CONTACTING MODULE FOR CONTACTING OPTO-ELECTRONIC CHIPS

Description

[0001] The invention relates to a contacting module for testing optoelectronic chips, as is known by generic name from WO 2019 / 029765 A1.

[0002] The invention relates to the testing and qualification of chips with photonic integrated circuits (PICs) at the wafer level. Unlike conventional chips with purely electrically integrated circuits (ICs), PICs integrate optical functionalities in addition to the electrical circuits.

[0003] In the manufacturing of integrated circuits (ICs), for example using CMOS technology, tests and measurements are performed at various stages of the process to monitor the manufacturing process and to conduct quality control. One established test is the electrical wafer-level test after the wafer has been prepared. This test identifies functional and non-functional chips (known good dies), records them in a wafer map, and thus determines the yield. When the wafer is separated into individual chips, the non-functional chips are then sorted out. The test equipment required for the wafer-level test consists of wafer probers and wafer testers with associated contact modules (probe cards). The contact module connects the device-side interfaces (inputs and outputs) of the wafer tester to the individual interfaces (inputs and outputs) of the chips on the wafer fixed to the wafer prober.The contact module is generally designed to contact only one chip, but can also be configured to contact multiple chips simultaneously. It is also not strictly necessary for the chips to be present in the wafer assembly for contacting. To contact multiple chips on a wafer simultaneously or sequentially, the chips simply need to have a fixed and defined orientation relative to each other. This flexibility is present in prior art contact modules as well as in a contact module according to the invention.

[0004] Test equipment for testing purely electronic chips (semiconductor chips with ICs) has been optimized and diversified over decades in order to qualify high volumes of diverse ICs with high throughput in order to optimize costs.

[0005] PICs are typically manufactured using the same established semiconductor processes, such as CMOS technology. The very low production volumes of PICs compared to IC manufacturing initially meant that semiconductor fabricators typically only performed process characterization tests, but no functional tests of the PICs. Functional characterization was the responsibility of the end customer and was often performed on cut chips. The test equipment used employed independent, separate electrical and optical contact modules.

[0006] Testing PICs at the wafer level requires coupling light in and out from the PIC plane, typically using integrated grating couplers as coupling points. These grating couplers can be functional components within the chip or sacrificial structures on the wafer, for example, in the groove or on adjacent chips.

[0007] US Patent 6 515 494 B1 discloses a device for testing electronic chips, which includes an infrared microscope for imaging and adjusting the needle tips of a contacting module to the pads of the electronic chip.

[0008] From the aforementioned US 2006 / 0109015 A1, an optoelectronic probe module for testing chips with electrical and optical inputs and outputs (DUT) is known, comprising a probe substrate and a redistribution substrate. The probe module provides an interface between a test apparatus (ATE) and the DUT and is equipped with electrical probes, optical probes, optical elements, and combinations thereof to transmit signals to and from the DUT and redistribute these signals for an interface with the test apparatus.

[0009] The separation into a contacting plate and a redistribution plate leads to a modular design of the contacting module, which has the advantage that in case of damage to the electrical contacts the contacting plate can be replaced, while the redistribution plate can continue to be used with the comparatively expensive electrical and optical distribution network.

[0010] Regarding the optical inputs and outputs (optical interfaces), it is disclosed that these are created via optical elements located on the contact plate and / or the redistribution plate and are adapted to various coupling mechanisms, e.g., free radiation, quasi-free radiation, or waveguides. Diffractive and refractive elements are specified as suitable optical elements for this purpose. It is also disclosed that a photodetector or a light source can be arranged directly at the interface to the device under test (DUT), thus constituting the optical input or output on the contact plate.

[0011] According to an embodiment of the aforementioned US 2006 / 0109015 A1, the optical and electrical signal lines (optical and electrical distribution network) are implemented on separate redistribution plates. It is proposed to route the electrical signals from the DUT to the edge regions of the contact plate, so that the electrical signals are coupled into the first redistribution plate located above the contact plate at the edge region. This allows an opening to be formed in the first redistribution plate, in which only the electrical signals are redistributed, through which the optical signals are routed to a separate second redistribution plate located above it.

[0012] In summary, the aforementioned US 2006 / 0109015 A1 presents a variety of ideas for how a contacting module, which is justifiably divided into a contacting plate and a redistribution plate (e.g., due to wear and tear of the mechanical contacts for electrical signal transmission), could be additionally equipped with optical signal lines. However, it is overlooked that the tolerances possible for the mechanical contact of the electrical inputs and outputs of the contacting module to the device under test (DUT) are not transferable to the optical inputs and outputs.

[0013] While the transmission of a consistently identical electrical signal via electrical interfaces requires mechanical contact between needles on the contacting module and contact pads on the DUT, which can be ensured within a comparatively large positional tolerance of a few µm in all three spatial directions, the quality of optical signal transmission is affected by a much smaller deviation of the optical interfaces from their intended position, in the sub-µm range.

[0014] From US patent 2012 / 0033208 A1, a device for testing optoelectronic chips is known, comprising an optical module with four optical blocks, each having an arrangement of optical interfaces in an optical interface plane. The optical module also includes a mounting plate. The device further includes an electronic module comprising a carrier plate, a circuit board, and a needle carrier with an arrangement of contact needles with needle tips. A repeatedly detachable connection, achieved by means of a spring mechanism, exists between the mounting plate and the electronic module. The device does not have a permanent connection between the optical blocks and the mounting plate; rather, the optical block is aligned on the mounting plate with the optical interfaces of the optoelectronic chip.

[0015] WO 2019 / 029765 A1 discloses a contacting module that is insensitive to positional tolerances of the optical interfaces. Similar to contacting modules according to the invention and others known from the prior art, a contacting module described here is arranged between a wafer platform, e.g., a wafer probe on which a wafer with optoelectronic chips to be tested is fixed, and a test apparatus for generating and evaluating optical and electrical signals. The contacting module establishes the signal connection between the individual optical and electrical interfaces of an optoelectronic chip to be tested and the device-specific optical and electrical interfaces of the test apparatus. The interfaces are electrical or optical inputs and outputs, from which and into which the electrical or optical signals are received and received.are extracted and routed to or from the optoelectronic chip under test via electrical or optical signal lines.

[0016] The electrical interfaces on contact module 1 are each formed by the needle tips of contact needles, which, for the purpose of transmitting the electrical signals, are mechanically in contact with an electrical interface of the optoelectronic chip under test, each interface being formed by an electrical contact plate. As detailed in the description of the prior art, the tolerance limits required for reliable electrical contacting are large compared to the tolerances required for optical contacting.

[0017] It is also known from the aforementioned WO 2019 / 029765 A1 that the contacting module comprises an electronic module on which the electrical interfaces are arranged and an optical module on which the optical interfaces are arranged. The optical module is attached to the electronic module via defined mechanical interfaces, thus ensuring a defined relative position between the arrangement of electrical interfaces and the arrangement of optical interfaces.

[0018] The advantage compared to a monolithic contact module lies particularly in the fact that the electrical and optical signal lines can be manufactured independently of each other using different production processes and even on or in substrates made of different materials. To ensure that all interfaces, whether optical or electrical, form a common arrangement that can be adjusted relative to the optoelectronic chip under test, the optical block is fixedly aligned with the electronic block.

[0019] In an advantageous embodiment of the contacting module, the optical block is advantageously designed in its dimensions and geometry, including openings or apertures, such that all contact pins present on the electronic module can make contact with the chip 2 past, around, and / or optionally through openings formed in the optical block. This enables the integration of all optical interfaces in a monolithic optical block.

[0020] In one embodiment of a contacting module described in the aforementioned WO 2019 / 029765 A1, the electronic module corresponds in its technical design to a conventional contacting module for purely electronic chips. It comprises a printed circuit board, an arrangement of contact needles (here exemplified as cantilever needles), and a carrier plate on which the mechanical interfaces to the test apparatus are located. Electrical contact is achieved via the electronic module through physical contact of the contact needles with the electrical contact pads of the chip.

[0021] The optical module consists of an optical block with optical signal lines, each in the form of waveguides and an integrated mirror positioned upstream of each waveguide, a fiber holder with V-grooves, as well as optical fibers and single-fiber connectors or a multi-fiber connector. The waveguides are manufactured using a laser direct writing process, and the mirrors using a laser-assisted etching process. Consequently, the waveguides are formed by the input of laser energy through locally limited modified substrate material, which is characterized in particular by a local refractive index modification compared to the refractive index of the substrate material. The mirrors are formed by interfaces of etched recesses in the substrate material. The substrate material of the optical block is glass, preferably borofloat glass, and has a thickness in the range of a few hundred micrometers to a few millimeters, preferably 0.5–1 mm.Optical contacting is achieved without direct contact with the chip, via a gap between the chip and the contacting module. The manufacturing process used for the mirrors and waveguides allows for highly precise fabrication of the optical interfaces, both relative to each other and to a mechanical interface on the optical block. Furthermore, the mirrors and waveguides can be freely positioned within the substrate material.

[0022] Preferably, the optical module is connected to the electronic module by being glued to a carrier plate within the electronic module, for example, via three fixing points. During the fabrication of the electronic module, e.g., using cantilever needles as contact points, the Z-height of the needles is typically referenced to the clamping points of the contact module with a fixed reference to the wafer platform. If a metal frame serves as the carrier plate, these reference points are located on the metal frame, into which the fixing points for the optical module are integrated with high precision. Thus, the optical module can be mounted exactly parallel to the reference plane of the contact needle tips by precisely gluing it to the fixing points in the Z-direction. Furthermore, parallel mounting of the optical module to the electronic module prevents the optical module from colliding with the chip during operation, such as during contacting, due to the small working distance.

[0023] As an alternative to attaching it to the carrier plate, the optical block can also be attached directly to the circuit board.

[0024] In the aforementioned WO 2019 / 029765 A1, it is merely disclosed and suggested that mechanical interfaces between the optical block and the electronic module be indirectly connected using adhesive. No further details are provided, therefore it is suggested that adhesive is applied between the planar mechanical interfaces.

[0025] The object of the invention is to find a contacting module with a new, cost-effective design of the mechanical interfaces between the optical block and the electronic module or the optical block and a mounting plate connected to the electronic block, with which the optical block can be freely positioned in all 6 degrees of freedom relative to the electronic module in an adjustment position and subsequently fixed exactly in this adjustment position permanently.

[0026] It is also an object of the invention to find a method for mounting an optical block that is adjustable in all 6 degrees of freedom to an electronic module or a mounting plate connected to the electronic block, with which the optical block can be fixed in an adjusted position with high precision and easily.

[0027] The problem for a contacting module is solved for a contacting module with an optical module comprising an optical block made of glass, which has an arrangement of optical interfaces in an optical interface plane, and an electronic module comprising a carrier plate, a circuit board and a needle carrier with an arrangement of contacting needles with needle tips, which form an arrangement of electrical interfaces in an electrical interface plane, wherein the optical module and the electronic module are arranged to each other such that the arrangement of optical interfaces and the arrangement of electrical interfaces have a defined alignment position relative to each other with respect to all six degrees of freedom of a Cartesian coordinate system.It is essential to the invention that, according to a first alternative, the optical block is permanently connected to the carrier plate via at least three cylindrical pins, or, according to a second alternative, the optical module has a mounting plate to which the optical block is permanently connected via at least three cylindrical pins. The cylindrical pins each bear against the optical block with adhesive at a first end face. Parallel through-holes are provided in the carrier plate or the mounting plate, in which the cylindrical pins are each connected to the carrier plate or the mounting plate via adhesive.

[0028] Advantageous embodiments are specified in dependent claims 2 to 6.

[0029] The problem for a method is solved by a method for assembling a contacting module, with an optical module comprising an optical block made of glass, which has an arrangement of optical interfaces in an optical interface plane, and an electronic module comprising a carrier plate, a circuit board and a needle carrier with an arrangement of contacting needles with needle tips which form an arrangement of electrical interfaces in an electrical interface plane, wherein the optical module and the electronic module are arranged to each other in such a way that the arrangement of optical interfaces and the arrangement of electrical interfaces have a defined alignment position to each other.

[0030] According to a first alternative, the arrangement of optical interfaces is first adjusted to the arrangement of electrical interfaces, and then the optical block is permanently connected to the carrier plate via an adhesive connection according to the invention.

[0031] According to a second alternative, the mounting plate contained in the optical module is first connected to the carrier plate via a detachable connection in a reproducible relative position, then the arrangement of optical interfaces is adjusted to the arrangement of electrical interfaces, and then the optical block is permanently connected to the mounting plate via an adhesive connection according to the invention.

[0032] It is essential to the invention that the adhesive bond is created for both of the aforementioned alternatives by producing at least three parallel through-holes in the carrier plate or the mounting plate and by guiding at least three cylindrical pins through one of the through-holes until they come into contact with the optical block. Prior to this, adhesive is applied to the first end face of each cylindrical pin facing the optical block, causing them to bond to the block. The cylindrical pins are then bonded to the carrier plate or the mounting plate either during or after being guided through the through-holes.

[0033] The invention is explained in more detail below with reference to exemplary embodiments and drawings. These include: Figs. 1a and 1b contact module according to a first alternative in which the optical block of the optical module is connected to the carrier plate of the electronic module via an adhesive bond, in a top view and a sectional view; Figs. 2a and 2b contact module according to a second alternative in which the optical block is connected to a mounting plate of the optical module via an adhesive bond, in a top view and a sectional view; Fig. 3a a first embodiment of an adhesive bond according to the invention; Fig. 3b a second embodiment of an adhesive bond according to the invention; Figs. 4a and 4b contact module according to the second alternative with a first embodiment of the releasable connection

[0034] A contact module according to the invention, as described in the Fig. 1a und 1b The figure shows an optical module 1 comprising a glass optical block 1.1, which has an arrangement of optical interfaces Sopt in an optical interface plane Eopt, and an electronic module 2 comprising a carrier plate 2.1, a printed circuit board 2.2, and a needle carrier 2.3 with an arrangement of contact needles 2.3.1 with needle tips, which form an arrangement of electrical interfaces Sele in an electrical interface plane Eele. The carrier plate 2.1 and the needle carrier 2.3 are rigidly connected to each other or form a monolithic unit. The optical module 1 and the electronic module 2 are arranged relative to each other such that the arrangement of optical interfaces Sopt and the arrangement of electrical interfaces Sele have a defined alignment position with respect to all six degrees of freedom of a Cartesian coordinate system. The optical block 1.1 is fixed in an alignment position by means of an adhesive bond.According to a first alternative for a contacting module according to the invention, the adjustment position can be fixed directly between the optical block 1.1 and the electronic module 2, for which the carrier plate 2.1 forms the mechanical basis, via an adhesive connection according to the invention, see . Fig. 1a und 1b or, according to a second alternative, it can be indirectly fixed between the optical block 1.1 and a mounting plate 1.2 optionally encompassed by the optical module 1 via an adhesive connection according to the invention, which is connected to the electronic module 2, more precisely to the carrier plate 2.1, via a reproducible, detachable connection, see Fig. 2a und 2b .

[0035] It is essential to the invention that the adhesive connection between the optical block 1.1 and the mounting plate 1.2 or between the optical block 1.1 and the carrier plate 2.1 is established indirectly via at least three cylindrical pins 5. As shown in the Fig. 3a und 3b As can be seen more clearly, the cylindrical pins 5 each rest with a first end face 5.1 against the optical block 1.1 via adhesive 9. Through holes 7 are provided in the carrier plate 2.1 and the mounting plate 1.2, in which the cylindrical pins 5 are fixed to the carrier plate 2.1 and the mounting plate 1.2, respectively, via adhesive 9.

[0036] The cylindrical pins 5 and the through-holes 7 are dimensioned to match each other in such a way that a second end face 5.2 projects beyond the through-holes 7, thus holding them in place during assembly until they contact the optical block 1.1. The adhesive 9 is applied to the projecting circumferential surface of the cylindrical pins 5, see [reference]. Fig. 3a .

[0037] In another version, shown in Fig. 3b ,The second end face 5.2 of the cylindrical pins 5 is arranged lying inside one of the through holes 7 and any remaining free volume in the through hole 7 is filled with adhesive 9.

[0038] In the case in which the optical block 1.1 is bonded to a mounting plate 1.2 according to the invention, the mounting plate 1.2 is advantageously connected to the carrier plate 2.1 via a repeatedly detachable connection, whereby the detachable connection ensures repeated adjustment of the alignment position of the arrangement of the optical interfaces S opt to the arrangement of the electrical interfaces S ele.

[0039] A first version of the detachable connection is in Fig. 4a und 4b The illustration shows, although the depiction of an adhesive bond according to the invention has been omitted here. Three projections 1.2.1.1, defining a mounting plane, are provided on an end face of the mounting plate 1.2.1. These projections bear against a mounting surface 2.1.1 of the carrier plate 2.1, thus defining the relative position of the mounting plate 1.2.1 in a z-direction, about an x-direction, and about a y-direction of a Cartesian coordinate system with respect to the carrier plate 2.1. Three dowel pins 2.1.2, aligned parallel to the mounting plane, are provided on the circumference of the mounting plate 1.2.1. Two of these are oriented perpendicular to each other and each bear against a stop pin 1.2.2.1 provided on the carrier plate 2.1. This defines the relative position of the mounting plate 1.2.1 in the x-direction and in the y-direction with respect to the carrier plate 2.1. The third of the dowel pins 2.1.2 rests against another stop pin 1.2.2.1 present on the carrier plate 2.1, thus determining the relative position of the mounting plate 1.The position of the mounting plate 1.2 relative to the carrier plate 2.1 is fixed in the z-direction. Even after repeated mounting of the mounting plate 1.2 to the carrier plate 2.1, the mounting plate 1.2 assumes the same relative position to the carrier plate 2.1. To align the stop pins 1.2.2.1 with the dowel pins 2.1.2, a pressure unit 8 can, for example, be temporarily placed on the carrier plate 2.1. To fix the relative position, the mounting plate 1.2 is connected to the carrier plate 2.1 via at least one screw connection 2.1.3.

[0040] A second version for the detachable connection is the Fig. 2a und 2b to be taken.

[0041] Here too, the relative position of the mounting plate 1.2 in the x, y, and z directions to the carrier plate 2.1 is determined analogously to the first embodiment via a three-point support. In contrast to the first embodiment, the mounting plate 1.2 has two penetrating bending structures 4, which were produced, for example, by electrical discharge machining (EDM). Two clamping pins 3 are provided on the carrier plate 2.1, aligned perpendicular to the mounting surface 2.1.1 and firmly connected to the carrier plate 2.1. They can be connected directly or indirectly to the carrier plate, for example, to the needle carrier 2.3, which is advantageously made of ceramic. For the detachable connection of the mounting plate 1.2 to the carrier plate 2.1, the two clamping pins 3 are each clamped in one of the bending structures 4. In the first of the two bending structures 4, the first of the two clamping pins 3 is clamped circumferentially over its outer surface, thus determining the relative position of the mounting plate 1.2.The position of the mounting plate 1.2 is fixed in the x-direction and the y-direction relative to the support plate 2.1. Advantageously, the first of the two bending structures 4 has the form of a pipe clamp. In the second of the two bending structures 4, the second of the two clamping pins 3 is clamped tangentially via its outer surface, thus fixing the relative position of the mounting plate 1.2 around the z-direction to the support plate 2.1. To clamp the bending structures 4 onto each of the clamping pins 3, they can be dimensioned such that, in the stress-free state, they have an opening that is smaller than the cross-section of the clamping pins 3, so that they are tensioned before or during the insertion of the clamping pins 3 and clamp the clamping pin 3. Advantageously, the bending structures 4 are dimensioned such that they each have an opening that is larger than the cross-section of the clamping pins 3. Only after the clamping pins 3 are inserted are the bending structures 4 tensioned to clamp the clamping pins 3.This can advantageously be achieved, as shown, via a threaded stud 6. To secure the fixed relative position, it is advantageous for the mounting plate 1.2 to be connected to the support plate 2.1 via at least one screw connection 2.1.3.

[0042] A method according to the invention for assembling a contacting module according to the invention is explained in more detail below. As in the prior art, at the end of the adjustment and assembly, the optical module 1 and the electronic module 2 are arranged relative to each other such that the arrangement of optical interfaces S op and the arrangement of electrical interfaces S ele have a defined alignment position relative to each other in all 6 degrees of freedom.

[0043] A contacting module, consisting of an optical module 1 and an electronic module 2, is assembled according to a method of the invention. The optical module 1 comprises an optical block 1.1 made of glass, which has an arrangement of optical interfaces Sopt in an optical interface plane Eopt. The electronic module 2 comprises a carrier plate 2.1, a printed circuit board 2.2, and a needle carrier 2.3 with an arrangement of contact needles 2.3.1, the needle tips of which form an arrangement of electrical interfaces Sele in an electrical interface plane Eopt. The optical module 1 and the electronic module 2 are arranged relative to each other such that the arrangement of optical interfaces Sopt and the arrangement of electrical interfaces Sele have a defined alignment position relative to each other.

[0044] The method can be applied alternatively, either in a first alternative for mounting a previously described contact module, in which the optical module 1 is permanently connected to the electronic module 2 via an adhesive bond, or in a second alternative for mounting a previously described contact module, in which the optical module 1 is repeatedly and detachably connected to the electronic module 2. In the case of the second alternative, the optical module 1 additionally has a mounting plate 1.2. The optical block 1.1 is permanently attached to the mounting plate 1.2 via an adhesive bond, and the mounting plate 1.2, and thus the optical module 1, is detachably connected to the electronic module 2.

[0045] In the case of the first alternative, the arrangement of optical interfaces S opt is adjusted to the arrangement of electrical interfaces S ele and then the optical block 1.1 is permanently connected to the carrier plate 2.1 via an adhesive connection.

[0046] In the case of the second alternative, the mounting plate 1.2 of the optical module 1 is first connected to the carrier plate 2.1 of the electronic module 2 via a detachable connection in a reproducible relative position. Subsequently, the arrangement of optical interfaces Sopt is aligned with the arrangement of electrical interfaces Sele, and then the optical block 1.1 is permanently bonded to the mounting plate 1.2 via an adhesive bond.

[0047] The design of the adhesive bond is essential to the invention.

[0048] To create an adhesive bond according to the invention, at least three parallel through-holes 7 are first made in the carrier plate 2.1 or the mounting plate 1.2. In the case of exactly three through-holes 7, these are arranged to form a triangle with respect to each other. The through-holes 7 serve to subsequently receive cylindrical pins 5 via which the adhesive bond is created as an indirect adhesive bond.

[0049] Before the adhesive bond between the optical block 1.1 and the carrier plate 2.1 or the mounting plate 1.2 is established, the optical block 1.1 is aligned so that the arrangement of optical interfaces Sopt is adjusted to the arrangement of electrical interfaces Sele. This results in a relative position of the optical block 1.1 to the carrier plate 2.1 or the mounting plate 1.2, which is fixed in all 6 degrees of freedom by the adhesive bond.

[0050] At least three cylindrical pins 5 are guided through each of the through-holes 7 until they come into contact with the optical block 1.1, whereby adhesive 9 is applied beforehand to the first end face 5.1 of each cylindrical pin 5 facing the optical block 1.1, thus bonding the cylindrical pins 5 to the optical block 1.1. The cylindrical pins 5 are bonded to the carrier plate 2.1 or the mounting plate 1.2 either during or after being guided through the through-holes 7.

[0051] To glue the cylindrical pins 5 when guiding them through the through holes 7, adhesive 9 is applied either to their circumferential surface, facing the second end face 5.2, or into the through holes 7.

[0052] A defined bonding surface for the cylindrical pins 5 is obtained by advantageously dimensioning the cylindrical pins 5 and the through-holes 7 in such a way that the second end face 5.1 lies within the through-hole 7. The remaining free volume in the through-hole 7 is then filled with adhesive 9.

[0053] If the optical block 1.1 and the carrier plate 2.1 or the mounting plate 1.2 are aligned parallel to each other in the adjusted relative position, all cylindrical pins 5 are glued to the same depth in the through holes 7. This remains unchanged for relative positions that differ in the x-direction, y-direction, z-direction, or around the z-direction. A tilt around the x-direction or around the y-direction is compensated for by the cylindrical pins 5 being positioned more or less deeply in the through holes against the optical block. Unlike many adhesive joints known from the prior art, a tilt does not need to be compensated for by the amount of adhesive 9. A uniform amount of adhesive at all points where the connection is formed has the advantage that the behavior of the adhesive 9, e.g., shrinkage during curing, is the same everywhere, thus fixing the adjusted relative position with high precision. Reference symbol list

[0054] 1 Optical module 1.1 Optical block 1.2 Mounting plate 1.2.1 End face of mounting plate 1.2.1.1 Raised section 1.2.2 Circumference of mounting plate 1.2.2.1 Stop pin 2 Electronic module 2.1 Carrier plate 2.1.1 Mounting surface 2.1.2 Dowel pin 2.2 Circuit board 2.3 Needle carrier 2.3.1 Contacting needle 3 Clamping pin 4 Bending structure 5 Cylindrical pin 5.1 First end face of cylindrical pin 5.2 Second end face of cylindrical pin 6 Threaded pin 7 Through hole 8 Pressure unit 9 Adhesive S opt optical interface S ele electrical interface E opt optical interface level (of the contacting module) E ele electrical interface level (of the contacting module)

Claims

1. A contacting module with an optical module (1), containing an optical block (1.1) made of glass, which has an arrangement of optical interfaces (Sopt) in an optical interface plane (Eopt), and an electronic module (2), containing a carrier plate (2.1), a printed circuit board (2.2) and a needle carrier (2.3) with an arrangement of contacting needles (2.3.1) with needle tips, which form an arrangement of electrical interfaces (Sele) in an electrical interface plane (Eele), the optical module (1) and the electronic module (2) being arranged relative to one another in such a way that the arrangement of optical interfaces (Sopt) and the arrangement of electrical interfaces (Sele) have a defined adjustment position relative to one another with respect to all six degrees of freedom of a Cartesian coordinate system, characterized in that the optical block (1.1) is permanently connected to the carrier plate (2.1) via at least three cylindrical pins (5) or the optical module (1) has a mounting plate (1.2) to which the optical block (1.1) is permanently connected via at least three cylindrical pins (5), wherein the cylindrical pins (5) each contact the optical block (1.1) with a first end face (5.1) of the cylindrical pin via adhesive (9), and in the carrier plate (2.1) or in the mounting plate (1.2), there are through holes (7) arranged parallel to each other, in which the cylindrical pins (5) are each connected to the carrier plate (2.1) or the mounting plate (1.2) via adhesive (9).

2. The contacting module according to claim 1, characterized in that a second end face (5.2) of the cylindrical pins is located internally in one of the through holes (7) in each case, and any free volume remaining above it in the through hole (7) is filled with adhesive (9).

3. The contacting module according to claim 1 or 2, characterized in that the mounting plate (1.2) is connected to the carrier plate (2.1) via a repeatedly detachable connection, said detachable connection ensuring repeated production of the adjustment position of the arrangement of the optical interfaces (Sopt) with respect to the arrangement of the electrical interfaces (Sele).

4. The contacting module according to claim 3, characterized in that, on one end face of the mounting plate (1.2.1), three elevations (1.2.1.1) defining a mounting plane are present, which rest against a mounting surface (2.1.1) of the carrier plate (2.1), whereby the relative position of the mounting plate (1.2) in a z-direction, about an x-direction and about a y-direction of a Cartesian coordinate system with respect to the carrier plate (2.1) is fixed, and there are three dowel pins (2.1.2) on a circumference of the mounting plate (1.2.2), which are aligned parallel to the mounting plane and two of which are aligned perpendicular to each other and each rest against a respective stop pin (1.2.2.1) provided on the carrier plate (2.1), which determines the relative position of the mounting plate (1.2) in the x-direction and in the y-direction to the carrier plate (2.1), and the third of the dowel pins (2.1.2) rests against a further stop pin (1.2.2.1) present on the carrier plate (2.1), thus fixing the relative position of the mounting plate (1.2) around the z-direction with respect to the carrier plate (2.1).

5. The contacting module according to claim 3, characterized in that, on one end face of the mounting plate (1.2.1), three elevations (1.2.1.1) defining a mounting plane are present, which rest against a mounting surface (2.1.1) of the carrier plate (2.1), whereby the relative position of the mounting plate (1.2) in a z-direction, about an x-direction and about a y-direction of a Cartesian coordinate system with respect to the carrier plate (2.1) is fixed, and the mounting plate (1.2) has two bending structures (4) penetrating the mounting plate (1.2), wherein in the first of the two bending structures (4), a first clamping pin (3) attached to the carrier plate (2.1) is clamped circumferentially over its lateral surface, thus fixing the relative position of the mounting plate (1.2) in the x-direction and in the y-direction with respect to the carrier plate (2.1), and in the second of the bending structures (4), a second clamping pin (3) attached to the carrier plate (2.1) is clamped tangentially via its lateral surface, thus fixing the relative position of the mounting plate (1.2) around the z-direction with respect to the carrier plate (2.1).

6. The contacting module according to claim 5, characterized in that the first bending structure (4) has the shape of a pipe clamp, in which the first clamping pin (3) is clamped in a self-centered manner.

7. A method for assembly of a contacting module with an optical module (1), containing an optical block (1.1) made of glass, which has an arrangement of optical interfaces (Sopt) in an optical interface plane (Eopt), and an electronic module (2), containing a carrier plate (2.1), a printed circuit board (2.2) and a needle carrier (2.3) with an arrangement of contacting needles (2.3.1) with needle tips, which form an arrangement of electrical interfaces (Sele) in an electrical interface plane (Eele), the optical module (1) and the electronic module (2) being arranged relative to one another in such a way that the arrangement of optical interfaces and the arrangement of electrical interfaces have a defined adjustment position relative to one another, characterized in that either the arrangement of optical interfaces (Sopt) is first adjusted to the arrangement of electrical interfaces (Sele) and then the optical block (1.1) is permanently connected to the carrier plate (2.1) via an adhesive connection, or a mounting plate (1.2) is connected to the carrier plate (2.1) via a detachable connection in a relative position that can be repeatedly produced, after which the arrangement of optical interfaces (Sopt) is adjusted to the arrangement of electrical interfaces (Sele) and then the optical block (1.1) is permanently connected to the carrier plate (1.2) via an adhesive connection, wherein the adhesive connection for both of the above alternatives is produced by making at least three through holes (7) parallel to each other in the carrier plate (2.1) or the mounting plate (1.2), at least three cylindrical pins (5) are each guided through one of the through holes (7) until they each come into contact with the optical block (1.1), adhesive (9) having previously been applied to a first end face (5.1) of the cylindrical pins which faces the optical block (1.1) in each case, and the cylindrical pins (5) are bonded either during or after guiding them through the through holes (7).