Air-cooled and water-cooled integrated system condensing device

Abstract

The utility model discloses air -cooled water -cooled integrated system condensing device relates to radiator technical field, and the utility model discloses including loading board, the upper portion of loading board is equipped with condensing mechanism, is used for the quick cooling of equipment, and condensing mechanism includes: refrigeration subassembly includes the circulating pump fixed mounting in loading board top one side, and the bottom one side mounting of loading board has cold water row, and cold water drain pipe output and input all with the cooling water output and input of circulating pump interconnect, the circulation of cooling liquid between cold water row and radiating fin is driven through circulating pump, directly absorbs equipment heat, and through the cooperation of semiconductor refrigeration piece and centrifugal fan, and semiconductor refrigeration piece is actively refrigerated to its lower part air, and centrifugal fan then will produce cold air forcedly and blow to radiating fin, can high -efficiently and quickly cool the cooling liquid, has improved the heat dissipation efficiency and cooling speed of whole equipment significantly, has guaranteed the stability of high -power equipment operation.

Description

Technical Field

[0001] This utility model relates to the field of radiator technology, specifically to a condenser device for an integrated air-cooled and water-cooled system. Background Technology

[0002] In fields such as industrial equipment, electronic instruments, and precision machinery, core components (such as chips, power modules, and CPUs) continuously generate heat during equipment operation. If the heat cannot be dissipated in time, the equipment temperature will rise, leading to performance degradation, decreased operational stability, and even a shortened service life.

[0003] Reference patent document: Patent Publication No. CN207281691U, Patent Publication Date 2018, discloses an integrated air-cooled and water-cooled device, relating to the field of heat sinks; it includes an air-cooling unit and a water-cooling unit. The air-cooling unit includes a heat-conducting plate, a fixing frame disposed on one side of the heat-conducting plate, heat dissipation fins, and a set of cooling fans. The heat dissipation fins are fixed between the heat-conducting plate and the fixing frame, and a heat transfer chamber connected to the water-cooling unit is provided between the heat-conducting plate and the heat dissipation fins; a set of cooling fans is fixed on the outside of the fixing frame; the water-cooling unit includes a heat-absorbing head, a heat dissipation radiator, and a connecting water channel disposed between the heat-absorbing head and the heat dissipation radiator; the heat-absorbing head is installed in the heat transfer chamber. Through the combination of air cooling and water cooling, the structure is simple and compact, improving the heat dissipation effect; combining the air-cooling and water-cooling parts together makes installation convenient and improves heat dissipation performance; reduces noise and can operate in a quiet environment; and prevents coolant in the connecting water channel from leaking out of the interface and burning out electronic components through a leak-proof joint.

[0004] Based on the search of patent numbers and the shortcomings of existing technologies, the following was found:

[0005] Currently, common traditional heat dissipation methods are mainly divided into two categories: air cooling and water cooling. Air cooling devices have simple structures and low costs, but their heat dissipation efficiency is significantly affected by ambient temperature. They are difficult to meet heat dissipation requirements in high-temperature environments or under high-load conditions. Water cooling devices absorb heat through coolant circulation, and their heat dissipation efficiency is higher than that of air cooling. However, traditional water cooling systems rely solely on natural heat dissipation from the cooling water radiator or a single fan for auxiliary heat dissipation. The cooling rate of the coolant is limited, and when the heat generated by the equipment increases sharply, it is easy to cause poor heat dissipation efficiency. While some existing systems have introduced integrated water and air cooling devices, most of them are still significantly affected by ambient temperature.

[0006] Therefore, this utility model provides a condensation device for an integrated air-cooled and water-cooled system. Utility Model Content

[0007] In order to solve the problem that traditional air-cooling and water-cooling heat dissipation methods and their combined structures are significantly limited by ambient temperature, the purpose of this utility model is to provide a condensation device for an integrated air-cooling and water-cooling system.

[0008] To achieve the above objectives, this utility model provides the following technical solution: a condensing device for an integrated air-cooled and water-cooled system, comprising a loading plate, wherein a condensing mechanism is provided on the upper part of the loading plate for rapid cooling of the equipment, the condensing mechanism comprising:

[0009] The refrigeration assembly includes a circulating pump fixedly installed on one side of the top of the loading plate, a cold water drain installed on one side of the bottom of the loading plate, and the output and input ends of the cold water drain pipe connected to the cooling water output and input ends of the circulating pump. A heat dissipation fin is fixedly installed on the other side of the top of the loading plate, a circulating pipe is fixedly installed in the middle of the heat dissipation fin, the two ends of the circulating pipe are respectively installed on the cooling water output and input ends of one side of the circulating pump, a centrifugal fan is fixedly installed in the middle of the top of the heat dissipation fin, a frame is fixedly installed on the top of the centrifugal fan, and a semiconductor refrigeration chip is provided in the middle of the frame.

[0010] The dehumidification components are located on both sides of the frame to keep the air entering the cooling side of the thermoelectric cooler dry.

[0011] Preferably, the dehumidification assembly includes two vent boxes fixedly installed on the top of the heat dissipation fins, each vent box having a conveying pipe fixedly installed at the middle of its top, the other end of the conveying pipe fixedly installed on the upper side of one side of the frame, and a heating plate fixedly installed on one side of each vent box.

[0012] Preferably, the bottom end of the loading plate is fixedly installed with two symmetrically distributed mounting seats, and the upper part of each mounting seat is provided with multiple symmetrically distributed mounting holes.

[0013] Preferably, a fixing plate is fixedly installed in the middle of the frame, and the semiconductor cooling chip is fixedly installed in the middle of the fixing plate.

[0014] Preferably, an axial fan is fixedly installed at the top of the frame, and the axial fan is used to dissipate heat from the semiconductor cooling chip.

[0015] Preferably, a valve body is fixedly installed on the middle of one side of each of the two conveying pipes to regulate the airflow of the drying air through the conveying pipes.

[0016] Beneficial effects

[0017] This utility model provides a condenser device for an integrated air-cooled and water-cooled system. Compared with the prior art, it has the following advantages:

[0018] 1. This application uses a circulating pump to drive the coolant to circulate between the cooling water outlet and the heat dissipation fins, directly absorbing heat from the equipment. The semiconductor cooling chip and centrifugal fan work together to actively cool the air below the cooling water outlet, while the centrifugal fan forces the generated cold air towards the heat dissipation fins. This can efficiently and quickly cool the coolant, significantly improving the overall heat dissipation efficiency and cooling speed of the equipment, and ensuring the stable operation of high-power equipment.

[0019] 2. This application utilizes the negative pressure generated by the operation of a centrifugal fan to draw outside air into a breathable box filled with color-changing silica gel desiccant for dehumidification, producing dry air with a low dew point before delivering it to the cooling chip environment. This reduces air humidity and ensures that the semiconductor cooler does not crystallize under high-efficiency operation. At the same time, by switching between the dual-box body and valve body in conjunction with the heating plate, the drying, regeneration, and recycling of the desiccant are realized, thereby continuously preventing semiconductor crystallization and improving the reliability and service life of the equipment. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of this utility model.

[0021] Figure 2 This is a schematic diagram of the circulating pump structure of this utility model.

[0022] Figure 3 This is a schematic diagram of the heat dissipation fin structure of this utility model.

[0023] Figure 4 This is a schematic diagram of the dehumidification component after disassembly in this utility model.

[0024] In the diagram: 1. Loading plate; 2. Condensation mechanism; 21. Refrigeration component; 211. Circulation pump; 212. Cold water drain; 213. Mounting base; 214. Circulation pipe; 215. Heat dissipation fins; 216. Centrifugal fan; 217. Frame; 218. Semiconductor refrigeration chip; 2181. Fixing plate; 219. Axial flow fan; 22. Dehumidification component; 221. Vent box; 222. Heating plate; 223. Delivery pipe; 224. Valve body. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Please see Figure 1-4This utility model provides a technical solution: a condensing device for an integrated air-cooled and water-cooled system, including a loading plate 1, which is made of aluminum alloy with a thickness of 5-8mm. A condensing mechanism 2 is provided on the upper part of the loading plate 1 for rapid cooling of the equipment. The condensing mechanism 2 includes:

[0027] The refrigeration assembly 21 includes a circulation pump 211 fixedly installed on one side of the top of the loading plate 1. A cooling water drain 212 is installed on one side of the bottom of the loading plate 1. The cooling water drain 212 adopts a combination structure of copper flat tube and aluminum heat dissipation fins. The water outlet and inlet of the cooling water drain 212 are connected to the cooling water outlet and inlet of the circulation pump 211. A heat dissipation fin 215 is fixedly installed on the other side of the top of the loading plate 1. A circulation pipe 214 is fixedly installed in the middle of the heat dissipation fin 215. The circulation pipe 214 is made of φ8mm copper tube and is connected to the heat dissipation fin 215 by brazing. The two ends of the circulation pipe 214 are respectively installed on the cooling water outlet and inlet of one side of the circulation pump 211. A centrifugal fan is fixedly installed in the middle of the top of the heat dissipation fin 215. The centrifugal fan 216 has a frame 217 fixedly installed at its top. A thermoelectric cooler 218 is located in the middle of the frame 217. The thermoelectric cooler 218 is a TEC1-12706 model with a working voltage of 12V and a maximum cooling capacity of 60W. When cooling, the circulating pump 211 and the thermoelectric cooler 218 are started, so that the coolant flows in the cold water drain 212, which carries away the heat generated by the equipment in contact with it. The cool water containing heat is transferred to the heat dissipation fins 215 through the circulation of the circulating pump 211 and the circulation pipe 214. The lower part of the thermoelectric cooler 218 cools the air around it. The centrifugal fan 216 blows the cold air toward the heat dissipation fins 215, thereby cooling them.

[0028] The dehumidification components 22 are disposed on both sides of the frame 217 to keep the air entering the cooling side of the semiconductor refrigeration chip 218 in a dry state.

[0029] The dehumidification assembly 22 includes two vent boxes 221 fixedly installed on the top of the heat dissipation fins 215. The vent boxes 221 are made of high-temperature resistant transparent boxes and are filled with color-changing silica gel desiccant, with a filling amount of 200-300g. Ventilation holes are provided near the heating plate 222 and on its front and rear sides to allow air to enter. Users can identify the moisture level of the desiccant by the color change. When the color darkens, it can be observed whether the heating plate 222 is activated, so as to monitor the operation of the equipment at all times. A conveying pipe 223 is fixedly installed in the middle of the top of each of the two vent boxes 221. The other end of the conveying pipe 223 is fixedly installed on the upper side of one side of the frame 217. A heating plate 222 is fixedly installed on one side of each of the two vent boxes 221. The heating plate 222 uses PTC ceramic heating elements with a rated power of 50-80W and a surface temperature that can be controlled at 50-60℃.

[0030] Two symmetrically distributed mounting bases 213 are fixedly installed at the bottom of the loading plate 1. The upper part of each mounting base 213 is provided with multiple symmetrically distributed mounting holes. The device can be installed on the equipment that needs heat dissipation and cooling by the cooperation of the internal hex bolts and the mounting holes.

[0031] A fixing plate 2181 is fixedly installed in the middle of the frame 217. The thermoelectric cooler 218 is fixedly installed in the middle of the fixing plate 2181. The connection between the fixing plate 2181 and the thermoelectric cooler 218 is sealed, so that the upper heating area and the lower cooling area of ​​the thermoelectric cooler 218 are isolated from each other, ensuring the cooling effect while preventing humid air from entering the lower part.

[0032] An axial fan 219 is fixedly installed at the top of the frame 217. The axial fan 219 is used to dissipate heat from the thermoelectric cooler 218, so that the thermoelectric cooler 218 can always operate efficiently.

[0033] A valve body 224 is fixedly installed on the middle of one side of each of the two conveying pipes 223. It is used to regulate the air volume of the drying airflow through the conveying pipe 223. The valve body 224 controls the opening and closing of the conveying pipe 223. When the desiccant is in a humid state and cannot meet the drying requirements when the air enters, the valve body 224 on that side is activated to close the conveying pipe 223, while the valve body 224 on the other side is opened to make it work. At the same time, the humid desiccant is dried and heated by the heating plate 222, so that it can be recycled.

[0034] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0035] During operation, after the device is started, the circulating pump 211 drives the coolant to flow in a closed loop. The coolant first flows through the cold water drain 212, contacts the surface of the equipment that needs to be cooled and absorbs heat. The coolant carrying heat flows back to the circulating pump 211 through the pipe, and is then transported to the circulating pipe 214 inside the heat sink fins 215. At this time, the thermoelectric cooler 218 starts up simultaneously to cool the air below it. The centrifugal fan 216 blows the cold air towards the heat sink fins 215, thereby quickly cooling the coolant in the circulating pipe 214. Meanwhile, the heat generated by the heating surface of the thermoelectric cooler 218 is quickly dissipated by the axial fan 219 above, preventing the heating end temperature from being too high and affecting the cooling efficiency. This ensures that the thermoelectric cooler 218 is always in a high-efficiency working state. The cooled coolant is then transported back to the cold water drain 212 by the circulating pump 211, forming a continuous water cooling cycle that continuously removes the heat generated by the equipment, achieving rapid cooling.

[0036] While the centrifugal fan 216 is working, due to the negative pressure at the bottom of the frame 217, outside air enters through the vents on both sides of the vent box 221. The color-changing silica gel desiccant inside absorbs moisture and reduces the relative humidity of the air, forming a low dew point dry airflow. The dry airflow enters the lower cavity of the frame 217 through the delivery pipe 223 and flows through the cooling side of the semiconductor cooling chip 218, preventing water vapor in the air from condensing due to excessively low temperature on the cooling surface. When the color-changing silica gel in one vent box 221 changes color due to moisture absorption (the color darkens), the valve 224 of the corresponding delivery pipe 223 closes, and the valve 224 on the other side opens to ensure continuous air supply. At the same time, the heating plate 222 on that side is activated, and the moist desiccant is dehydrated and regenerated by heating at 50-60℃, realizing recycling.

[0037] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. Air-cooled and water-cooled integrated system condensing device, comprising a loading plate (1), characterized in that: The upper part of the loading plate (1) is provided with a condensation mechanism (2) for rapid cooling of the equipment. The condensation mechanism (2) includes: The refrigeration assembly (21) includes a circulation pump (211) fixedly installed on one side of the top of the loading plate (1), a cold water drain (212) installed on one side of the bottom of the loading plate (1), the water pipe output and input ends of the cold water drain (212) are connected to the cooling water output and input ends of the circulation pump (211), a heat dissipation fin (215) is fixedly installed on the other side of the top of the loading plate (1), a circulation pipe (214) is fixedly installed in the middle of the heat dissipation fin (215), the two ends of the circulation pipe (214) are respectively installed on the cooling water output and input ends of one side of the circulation pump (211), a centrifugal fan (216) is fixedly installed in the middle of the top of the heat dissipation fin (215), a frame (217) is fixedly installed in the top of the centrifugal fan (216), and a semiconductor cooling chip (218) is provided in the middle of the frame (217). A dehumidification assembly (22) is provided on both sides of the frame (217) to keep the air entering the cooling side of the semiconductor refrigeration chip (218) in a dry state.

2. The air-cooled and water-cooled integrated system condensing device according to claim 1, characterized in that: The dehumidification assembly (22) includes two vent boxes (221) fixedly installed on the top of the heat dissipation fins (215). A conveying pipe (223) is fixedly installed at the middle of the top of each of the two vent boxes (221). The other end of the conveying pipe (223) is fixedly installed on the upper side of one side of the frame (217). A heating plate (222) is fixedly installed on one side of each of the two vent boxes (221).

3. The air-cooled and water-cooled integrated system condensing device according to claim 1, characterized in that: The loading plate (1) has two symmetrically distributed mounting seats (213) fixedly installed at its bottom end, and the upper part of each mounting seat (213) is provided with multiple symmetrically distributed mounting holes.

4. The air-cooled and water-cooled integrated system condensing device according to claim 1, characterized in that: A fixing plate (2181) is fixedly installed in the middle of the frame (217), and a semiconductor cooling chip (218) is fixedly installed in the middle of the fixing plate (2181).

5. The air-cooled and water-cooled integrated system condensing device according to claim 1, characterized in that: An axial fan (219) is fixedly installed at the top of the frame (217), and the axial fan (219) is used to dissipate heat from the semiconductor cooling chip (218).

6. The air-cooled and water-cooled integrated system condensing device according to claim 2, characterized in that: A valve body (224) is fixedly installed on the middle of one side of each of the two conveying pipes (223) for adjusting the air volume of the drying airflow flowing through the conveying pipes (223).

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