Method for manufacturing a component

Abstract

A method for manufacturing a component comprises applying an electrical voltage using an inductor (109) to a stack of a first component (102), a second component (104), and a reactive multilayer system (106) to generate a current flow through the reactive multilayer system (106) and at least one of the components (102, 104), moving the reactive multilayer system (106) and the at least one of the components (102, 104) apart from each other to generate a spark (215) using a spark voltage generated by the inductor (109) to trigger a reaction of the reactive multilayer system (106), and bringing the reactive multilayer system and the at least one of the components (102, 104) together during the reaction to form the component (1300) by means of a metallurgical bond between the components (102, 104).

Description

[0001] The present invention relates to a method for producing a component using a reactive multilayer system.

[0002] A reactive multilayer system, such as a reactive multilayer film (RMS), can be used to bond elements. Reactive multilayer systems are known from DE 19 16 712 A and CN 1 07 297 554 A.

[0003] Against this background, the present invention provides an improved method and an improved device for producing a component according to the main claims. Advantageous embodiments emerge from the subclaims and the following description.

[0004] The energy required to activate a reactive multilayer system can be provided in the form of electrical energy using an inductor. Advantageously, this allows the amount of electrical energy to be metered very precisely.

[0005] A method for manufacturing a component comprises the following steps: Applying an electrical voltage using an inductance to a stack of a first component, a second component, and a reactive multilayer system, wherein the reactive multilayer system is arranged between the first component and the second component, in order to generate a current flow through the reactive multilayer system and at least one of the components; Moving the reactive multilayer system and the at least one of the components away from each other to generate an ignition spark between the reactive multilayer system and the at least one of the components using an ignition voltage generated by the inductance to trigger a reaction of the reactive multilayer system; and Combining the reactive multilayer system and at least one of the components during the reaction in order to form the component by means of a material-to-material connection between the components.

[0006] The component can be an assembly of components. The first component can be an electronic component or a sensor. For example, the first component can be a semiconductor component or a power semiconductor component, a chip, or a wafer. For example, the component can be embodied as a transistor or diode or as a force sensor. The second component can be a carrier for the first component. For example, the second component can be a carrier for electronic components, for example a circuit board, or a substrate, for example a copper substrate or ceramic substrate. The second component can also be a machine element, for example a connecting element or an element for transmitting forces or movements, for example a shaft.The reactive multilayer system can be a reactive multilayer film, or RMS for short, which can provide instant heat for a wide variety of applications across many industries. The reactive multilayer system can be fabricated by vapor deposition of thousands of alternating nanoscale layers, for example, of aluminum and nickel. The reactive multilayer system can be arranged as a film between the components or comprise reactive layers that have been sequentially applied directly to one or both of the components to form the reactive multilayer system. Thus, the components and the reactive multilayer system can be provided as pre-assembled parts or as individual parts during the application step.The reactive multilayer system can be used to effect a mechanical and electrically conductive connection between the first component and the second component in response to an activation of the reactive multilayer system triggered by the reaction. The electrical energy required to trigger the ignition spark can be transferred from the inductor to the stack in a suitable manner. The reaction or activation can also be referred to as ignition of the reactive multilayer system. The ignition voltage can be applied to the stack in such a way that the ignition spark caused by the ignition voltage jumps from at least one of the components to the reactive multilayer system, or vice versa. Thus, the current flow used for the reaction can be conducted via or through at least one of the components. The inductor can be implemented as a coil.During the application step, the current can flow through the inductor and through the stack. The inductor's size can be selected such that the ignition voltage provided by the inductor upon removal is sufficient to generate the ignition spark that triggers the reaction. The ignition spark can generate sufficient thermal energy in the area of ​​the reactive multilayer system to reach the temperature required to trigger the reaction of the reactive multilayer system. By at least partially dissolving the stack during the removal step, the ignition voltage can trigger the ignition spark. The integral connection can also be referred to as a multilayer bond or realized by multilayer bonding.

[0007] According to various embodiments, the electrical voltage can be applied between the two components in the application step, whereby the current flows from one of the components into the reactive multilayer system and from the reactive multilayer system into the other of the components. For example, a first voltage potential of the activation voltage can be applied to one of the components and a second voltage potential of the activation voltage can be applied to the other of the components. This is useful, for example, if the reactive multilayer system cannot be contacted or is difficult to contact.

[0008] Alternatively, the electrical voltage can be applied between one of the two components and the reactive multilayer system, causing the current to flow from the component into the reactive multilayer system, or vice versa. This is advantageous if one of the components does not have a suitable contact area for applying a voltage potential or a suitable connection section for conducting the current flow intended for activation.

[0009] In the steps of moving away and bringing together, a relative movement can occur between the reactive multilayer system and at least one of the components. Thus, both components can be moved, or one of the components can be at rest, and the other can be moved away from the stationary component and then back toward it. The reactive multilayer system can already be located on one of the components and thus, if necessary, be moved along with it. If only one of the components is moved, a bringing device used for bringing together can be designed more simply.

[0010] During the application step, the electrical voltage can be applied to the stack while the reactive multilayer system is in contact with both components. This allows current to flow through the entire stack and thus through the inductance.

[0011] In the moving-away step, according to the invention, the reactive multilayer system and at least one of the components are tilted relative to each other. In this way, a position of the ignition spark and thus of the activation can be defined and a result of the bonding process can be influenced by means of the reactive multilayer system.

[0012] During the joining step, the first component, the reactive multilayer system, and the second component can be pressed together. The joining step can thus be continued until sufficient contact pressure is achieved. This can improve the quality of the bond between the components created by the activated reactive multilayer system.

[0013] During the application step, the electrical voltage can be applied to the stack using at least one electrical contact tip. Such a contact tip enables contacting of very small contact surfaces. Furthermore, special connecting elements, such as connectors, on the stack side can be dispensed with.

[0014] In such a case, one of the components can be moved together with the electrical contact tip during the steps of moving away and bringing together. For example, the first component can be contacted by a first contact tip and moved toward the second component together with the first contact tip. Optionally, the respective component can be moved using the contact tip.

[0015] A device for producing such a component, which is not the subject of the invention, has the following features: an application device configured to apply an electrical voltage using an inductance to a stack of a first component, a second component, and a reactive multilayer system to generate a current flow through the reactive multilayer system and at least one of the components, wherein the reactive multilayer system is arranged between the first component and the second component; and a movement device which is designed to move the reactive multilayer system and the at least one of the components away from one another in a triggering mode in order to generate an ignition spark between the reactive multilayer system and the at least one of the components using an ignition voltage generated by the inductance in order to trigger a reaction of the reactive multilayer system, and in a composite mode to bring the reactive multilayer system and the at least one of the components together during the reaction in order to form the component by means of a materially bonded connection between the components.

[0016] Using the device, the steps of the aforementioned method for manufacturing a component can be advantageously carried out. Known manufacturing devices can be used for the device's devices, with which components can be held and moved, for example, and with which an electrical voltage can be applied. Accordingly, the displacement device can be designed to hold the components and move them in opposite directions. In addition to the inductance, the application device can optionally comprise a voltage source and, for example, contact tips for contacting at least one of the components. Optionally, the voltage source and the inductance are connected in series.

[0017] The invention is explained in more detail by way of example with reference to the accompanying drawings. They show: Fig. 1 shows a representation of a first sub-step of an embodiment of a method for producing a component; Fig. 2 shows a representation of a second sub-step of an embodiment of a method for producing a component; Fig. 3 shows a representation of a third sub-step of an embodiment of a method for producing a component; Fig. 4 shows a representation of the third sub-step of an embodiment of a method for producing a component; Fig. 5 shows an illustration of an embodiment of a method for producing a component; Fig. 6 shows an illustration of an embodiment of a method for producing a component; Fig. 7 shows an illustration of an embodiment of a method for producing a component; Fig. 8 shows an illustration of an embodiment of a first component; Fig. 9 shows an illustration of an embodiment of a first component; Fig. 10 shows an illustration of an embodiment of a second component; Fig. 11 shows an illustration of an embodiment of a second component; Fig. 12 is a diagram illustrating activation of an embodiment of a reactive multilayer system; Fig. 13 a schematic representation of an embodiment of a component; and Fig. 14 a flow diagram of an embodiment of a method for producing a component.

[0018] In the following description of preferred embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures and having a similar effect, whereby a repeated description of these elements is omitted.

[0019] Fig. Figure 1 shows a representation of a first substep of an exemplary embodiment of a method for producing a component. By way of example, the component is produced using a device 100 for producing the component.

[0020] Shown is a stack of a first component 102, a second component 104, and a reactive multilayer system 106 arranged between the first component 102 and the second component 104, which is not yet fully bonded together. The reactive multilayer system 106 has not yet been ignited.

[0021] By way of example, the reactive multilayer system 106 is arranged on a surface of the second component 104. The first component 102 is arranged on the reactive multilayer system 106, specifically on a side of the reactive multilayer system 106 opposite the second component 104. An electrically conductive contact exists between the components 102, 104 via the reactive multilayer system 106.

[0022] The shape and arrangement of the components 102, 104 is chosen only as an example and can also be interchanged here and in the embodiments described with reference to the following figures, so that, for example, the lower of the Fig. 1 shown components 102, 104 as the first component and the upper one of the in Fig. 1 could also be referred to as a second component.

[0023] According to one embodiment, the first component 102 is an electronic component, for example a semiconductor component, and the second component 104 is a carrier for the first component 102. For example, the second component 104 is a circuit board or a substrate, for example a copper substrate. For example, the first component 102 is a chip, purely by way of example a transistor or a diode. According to one embodiment, after ignition of the reactive multilayer system 106 and complete combination of the first component 102, the reactive multilayer system 106, and the second component into a stack, at least one electrical connection of the first component 102 is permanently electrically and mechanically connected to an electrical contact of the second component 104.

[0024] According to an alternative embodiment, the first component 102 is a sensor, and the second component 104 is a machine element, for example, a shaft for an electric drive or a transmission. For example, the first component 102 is a force sensor that, after the reactive multilayer system 106 has been ignited and the first component 102, the reactive multilayer system 106, and the second component have been fully combined into a stack, is firmly connected to the second component 104 in order to detect a deformation of the second component 104.

[0025] According to one embodiment, the reactive multilayer system 106 comprises a plurality of alternating nanoscale layers and is configured to react exothermically in response to ignition, thereby establishing a material connection between the components 102, 104. For example, the reactive multilayer system 106 is embodied as a reactive multilayer film placed between the components 102, 104. Alternatively, the layers of the reactive multilayer system 106 are grown, for example, on a surface of one of the components 102, 104.

[0026] To prepare for the activation of the reactive multilayer system 106, an electrical voltage is applied to the stack in the first substep shown. For example, the electrical voltage is not applied between two contact regions of the reactive multilayer system 106, but rather, for example, between contact regions of the components 102, 104 or between a contact region of the reactive multilayer system 106 and a contact region of one of the components 102, 104. According to the exemplary embodiment shown, the electrical voltage is applied between the first component 102 and the second component 104. This generates a current flow i(t) through the stack.

[0027] According to one exemplary embodiment, the device 100 for producing the component is used to provide and apply the electrical voltage. The device 100 comprises an application device that is designed to generate the electrical voltage U using a voltage source 108 and to apply it to the stack using an inductance 109 and optionally using a first electrical contact tip 110 and a second electrical contact tip 112. For example, the first electrical contact tip 110 contacts the first component 102 and the second electrical contact tip 112 contacts the second component 104. The current flow i(t) through the stack occurs via the contact tips 110, 112.

[0028] According to the illustrated embodiment, the voltage source 108 and the inductor 109, for example, a coil, are connected in series. Optionally, a resistor 114 is connected between the inductor 109 and the voltage source 108.

[0029] One terminal of the first contact tip 110 is connected to a first terminal of the voltage source 108, for example, to a positive pole. One terminal of the second contact tip 112 is connected to a first terminal of the inductor 109. A second terminal of the inductor 109 is connected directly or via the optional resistor 114 to a second terminal of the voltage source 108, for example, to a negative pole.

[0030] In this way, a circuit is closed via the voltage source 108, the first contact tip 110, the first component 102, the reactive multilayer system 106, the second component 104, the second contact tip 112, the inductance 109 and the optional resistor 114 and the current flow i(t) occurs.

[0031] The polarity of the voltage source 108 is chosen here and in the following embodiments only as an example and can also be used in reverse.

[0032] Fig. Figure 2 shows a representation of a second sub-step of an embodiment of a method for producing a component. By way of example, the component is produced using the method described in Fig. 1 described device 100 for producing the component.

[0033] In the second sub-step shown, the reactive multilayer system 106 and at least one of the components 102, 104 are moved away from each other. For example, the first component 102 is moved away from a partial stack comprising the second component 104 and the reactive multilayer system 106. Using an ignition voltage generated by the inductor 109, an ignition spark 215 is generated between at least one of the components 102, 104, here the first component 102, and the reactive multilayer system 106. The ignition spark 215 releases sufficient thermal energy to trigger a reaction of the reactive multilayer system 106 and thus an activation of the reactive multilayer system 106.

[0034] According to one embodiment, the ignition spark 215 jumps as soon as a distance d between the first component 102 and the reactive multilayer system 106 is reached.

[0035] According to one embodiment, the device 100 comprises a displacement device 220 configured to perform a relative movement between the reactive multilayer system 106 and at least one of the components 102, 104. For example, the displacement device 220 is configured to move the first contact tip 110 together with the first component 102 away from the reactive multilayer system 106 in a trigger mode and then move them back toward each other in a composite mode.

[0036] The displacement device 220 can be designed in a suitable manner and coupled in a suitable manner to the first component 102 or the first contact tip 110 or alternatively or additionally to the second component 102 or the second contact tip 110.

[0037] Fig. Figure 3 shows a representation of a third sub-step of an embodiment of a method for producing a component. For example, the component is produced using the method described with reference to Fig. 1 described device 100 for producing the component.

[0038] In the third sub-step, the reactive multilayer system 106 and at least one of the components 102, 104, which was previously moved relatively away from the reactive multilayer system 106, are brought back together. The joining takes place during the reaction triggered by the ignition spark. As a result, the component is formed by a materially bonded connection between the components 102, 104.

[0039] According to one embodiment, the merging is carried out using the Fig. 2 described displacement device 220 of the device 100.

[0040] According to one embodiment, in the step of joining, a contact pressure is built up with which the components 102, 104 are pressed together in order to optimize the formation of the material-to-material connection.

[0041] Based on the Fig. 1 to 3 are described in more detail below.

[0042] The reactive multilayer film (RMS), which can be used as a reactive multilayer system 106 according to one embodiment, is a film that provides instant heat for a wide variety of applications in many industries. This reactive multilayer film is produced by vapor deposition of thousands of alternating nanoscale layers, for example, made of aluminum (Al) and nickel (Ni). Activation is triggered by a small local energy pulse from an electrical source, thus eliminating the need for additional optical or thermal sources. Such sources can optionally be used additionally. The reactive multilayer system 106 reacts exothermically and releases precise local heat up to 1500°C in fractions of a second.

[0043] Because the activation of the reactive multilayer system 106 is not carried out by applying an activation voltage only to the reactive multilayer system 106, by a special laser, or by applying a direct heat source to the reactive multilayer system 106, it is not necessary for the reactive multilayer system 106 to be accessible for ignition. Thus, the reactive multilayer system 106, for example the foil, can be located inside or be smaller than the components to be connected, here the components 102, 104. It is also not necessary for the reactive multilayer system 106 to require excess material or ignition tabs through which the energy can be introduced. Furthermore, it is not harmful if surrounding components or geometries block access to the reactive multilayer system 106 for ignition, for example by means of a laser beam.As a result, the design of the component arrangement and thus of the component to be manufactured is subject to only minor restrictions.

[0044] The described approach provides, for example, a small local energy pulse to trigger the activation of the reactive multilayer system 106 with the aid of a current through a conductive part, here, for example, the first component 102, which is part of the stack in the form of an RMS composite system. The current can be conducted through a conductive part that is no longer accessible. This current can flow between an electrically conductive part, for example, the first electrical contact tip 110 as the positive pole, and another electrical part, for example, the second electrical contact tip 112 as the negative pole. The current can flow within the stack, for example, between the first component 102 and the second component 104, or through only one electrically conductive component of the stack, for example, through the first component 102 and the reactive multilayer system 106, as in Fig. 1. By means of the energy introduced into the reactive multilayer system 106 by the current, the reactive multilayer system 106 can be triggered during the approach, for example, the RMS foil can be ignited.

[0045] The voltage source 108 generates in the Fig. 1, the current flow i(t) is limited by the inductance 109 and the resistor 114. The resistor 114 can, in principle, be omitted or set to 0 ohms. The desired current value is reached after a short time. After interrupting the circuit by removing the electrically conductive part, here the first component 102 as shown in Fig. 2, the current is immediately zero, resulting in an almost infinite current change di / dt in the inductor 109, which has an inductance value L1. This large current change results in a high induced voltage U induced in the inductor 109. (U induced = L1 * di / dt) This high voltage is dissipated by the ignition spark 215 between the conductive part, here the first component 102, and the reactive multilayer system 106, and this energy triggers the reactive multilayer system 106 during removal. This ignites the reactive multilayer system 106, for example, in the form of an RMS foil. This allows the reactive multilayer system 106 to be activated without the usual design limitations that arise from other activation methods.

[0046] By using the current conducted through at least one of the components 102, 104 to activate the reactive multilayer system 106, it is also not necessary for the reactive multilayer system 106 to be accessible and thus larger than the actual area to be connected in order to activate the reactive multilayer system 106. This avoids additional material costs, since the method described here for activating the reactive multilayer system 106 by applying current does not require additional material. This allows the required reactive multilayer film material to be kept to a minimum.

[0047] Since the reactive multilayer system 106 does not require accessibility and thus a larger surface than the actual surface to be bonded to activate it, it is possible to prevent protruding reactive material from the reactive multilayer system 106 from splashing or otherwise contaminating surrounding components during the reaction of the reactive multilayer system 106. This prevents contamination of surrounding components by protruding material from the reactive multilayer system 106.

[0048] According to one embodiment, the first component 102 represents, for example, a bare chip, i.e., an unpackaged chip, which is connected to the reactive multilayer system 106, for example, an RMS film, with the second component 104, for example, a substrate. For example, a small local energy pulse for activating the reactive multilayer film is triggered by a current through a conductive component that does not touch the reactive multilayer system 106 and is part of the RMS composite system. The approach speed of the conductive component, here the first component 102, approaching after the ignition of the reactive multilayer system 106, and the subsequent contact pressure represent suitably selected parameters of the manufacturing process.

[0049] Instead of generating the small local energy pulse for activating the reactive multilayer system 106 by a current flowing only through this reactive multilayer system 106, the approach described here has a number of advantages. For example, the reactive multilayer system 106, for example, an RMS foil, can be the same size as or smaller than the components to be connected, here the devices 102, 104, so that no excess material or ignition tabs are required. Multiple internal RMS bonds, for example, the gate and source pads of a transistor, can be produced. The required reactive material for the reactive multilayer system 106 can be kept to a minimum. Contamination of surrounding components by excess material of the reactive multilayer system 106 can be avoided. Such an RMS activation method is well suited for series production due to its good ability to provide RMS ignition energy.

[0050] The removal under current creates an electrical arc to the reactive multilayer system 106, which supports the activation of the reactive multilayer system 106. This improves, among other things, the activation of large-area RMS connections.

[0051] Advantageously, the activation energy can be precisely adjusted. Furthermore, the high current flow during activation is limited in time, so the risk of damage is low.

[0052] According to one embodiment, the following steps are carried out to produce a component and thus to activate the reactive multilayer system 106 by means of a removal process: First, an RMS foil used for the reactive multilayer system 106 is cut.

[0053] Subsequently, the second component 104, for example a substrate, and the reactive multilayer system 106 in the form of the cut RMS foil are placed on top of each other.

[0054] The first component 102, for example in the form of a part, is contacted, for example, with the first electrical contact tip 110, which optionally represents a positive pole, and the second component 104 is contacted, for example, with the second electrical contact tip 112, which optionally represents a negative pole.

[0055] The voltage source 108 generates the current flow i(t) in the closed circuit, as shown in Fig. 1 is shown.

[0056] When the desired current value is reached after a short time, the circuit is interrupted by removing the electrically conductive part, here the first component 102, as shown in Fig. 2 is shown.

[0057] This leads to an induced voltage and the resulting ignition spark 215 between the conductive part and the reactive multilayer system 106, and this energy triggers the reactive multilayer system 106 during removal.

[0058] After activation of the reactive multilayer system 106, the electrically conductive part, here the first component 102, is approached again to establish the RMS bond, as described in Fig. 3 and subsequently in Fig. 4. The approach speed and the subsequent contact pressure are important parameters for this process.

[0059] Fig. 4 shows a further illustration of the third substep of an exemplary embodiment of a method for manufacturing a component. By way of example, the component is manufactured using the aforementioned device 100 for manufacturing the component. The illustration shows the approach of the first component 102 to the reactive multilayer system 106 after ignition by the ignition spark 215. According to one exemplary embodiment, the approach occurs at a defined joining speed until the first component 102 is pressed against the second component 104 and the reacting reactive multilayer system 106 located therebetween with a pressure predefined according to one exemplary embodiment.

[0060] The first electrical contact tip 110 is connected to the first component 102, and the second electrical contact tip 112 is connected to the second component 104, for example, a substrate or carrier material. Upon approach and during activation of the reactive multilayer system 106, the current flows from the first component 102 through the reactive multilayer system 106, for example, in the form of an RMS foil, to the second component 104.

[0061] To provide the electrical voltage U or the small local energy pulse to trigger the activation of the reactive multilayer system 106 by means of a current through a moving conductive part which is part of the RMS composite system, in addition to the Fig. 1 to 4, in which both the first component 102 and the second component 104 are contacted, further possibilities can be realized, as shown by way of example in the following figures.

[0062] Fig. Figure 5 shows a schematic representation of an embodiment of a method for manufacturing a component. Corresponding to the previous figures, it shows a stack comprising a first component 102, a second component 104, and a reactive multilayer system 106 arranged between the first component 102 and the second component 104. The first component 102 is arranged away from the reactive multilayer system 106, the reactive multilayer system 106 is ignited, and the first component 102 is brought closer to the reactive multilayer system 106 again.

[0063] In contrast to the embodiments described with reference to the preceding figures, the second contact tip 112 contacts the reactive multilayer system 106.

[0064] Thus, the electrical contact tip "+" is connected to the part, and the electrical contact tip "-" is connected to the RMS foil. Upon approach and during activation of the reactive multilayer system, the current flows directly from the part to the RMS foil.

[0065] Thus, the first electrical contact tip 110 is connected to the first component 102, and the second electrical contact tip 112 is connected to the reactive multilayer system 106. Upon approach and during activation of the reactive multilayer system 106, the current flows from the first component 102 directly to the reactive multilayer system 106, for example, in the form of an RMS foil.

[0066] Fig. Figure 6 shows a schematic representation of an embodiment of a method for manufacturing a component. As in the previous figures, it shows a stack consisting of a first component 102, a second component 104, and a reactive multilayer system 106 arranged between the first component 102 and the second component 104.

[0067] In contrast to the exemplary embodiments described with reference to the preceding figures, the reactive multilayer system 106 is arranged on the first component 102. The composite of the reactive multilayer system 106 and the first component 102 is arranged remotely from the second component 102. The reactive multilayer system 106 is ignited, and the composite of the reactive multilayer system 106 and the first component 102 is again brought closer to the second component 104. Thus, a relative movement is carried out between the composite and the second component 104. For example, the second component 104 is at rest, and the composite is moved in the direction of the second component 102.

[0068] The first contact tip 110 is connected to the reactive multilayer system 106, and the second contact tip 112 is connected to the second component 104, for example, a substrate. Upon approach and during activation of the reactive multilayer system 106, the current flows from the reactive multilayer system 106 directly to the second component 104.

[0069] According to this and the previous embodiments, the reactive multilayer system 106 protrudes, for example, beyond the first component 102, i.e., it is larger in area than the first component 102.

[0070] For example only, the electrical voltage of the current source 108 or the inductance 109 is applied on the one hand to a surface of the reactive multilayer system 106 facing the first component 102 and on the other hand to a surface of the second component 104 facing the reactive multilayer system 106.

[0071] Fig. Figure 7 shows a schematic representation of an embodiment of a method for manufacturing a component. As in the previous figures, it shows a stack consisting of a first component 102, a second component 104, and a reactive multilayer system 106 arranged between the first component 102 and the second component 104.

[0072] In contrast to the one based on Fig. 6, the first contact tip 110 contacts the first component 102.

[0073] According to this embodiment, the reactive multilayer system 106, for example, has no overhang beyond the first component 102, and is therefore the same size or smaller in area than the first component 102.

[0074] For example only, the electrical voltage of the current source 108 or the inductance 109 is applied on the one hand to a surface of the first component 102 facing away from the reactive multilayer system 106 and on the other hand to a surface of the second component 104 facing the reactive multilayer system 106.

[0075] In this as well as in the other embodiments, the electrical contact tips 110, 112 can be interchanged.

[0076] The position of the electrical arcing, i.e., the ignition spark 215, and thus the position of activation of the reactive multilayer system 106, can be manipulated by mutually tilting the first component 102, the reactive multilayer system 106, the second component 102, or a corresponding composite, for example, the part or substrate being removed and the RMS foil. The electrical arcing then occurs at the nearest location. This allows the bonding result to be influenced.

[0077] The approach described here for activating the reactive multilayer system 106 by current through a conductive part is therefore also suitable for the reactive multilayer system 106 in the form of a directly grown reactive multilayer system on one of the components 102, 104, for example on an electrically conductive part, e.g., a bare chip, or on a substrate.

[0078] The described approach enables subsequent electrical testing, e.g. via a conductance measurement, of the bond connection produced by the activation of the reactive multilayer system 106, also referred to as an adhesive connection, without the attachment of additional measuring tips, since the electrical contacts for the activation, e.g. the electrical contact tips 110, 112 of the reactive multilayer system 106 according to one embodiment, are already present.

[0079] Fig. Figure 8 shows an illustration of an embodiment of a first component 102, as described, for example, with reference to the preceding figures. The first component 102 can be made entirely of an electrically conductive or electrically conducting material, or as in Fig. 8, have at least one electrically conductive region 840 and at least one electrically non-conductive region 842.

[0080] By way of example, the first component 102 has only a single electrically conductive region 840, which is surrounded by electrically non-conductive regions 842 and extends over the entire height of the first component 102, such that a current flow is possible via the electrically conductive region 840 from a surface facing away from the reactive multilayer system to a side of the first component 102 facing or capable of facing the reactive multilayer system.

[0081] The electrically conductive region 840 forms, for example, a connecting section through which a current caused by the activation voltage can flow. For example, a first voltage potential of the activation voltage is applied, for example using an electrical contact tip or another contacting device, to a contact region of the first component 102 formed by the conductive region 840 or electrically conductively connected to the conductive region 840. The connecting section electrically conductively connects the contact region to a contacting surface of the first component. The contacting surface represents an interface to the reactive multilayer system for the current caused by the activation voltage.

[0082] Fig. 9 shows a representation of an embodiment of a first component 102, as it is shown for example in Fig. 8, but with the difference that the first component 102 has a plurality of electrically conductive regions 840 that are spaced apart from one another and each electrically insulated from one another by electrically non-conductive regions 842. For example, two of the electrically conductive regions 840 are embedded in electrically non-conductive regions 842, and one electrically conductive region 840 extends along an edge of the first component 102. In this way, three separate current flows through the first component 102 are possible, so that, for example, three separate reactive multilayer systems can be activated.

[0083] Fig. 10 shows an illustration of an embodiment of a second component 104. The second component 104 is designed in accordance with the embodiment described with reference to Fig. 8 described first component with only one electrically conductive region 840.

[0084] Fig. 11 shows an illustration of an embodiment of a second component 104 which, in contrast to the one shown in Fig. 10 has a plurality of, for example, two electrically conductive regions 840. For example, one of the two electrically conductive regions 840 is significantly larger, for example, at least five times as large as the other electrically conductive region 840.

[0085] As shown by the Fig. As shown in Figures 8 to 11, the first component 102 and, additionally or alternatively, the second component 104 can be partially electrically conductive and electrically non-conductive. Several separate electrically conductive segments are also possible, e.g., gate and source pads of a transistor or a specially developed separate electrically conductive segment for activating the reactive multilayer system or multiple reactive multilayer systems. Several separate electrically conductive segments enable the activation of several separate reactive multilayer systems, e.g., to connect separate electrical contacts such as the gate and source.

[0086] Thus, the contacting surfaces of the first component 102 represent, for example, electrical connections of the first component 102, and the contacting surfaces of the second component 104 represent, for example, connection surfaces of the second component 104 for electrically contacting the connections of the first component 102. Alternatively, the contacting surfaces are, for example, only sections of surfaces of the components 102, 104.

[0087] Fig. 12 shows a schematic representation of a reaction of an embodiment of a reactive multi-layer system 106 to a reacted reactive multi-layer system 1206, as used, for example, to produce a component as shown in Fig. 13. The reactive multilayer system 106 is constructed, for example, from a plurality of first layers 1230 and a plurality of second layers 1232 arranged alternately, with optionally intermixed regions 1234 being located between adjacent layers 1230, 1232.

[0088] A position of an activation is shown schematically, exemplified in the form of an ignition spark 215. Starting from the position of activation, the material of the reactive multilayer system 106 reacts to form reacted material of the reacted reactive multilayer system 1206. A corresponding propagation direction 1236 is indicated by an arrow.

[0089] The reactive multilayer system 106, according to one embodiment, is a reactive multilayer film. This is a film that provides instant heat for a variety of applications in many industries. This reactive multilayer film is manufactured by vapor deposition of thousands of alternating nanoscale layers, which are Fig. 12 are schematically represented by the layers 1230, 1232 and consist, for example, of aluminum (Al) and nickel (Ni). Activation is triggered by a small local energy pulse from an electrical source, as shown in Fig. 12 is schematically represented by the ignition spark 215. The reactive multi-layer system 106 reacts exothermically to generate precise local heat up to 1500 °C in fractions of a second.

[0090] In this way, a connection that is both electrically and thermally conductive can be made, e.g. between a bare chip in electronics and a leadframe, a packaged chip and a printed circuit board, etc. - ie generally a connection between two parts, which are referred to here as components by way of example.

[0091] Fig. 13 a representation of a component 1300. After the components 102, 104 have been completely brought closer together again after the activation of the reactive multilayer system, as is the case, for example, in Fig. 3, the components 102, 104 have been materially bonded to the component 1300 by the reaction of the reactive multilayer system following the activation to form the reacted reactive multilayer system 1206.

[0092] Fig. 14 shows a flow diagram of an embodiment of a method for manufacturing a component. The component, for example, the component illustrated in Fig. The component shown in Figure 13 can be manufactured using a stack of a first component, a second component and a reactive multilayer system, as shown in the preceding figures.

[0093] In a step 1401, an electrical voltage is applied to the stack, as is shown, for example, by Fig. 1. A circuit is closed, with the current flowing through an inductor, at least one of the components, and the reactive multilayer system. According to one embodiment, the magnitude of the current is selected such that the reactive multilayer system is not initially activated by the current flowing through it.

[0094] In a step 1403, the reactive multilayer system and the at least one of the components through which the current also flows are moved away from each other. This creates a gap between the reactive multilayer system and at least one of the components, interrupting the circuit. The resulting current change within the inductance leads to the provision of an ignition voltage generated by the inductance, which causes an ignition spark to bridge the gap. The ignition spark triggers a reaction of the reactive multilayer system.

[0095] In a step 1405, the gap is closed again by reuniting the reactive multilayer system and at least one of the components during the reaction. This forms a material bond between the components and produces the component. Reference symbol 100 device 102 first component 104 second component 106 reactive multilayer system 108 Voltage source 109 Inductance 110 first contact tip 112 second contact tip 114 Resistance 215 ignition spark 220 Traversing device 840 electrically conductive area 842 electrically insulating area 1206 activated reactive multilayer system 1230 first layer 1232 second layer 1234 mixed regions 1236 Propagation direction 1300 components 1501 Step of creating 1503 Step of moving away 1505 Merge step

Claims

[1] A method for manufacturing a component (1300), the method comprising the following steps: Applying (1401) an electrical voltage using an inductance (109) to a stack of a first component (102), a second component (104) and a reactive multilayer system (106), wherein the reactive multilayer system (106) is arranged between the first component (102) and the second component (104) in order to generate a current flow through the reactive multilayer system (106) and at least one of the components (102, 104); Moving (1403) the reactive multilayer system (106) and the at least one of the components (102, 104) away from each other to generate an ignition spark (215) between the reactive multilayer system (106) and the at least one of the components (102, 104) using an ignition voltage generated by the inductance (109) to trigger a reaction of the reactive multilayer system (106); and Combining (1405) the reactive multilayer system (106) and at least one of the components (102, 104) during the reaction in order to form the component (1300) by means of a material connection between the components (102, 104), characterized by that in the step (1403) of moving away, the reactive multilayer system (106) and the at least one of the components (102, 104) are tilted relative to one another. [2] Method according to claim 1, wherein in the step (1401) of applying the electrical voltage is applied between the first component (102) and the second component (104) or between one of the components (102, 104) and the reactive multilayer system (106). [3] Method according to one of the preceding claims, wherein in the steps (1403, 1405) of moving away and bringing together a relative movement between the reactive multilayer system (106) and at least one of the components (102, 104) is carried out. [4] Method according to one of the preceding claims, wherein in the step (1401) of applying the electrical voltage is applied to the stack while the reactive multilayer system (106) is in contact with both components (102, 104). [5] Method according to one of the preceding claims, wherein in the step (1405) of merging, the first component (102), the reactive multilayer system (106) and the second component (104) are pressed together. [6] Method according to one of the preceding claims, wherein in the step (1401) of applying the electrical voltage is applied to the stack using at least one electrical contact tip (110, 112). [7] Method according to claim 6, wherein in the steps (1403, 1405) of moving away and bringing together, the at least one of the components (102, 104) is moved together with at least one of the electrical contact tips (110, 112).

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