Component holder with temperature control function

Abstract

Component holder (1) for processing a component comprising a carrier (100), a component holding tool (300) with a component contact surface (350) and a temperature control device (200) for thermally shielding one or more areas of the component contact surface (350) of the component holding tool (300) from the carrier (1) relative to a predetermined process temperature.

Description

Technical area

[0001] The invention relates to a component holder with a temperature control function according to the features of claim 1 and its use according to the features of claim 22. State of the art

[0002] Component holders are known from the state of the art for mounting components in a wide variety of shapes for a wide variety of applications. Component holders are typically used in the manufacture of electrical components or assemblies for mounting semiconductor chips on substrates. The use of component holders in thermal assembly processes such as soldering or bonding is problematic. Due to the different masses of the component holder and the component to be held, strong temperature gradients arise, which have a negative impact on the assembly processes.

[0003] It is also known from the prior art that electrical components made of materials with a positive temperature coefficient, so-called PTC elements, are frequently used in protective circuits, particularly as fuses. Their electrical resistance increases as the ambient temperature rises. Due to this effect, they are frequently used as fuse elements to limit current flow, as the PTC element heats up as the current increases. As a result of the heating, the electrical resistance of the element increases and limits the current flow. If the current increases unexpectedly high or uncontrolled in a very short time, the heat generated causes the PTC element to melt and, by destroying the PTC element, interrupts the current flow. Task

[0004] It is an object of the invention to provide a component holder for holding components, such as electrical components or semiconductor chips, during component assembly, the temperature behavior of which can be adapted and guided to the direct process ambient temperature of a component, even at high process cycles, despite a solid design. Solution to the task

[0005] The object is achieved by the technical subject matter according to independent claim 1 and its use according to claim 22. Technically advantageous embodiments are set out in the dependent claims, the description, and the drawings. Description of the invention

[0006] According to one aspect of the invention, a component holder for processing a component as components comprises a carrier, a component holding tool with a component contact surface and a temperature control device for thermally shielding one or more regions of the component contact surface of the component holding tool from the carrier relative to a predetermined process temperature.

[0007] According to another aspect of the invention, a component holder for processing a component as a component comprises a carrier, a component holding tool with a component contact surface and a temperature control device, wherein the temperature control device is arranged between the carrier and the component holding tool such that one or more regions of the component contact surface of the component holding tool can be temperature-controlled relative to the carrier relative to a predetermined process temperature such that during processing of the component one or more regions of the component contact surface of the component holding tool is or can be thermally shielded from the carrier.

[0008] In both aspects, thermal shielding is achieved in particular by compensating for a thermal energy difference occurring between the components.

[0009] In both aspects, the component holder and / or at least one of its components preferably has a solid construction in order to be able to counteract process-related vibrations by means of mass inertia. The solid construction is indeed accompanied by a sluggish heating and / or cooling behavior, with which supplied and / or dissipated thermal energy can only unfold its effect in the form of heat radiation or cold radiation on one or more areas of the component contact surface after a time delay. However, this disadvantage can be optimized by thermally coordinated materials in such a way that the thermal conductivity is optimal overall due to the coordinated thermal conductivity coefficients and thicknesses of the materials along the heat flow, so that the thermal energy supplied and / or dissipated in at least one way in a very short time counteracts the inertia.

[0010] In both aspects, heat energy from at least one heat source and / or heat sink can be supplied to and / or removed from the component holder and / or at least one of its components. Preferably, the heat source(s) and / or heat sink(s) are embedded in the component holder and / or in at least one of its components. Preferably, in both aspects, the heat source(s) and / or heat sink(s) are arranged extending within the spatial volume of the component holder and / or at least one of its components and / or arranged extending within a layer plane of the component holder and / or at least one of its components.

[0011] In both aspects, the spatial volume and / or the layer level are preferably divided into temperature zones. This has the advantage that, through predefined temperature values ​​adapted to a specific process or component being processed, the heat energy to be supplied and / or removed can be optimally controlled, and target deviations can be continuously reduced through control loops. In particular, external environmental influences can be significantly reduced, allowing for more stable processes.

[0012] In embodiments of a component holder, the component holder and / or one or more of its, preferably all, components, in particular the carrier, the component holding tool and the temperature control device each comprise at least one media line section running in the spatial volume within a temperature zone.

[0013] Preferably, the media line sections are each arranged such that, in the case of a force-fitting and / or form-fitting connection of the carrier to the temperature control device and a force-fitting and / or form-fitting connection of the temperature control device to the component holding tool, a continuous media line is formed from at least two media line sections, through which, in a first manner, at least a portion of the positive and / or negative thermal energy for tempering a temperature zone can be supplied to and / or discharged from at least one temperature zone by means of at least one medium, preferably for processing the component, within a few seconds. In the case of one media line, an alternating supply and / or discharge of thermal energy within a temperature zone through the same media line is possible, as is the case with two or more media lines.

[0014] Technical gases are particularly suitable as a medium, which, especially when subjected to high pressure, enable temperature control within a few seconds, preferably within a few milliseconds.

[0015] In embodiments of a component holder, the component holder and / or one or more, preferably all, of its components comprise one or more heating elements in order to provide at least part of the positive thermal energy for tempering within a temperature zone in a second manner.

[0016] Preferably, the above-mentioned embodiments of a component holder comprise heat source(s) and / or heat sink(s) arranged extending in the spatial volume of the component holder and / or at least one of its components and / or arranged extending in a layer plane of the component holder and / or at least one of its components in order to provide at least a portion of the positive or negative thermal energy for temperature control in the two ways described above.

[0017] Within the scope of the disclosure, thermal energy that can be supplied and / or dissipated within a very short time ultimately serves to temper a spatial temperature zone arranged in the volume or in the layer plane to bring one or more regions of the component contact surface to a specific temperature and maintain it during the processing of a component. For this purpose, the thermal conductivity coefficients of the materials of the individual components are preferably coordinated to optimize the overall thermal conductivity.

[0018] In embodiments of a component holder with multiple heating elements, at least one heating element is a PTC thermistor heating element.

[0019] In embodiments of a component holder with several heating elements, the heating elements are electrically connected in series with one another, particularly preferably connected in parallel.

[0020] In such embodiments of a component holder with one or more heating elements, the one or more heating elements are arranged in one or more temperature zones.

[0021] In contrast to series connection, when there is a temperature difference between two areas of the component contact surface or two temperature zones of the temperature control device, the advantage of connecting heating elements in parallel is that the electrical resistance of an embedded PTC thermistor heating element increases in the area or temperature zone with the higher temperature. According to the laws governing electrical parallel circuits, the same voltage is applied across each electrical resistance. However, the electrical current is lower if the electrical resistance is higher in one branch of an electrical circuit. This means that a high electrical resistance in one area or temperature zone leads to a low current in that branch due to a higher temperature, and thus to lower heating output in that area or temperature zone.As a result, the temperature drops, causing the electrical resistance in this area or temperature zone to also decrease. The resulting negative feedback loop enables a self-adapting temperature control system. The result is a uniform temperature distribution across the component contact surface despite fluctuating or inhomogeneous process temperatures and / or ambient temperatures.

[0022] In addition, manufacturing tolerances (or minor defects) in the PTC thermistors are compensated, which leads to a higher acceptable yield in the processing of the heating device and thus to lower production costs.

[0023] Additionally, there is potential for cost reduction, as the automatically adaptive behavior of the design can result in fewer heaters being required, where otherwise each heater would require its own controller and thermocouple.

[0024] In the case of a series circuit, which can also be used in the same scenario described above, an increase in temperature in an area or temperature zone leads to a higher electrical resistance of a PTC thermistor heating element embedded in it. According to the laws of electrical series circuits, the same electrical current is applied across each electrical resistance. The higher the electrical resistance, the higher the electrical voltage. This means that a high electrical resistance in the area or temperature zone leads to a high voltage in this zone and thus to a higher heating output. The temperature rises in an area or temperature zone. The electrical resistance increases in this area or temperature zone. This is a positive feedback loop and you get a self-reinforcing system. The result is a hotspot on the heating element.

[0025] In embodiments of a component holder, the heating elements for each temperature zone are each electrically connected to an electrical power supply, wherein each electrical power supply is arranged to provide a predetermined and / or controlled supply of electrical energy to the heating elements of a temperature zone. Accordingly, the number of power supplies preferably corresponds to the number of temperature zones, so that each temperature zone has a power supply.

[0026] In embodiments of a component holder, preferably at least one of the temperature zones is arranged in an inner central region of the component contact surface, wherein at least one further temperature zone is arranged in one or more outer regions of the component contact surface peripheral to the inner central region.

[0027] In embodiments of a component holder, one or more heating elements or one or more PTC thermistor heating elements are preferably manufactured using thin-film technology, or for particularly powerful heating elements, thick-film technology, and thus embedded in a temperature control layer. Thermal expansion typically causes a change in the length / thickness or a deflection of a temperature control layer.

[0028] In addition, the design of the temperature control device in thin-film technology or thick-film technology as a layer composite of several temperature control layers with summable heat energy inputs or heat energy dissipations of summable heat energy with simultaneous or alternating heat energy inputs and / or heat energy dissipations enables improved temperature control for thermal shielding.

[0029] By using temperature-compensated material layers for tempering layers of a tempering device for all embodiments of a component holder, preferably alternating pairwise material layer sequences with coordinated thermal expansion coefficients, which compensate each other as a layer pair, or mechanically special rigid materials for the tempering layers in general, such as ceramics, sintered ceramics, technical glasses, sapphire or semiconductor materials, thermally induced deflection of the layer composite of a tempering device can be advantageously reduced.

[0030] In embodiments of a component holder, the component contact surfaces preferably have the shape of a polygon. This polygon shape is preferably triangular, square, trapezoidal, polygonal, quadrangular, rectangular, polygonal, circular, elliptical, annular, arcuate, or any combination thereof.

[0031] In embodiments of a component holder, one or more of the temperature zones preferably each have the shape of a polygon.

[0032] Preferably, this shape of the polygon is triangular, square, trapezoidal, polygonal, quadrilateral, rectangular, polygonal, circular, elliptical, linear, annular, arcuate, or any combination thereof.

[0033] In embodiments of a component holder, in the case of a plurality of temperature zones, a first temperature zone is arranged in a central region of the component contact surface, a second temperature zone is arranged adjacent to and peripheral to a first edge of the first temperature zone, a first PTC thermistor heating element of a third temperature zone is arranged adjacent to and peripheral to a second edge of the first temperature zone, a fourth temperature zone is arranged adjacent to and peripheral to a third edge of the first temperature zone and a second PTC thermistor heating element of the third temperature zone is arranged adjacent to and peripheral to a fourth edge of the first temperature zone, wherein the first temperature zone comprises a plurality of PTC thermistor heating elements connected in parallel.

[0034] In embodiments of a component holder, a fifth temperature zone is arranged adjacent and peripheral to a first edge of the first PTC thermistor heating element of the third temperature zone, and a sixth temperature zone is arranged adjacent and peripheral to a first edge of the second heating element of the third temperature zone.

[0035] In embodiments of a component holder, the first temperature zone has a square shape and the second temperature zone, the first PTC thermistor heating element of the third temperature zone, the fourth temperature zone and the second PTC thermistor heating element of the third temperature zone have a trapezoidal shape.

[0036] In embodiments of a component holder, a first PTC thermistor heating element of a first temperature zone is arranged in an inner central region of the component contact surface, a second PTC thermistor heating element of the first temperature zone is arranged adjacent and peripherally to a first edge of the first PTC thermistor heating element of the first temperature zone, a third PTC thermistor heating element of the first temperature zone is arranged adjacent and peripherally to a second edge of the first PTC thermistor heating element of the first temperature zone, a fourth PTC thermistor heating element of the first temperature zone is arranged adjacent and peripherally to a third edge of the first PTC thermistor heating element of the first temperature zone, a fifth heating element of the first temperature zone is arranged adjacent and peripherally to a fourth edge of the first PTC thermistor heating element of the first temperature zone,wherein the first temperature zone comprises a plurality of parallel-connected PTC thermistor heating elements.,

[0037] In embodiments of a component holder, the first PTC thermistor heating element of the first temperature zone has a square shape, and the second PTC thermistor heating element of the first temperature zone, the third PTC thermistor heating element of the first temperature zone, the third PTC thermistor heating element of the first temperature zone, the fourth PTC thermistor heating element of the first temperature zone, and the fifth PTC thermistor heating element of the first temperature zone each have the shape of a polygon. Preferably, as already described, this shape of the polygon is triangular, square, trapezoidal, polygonal, quadrilateral, rectangular, polygonal, circular, elliptical, linear, annular, arcuate, or any combination thereof.

[0038] In embodiments of a component holder, a first PTC thermistor heating element of a second temperature zone is arranged adjacent and peripherally to a first edge of the second PTC thermistor heating element of the first temperature zone, a second PTC thermistor heating element of the second temperature zone is arranged adjacent and peripherally to a first edge of the third PTC thermistor heating element of the first temperature zone, a third PTC thermistor heating element of the second temperature zone is arranged adjacent and peripherally to a first edge of the fifth PTC thermistor heating element of the first temperature zone, and a fourth PTC thermistor heating element of the second temperature zone is arranged adjacent and peripherally to a first edge of the fourth PTC thermistor heating element of the first temperature zone, wherein the second temperature zone comprises a plurality of PTC thermistor heating elements connected in parallel.

[0039] In embodiments of a component holder, a first PTC thermistor heating element of a third temperature zone is arranged adjacent and peripheral to a first edge of the second PTC thermistor heating element of the second temperature zone, and a second PTC thermistor heating element of the third temperature zone is arranged adjacent and peripheral to a first edge of the first PTC thermistor heating element of the third temperature zone, wherein the third temperature zone comprises a plurality of PTC thermistor heating elements connected in parallel.

[0040] In embodiments of a component holder, a first PTC thermistor heating element of a fourth temperature zone is arranged adjacent and peripheral to a first edge of the first PTC thermistor heating element of the second temperature zone, and a second PTC thermistor heating element of the fourth temperature zone is arranged adjacent and peripheral to a first edge of the first PTC thermistor heating element of the fourth temperature zone, wherein the fourth temperature zone comprises a plurality of PTC thermistor heating elements connected in parallel.

[0041] In embodiments of a component holder, a first PTC thermistor heating element of a fifth temperature zone is arranged adjacent and peripheral to a first edge of the third PTC thermistor heating element of the second temperature zone, and a second PTC thermistor heating element of the fifth temperature zone is arranged adjacent and peripheral to a first edge of the first PTC thermistor heating element of the fifth temperature zone, wherein the fifth temperature zone comprises a plurality of PTC thermistor heating elements connected in parallel.

[0042] In embodiments of a component holder, a first PTC thermistor heating element of a sixth temperature zone is arranged adjacent and peripheral to a first edge of the fourth PTC thermistor heating element of the second temperature zone, and a second PTC thermistor heating element of the sixth temperature zone is arranged adjacent and peripheral to a first edge of the first PTC thermistor heating element of the sixth temperature zone, wherein the sixth temperature zone comprises a plurality of PTC thermistor heating elements connected in parallel.

[0043] In embodiments of a component holder, the component holder and / or its components, preferably the carrier and / or particularly preferably also the tempering device and / or the component holding tool, additionally comprise one or more temperature sensors.

[0044] The temperature sensor can also be arranged as a layer in the temperature control device and cover a similar area to the heating elements, preferably PTC thermistor heating elements. The impact of integrating electrical heating elements and the temperature sensor on temperature homogeneity can be relatively small.

[0045] In embodiments of a component holder, a combination, preferably by parallel connection, of heating elements to temperature zones, which act both in the layer plane and in the spatial volume, in particular in a resulting layer composite of a tempering device, depending on the requirements of the process-related temperature profile, has proven to be particularly advantageous for tempering in order to thermally shield one or more areas of the component contact surface of the component holding tool from the carrier during processing of the component.

[0046] Embodiments of a component holder are arrangeable on a bondhead so that it can receive and hold any type of component, such as a semiconductor die, a semiconductor package, a chip, a flip chip, an integrated circuit, or an optical element, an electronic element, an electro-optical element, or a combination thereof.

[0047] Embodiments of a component holder are arrangeable at a bonding site of a bonder so that it can receive and hold any type of component, such as a semiconductor die, a semiconductor package, a chip, a flip chip, an integrated circuit, or an optical element, an electronic element, an electro-optical element, a substrate, a wafer, or a combination thereof.

[0048] The previously described arrangements of heating elements and / or PTC thermistor heating elements have each been described depending on the type of component, whereby the geometric dimensions specify the number and the geometric area to be occupied by the heating elements and / or PTC thermistor heating elements and the technical effect of the temperature control during the processing of the component by thermal shielding of the component from the carrier of the component holder results directly from this.

[0049] In another aspect of the invention, a method for using a component holder according to one of the previously described embodiments for controlling the temperature of one or more regions of the component contact surface of the component holding tool comprises controlling a relative temperature difference between one or more temperature zones and / or between one or more PTC thermistor heating elements of a temperature zone during a process step in which the component holder is used.

[0050] In preferred methods, the method of using a component holder comprises controlling a relative temperature difference between one or more temperature zones and / or between one or more PTC thermistor heating elements of a temperature zone to achieve a homogeneous distribution of the temperature of the component contact surface.

[0051] The embodiments EA1 to EA12 described below are suitable not only for use in connection with holding components, but also for securing any components during processing, in connection with other and / or additional processes, and in connection with other and / or additional processing machines. These embodiments are: EA1: A temperature control device comprising two or more heating elements, each heating element being configured and arranged to increase a temperature of an adjacent region as the electron flow through a heating element of an electrical current or voltage applied to the heating elements increases; at least two of the two or more heating elements being electrically connected in parallel; and each heating element being configured and arranged such that its electrical resistance increases non-linearly as the temperature of the adjacent region increases. EA2: A temperature control device according to EA1, wherein each parallel-connected heating element comprises one or more PTC thermistors. EA3: A tempering heating device according to EA1 or according to EA2, wherein the increase in electron flow occurs by increasing the electrical voltage while keeping the electrical current constant or by increasing the electrical current while keeping the electrical voltage constant. EA4. A temperature control device according to EA1, EA2, or EA3, wherein each heating element comprises one or more electrically conductive thin films manufactured using thin-film technology. EA5. A component holder having a component contact surface and a temperature control device according to EA1, EA2, EA3, or EA4, wherein the temperature control device is configured and arranged to increase the temperature of one or more regions of the component contact surface during operation. EA6: A component holder according to EA5, wherein the component contact surface has a low electrical conductivity, preferably an electrically insulating effect, in one or more regions near one or more heating elements. EA7: A component holder according to EA5 or according to EA6, wherein the temperature of the component contact surface can be increased during operation, preferably distributed homogeneously over the component contact surface. EA8: An arrangement of mutually symmetrical heating elements, wherein the symmetries comprise concentric arrangements comprising parallel zones equidistant from the center, wherein tempering layers with non-square surfaces are designed as separate zones at the edges. EA9: A temperature zone arrangement with preferably rectangular configuration for rectangular components or also square or circular configurations for thermal shielding of square or circular components. Ea10. A temperature control device which can be arranged and / or fastened on a carrier plate. EA11. A carrier plate that is interchangeably connected to a component holder. EA12. An interface for conducting or passing process media and / or electrical signals between a temperature control device and a component holder. EA13. A controllable feedthrough for process media in a temperature control device.

[0052] In addition, the following versions EA-P1 to EA-P23 have proven particularly suitable in practice: EA-P1. Component holder (1) for processing a component, wherein the component holder (1) comprises as components a carrier (100), a component holding tool (300) with a component contact surface (350), and a temperature control device (200), wherein the temperature control device (200) is arranged on the carrier (100) such that, relative to the carrier (100), one or more regions of the component contact surface (350) of the component holding tool (300) can be temperature-controlled by means of positive or negative thermal energy relative to a predetermined process temperature for processing the component, so that one or more regions of the component contact surface (350) of the component holding tool (300) are thermally shielded from the carrier (100) for processing the component. EA-P2. Component holder (1) according to EA-P1, wherein the carrier (100) and the temperature control device (200) each have at least one media line (130, 131, 132, 133, 134, 135, 136, 137, 138, 139, 140, 141), each arranged such that the carrier (100) is connected to the temperature control device (200) and the temperature control device (200) is connected to the component holding tool (300) in a force-fitting and / or form-fitting manner, such that at least part of the positive or negative thermal energy for temperature control can be supplied or dissipated by means of at least one medium, preferably for processing the component. EA-P3. Component holder (1) according to EA-P1 or EA-P2, wherein the temperature control device (200) comprises one or more temperature zones (301, 302, 303, 304, 305, 306) that provide positive thermal energy for the one or more regions of the component contact surface (350). EA-P4. Component holder (1) according to EA-P3, wherein each temperature zone (301, 302, 303, 304, 305, 306) comprises one or more electrical heating elements (301a, 301b, 302, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b). EA-P5. Component holder (1) according to EA-P3, wherein one or more of the temperature zones (301, 302, 303, 304, 305, 306) comprises two or more PTC thermistor heating elements (301a, 301b, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) electrically connected in parallel. EA-P6. Component holder (1) according to EA-P4 or EA-P5, wherein each of the one or more temperature zones (301, 302, 303, 304, 305, 306) is arranged to be electrically connected to one of n electrical power supplies, and each of the electrical power supplies is arranged to provide a predetermined and / or controlled supply of electrical power to one of the temperature zones (301, 302, 303, 304, 305, 306). EA-P7. Component holder (1) according to one of claims 3 to 6, wherein at least one of the n temperature zones (301) is arranged in an inner central region of the component contact surface (350); and wherein at least one further temperature zone (302, 303, 304, 305, 306) is arranged in one or more outer regions of the component contact surface (350) peripheral to the inner central region. EA-P8. Component holder (1) according to EA-P4 or EA-P5, wherein one or more heating elements (301a, 301b, 302, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) or one or more PTC thermistor heating elements (301a, 301b, 302, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) are applied as a thin film. EA-P9. Component holder (1) according to one of the preceding embodiments, wherein the component contact surfaces (350) comprise a triangular, square, trapezoidal, polygonal, quadrangular, rectangular, polygonal, circular, elliptical, annular, arcuate shape, or any combination thereof. EA-P10. Component holder (1) according to any one of embodiments EA-P3 to EA-P9, wherein the one or more of the temperature zones (301, 302, 303, 304, 305, 306) comprise a triangular, square, trapezoidal, polygonal, quadrilateral, rectangular, polygonal, circular, elliptical, linear, annular, arcuate shape, or any combination thereof. EA-P11. Component holder (1) according to one of claims 3 to 9, wherein, in the case of multiple temperature zones, a first temperature zone (301) is arranged in a central region of the component contact surface (350), a second temperature zone (302) is arranged adjacent and peripherally to a first edge of the first temperature zone (301), a first PTC thermistor heating element (303a) of a third temperature zone (303) is arranged adjacent and peripherally to a second edge of the first temperature zone (301); a fourth temperature zone (304) is arranged adjacent and peripherally to a third edge of the first temperature zone (301); and a second PTC thermistor heating element (303b) of the third temperature zone (303) is arranged adjacent and peripherally to a fourth edge of the first temperature zone (301); wherein the first temperature zone (301) comprises a plurality of parallel-connected PTC thermistor heating elements (301a, 301b, 301c, 301d, 301e). EA-P12. Component holder (1) according to embodiment EA-P11, wherein a fifth temperature zone (305) is arranged adjacent and peripheral to a first edge of the first PTC thermistor heating element (303a) of the third temperature zone (303), and a sixth temperature zone (306) is arranged adjacent and peripheral to a first edge of the second heating element (303b) of the third temperature zone (303). EA-P13. Component holder (1) according to embodiment EA-P11 or embodiment EA-P12, wherein the first temperature zone (301) comprises a square shape and wherein the second temperature zone (302), the first PTC thermistor heating element (303a) of the third temperature zone (303), the fourth temperature zone (304), and the second PTC thermistor heating element (303b) of the third temperature zone (303) comprise a trapezoidal shape. EA-P14. Component holder (1) according to one of the preceding claims, wherein a first PTC thermistor heating element (301a) of a first temperature zone (301) is arranged in an inner central region of the component contact surface (350), a second PTC thermistor heating element (301b) of the first temperature zone (301) is arranged adjacent and peripherally to a first edge of the first PTC thermistor heating element (301a) of the first temperature zone (301), a third PTC thermistor heating element (301c) of the first temperature zone (301) is arranged adjacent and peripherally to a second edge of the first PTC thermistor heating element (301a) of the first temperature zone (301), a fourth PTC thermistor heating element (301d) of the first temperature zone (301) is arranged adjacent and peripherally to a third edge of the first PTC thermistor heating element (301a) of the first temperature zone (301) is arranged,a fifth heating element (301e) of the first temperature zone (301) is arranged adjacent to and peripheral to a fourth edge of the first PTC thermistor heating element (301a) of the first temperature zone (301); wherein the first temperature zone (301) comprises a plurality of parallel-connected PTC thermistor heating elements (301a, 301b, 301c, 301d, 301e). EA-P15. Component holder (1) according to embodiment EA-P14, wherein the first PTC thermistor heating element (301a) of the first temperature zone (301) comprises a square or rectangular shape; and wherein the second PTC thermistor heating element (301b) of the first temperature zone (301), the third PTC thermistor heating element (301c) of the first temperature zone (301), the third PTC thermistor heating element (301c) of the first temperature zone (301), the fourth PTC thermistor heating element (301d) of the first temperature zone (301), and the fifth PTC thermistor heating element (301d) of the first temperature zone (301) comprise a polygonal shape. EA-P16. Component holder (1) according to embodiment EA-P14 or embodiment EA-P15, wherein a first PTC thermistor heating element (302a) of a second temperature zone (302) is arranged adjacent to and peripherally to a first edge of the second PTC thermistor heating element (301b) of the first temperature zone (301), a second PTC thermistor heating element (302b) of the second temperature zone (302) is arranged adjacent to and peripherally to a first edge of the third PTC thermistor heating element (301c) of the first temperature zone (301), a third PTC thermistor heating element (302c) of the second temperature zone (302) is arranged adjacent to and peripherally to a first edge of the fifth PTC thermistor heating element (301e) of the first temperature zone (301), and a fourth PTC thermistor heating element (302d) of the second temperature zone (302) is arranged adjacent and peripheral to a first edge of the fourth PTC thermistor heating element (301d) of the first temperature zone (301);wherein the second temperature zone (302) comprises a plurality of parallel-connected PTC thermistor heating elements (302a, 302b, 302c, 302d); EA-P17. Component holder (1) according to embodiment EA-P10, wherein a first PTC thermistor heating element (303a) of a third temperature zone (303) is arranged adjacent to and peripherally to a first edge of the second PTC thermistor heating element (302b) of the second temperature zone (302), and a second PTC thermistor heating element (303b) of the third temperature zone (303) is arranged adjacent to and peripherally to a first edge of the first PTC thermistor heating element (303a) of the third temperature zone (303); wherein the third temperature zone (303) comprises a plurality of PTC thermistor heating elements (303a, 303b) connected in parallel. EA-P18. Component holder (1) according to embodiment EA-P10 or embodiment EA-P11, wherein a first PTC thermistor heating element (304a) of a fourth temperature zone (304) is arranged adjacent to and peripherally to a first edge of the first PTC thermistor heating element (302a) of the second temperature zone (302), and a second PTC thermistor heating element (304b) of the fourth temperature zone (304) is arranged adjacent to and peripherally to a first edge of the first PTC thermistor heating element (304a) of the fourth temperature zone (304); wherein the fourth temperature zone (304) comprises a plurality of PTC thermistor heating elements (304a, 304b) connected in parallel. EA-P19. Component holder (1) according to one of claims 10 to 12, wherein a first PTC thermistor heating element (305a) of a fifth temperature zone (305) is arranged adjacent to and peripherally to a first edge of the third PTC thermistor heating element (302c) of the second temperature zone (302), and a second PTC thermistor heating element (305b) of the fifth temperature zone (305) is arranged adjacent to and peripherally to a first edge of the first PTC thermistor heating element (305a) of the fifth temperature zone (305); wherein the fifth temperature zone (305) comprises a plurality of PTC thermistor heating elements (305a, 305b) connected in parallel. EA-P20. Component holder (1) according to one of claims 10 to 13, wherein a first PTC thermistor heating element (306a) of a sixth temperature zone (306) is arranged adjacent to and peripherally to a first edge of the fourth PTC thermistor heating element (302d) of the second temperature zone (302), and a second PTC thermistor heating element (306b) of the sixth temperature zone (306) is arranged adjacent to and peripherally to a first edge of the first PTC thermistor heating element (306a) of the sixth temperature zone (306); wherein the sixth temperature zone (306) comprises a plurality of PTC thermistor heating elements (306a, 306b) connected in parallel. EA-P21. Component holder (1) according to one of the preceding claims, wherein the component holder (1) further comprises one or more temperature sensors (400). EA-P22. A method for using a component holder (1) according to any one of claims 1 to 21 for controlling the temperature control of one or more regions of the component contact surface (350), wherein the method comprises controlling a relative temperature difference between one or more temperature zones and / or between one or more PTC thermistor heating elements of a temperature zone during a process step. EA-P23. A method for using a component holder (1) according to embodiment EA-P22, wherein the method comprises controlling a relative temperature difference between one or more temperature zones and / or between one or more PTC thermistor heating elements of a temperature zone in order to achieve a homogeneous distribution of the temperature of the component contact surface (350).

[0053] All designs of a component holder therefore ensure a constant process temperature with a homogeneous temperature distribution or with a temporally constant temperature profile in the immediate vicinity of the component in operation.

[0054] Further advantages and features of the invention will become apparent from the following figures, namely: Fig. 1 shows a perspective view of a component holder comprising a carrier, a component holding tool and a tempering device; Fig. 2 shows a plan view of a component holder with a carrier, a component holding tool and a tempering device; Fig. 3 shows a side view of a component holder with a carrier, a component holding tool and a tempering device; Fig. 4 shows a sectional view of a component holder with a component holding tool and a temperature control device with feedthroughs for process media; Fig. 5 shows the top of a tempering device for a component holder; Fig. 6 shows the underside of a tempering device for a component holder; Fig. 7a shows an embodiment of an arrangement of heating elements of a tempering layer for a tempering device; Fig. 7b shows an embodiment of a temperature zone division of the arrangement of heating elements from Fig. 7a; Fig. 8 shows an embodiment of a further tempering layer for a tempering device with an arrangement of heating elements; Fig. 9 shows an embodiment of a tempering device with an arrangement of heating elements to form a square temperature zone; Fig. 10 shows an embodiment of a further tempering layer for a tempering device with an arrangement of the heating elements and their temperature zones; Fig. 11 shows an embodiment of a tempering device; Fig. 12 shows a side view of a component holder with a carrier, a component holding tool and the tempering device from Fig. 11. Character description

[0055] Fig. 1 shows a perspective view of a component holder 1 comprising a carrier 100, a temperature control device 200 and a component holding tool 300 with a component contact surface 350 for receiving and holding a non-illustrated component of any type, such as a semiconductor die, a semiconductor package, a chip, a flip chip, an integrated circuit, a substrate, an optical element, an electronic element, an electro-optical element or a combination thereof.

[0056] The component contact surface 350 is suitable for a variety of shapes of components (not shown) to be held. The variety of shapes includes, for example, the shape of a triangle, a square, a trapezoid, a polygon, a quadrilateral, a rectangle, a polygon, a circle, an ellipse, a ring, an arc, or any combination thereof.

[0057] To hold a component resting on the component contact surface 350 during operation (not shown), a vacuum is typically used, which is made available as a process medium on the surface by means of outlets (not shown) of media lines 130, 131, 132, 133, and 134. Preferably, the process medium can also be distributed via additional recesses recessed in the surface of the component contact surface 350, which are preferably designed as half-channels running orthogonally to one another. The additional half-channel-shaped recesses enlarge the suction surface for a component, resulting in a higher contact suction and thus also a higher thermal gradient between the component contact surface 350 and the component contact surface and a component to be sucked in.

[0058] The component holder 1 can be arranged as intended on a bondhead (not shown), a bonding station (not shown) or a device for processing components.

[0059] The component holder 1 can be used in any type of these devices or in any type of process step requiring improved, preferably temperature-compensated, temperature behavior of the component holder to ensure a constant process temperature with a homogeneous temperature distribution or with a temporally constant temperature profile in the immediate vicinity of the component being operated. This is particularly true for mechanically very stable, solid component holders, which, due to their mass, exhibit a high heat capacity and thermal inertia. For example, in TCB (thermocompression bonding) with heated bonding inserts or heated chucks, as well as in other assembly processes for semiconductor chips and the holding tools required for them.

[0060] The carrier 100 has a recess 101 into which the temperature control device 200 is inserted in a force-fitting and / or form-fitting manner. The temperature control device 200 has numerous electrical contacts 160, 161, shown in dashed lines, arranged on two opposite sides. The electrical contacts 160, 161 serve to electrically contact and control hidden temperature zones (not shown) with embedded electrical heating elements (not shown), preferably also PTC thermistor heating elements, which are particularly preferably operated in parallel and / or serve to electrically contact and read out temperature sensors (not shown). The plurality of electrical contacts 160, 161 can be provided, for example, with the aid of spring contact pins to enable rapid replacement.The use of more than one contact pin per contact point makes it possible to avoid overloading the contact pins. Electrical contact can also be established via rigid contact, for example, in the form of pins or surface contacts.

[0061] Also not visible are the openings 142 and 143 formed on the underside surface 51, which also serve in larger numbers for supplying and / or discharging at least one medium in order to supply and / or discharging at least part of the positive or negative thermal energy for temperature control.

[0062] The carrier 100 has eight holding clamps 110, 111, 112, 113, 114, 115, 116 and 117, each arranged in pairs opposite one another, for fastening the tempering device 200.

[0063] Furthermore, a holder 120 of two holders 120, 121 arranged opposite one another during operation for fastening the component holding tool 300 is shown.

[0064] Preferably, the component holder 350 is arranged centered and aligned with the temperature control device 200. It may be advantageous to consider thermal expansion during fastening and to take mechanical play of the holders 120, 121 into account accordingly, as well as to utilize an additional fastening by means of a vacuum already provided for holding components for additional, supporting fastening of the component holding tool 300.

[0065] Fig. 2 shows a top view of the component holder 1 from Fig. 1 with further details shown. The component holder 1 comprises the carrier 100, the component holding tool 300, and the temperature control device 200 in the recess 101. The temperature control device 200 is secured in the recess by the two illustrated holders 120, 121, along with a vacuum fastening during operation.

[0066] The recess 101 facilitates handling, particularly as a guide aid, during a quick tool change, although designs without recesses 101 are also possible.

[0067] The two brackets 120, 121 rest on the paired retaining clips 112, 115 and 116, 117 indicated by dashed lines. The retaining clips 110, 111 and 114, 115 are not covered.

[0068] Between the indicated openings of the media line sections 130, 131, 132, 133, and 134, the U-shaped, crossed recesses in the form of half-channels for holding a component resting on the component contact surface 350 during operation can be seen. As already explained, the suction surface for a component is enlarged by the additional channel-shaped recesses, resulting in a higher contact suction and thus also a higher thermal gradient between the component contact surface 350 and the component contact surface and a component resting thereon that is being sucked in.

[0069] Fig. Figure 3 shows the side view of the component holder 1 with the carrier 100, the component holding tool 300, and the temperature control device 200, as well as the holder 120 resting on the retaining clamps 117, 116. In the side view, possible positions of embeddable temperature control layers 201, 202, 203, 204, as well as the associated components for electrical or fluidic operation of the temperature control device 200, are partially indicated by dashed lines. Likewise, the media line section 140 and the media line section 141 are each indicated by dashed lines, which extend through the force-fitting and / or form-fitting connection of the underside surface 251 of the temperature control device 200 and the recess 101 of the carrier 100. During operation, vacuum can preferably be applied through the two media lines 140 and 141 to additionally hold the tempering device 200 in the recess 101.

[0070] Within the temperature control device 200, the media line section 140 and the media line section 141, in addition to holding the temperature control device 200 in the recess 101 during operation, serve to supply and / or discharge at least a portion of the positive or negative thermal energy via the media line section 139 for temperature control through the temperature control layer 204 by means of at least one medium, preferably for processing the component, such as compressed air, nitrogen, vacuum, or another process gas. The supply and / or discharge takes place via openings 142 and 143 (not shown) in the surface of the underside surface 251, between which the media line section 139 extends.

[0071] For clarity, the side view is Fig. 3 as a sectional view in Fig. 4 shown.

[0072] Fig. Figure 4 shows a sectional view of the component holder 1 with the component holding tool 300 and the temperature control device 200 held in the recess 101 of the carrier 100 by means of the holders 110, 115. During operation, the component holding tool 300 can additionally be fixed to the upper surface 250 of the temperature control device 200 by means of a vacuum. The vacuum can be applied using the media line sections 138 and 136 formed during operation through the feedthroughs in the carrier 100 and the temperature control device 200.

[0073] The carrier 100 has the media line sections 140 and 141, the media line sections 131, 133, and the feedthroughs for process media in the form of the media line section 140, the media line section 139 embedded in the temperature control device 200, and the media line section 141. During operation, a vacuum can be provided by means of the media line sections 131, 133, and 130 to hold a component on the component contact surface 350.

[0074] The media line section 139 embedded in the temperature control layer 204 runs, as indicated, parallel to the temperature control layers 201, 202, 203 and preferably, as indicated in the XY plane shown, in a meandering shape around at least a portion of the media line sections 131, 130, 130. The media line section 139 serves the temperature control layer 204 for supplying and / or discharging at least one of the available media in order to supply and / or dissipate at least a portion of the positive or negative thermal energy for temperature control. In the case of particularly rapid succession or short heating or cooling cycles, it has proven advantageous to embed several media line sections, preferably running parallel to one another, in the temperature control layer 204 instead of a single media line section 139.Furthermore, it has proven advantageous to at least partially subdivide media line sections into individual channels running parallel to each other, with their course and geometry adapted to the available space and the required temperature profile. Practical experience has shown that subdividing media line sections into channels improves the static behavior of a temperature control device when the number of media line sections is increased, allowing for increased supply and / or removal of heat energy within the same area.

[0075] The tempering layers 201, 202 and 203 are interconnected by means of electrical vias 150 and can be electrically contacted by means of electrical contacts 160 and 161, for example by means of spring contact pins (not shown) in the recess 101 of the carrier 100.

[0076] Fig. 5 shows the upper side surface 250 of a temperature control device 200 for a component holder 1 with the centrally arranged media line section 130 and the media line sections 131, 132, 133, 134, 135, 136, 137 and 138 arranged crosswise around it, each of which opens onto the upper side surface 250.

[0077] Fig. Figure 6 shows the underside surface 251 of a temperature control device 200 for a component holder 1 with the centrally arranged media line section 130. The media line sections 131, 132, 133, 134, 135, 136, 137, and 138 are arranged in a cross shape around the centrally arranged media line section 130. In addition, in this embodiment, the two openings 142 and 143 of the underside surface 251 are also visible. The media line section 139 extends between these two openings 142 and 143 for supplying and / or dissipating at least part of the positive or negative thermal energy.

[0078] Fig. 7a and Fig. 7b show the same embodiment of an arrangement of heating elements 301a, 302a, 303a, 303b, 304a, 305a, 306a of a tempering layer 201, 202, 203 for a non-illustrated rectangular tempering device 200, wherein for the sake of clarity the reference numerals and the temperature zones refer to the two Fig. 7a and Fig. 7b were divided in such a way that the temperature zones only in Fig. 7b are shown. Fig. Figure 7a shows the arrangement of heating elements 301a, 302a, 303a, 303b, 304a, 305a, 306a of a temperature control layer 201, 202, 203 for a rectangular temperature control device 200 (not shown), such as is suitable for components with a rectangular base area. The heating elements 301a, 302a, 303a, 303b, 304a, 305a, 306a embedded in the temperature control device 200 each have an electrical through-hole 150 and the through-hole electrical contacts 160 at both ends for electrical contacting, of which only three have been designated for clarity. In addition, in this embodiment of a tempering layer 201, 202, 203, the media line sections 130, 131, 132, 133, 134, 135 and 137 - indicated here with a circular cross-section - can be seen in corresponding recesses in the meanders of the heating elements 301a, 302a, 303a, 303b, 304a and 305a.The specific design of the cross-section of the media line sections 130, 131, 132, 133, 134, 135, and 137 can also be arbitrary in this embodiment, preferably with a channel-shaped subdivision, and is not intended to be limited by the schematic representation for the sake of clarity within the meaning of the disclosure. In particular, depending on the requirements of the temperature zones, embodiments of a temperature control layer can also have more or fewer media line sections than shown schematically in . Fig. 7 is indicated.

[0079] In this embodiment, the heating elements 301a, 302a, 303a, 303b, 304a, 305a, 306a are divided into the temperature zones 301, 302, 304, 305 and 306 by a non-illustrated electrical connection of the heating elements 301a, 302a, 304a, 305a and 306a as in Fig. 7b. The two heating elements 303a, 303b are connected in parallel and form a further temperature zone 303.

[0080] Fig. Figure 8 shows an embodiment of a temperature control layer 201, 202, 203 for a temperature control device 200 with an arrangement example of the heating elements for a component with a rectangular base area, which can be arranged together with another temperature control layer within a temperature control device 200. The arrangement of the heating elements 31a, 32a, 33a, 33b, 34a, 35a, 36a corresponds to the arrangement of the heating elements of the Fig. 7 depicted heating elements 301a, 302a, 303a, 303b, 304a, 305a, 306a. Even if their respective meander geometry differs from each other, in a superimposed arrangement of the two tempering layers, the respective electrical vias 150 are congruent with each other, so that the heating elements of the two tempering layers of the Fig. 7 and Fig. 8 with electrical connecting lines (not shown) within a temperature control device 200 are electrically interconnected to form temperature zones of the temperature control device 200. In particular, the heating elements 301a, 302a, 303a, 303b, 304a, 305a, 306a of the Fig. 7 with the heating elements 31a, 302a, 33a, 33b, 34a, 35a, 36a of the Fig. 8 are connected in parallel such that the heating elements 301a and 31a form a first temperature zone 31 in the spatial volume of a resulting layer composite of a temperature control device 200. The heating elements 302a and 32a form a second temperature zone 32 in the spatial volume of a resulting layer composite of a temperature control device 200. The heating elements 304a and 34a, 305a and 35a, and 306a and 36a, in a corresponding parallel connection, also form the respective temperature zones 304, 305, and 306 in the spatial volume of a resulting layer composite of a temperature control device 200. The heating elements 303a and 303b as well as 33a and 33b, which are already connected in parallel in the layer plane of the illustrated tempering layer 201, 202, 203, thus form, in the layer composite, respectively divided temperature zones 303 and 33, which act both in the layer plane and in the spatial volume.

[0081] The electrical wiring of the heating elements is not shown for clarity. A combination of heating elements to form temperature zones that act both in the layer plane and in the spatial volume, especially in the resulting layer composite of a temperature control device, is particularly advantageous for temperature control depending on the requirements of a process-related temperature profile, so that one or more areas of the component contact surface of the component holding tool are thermally shielded from the carrier for processing the component.

[0082] Fig. Figure 9 shows an embodiment of a temperature control layer 201, 202, 203 of a temperature control device 200. The temperature control layer 201, 202, 203 has a square-shaped temperature zone 301 with a first heating element 301a at the center and four additional heating elements 301b, 301c, 301d, and 301e arranged evenly around this heating element 301a. The temperature zone 301 is arranged, as shown, preferably symmetrically, centered on the outer edges of the temperature control layer 201, 202, 203. The electrical wiring of the heating elements is not shown for clarity. The heating elements are preferably all designed as PTC thermistor heating elements and the outer heating elements 301b, 301c, 301d and 301e can be connected in parallel in pairs as adjacent or opposite pairs, depending on the temperature profile requirements.

[0083] Fig. 10 shows an embodiment of a rectangular temperature control layer 201, 202, 203 for a non-illustrated temperature control device 200 with an advantageous arrangement of the temperature zones 301, 302, 303, 304, 305, and 306 for one or more non-illustrated components with a square or rectangular base area. The temperature control layer 201, 202, 203 has a first temperature zone 301 in a square shape with a first heating element 301a in the center and four additional heating elements 301b, 301c, 301d, and 301e arranged evenly around this heating element 301a. The temperature zone 301 is arranged, preferably symmetrically, centered on the outer edges of the temperature control layer 201, 202, 203.The second heating element 301b of temperature zone 301, the third heating element 301c of temperature zone 301, the third heating element 301c of temperature zone 301, the fourth heating element 301d of temperature zone 301, and the fifth heating element 301d of the first temperature zone 301 each have the shape of a polygon in order to be able to enclose the first heating element 301a, each arranged uniformly in the XY plane. In this embodiment, the shape of a polygon is angular or L-shaped. In addition, the first heating element 301a of the first temperature zone 301 has a recess in its meandering geometry in the center, through which the media line section 130 runs perpendicularly into the image plane XY. The heating elements are preferably all designed as PTC thermistor heating elements. The first temperature zone 301 is surrounded by the concentrically arranged temperature zone 302.The temperature zone 302 also comprises 4 uniformly arranged polygons, each angular or L-shaped, which enclose the 5 heating elements of the first temperature zone in the XY plane, i.e. in a layer plane of a layer composite of a tempering device 200 (not shown).

[0084] Fig. 11 shows an embodiment of a temperature control device 200 with a layer composite comprising the temperature control layers 201, 202, 203 and 204, wherein for the sake of clarity only the temperature control layer 204 is shown in the layer composite. The temperature control device 200, shown transparently in perspective with a view of the underside surface 251, enables a good understanding of the layer composite. The temperature control layer 204 comprises the media line section 139, which runs in a meandering shape within the layer composite, and the media line section 1390, which runs in a meandering shape within the layer composite. In this embodiment, the two media line sections are arranged mirror-inverted to one another such that their meanders interlock in a comb-like manner. The two media line sections 139 and 1390 are also each at least partially orPartially subdivided into channel-shaped individual channels 144a, 144b, 144c, 144d running parallel to one another, the course and geometry of which are adapted to the available space volume and required temperature profile. The recessed openings 142 and 143 are clearly visible on the underside surface 251. A larger number of these openings also serve to supply and / or discharge at least one medium into and / or out of a media line section 139, 1390 in order to supply and / or discharge at least a portion of the positive or negative thermal energy for temperature control. The channel-shaped subdivision 144 can be clearly seen in the respective openings 142 of the media line section 139 due to the perspective view.It has been shown in practice that a channel-shaped subdivision 144 of media line sections generally improves the static behavior of a temperature control device 200 when the number of media line sections increases, so that an increased supply and / or removal of thermal energy is possible on the same surface of the temperature control layer 204. Additionally, in this embodiment of a temperature control layer 204, the media line sections 130, 132, 134, 136, 137, and 138 are visible, partly in corresponding recesses in the media line sections 139 and 1390.

[0085] Fig. 12 shows a cross-sectional view of a component holder 1 with an incompletely shown carrier 100, which with the holder clamps 110 and 115 and further holding clamps not shown, the temperature control device from Fig.11. The component holding tool 300 with the component contact surface 350 rests on the top surface of the temperature control device 200. Contacts 160 and 161 of the temperature control device 200 for electrically contacting the corresponding temperature control layer 201, 202, 203 within the layer composite of the temperature control device 200 are electrically contacted by the contact spring pins 1600, thus establishing an electrical connection to their power supplies and control unit (not shown). Contact spring pins 1600 are embedded in the carrier 100 and the component holder 1. The carrier 100 and the component holder 1 also have numerous media performance sections 136, 138, 140, 141 for supplying and / or removing heat energy to and / or from the temperature control device 200 using media, preferably liquid or gaseous process media, as energy carriers.The cross-sectional view also shows the advantageous arrangement and design of the channel-shaped subdivision 144 of the two media line sections 139 and 1390 into individual channels 144a, 144b, 144c, 144d, which run parallel to one another at least in sections or partially in channel-shaped manner, within the layer composite of the temperature control device 200. Furthermore, the media lines (without reference symbols) formed from the media line sections 130, 130a, 131, 131a, 136, 138, 140 and 141 can be seen through the force-fitting and / or form-fitting connection of the carrier 100 to the temperature control device 200 and a force-fitting and / or form-fitting connection of the temperature control device 200 to the component holding tool 300.These formed media lines (without reference symbols) also serve to supply and / or discharge at least one medium into and / or from a media line section in order to supply and / or discharge at least part of the positive or negative thermal energy for temperature control. List of reference symbols 1 component holder 100 carriers 101 recess 110 retaining clip 111 Retaining clip 112 retaining clip 113 Retaining clip 114 retaining clip 115 retaining clip 116 retaining clip 117 Retaining clip 120 bracket 121 bracket 130 media line section 131 media line section 131a Media line section 132 media line section 133 Media line section 133a Media line section 134 Media line section 135 media line section 136 media line section 137 Media line section 138 media line section 139 Media line section 1390 media line section 140 media line section 141 media line section 142 Opening 143 Opening 144 Channel-shaped subdivision 144a Single channel 144b Single channel 144c single channel 144d single channel 150 Electrical vias 160 Electrical contact 161 Electrical contact 1600 contact spring pin 200 Tempering device 201 Tempering layer 202 Tempering layer 203 Tempering layer 204 Tempering layer 250 top surface tempering device 251 Underside surfaces tempering device 300 component holding tools 301 temperature zone 301a Heating element / PTC thermistor heating element 301b Heating element / PTC thermistor heating element 301c heating element / PTC thermistor heating element 301d heating element / PTC thermistor heating element 301e heating element / PTC thermistor heating element 302 temperature zone 302a Heating element / PTC thermistor heating element 302b Heating element / PTC thermistor heating element 303 Temperature Zone 303a Heating element / PTC thermistor heating element 303b Heating element / PTC thermistor heating element 304 Temperature Zone 304a heating element / PTC thermistor heating element 304b Heating element / PTC thermistor heating element 305 temperature zone 305a Heating element / PTC thermistor heating element 305b Heating element / PTC thermistor heating element 306 Temperature Zone 306a heating element / PTC thermistor heating element 306b Heating element / PTC thermistor heating element 350 component contact area 400 temperature sensor 31a Heating element / PTC thermistor heating element 32a Heating element / PTC thermistor heating element 33a Heating element / PTC thermistor heating element 33b Heating element / PTC thermistor heating element 34a Heating element / PTC thermistor heating element 35a Heating element / PTC thermistor heating element 36a Heating element / PTC thermistor heating element

Claims

[1] Component holder (1) for processing a component, wherein the component holder (1) comprises as components a carrier (100), a component holding tool (300) with a component contact surface (350) and a temperature control device (200), wherein the temperature control device (200) is arranged on the carrier (100) in such a way that one or more regions of the component contact surface (350) of the component holding tool (300) can be temperature-controlled relative to the carrier (100) relative to a predetermined process temperature for processing the component by means of positive or negative thermal energy, so that one or more regions of the component contact surface (350) of the component holding tool (300) are thermally shielded from the carrier (100) for processing the component. [2] Component holder (1) according to claim 1, wherein the carrier (100) and the tempering device (200) each have at least one media line (130, 131, 132, 133, 134, 135, 136, 137, 138, 139, 140, 141), which are each arranged such that the carrier (100) is connected to the tempering device (200) and the tempering device (200) is connected to the component holding tool (300) in a force-fitting and / or form-fitting manner, so that at least part of the positive or negative thermal energy for tempering can be supplied or dissipated by means of at least one medium, preferably for processing the component. [3] Component holder (1) according to claim 1 or claim 2, wherein the tempering device (200) comprises one or more temperature zones (301, 302, 303, 304, 305, 306) to provide positive thermal energy for the one or more regions of the component contact surface (350). [4] Component holder (1) according to claim 3, wherein each temperature zone (301, 302, 303, 304, 305, 306) comprises one or more electrical heating elements (301a, 301b, 302, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b). [5] Component holder (1) according to claim 3, wherein one or more of the temperature zones (301, 302, 303, 304, 305, 306) comprises two or more PTC thermistor heating elements (301a, 301b, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) electrically connected in parallel. [6] A component holder (1) according to claim 4 or claim 5, wherein each of the one or more temperature zones (301, 302, 303, 304, 305, 306) is arranged to be electrically connected to one of n electrical power supplies, and each of the electrical power supplies is arranged to provide a predetermined and / or controlled supply of electrical power to one of the temperature zones (301, 302, 303, 304, 305, 306). [7] Component holder (1) according to one of claims 3 to 6, wherein at least one of the n temperature zones (301) is arranged in an inner central region of the component contact surface (350); and wherein at least one further temperature zone (302, 303, 304, 305, 306) is arranged in one or more outer regions of the component contact surface (350) peripheral to the inner central region. [8] Component holder (1) according to claim 4 or claim 5, wherein one or more heating elements (301a, 301b, 302, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) or one or more PTC thermistor heating elements (301a, 301b, 302, 302b, 303a, 303b, 304a, 304b, 305a, 305b, 306a, 306b) are applied as a thin film. [9] Component holder (1) according to one of the preceding claims, wherein the component contact surfaces (350) comprise a triangular, square, trapezoidal, polygonal, quadrangular, rectangular, polygonal, circular, elliptical, annular, arcuate shape, or any combination thereof. [10] Component holder (1) according to one of claims 3 to 9, wherein the one or more of the temperature zones (301, 302, 303, 304, 305, 306) comprise a triangular, square, trapezoidal, polygonal, quadrilateral, rectangular, polygonal, circular, elliptical, linear, annular, arcuate shape, or any combination thereof. [11] Component holder (1) according to one of claims 3 to 9, wherein, in the case of a plurality of temperature zones, a first temperature zone (301) is arranged in a central region of the component contact surface (350), a second temperature zone (302) is arranged adjacent and peripheral to a first edge of the first temperature zone (301), a first PTC thermistor heating element (303a) of a third temperature zone (303) is arranged adjacent and peripheral to a second edge of the first temperature zone (301); a fourth temperature zone (304) is arranged adjacent and peripheral to a third edge of the first temperature zone (301); and a second PTC thermistor heating element (303b) of the third temperature zone (303) is arranged adjacent and peripheral to a fourth edge of the first temperature zone (301); wherein the first temperature zone (301) comprises a plurality of parallel-connected PTC thermistor heating elements (301a, 301b, 301c, 301d, 301e). [12] Component holder (1) according to claim 10, wherein a first PTC thermistor heating element (303a) of a third temperature zone (303) is arranged adjacent and peripherally to a first edge of the second PTC thermistor heating element (302b) of the second temperature zone (302), and a second PTC thermistor heating element (303b) of the third temperature zone (303) is arranged adjacent and peripherally to a first edge of the first PTC thermistor heating element (303a) of the third temperature zone (303); wherein the third temperature zone (303) comprises a plurality of PTC thermistor heating elements (303a, 303b) connected in parallel. [13] Component holder (1) according to one of the preceding claims, wherein the component holder (1) further comprises one or more temperature sensors (400). [14] A method for using a component holder (1) according to any one of claims 1 to 13 for controlling the temperature control of one or more regions of the component contact surface (350), the method comprising controlling a relative temperature difference between one or more temperature zones and / or between one or more PTC thermistor heating elements of a temperature zone during a process step. [15] A method of using a component holder (1) according to claim 14, wherein the method comprises controlling a relative temperature difference between one or more temperature zones and / or between one or more PTC thermistor heating elements of a temperature zone in order to achieve a homogeneous distribution of the temperature of the component contact surface (350).

Images