the number of LED chips in an LED chip unit differs, current adjustment for each LED chip unit can still be achieved.

[0428] Through the above embodiments, those skilled in the art can reasonably expand upon the methods to adjust the current distribution of multi-channel LED chip units, and are not limited to two or three channels.

[0429] The “one LED filament” or “one LED filament” referred to in this application refers to a structure consisting of the aforementioned conductor segment and LED segment connected together, or consisting only of LED segment (or LED chip unit), having the same and continuous light conversion layer (including the same and continuously formed top or bottom layer), and having two electrodes electrically connected to the bulb conductive support only at both ends. A structure that conforms to the above description is the single LED filament structure referred to in this application.

[0430] This application has been disclosed above with reference to preferred embodiments. However, those skilled in the art should understand that these embodiments are merely illustrative of some implementations of this application and should not be construed as limiting. It should be noted that any equivalent variations and substitutions to these embodiments, or reasonable combinations between embodiments (especially the combination of the aforementioned LED filament embodiments with the aforementioned LED bulb embodiments), should be considered within the scope supported by this application's specification. Therefore, the scope of protection of this application should be determined by the scope defined in the appended claims.

Claims

1. An LED filament, the LED filament comprising an LED chip, a light conversion layer, and two electrodes, characterized in that: The light conversion layer covers the LED chip and at least part of the two electrodes; The light conversion layer has a layered structure on its outer surface, which covers the light conversion layer and at least a portion of the electrode. The light conversion layer includes a top layer and a base layer, and the layered structure includes an upper layer and a lower layer. The lower layer, the base layer, the top layer, and the upper layer are stacked sequentially. The light conversion layer also includes a plurality of first wires, which connect the two electrodes to the LED chip and the LED chips to each other. The LED chip includes a plurality of first LED chips and a plurality of second LED chips, which are connected in series between the two electrodes. The two electrodes, the plurality of first LED chips, and the plurality of second LED chips form a conductive path in the top layer and the base layer.

2. The LED filament according to claim 1, characterized in that: The first LED chip in the top layer and the second LED chip in the base layer are arranged alternately.

3. The LED filament according to claim 2, characterized in that: Each first LED chip includes a first electrical connection portion and a second electrical connection portion, and each second LED chip includes a third electrical connection portion and a fourth electrical connection portion, wherein the first electrical connection portion, the second electrical connection portion, the third electrical connection portion and the fourth electrical connection portion all face the upper layer.

4. The LED filament according to claim 3, characterized in that: The first electrical connection portion of the first LED chip is connected to the fourth electrical connection portion of the adjacent second LED chip via the first wire, and the second electrical connection portion of the first LED chip is connected to the third electrical connection portion of another adjacent second LED chip via the first wire.

5. The LED filament according to claim 4, characterized in that: The first LED chip and / or the second LED chip adjacent to the two electrodes are connected to the two electrodes via the first wire.

6. The LED filament according to claim 5, characterized in that: The thickness of the layered body is less than or equal to the thickness of the light conversion layer.

7. The LED filament according to claim 6, characterized in that: The thickness of the layered structure is less than or equal to the thickness of the top layer.

8. The LED filament according to claim 7, characterized in that: The first conductor is located in the top layer.

9. An LED filament, the LED filament comprising an LED chip, a light conversion layer, and two electrodes, characterized in that: The light conversion layer covers the LED chip and at least part of the two electrodes; A layered structure is disposed on the outer surface of the light conversion layer, the layered structure covering the light conversion layer and at least a portion of the electrode; the light conversion layer includes a top layer and a base layer, the layered structure includes an upper layer and a lower layer, the lower layer, the base layer, the top layer and the upper layer are stacked sequentially; the top layer is disposed of a plurality of first LED chips, the base layer is disposed of a plurality of second LED chips, the first LED chips in the top layer and the adjacent second LED chips in the base layer at least partially overlap, the first LED chips and the adjacent second LED chips are directly conductive, the plurality of first LED chips and the plurality of second LED chips are connected in series between the two electrodes, the two electrodes, the plurality of first LED chips and the plurality of second LED chips form a conductive path in the top layer and the base layer.

10. The LED filament according to claim 9, characterized in that: Each first LED chip includes a first electrical connection portion and a second electrical connection portion, and each second LED chip includes a third electrical connection portion and a fourth electrical connection portion, wherein the first electrical connection portion, the second electrical connection portion, the third electrical connection portion and the fourth electrical connection portion all face the upper layer.

11. The LED filament according to claim 10, characterized in that: The first LED chip and the adjacent second LED chip are connected by a first electrical connection portion of the first LED chip to a fourth electrical connection portion of the adjacent second LED chip, or by a third connection portion of the second LED chip to a second electrical connection portion of the first LED chip.

12. The LED filament according to claim 11, characterized in that: The first LED chip and / or the second LED chip adjacent to the two electrodes are connected to the two electrodes via a first wire.

13. The LED filament according to claim 12, characterized in that: The fourth electrical connection portion of the second LED chip is connected to the first electrical connection portion of the first LED chip, and the second electrical connection portion of the first LED chip is connected to the third electrical connection portion of the second LED chip via conductive silver paste or solder paste.

14. The LED filament according to claim 13, characterized in that: The top layer and the bottom layer form a current path through the first LED chip and the second LED chip.

15. The LED filament according to claim 14, characterized in that: The thickness of the layered structure is less than or equal to the thickness of the top layer.

16. An LED filament bulb, characterized in that, include: The lamp holder, the lamp housing connected to the lamp holder, at least two conductive supports, a cantilever, a core post and at least one LED filament disposed within the lamp housing, the LED filament including an LED chip, a light conversion layer and two electrodes; The light conversion layer has a layered structure on its outer surface, which covers the light conversion layer and at least a portion of the electrode. The light conversion layer includes a top layer and a base layer, and the layered structure includes an upper layer and a lower layer. The lower layer, the base layer, the top layer, and the upper layer are stacked sequentially. The light conversion layer also includes a plurality of first wires, which connect the two electrodes to the LED chip and the LED chips to each other. The LED chip includes a plurality of first LED chips and a plurality of second LED chips, which are connected in series between the two electrodes. The two electrodes, the plurality of first LED chips, and the plurality of second LED chips form a conductive path in the top layer and the base layer.

17. The LED filament bulb according to claim 16, characterized in that: The first LED chip in the top layer and the second LED chip in the base layer are arranged alternately.

18. The LED filament bulb according to claim 17, characterized in that: Each first LED chip includes a first electrical connection portion and a second electrical connection portion, and each second LED chip includes a third electrical connection portion and a fourth electrical connection portion, wherein the first electrical connection portion, the second electrical connection portion, the third electrical connection portion and the fourth electrical connection portion all face the upper layer.

19. The LED filament bulb according to claim 18, characterized in that: The first electrical connection portion of the first LED chip is connected to the fourth electrical connection portion of the adjacent second LED chip via the first wire, and the second electrical connection portion of the first LED chip is connected to the third electrical connection portion of another adjacent second LED chip via the first wire.

20. The LED filament bulb according to claim 19, characterized in that: The first LED chip and / or the second LED chip adjacent to the two electrodes are connected to the two electrodes via the first wire.

21. The LED filament bulb according to claim 20, characterized in that: The thickness of the layered body is less than or equal to the thickness of the light conversion layer.

22. The LED filament bulb according to claim 21, characterized in that: The thickness of the layered structure is less than or equal to the thickness of the top layer.

23. The LED filament bulb according to claim 22, characterized in that: The first conductor is located in the top layer.

24. An LED filament bulb, characterized in that, include: The lamp holder, the lamp housing connected to the lamp holder, at least two conductive supports, a cantilever, a core post and at least one LED filament disposed within the lamp housing, the LED filament including an LED chip, a light conversion layer and two electrodes; A layered structure is disposed on the outer surface of the light conversion layer, the layered structure covering the light conversion layer and at least a portion of the electrode; the light conversion layer includes a top layer and a base layer, the layered structure includes an upper layer and a lower layer, the lower layer, the base layer, the top layer and the upper layer are stacked sequentially; the top layer is disposed of a plurality of first LED chips, the base layer is disposed of a plurality of second LED chips, the first LED chips in the top layer and the adjacent second LED chips in the base layer at least partially overlap, the first LED chips and the adjacent second LED chips are directly conductive, the plurality of first LED chips and the plurality of second LED chips are connected in series between the two electrodes, the two electrodes, the plurality of first LED chips and the plurality of second LED chips form a conductive path in the top layer and the base layer.

25. The LED filament bulb according to claim 24, characterized in that: Each first LED chip includes a first electrical connection portion and a second electrical connection portion, and each second LED chip includes a third electrical connection portion and a fourth electrical connection portion, wherein the first electrical connection portion, the second electrical connection portion, the third electrical connection portion and the fourth electrical connection portion all face the upper layer.

26. The LED filament bulb according to claim 25, characterized in that: The first LED chip and the adjacent second LED chip are connected by a first electrical connection portion of the first LED chip to a fourth electrical connection portion of the adjacent second LED chip, or by a third connection portion of the second LED chip to a first electrical connection portion of the first LED chip.

27. The LED filament bulb according to claim 26, characterized in that: The first LED chip and / or the second LED chip adjacent to the two electrodes are connected to the two electrodes via a first wire.

28. The LED filament bulb according to claim 27, characterized in that: The fourth electrical connection portion of the second LED chip is connected to the first electrical connection portion of the first LED chip, and the second electrical connection portion of the first LED chip is connected to the third electrical connection portion of the second LED chip via conductive silver paste or solder paste.

29. The LED filament bulb according to claim 28, characterized in that: The top layer and the bottom layer form a current path through the first LED chip and the second LED chip.

30. The LED filament bulb according to claim 29, characterized in that: The thickness of the layered structure is less than or equal to the thickness of the top layer.

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