Printed circuit board

Abstract

The utility model discloses a kind of printed circuit boards, it is related to the field of circuit board, and its technical solution main points are: including upper layer and lower layer, the edge position of upper layer is equipped with through-hole, lower layer is fixedly connected with reference disc in through-hole, the side of lower layer back to upper layer is equipped with several convex edges, and the position of convex edge corresponds with through-hole.Reference disc is located in through-hole, so that the wear of circuit board is not prone to occur in moving process, and reference disc is located in recess, so that people can paste the part of upper layer setting through-hole by sticking paper, so that moisture and dust are not prone to enter into through-hole, so that reference disc is not prone to oxidation, reference disc surface is plated with tin layer, the setting of tin layer makes the contrast feeling of reference disc after being irradiated and other positions of through-hole more strong, so as to facilitate the positioning of reference disc for chip mounter.

Description

Technical Field

[0001] This utility model relates to the field of circuit boards, and more specifically, to a printed circuit board. Background Technology

[0002] A printed circuit board is a substrate used to support and connect electronic components. It uses printing technology to print conductive lines on an insulating substrate to form electrical connection paths.

[0003] Electronic components are fixed onto circuit boards using a pick-and-place machine. To facilitate the machine's positioning of the circuit board, several reference points are set on it. By identifying these reference points, the pick-and-place machine can correct the position and angle of the circuit board, ensuring placement accuracy. Reference points are usually located near the edge of the circuit board because the central area is typically densely populated with components. If the reference points were placed in these areas, they might be obscured by the components, affecting identification. However, if the reference points are placed at the edge, they are more susceptible to wear during circuit board handling, which could also affect the pick-and-place machine's identification and alignment.

[0004] Therefore, a new solution is needed to address this problem. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a printed circuit board.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a printed circuit board, including an upper layer and a lower layer, wherein a through hole is provided at the edge of the upper layer, a reference plate located in the through hole is fixedly connected to the lower layer, and a plurality of protruding ridges are provided on the side of the lower layer opposite to the upper layer, wherein the protruding ridges correspond to the positions of the through holes.

[0007] The present invention is further configured such that: the reference disk is arranged in a ring shape, and the lower layer is provided with a protruding post passing through the center of the reference disk.

[0008] The present invention is further configured such that: the reference disk is arranged in a ring shape, and the lower layer is provided with a protruding post passing through the center of the reference disk.

[0009] The present invention is further configured such that the diameter of the protrusion is smaller than the inner diameter of the reference plate, and the length of the protrusion is smaller than the thickness of the upper layer.

[0010] The present invention is further configured such that the diameter of the reference plate is smaller than the diameter of the through hole.

[0011] The present invention is further configured such that the protruding ridge is inclined and the included angle between the protruding ridge and the upper sidewall is 45 degrees.

[0012] The present invention is further configured such that the surface of the reference disk is plated with a tin layer.

[0013] In summary, this utility model has the following beneficial effects: The reference plate is located inside the through hole, creating a distance between the reference plate and the side of the upper layer facing away from the lower layer. This reduces the risk of wear and tear on the circuit board during movement. Furthermore, the reference plate is located in a recess, allowing users to cover the part of the upper layer with the through hole using a sticker. This prevents moisture and dust from entering the through hole and reduces the risk of oxidation of the reference plate. The raised ridges allow the other end of the sticker to be adhered to the raised ridge position on the lower layer. The unevenness of the raised ridges creates a gap between the sticker and the lower layer, making it easier to peel the sticker off the circuit board later. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the structure of the present invention. Figure 2 .

[0015] In the diagram: 1. Upper layer; 2. Lower layer; 3. Through hole; 4. Base plate; 5. Raised edge; 6. Raised column. Detailed Implementation

[0016] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0017] Printed circuit boards, such as Figure 1 and Figure 2 As shown, the circuit includes an upper layer 1 and a lower layer 2. A through-hole 3 is provided at the edge of the upper layer 1. A reference plate 4 is fixedly connected to the lower layer 2 within the through-hole 3. Several protruding ridges 5 are provided on the side of the lower layer 2 opposite to the upper layer 1, with the ridges 5 corresponding to the positions of the through-holes 3. Mounting holes penetrating the entire circuit board are provided at the corners of the circuit board. Several solder pads are provided on the upper layer 1. In this embodiment, there are two reference plates 4, each positioned close to one of the two mounting holes. The pick-and-place machine identifies the reference plates 4 to determine the position of the circuit board and then solders the corresponding electronic components onto the solder pads. The base plate 4 is located inside the through hole 3, which creates a distance between the base plate 4 and the side of the upper layer 1 facing away from the lower layer 2. This makes the circuit board less prone to wear during movement. Furthermore, the base plate 4 is located in a groove, allowing people to cover the part of the upper layer 1 with a sticker to prevent moisture and dust from entering the through hole 3 and to prevent the base plate 4 from oxidizing. The protruding ridge 5 allows the other end of the sticker to be pasted onto the protruding ridge 5 position of the lower layer 2. The unevenness of the protruding ridge 5 creates a certain gap between the sticker and the lower layer 2, making it easier for people to peel the sticker off the circuit board later.

[0018] like Figure 1 and Figure 2 As shown, the reference plate 4 is arranged in a ring shape. The lower layer 2 is also provided with a protrusion 6 passing through the center of the reference plate 4. The protrusion 6 can support the sticker, so that the sticker is not easily sunk into the through hole 3 as a whole, and prevents the sticker from sticking to the reference plate 4. The diameter of the protrusion 6 is smaller than the inner diameter of the reference plate 4, and the length of the protrusion 6 is smaller than the thickness of the upper layer 1. At the same time, the diameter of the reference plate 4 is also smaller than the diameter of the through hole 3. There is a distance between the outer peripheral wall of the reference plate 4 and the inner wall of the through hole 3, and there is also a distance between the inner peripheral wall of the reference plate 4 and the protrusion 6, so as to avoid the edge of the through hole 3 from blocking the reference plate 4 and the protrusion 6 from blocking the reference plate 4. The surface of the reference plate 4 is plated with a tin layer. The tin layer makes the contrast between the reference plate 4 and other positions of the through hole 3 stronger after the reference plate 4 is irradiated, thus facilitating the positioning of the reference plate 4 by the pick and place machine.

[0019] like Figure 2 As shown, the protruding rib 5 is inclined, and the angle between the protruding rib 5 and the side wall of the upper layer 1 is 45 degrees. This arrangement makes the protruding rib 5 have a certain reinforcing effect on the lower layer 2 in both the lateral and longitudinal directions, thereby ensuring the strength of the through hole 3 on the circuit board.

[0020] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A printed circuit board, characterized in that: It includes an upper layer (1) and a lower layer (2). The upper layer (1) has a through hole (3) at its edge. The lower layer (2) has a reference plate (4) fixedly connected inside the through hole (3). The lower layer (2) has several protruding ridges (5) on the side opposite to the upper layer (1). The protruding ridges (5) correspond to the positions of the through holes (3).

2. The printed circuit board according to claim 1, characterized in that: The reference disk (4) is arranged in a ring shape, and the lower layer (2) is also provided with a protruding post (6) passing through the center of the reference disk (4).

3. The printed circuit board according to claim 2, characterized in that: The diameter of the protrusion (6) is smaller than the inner diameter of the reference plate (4), and the length of the protrusion (6) is smaller than the thickness of the upper layer (1).

4. The printed circuit board according to claim 1, characterized in that: The diameter of the reference plate (4) is smaller than the diameter of the through hole (3).

5. The printed circuit board according to claim 1, characterized in that: The protruding ridge (5) is inclined, and the angle between the protruding ridge (5) and the side wall of the upper layer (1) is 45 degrees.

6. The printed circuit board according to claim 1, characterized in that: The reference disk (4) has a tin coating on its surface.

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