Probe with reference target, probe system including same, and related methods

Abstract

Reference targeted probes, probe systems including such probes, and related methods are disclosed. The probe (100) includes a probe body (110), a probe beam (120), a probe tip (140) configured to contact a device under test (DUT) (42), and a reference target (150) attached to the probe beam (120). The reference target (150) is configured to be visible to an optical system (20) for measuring the position of the probe tip (140) relative to the DUT (42). The method includes a method for utilizing and / or manufacturing such a probe (100).

Description

[Technical Field]

[0001] Related Applications This application is a continuation of U.S. patent application Ser. No. 16 / 249,044, filed Jan. 16, 2019, and and priority of U.S. Provisional Patent Application No. 62 / 619,282, filed January 19, 2018. No. 6,023,799, filed on Dec. 1, 2003, the entire disclosures of which are hereby incorporated by reference.

[0002] FIELD OF THE INVENTION The present invention generally relates to probes with reference targets, probe systems containing such probes, and This invention relates to a system and related methods. [Background technology]

[0003] Background of the Invention The probe system is used to connect the probe system to the contact pads of the integrated circuit device. Testing the operation and / or performance of integrated circuit devices by contacting probes Integrated circuit devices can have contacts on the order of tens of micrometers (μm) wide. Thus, aligning the probes with the contact pads can and / or contact pad position, e.g. very precise height of probe relative to contact pad For example, making electrical contact between the probe and the contact pad. This is done by contacting the contact pads with the probe tips of the probes, This may include applying a specified amount of compression to ensure robust contact. Achieving repeatable test results requires probe contact pads with the correct amount of pressure. This may require contacting the contact pads when establishing electrical contact. This may require precise measurements of the height of the probe above the head. This may include focusing such an optical assembly onto the contact pads and / or probes. However, it is possible to identify the probe with the optical assembly and / or Focusing the probe can be difficult to achieve reliably and consistently. Therefore, the focus of the optical assembly must be adjusted to accurately identify the spatial height of the probe. There is a need for probes that include features to facilitate matching. Summary of the Invention [Means for solving the problem]

[0004] Reference-targeted probes, systems including such probes, and related methods - Patents.com These probes include a probe body and a probe extending from the probe body. The probe includes a probe beam (probe beam portion) and at least one probe tip. The tip extends from the leading edge of the probe beam away from the probe body and is connected to the device under test. These probes are designed to contact the device under test (DUT). , further comprising a reference target attached to the probe beam. , configured to be visible to the optical system when the probe tip approaches the DUT. This reference target is used to facilitate measurement of the position of the probe tip relative to the DUT. The optical signal is smaller than at least a portion of the probe beam adjacent to the reference target. The stem allows for better optical resolution.

[0005] The probe system is configured to test at least one DUT. at least one DUT configured to test a corresponding DUT; The probe system further includes an optical assembly, the optical assembly including: The assembly includes a probe that is connected to at least one of the DUTs when the probe approaches the corresponding DUT. The probe system is configured to capture at least a portion of the image along the optical axis. The system measures the position of at least one reference target on at least one probe. It is configured to make it possible.

[0006] Related methods include those utilizing probes containing reference targets. measuring a first position of a reference target of the probe relative to the optical system; The steps of translating the DUT relative to the probe and positioning a reference target relative to the optical system are performed. and measuring a second position of the nozzle.

[0007] Related methods may additionally or alternatively include a probe with a reference target. These methods include methods for fabricating a probe beam and a probe tip. providing a probe having a reference target attached to the probe beam; and [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic side view illustrating an example of a probe system according to the present invention. [Figure 2] 2 is a schematic top view illustrating an example of a portion of the probe system of FIG. 1. [Figure 3] 1 is a schematic top view showing an example of a collected reflection superimposed on a reference image, in accordance with the present invention; [Figure 4]3A-3C are schematic side views illustrating examples of light reflecting from the outer surface of a reference target, in accordance with the present invention. [Figure 5] 3A-3C are schematic side views illustrating examples of light internally reflected within a reference target, in accordance with the present invention. [Figure 6] 1 is a partial side view showing an example of a portion of a probe according to the present invention. [Figure 7] FIG. 7 is a partial top view of the probe of FIG. 6. [Figure 8] 2 is a schematic side view showing a probe tip in contact with a DUT prior to pressing the DUT against the probe tip, in accordance with the present invention; [Figure 9] 9 is a schematic side view of the probe tip and DUT of FIG. 8 after the DUT has been pressed against the probe tip. [Figure 10] 4 is a flowchart illustrating a method for measuring a pressing distance of a probe against a DUT according to the present invention. [Figure 11] 1 is a flowchart illustrating a method for fabricating a probe with a reference target in accordance with the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0009] Detailed Description 1-11 show an example of a probe 100 with a reference target 150, a probe system in operation, and Examples of methods of generating and / or using 200 and / or programming with reference targets An example of a method 300 for manufacturing a lobe is provided. Each of FIGS. Elements that serve at least substantially the same purpose are similarly labeled and these elements are In the present specification, there may be cases where the description does not refer to each of Figures 1 to 11. Similarly, each of Figures 1 to 11 Although not all elements may be labeled individually, the elements are labeled as such in this specification. Reference numbers relating to elements may be used for consistency. The elements, components and / or features referenced above and described herein are within the scope of the present invention. 1 to 11 without departing from the scope of the present invention. It may be used together with

[0010] Generally, elements that are likely to be included in a given (i.e., particular) embodiment are shown with solid lines. In contrast, elements that are optional for a given embodiment are shown in dashed lines. However, elements shown in solid lines are not essential to all embodiments, and elements shown in solid lines are within the scope of the present invention. may be omitted from certain embodiments without departing from the scope of the present invention.

[0011] FIG. 1 is a schematic side view of a probe system 10 including a pair of probes 100 in accordance with the present invention. FIG. 2 is a schematic top view of a portion of the probe system of FIG. 1. The probe system 10 is shown diagrammatically as including two probes 100. is not a requirement, and the probe system may be one probe, two probe, three probe, Contains any suitable number of probes, such as 1 probe, 4 probes, or 5 or more probes It is within the scope of the present invention that each probe 100 may include a probe body 110. a probe beam 120 extending from the probe body, and a probe beam 130 extending from the probe body. and at least one probe tip 140 extending from the leading edge 126 of the probe beam. The probe tip 140 may be connected to a corresponding contact pad on, for example, a device under test (DUT) 42. The probe 100 is configured to contact the DUT via a single probe. Tip, two probe tips, three probe tips, or four or more probe tips The probe tip 140 may include any suitable number of probe tips, such as Probe 100 is a probe configured for radio frequency (RF) testing. and / or configured to transmit and / or receive signals. At least one probe tip 140 and / or at least one probe tip 140 configured to provide an electrical ground. Each of the probes may have one probe tip.

[0012] As shown schematically in FIGS. 1-2, the probe 100 directs a probe beam 120, e.g. At least one reference target 150 attached to the top surface 128 of the probe beam. As described herein, each reference target 150 includes a probe tip 140 is configured to be visible to the optical system when approaching the DUT 42; For example, this facilitates measuring the position of the probe tip relative to the DUT 42. 2 is a view of the probe system of FIG. 1 by and / or from the perspective of the optical system 20. It can be described as a schematic representation of a portion of the system 10. 2 can be described as a schematic representation of the field of view of optical system 20. As further shown generally in Figures 1-2 and as described herein, the probe system The system 10 and / or probe 100 have x, y, and z dimensions that are orthogonal to one another. It can be described with reference to an xyz coordinate system. More specifically, the probe system 10, the optical system 20 is configured to image the reference target 150 at least substantially parallel to the z dimension. The probe system may be described as being oriented so as to look along the direction can.

[0013] Each probe 100 may include a suitable number of reference targets 150. Some of the probes disclosed herein may have a single reference to which each probe 100 corresponds. This is relevant to embodiments that include a target 150. However, this does not necessarily mean that the probe 100 However, it is not required in all cases that each probe has two reference targets, three reference targets, or Multiple corresponding targets such as a single target, four reference targets, or five or more reference targets It is within the scope of the present invention that a reference target 150 may be included.

[0014] A probe system including a plurality of probes 100 with a corresponding plurality of targets 150. In one embodiment of the present invention, at least one reference target of the plurality of reference targets the target in question, distinguished from and / or having a different shape from other reference targets among the plurality of reference targets. This can facilitate, for example, the identification of corresponding probes (for the reference target). In other words, in such an example, each probe 100 can be used to measure the relative position of a corresponding reference target. The target 150 may include a reference target 150, or a corresponding plurality of reference targets 150. The fiducial target is shaped, sized, positioned, and oriented to allow unique identification of the probe. and / or otherwise configured. Instead, in one embodiment of the probe 100 that includes multiple reference targets 150, the probe At least one reference target of a plurality of reference targets associated with the probe is at least one other reference target of the plurality of reference targets associated with the probe; and / or have a different shape, e.g., the position of the probe relative to the optical system 20. As another example, multiple reference targets can be used to facilitate measuring the position in three dimensions. In one embodiment of the probe 100 including the target 150, at least one of the multiple reference targets At least two reference targets are located in the x-, y-, and / or or z-dimension, so that a given probe 10 150 relative to the reference target 150 allows unique identification of the probe. This may include and / or facilitate:

[0015] As further shown schematically in FIG. 1, the probe system 10 includes a plurality of probe holders 10 2, and the probe holder 102 can hold a corresponding plurality of probes 100 in a plurality of D The probe is configured to support and maintain the UT42. The holder 102 may also be referred to as a positioner 102. The probe system 10 may also include a chuck 30, which may include a plurality of DUs. 1 defines a support surface 32 configured to support a substrate 40 including a T42. As shown generally in FIG. 1, the probe system 10 may include a controller 50. The controller 50 is configured to control the operation of the probe system 10 or The controller 50 may be programmed to automate the system 10. 200. Additionally or alternatively, the controller 50 may 0, optical system 20, and / or chuck 30. The control circuitry may be configured to control any suitable component.

[0016] As used herein, terms of location such as "top," "upper," "lower," "below," etc. , which illustrate exemplary spatial relationships between components of the probe 100 and / or probe system 10. can be used to describe in a non-limiting manner, and generally, the substrate 40 and / or D The UT 42 extends at least approximately parallel to the ground, and the probe 100 is positioned vertically above the DUT. This refers to the configuration in which gravity deflects the probe towards the DUT. Such terms are provided for context only and do not necessarily refer to the probe 100 and / or probe system. The components of the stem 10 are not limited to always being in a particular orientation relative to the ground.

[0017] As shown schematically in FIG. 1, an optical system 20 is configured to capture images along an optical axis 22. , at least approximately parallel to the z-dimension of the probe system 10. For example, the optical system 20 can include an illumination source 26, The source 26 emits light at least approximately parallel to the optical axis 22 to illuminate the reference target 1 of the probe 100. 50. Optical System 2 The system may further include a microscope 28, which receives reflected light from a reference target 150. and / or otherwise configured to acquire emitted and / or transmitted light. 8 includes any suitable microscope, such as a visible light microscope and / or a confocal microscope. and / or any suitable microscope. As further shown schematically in FIG. Additionally, the optical system 20 includes an optical enclosure 21, and / or or placed in an optical enclosure 21, which is It is configured to restrict light from entering a portion of the optical system, such as a microscope 28. do.

[0018] The probe system 10 is configured to have the probe tip 140 of the probe 100 approach the DUT 42. When doing so, the optical system 20 is focused on the reference target 150 of the probe. More specifically, the optical system 20 may have a focal range and a probe As the tip approaches the DUT 42, the reference target 150 and the DUT 42 each Within the focus range, the optical system is focused alternately on the reference target and the DUT. Additionally or alternatively, the probe system 10 may The position of the focal plane along the optical axis 22 of the optical system 20 is determined by the The optical system may be configured to record the image of the portion of the image that is visible to the optical system. In this manner, the probe system 10, as described herein, By measuring the position of the focal plane when the target is best focused, the direction parallel to the optical axis 22 and / or enable precise measurement of the position of the reference target 150 along a direction parallel to the z direction. The device can be configured to enable

[0019] The probe system 10 includes at least one probe tip 140 in close proximity to the DUT 42. When the reference target 150 and the probe tip are scanned, the reference target 150 and the probe tip are scanned in the field of view of the optical system 20. The probe system 10 may be configured to be in a field. , during the test, and / or after the test, the reference target 150 and at least one probe Each of the chips 140 can be further configured to remain within the field of view of the optical system 20. For example, testing of a DUT 42 may involve testing the DUT and / or processor during testing of the DUT. At least a portion of the lobe tip 140 is thermally drifted relative to the field of view of the optical system 20. The temperature of the DUT can be adjusted to match the optical system. The system 20 may be configured to connect the probe tip 140 and / or the reference target 110 during testing of the DUT 42. 50 has a field of view wide enough that at least a portion of the optical system remains within the field of view of the optical system. It is possible.

[0020] For example, as shown schematically in FIG. 2, the field of view of optical system 20 may be such that the linear dimension 23 of the field of view is and / or can be characterized by the linear dimension 23 of the field of view. The linear dimension 23 of the field can correspond to any suitable dimension of the field of view. As shown schematically in FIG. 1, the linear dimensions 23 of the field of view are along the x dimension, along the y dimension, and / or Alternatively, it can be measured along a direction at least substantially perpendicular to the optical axis 22. As used herein, the linear dimension 23 of the field of view may refer to distance (e.g., length) and / or resolution (e.g., Any suitable method for measuring the field of view, such as the number of pixels across the field of view ( By way of example, the linear dimension 23 of the field of view may correspond to a scale of at least 100 microns. Chromium (μm), at least 300 μm, at least 500 μm, at least 1 mm meters (mm), at least 1.5mm, at least 2mm, at least 3mm, at least 5 mm, maximum 7mm, maximum 2.5mm, maximum 1.7mm, maximum 1.2mm, maximum 700 μm, and / or at most 200 μm. Alternatively, the linear dimension 23 of the field of view may be at least 100 pixels, at least 300 pixels, At least 500 pixels, at least 1000 pixels, at least 1300 pixels, at least 1500 pixels, at least 2000 pixels, at least 2500 pixels, at most 3000 pixels Pixels, maximum 2200 pixels, maximum 1700 pixels, maximum 1200 pixels, maximum 7 00 pixels and / or at most 200 pixels.

[0021] The optical system 20 generally collects light from the reference target 150 and directs it onto the DUT 42. The position of the probe tip 140 relative to the optical system is measured to determine the position of the probe tip relative to the optical system. configured to measure the position and / or detect the deflection of the probe tip; For example, optical system 20 may receive light reflected from reference target 150 and / or Alternatively, the reference target 150 may be configured to focus the emitted light. , so that the corresponding focal plane positions can be used to determine the probe position in the direction parallel to the optical axis 22. The height of the top 140 can be measured (in Figure 1, the z-direction labels are placed in this direction). More specifically, light reflected from the reference target 150 and / or Otherwise, the light emitted by the reference target 150 would be in high contrast against a relatively non-reflective background. Such a background can provide a visual reference point for the target, e.g., the probe beam 120 and / or may be the probe beam 120. Optical system 120 may be implemented by any suitable routine, such as an automated focus optimization routine. configured to facilitate measuring the position of the probe tip 140 relative to the UT 42 For example, the focus optimization routine may be implemented using a pattern score routine. and / or gradient search routines. Additionally or alternatively, the optical system 20 may be manually adjusted by the user. 2. The optical system of claim 1, wherein the optical axis of the reference target 150 is a reference target. It is possible.

[0022] The probe system 10 and / or the reference target 150 may be configured such that the reference target is the optical resolution provided by the optical system 20 relative to at least a portion of the remainder of the optical system; can be configured to be higher, and at least some of the above can be configured to be higher, for example, by a probe beam. The portion of the upper surface 128 of the frame 120 that supports the reference target and / or the reference target. As an example, the reference target 150 is a portion adjacent to the reference target. When visible, the reference target is at least one pixel in the upper surface 128 of the probe beam 120. The optical resolution of the optical system compared to the portion that is at most visible to the optical system. As used herein, an optical system (such as optical system 20) "High optical resolution" used to describe components within the field of view of a system: In general, the optical system must accurately and reliably resolve the component. focusing on the element and / or otherwise optimizing the image quality of that element; As a more specific example, the probe body 110, the probe beam 120, and / or making the probe tip 140 optically opaque and / or light absorbing. As a further example, the reference target 150 may be positioned above the probe beam 120. 28, being optically brighter than at least the portion supporting the reference target; To have high optical brightness, high light reflectance, and high optical contrast. and / or increase the degree to which incident light is scattered. Additionally or alternatively, reference target 150 and / or The light scattered and / or reflected by the optical system 20 is focused within a discrete focal resolution range. This discrete focus resolution range allows the optical system to focus on the probe. The optical system used herein is smaller than the focal resolution range required to fit the beam 120. The focus resolution range of 20 can be used in addition to or instead of the focus sensitivity of the optical system. It can be called.

[0023] The optical system 20 may image and render the reference target 150 in any suitable manner. For example, the system may be configured to display the As shown diagrammatically, optical system 20 is configured such that probe tip 140 approaches DUT 42 and and when the optical system is focused on the reference target, at least the reference target 150 The imaging system may be configured to receive and / or record a reference image 160 of at least a portion of the imaging system. In other words, the reference image 160 can be obtained by Including and / or being an image of the portion of the optical system 20 that is in focus Additionally or alternatively, as further shown schematically in FIG. The quasi-target 150 reflects, generates, and collects reflections 162 from the reference target 150. and / or otherwise configured to generate a reference time. The target 150 may be configured to receive collected reflection 162 from the target 150. As used herein, the focus of the optical system 20 on the reference target 150 References to and can refer to focusing the optical system on the reference image 160, and and / or the optical system may be focused on the collected reflection 162. As shown schematically in FIG. 3, the collected reflection 162 can be smaller than the reference image 160, and / or can be superimposed on a reference image.

[0024] Optical system 20 is configured to receive reference image 160 and collected reflection 162. In an example, the reference image may be similar in shape and / or appearance to the reference target 150. , the focused reflection is a focused reflection that is narrower and / or has a sharper outline than the reference image. The light source may include a spot and / or may be a focused spot. As a general example, and as further shown schematically in FIG. 3, the reference image 160 may have a diameter of 16 mm. 1 and / or can be characterized by a diameter 161 of the reference image, The reflection 162 may have a diameter 163 of the collected reflection and / or may be The diameter of the collected reflection is smaller than the diameter of the reference image. As an example, the diameter 163 of the collected reflection is at least 0.1% of the diameter 161 of the reference image. At least 0.2% of the diameter of the image, at least 0.5% of the diameter of the reference image, at least 1% of the diameter of the reference image, at least 2% of the diameter of the reference image, at least 5% of the diameter of the reference image at least 10% of the diameter of the reference image, at least 20% of the diameter of the reference image at least 50% of the diameter of the reference image, at least 70% of the diameter of the reference image, at most 85% of the diameter of the reference image, at most 60% of the diameter of the reference image, at most 50% of the diameter of the reference image, at most 30% of the diameter of the reference image , at most 25% of the diameter of the reference image, at most 20% of the diameter of the reference image, at most 1 / 3 of the 15% of the diameter of the reference image, at most 10% of the diameter of the reference image, at most 7% of the diameter of the reference image, at most 5% of the diameter of the reference image, at most 3% of the diameter of the reference image, and / or at most 1% of the diameter of the reference image As another example, the diameter 163 of the collected reflection 162 can be The discrete focus-resolution range may have a minimum value, and the discrete focus-resolution range may have a minimum value. and the diameter of the reference image of the reference image 160 within this particular focus-resolution range is smaller than the focus-resolution range of 161 have respective minimum values. As a further example, the diameter 163 of the collected reflection is at least 0.00001% of the linear dimension 23 of the field of view, at least 0.0001% of the linear dimension 23 of the field of view ,at least 0.001% of the linear dimension of the field of view,at least 0.01% of the linear dimension of the field of view,field of view At least 0.1% of the linear dimension of the field of view, at least 1% of the linear dimension of the field of view, at most 10%, at most 20% of the linear dimension of the field of view, at most 15% of the linear dimension of the field of view, at most 5% of the linear dimension of the field of view, at most 1% of the linear dimension of the field of view, at most 0.5% of the linear dimension of the field of view, At most 0.05% of the linear dimension of the field of view, at most 0.005% of the linear dimension of the field of view, at most 0.0005% of the linear dimension of the field and / or at most 0.00005% of the linear dimension of the field It is possible.

[0025] The collected reflection 162 may also be characterized by a focal resolution range within which the collected reflection is in focus. For example, the reference light reflection can be measured from a 15 mm diameter reference target (schematically shown in Figures 1-2). Visible and / or adequately resolved within a discrete focus resolution range of less than 8 As a more specific example, the reference light reflection can be measured at the maximum diameter of the reference target 158 ​​mm. At most 50%, at most 30%, at most 25%, at most 20%, at most 15%, at most At most 10%, at most 7%, at most 5%, at most 3%, and / or at most 1% be visible and / or adequately resolvable within the discrete focus resolution range of .

[0026] The collected reflection 162 includes light reflected from the exterior surface of the reference target 150, and / or or light reflected from the outer surface of the reference target 150. For example, As shown diagrammatically, this focused reflection is generated by illumination source 26 and reflected by reference target 150. It may include light subsequently reflected from the exterior surface facing the illumination source, and / or Additionally or alternatively, it can be a focused reflection1 62 may include light internally reflected within the reference target and / or For example, as shown schematically in FIG. The light is emitted and enters the reference target 150, and then reflects back at least once before exiting the reference target. and / or the light collected by the optical system 20. It can be light.

[0027] The reference target 150 is configured such that the reference image 160 and / or collected reflection 162 is The portion of the frame 120 that supports the reference target and / or the portion adjacent to the reference target configured to have a high light intensity and / or high optical contrast compared to the image of the part Therefore, the optical system 20 can detect a reference time in the probe beam 120. more precisely than on the part supporting the target and / or on the part adjacent to the reference target, It is possible to focus on a reference image, which allows for a probe system without a reference target. 10, allowing for more accurate measurement of the position of the reference target 150 along the optical axis 22. Additionally or alternatively, the reference target 150 may be , the collected reflection 162 has a higher light intensity and / or a higher optical contrast than the reference image 160. In such an embodiment, the optical system 20 may be configured to have a , the focused reflection can be more accurately focused than the reference image, which compared to a probe system 10 without a reference target 150 configured to generate , allowing for a more accurate measurement of the position of the reference target 150 along the optical axis 22. Cut.

[0028] The reference target 150 may have any suitable geometric shape and / or configuration. For example, the reference target 150 can have at least one axis of symmetry, e.g. For example, the reference target is rotationally symmetric about this axis of symmetry. The axis of symmetry extends approximately parallel to the probe beam centerline 130 (shown diagrammatically in FIG. 2). The centerline 130 extends from the tip of the probe beam 120 along the top surface 128 of the probe beam 120. The reference target 150 may also or alternatively extend toward the body 110. Instead, the periphery of an axis of rotational symmetry that extends at least approximately perpendicular to the centerline 130 of the probe beam. Such a configuration allows the reference target to be aligned with the probe beam. the optical system 2 without the need to be mounted in a precise and / or predetermined orientation relative to the 0 is appropriately positioned to receive light reflected by the reference target 150. By way of example, the reference target 150 may be at least approximately spherical to facilitate probing. As the rotational orientation of the reference target relative to the beam 120 changes, the reflection of the reference target As a further example, the reference target 150 can be The reference target 150 may be reflective and / or may be a rectangular prism. The reference target 150 may include a prism and / or may be such a prism. It is possible.

[0029] The reference target 150 may, for example, facilitate the formation of a reference image 160 and / or a focused reflection 162. The optical properties may be any suitable for enhancing the optical performance. For example, as described, The reference target 150 may be at least substantially optically reflective, and optionally completely optically reflective. As a more specific example, the reference target 150 may be entirely It may include or be a metal sphere having a light-reflective surface. Additionally or alternatively, the reference target 150 may include at least a portion Partially optically transparent and / or at least partially optically translucent The reference target 150 may be made of plastic, acrylic, metal, and / or The probe body 1 may be formed of any suitable material, such as glass, and / or 10, probe beam 120, and / or probe tip 140 may be formed of a different material. As a more specific example, the reference target 150 may be a glass sphere. In some embodiments, for example, electrical interference with the rest of the probe system 10 may be avoided. To avoid interference, the reference target 150 may be non-metallic. The probe 150 can be attached to the probe beam 120 in any suitable manner. As shown schematically in FIG. 1, the reference target 150 is secured to the protrusion 154 by adhesive 170. The beam 150 may be attached to the adhesive 170, for example, epoxy and / or It may contain thermal epoxy and / or may be epoxy and / or thermal epoxy. This can be done.

[0030] The probe 100, and / or any of its components, may be of any suitable size and / or For example, as shown schematically in FIG. The tip 140 is at a probe tip height 142 from the lower surface 132 of the probe beam 120. The probe tip height 142 is the height at which the probe tip contacts the DUT 42. As a more specific example, the height of the probe tip 142 is measured parallel to the optical axis. is at least 10 μm, at least 50 μm, at least 100 μm, at least 150 μm, at least 200 μm, at least 250 μm, at least 300 μm, at least 3 50 μm, at least 400 μm, at least 450 μm, at least 500 μm, at most 475 μm, maximum 425 μm, maximum 375 μm, maximum 325 μm, maximum 27 5 μm, maximum 225 μm, maximum 175 μm, maximum 125 μm, maximum 75 μm , and can be at most 25 μm.

[0031] Similarly, the reference target 150 may be, for example, scattered and / or or a probe to facilitate focusing of the optical system 20 on the reflected light. The beam 120 may have any suitable spatial relationship to the beam 120. As shown schematically in FIG. 1, the reference target 150 is positioned above the top surface 12 of the probe beam 120. 8 by a reference target height 152, and 52 is measured in a direction parallel to the optical axis 22 as the probe tip 140 approaches the DUT 42. As a more specific example, the height 152 of the reference target is at least 25 μm, at least 50 μm, at least 100 μm, at least 200 μm, at least 300 μm, At least 400 μm, at least 500 μm, at least 600 μm, at least 700 μm, at least 800 μm, at least 900 μm, at most 1000 μm, at most 95 0μm, maximum 850μm, maximum 750μm, maximum 650μm, maximum 550μm m, maximum 450 μm, maximum 350 μm, maximum 250 μm, maximum 150 μm, and / or at most 75 μm. In embodiments where the probe beam 120 is attached by adhesive, the adhesive It serves to hold the reference target at a distance from the beam, thereby The height 152 of the quasi-target is greater than the diameter 158 of the reference target. It is not a requirement, and the height of the reference target 152 must be less than the diameter 158 of the reference target. For example, the reference target 150 may be at least partially A reference target can be attached to the probe beam so that it extends into the beam 120. As another example, the reference target 150 may include only a portion of a sphere.

[0032] As another example, as shown schematically in FIGS. 1-2, the reference target 150 may be a probe beam. The axis offset 154 can be spaced from the leading edge 126 of the axis 120. Set 154 measures in a direction parallel to the probe beam centerline 130. As such, the on-axis offset 154 is at least 50 μm, at least 100 μm, or at least at most 200 μm, at least 300 μm, at least 400 μm, at most 450 μm, at most at most 350 μm, at most 250 μm, at most 150 μm, and / or at most 75 μm Additionally or alternatively, the on-axis offset 154 can be The probe beam 120 can be measured relative to the probe beam length 122, The beam length 122 is measured along a direction parallel to the centerline 130 of the probe beam. The on-axis offset 154 is at most 0.5 times the probe beam length 122 and at most 0.3 times the probe beam length, at most 0.25 times the probe beam length, at most 0.1 times the probe beam length, at most 0.05 times the probe beam length, and / or at most It can be 0.01 times the beam length. The upper offset 154 can be measured relative to the probe beam width 124, The beam width 124 is perpendicular to the probe beam centerline 130 as shown in FIG. A straight line extending through the entire lobe beam 120 and intersecting the center of the reference target 150 For example, the on-axis offset 154 is at most 1 / 2 inch (200 mm) from the probe. 5 times the beam width of 124, at most 3 times the probe beam width, at most 124 times the probe beam width Equal, at most 0.5 times the probe beam width, at most 0.25 times the probe beam width , and / or at most 0.1 times the probe beam width.

[0033] Additionally or alternatively, as shown schematically in FIG. 50 may be spaced from the probe beam centerline 130 by a cross-axis offset 156. The cross-axis offset 156 can be set along the top surface 128 of the probe beam 120. It is measured in a direction perpendicular to the center line of the beam. 56 is at least 50 μm, at least 100 μm, at least 200 μm, at least 300 μm, at least 400 μm, at most 450 μm, at most 350 μm, at most 2 It can be 50 μm, at most 150 μm, and / or at most 75 μm.

[0034] The reference target 150 can have any suitable size. For example, as shown in FIGS. As shown generally at 2, the reference target 150 may have a diameter 158 and / or The diameter 158 may be at least 25 μm and at least At least 50 μm, at least 100 μm, at least 200 μm, at least 300 μm, at least 400 μm, at least 500 μm, at least 600 μm, at least 700 μm, At least 800 μm, at least 900 μm, at most 1000 μm, at most 950 μm , maximum 850 μm, maximum 750 μm, maximum 650 μm, maximum 550 μm, maximum At most 450 μm, at most 350 μm, at most 250 μm, at most 150 μm, and / or Or at most 75 μm. In general, the smaller the reference target diameter 158, the better. This can result in a narrower and / or sharper focused reflection 162, can facilitate more accurate measurement of the spatial position of the reference target 150. Additionally or alternatively, the collected reflection 162 may be optically clear to the optical system 20. of the reference target so that it is visible with sufficient signal-to-noise ratio to be resolvable. It may also be preferable for the diameter 158 to be sufficiently large. When the diameter of the light source 158 is large enough, the diameter of the collected reflection 163 is The diameter of the collected reflection is related to the diameter of the reference target 158 ​​so that the ratio is large enough. It can be done.

[0035] 6-7 are more detailed illustrations of an example portion of the probe 100. , three probe tips 140, and attached to the probe beam 120 by adhesive 170. In the example of Figures 6-7, the adhesive 1 70 maintains the bottom of the reference target 150 above the top surface 128 of the probe beam 120. This acts to reduce the reference target height 152 to the reference target diameter 158. As shown in FIG. 7, adhesive 170 adheres to the top surface 12 of probe beam 120. 8 and / or the reference target 150. It may be partially and / or substantially embedded in the adhesive. Instead, as further shown in FIG. 7, the probe 100 is positioned above the probe beam 120. The reference target 128 may include a first adhesive 170, such as an epoxy, that substantially covers the reference target 128. The mat 150 may be secured by a second adhesive 171. In such an embodiment, the mat The adhesive 170 increases the stiffness of at least a portion of the probe beam 120, e.g., to facilitate reference timing. - Maintaining a substantially fixed positional relationship between the target 150 and the probe tip 140 As best seen in FIG. 7, FIGS. 6-7 show that the reference target 150 is A portion of the probe 100 spaced from the beam centerline 130 by a cross-axis offset 156 It can be explained by way of example.

[0036] 8-9 show a method for pressing the DUT 42 against the probe 100 (or equivalently, 1 shows a schematic diagram of an example of pressing a probe 100 against a DUT 42. 8 is the portion of the probe system 10 where the probe tip 140 comes into contact with the DUT 42. Figure 9 shows the configuration after the DUT has been translated upward relative to the probe (i.e. 8 shows the probe system of FIG. As shown schematically in FIG. 9, the probe beam 120 is in a normal position relative to the probe body 110. 8 and shown by dashed lines in Figure 9), and a position offset relative to the probe body (shown by solid lines in Figure 9). In other words, the probe beam 120 may bend, deflect, and / or otherwise react to forces applied to the probe tip 140. Alternatively, the structure may be configured to deform elastically. The pressure of the DUT 42 relative to the probe 100 (as described in more detail herein) Facilitates soldering to ensure robust electrical contact between, for example, the probe tip 140 and the DUT It is possible.

[0037] As described, the reference target 150 may be used to measure the accuracy and / or consistency of the pressure. This can facilitate pressing the DUT 42 against the probe 100 when the probe 100 is in contact with the DUT 42. For example, , as shown schematically in FIG. 9, pressing the DUT 42 against the probe 100 translating the DUT by the DUT pressing distance 34 and / or (reference target A portion of the probe 100 (such as probe 150) is positioned along a direction substantially parallel to the optical axis 22. This corresponds to translating the probe by a distance of 180. Therefore, the distance between the DUT 42 and the probe 100 can be made approximately equal to the distance between the DUT 42 and the probe 100. and come into contact and / or out of contact with each other, and / or the probe beam 120 Measurement of the height of the reference target 150 (e.g., For example, by focusing the optical system 20 on light reflected by a reference target. (This can be facilitated by the probe pressing distance 180 and / or DUT pressing distance More specifically, the DUT 42 can be connected to the probe 1. Before pressing it against the reference target 150, the optical system The focusing of the lens 20 is measured along a direction at least approximately parallel to the optical axis 22. a first height offset 62 (shown in FIG. 8) between the optical system and the reference target, Similarly, after pressing the DUT against the probe, a reference The optical system focuses the light reflected by the target onto the optical axis 22. The first distance between the optical system and the reference target, measured along a direction at least approximately parallel to the reference target. This can result in a measurement of the height offset 64 (shown in FIG. 9) between the probe and the probe. The push-in distance 180 is the difference between the first height offset 62 and the second height offset 64. It can be calculated as:

[0038] As further shown generally in FIGS. 8-9, the DUT 42 is pressed against the probe 100. This involves translating a portion of the probe 100 along a direction substantially perpendicular to the optical axis 22. For example, as shown schematically in FIG. 0, the reference target 150 is pressed against the optical axis 22 in a direction substantially perpendicular to the optical axis 22. and / or by translating the reference target by a lateral displacement 72 of the probe. The tip 140 is parallel to the optical axis by a lateral displacement 74 of the probe tip along a direction substantially perpendicular to the optical axis. For example, as shown schematically in FIG. The lateral displacement 72 is proportional to or substantially equal to the lateral displacement 74 of the probe tip. In this way, direct measurement of the lateral displacement 72 of the reference target is possible. can serve as an indirect measure of the lateral displacement of the probe tip. As shown, the lateral displacement 72 of the reference target and / or the lateral displacement of the probe tip Displacement 74 corresponds to a displacement along a direction generally parallel to the x-direction of probe system 10. However, in addition, the lateral displacement 72 of the reference target and / or the protrusion The lateral displacement 74 of the probe tip has a component perpendicular to the x direction (i.e., in the y direction shown in FIG. 7). It is within the scope of the present invention to have

[0039] The above description has primarily focused on the physical and / or electrical connection of the reference target 150 to the DUT 42. Utilizing the probe with a probe tip 140 configured to make electrical contact Although the reference target 150 is oriented toward the In one example, the probe system can transmit and receive optical signals. The transmitter may include at least one optical fiber configured to transmit and / or receive the signal. In such an example, each probe 100 may include an optical fiber, and / or each probe 100 may include an optical fiber. 00 can be an optical fiber, and the DUT 42 has at least one corresponding grating. The grating coupler can be a fiber optic coupler. and / or optical fiber for transmitting optical signals to the optical fiber without physical contact with the optical fiber. Such a system is configured to receive an optical signal from an optical fiber and a diffraction grating. Robust coupling with grating couplers is achieved by precise mechanical and / or optical fiber coupling with grating couplers. Therefore, the reference target may be attached to an optical fiber (or or an array of optical fibers), or a reference target can be connected to an optical fiber (or optical fiber (or optical fiber array) and correspond to the optical fiber (or optical fiber array) The probe tip is aligned with the grating coupler (or array of grating couplers) that 140 and the DUT 42. This can be promoted in a similar manner.

[0040] FIG. 10 illustrates a method for detecting a target including a reference target (such as reference target 150) according to the present invention. 2 is a flow chart illustrating a method 200 of utilizing a probe (such as probe 100). The method 200 includes providing a probe at block 210, the probe comprising: A probe body (such as probe body 110) and a probe beam (such as probe beam 120) a lobe beam and at least one probe tip 140 extending from the probe beam; The probe includes a probe tip (such as a probe tip) and a reference target attached to the probe beam. The step of preparing a probe in block 210 involves contacting a DUT (such as DUT 42) with a probe. providing a probe configured to: This may include buying, purchasing, and / or manufacturing. Alternatively, the step of providing a probe in block 210 may be performed by This may involve utilizing a probe forming part of a probe system (such as do.

[0041] As shown in FIG. 10, the method 200 begins at block 230 with a measuring a first position of the reference target relative to the optical system; Block 240 moving the DUT relative to the probe at block 250; and moving the DUT relative to the optical system at block 250. and measuring a second position of the reference target.

[0042] The step of measuring the first position at block 230 generally includes utilizing an optical system to: The reference target reflects and / or otherwise emits light (such as collected reflection 162). This involves focusing a concentrated reflection (e.g., an internal reflection) within the reference target. and / or light reflected from the outer surface of the reference target; and / or As shown in FIG. 10, the step of measuring in block 230 The step involves scanning the focal point of the optical system to focus the collected reflection in block 232. It can include.

[0043] As an example, scanning in block 232 may involve moving the focal plane of the optical system (toward the optical axis 22) A series of images of at least a portion of the probe are captured while being translated along an optical axis (such as In this way, the series of images can be recorded. For example, as shown in FIG. 10, The measuring step at 230 includes measuring the optical system in a direction parallel to the optical axis at block 234. A first height offset (such as first height offset 62) between the stem and the reference target As a more specific example, measuring the set in block 234 may include: The determination is made by analyzing a series of images generated during the scan in block 232 to determine the collected reflection. This can include identifying the location of the focal plane where the image is best focused.

[0044] The measuring in block 234 can be performed manually and / or by, for example, focusing. This can be done at least partially automatically by a focal point optimization routine. The point optimization routine may include a pattern score routine and / or a gradient search routine. As another example, the following routine may be implemented: As shown, the measuring step at block 230 begins with measuring the reference target at block 236. The method may further include measuring a first plane position, the first plane position being perpendicular to the optical axis. As a more specific example, the measuring in block 236 may be performed along a direction of light. Identify the position within the field of view of the optical system where the focused reflection appears when it is in best focus. In this way, the first position of the reference target can be determined by dividing the first position of the reference target by the x-axis. corresponds to the position of the reference target along the y-direction, along the y-direction, and / or along the z-direction. and / or corresponds to the three-dimensional position of the reference target relative to the optical system. It is possible.

[0045] The step of translating the DUT relative to the probe at block 240 may be performed by any suitable In one example, block 240 may include translating the image along a direction. The translating step involves translating the DUT while maintaining the probe in a substantially fixed position. In such an example, block 240 may include translating the The step may serve to deflect the probe beam relative to the probe body. and / or pressing the DUT against the probe. Additionally or alternatively, block 240 translates the DUT relative to the probe. Moving the probe translates the probe while keeping the DUT in a nearly fixed position. In such an example, the translating step in block 240 may include: , can be described as translating the probe relative to the DUT. The translating step at 240 may translate the DUT and / or probes toward each other. This may involve moving the DUT and / or probe along the optical axis, for example. The DUT and the probe are translated away from each other by translating along the This may include making the

[0046] As shown in FIG. 10, the method 200 continues after the translating step at block 240. At block 250, measuring a second position of the reference target relative to the optical system. The step of measuring the second position at block 250 generally involves utilizing an optical system. , after the translation step in block 240, the reference target is reflected, and / or otherwise focusing the emitted collected light reflection. As shown in FIG. 10, the measuring step in block 250 begins with measuring the optical system in block 252. This can include scanning the focal point of the system to focus the collected reflection. Scanning in block 252 involves shifting the focal plane of the optical system along the optical axis of the optical system. recording an image of at least a portion of the probe while translating it with an optical system; In this way, the series of images can include the second position of the reference target. This allows for the measurement of

[0047] For example, as shown in FIG. 10, the measuring step in block 250 may be replaced by a step in block 254. , the distance between the optical system and the reference target (second Optionally, measuring a second height offset (such as height offset 64) may be performed. As a more specific example, the measurement in block 254 can be performed by The series of images generated during the measurement at the focal plane where the collected reflection is best in focus is analyzed. The measuring in block 254 may be performed manually. and / or at least partially automated, e.g., by a focus optimization routine. For example, the focus optimization routine can be run in the pattern score routine. and / or including a gradient search routine; As another example, as further shown in FIG. 10, the measuring step at block 250 and additionally including measuring a second plane position of the reference target at block 256. The second plane position is measured along a direction perpendicular to the optical axis. , measuring in block 256 is performed to determine the best focus for the collected reflection within the field of view of the optical system. This can include identifying the location where the focused reflection appears when the two images match. , the second position of the reference target is along the x-direction, along the y-direction, and / or along the z-direction and / or relative to the optical system. This can correspond to the three-dimensional position of a reference target.

[0048] As further shown in FIG. 10, the method 200 begins at block 230 by identifying the first position of the reference target. Before the step of measuring the position, a step of contacting the probe tip with the DUT is performed in block 220. The contacting step in block 220 may include contacting the probe tip with the The probe tip is translated relative to the DUT to physically and / or Making electrical contact can include, for example, probes performing electrical measurements on the DUT. The contacting step in block 220 may involve contacting the probe and / or the DUT with the DUT. and independently translate in a direction perpendicular to, or at least substantially perpendicular to, the contact surface of the During the contacting step in block 220, and / or As a result of the contacting step, the probe tip contacts at least a portion of the contact surface of the DUT. It may be brushed or slid over and / or across a portion of the contact surface. Polishing can improve the electrical contact between the probe tip and the DUT. Block 220 The contacting step can be performed manually or at least partially autonomously. can be implemented effectively.

[0049] As further shown in FIG. 10, the method 200 measures the pressing distance at block 260. The measurement may additionally include a step of measuring, at least in part, a reference target. The distance is based on the difference between the first position of the reference target and the second position of the reference target. The height offset can be equal to the difference between the first height offset and the second height offset.

[0050] FIG. 11 is a flow chart illustrating a method for fabricating a probe with a reference target in accordance with the present invention. The method 300 begins at block 310 by connecting a probe (such as probe 100) to a The step of providing a probe beam (such as probe beam 120) The method 300 includes a beam and a probe tip (such as probe tip 140). Lock 320 attaches a reference target (such as reference target 150) to the probe beam. The method further includes the step of attaching the

[0051] The step of providing a probe in block 310 includes providing a probe configured to contact the DUT. The method may include providing a probe, obtaining, purchasing, and / or Additionally or alternatively, Block 3 may include manufacturing The step of providing a probe at 10 may be performed by a probe system (such as probe system 10). The method may include performing method 200 utilizing a probe forming part of the system. do.

[0052] The mounting step in block 320 involves attaching a probe beam 120 (such as the top surface 128 of the probe beam 120) to the probe beam 120. (e.g., mounting a reference target on top of the probe beam); and / or Alternatively, at least a portion of the reference target is in contact with the optical system when the probe approaches the DUT. The reference target is probed so that it is visible to an optical system (such as stem 20). The step of attaching in block 320 can include attaching the beam to the device. , by adhering the reference target to the probe beam with an adhesive (such as adhesive 170). The adhesive may include an epoxy, such as a thermal epoxy, and / or The step of attaching in block 320 may be performed by attaching the reference target. The target is placed at a predetermined orientation relative to the probe beam, e.g., reflecting from a reference target. This can include ensuring that the optical system is able to collect the emitted light. Alternatively, the reference target may be rotationally symmetric and / or rotationally inconsistent, such as a sphere. In odd-shaped embodiments, the reference target is oriented relative to the probe beam. This eliminates the need to place a reference target because the reflectance characteristics of such a target are is, at least in part, independent of the orientation of the reference target relative to the probe beam. Because it is possible.

[0053] The present invention provides some illustrative, non-exclusive examples in the form of flow charts or flowcharts. As related and / or illustrated, these flow charts or flowcharts illustrate methods Unless otherwise noted in the accompanying description, the present invention is illustrated and described as a series of blocks or steps. Unless otherwise specified, the order of these blocks may differ from the order shown in the flowchart. or steps) occurring in different orders and / or simultaneously. These blocks or steps may be implemented by logic circuits. It is within the scope of the present invention that these blocks or steps may be implemented as logic circuits. In some applications, these blocks or steps can be written to be implemented as A step is a representation or operation that can be performed by a functionally equivalent circuit or other logic device. The illustrated blocks may represent executable instructions, but the It is not a requirement that these instructions be implemented in a computer, processor, and / or other logic device. It causes a logical device to respond, perform an action, change state, or generate an output or indication. , and / or have decisions made.

[0054] As used herein, "and / or" between a first entity and a second entity means , (1) a first entity, (2) a second entity, and (3) a first entity and a second entity. Multiple entities listed with "and / or" are treated in the same manner, i.e., as follows: should be considered "one or more" of the entities joined together. that other entities other than the specifically identified entity have a relationship with the specifically identified entity Thus, as a non-limiting example, "A and / or B" When used with open-ended language such as "comprising," the reference can refer only to A (optionally including entities other than B); in other instances, only to B ( In yet another embodiment, A and B may be used together. These entities can be elements, actions, structures, It can refer to structure, shape, operation, value, etc.

[0055] As used herein, "at least one" in reference to a list of one or more entities means means at least one entity selected from any one or more entities in the list of entities It should be understood that any and all entities specifically listed in the list of entities does not necessarily include at least one of, and does not exclude any combination of entities in the list of entities This definition applies to the entities specifically identified in the list of entities and to which "at least one" refers. Other entities may optionally exist, either related or unrelated to the specifically identified entities. Thus, as a non-limiting example, "at least one of A and B" (or or equivalently, "at least one of A and B," or equivalently, "A and / or B" "at least one" in one embodiment means at least one (optionally including two or more) A, B can refer to non-existent entities (optionally including entities other than B); At least one (optionally including two or more) B, no A (optionally including entities other than A) ) can refer to; in yet another embodiment, at least one (optionally two or more) refers to at least one (optionally including two or more) A (optionally including other entities) and at least one (optionally including two or more) B (optionally including other entities) In other words, "at least one," "one or more," and "and / or "Or" is an open-ended expression that is both conjunction and disjunction in function. For example, "at least one of A, B, and C," "at least one of A, B, or C," "A, B, and C", "One or more of A, B, or C" "Above," and "A, B, and / or C" means A alone, B alone, C alone, A and B together, A and C together, B and C together, A, B, and C together, and optionally It may refer to any of the above in combination with at least one other entity.

[0056] As used herein, "at least substantially" modifies a degree or relationship. In this case, the degree or relationship described, not just the "substantial" degree or relationship described, A "substantial" amount of a stated degree or relationship is the amount of the stated degree. or at least 75% of the relationship. For example, at least substantially light reflective A transparent object includes an object having a light reflectance of at least 75%. A first direction that is also substantially parallel to a second direction is a unit vector along the first direction and a vector along the second direction. The directions include those whose dot product with the unit vector has a magnitude of at least 0.75.

[0057] As used herein, "adapted" and "configured" refer to an element, component, or other It means that the entity is designed and / or intended to perform a given function. Thus, the uses of "adapted" and "configured" refer to a given element, component, or other The subject of a function is merely "capable" of performing a given function, but the elements, components, and / or or other entity specifically selected, created, realized, utilized, programmed, or otherwise designed to perform such functions. This should not be construed as implying that the product is designed and / or capable of performing a particular function. The elements, components, and / or other configured to perform such functions in addition to or instead of the entities listed in It is within the scope of the present invention that the invention may be described as being provided in a particular embodiment, and vice versa.

[0058] As used herein, "for example," "by way of example," and / or simply "example" refers to

[0013] Reference is made to one or more components, features, details, structures, embodiments, and / or methods according to the disclosure. When used in conjunction with the present application, the described components, features, details, structures, embodiments, and / or methods , exemplary and non-explanatory views of components, features, details, structures, embodiments, and / or methods according to the present invention. The described components, features, The details, structures, embodiments, and / or methods are not intended to be limiting, necessary, or is not intended to be exclusive / exhaustive; other components, features, details, structures, implementations The forms and methods also include structurally and / or functionally similar and / or equivalent components, particularly All such features, details, structures, embodiments, and / or methods are within the scope of the present invention.

[0059] Any patents, patent applications, or other references are incorporated herein by reference. and any other part of this disclosure or any other incorporated reference. (1) define terms in a manner that conflicts with the terms in this disclosure, and / or (2) if inconsistent, The term and the disclosure contained herein shall govern except as otherwise provided by the inclusion of the term. Only to the reference portion defined and / or the reference portion where the included disclosure originally existed Dominant.

[0060] Illustrative, non-exclusive examples of probes, probe systems, and methods according to the present invention are set forth below. The individual steps of the methods described herein are presented in the paragraphs listed below. "Steps for" performing the actions described, including paragraphs listing additional or alternative steps It is within the scope of the present invention that the term "electronically coupled" may be used interchangeably with "electronically coupled" or "electronically coupled" in any manner whatsoever.

[0061] A1. A probe for a probe system, comprising: a probe body; a probe beam extending from the probe body; Extends from the leading edge of the probe beam away from the probe body and connects to the device under test (DUT) at least one probe tip configured to contact the at least one reference target attached to the probe beam; The reference target is visible to the optical system when the probe tip approaches the DUT. and measuring the position of the at least one probe tip relative to the DUT. A probe that encourages

[0062] A2. The probe of paragraph 1, wherein the reference target is attached to the top surface of the probe beam. The probe being used.

[0063] A3. Any of the probes of paragraphs A1 to A2, including at least one probe tip However, you can choose one probe tip, two probe tips, three probe tips, or four A probe including the above probe tip.

[0064] A4. A probe according to any one of paragraphs A1 to A3, wherein the probe beam is elastically bent and and / or deflected to allow for normal and deflected positions relative to the probe body. A probe that transitions between the

[0065] A5. In any of the probes of paragraphs A1 to A4, the reference target is a probe beam At least a portion of the upper surface of the frame that supports the reference target and / or the reference target A probe that is more optically resolvable by an optical system than adjacent portions thereof.

[0066] A6. The probe of paragraph A5, wherein the reference target is At least the portion supporting the reference target and / or the portion adjacent to the reference target and / or optically brighter than the Service.

[0067] A7. In any of the probes of paragraphs A5 to A6, the reference target is a probe beam At least a portion of the upper surface of the frame that supports the reference target and / or the reference target and has a greater optical reflectance and a greater optical contrast than the adjacent portions. A probe that is at least one of these things.

[0068] A8. In any of the probes of paragraphs A5 to A7, the reference target is a probe beam At least a portion of the upper surface of the frame that supports the reference target and / or the reference target A probe that scatters incident light to a greater degree than adjacent portions.

[0069] A9. Any of the probes of paragraphs A1 to A8, wherein the optical system has a discrete focus resolution The optical system focuses on the reference target within this discrete focus resolution range. The reference is set so that the focal point of the optical system is smaller than the focal resolution range for the probe beam. The probe for which the target is configured.

[0070] A10. Any of the probes in paragraphs A1 to A9, in which the probe tip is close to the DUT The probe system is configured so that the optical system is focused on the reference target when the probe is The probe being configured.

[0071] A11. Any of the probes of paragraphs A1 to A10, wherein the optical system has a focal range However, when the probe tip approaches the DUT, the reference target and the DUT each fall within the focal range. probes that are within range.

[0072] A12. Any of the probes in paragraphs A1 to A11, in which the probe tip is connected to the DUT When approaching the reference target and the optical system is focused on the reference target, the optical system A probe configured to receive a reference image of at least a portion of the target.

[0073] A13. Any of the probes of paragraphs A1 to A12, wherein the reference target is a focused reflection and an optical system configured to receive a focused reflection from the reference target. The probe is configured to:

[0074] A14. A probe according to paragraph 13, when subject to paragraph A12, in which the collected reflection is greater than the reference image. A smaller probe.

[0075] A15. The probe of paragraph 14, wherein the reference image has a diameter of the reference image and the collected reflection is a collected reflection. The diameter of the collected reflection is at least 0.1% of the diameter of the reference image. at least 0.2% of the diameter of the reference image, at least 0.5% of the diameter of the reference image 1% of the diameter of the reference image, at least 2% of the diameter of the reference image, at least 5% of the diameter of the reference image At least 10%, at least 50% of the diameter of the reference image, at least 70% of the diameter of the reference image , 85% of the diameter of the reference image at most, 60% of the diameter of the reference image at most, 50% of the diameter, at most 30% of the diameter of the reference image, at most 25% of the diameter of the reference image, at most 20% of the diameter of the reference image, at most 15% of the diameter of the reference image, at most 10% of the diameter of the reference image , at most 7% of the diameter of the reference image, at most 5% of the diameter of the reference image, at most 1% of the diameter of the reference image 3%, and a probe that is at least one of 1% of the diameter of the reference image.

[0076] A16. Any of the probes of paragraphs A14 to A15, wherein the diameter of the collected reflection is and the diameter of the collected reflection is at least 0.00001% of the linear dimension of the field of view of the optical system. , at least 0.0001% of the linear dimension of the field of view, at least 0.001% of the linear dimension of the field of view, At least 0.1% of the linear dimension of the field of view, at least 1% of the linear dimension of the field of view, At least 10%, at most 20% of the linear dimension of the field of view, at most 15% of the linear dimension of the field of view, at most At most 5% of the linear dimension of the field of view, at most 1% of the linear dimension of the field of view, at most 0.5% of the linear dimension of the field of view %, at most 0.05% of the linear dimension of the field of view, at most 0.005% of the linear dimension of the field of view, at most Within 0.0005% of the linear dimension of the field of view, and within 0.00005% of the linear dimension of the field of view at most A probe that is at least one of the following:

[0077] A17. The probe of any one of paragraphs A13 to A16, wherein the reference light reflection is a discrete focal point. Visible within the point resolution range, the discrete focus resolution range is at most the diameter of the reference target. 50%, at most 30%, at most 25%, at most 20%, at most 10%, at most 7%, at most 5%, at most 3%, and at most 1% Robe.

[0078] A18. A probe according to any one of paragraphs A13 to A17, wherein the collected reflection is a reflection of a reference target. and optionally, light reflected from the outer surface of a reference target. Robe.

[0079] A19. The probe of any one of paragraphs A13 to A18, wherein the collected reflection is a reflection of a reference target. The probe contains light that is internally reflected within the cavity.

[0080] A20. A probe according to any one of paragraphs A1 to A19, wherein the reference image and the collected reflection are at least Both of them are larger than the image of the portion of the probe beam that supports the reference target. The reference target is configured to have high light intensity and high optical contrast. Robe.

[0081] A21. Any of the probes in paragraphs A13 to A20, when subordinate to paragraph 16, The reference image is then imaged so that the collected reflection has a greater optical intensity and a greater optical contrast than the reference image. The probe for which the sub-target is configured.

[0082] A22. A probe according to any one of paragraphs A1 to A21, wherein the optical system is and configured to acquire an image, and as the probe tip approaches the DUT, Each of the four probe tips measures the probe beam from the bottom, measured parallel to the optical axis. The probe tip extends for a height of at least 10 μm and at least 50 μm. μm, at least 100 μm, at least 150 μm, at least 200 μm, at least 2 50 μm, at least 300 μm, at least 350 μm, at least 400 μm, at least Maximum 450 μm, Maximum 500 μm, Maximum 475 μm, Maximum 425 μm, Maximum 3 75 μm, maximum 325 μm, maximum 275 μm, maximum 225 μm, maximum 175 at least one of μm, at most 125 μm, at most 75 μm, and at most 25 μm One of the probes.

[0083] A23. A probe according to any one of paragraphs A1 to A22, wherein the optical system is configured to acquire an image of a reference target as the probe tip approaches the DUT. The height of the reference target measured parallel to the optical axis above the top surface of the probe beam. and the height of the reference target is at least 25 μm, at least 50 μm, at least at least 100 μm, at least 200 μm, at least 300 μm, at least 400 μm, at least 500 μm, at least 600 μm, at least 700 μm, at least 800 μm, At least 900 μm, at least 1000 μm, at most 950 μm, at most 850 μm , at most 750 μm, at most 650 μm, at most 550 μm, at most 450 μm, at most At most 350 μm, at most 250 μm, at most 150 μm, and at most 75 μm A probe that is at least one of the following:

[0084] A24. A probe according to any one of paragraphs A1 to A23, wherein the reference target is the tip The on-axis offset is parallel to the centerline of the probe beam. direction, and the centerline of the probe beam is measured along the top surface of the probe beam. Extending from the tip towards the probe body, the on-axis offset is at least 50 μm, At least 100 μm, at least 200 μm, at least 300 μm, at least 400 μm, At most 450 μm, at most 350 μm, at most 250 μm, at most 150 μm, and at most A probe that is at least 75 μm in size.

[0085] A25. A probe according to any one of paragraphs A1 to A24, wherein the probe beam is The probe beam length is measured along the centerline of the beam, and the centerline of the probe beam is A reference target extends along the upper surface of the lobe beam from the tip to the probe body. The axial offset is the distance from the tip of the lens to the probe. On-axis offset measured along a direction parallel to the centerline of the probe beam towards the probe body is at most 0.5 times the probe beam length, at most 0.3 times the probe beam length, At most 0.25 times the probe beam length, at most 0.1 times the probe beam length, The minimum of 0.05 times the lobe beam length and at most 0.01 times the probe beam length At least one probe.

[0086] A26. Any of the probes in paragraphs A1 to A25, wherein the probe beam is a probe beam the probe beam width is the probe beam width perpendicular to the centerline of the probe beam. Measured along a direction parallel to a line extending throughout and intersecting the center of the reference target. The center line of the probe beam is aligned along the top surface of the probe beam from the tip of the probe to the center of the probe. The reference target is spaced from the tip by an axial offset and extends to the body. The set is directed from the tip of the probe to the probe body along a direction parallel to the centerline of the probe beam. The on-axis offset is measured at most 5 times the probe beam width and at most 1 / 3 of the probe beam width. 3 times the probe beam width, at most 2 times the probe beam width, at most equal to the probe beam width 0.5 times the probe beam width, 0.25 times the probe beam width, and and at most 0.1 times the probe beam width.

[0087] A27. In any of the probes of paragraphs A1 to A26, the reference target is a probe beam The probe beam centerline is spaced from the centerline of the probe by a cross-axis offset. extending along the top surface of the beam from the tip to the probe body, and the cross-axis offset is , measured along the top surface of the probe beam in a direction perpendicular to the centerline of the probe beam, at least 50 μm, at least 100 μm, at least 200 μm, at least 300 μm, At least 400 μm, at most 450 μm, at most 350 μm, at most 250 μm, at most A probe that is at least one of at most 150 μm and at most 75 μm.

[0088] A28. Any of the probes of paragraphs A1 to A27, including a probe tip, a probe bi, A probe in which one or more of the probe body and the probe arm are optically opaque.

[0089] A29. Any of the probes of paragraphs A1 to A28, including a probe tip, a probe bi, and a probe in which one or more of the probe body is light absorbing.

[0090] A30. Any of the probes of paragraphs A1 to A29, wherein the reference target is at least A probe containing one axis of symmetry.

[0091] A31. The probe of paragraph A30, wherein the reference target is rotationally symmetric about an axis of rotational symmetry. and the axis of rotational symmetry extends approximately parallel to the centerline of the probe beam.

[0092] A32. A probe according to any one of paragraphs A28 to A31, wherein the reference target is rotationally symmetric. The probe is rotationally symmetric about an axis, and the axis of rotational symmetry extends approximately perpendicular to the center line of the probe beam. Robe.

[0093] A33. Any of the probes of paragraphs A28 to A32, wherein the reference target is at least A probe that is also substantially spherical.

[0094] A34. Any of the probes in paragraphs A28 to A33, in which the reference target is a part of a sphere Probes containing only minutes.

[0095] A35. A probe according to any one of paragraphs A1 to A34, wherein the reference target is a prism. and optionally a right-angle prism.

[0096] A36. Any of the probes of paragraphs A1 to A35, wherein the reference target is at least A probe that is substantially light reflective, and optionally completely light reflective.

[0097] A37. The probe of paragraph A36, wherein the reference target has a completely optically reflective surface. A probe containing a metal sphere.

[0098] A38. Any of the probes of paragraphs A36-A37, wherein the reference target is retroreflective The probe.

[0099] A39. Any of the probes of paragraphs A1 to A38, wherein the reference target is at least A probe that is partially optically transparent.

[0100] A40. Any of the probes of paragraphs A1 to A39, wherein the reference target is at least A probe that is partially optically translucent.

[0101] A41. In any of the probes of paragraphs A1 to A40, the diameter of the reference target is At least 25 μm, at least 50 μm, at least 100 μm, at least 200 μm, At least 300 μm, at least 400 μm, at least 500 μm, at least 600 μm , at least 700 μm, at least 800 μm, at least 900 μm, at most 100 0μm, maximum 950μm, maximum 850μm, maximum 750μm, maximum 650μm m, maximum 550 μm, maximum 450 μm, maximum 350 μm, maximum 250 μm, A probe that is at least one of at most 150 μm and at most 75 μm.

[0102] A42. The probe of any one of paragraphs A1 to A41, wherein the reference target is a probe The probe body is formed of a material different from at least one of the tip, the probe beam, and the probe body. The probe created.

[0103] A43. In the probe of any one of paragraphs A1 to A42, the reference target is a plastic The probe is formed of at least one of: black, acrylic, metal, and glass.

[0104] A44. The probe of paragraph A43, wherein the reference target is a glass sphere.

[0105] A45. Any of the probes of paragraphs A1 to A44, wherein the reference target is non-metallic A probe.

[0106] A46. Any of the probes of paragraphs A1 to A44, wherein the reference target is made of adhesive The probe beam is attached by adhesive, which is optionally at least one of epoxy and thermal epoxy. A probe containing either one.

[0107] A47. The probe of paragraph A46, wherein the probe is configured to substantially project the upper surface of the probe beam. a first adhesive covering the reference target, the reference target being attached to the first adhesive by a second adhesive; probe.

[0108] A48. Any of the probes of paragraphs A1 to A47, wherein the reference target is at least A reference target is attached to the probe beam so that it is partially inside the probe beam. The probe

[0109] B1. A method utilizing a probe containing a reference target, providing a probe according to any of paragraphs A1-A48; Measuring a first position of a reference target relative to the optical system; translating the DUT relative to the probe; measuring a second position of the reference target relative to the optical system; A method comprising:

[0110] B2. The method of paragraph B1, wherein the first position is a third-order position of the reference target relative to the optical system. A method equivalent to the original position.

[0111] B3. The method of any of paragraphs B1-B2, wherein the step of measuring the first position includes optical The focal point of the system is scanned to focus on the collected reflection produced by the reference target. The method includes:

[0112] B4. The method of paragraph B3, wherein the collected reflection includes light internally reflected within the reference target. method.

[0113] B5. Any of the methods of paragraphs B3-B4, wherein the collected reflection is from the outer surface of the reference target A method involving light reflected from a

[0114] B6. The method of any of paragraphs B3 to B5, wherein the scanning is performed by focusing the optical system. A surface is translated along the optical axis of the optical system while a portion of at least a portion of the probe is A method comprising recording an image of the series with an optical system.

[0115] B7. The method of any of paragraphs B1 to B6, wherein the step of measuring the first position includes optical measuring a first height offset between the system and a reference target; A method in which the height offset is measured along a direction parallel to the optical axis of the optical system.

[0116] B8. The method of paragraph B7, wherein measuring the first height offset comprises: Analyze and, optionally, utilize an automated focus optimization routine to determine where the focus is best focused on the collected reflection. How to identify a good focal plane location.

[0117] B9. The method of paragraph B8, wherein the automated focus optimization routine is The method includes one or more of a gradient search routine and a gradient search routine.

[0118] B10. The method of any of paragraphs B1 to B9, wherein the step of measuring the first position includes optical Measure the first plane position of the reference target measured along a direction perpendicular to the optical axis of the optical system. The method includes determining

[0119] B11. The method of paragraph B10, wherein measuring the first plane position of the reference target comprises: Identify the position where the focused reflection appears within the field of view of the optical system when it is best focused. The method includes distinguishing

[0120] B12. Any of the methods of paragraphs B1 to B11, wherein the DUT is translated relative to the probe. The step of moving the DUT translates the probe beam to deflect it relative to the probe body. A method including directing

[0121] B13. Any of the methods of paragraphs B1 to B12, wherein the DUT is translated relative to the probe. The step of moving the probe translates the DUT while maintaining the probe in a substantially fixed position. The method includes:

[0122] B14. Any of the methods of paragraphs B1 to B13, wherein the DUT is translated relative to the probe. The step of translating the probe while maintaining the DUT in a substantially fixed position. The method includes:

[0123] B15. Any of the methods of paragraphs B1 to B14, wherein the DUT is translated relative to the probe. The step of moving may include translating the DUT and / or the probe toward each other. Methods including:

[0124] B16. Any of the methods of paragraphs B1 through B14, wherein the DUT and / or probe are a method comprising translating the object away from the object.

[0125] B17. The method of any of paragraphs B1-B16, wherein the second position is relative to the optical system. A method that corresponds to the three-dimensional position of a reference target.

[0126] B18. The method of any of paragraphs B1-B17, wherein the step of measuring the second position comprises: The focal point of the optical system is scanned to focus on the collected reflection produced by the reference target. The method includes:

[0127] B19. The method of paragraph B18, wherein scanning comprises moving a focal plane of the optical system to the optical system. A series of images of at least a portion of the probe are captured by the optical system while the optical system is moved along the optical axis of the system. A method including recording in a stem.

[0128] B20. The method of any of paragraphs B1-B19, wherein the step of measuring the second position comprises: measuring a second height offset between the optical system and the reference target; The height offset of the two is measured along a direction parallel to the optical axis of the optical system.

[0129] B21. The method of paragraph B20, wherein measuring the second height offset comprises measuring a series of images. The image is analyzed and, optionally, an automated focus optimization routine is used to determine whether the focus is on the collected reflection. How to identify the best-fit focal plane location.

[0130] B22. The method of paragraph B21, wherein the automated focus optimization routine The method includes one or more of a gradient search routine and a gradient search routine.

[0131] B23. The method of any of paragraphs B1-B22, wherein the step of measuring the second position comprises: The second plane position of the reference target measured along a direction perpendicular to the optical axis of the optical system is The method includes measuring.

[0132] B24. The method of paragraph B23, wherein measuring the second plane position of the reference target comprises: Identify the position where the focused reflection appears within the field of view of the optical system when it is best focused. The method includes distinguishing

[0133] B25. The method of any of paragraphs B1-B24, before the step of measuring the first position and contacting at least one probe tip with a corresponding DUT. How to do it.

[0134] B26. The method of paragraph B25, further comprising: connecting at least one probe tip to a corresponding DUT. The step of contacting the probe tip translates the probe tip relative to the DUT. the tip being in electrical contact with the DUT.

[0135] B27. The method of any of paragraphs B25 to B26, wherein at least one probe tip The step of contacting the probe with the corresponding DUT includes contacting one or both of the probe and the DUT. and independently translating the DUT in a direction at least substantially perpendicular to the contact surface of the DUT. How to do it.

[0136] B28. The method of any of paragraphs B25 to B27, wherein at least one probe tip The step of contacting the probe with a corresponding DUT includes: The method includes polishing across at least a portion of the contact surface of the UT.

[0137] B29. The method of any of paragraphs B25 to B28, wherein at least one probe tip The step of contacting the probe with the corresponding DUT includes contacting one or both of the probe and the DUT. A method that involves manual translation.

[0138] B30. The method of any of paragraphs B25 to B28, wherein at least one probe tip The step of contacting the probe with the corresponding DUT includes contacting one or both of the probe and the DUT. 1. A method comprising at least partially autonomously translating.

[0139] B31. In any of the methods of paragraphs B1 through B30, after the step of measuring the second position, and measuring a pressing distance of the probe against the DUT. The step of measuring the distance includes, at least in part, measuring a first position, a second position, and a second position. A method based on the difference from the second position.

[0140] B32. The method of paragraph B31, wherein the pressing distance is a first height offset and a second height offset. The method is equal to the difference between the offset.

[0141] C1. A probe configured to test at least one device under test (DUT) 1. A system comprising: At least one probe according to any one of paragraphs A1 to A48, at least one probe configured to test a corresponding one of the DUTs; ; When at least one probe approaches a corresponding DUT, at least one of the probes and an optical system configured to acquire an image of at least a portion of the probe along an optical axis. In the system, The probe system includes at least one probe for detecting at least one reference target. A probe system configured to enable measurement of a position.

[0142] C2. The probe system of paragraph C1, wherein: A corresponding probe of the at least one probe is connected to at least one DUT. at least one probe configured to support and maintain a corresponding DUT thereon; Buholder; a chamber defining a support surface configured to support a substrate including at least one DUT; and a controller programmed to perform any of the methods of paragraphs B1-B31; The probe system further comprising one or more of:

[0143] C3. The probe system of paragraph C2, wherein the probe system includes a controller; The controller executes an automated focus optimization routine to obtain a reference time for the optical system. A probe system that measures the target position.

[0144] C4. The probe system of any of paragraphs C1-C3, wherein the optical system: configured to illuminate at least one reference target of at least one probe; illuminated light source; Concentrating light reflected from at least one reference target to form a corresponding focused reflection. a microscope configured to: an optical system configured to limit ambient light from entering at least a portion of the optical system; enclosure; A probe system comprising one or more of:

[0145] C5. A probe system according to any one of paragraphs C1 to C4, wherein the probe system is arranged along the optical axis of the optical system. The position of the focal plane of the optical system is measured by a part of the probe system that is connected to the optical system. a program configured to record the image of the portion of the image that is visible to the user in synchronization with the image of the portion of the image that is visible to the user; Service system.

[0146] C6. Any of the probe systems of paragraphs C1 through C5, wherein the optical system has a field of view and at least one reference time when at least one probe tip approaches the DUT. The target and at least one probe tip are each configured to be within this field of view. A probe system.

[0147] C7. A probe system according to any of paragraphs C1 to C6, wherein the field of view of the optical system is The linear dimension of the field of view is at least substantially perpendicular to the optical axis of the optical system. The linear dimension of the field of view is measured along the optical axis and is at least 100 micrometers (μm), At least 300 μm, at least 500 μm, at least 1 millimeter (mm), at least At least 1.5mm, at least 2mm, at least 3mm, at least 5mm, at most 7mm, at most 2.5mm, 1.7mm, 1.2mm, 700μm, at least 1 00 pixels, at least 300 pixels, at least 500 pixels, at least 1000 pixels, At least 1300 pixels, at least 1500 pixels, at least 2000 pixels, at least 2500 pixels, maximum 3000 pixels, maximum 2200 pixels, maximum 1700 pixels, One or more of: at most 1200 pixels, at most 700 pixels, and at most 200 pixels This is a probe system.

[0148] C8. Any probe system of paragraphs C1 through C7, including at least one probe A probe system in which one or more of the probes in the probe contain multiple corresponding reference targets. Hmm.

[0149] C9. The probe system of paragraph C8, wherein among the plurality of corresponding reference targets, At least one reference target of the plurality of corresponding reference targets A probe system that is distinguishable from at least one other reference target.

[0150] C10. Any of the probe systems of paragraphs C1 through C9, wherein the probe system is Each probe includes a corresponding reference target, and the reference target includes a corresponding A probe system configured to allow unique identification of the probe.

[0151] D1. A method for producing a reference targeted probe, comprising: providing a probe having a probe beam and at least one probe tip; Top and; attaching a reference target to the probe beam; A method comprising:

[0152] D2. The method of paragraph D1, wherein the attaching step includes attaching a reference target to a probe beam. The method includes attaching the device to the top surface of the device.

[0153] D3. The method of any of paragraphs D1-D2, wherein the attaching step comprises attaching the probe to the subject. When approaching the device under test (DUT), the reference target must be visible to the optical system. The method includes attaching a reference target to the probe beam, such that:

[0154] D4. The method of any of paragraphs D1-D3, wherein the attaching step comprises attaching a reference target to a reference target. and adhering the probe to the probe beam with an adhesive, the adhesive optionally being an epoxy and a thermal epoxy. A method comprising at least one of:

[0155] D5. The method of any of paragraphs D1 through D4, wherein the attaching step includes attaching a reference target to a reference target. The method includes positioning a probe at a predetermined orientation relative to a probe beam.

[0156] D6. The method of any of paragraphs D1-D5, wherein the reference target is at least substantially How to be spherical.

[0157] D7. The method of any of paragraphs D1 to D6, wherein the probe is any of paragraphs A1 to A48. A method that is a probe. [Industrial Applicability]

[0158] The probes, probe systems, and methods disclosed herein are suitable for the semiconductor testing industry. It is available.

[0159] The above disclosure encompasses multiple distinct inventions with independent utility. Each of these inventions is disclosed in its preferred form, and is not intended to be limiting unless otherwise specified. The specific embodiments disclosed and illustrated herein should not be considered in a limiting sense. The subject matter of the present invention is the same as that disclosed herein, since a great number of variations are possible. All novel and non-obvious combinations and subcombinations of the various elements, features, functions, and / or properties disclosed herein Similarly, this disclosure, the preceding numbered paragraphs or when a later claim recites "a" or "first" element, The claims should be understood to include the inclusion of one or more such elements, and not two or more. It neither requires nor excludes these elements.

[0160] The following claims are directed to one of the disclosed inventions and provide a novel and unobvious specific It is believed that the combinations and subcombinations of features, functions, elements, and and / or other combinations and subcombinations of properties. amending the claims in this application or presenting new claims in this or any related application Such amended or new claims may also be directed to a different invention. Even if directed to the same invention, the scope of the original claims may differ, be broader or narrower. or equivalents are considered to be within the inventive subject matter of this disclosure.

Claims

1. 1. A probe for a probe system, comprising: A probe body; a probe beam extending from the probe body; at least one probe tip extending from a leading edge of the probe beam distal from the probe body and configured to contact a device under test (DUT); at least one reference target attached to said probe beam, the reference target is formed of a different material than the probe beam; the reference target is configured to be visible to an optical system when the probe tip approaches the DUT to facilitate measuring the position of the at least one probe tip relative to the DUT; the reference target is configured to be more optically resolvable by the optical system than at least a portion of the probe beam adjacent to the reference target; the reference target is configured to produce a focused reflection; the optical system is configured to receive the collected reflection from the reference target, the optical system being focused on the collected reflection; A probe wherein the collected reflection includes light internally reflected within the reference target.

2. 2. The probe of claim 1, wherein the optical system is configured to receive a reference image of at least a portion of the reference target when the probe tip approaches the DUT and when the optical system is focused on the reference target, and the focused reflection is smaller than the reference image.

3. 3. The probe of claim 2, wherein the reference image has a diameter of the reference image, and the focused reflection has a diameter of the focused reflection, the diameter of the focused reflection being at most 25% of the diameter of the reference image.

4. 2. The probe of claim 1, wherein the reference target is configured such that the optical system focuses on the reference target within a discrete focus-resolution range of the optical system, the discrete focus-resolution range being smaller than a focus-resolution range within which the optical system focuses on the probe beam.

5. The probe of claim 1 , wherein the reference target is mounted on top of the probe beam.

6. The probe of claim 1 , wherein the reference target includes at least one axis of symmetry.

7. The probe of claim 6 , wherein the reference target is at least substantially spherical.

8. The probe of claim 1 , wherein the reference target is optically reflective.

9. The probe of claim 1 , wherein the reference target is at least partially optically transparent.

10. 10. The probe of claim 1, wherein the reference target has a reference target diameter, the reference target diameter being at most 150 microns ([mu]m).

11. The probe of claim 1 , wherein the reference target is a glass sphere.

12. The probe of claim 1 , wherein the reference target is attached to the probe beam with an adhesive, the adhesive comprising an epoxy.

13. The probe of claim 1 , wherein the probe beam is configured to elastically deform to transition between a normal position relative to the probe body and an offset position relative to the probe body.

14. The probe of claim 1 , wherein the focused reflection has a diameter of the focused reflection that is smaller than a diameter of the incident light incident on the reference target.

15. 1. A probe system configured to test at least one device under test (DUT), comprising: at least one probe according to any one of claims 1 to 14, configured to test a corresponding one of said at least one DUT; an optical system configured to acquire an image of at least a portion of the at least one probe along an optical axis as the at least one probe approaches the corresponding DUT, A probe system configured to enable measurement of a position of the at least one reference target of the at least one probe.

16. 16. A probe system according to claim 15, configured to record the position of a focal plane of the optical system along its optical axis synchronously with an image of a portion of the probe system that is visible to the optical system.

17. 16. The probe system of claim 15, wherein the optical system has a field of view, and wherein the at least one reference target and the at least one probe tip are each configured to be within the field of view when the at least one probe tip approaches the DUT.

18. 16. The probe system of claim 15, wherein the optical system has a field of view, the field of view having a field of view linear dimension, the field of view linear dimension measured along a direction at least substantially orthogonal to the optical axis, and the reference target is configured to produce a focused reflection, the focused reflection having a focused reflection diameter, the focused reflection diameter being at least 0.1% of the field of view linear dimension and at most 10% of the field of view linear dimension.

19. A method for producing the probe according to any one of claims 1 to 14, comprising the steps of: providing the probe body, the probe beam extending from the probe body and the at least one probe tip extending from the leading end of the probe beam; attaching the at least one reference target to the probe beam; A method comprising:

20. 20. The method of claim 19, wherein attaching the reference target comprises adhering the reference target to the probe beam with an adhesive.

Images