High frequency circuit board plating fixture

Abstract

The utility model discloses a kind of high-frequency circuit board electroplating clamps, belong to circuit board processing technical field, and its technical scheme main points include electroplating bath body, clamping mechanism is welded on the both sides of the electroplating bath body, drying mechanism is welded on the rear side of the electroplating bath body, the drying mechanism includes fixed plate, air outlet pipe, temperature sensor, installation shell, mounting plate, several semiconductor heating plates, five air ducts, electric blower fan and air inlet, drying mechanism integrated semiconductor heating plate, electric blower fan and air duct, can rapidly blow hot air after circuit board electroplating is completed, timely remove surface residual electrolyte and moisture, this process can effectively avoid the oxidation of plating layer, rust caused by long-time adhesion of electrolyte, simultaneously prevent moisture from penetrating into sensitive base material such as PTFE, ceramic of high-frequency circuit board, protect the dielectric property of base material, ensure the stability of high-frequency signal transmission, the linkage of temperature sensor and PLC controller can monitor the hot air temperature of air outlet pipe in real time.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, and in particular to a high-frequency circuit board electroplating fixture. Background Technology

[0002] High-frequency circuit board electroplating fixtures are tools used to fix high-frequency circuit boards, enabling them to be accurately positioned during the electroplating process and ensuring uniform current distribution, thereby achieving high-quality electroplating.

[0003] To address the aforementioned issues, existing patents have provided solutions. However, existing electroplating fixtures lack a structure for rapid drying after electroplating, which necessitates transporting the high-frequency circuit board to a drying device before drying, thereby increasing the connection time between production processes and transportation costs.

[0004] To address this, a high-frequency circuit board electroplating fixture is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a high-frequency circuit board electroplating fixture that can solve the problem that existing circuit board processing lacks a structure for rapid drying after electroplating, which leads to the need to transport the high-frequency circuit board to a drying device for drying, thereby increasing the connection time of production processes and transportation costs.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a high-frequency circuit board electroplating fixture, comprising an electroplating tank body, clamping mechanisms welded to both sides of the electroplating tank body, and a drying mechanism welded to the rear side of the electroplating tank body. The drying mechanism includes a fixing plate, an air outlet pipe, a temperature sensor, a mounting shell, a mounting plate, several semiconductor heating plates, five air ducts, an electric blower, and an air inlet. The fixing plate is welded to the rear side of the electroplating tank body, the air outlet pipe is installed inside the fixing plate, the temperature sensor is installed on the front side of the top of the air outlet pipe, and the output end of the bottom of the temperature sensor extends through and to the inner side of the air outlet pipe. The mounting shell is welded to the rear side of the air outlet pipe, the mounting plate is welded to the inner side of the mounting shell, the semiconductor heating plate is installed on the top of the mounting plate, the air duct is installed on the rear side of the mounting shell, the electric blower is installed inside the air duct, and the air inlet is located at the bottom of the mounting shell.

[0007] Preferably, the clamping mechanism includes a limiting plate, a lead screw, a limiting rod, a servo motor, a PLC controller, a lifting plate, and several clamping plates, with the limiting plate welded to both sides of the electroplating tank body.

[0008] Preferably, the lead screw is rotatably connected to the inner side of the left limiting plate, the limiting rod is welded to the inner side of the right limiting plate, and the servo motor is installed on the top of the left limiting plate.

[0009] Preferably, the top of the lead screw is connected to a connecting shaft via a flat key, the output end of the servo motor at the bottom passes through the limiting plate and is fixedly connected to the top of the connecting shaft, the PLC controller is installed on the front side of the electroplating tank body, the left side of the lifting plate is threaded to the surface of the lead screw, the right side of the lifting plate is slidably connected to the surface of the limiting rod, and the clamping plate is installed at the bottom of the lifting plate.

[0010] Preferably, the top of the mounting shell is provided with a plurality of heat dissipation holes, and a filter screen is movably connected to the inner side of the heat dissipation holes.

[0011] Preferably, a dust filter is movably connected to the rear side of the inner side of the air duct, and the front side of the air duct is tapered.

[0012] Preferably, reinforcing rods are welded to both sides of the mounting shell, and a reinforcing ring is welded to the side of the reinforcing rod closest to the fixing plate.

[0013] Preferably, the PLC controller is electrically connected to the temperature sensor, servo motor, semiconductor heating plate and electric fan respectively.

[0014] Compared with the prior art, the beneficial effects of this utility model are: 1. The clamping mechanism of this application uses a lead screw, a limit rod, and a servo motor to lift the lifting plate. Combined with several clamping plates at the bottom, it can stably clamp high-frequency circuit boards of different specifications. The lead screw drive avoids displacement or deformation of the circuit board due to liquid impact or vibration during electroplating, ensuring consistent plating thickness. It is especially suitable for the stringent structural precision requirements of high-frequency circuit boards. The clamping mechanism is electrically connected to a PLC controller, which can control the lifting rhythm of the servo motor to achieve automatic clamping, immersion in electroplating solution, and removal of circuit boards through program control. This reduces manual intervention and errors, and can also form a continuous process with the subsequent drying process, shortening the processing time of a single batch of products and meeting the needs of mass production. 2. The drying mechanism of this application integrates a semiconductor heating plate, an electric fan, and an air duct. It can quickly blow out hot air after the circuit board electroplating is completed, and promptly remove residual electrolyte and moisture from the surface. This process can effectively avoid oxidation and corrosion of the plating layer caused by prolonged electrolyte adhesion, while preventing moisture from penetrating into the sensitive substrates of the high-frequency circuit board, such as PTFE and ceramics, protecting the dielectric properties of the substrate, and ensuring the stability of high-frequency signal transmission. The linkage between the temperature sensor and the PLC controller can monitor the hot air temperature of the air duct in real time, and control the temperature by adjusting the power of the semiconductor heating plate. This can meet the needs of rapid drying, and avoid deformation of flexible substrates or damage to plating performance due to excessive temperature, thus improving the adaptability of the equipment to different types of high-frequency circuit boards. Attached Figure Description

[0015] Figure 1 This is an overall structural diagram of the high-frequency circuit board electroplating fixture of this utility model; Figure 2 This is a schematic diagram of the structure of the fixing plate of this utility model; Figure 3 This is a schematic diagram of the structure of the mounting shell of this utility model; Figure 4 This is a schematic diagram of the structure of the air guide duct of this utility model; Figure 5 This is a schematic diagram of the clamping mechanism of this utility model.

[0016] In the diagram, 1. Electroplating tank body; 2. Clamping mechanism; 21. Limiting plate; 22. Lead screw; 23. Limiting rod; 24. Servo motor; 25. PLC controller; 26. Lifting plate; 27. Clamping plate; 3. Drying mechanism; 31. Fixing plate; 32. Air outlet duct; 33. Temperature sensor; 34. Mounting shell; 35. Mounting plate; 36. Semiconductor heating plate; 37. Air duct; 38. Electric blower fan; 39. Air inlet; 4. Heat dissipation hole; 5. Filter screen; 6. Dustproof filter screen; 7. Reinforcing rod; 8. Reinforcing ring. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figure 1-5 The present invention provides the following technical solution: A high-frequency circuit board electroplating fixture includes an electroplating tank body 1, clamping mechanisms 2 welded to both sides of the electroplating tank body 1, and a drying mechanism 3 welded to the rear side of the electroplating tank body 1. The drying mechanism 3 includes a fixing plate 31, an air outlet duct 32, a temperature sensor 33, a mounting shell 34, a mounting plate 35, several semiconductor heating plates 36, five air ducts 37, an electric blower fan 38, and an air inlet 39. The fixing plate 31 is welded to the rear side of the electroplating tank body 1, and the air outlet duct 32 is mounted on the fixing plate 31. Inside the air outlet duct 32, a temperature sensor 33 is installed on the front side of the top of the air outlet duct 32. The output end of the temperature sensor 33 extends through and into the inside of the air outlet duct 32. The mounting shell 34 is welded to the rear side of the air outlet duct 32. The mounting plate 35 is welded to the inside of the mounting shell 34. The semiconductor heating plate 36 is installed on the top of the mounting plate 35. The air duct 37 is installed on the rear side of the mounting shell 34. The electric fan 38 is installed inside the air duct 37. The air inlet 39 is opened at the bottom of the mounting shell 34.

[0019] In this embodiment: the electroplating tank body 1 provides a stable space for the electroplating process, capable of holding the electroplating solution. Simultaneously, it supports and limits the clamping mechanism 2 and the drying mechanism 3. The fixing plate 31 supports and limits the air outlet duct 32. The air outlet duct 32, as a channel for hot air output, accurately guides the heated air to the electroplated circuit board, concentrating the hot air on the areas requiring drying, thus improving drying efficiency. The temperature sensor 33 monitors the temperature of the hot air output from the air outlet duct 32 in real time and transmits the temperature information to the PLC controller 25 for easy control of the drying temperature. The mounting shell 34 provides protection for components such as the semiconductor heating plate 36 and the electric fan 38. The mounting space and mounting plate 35 can support and limit the semiconductor heating plate 36. The semiconductor heating plate 36 can quickly generate heat to provide the heat source required for drying. The air duct 37 can evenly guide the air generated by the electric blower 38 to the semiconductor heating plate 36 for heating, and then deliver the heated air to the air outlet duct 32, which plays the role of guiding airflow and distributing air volume to ensure stable output of hot air. The electric blower 38 provides power for the airflow, draws in external air and delivers it to the semiconductor heating plate 36 through the air duct 37. After being heated, it forms hot air. The air inlet 39 ensures smooth airflow circulation, so that the heated air can continuously act on the circuit board and improve drying efficiency.

[0020] Specifically, such as Figure 5 As shown, the clamping mechanism 2 includes a limiting plate 21, a lead screw 22, a limiting rod 23, a servo motor 24, a PLC controller 25, a lifting plate 26, and several clamping plates 27. The limiting plate 21 is welded to both sides of the electroplating tank body 1.

[0021] Specifically, such as Figure 5 As shown, the lead screw 22 is rotatably connected to the inner side of the left limiting plate 21, the limiting rod 23 is welded to the inner side of the right limiting plate 21, and the servo motor 24 is installed on the top of the left limiting plate 21.

[0022] Specifically, such as Figure 5 As shown, the top of the lead screw 22 is connected to a connecting shaft via a flat key. The output end of the servo motor 24 at the bottom passes through the limit plate 21 and is fixedly connected to the top of the connecting shaft. The PLC controller 25 is installed on the front side of the electroplating tank body 1. The left side of the lifting plate 26 is threadedly connected to the surface of the lead screw 22, and the right side of the lifting plate 26 is slidably connected to the surface of the limit rod 23. The clamping plate 27 is installed at the bottom of the lifting plate 26.

[0023] In this embodiment: the limiting plate 21 supports and fixes the lead screw 22, the limiting rod 23, and the servo motor 24. The lead screw 22 rotates under the drive of the servo motor 24, and drives the lifting plate 26 to move up and down through the threaded transmission, thereby adjusting the height of the circuit board. This facilitates the accurate placement of the circuit board into the electroplating bath for electroplating or removal for drying. The limiting rod 23 cooperates with the lead screw 22 to limit and guide the movement of the lifting plate 26, preventing the lifting plate 26 from rotating or deviating during movement. The servo motor 24 provides power for the rotation of the lead screw 22. The PLC controller 25 can receive the signal from the temperature sensor 33 and control the operation of the servo motor 24, the semiconductor heating plate 36, and the electric fan 38 according to the preset program. The lifting plate 26 moves up and down under the action of the lead screw 22 and the limiting rod 23, driving the circuit board on the clamping plate 27 to adjust its position. The clamping plate 27 directly contacts the circuit board, fixing the circuit board through clamping force, and driving the circuit board to be electroplated or dried.

[0024] Specifically, such as Figure 3 As shown, the top of the mounting shell 34 has several heat dissipation holes 4, and a filter screen 5 is movably connected to the inside of the heat dissipation holes 4.

[0025] Specifically, such as Figure 4 As shown, a dust filter 6 is movably connected to the rear side of the inner side of the air duct 37, and the front side of the air duct 37 is designed to be tapered.

[0026] In this embodiment: by setting heat dissipation holes 4, excess heat generated by the semiconductor heating plate 36 inside the mounting shell 34 during operation can be dissipated in a timely manner. By setting filter screen 5, dust and impurities in the air can be effectively filtered to prevent them from entering the mounting shell 34 through heat dissipation holes 4. Dust filter screen 6 can filter the air entering the air duct 37, blocking dust, particulate matter and other impurities in the air from entering the drying mechanism 3. By setting the front of the air duct 37 to be tapered, the airflow gradually contracts during the outgoing process, increasing the wind speed and air pressure at the air outlet, allowing hot air to be delivered more concentratedly to the air outlet duct 32, thereby enhancing the drying effect on the circuit board.

[0027] Specifically, such as Figure 4 As shown, reinforcing rods 7 are welded to both sides of the mounting shell 34, and a reinforcing ring 8 is welded to the side of the reinforcing rod 7 closest to the fixing plate 31.

[0028] Specifically, such as Figure 5 As shown, the PLC controller 25 is electrically connected to the temperature sensor 33, the servo motor 24, the semiconductor heating plate 36, and the electric fan 38.

[0029] In this embodiment: by setting the reinforcing rod 7, the connection strength between the mounting shell 34 and the fixing plate 31 is enhanced; by setting the reinforcing ring 8, the connection between the reinforcing rod 7 and the fixing plate 31 is strengthened, making the force transmission more uniform.

[0030] Working principle: First, the operator clamps the high-frequency circuit board to be electroplated onto the clamping plate 27. At this time, the PLC controller 25 is in an initial standby state, waiting to receive work instructions. Then, the operator issues a start command through the PLC controller 25, and the servo motor 24 starts working. The output end of the servo motor 24 drives the lead screw 22 to rotate through the connecting shaft. Since the left side of the lifting plate 26 is threadedly connected to the lead screw 22 and the right side is slidably connected to the limit rod 23, the rotation of the lead screw 22 is converted into the downward movement of the lifting plate 26, thereby driving the clamping plate 27 upward. The circuit board is gradually immersed in the electroplating solution in the electroplating tank body 1 for electroplating. Then, after the circuit board is electroplated, the operator controls the servo motor 24 to reverse through the PLC controller 25. The lead screw 22 drives the lifting plate 26 and the circuit board to move upward, detaching them from the electroplating solution and moving them to the front of the air outlet duct 32. At the same time, the operator starts the semiconductor heating plate 36 and the electric fan 38 through the PLC controller 25. The electric fan 38 draws in air from the outside through the air duct 37. The drawn-in air first passes through the dust filter 6 to remove dust and impurities. The filtered air flows to the semiconductor heating plate 36 under the guidance of the air duct 37. Because the front of the air duct 37 is tapered, the airflow contracts here, increasing wind speed and air pressure, allowing the air to contact the semiconductor heating plate 36 more efficiently and be heated. Afterward, the heated air is directionally blown onto the electroplated circuit board through the air outlet duct 32 for drying. The temperature sensor 33 monitors the temperature of the hot air in the air outlet duct 32 in real time and transmits the temperature information to the PLC controller 25. If the temperature is too high or too low, the PLC controller 25 adjusts the semiconductor heating plate accordingly. The heating power of the hot plate 36 and the wind speed of the electric fan 38 ensure that the drying temperature is within a suitable range. During the drying process, the heat dissipation holes 4 on the top of the mounting shell 34 will dissipate excess heat to prevent the temperature from being too high and affecting the performance of the components. Finally, after the circuit board is dried, the operator controls the semiconductor heating plate 36 and the electric fan 38 to turn off through the PLC controller 25, and controls the servo motor 24 to run again to move the lifting plate 26 and the processed circuit board to the initial position. The operator removes the circuit board, and the entire electroplating and drying process is completed.

[0031] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-frequency circuit board electroplating fixture, comprising an electroplating tank body (1), characterized in that: Clamping mechanisms (2) are welded to both sides of the electroplating tank body (1), and a drying mechanism (3) is welded to the rear side of the electroplating tank body (1). The drying mechanism (3) includes a fixing plate (31), an air outlet pipe (32), a temperature sensor (33), a mounting shell (34), a mounting plate (35), several semiconductor heating plates (36), five air ducts (37), an electric blower (38), and an air inlet (39). The fixing plate (31) is welded to the rear side of the electroplating tank body (1), and the air outlet pipe (32) is installed inside the fixing plate (31). (33) is installed on the front side of the top of the air outlet pipe (32). The output end of the temperature sensor (33) at the bottom extends through and to the inside of the air outlet pipe (32). The mounting shell (34) is welded to the rear side of the air outlet pipe (32). The mounting plate (35) is welded to the inside of the mounting shell (34). The semiconductor heating plate (36) is installed on the top of the mounting plate (35). The air duct (37) is installed on the rear side of the mounting shell (34). The electric blower (38) is installed on the inside of the air duct (37). The air inlet (39) is opened at the bottom of the mounting shell (34).

2. The high-frequency circuit board electroplating fixture according to claim 1, characterized in that: The clamping mechanism (2) includes a limiting plate (21), a lead screw (22), a limiting rod (23), a servo motor (24), a PLC controller (25), a lifting plate (26), and several clamping plates (27). The limiting plate (21) is welded to both sides of the electroplating tank body (1).

3. The high-frequency circuit board electroplating fixture according to claim 2, characterized in that: The lead screw (22) is rotatably connected to the inner side of the left limiting plate (21), the limiting rod (23) is welded to the inner side of the right limiting plate (21), and the servo motor (24) is installed on the top of the left limiting plate (21).

4. A high-frequency circuit board electroplating fixture according to claim 2, characterized in that: The top of the lead screw (22) is connected to a connecting shaft via a flat key. The output end of the servo motor (24) at the bottom passes through the limiting plate (21) and is fixedly connected to the top of the connecting shaft. The PLC controller (25) is installed on the front side of the electroplating tank body (1). The left side of the lifting plate (26) is threaded to the surface of the lead screw (22). The right side of the lifting plate (26) is slidably connected to the surface of the limiting rod (23). The clamping plate (27) is installed at the bottom of the lifting plate (26).

5. A high-frequency circuit board electroplating fixture according to claim 1, characterized in that: The top of the mounting shell (34) is provided with several heat dissipation holes (4), and a filter screen (5) is movably connected to the inside of the heat dissipation holes (4).

6. The high-frequency circuit board electroplating fixture according to claim 1, characterized in that: A dust filter (6) is movably connected to the rear side of the inner side of the air duct (37), and the front side of the air duct (37) is designed to be tapered.

7. A high-frequency circuit board electroplating fixture according to claim 1, characterized in that: Both sides of the mounting shell (34) are welded with reinforcing rods (7), and a reinforcing ring (8) is welded to the side of the reinforcing rod (7) near the fixing plate (31).

8. A high-frequency circuit board electroplating fixture according to claim 2, characterized in that: The PLC controller (25) is electrically connected to the temperature sensor (33), the servo motor (24), the semiconductor heating plate (36), and the electric fan (38).

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