A bonding sheet cleaning device

Abstract

The application provides a bonding sheet cleaning device, which comprises a brush cleaning mechanism and a rotary cleaning mechanism. The brush cleaning mechanism is sequentially provided with a first brush, a first flexible scrubbing piece and a first flushing pipe along the moving direction of the bonding sheet. The first brush is used for preliminarily removing silicon powder particles attached to the surface to be cleaned. The first flexible scrubbing piece is used for further removing residual contaminants. The first flushing pipe is used for flushing the surface to be cleaned of the bonding sheet by spraying deionized water, so as to remove loose contaminants and prevent secondary deposition. The rotary cleaning mechanism comprises a rotary base, a second brush, a second flexible scrubbing piece and a second flushing pipe. The bonding sheet processed by the brush cleaning mechanism is transferred to the rotary base. The rotary base is used for driving the bonding sheet to rotate and enabling the surface to be cleaned of the bonding sheet to be in contact with the second brush and the second flexible scrubbing piece, so as to be cleaned again. The second flushing pipe synchronously sprays deionized water, so as to ensure that the silicon powder residues on the surface to be cleaned of the bonding sheet are completely removed.

Description

Technical Field

[0001] This application belongs to the field of wafer manufacturing technology, and more specifically, relates to a bonding wafer cleaning device. Background Technology

[0002] After the bonding wafer completes its processing in the thinning machine, a ring of silicon powder residue, approximately 8 mm wide, often appears around its edges. This residue is mainly distributed within an 8 mm annular area extending inwards from the outer edge of the bonding wafer. This residual silicon powder not only affects the product's appearance but, more importantly, poses a risk of contamination to subsequent processes. Because wafer manufacturing demands extremely high cleanliness, these micron-sized silicon powder particles are easily dispersed to other processes by airflow or mechanical handling, contaminating other products on the production line and leading to a decrease in product yield. Currently, the industry commonly uses manual cleaning to address this issue, but this method suffers from low cleaning efficiency, inconsistent cleaning results, and the potential introduction of new contaminants during manual operation. Therefore, effectively solving the problem of residual silicon powder at the edges of the bonding wafer after thinning has become a pressing technical challenge in this field. Utility Model Content

[0003] The purpose of this application is to provide a bonding wafer cleaning device to solve the technical problem of residual silicon powder at the edge of the bonding wafer after thinning in the prior art.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0005] A bonding sheet cleaning device is provided, comprising:

[0006] The brush cleaning mechanism includes a first brush, a first flexible scrubbing member, and a first rinsing pipe arranged sequentially along the moving direction of the bonding sheet. The first brush and the first flexible scrubbing member are used to contact the surface of the bonding sheet to be cleaned, and the first rinsing pipe is used to rinse the surface of the bonding sheet to be cleaned.

[0007] The rotating cleaning mechanism includes a rotating base, a second brush, a second flexible scrubbing element, and a second rinsing pipe. After being rinsed by the first rinsing pipe, the bonding sheet is placed on the rotating base, which drives the bonding sheet to rotate. The second brush and the second flexible scrubbing element are used to contact the surface of the bonding sheet to be cleaned, and the second rinsing pipe is used to rinse the surface of the bonding sheet to be cleaned.

[0008] As a further improvement to the above technical solution:

[0009] Optionally, the second brush is an annular brush, and the rotating base is located inside the annular brush.

[0010] Optionally, the second flexible scrubbing member is mounted on the annular brush and extends along the radial direction of the annular brush; one end of the second flexible scrubbing member intersects with the inner ring of the annular brush, and / or, the other end of the second flexible scrubbing member intersects with the outer ring of the annular brush.

[0011] Optionally, the second flexible scrubbing member has a porous perforated structure, and the second flushing tube extends into the second flexible scrubbing member and seeps water outward through the porous perforated structure of the second flexible scrubbing member.

[0012] Optionally, the rotating cleaning mechanism further includes a fixing member for fixing the second flexible scrubbing member, the fixing member being disposed within the second flexible scrubbing member and connected to the second brush by fasteners.

[0013] Optionally, there may be multiple second flexible scrubbing elements, with each second flexible scrubbing element spaced apart from the others in the circumferential direction.

[0014] The brush cleaning mechanism further includes a brush drive component, which is connected to the first brush drive to drive the first brush to rotate.

[0015] Optionally, the first brush is a straight-line brush, and the length of the straight-line brush is greater than or equal to the diameter of the bonding sheet.

[0016] Optionally, the first flexible scrubbing member extends in a direction intersecting the moving direction of the bonding sheet, and the length of the first flexible scrubbing member is greater than or equal to the diameter of the bonding sheet.

[0017] Optionally, the hardness range of the first flexible scrubbing component and the second flexible scrubbing component is 20HB-50HB.

[0018] The beneficial effects of the bonding sheet cleaning device provided in this application are as follows:

[0019] The bonding wafer cleaning device provided in this application includes a brush cleaning mechanism and a rotary cleaning mechanism, which work together to achieve efficient cleaning of silicon powder residue on the edges of the bonding wafer. A robotic arm moves the bonding wafer to be cleaned onto the brush cleaning mechanism, which is sequentially equipped with a first brush, a first flexible scrubbing element, and a first rinsing pipe along the direction of movement of the bonding wafer. The first brush is used to initially remove silicon powder particles adhering to the surface of the bonding wafer to be cleaned. The first flexible scrubbing element further removes residual fine contaminants. The first rinsing pipe rinses the surface of the bonding wafer to be cleaned by spraying deionized water to remove loose contaminants and prevent secondary deposition. The rotary cleaning mechanism includes a rotating base, a second brush, a second flexible scrubbing element, and a second rinsing pipe. The bonding wafer, after initial treatment by the brush cleaning mechanism, is transferred to the rotating base, which rotates the bonding wafer and brings the surface of the bonding wafer to be cleaned into contact with the second brush and the second flexible scrubbing element for secondary cleaning. The second rinsing tube simultaneously sprays deionized water to ensure thorough removal of silicon powder residue from the bonding wafer's surface to be cleaned.

[0020] The bonding sheet cleaning device provided in this application achieves efficient removal of contaminants on the bonding sheet through the cooperation of two-stage cleaning mechanisms, while avoiding the secondary pollution problems that may be caused by manual cleaning. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A three-dimensional structural schematic diagram of the bonding sheet cleaning device provided in this application;

[0023] Figure 2 A partially enlarged structural diagram of the bonding wafer cleaning device provided in this application. Figure 1 ;

[0024] Figure 3 A partially enlarged structural diagram of the bonding wafer cleaning device provided in this application. Figure 2 ;

[0025] Figure 4 This is a partial cross-sectional structural diagram of the rotating cleaning mechanism provided in this application.

[0026] The following are the labeling elements in the figure:

[0027] 1. Brush cleaning mechanism; 11. First brush; 12. First flexible scrubbing component; 13. First rinsing pipe; 2. Rotary cleaning mechanism; 21. Rotary base; 22. Second brush; 23. Second flexible scrubbing component; 24. Second rinsing pipe; 25. Fixing component; 26. Fastener; 3. Bonding plate. Detailed Implementation

[0028] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0029] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0031] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0033] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of this utility model.

[0034] In the following description, suffixes such as "module," "part," "component," or "unit" are used only for the purpose of describing this utility model and have no specific meaning in themselves. Therefore, they can be used in combination.

[0035] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0036] like Figure 1 As shown, this application provides a bonding wafer cleaning device, which includes a brush cleaning mechanism 1 and a rotary cleaning mechanism 2, which work together to achieve efficient cleaning of silicon powder residue on the edge of the bonding wafer.

[0037] like Figure 2 As shown, the robotic arm moves the bonding wafer 3 to be cleaned onto the brush cleaning mechanism 1. The brush cleaning mechanism 1 is sequentially equipped with a first brush 11, a first flexible scrubbing element 12, and a first rinsing pipe 13 along the moving direction of the bonding wafer. The first brush 11 is used to initially remove silicon powder particles attached to the surface of the bonding wafer to be cleaned. The first flexible scrubbing element 12 further removes residual fine contaminants. The first rinsing pipe 13 rinses the surface of the bonding wafer to be cleaned by spraying deionized water to remove loose contaminants and prevent secondary deposition.

[0038] like Figure 3As shown, the rotary cleaning mechanism 2 includes a rotating base 21, a second brush 22, a second flexible scrubbing element 23, and a second rinsing pipe 24. The bonded sheet, after initial treatment by the brush cleaning mechanism 1, is transferred to the rotating base 21. The rotating base 21 drives the bonded sheet to rotate, bringing the surface to be cleaned into contact with the second brush 22 and the second flexible scrubbing element 23 for secondary cleaning. The second rinsing pipe 24 simultaneously sprays deionized water to ensure thorough removal of silicon powder residue from the surface of the bonded sheet to be cleaned.

[0039] The bonding sheet cleaning device provided in this application achieves efficient removal of contaminants on the bonding sheet through the cooperation of two-stage cleaning mechanisms, while avoiding the secondary pollution problems that may be caused by manual cleaning.

[0040] like Figure 3 As shown in a specific embodiment of this application, the second brush 22 of the rotating cleaning mechanism 2 adopts an annular brush structure. The inner diameter of the annular brush is smaller than the diameter of the bonding plate, and the outer diameter of the annular brush is larger than the diameter of the bonding plate, so that the area to be cleaned on the bonding plate can be completely placed within the brushing range of the annular brush. The rotating base 21 is located at the center of the inner side of the annular brush. When the bonding plate is placed on the rotating base 21, the rotating base 21 drives the bonding plate to rotate, while the annular brush remains in a fixed position. This ensures that the area to be cleaned on the bonding plate can maintain continuous contact with the bristles of the annular brush during rotation, thereby achieving cleaning of the bonding plate.

[0041] like Figure 3 As shown, in one specific embodiment of this application, a second flexible scrubbing member 23 is mounted on an annular brush. The second flexible scrubbing member 23 extends radially along the annular brush. One end of the second flexible scrubbing member 23 extends to intersect the inner ring edge of the annular brush, and / or the other end extends to intersect the outer ring edge of the annular brush. This radially extended mounting method allows the second flexible scrubbing member 23 to cover the entire area to be cleaned on the bonded sheet. When the rotating base 21 rotates the bonded sheet, the second flexible scrubbing member 23 can apply a uniform scrubbing force to the entire area to be cleaned on the bonded sheet. The mating arrangement of the second flexible scrubbing member 23 and the annular brush ensures that silicon powder residue on the bonded sheet is thoroughly removed.

[0042] like Figure 3As shown in one specific embodiment of this application, the second flexible scrubbing member 23 of the rotating cleaning mechanism 2 has a porous perforated structure, thereby enabling the second flexible scrubbing member 23 to maintain the necessary mechanical strength while possessing liquid penetration capability. The water outlet end of the second flushing pipe 24 extends into the interior of the second flexible scrubbing member 23. After the cleaning liquid is delivered to the second flexible scrubbing member 23 through the second flushing pipe 24, it seeps out evenly through its porous perforated structure, thereby achieving distributed supply of cleaning liquid. When the second flexible scrubbing member 23 contacts the surface of the bonding sheet, the seeping cleaning liquid can instantly wet the contact area, forming a liquid medium layer to enhance the cleaning effect. The pore size of the porous perforated structure needs to ensure sufficient liquid penetration while maintaining appropriate contact pressure between the second flexible scrubbing member 23 and the surface of the bonding sheet, thereby improving cleaning efficiency under the combined action of mechanical scrubbing and liquid rinsing.

[0043] like Figure 4 As shown, in one specific embodiment of this application, the rotating cleaning mechanism 2 further includes a fixing member 25 for securely mounting the second flexible scrubbing member 23. The fixing member 25 has a built-in structure and is disposed inside the second flexible scrubbing member 23. This built-in arrangement ensures the structural stability of the second flexible scrubbing member 23 and avoids interference with external cleaning operations. The fixing member 25 is mechanically connected to the second brush 22 via fasteners 26, which also facilitates disassembly and replacement during maintenance.

[0044] like Figure 3 As shown in one specific embodiment of this application, the second flexible scrubbing element 23 of the rotating cleaning mechanism 2 is specifically configured to be evenly distributed along the circumference of the annular brush. These second flexible scrubbing elements 23 maintain an appropriate spacing from each other, forming a circumferential array layout. This circumferentially spaced arrangement of multiple second flexible scrubbing elements 23 improves the uniformity and efficiency of the cleaning operation. When the rotating base 21 drives the bonding sheet to rotate, the surface of the bonding sheet to be cleaned can make contact with each of the second flexible scrubbing elements 23, achieving a comprehensive and continuous cleaning effect.

[0045] In one specific embodiment of this application, the brush cleaning mechanism 1 further includes a brush drive (not shown), which is poweredly connected to the first brush 11. The brush drive is preferably a speed-adjustable motor, whose output shaft is connected to the rotation shaft of the first brush 11 via a coupling or gear set, thereby providing controllable rotational power to the first brush 11. This drive connection allows the first brush 11 to actively rotate under the drive of the brush drive. By adjusting the rotational speed parameters of the brush drive, the relative speed between the first brush 11 and the bonding plate can be precisely controlled, thereby optimizing the cleaning effect and avoiding excessive wear.

[0046] like Figure 2As shown in one specific embodiment of this application, the first brush 11 of the brush cleaning mechanism 1 adopts a straight-line structure, and the length of the straight-line brush is greater than or equal to the diameter of the bonding sheet to be cleaned. This size matching allows the straight-line brush to completely cover the area to be cleaned on the bonding sheet during cleaning operations, avoiding cleaning blind spots caused by insufficient brush length. The bristle arrangement density and hardness of the straight-line brush are optimized to effectively remove silicon powder particles attached to the edge of the bonding sheet without damaging the surface of the bonding sheet. When the bonding sheet passes through the first brush 11 along the moving direction, the entire working length of the straight-line brush participates in the cleaning process, ensuring that the cleaning force on the bonding sheet is uniform and consistent.

[0047] like Figure 2 As shown in a specific embodiment of this application, the extending direction of the first flexible scrubbing member 12 of the brush cleaning mechanism 1 forms an intersecting angle with the moving direction of the bonding sheet. The length of the first flexible scrubbing member 12 must ensure that its effective working length is greater than or equal to the diameter of the bonding sheet to be cleaned. The length configuration of the first flexible scrubbing member 12 ensures that the entire area of ​​the bonding sheet to be cleaned can be uniformly scrubbed, avoiding the generation of cleaning dead corners.

[0048] In one specific embodiment of this application, the first flexible scrubbing member 12 of the brush cleaning mechanism 1 and the second flexible scrubbing member 23 of the rotary cleaning mechanism 2 are both made of a material with a specific hardness range, with the hardness value controlled between 20HB and 50HB. Within this hardness range, the first flexible scrubbing member 12 and the second flexible scrubbing member 23 can fully conform to the surface of the bonded sheet to be cleaned, maintain stable cleaning performance under contact pressure, and avoid the risk of surface damage to the bonded sheet due to excessively hard materials.

[0049] In one specific embodiment of this application, the first flexible scrubbing component 12 of the brush cleaning mechanism 1 and the second flexible scrubbing component 23 of the rotary cleaning mechanism 2 are specifically made of sponge or silicone as the base material. Sponge material has a porous structure and compressibility, effectively absorbing particles generated during the cleaning process; silicone material possesses excellent resilience and chemical resistance, making it suitable for long-term use in humid environments. In practical implementation, sponges with different densities and porosities, or silicone with different hardness and surface properties, can be selected according to specific cleaning needs. This maintains a match with the 20HB-50HB hardness range while meeting the requirements for material cleanliness and durability in bonded sheet cleaning operations. The first flexible scrubbing component 12 and the second flexible scrubbing component 23, made of sponge or silicone, can scrub the bonded sheet during the cleaning process while avoiding mechanical damage to the bonded sheet surface.

[0050] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A bonding wafer cleaning device, characterized in that, include: The brush cleaning mechanism (1) includes a first brush (11), a first flexible scrubbing member (12) and a first rinsing pipe (13) arranged sequentially along the moving direction of the bonding sheet. The first brush (11) and the first flexible scrubbing member (12) are used to contact the surface of the bonding sheet to be cleaned, and the first rinsing pipe (13) is used to rinse the surface of the bonding sheet to be cleaned. The rotating cleaning mechanism (2) includes a rotating base (21), a second brush (22), a second flexible scrubbing member (23), and a second rinsing pipe (24). After being rinsed by the first rinsing pipe (13), the bonding sheet is placed on the rotating base (21). The rotating base (21) is used to drive the bonding sheet to rotate. The second brush (22) and the second flexible scrubbing member (23) are used to contact the surface of the bonding sheet to be cleaned. The second rinsing pipe (24) is used to rinse the surface of the bonding sheet to be cleaned.

2. The bonding wafer cleaning device as described in claim 1, characterized in that, The second brush (22) is an annular brush, and the rotating base (21) is located on the inner side of the annular brush.

3. The bonding wafer cleaning device as described in claim 2, characterized in that, The second flexible scrubbing member (23) is mounted on the annular brush and extends in the radial direction of the annular brush; one end of the second flexible scrubbing member (23) intersects with the inner ring of the annular brush, and / or the other end of the second flexible scrubbing member (23) intersects with the outer ring of the annular brush.

4. The bonding wafer cleaning apparatus according to any one of claims 1 to 3, characterized in that, The second flexible scrubbing member (23) has a porous hollow structure, and the second flushing pipe (24) extends into the second flexible scrubbing member (23) and seeps water out through the porous hollow structure of the second flexible scrubbing member (23).

5. The bonding wafer cleaning apparatus according to any one of claims 1 to 3, characterized in that, The rotating cleaning mechanism (2) further includes a fixing member (25) for fixing the second flexible scrubbing member (23), the fixing member (25) being disposed inside the second flexible scrubbing member (23), and the fixing member (25) being connected to the second brush (22) by a fastener (26).

6. The bonding wafer cleaning apparatus according to any one of claims 1 to 3, characterized in that, The number of the second flexible scrubbing member (23) is multiple, and each of the second flexible scrubbing member (23) is arranged at intervals from each other in the circumferential direction.

7. The bonding wafer cleaning apparatus according to any one of claims 1 to 3, characterized in that, The brush cleaning mechanism (1) further includes a brush drive component, which is driven to connect with the first brush (11) to drive the first brush (11) to rotate.

8. The bonding wafer cleaning apparatus according to any one of claims 1 to 3, characterized in that, The first brush (11) is a straight-line brush, and the length of the straight-line brush is greater than or equal to the diameter of the bonding sheet.

9. The bonding wafer cleaning apparatus according to any one of claims 1 to 3, characterized in that, The first flexible scrubbing member (12) extends in a direction intersecting the moving direction of the bonding sheet, and the length of the first flexible scrubbing member (12) is greater than or equal to the diameter of the bonding sheet.

10. The bonding wafer cleaning apparatus according to any one of claims 1 to 3, characterized in that, The hardness range of the first flexible scrubbing element (12) and the second flexible scrubbing element (23) is 20HB-50HB.

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