Method and device for determining a positioning error of a receptable component

Abstract

Method for determining a positioning error of a receptable component (600) before the component (600) is mounted on a substrate (300), using a device (100), wherein: the component (600) comprises one or more component marks; and the component (600) comprises a mounting surface (601) suitable for attachment to the substrate (300) and a gripping surface (602) arranged opposite the mounting surface (601); the device (100) comprises: a pickup and placement actuator (150) arranged to be at a placement position (800) and can be used at a component change position (810), wherein the picking and placement actuator (150) comprises a gripper (160) for releasable attachment to the gripping surface (602) of the component (600); a component holder (130) for releasable attachment to the mounting surface (601) of the component (600); and at least one downward-facing camera (410) arranged in such a way that that they include at least one underside view of at least a part of the mounting surface (601) of the component (600) might; the procedure includes Attaching the mounting surface (601) of the component (600) to the component holder (130); Moving the component holder (130) with the attached component (600) into the component exchange position (810); Using the at least one bottom-view camera (410) at the component exchange position (810) to take at least one first bottom-view photograph (720) of a first component mark; Moving the pickup and placement actuator (150) to the component exchange position (810); Attaching the gripping surface (602) of the component (600) to the gripper (160) and releasing the mounting surface (601) of the component (600) from the component holder (130); using the at least one bottom-view camera (410) at the component change position (810) to take at least one second bottom-view image (730) of a second component mark; and determining a positioning error of the component (600) using the at least one second bottom-view image (730) and the at least one first bottom-view image (720).

Description

Technical field

[0001] The present disclosure relates to a device or method for determining a positioning error of one or more receptable components, such as chips or electrical components, before placement on one or more substrates. Preferably, the receptacle can be taken in a bonding device before bonding to the one or more substrates. State of the art

[0002] Similar devices and components are known from the prior art, such as those described in US 2009 / 0070992 A1. This patent application describes a semiconductor assembly device comprising a placement system with a bonding head, which includes a first drive system and a second drive system for moving the bonding head in a predetermined direction. The first drive system comprises a first pivoting arm and a first stationary drive, which is used to pivot the pivoting arm back and forth within a predetermined pivoting range. The second drive system is mounted on the pivoting arm and comprises a stationary electric motor.

[0003] In semiconductor assembly, components are frequently transferred between manipulators and actuators positioned to move components between loading, unloading, or processing stations. To track the position of the components at these stations, one or more inspection cameras are typically used. The measurements taken by these cameras are used to determine the target location to which a manipulator or actuator must move to pick up or place the components. Nevertheless, unexpected positioning errors still frequently occur, negatively impacting the quality of semiconductor assembly.

[0004] Furthermore, devices and associated methods for determining positioning errors in components to be processed are also known from patent specifications US 2009 / 0070992A1, JP 2013-168683A, DE 102018117825A1, DE 102014101901A1, JP 2022-123609A, JP 2005-11950A, JP 6913231B2, or in particular JP 2001-156499A, which, however, pursue completely different approaches in the specific machine concept and implementation than the teaching disclosed here. Object of the invention

[0005] One objective of the invention is to increase the positioning accuracy of a component on a substrate by determining a positioning error of the component when switching to a gripper. Solution to the task

[0006] By determining positioning errors of a component being picked up, the positioning accuracy of the device can be increased in the event of positioning errors that may occur during the picking up of a component.

[0007] In a first aspect, a method for determining a positioning error of a pick-up component before the component is mounted on a substrate is provided, using a device. The component comprises one or more component markers and a mounting surface suitable for attachment to the substrate. The component also includes a gripping surface arranged opposite the mounting surface. The device includes a pick-up and placement actuator arranged to be used at a placement position and at a component exchange position. The pick-up and placement actuator includes a gripper for releasable attachment to the gripping surface of the component. The device includes a component holder for releasable attachment to the mounting surface of the component and at least one bottom-view camera arranged tothat it creates at least one upward image of at least a portion of the component's mounting surface. The method comprises the step of attaching the component's mounting surface to the component holder, the step of moving the component holder with the attached component to the component exchange position, the step of using the at least one downward-facing camera at the component exchange position to take at least one initial downward-facing image of a first component mark, the step of moving the pickup and placement actuator to the component exchange position, the step of attaching the component's gripping surface to the gripper and releasing the component's mounting surface from the component holder, and the step of using the at least one downward-facing camera at the component exchange position to take at least one second downward-facing image of a second component mark.and the step of determining a positioning error of the component using at least one second bottom view and at least one first bottom view.

[0008] Determining positional errors using appropriate component markings can increase the accuracy of error detection. This can be advantageous when sampling components with inaccurate markings, such as chips with rough, irregular edges resulting from imprecise sawing. This can be beneficial for flip-chip components.

[0009] In an optional aspect of the method, the device comprises at least one top-view camera arranged to take at least one top-view photograph of at least one part of the gripping surface of the component, wherein the method comprises the step of using the at least one top-view camera at the component change position to take at least one first top-view photograph of a third component marking.

[0010] In an optional aspect of the procedure, the procedure includes the step of providing the substrate at the placement position, the step of moving the pick-up and placement actuator to the placement position with the attached component, and the step of placing the component onto the substrate at the placement position.

[0011] In an optional aspect of the procedure, the procedure includes the step of at least partially correcting the positioning error of the component by changing one or more positions and / or orientations selected from the group that includes a rotation of the component, a displacement of the component, a tilt of the component, a rotation of the substrate, a displacement of the substrate, a tilt of the substrate, a rotation of the pick-up and placement actuator, a displacement of the pick-up and placement actuator, a tilt of the pick-up and placement actuator, a rotation of the gripper, a displacement of the gripper, a tilt of the gripper, a rotation of the component holder, a displacement of the component holder, a tilt of the component holder, or any combination thereof.

[0012] In an optional aspect of the procedure, the device includes a component loading position, and the procedure includes the step of providing the component in the component loading position, the step of moving the component holder into the component loading position, the step of attaching the component to the component holder, and the step of moving the component holder with the attached component into the component exchange position.

[0013] In an optional aspect of the process, the substrate includes at least one substrate marker.

[0014] In an optional aspect of the procedure, the procedure includes the step of using the at least one top-down camera at the placement position to take at least one second top-down image of a part of the substrate and / or at least one substrate marker, and the step of determining a fourth position and / or orientation of the substrate using the at least one second image.

[0015] Similarly, a device is provided for receiving a component before the component is placed on a substrate for mounting, wherein the component comprises one or more component markings and a mounting surface suitable for attachment to the substrate. The component includes a gripping surface arranged to face the mounting surface.

[0016] The device comprises a receiving and placement actuator arranged to be located at a placement position and at a component exchange position, and comprising a gripper that can be releasably attached to the gripping surface of the component.

[0017] The device comprises a component holder for releasable attachment to the mounting surface of the component and at least one under-view camera arranged to take at least one under-view photograph of at least one part of the mounting surface of the component.

[0018] The device is arranged to attach the mounting surface of the component to the component holder and is arranged to move the component holder with the attached component into the component exchange position.

[0019] The at least one bottom-view camera is arranged to take at least one first bottom-view photograph of a first component marking at the component change position, and the device is arranged to move the recording and placement actuator to the component change position;

[0020] The device is also arranged to attach the gripping surfaces of the component to the gripper and to release the mounting surface of the component from the component holder, and the at least one bottom-view camera is arranged to take at least one second bottom-view photograph of a second component marking at the component change position, and the device is also arranged to determine a positional error of the component using the at least one second upward photograph and the at least one first upward photograph.

[0021] In an optional aspect of the device, the device comprises at least one top-view camera arranged to take at least one top-view photograph of at least one part of the gripping surface of the component, wherein the at least one top-view camera is arranged to take at least one first top-view photograph of a third component marking at the component change position.

[0022] In an optional aspect of the device, the component holder includes a receiving surface with a component holding area.

[0023] The area for holding the component is suitable to accommodate and hold at least part of the component's mounting surface.

[0024] In an optional aspect of the device, the component holder comprises a rear surface arranged as a surface opposite the receiving surface, one or more radiation windows arranged such that illumination radiation can pass between the receiving surface and the rear surface, wherein the at least one bottom-view camera is arranged to take the at least one first bottom-view image and / or the at least one second bottom-view image using illumination radiation passing between the receiving surface and the rear surface.

[0025] In an optional aspect of the device, the one or more radiation windows comprise one or more openings and / or one or more areas that are at least partially transparent to illumination radiation.

[0026] In an optional aspect of the device, one or more radiation windows are arranged at least partially in the area in which the component is held.

[0027] In an optional aspect of the device, the at least one component marking is selected from the group comprising: one or more structural features of at least one part of a component, one or more optical features of at least one part of a component, at least one part of a reference mark on the component, or any combination thereof.

[0028] In an optional aspect of the device, the at least one top-view camera is arranged to take at least one second top-view photograph of the at least one substrate marker at the placement position, and the device is arranged to determine a fourth position and / or orientation of the substrate using the at least one second top-view photograph.

[0029] In an optional aspect of the device, the at least one top-view camera and / or the at least one bottom-view camera are arranged to illuminate at least part of a surface of the component.

[0030] In an optional aspect of the device, the device includes a component loading position, wherein the device is arranged to provide the component at the component loading position, move the component holder to the component loading position to attach the component to the component holder, and move the component holder with the attached component to the component exchange position.

[0031] In an optional aspect of the device, the substrate includes at least one substrate marker.

[0032] In an optional aspect of the device and method, the at least one substrate marking is selected from the group comprising one or more structural features of at least one part of a substrate, one or more optical features of at least one part of a substrate, at least one part of a reference mark on a substrate, or any combination thereof.

[0033] In an optional aspect of the device, the at least one top-view camera is arranged to take at least one second top-view photograph of the at least one substrate marker at the placement position, and the device is arranged to determine a fourth position and / or orientation of the substrate using the at least one second top-view photograph.

[0034] In an optional aspect of the device and method, the component is selected from the group comprising one or more dies, one or more semiconductor packages, one or more chips, one or more flip chips, one or more integrated circuits, one or more further substrates, one or more optical elements, one or more electronic elements, one or more electro-optical elements or any combination thereof.

[0035] In an optional aspect of the device, the device additionally comprises at least one overhead camera arranged to take at least one overhead photograph of at least one part of the gripping surface of the component.

[0036] In an optional aspect of the device, the at least one overhead camera is additionally arranged to take at least one first overhead photograph of a first component marking at the component change position.

[0037] In an optional aspect of the device, the at least one bottom-view camera is arranged to take at least one second bottom-view photograph of a third component marking at the component change position, wherein the device is arranged to determine a positioning error of the component using the at least one second bottom-view photograph and the at least one first bottom-view photograph.

[0038] In an optional aspect of the apparatus and method, the first component marking and the second component marking are physically different, physically similar, physically the same, physically identical, optically different, optically similar, optically the same, optically identical, or a combination thereof.

[0039] Further advantages and features result from the figures, including Fig. 1, showing a schematic cross-section, viewed from one side, of the relevant parts of a device for receiving one or more components and for attaching the one or more components to one or more substrates.

[0040] Further advantages and features result from the figures, including Fig. Figures 2A to 2D show selected steps in a process for receiving a component and placing it on a substrate.

[0041] Further advantages and features result from the figures, including Fig. 3A to 3D, which show selected steps in an improved procedure for receiving a component and for mounting a substrate for attaching the component.

[0042] Further advantages and features result from the figures, including Fig. Figures 4A to 4B show aspects of an improved device for receiving a component prior to placing the component on a substrate.

[0043] Further advantages and features result from the figures, which Fig. Sections 5A to 5B cover aspects of an improved component holder for repositionable attachment to a component. Detailed description

[0044] The figures show a first axis 910, a second axis 920, and a third axis 930 to facilitate the understanding of the different views and parts. The first axis 910 is perpendicular to the second axis 920, and the third axis 930 is perpendicular to both the first axis 910 and the second axis 920. It is assumed that in use, the first axis 910 runs in the Y direction, the second axis 920 in the X direction, and the third axis 930 in the Z direction. Typically, the Y-axis 910 and the X-axis 920 are essentially horizontal, horizontal, or approximately horizontal in use. Functionally, the X-axis 920 and the Y-axis 910 can be interchanged. In use, the Z-axis 930 is typically essentially vertical, vertical, or approximately vertical. To clarify the description of the various components, the figures show the parts in these orientations.To clarify the description of the different components, some relative terms were used, such as top, bottom, upper, side and base, to conform to this convention.

[0045] The device described in this disclosure can be arranged by a person skilled in the art such that it can be operated with different deviations from the orientations and nominal coordinate axes.

[0046] Fig. Figure 1 shows a schematic cross-section, viewed from one side, of relevant parts of a device 100, which is suitable for receiving one or more components 600 at a component exchange position 810, before the one or more components 600 are mounted onto one or more substrates 300 according to one of the methods disclosed herein. In the Fig. In the example shown, the device 100 is suitable for mounting one or more components 600 onto one or more substrates 300 for attachment at a placement position 800 according to one of the methods disclosed herein. In particular, the device 100 is viewed from a plane encompassing the X-axis 920, which nominally has a positive direction from left to right, and the Z-axis 930, which nominally has a positive direction from bottom to top. The Y-axis 910 is nominally shown to have a positive direction out of the drawing, towards the viewer.

[0047] Device 100 can, for example, be a system for holding and placing components (or dies). Device 100 can, for instance, be a bonding fixture for components (or dies). The dies are typically rectangular, but round shapes are also possible.

[0048] It may be advantageous to arrange the device in such a way that it places the one or more components 600 on the one or more substrates 300 with a precision in the micrometer or submicrometer range.

[0049] As described below, the device 100 is configured to determine one or more positioning errors in order to monitor and optionally reduce alignment errors between a component and a substrate after placement. In general, an actual and / or predicted degree of misalignment can be corrected by any suitable means to provide at least a small degree of movement in one or more directions of a component and / or a substrate. One or more of these corrections can be provided at any suitable time, for example, during loading, during unloading, during transfer between stations, during an initial phase of placing a component onto a substrate, and / or after placing a component onto a substrate.In practice, one or more corrections can be made by approximately linear movements along one or more axes 910, 920, 930 and / or by approximately rotating movements around one or more axes 910, 920, 930. Differences in alignment can also be described as differences in inclination.

[0050] The methods and devices presented here for receiving one or more components 600 are not limited to dies – the one or more components 600 can be selected from the group comprising: one or more dies, one or more semiconductor packages, one or more chips, one or more flip chips, one or more integrated circuits, one or more further substrates 300, one or more optical elements, one or more electronic elements, one or more electro-optical elements, or any combination thereof. For example, one component 600 can be mounted on a substrate 300, one or more components 600 can be mounted on a substrate 300, or one component 600 can be mounted on one or more substrates 300.

[0051] The one or more components 600 comprise one or more component markers that can be optically detected, for example, by one or more inspection cameras and are arranged to assist in determining one or more positions and / or orientations of the one or more components 600. The one or more components 600 comprise a mounting surface 601 suitable for attachment to the one or more substrates 300 and an opposing gripping surface suitable for attachment to a gripper 160.

[0052] Preferably, the component change position 810 can include one or more component markings.

[0053] Optionally, the one or more substrates 300 may include at least one substrate marker (or substrate alignment target) that can be detected by one or more inspection cameras and is arranged to assist in determining one or more positions and / or orientations of the one or more substrates 300. The at least one substrate marker may be any suitable object for alignment. For example, a substrate marker may be selected from the group that includes: one or more structural features of at least one part of a substrate 300, one or more optical features of at least one part of a substrate 300, at least one part of a reference mark on a substrate, or any combination thereof.

[0054] Preferably, the placement position 800 can include one or more placement position markers or one or more nominal substrate place markers.

[0055] The one or more substrates 300 can be any object that has at least one fixed surface at a placement position, wherein the fixed surface of the one or more substrates 300 is suitable for receiving the mounting surface 601 of the one or more components 600. The one or more substrates 300 can, for example, be selected from the group comprising: one or more metallic substrates, one or more substrate strips, one or more conductor frames, one or more wafers, one or more other components 600, or any combination thereof. The one or more substrates 300 can also be referred to as one or more media.

[0056] Fig. Figure 1 shows the device 100, which includes a pick-up and placement actuator 150, an optional component feeder (or feeder unit) 120 for providing the one or more components 600, and an optional substrate feeder (or feeder unit) 140 for providing the one or more substrates 300. The optional component feeder unit 120 is located at a component loading position 820 and may include an optional component handling system, such as a wafer, a magazine, a waffle pack, or a belt. A component changer 170 is arranged (in Fig. 1 (not shown), to hold one or more components in a holder (not shown) and to move one or more held components 600 to a component exchange position 810. The substrate feeder 140 is equipped in a placement position 800 for the components.

[0057] Alternatively, the device can also be designed as a bonding device, which includes a bonding head instead of a pickup and placement actuator.

[0058] Fig. Figure 1 shows an example of a pick-up and placement drive comprising a first drive system 210 and a second drive system 220 for the pick-up and placement actuator 150. The second drive system 220 is attached to the first drive system 210 in any suitable manner. Any suitable configuration of the drive can include the device 100. For example, the first drive system 210 can be arranged to move the pick-up and placement actuator 150 positively and negatively along the X-axis 920, and the second drive system 220 can be arranged to move the pick-up and placement actuator 150 positively and negatively along the Y-axis 910, thereby moving the pick-up and placement actuator 150 between the component exchange position 810 and the component placement position 800.

[0059] As in Fig. As shown in Figure 1, the device comprises at least one downward-facing camera 410 (or upward-facing camera) and preferably at least one top-facing camera 510 (or downward-facing camera). In the context of this disclosure, a camera is an optical system arranged to capture an image. In the context of this disclosure, "upward-facing" means that the camera is directed approximately in the positive direction of the Z-axis 930. In the context of this disclosure, "downward-facing" means that the camera is directed approximately in the negative direction of the Z-axis 930.

[0060] The at least one bottom-view camera 410 is arranged to take at least one bottom-view photograph of one or more components 600. In the Fig. In the example shown in Figure 1, the at least one bottom-view camera 410 is arranged to take at least one bottom-view image of a surface of a component 600 at the component change position 810. Preferably, the at least one bottom-view camera 410 can include a light source suitable for illuminating part of a surface of a component 600. Additionally or alternatively, one or more light sources not included in the at least one bottom-view camera 410 can also be provided. It can also be advantageous if the at least one bottom-view camera 410 is provided with a direct light source, and preferably with indirect lighting using one or more light sources not included in the at least one bottom-view camera 410.

[0061] The preferably at least one overhead camera 510 can be arranged such that it takes at least one overhead photograph of one or more components 600. In the Fig. In the example shown in Figure 1, at least one overhead camera 510 is arranged to take at least one overhead photograph of a surface of a component 600 at the component change position 810.

[0062] Preferably, the at least one monitoring camera 510 can include a light source suitable for illuminating part of a surface of a component 600. Additionally or alternatively, one or more light sources not included in the at least one monitoring camera 510 can be provided. It can also be advantageous for the at least one monitoring camera 510 to include a direct light source and preferably for indirect lighting to be provided using one or more light sources not included in the at least one monitoring camera 510.

[0063] Preferably, the at least one overhead camera 510 is arranged to take at least one overhead photograph of a surface of a substrate 300 at the placement position 800 for the component.

[0064] Each camera 410, 510 comprises one or more image sensors (not shown) and one or more optical elements (not shown). The image sensor(s) can employ any suitable optical detection method, for example, CMOS. If necessary, the light paths can be deflected using one or more suitably configured deflecting mirrors (not shown).

[0065] In the Fig. In the example shown, at least one monitoring camera 510 is attached to the recording and placement actuator 150.

[0066] As in Fig. As shown in Figure 1, the pick-up and placement actuator 150 comprises a component gripper 160, which is arranged such that it is detachably attached to the gripper surface 602 of a component 600 during use and maintains this attachment during the movements of the pick-up and placement actuator 150 and / or the gripper 160. The gripper 160 is, for example, vacuum-operated, whereby a certain degree of negative pressure can be used to hold a component 600 in the gripper 160. The gripper 160 is arranged so that it is rotatable about the Z-axis 930.

[0067] In the Fig. In the example shown in Figure 1, the device 100 is arranged such that it provides at least part of a placement process at the placement position 800. During at least part of the placement process, the mounting surface 601 of the one or more components 600 is brought into contact with the one or more substrates 300, so that one or more processing operations can be carried out on at least part of the mounting surface 601. The mounting surface 601 is typically at least part of a mutual area of ​​contact between a component and a substrate.

[0068] In the Fig. In the example shown, the first drive system 210 is arranged to transport the pick-up and placement actuator 150 over relatively long distances, namely from the component exchange position 810, where the pick-up and placement actuator 150 and the gripper 160 pick up a component 600 from the component changer 170, to the placement position 800, where the pick-up and placement actuator 150 and the gripper 160 place the component 600 onto a substrate 300. The requirements for the positional accuracy of the first drive system 210 can be relatively low; a positional accuracy of + / - 2 µm is generally sufficient. In the example shown Fig. In the example shown, the first drive system 210 is designed as a so-called “gantry” with two or more mechanically highly stable axes of motion, two of which enable movements of the receiving and placement actuator 150 along two axes 910, 920 perpendicular to each other.

[0069] Typically, movements of the pick-up and placement actuator 150 along the Z-axis 930 are required to remove a component 600 from the component changer unit 170 and to place the component 600 in an intended placement position on a substrate 300. This movement along the Z-axis 930 can be achieved in various ways, for example, by providing the first drive system 210 with a third, stable or highly stable axis of motion, arranged to enable movement along the Z-axis 930 of the pick-up and placement actuator. Additionally or alternatively, the second drive system 220 can be equipped with an additional, high-precision drive, arranged to provide movements of the pick-up and placement actuator 150 along the Z-axis 930.Additionally or alternatively, the picking and placement actuator 150 can include a high-precision drive arranged to provide movements of the gripper 160 along the Z-axis 930. The device 100 can include one, two, or all three of the aforementioned axes of motion / drives for movements along the Z-axis 930.

[0070] In the Fig. In the example shown, the second drive system 220 is arranged to move the pickup and placement actuator 150 between the machining positions and also to enable highly precise corrective movements of the pickup and placement actuator 150 in two different directions 910, 920.

[0071] In the Fig. In the example shown, the picking and placement actuator 150 preferably comprises a drive for rotating the component gripper 160 about the Z-axis 930.

[0072] Additionally or alternatively, the component changer 170 can be arranged to rotate one or more components 600 around the Z-axis 930 to reduce or eliminate at least one degree of angular error.

[0073] Additionally or alternatively, the substrate feeding device 140 can be arranged to rotate one or more substrates 300 around the Z-axis 930 to reduce or eliminate at least one degree of angular error.

[0074] In the Fig. In the example shown, the range of motion of the second drive system 220 is typically small or very small compared to the range of motion of the first drive system 210. The second drive system 220 is arranged to move the pick-up and placement actuator 150 to one or more machining positions and is arranged to provide highly precise corrective movements of the pick-up and placement actuator 150 in two different directions 910, 920.

[0075] The one or more components 600 comprise a first surface, which is created using the in Fig. The first surface is nominally described as the upper surface. It is suitable for being detachably attached to the gripper 160 and is therefore also referred to as the gripper surface 602. The one or more components 600 comprise a second surface, which is formed using the orientations described in Fig. The first orientation is nominally referred to as the base surface. The second surface is suitable for attachment to a substrate and is therefore also referred to as the mounting surface 601. The second surface is suitable for detachable attachment to the component holder 130.

[0076] The device 100 is arranged such that in the component change position 810 it moves a component 600, which is attached to the gripper 160, away from the holder 130 along the Z-axis 930.

[0077] The above in relation to Fig. The device 100 described herein and all variants and embodiments described herein are suitable for carrying out the improved methods disclosed herein.

[0078] Fig. Figures 2A to 2D show selected steps of a process for picking up a component and mounting the component onto a substrate. The in Fig. The device shown in 1 can be modified to perform the method using modified components and modules. Fig. Components and modules 2A to 2D with the same reference symbols function similarly to the corresponding components and modules in Fig. 1, but are not identical. The modules and components in Fig. Sections 2A to 2D are shown in a schematic cross-section, viewed from one side, during the assembly and placement process. Specifically, the components and modules are viewed from a plane defined by the X-axis (920), which nominally has a positive direction from left to right, and the Z-axis (930), which nominally has a positive direction from bottom to top. The Y-axis (910) is nominally shown with a positive direction extending out of the drawing, towards the viewer.

[0079] As in Fig. As shown in Figure 2A, a component changer 9170 holds a component 600 on a component holder 9130 in a component change position 9810. At the component change position 9810, a monitoring camera 9510 is used to take a picture of the component 600, which is located within the field of view 9515 of the monitoring camera 9510. The image is then used to determine the position of the component 600.

[0080] After the recording has been made, the recording and placement actuator 150 can be moved to the component change position 9810.

[0081] As in Fig. As shown in Figure 2B, the pick-up and placement actuator 150 is positioned such that the gripper 160 faces component 600 and is located near component 600. As shown in Fig. As shown in Figure 2B, the pickup and placement actuator 150 is attached to component 600 at component exchange position 9810.

[0082] After the gripper 160 is attached to the component 600, the component holder 9130 releases the component 600 again.

[0083] As in Fig. As shown in Figure 2C, the pickup and placement actuator 150 is moved away from the component holder 9130, while the component 600 is held by the gripper 160, thus creating space for the further movement of the component 600 to the placement position 800.

[0084] Once sufficient clearance has been created, the pickup and placement actuator 150 and component 600 can be moved into the placement position 800.

[0085] As in Fig. As shown in 2D, the device 100 provides a substrate 300, which is brought into the placement position 800. As shown in Fig. As shown in 2D, the pickup and placement actuator 150 is movable such that component 600 is located near substrate 300. As shown in Fig. Shown in 2D, component 600 is loaded by gripper 160, which releases component 600 at placement position 800.

[0086] One disadvantage of the picking process is that significant displacement errors that occur when attaching component 600 to gripper 160 are not detected or measured during the picking steps. Significant displacement errors can be as high as a few micrometers. For example, significant displacement errors can be as high as five micrometers (µm). This often leads to an undetected alignment error between component 600 and substrate 300 at placement position 800. In other words, before placement, an undetected position and / or alignment error can occur between component 600 and substrate 300 at placement position 800.

[0087] To reduce the risk of undetected alignment errors, improved acquisition methods are described here. These improved alignment methods can also reduce the magnitude of undetected alignment errors. For example, significant displacement errors can be reduced to less than one micrometer (µm). For example, significant displacement errors can be reduced to less than 500 nanometers (nm). For example, significant displacement errors can be reduced to approximately 100 nm to 500 nm.

[0088] Fig. Figures 3A to 3D show selected steps from an improved procedure. The in Fig. The device shown in Figure 1 is suitable for carrying out the improved method for receiving a component 600 and for loading a substrate 300. The device shown in Figure 1 is suitable for carrying out the improved method for receiving a component 600 and for loading a substrate 300. Fig. Components and modules shown in sections 3A to 3D with the same reference symbols function in the same way as the corresponding components and modules in [section name missing]. Fig. 1. The modules and components in Fig. Sections 3A to 3D are shown in a schematic cross-section, viewed from one side, during the recording and placement process. Specifically, the components and modules are viewed from a plane encompassing the X-axis (920), which nominally has a positive direction from left to right, and the Z-axis (930), which nominally has a positive direction from bottom to top. The Y-axis (910) is nominally shown to have a positive direction out of the drawing, towards the viewer.

[0089] As in Fig. As shown in Figure 3A, the component changer 170 holds a component 600 on a receiving surface 131 of the component holder 130 at the component change position 810. The receiving surface 131 of the component holder 130 is suitable for receiving and holding at least part of the mounting surface 601 of the component 600. In the Fig. In the example shown in 3A, the mounting surface 601 of component 600 is received by the receiving surface 131 of component holder 130. In the example shown in Fig. In the example shown in 3A, the component holder 130 comprises a rear surface 132 which is arranged so that it is opposite the receiving surface 131.

[0090] In the Fig. In the example shown in 3A, at least one overhead camera 510 is arranged to take at least one overhead photograph of at least a part of the gripping surface 602 of component 600 at the component change position 810. In the example shown in Fig. In the example shown in Figure 3A, at least one overhead camera 510 is used to take at least one first overhead photograph 710 of a first component marking that includes the component 600. The at least one first overhead photograph 710 can preferably be used to determine a positioning error of the component 600. The at least one first overhead photograph 710 can preferably be used to determine a first position and / or orientation of the component 600.

[0091] In the Fig. In the example shown in 3A, at least one bottom-view camera 410 is arranged to take at least one bottom-view image of at least a part of the mounting surface 601 of component 600 at the component change position 810. In the example shown in Fig. In the example shown in Figure 3A, the at least one bottom-view camera 410 is used to take at least one first bottom-view image 720 of a second component marking that includes the component. The at least one first bottom-view image 720 is then used to determine a positioning error of the component 600. The at least one first bottom-view image 720 can preferably be used to determine a second position and / or orientation of the component 600.

[0092] Any suitable component mark can be used. For example, one or more marks from the group that includes: one or more structural features of at least one part of component 600, one or more optical features of at least one part of component 600, at least part of a reference point on a component, or any combination thereof. The structural features can include, for example, one or more edges, one or more corners, or one or more facets. A second component mark can, for example, include at least part of an edge, such as a saw edge. Component marks can be physically different, physically similar, physically the same, physically identical, optically different, optically similar, optically the same, optically identical, or a combination thereof.For example, the same physical component marking may be considered as several different component markings when viewed under one or more different optical arrangements and / or orientations.

[0093] It can be advantageous if a second component marking and a third component marking include at least part of an active chip structure contained in the gripper surface 602 of a component, as this can achieve higher accuracy.

[0094] In the Fig. In the example shown in 3A, the component changer 170 is arranged such that the at least one overhead camera 510 is directed towards the recording surface 131 of the component holder 130.

[0095] In the Fig. In the example shown in 3A, the component changer 170 is arranged such that the at least one overhead camera 510 faces the gripper surface 602 of the component 600, and one or more overhead photographs are taken of one or more first component markings.

[0096] At the in Fig. In the example shown in 3A, the component changer 170 is arranged such that the at least one under-view camera 410 faces the rear surface 132 of the component holder 130.

[0097] In the Fig. In the example shown in 3A, the component holder 130 is arranged such that the at least one under-view camera 410 faces at least a part of the mounting surface 601 of the component 600, thereby taking one or more under-view photographs of one or more second component markings.

[0098] For example, one or more radiation windows (not shown) can be provided in the component holder 130 and arranged so that an illumination radiation can extend between the receiving surface 131 and the rear surface 132 of the component holder.

[0099] For example, a component holder can be a transparent plate, such as a glass plate, with vacuum holes, thus providing relatively large radiation windows. This can be advantageous because it allows a certain degree of simultaneous surface inspection.

[0100] The one or more radiation windows can be located, for example, at one or more corners of a component. The one or more radiation windows can also be positioned, for example, approximately in the middle of one or more sides of a component.

[0101] After the device has taken at least one first bottom-view image 710 and at least one first bottom-view image 720, it moves the pickup and placement actuator 150 to the component change position 810. Preferably, predefined relative positions and / or orientations between the pickup and placement actuator 150 and the top-view camera 510 can be used to influence the accuracy of the movement. Additionally or alternatively, the at least one first top-view image 710 can be used to determine a first top-view position and / or orientation of the component 600 to influence the accuracy of the movement.

[0102] As in Fig. As shown in Figure 3B, the pick-up and placement actuator 150 is positioned such that the gripper 160 faces the gripper surface 602 of component 600 and that the gripper 160 is located near the gripper surface 602 of component 600. As shown in Fig. As shown in Figure 3B, the gripper 160 is attached to the gripper surface 602 of component 600 at component change position 810.

[0103] After the gripper 160 is attached to the gripping surface 602 of the component 600, the receiving surface 131 of the component holder 130 releases the mounting surface 601 of the component 600 again.

[0104] As in Fig. As shown in Figure 3C, the pick-up and placement actuator 150 is movable along the Z-axis 930 away from the component holder 130 and from the pick-up surface 131 of the component holder 130, while the component 600 is held by the gripper 160. After being released by the component holder 130 and moving along the Z-axis 930, the component 600 is also positioned in a further inspection position 932. In the Fig. In the example shown in Figure 3C, the mounting surface 601 of component 600 is positioned at a further inspection position 932. ... Fig. In the example shown in Figure 3C, the mounting surface 601 of component 600 is held within a field of view 415 of at least one under-view camera 410. In the example shown in Fig. In the example shown in Figure 3C, a position of close proximity between the mounting surface 601 of component 600 and the receiving surface 131 of holder 130 is maintained while at least one second underside view 730 is taken. For the purposes of this disclosure, "close proximity" means that the average distance between the mounting surface 601 of component 600 and the receiving surface 131 of holder 130 can be in the range of 10 to 200 µm.

[0105] At the component exchange position 810, the underview camera 410 is used to take at least one second underview photograph 730 of the third component marking at the further inspection position 932.

[0106] It may be advantageous to arrange the further inspection position 932 of component 600 such that the mounting surface 601 of component 600 is held in an optimal imaging range of the under-view camera 410, for example to inspect the Fig. 3A shows at least one initial underside view 720 and the one in Fig. Figure 3C shows the use of at least one second bottom-view image 730. This allows for a higher degree of accuracy, as differences in optical paths and optical configurations are reduced when comparing the positions and / or orientations of the third component marking with the positions and / or orientations of the second component marking. Additionally or alternatively, the focus of the bottom-view camera 410 can be adjusted to capture the at least one second bottom-view image 730 of the third component marking within an optimal imaging area. Preferably, the third component marking and the second component marking can share one or more of the same structural features of a component, for example, one or more edges.Additionally or alternatively, the third component marking and the second component marking can have one or more of the same optical properties of the component. Additionally or alternatively, the third component marking and the second component marking can cover the same surface of a component. Additionally or alternatively, the third component marking and / or the second component marking can be located in the mounting surface 601 of component 600.

[0107] The at least one second underside view 730 is used together with the at least one first underside view 720 to determine a positioning error of the component 600. For example, a second position and / or orientation of the component 600 can be determined using the at least one first underside view 720. Similarly, a third position and / or orientation of the component 600 can be determined using the at least one second underside view 730. For example, the positioning error of the component 600 can be determined using the third position and / or orientation in conjunction with the second position and / or orientation.The positioning error of component 600 corresponds to a difference between the second component position (attached to component holder 130) and the third component position (attached to gripper 160 after being released from component holder 130), which is caused by a component displacement when being released from component holder 130.

[0108] Additionally or alternatively, the following can be used after the in Fig. The positioning errors of component 600 shown in step 3C are at least partially corrected before component 600 is placed on substrate 300 at placement position 800.

[0109] Preferably, the correction, at least partially, can be maintained for one or more subsequent components. For example, the positioning error of component 600 can be corrected, at least partially, by changing one or more suitable positions and / or orientations selected from the group that includes: a rotation of component 600, a displacement of component 600, a tilt of component 600, a rotation of substrate 300, a displacement of substrate 300, a tilt of substrate 300, a rotation of the pick-up and placement actuator 150, a displacement of the pick-up and placement actuator 150, a tilt of the pick-up and placement actuator 150, a rotation of gripper 160, a displacement of gripper 160, a tilt of gripper 160, or any combination thereof.Additionally or alternatively, an expected positioning error of a subsequent component can be at least partially corrected by changing one or more suitable positions and / or orientations from the group that includes: a rotation of the component holder 130, a displacement of the component holder 130, a tilt of the component holder 130 or any combination thereof.

[0110] Preferably, the device moves the picking and placing actuator 150 further away from the component holder 130, while the component 600 is held by the gripper 160, when the distance for further movement according to the Fig. The step shown in 3C is too small. Once sufficient distance has been created, the pickup and placement actuator 150 and the component 600 can be moved by the device into the placement position 800.

[0111] As in Fig. As shown in 3D, the device 100 provides a substrate 300 to load the placement position 800. As shown in Fig. As shown in 3D, the device moves the pickup and placement actuator 150 so that the mounting surface 601 of component 600 is located near the substrate 300 and / or the placement position 800, optionally correcting at least some or all positioning errors of component 600. As shown in Fig. As shown in 3D, the device 100 then loads the mounting surface 601 of the component 600 on the substrate 300 by the gripper 160 releasing the gripper surface 602 of the component 600 at the placement position 800.

[0112] In the Fig. 4A and Fig. The example shown in 4B illustrates aspects of an improved device, as described in Fig. 1 is shown, depicted. The in Fig. 4A and Fig. The components and modules shown in section 4B with the same reference symbols function in the same way as the corresponding components and modules in section 4B. Fig. 1 and Fig. 3A to 3D. In which in Fig. The examples shown in 4A to 4B also include optional process steps that can be performed before the one described above. Fig. The step shown in 3A can be carried out to provide a component 600, which is held on a receiving surface 131 of the component holder 130 at the component exchange position 810. The components and modules in Fig. 4A to 4B are shown in a schematic cross-section, viewed from one side, during component loading and before component changes. Specifically, the components and modules are viewed from a plane encompassing the X-axis 920, which nominally has a positive direction from left to right, and the Z-axis 930, which nominally has a positive direction from bottom to top. The Y-axis 910 is nominally shown to have a positive direction out of the drawing, towards the viewer.

[0113] As in Fig. As shown in Figure 4A, the component changer 170 is arranged to receive a component 600 at the component loading position 820 from a preferably existing component feeder 120, and is arranged to hold the component 600 on the component holder 130.

[0114] As in Fig. As shown in Figure 4B, the component changer 170 is arranged such that it holds the component 600 on the component holder 130 at the component change position 810 and is arranged such that it releases the component 600 again from the receiving and placement actuator (not shown). Preferably, the component feeder 120 can be arranged such that it holds and releases the component. Any suitable component changer 170 can be arranged in the Fig. The device shown in 1 can be used.

[0115] In the Fig. 4A and Fig. In the example shown in Figure 4B, a component changer 170 of the "flip-unit" type can be provided, comprising a component holder 130, which includes a means (not shown) for changer rotation 240 in both directions about the first axis (Y-axis) 910, and a changer element 175 that connects the component holder 130 to the means for changer rotation (not shown). In the example shown in Figure 4B, the component changer 170 is a component changer 170 of the "flip-unit" type. Fig. 4A and Fig. In the example shown in 4B, the component changer 170 is arranged such that it is positioned between the in Fig. 4A component loading position 820 and the one shown in Fig. The component change position 810 shown in 4B rotates about a semicircle clockwise and counterclockwise.

[0116] In the Fig. In the example shown in 4A, the component changer 170 has been rotated 240° counterclockwise around the first axis (Y) 910, the receiving surface 131 of the component holder 130 has been moved close to the mounting surface 601 of the component 600, and the mounting surface 601 of the component 600 has been attached to the receiving surface 131 of the component holder 130.

[0117] After component 600 is picked up at component loading position 820, the component changer 170 rotates clockwise around the first axis (Y) 910 to component change position 810.

[0118] In the Fig. In the example shown in 4B, the component changer 170 holds the component 600 on the receiving surface 131 of the component holder 130 in the component change position 810. In the example shown in Fig. In the example shown in 4B, the component changer 170 is arranged such that the at least one bottom-view camera 410 faces the rear surface 132 of the component holder 130. In the example shown in Fig. In the example shown in 4B, the mounting surface 601 of component 600 is held within a field of view 415 of at least one under-view camera 410. In the example shown in Fig. In the example shown in 4B, at least one bottom-view camera 410 is directed towards at least a part of the mounting surface 601 of component 600, thereby taking one or more bottom-view photographs of one or more second component markings. In the example shown in Fig. In the example shown in 4B, one or more radiation windows (not shown) are provided in the component holder 130 and are arranged to allow illumination radiation to extend between the receiving surface 131 and the rear surface 132 of the component holder 130.

[0119] After holding component 600 on the receiving surface 131 of component holder 130 at component exchange position 810, the Fig. The component changer 170 shown in 4B is suitable for the steps of the process described in Fig. to carry out the improved procedures shown in 3A to 3D and described above. In particular, the procedure shown in Fig. Component changers 170 shown in 4A to 4B for carrying out the operation described in Fig. The step shown in 3C is suitable, wherein the mounting surface 601 of component 600 is held at the further inspection position (not shown) while at least one second underside view (not shown) is taken. The in Fig. The component changer 170 shown in 4A to 4B is for carrying out the operation described in Fig. 3C shown step suitable, wherein the mounting surface 601 of component 600 is held in a field of view 415 of the at least one under-view camera 410.

[0120] Fig. 5A and Fig. Figure 5B shows aspects of an improved component holder 130 for releasable attachment to a component. This is shown in Fig. 5A and Fig. The example shown in 5B is for use in the [document / project / etc.]. Fig. The component changer 170 shown in 3A to 3D is suitable. Fig. 5A and Fig. The components and modules shown in section 5B with the same reference symbols function in the same way as the corresponding components and modules in section 5B. Fig. 1, Fig. 3A to 3D and Fig. 4A and Fig. 4B. The one in Fig. 5A and Fig. The example shown in 5B is for use in the [document / project / etc.]. Fig. 4A and Fig. The component changer shown in 4B is suitable for 170. The modules and components in Fig. 5A and Fig. 5B are shown in a schematic view from top to bottom. Specifically, the components and modules are viewed from a plane encompassing the X-axis 920, which nominally has a positive direction from left to right, and the Y-axis 910, which nominally has a positive direction from top to bottom. The Z-axis 930 is nominally shown as having a positive direction out of the drawing, towards the viewer.

[0121] In the Fig. In the example shown in 5A, the mounting surface 131 of the component holder 130 is shown in the drawing plane without a component (not shown). In the example shown in Fig. The example shown in Figure 5A illustrates the extent of a component holding area 137, which is provided to receive a component (not shown) and detachably attach it to another component (not shown), wherein the extent of the component holding area 137 is predefined and / or controlled to correspond to the expected dimensions and orientations of the components to be received (not shown). In the example shown in Fig. In the example shown in Figure 5A, the component holder 130 also includes one or more radiation windows 135, which are arranged such that an illumination radiation extends between the receiving surface 131 and the rear surface (not shown) of the component holder 130. In the example shown in Figure 5A, the component holder 130 is further divided into two sections. Fig. In the example shown in 5A, the one or more radiation windows 135 are at least partially arranged in the component holding area 137. In the example shown in Fig. In the example shown in 5A, one or more radiation windows 135 are provided near a position where a corner of a component (not shown) is expected to be positioned during use. In the example shown in Fig. In the example shown in 5A, one or more radiation windows 135 are provided at positions where an edge of a component (not shown) is expected to be positioned in use.

[0122] In the Fig. In the example shown in Figure 5A, at least one under-view camera (not shown) is positioned directly behind the component holder 130, and the extent of a field of view 415 of the at least one under-view camera (not shown) is also shown. In the example shown in Fig. In the example shown in 5A, one or more radiation windows 135 are arranged at least partially within the field of view 415 of the at least one under-view camera (not shown). In the example shown in Fig. In the example shown in 5A, the one or more radiation windows 135 are arranged essentially within the field of view 415 of the at least one under-view camera (not shown). In the example shown in Fig. In the example shown in 5A, one or more radiation windows 135 are arranged completely within the field of view 415 of the at least one under-view camera (not shown). In the example shown in Fig. In the example shown in Figure 5A, the extent of the component holding area 137 is at least partially arranged within the field of view 415 of the at least one under-view camera (not shown). In the example shown in Fig. In the example shown in Figure 5A, the extent of the component holding area 137 is essentially located within the field of view 415 of the at least one under-view camera (not shown). In the example shown in Fig. In the example shown in Figure 5A, the field of view 415 of the at least one under-view camera (not shown) is arranged symmetrically around the extent of the component holding area 137. In the example shown in Fig. In the example shown in Figure 5A, the extent of the component holding area 137 is completely arranged within the field of view 415 of the at least one under-view camera (not shown). In the example shown in Fig. In the example shown in 5A, the field of view 415 of the at least one under-view camera (not shown) is arranged such that it encloses at least part of the component holding area 137.

[0123] The in Fig. The example shown in 5B is the same as the one in Fig. 5A shown, with the exception of the following five differences: Difference 1: A component 600 is shown, which is attached to the mounting surface 131; Difference 2: Component 600 is shown in the component holding area (not shown); Difference 3: the component 600 is shown with the negative Y / negative X corner near one or the other radiation window 135; Difference 4: Component 600 is shown with part of the negative X-edge in one or the other radiation window 135; and Difference 5: the component 600 is shown with part of the negative Y-edge in one or the other radiation window 135.

[0124] Preferably, the component holder can include 130 means for releasing and / or retaining a component, for example channels and a vacuum supply.

[0125] Preferably, the component holder 130 can be arranged in such a way that it is suitable for one or more component dimensions and / or one or more component orientations.

[0126] Preferably, the one or more radiation windows 135 can be arranged such that they are located in the component holding area 137.

[0127] Preferably, the one or more radiation windows 135 can comprise one or more openings.

[0128] Preferably, the one or more radiation windows 135 can comprise one or more areas that are at least partially transparent to illumination radiation, for example, glass or plastic windows in a metal component holder 130. Alternatively, one or more radiation windows made of opaque material can be provided.

[0129] Preferably, the viewing field 415 of the at least one under-view camera (not shown) can be arranged such that it encloses part of the component holding area 137.

[0130] Preferably, the viewing field 415 of the at least one under-view camera (not shown) can be arranged such that it encloses part of the component holding area 137.

[0131] Preferably, at least a part of one or more radiation windows 135 can be provided at symmetrical positions in the component holding area 137.

[0132] Preferably, at least a part of one or more radiation windows 135 can be provided at asymmetric positions in the component holding area 137.

[0133] Preferably, the one or more radiation windows 135 can be provided at positions located near places where a plurality of corners of a component (not shown) are to be positioned during use.

[0134] Preferably, the one or more radiation windows 135 can be provided at locations where a plurality of edges of a component (not shown) are to be positioned during use.

[0135] In summary, a method and a device for determining a positioning error of a pick-up component are provided, wherein the device 100 comprises a component holder 130 for detachable attachment to the component 600, wherein the method comprises the use of an under-view camera 410 at a component change position to create a first image 720 of a first component mark, attaching the component to a gripper 160, releasing the component, using the under-view camera to create a second image 730 of a second component mark, and determining a position error using the second image with the first image.

[0136] Determining positional errors based on corresponding component markings can increase the accuracy of error detection. This can be advantageous when sampling components with inaccurate markings, such as chips with rough, irregular edges due to imprecise sawing. This can be beneficial for flip-chip components.

[0137] Preferably, the device can be preconfigured during one or more steps of the methods presented here to perform one or more predetermined operations in order to improve throughput. Additionally or alternatively, the device can be preconfigured to control one or more operations for use.

[0138] This disclosure describes many functions and features that include, are attached to, or are associated with a pick-up and placement actuator, but these should be considered only as examples. A person skilled in the art may design and arrange one or more of these functions and features so that they are only partially included in, attached to, or connected to a pick-up and placement actuator.

[0139] In the present embodiments, one or more positioning errors can be determined using one or more images. However, all embodiments described and presented here can also be provided by using any suitable form of position detection and / or acquisition, for example, image analysis, line scanning, or position detection. Similarly, in the present embodiments, one or more images can be acquired using one or more cameras. However, all embodiments described and presented here can also provide similar advantages by providing any optical system or a position detection or acquisition device, for example, a camera, a line scanner, or a position-sensitive device (PSD).

[0140] For example, one or more downward-facing cameras can be positioned at an approximate angle of 90 degrees, with reflectors, such as mirrors, provided to redirect the optical path.

[0141] For example, one or more under-view cameras can be positioned with two or more 45-degree reflectors, such as mirrors, to arrange the one or more overhead cameras as one or more under-view cameras.

[0142] For example, one or more overhead cameras can be positioned at an approximate angle of 90 degrees, with reflectors, such as mirrors, provided to redirect the optical path.

[0143] For example, one or more downward-facing cameras can be positioned with two or more 45-degree reflectors, such as mirrors, to arrange the one or more downward-facing cameras as one or more overhead cameras. Reference symbol list 100 Device for receiving and loading 120 Feeding device or feeding unit for components 130 component holders 131 recording area 132 rear surface 135 radiation windows 137 Component holding area 140 Substrate feeding device or feeding unit 150 Pickup and Placement Actuator 160 component grippers 170 component changers 175 Changer element 210 first drive system 220 second drive system 240 changer rotation 300 substrate 410 Under-view camera 415 Field of view of the under-view camera 510 overhead camera 515 Field of view of the overhead camera 520 optical axis of a monitoring camera 600 components 601 Mounting surface 602 Gripping area 710 first supervisory recording 720 first underside view 730 second underside view 800 Component placement position 810 Component change position 820 Component loading position 910 first axis (Y) 920 second axis (X) 930 third axis (Z) 932 also inspection position 9130 Component holder 9170 Component changer 9510 Surveillance camera 9515 Field of view of the overhead camera 9810 Component change position

Claims

Method for determining a positioning error of a receptable component (600) before the component (600) is mounted on a substrate (300), using a device (100), wherein: the component (600) comprises one or more component markings; and the component (600) comprises a mounting surface (601) suitable for attachment to the substrate (300) and a gripping surface (602) arranged opposite the mounting surface (601); the device (100) comprises: a receiving and placement actuator (150) arranged so that it can be used at a placement position (800) and at a component exchange position (810), wherein the receiving and placement actuator (150) comprises a gripper (160) for releasable attachment to the gripping surface (602) of the component (600); a component holder (130) for releasable attachment to the mounting surface (601) of the component (600);and at least one bottom-view camera (410) arranged to take at least one bottom-view image of at least part of the mounting surface (601) of the component (600); the method comprises: attaching the mounting surface (601) of the component (600) to the component holder (130); moving the component holder (130) with the attached component (600) to the component change position (810); using the at least one bottom-view camera (410) at the component change position (810) to take at least one first bottom-view image (720) of a first component mark; moving the pick-up and placement actuator (150) to the component change position (810); attaching the gripping surface (602) of the component (600) to the gripper (160) and releasing the mounting surface (601) of the component (600) from the component holder (130);Using the at least one bottom-view camera (410) at the component exchange position (810) to take at least one second bottom-view photograph (730) of a second component mark; and determining a positioning error of the component (600) using the at least one second bottom-view photograph (730) and the at least one first bottom-view photograph (720). Method according to claim 1, wherein the device (100) comprises: at least one top-view camera (510) arranged to take at least one top-view photograph of at least one part of the gripping surface (602) of the component (600); wherein the method comprises: using the at least one top-view camera (510) at the component change position (810) to take at least one first top-view photograph (710) of a third component marking. Method according to a preceding claim, wherein the method comprises: providing the substrate (300) to the placement position (800); moving the pick-up and placement actuator (150) to the placement position (800) with the attached component (600); and placing the component (600) onto the substrate (300) at the placement position (800). A method according to any of the preceding claims, wherein the method comprises at least a partial correction of the positioning error of the component (600) by changing one or more positions and / or orientations selected from the group comprising: a rotation of the component (600), a displacement of the component (600), a tilt of the component (600), a rotation of the substrate (300), a displacement of the substrate (300), a tilt of the substrate (300), a rotation of the pick-up and placement actuator (150), a displacement of the pick-up and placement actuator (150), a tilt of the pick-up and placement actuator (150), a rotation of the gripper (160), a displacement of the gripper (160), a tilt of the gripper (160), a rotation of the component holder (130), a displacement of the component holder (130), a tilt of the component holder (130), or any combination thereof. A method according to any of the preceding claims, wherein the device (100) comprises a component loading position (820), the method comprising: providing the component (600) at the component loading position (820); moving the component holder (130) to the component loading position (820); attaching the component (600) to the component holder (130); and moving the component holder (130) with the attached component (600) to the component exchange position (810). Method according to a preceding claim, wherein the substrate (300) comprises at least one substrate marking (340). The method of claim 6, wherein the method comprises: using the at least one top-down camera (510) at the placement position (800) to take at least one second top-down view of a section of the substrate (300) and / or at least one substrate marker (340); and determining a fourth position and / or orientation of the substrate (300) using the at least one second top-down view. Device (100) for receiving a component (600) before the component (600) is mounted on a substrate (300), wherein: the component (600) comprises one or more component markings; and the component (600) comprises a mounting surface (601) suitable for attachment to the substrate (300) and a gripping surface (602) arranged opposite the mounting surface (601); the device (100) comprises: a receiving and placement actuator (150) arranged at a placement position (800) and at a component exchange position (810), the receiving and placement actuator (150) comprising a gripper (160) for releasable attachment to the gripping surface (602) of the component (600); a component holder (130) for releasable attachment to the mounting surface (601) of the component (600);and at least one bottom-view camera (410) arranged to take at least one bottom-view image of at least a part of the mounting surface (601) of the component (600); wherein the device (100) is arranged to attach the mounting surface (601) of the component (600) to the component holder (130) and is arranged to move the component holder (130) with the attached component (600) to the component change position (810); wherein the at least one bottom-view camera (410) is arranged to take at least one first bottom-view image (720) of a first component mark at the component change position (810); wherein the device (100) is arranged to move the pickup and placement actuator (150) to the component change position (810);wherein the device (100) is arranged to attach the gripping surface (602) of the component (600) to the gripper (160) and to release the mounting surface (601) of the component (600) from the component holder (130); wherein the at least one bottom-view camera (410) is arranged to take at least one second bottom-view image (730) of a second component marking at the component change position (810); and wherein the device (100) is arranged to determine a positioning error of the component (600) using the at least one second bottom-view image (730) and the at least one first bottom-view image (720). Device (100) according to claim 8, wherein the device (100) comprises: at least one top-view camera (510) arranged to take at least one top-view photograph of at least one part of the gripping surface (602) of the component (600); wherein the at least one top-view camera (510) is arranged to take at least one first top-view photograph (710) of a third component marking at the component change position (810). Device (100) according to one of claims 8 to 9, wherein the component holder (130) comprises: a receiving surface (131) with a component holding area (137), wherein the component holding area (137) is suitable for receiving and holding at least a part of the mounting surface (601) of the component (600); a rear surface (132) arranged as a surface opposite the receiving surface (131); one or more radiation windows (135) arranged such that an illumination radiation can extend between the receiving surface (131) and the rear surface (132); wherein the at least one bottom-view camera (410) is arranged to take the at least one first bottom-view image (720) and / or the at least one second bottom-view image (730) using illumination radiation extending between the receiving surface (131) and the rear surface (132). Device (100) according to claim 10, wherein the one or more radiation windows (135) comprise one or more openings and / or one or more areas that are at least partially transparent to illumination radiation. Device (100) according to one of claims 10 to 11, wherein the one or more radiation windows (135) are arranged at least partially in the component holding area (137). Device (100) according to any one of claims 8 to 12, wherein at least one component marking is selected from the group comprising: one or more structural features of at least one part of a component (600), one or more optical features of at least one part of a component (600), at least one part of a reference point on the component (600) or any combination thereof. Device (100) according to one of claims 8 to 13, wherein the device (100) is arranged such that: the substrate (300) is made available to the placement position (800); the receiving and placement actuator (150) with the attached component (600) is moved into the placement position (800); and the component (600) is mounted on the substrate (300) at the placement position (800). Device (100) according to one of claims 8 to 14, wherein the first component marking and the second component marking have one or more of the same structural features of the component (600) and / or one or more of the same optical features of the component (600) in common. Device (100) according to one of claims 9 to 15, wherein the at least one top-view camera (510) and / or the at least one bottom-view camera (410) are arranged such that they illuminate at least a part of a surface of the component (600). Device (100) according to one of claims 8 to 16, wherein the device (100) comprises a component loading position (820), wherein the device (100) is arranged such that the component (600) is made available to the component loading position (820), that the component holder (130) is moved to the component loading position (820) in order to attach the component (600) to the component holder (130) and to move the component holder (130) with the attached component (600) to the component exchange position (810). Device (100) according to one of claims 9 to 17, wherein the substrate (300) comprises at least one substrate marking (340). Device (100) according to claim 18, wherein the at least one substrate marking (340) is selected from the group comprising: one or more structural features of at least one part of a substrate (300), one or more optical features of at least one part of a substrate (300), at least one part of a reference point on a substrate (300) or any combination thereof. Device (100) according to one of claims 18 to 19, wherein: the at least one top-view camera (510) is arranged to take at least one second top-view photograph of the at least one substrate marking (340) at the placement position (800); and the device (100) is arranged to determine a fourth position and / or orientation of the substrate (300) using the at least one second top-view photograph. Device (100) according to any one of claims 8 to 20, wherein the component (600) is selected from the group comprising: one or more dies, one or more semiconductor packages, one or more chips, one or more flip chips, one or more integrated circuits, one or more further substrates (300), one or more optical elements, one or more electronic elements, one or more electro-optical elements or any combination thereof. Device (100) according to one of claims 8 to 21, which additionally comprises at least one top-view camera (510) arranged such that it takes at least one top-view photograph of at least one part of the gripping surface (602) of the component (600). Device (100) according to one of claims 8 to 22, wherein the at least one overhead camera (510) is additionally arranged to take at least one first overhead photograph (710) of a first component marking at the component change position (810). Device (100) according to any one of claims 8 to 23, wherein the at least one under-view camera (410) is arranged to take at least one second under-view image (730) of a third component marking at the component change position (810); and wherein the device (100) is arranged to determine a positioning error of the component (600) using the at least one second under-view image (730) and the at least one first under-view image (720). Device (100) according to any one of claims 8 to 24, wherein the first component marking and the second component marking are physically different, physically similar, physically the same, physically identical, optically different, optically similar, optically the same, optically identical or a combination thereof.

Images