Lifting and holding device for treating at least one substrate arranged in a carrier element, and method using a lifting and holding device of this kind

Abstract

The invention relates to a lifting and holding device for treating at least one substrate, in particular wafer, arranged in a carrier element. According to the invention, at least one lifting and holding device can be used in a basin that is filled with a liquid medium and can be moved into the basin, inside the basin and out of the basin by means of at least one manipulator unit. The invention also proposes a method for drying substrates.

Description

[0001] Lifting and holding device for treating at least one substrate arranged in a carrier element and method with such a lifting and holding device

[0002] Description

[0003] The invention relates to a lifting and holding device for treating at least one substrate, in particular a wafer, arranged in a carrier element. Furthermore, the invention comprises a method for treating substrates, in particular wafers, arranged in at least one carrier element in a tank filled with a liquid medium, wherein the carrier element is arranged on a stand element within the tank.

[0004] Definitions

[0005] The treatment of substrates refers to processes necessary for the production of such substrates, especially wafers, and which require processing in a tank filled with a liquid medium. Processing processes include etching processes, rinsing and cleaning processes in the liquid medium, as well as drying processes. The invention describes the drying process in particular as a treatment process, but is not limited to it. Rather, it refers to all treatment processes necessary for the production of substrates of the above type. State of the Art

[0006] US 4,722,752 discloses a process of the type mentioned in the first paragraph, in which silicon wafers are immersed for a period of time in a liquid containing hot (90 °C) deionized water for cleaning. The silicon wafers are then slowly lifted out of the water (at a speed of approximately 5 cm / min). This speed is sufficiently low to ensure that the silicon wafers leave the bath in a virtually dry state.

[0007] In practice, it has been shown that with this type of drying, impurities from the liquid can remain on the substrates. It has been shown that when applying the known method described, a water film with a thickness of several micrometers remains on the silicon wafers. This water film then evaporates quickly, which can, however, lead to the formation of so-called "drying marks." During drying, the water film can contract, so that impurities in the water, which are often organic or metallic in nature, remain in local concentrations on the wafers.

[0008] Such residues can be very disruptive if, for example, the wafers still need to undergo etching. They can locally delay or even prevent the etching process.

[0009] A physical effect is used in the drying of substrates. The substrates are placed in a basin filled with a liquid medium, and the basin is then closed with a lid. An alcohol-nitrogen mixture is introduced into the resulting gas space above the liquid medium. Isopropanol (abbreviated IPA) is preferably used as the alcohol because it is always available in high purity in semiconductor manufacturing. When the substrates are then lifted above the medium in an upright position (perpendicular to the extent of the fluid medium), the alcohol creates a change in the surface tension in the medium adhering to the substrate. This change in surface tension causes the so-called Marangoni effect. The medium adhering to the surface is drawn downwards into the basin.The process is continuous, so that when the substrates are slowly moved (typically 1 to 2 mm / see) out of the medium, a completely dry surface is left behind.

[0010] This residue-free drying process ensures a low- to particle-free surface after drying. At the same time, oxidation of the substrate surface, which typically occurs due to the oxygen contained in the medium during its slow evaporation, is prevented.

[0011] A key prerequisite for particle-free drying is the absence of particle-generating mechanical devices. To enable this, the process chamber contains a very simple device for supporting the carrier, a so-called support element for holding the substrates, as well as a device for lifting the substrates from the support element. The drives are located outside the process area. Thus, there are no significant mechanical movements within the process chamber, except for the movement of the substrates themselves.

[0012] Disadvantages of the state of the art

[0013] The previously described processes and devices have different disadvantages, depending on how the drying process is implemented. According to the state of the art, drying involves lifting the substrates out of the tank and drying by lowering the liquid level in the tank. Disadvantages can be identified when drying with lifting the substrates out of the tank:

[0014] Due to the guides in the lid, the dryer is limited to drying one substrate size. To enable use with other substrate sizes, the dryer must be prepared for conversion. Changing between two substrate sizes requires conversion each time. The mechanical settings are complex. There is a risk of substrate breakage after conversion if the mechanical settings are not carried out correctly. In addition, the dryer must be cleaned and tested for production re-qualification after each conversion. A total of approximately 8 hours must be allowed for conversion between two substrate sizes. Under these conditions, machines are equipped with two dryers so that parallel operation of the machine with two substrate sizes is possible. This incurs costs and requires space.

[0015] Mechanical adjustment is complex and therefore time-consuming and costly. Since the substrates are lifted from the carrier element over their entire height into the guides in the lid, all components must be precisely aligned. Incorrect adjustments result in mechanical stresses. These lead to friction (particle formation), damage to the substrates, or even wafer breakage. In the latter case, extensive cleaning and requalification of the dryer is necessary.

[0016] When using standard carriers, the carrier elements in the dryer must be tilted slightly. This is the only way to ensure that all substrates rest with their unused backs in the guides. Only then do all wafers have the same distance from each other. This is a prerequisite for threading the substrates into the guides in the lid. Tilting the carrier elements requires an additional mechanical device. Due to the tilt, all guide devices, as well as holding and lifting devices, must be adjusted to the exact angle to each other. This requires increased effort during the design, assembly, and commissioning of the dryer. This makes converting between substrate sizes even more challenging and therefore more time-consuming and costly.

[0017] The support elements initially remain in the drying tank and must then be dried separately. This significantly increases the process time, which in turn increases costs.

[0018] Especially with standard carriers, drying takes longer than with substrates due to the height of the carrier elements and their complex geometry. This results in a longer process time.

[0019] The design of the lifting and holding device requires very deep tanks, as the substrates must be lifted over the entire height of the support element. This has disadvantages when installing the tank in the housing (space requirements, the upper edge of the process tank is positioned high, which may increase the overall height of the system). It also increases the dryer's water consumption and thus the ongoing operating costs.

[0020] The mechanics of the dryer's lifting mechanism according to the state of the art are complex. The synchronization of the lifting movements "raising and lowering the support element" and "raising and lowering the substrate" is achieved by a cam mechanism. Switching to a different substrate size always requires a modification of this mechanism. This represents a further source of error during a conversion. Disadvantages of the state of the art are also evident in the drying process, which involves lowering the level of the liquid medium in the tank.

[0021] The substrates are not separated from the support element during drying. This creates contact points between the substrate and support element where large droplets remain after the liquid level of the medium has dropped. To dry these large droplets, hot nitrogen is introduced into the process tank after the actual drying process until the droplets have completely evaporated. This involves:

[0022] • Significantly increases the process time. Hot nitrogen may need to be introduced for 10 minutes or longer until all droplets have completely evaporated.

[0023] • Significant increase in consumption costs due to nitrogen consumption and energy costs.

[0024] • Significantly increased particle counts. High flow rates (150 to 500 l / min) are required to effectively increase the temperature in the process tank using hot nitrogen. This causes strong turbulence in the process tank. Particles are carried from the surfaces of the process tank onto the wafers.

[0025] • The nitrogen flow leads to electrostatic charging of the wafer surface. This, in turn, promotes the accumulation of particles on the substrate surface. Furthermore, there is a risk of damage to circuits on the wafers due to high current peaks during the dissipation of electrostatic energy.

[0026] Furthermore, a reduced drying efficiency is evident due to a reduced Marangoni effect. In the version with the substrates lifted out of the tank, the water in the tank is exchanged throughout the entire substrate drying process (water flows in from below and overflows out of the tank on both sides). This continuously removes isopropanol that diffuses into the surface of the medium. Thus, the gradient in surface tension between the adhering water on the substrate surface and the level of the medium in the tank is maintained throughout the entire drying time. Since medium exchange is not possible when the level is lowered, the difference in surface tension decreases with increasing duration of the process. As a result, the drying effect diminishes towards the end of the drying process (bottom of the substrate).

[0027] Object of the invention

[0028] Therefore, the object of the invention is to propose a device and a method by which at least one disadvantage of the prior art is avoided.

[0029] Solution to the task

[0030] The solution to the problem is characterized by the features of claim 1 and claim 9.

[0031] Advantages of the invention

[0032] A fundamental principle of the invention is that the surface of the substrates has no contact points with the carrier element during treatment, for example, during drying. This is achieved by separating the substrates from the carrier element during drying.

[0033] Typically, these dryers for carrier elements with substrates are integrated into fully automated wet-process systems and are continuously loaded and unloaded. As the final process step, the dryer, with process times of around 10 minutes, often proves to be a bottleneck. Reducing drying times generally directly increases the throughput of the wet-process system.

[0034] The device and method according to the invention achieve the following:

[0035] • The dryer can be used with different substrate sizes without any modifications. This allows mixed operation with different substrate sizes.

[0036] • In mixed operation with different substrate sizes, the system can be operated with only one dryer.

[0037] • Since the substrates within the carrier element only move a few millimeters, in contrast to the state of the art, the mechanical design is greatly simplified.

[0038] • Due to the significant simplification of the mechanics, less adjustment work is required compared to the original version.

[0039] • The risk of breakage is greatly reduced.

[0040] • Since the stroke of the substrates within the support elements to achieve the treatment, for example drying, is only a few millimeters, the friction is reduced and there is no risk of particle formation.

[0041] • Drying time is significantly reduced. Since the carrier element is dried simultaneously with the substrate, and only a few seconds are needed to dry the bottom section of the carrier element, drying times of less than four minutes are achieved for 6-inch substrates. This is shorter than the typical process time of other process tanks. Thus, the dryer no longer limits the throughput of an automatic system.

[0042] • The drying of the support elements is more effective than is known from the prior art, as the surface tension gradient is completely maintained during the drying process. The axes are no longer controlled mechanically via a cam disk. Adjustments / optimizations are possible with simple adjustments.

[0043] Due to the short distances of the lifting and holding devices, it would be possible to use pneumatic short-stroke cylinders instead of electric servo drives, which in turn saves costs.

[0044] Furthermore, the device allows for different substrate sizes to be treated in one tank without any modifications, while using the same process. For example, 6-inch and 8-inch substrates are conceivable.

[0045] An advantageous development of the carrier element provides for a fixing element formed by the first lifting and holding device to be fixedly mounted on the carrier element. A low-mass carrier is suitable for this purpose, in which a second lifting and holding device lifts the substrates from the carrier element during the treatment process and positions them between the first and second lifting and holding devices in such a way that they do not contact the actual carrier element of the substrate.

[0046] Further advantageous embodiments will become apparent from the following description, the claims and the drawings.

[0047] Drawings

[0048] Fig. 1 AP shows a schematic representation of a first exemplary embodiment of a lifting and holding device, as well as a representation of a first method process that can be carried out with the lifting and holding device; Fig. 2 AT shows a schematic representation of a second exemplary embodiment of a lifting and holding device, as well as a representation of a second method process that can be carried out with the lifting and holding device;

[0049] Fig. 3 AL a schematic representation of a third

[0050] Embodiment of a lifting and holding device as well as the representation of a third process that can be carried out with the lifting and holding device;

[0051] Fig. 4 AG a schematic representation of a fourth

[0052] Embodiment of a lifting and holding device as well as the representation of a fourth process that can be carried out with the lifting and holding device;

[0053] Fig. 5 AE is a schematic representation of a fifth embodiment of a lifting and holding device as well as a representation of a fifth method process that can be carried out with the lifting and holding device;

[0054] Fig. 6 AK a schematic representation of a sixth embodiment of a lifting and holding device as well as the representation of a sixth method process that can be carried out with the lifting and holding device.

[0055] Description of the embodiments

[0056] Many substrates S arranged in a carrier element T are immersed into a basin B filled with liquid medium F via at least one lifting and holding device and subjected to a processing process. The basin is U-shaped in cross-section and is dimensioned such that the carrier element T, together with parts of the lifting and holding device, fits into the basin B and such that the depth is dimensioned such that the carrier element T can be completely covered with liquid medium in one position. It is also dimensioned such that the carrier element T can be freely positioned and removed within the basin. Stand elements are provided within the basin B for the correct positioning of the carrier element T. The basin B is filled with liquid medium F. In the drawings, the fill level within the basin with the liquid medium is shown with a dotted line.The basin B is open on one side, namely at the top, for removal of the carrier element T. During the processing, a cover element (not shown in the drawings) is arranged on the basin B and thus closes the basin. The cover element can be moved transversely to the basin B to release the carrier element T. The lifting and holding device consists of the actual lifting and holding element for changing the positioning of the carrier element and / or for changing the positioning and / or holding the substrates positioned in the carrier element T. In its rest position, the lever element is arranged in the area of ​​the base G of the basin B.The respective lifting arm extends from basin B, even when the lid element is closed, and is connected to a manipulator unit (not shown in the drawings) such that the lifting arm is movable and / or pivotable, such that the lifting and holding element is movable within basin B and such that the lifting and holding element can be lifted out of the basin. A fixed connection within the basin is not provided to keep the basin wall intact.

[0057] The individual embodiments are described below in connection with the respective process, whereby the previously described features are applied to all embodiments.

[0058] First Embodiment (Fig. 1 AP) The lifting and holding device 10 in the first embodiment consists of two lifting and holding elements 11, 12, each coupled to a lifting arm 14, 15. This lifting and holding device 10 is suitable for carrier elements T, so-called standard carriers (a simplified representation provides for the carrier element T not being shown in Fig. 1 AB). The respective substrates S are arranged sequentially in the carrier element T and have several contact points and surfaces. The contact points and surfaces are created by receiving the substrates S in the respective comb-like recesses, which are arranged in defined areas within the carrier element T.This means that the respective substrate S rests against the carrier element T at several points and / or surfaces and therefore cannot be wetted by the liquid medium or can only be insufficiently wetted, or that the liquid medium remains at precisely these points during a drying process. Typically, the substrates S are slightly tilted relative to their vertical position.

[0059] The support element stands within the basin B on a stationary base element 17. The basin B is completely filled with liquid medium F. The two lifting and holding elements 11, 12 are movable independently of each other in and against the direction of an arrow 13, at least indirectly, by the lifting arms 14, 15.

[0060] The first lifting and holding element 11 consists of two fixing elements 11a, 11b, which in this embodiment are designed as lifters and holders for the substrates S, as well as the lifting arm 14. The fixing elements 11a, 11b engage on the side of the substrates S facing the base G, outside the respective vertical axis of symmetry 16 of the substrates S, and each have a linear guide 11c. This means that the substrate S can rest or lie against the first lifting and holding element 11 with its front side over a defined arc. The second lever element 12, which has the further lifting arm 15, is also initially engaged externally. The second lifting and holding element 12 can also rest on the respective substrates from the bottom G of the basin, but in contrast to the first lifting and holding element 11 with a point-shaped receptacle which engages the front side of the respective substrate S in the center of the axis (extension of the axis of symmetry 16).

[0061] The first lifting and holding element 11 is designed such that, in an initial position, it is not in engagement with the carrier element T and the substrates S (Fig. 1 CD). This also applies to the second lifting and holding element 12.

[0062] To begin the processing, for example a drying process, the first lifting and holding element 11 lifts the substrates S within the carrier element T in the direction of arrow 18. As a result, the line guide 11c grips the substrates S at their end faces and moves them outwards from the carrier element T. As a result of this engagement, the substrates S align themselves vertically by moving from their tilted position (Fig. 1 CD) into the now vertical position (Fig. 1 F) and thus move in the direction of arrow 19 (Fig. 1 F) and are held by the line guide 11c of the lifting and holding element 11. In a further step (Fig. 1 GH), the fill level of the liquid medium F within the container B is lowered so that the drying process can begin. This takes place wherever there is no contact with the carrier element T.However, in the area of ​​the line 11c of the first lifting and holding element 11, there is still contact, so that if the liquid medium is lowered further beyond this location, no drying is to be expected.

[0063] In order to enable drying here as well, the second lifting and holding element 12 is now moved with its lifting arm 15 in the direction of arrow 13 (Fig. 1J) until a point-like receptacle is reached on the end face of the respective substrate S. The second lifting and holding element 12 acts as a support element and guides the substrates S until they at least partially come into contact with the carrier element T. In doing so, the substrates tilt in the direction of arrow 19 'and thus again into an inclined position so that they can also come into contact with the carrier element T. The level of the liquid medium continues to drop and the first lifting and holding element 11 moves back to its starting position. This occurs while still within the liquid medium. The previously touched end face of the substrates S is thus free again. The level of the liquid medium F can be further reduced, as shown in Fig. MP.

[0064] If the area is now also free of liquid medium and the liquid medium has been drained at least to the extent that the carrier element is in the dry area, the second lifting and holding element 12 can be lowered (opposite the direction of the arrow 13) in such a way that the substrates are again arranged in the carrier element T completely, as in the initial position, but now completely dry and without residues.

[0065] Container B can now be released by removing the cover element (not shown in detail). The carrier element T and the substrate S can now be removed from the container.

[0066] Second embodiment (Fig. 2 AT)

[0067] The lifting and holding device 110 in the second exemplary embodiment consists of two lifting and holding elements 111, 112, each coupled to a lifting arm 114, 115. This lifting and holding device 110 is suitable for carrier elements T, so-called standard carriers (a simplified representation provides for the carrier element T not being shown in Fig. 2 AB). The respective substrates S are arranged sequentially in the carrier element T and have several contact points and surfaces. The contact points and surfaces are created by receiving the substrates S in the respective comb-like recesses, which are arranged in defined regions within the carrier element T. This means that the respective substrate S rests against the carrier element T at several points and / or surfaces and therefore cannot be wetted or can only be insufficiently wetted by the liquid medium, or that liquid medium remains at precisely these points during a drying process.As a rule, the substrates S are slightly tilted relative to their vertical position.

[0068] The support element T stands within the basin B on a non-stationary stand element 117 with the lifting arm 120 connected to it, compared to the first embodiment. The basin B is completely filled with liquid medium F. The two lifting and holding elements 111, 112 are movable independently of one another in and against the direction of an arrow 113, at least indirectly, by the lifters 114, 115.

[0069] The first lifting and holding element 111 consists of two fixing elements 111a, 111b, which are designed as lifters and receivers of the substrates, as well as the lifting arm 114. The fixing elements 111a, 111b engage on the side of the substrates S facing the base G outside the respective vertical axis of symmetry 116 of the substrates S and each have a line guide 111c. This means that the substrate S can rest or lie on the first lifting and holding element 111 with its front side over a defined arc. The second lever element 112, which has the further lifter 115, is also initially engaged externally. The second lifting and holding element 112 can also rest on the respective substrates from the bottom G of the basin, but in contrast to the first lifting and holding element 111 with a point-shaped receptacle which engages the front side of the respective substrate S in the center of the axis (extension of the axis of symmetry 116).

[0070] The first lifting and holding element 111 is designed such that in an initial position it is not in engagement with the carrier element T and the substrates S (Fig. 2 CD). This also applies to the second lifting and holding element 112. To begin the processing process, for example a drying process, the first lifting and holding element 111 lifts the substrates S within the carrier element T in the direction of arrow 118. As a result, the line guide 111c engages the substrates S at their end faces and moves them outward from the carrier element T. By engaging, the substrates S align themselves vertically by moving from their tilted position (Fig. 2 CD) into the now vertical position (Fig. 2F) and thus moving in the direction of arrow 119 (Fig. 2 F) and being held by the line guide 111c of the lifting and holding element 111. In a further step (Fig.2G-H), the level of the liquid medium F is maintained within the container B and not lowered as in the first embodiment. This means that the substrates S must be lifted outside the basin for a drying process.

[0071] In the first step, the first lifting and holding device 111, and thus the engagement of the substrates in the area of ​​the fixing elements 111a, 111b, ensures that the respective substrate S is lifted out of the liquid medium, as shown in Fig. 2G. At this point, the drying process can already begin outside the liquid medium. This takes place at all points where there is no contact with the carrier element T.

[0072] So that the substrates S can now be lifted further out of the liquid medium F, the movement of the lifting arm 120, which is coupled to the non-stationary stand element 117, ensures that both the remaining lifting and holding device 111, 112 and the support element T are lifted above and out of the container B, which is still completely filled. Complete lifting is not technically feasible, so that lifting up to the line 111c is sufficient and expedient. However, in the area of ​​the line 111c of the first lifting and holding element 111, there is still contact, so that if the substrates are lifted further out beyond the fill level of the container B beyond this point, no drying can be expected.

[0073] In order to enable drying here as well, the second lifting and holding element 112 is now moved with its lever arm 115 in the direction of arrow 13 (Fig. 2M-P) until a point-like receptacle is reached on the end face of the respective substrate S. The lifting and holding element 112 acts as a support element and preferably only rests in a point-like manner on the end face, i.e. on the circumference of the substrate S. The second lifting and holding element 112 guides the substrates S until they at least partially come into contact with the carrier element T. The substrates then tilt in the direction of arrow 119 and thus again into an inclined position so that they can also come into contact with the carrier element T. The first lifting and holding element 111 moves back to its starting position. This takes place while still within the liquid medium. The previously contacted end face of the substrates S is thus free again.In order to allow this area to dry, the non-stationary stand element 117 (together with the remaining lifting and holding elements 111, 112) is guided further in the direction of arrow 113 until the position reached in Fig. 2Q and 2R is reached, namely the substrates S, which are arranged in the carrier element T and are held in position by the second lifting and holding device 112, are above the container and thus out of the liquid medium.

[0074] If the area is now also free of liquid medium, so that the carrier element is in the dry area, the second lifting and holding element 112 can be lowered (opposite the direction of arrow 13), such that the substrates are again arranged in the carrier element T, as in the initial position, but now completely dry and without residue. In order to enable the carrier element T to be removed, in the version in which the cover element can be opened transversely, it must be returned to the container. First, the liquid medium is drained away, and with the draining, the stand element 117 for the carrier element T lowers back towards the bottom of the container B. The container B can now be released by removing the cover element (not shown in detail). The carrier element T and the substrates S can now be removed from the container.

[0075] Third embodiment (Fig. 3 AL)

[0076] The lifting and holding device 210 in the third exemplary embodiment consists of two lifting and holding elements 222, 212, each coupled to a lifting arm 223, 215. This lifting and holding device 210 is suitable for carrier elements T, so-called low-mass carriers (a simplified representation provides for the carrier element T not being shown in Fig. 3 AB). The respective substrates S are arranged sequentially in the carrier element T and have multiple contact points and surfaces. The contact points and surfaces are created by receiving the substrates S in the respective comb-like recesses arranged in defined regions within the carrier element T. This means that the respective substrate S rests against the carrier element T at multiple points and / or surfaces and therefore cannot be wetted or can only be insufficiently wetted by the liquid medium, or that liquid medium remains at precisely these points during a drying process.As a rule, the substrates S are slightly tilted relative to their vertical position.

[0077] The support element stands within the basin B on a stationary base element 217. The basin B is completely filled with liquid medium F. The two lifting and holding elements 222, 212 are movable independently of one another in and against the direction of an arrow 213 or an arrow 224, at least indirectly, by the lifting arms 214, 215.

[0078] The first lifting and holding element 222 consists of two fixing elements 222a, 222b and a lifting arm 223. In this exemplary embodiment, the fixing elements 222a, 222b are arranged above the support element T arranged in the basin B and at a distance from it. In this exemplary embodiment, it only performs the holding or fixing function. When the container B is loaded by the support element T, these elements are positioned such that they are widely spaced apart, so that positioning within the container B does not cause interference. The fixing elements 222a, 222b are preferably movable in and against the direction of arrow 224 (Fig. 3 A). The second lifting and holding element 212 can rest on or against the respective substrates from the base G of the basin as a support element. It preferably has a point-shaped receptacle which engages the front side of the respective substrate S in the center of the axis (extension of the axis of symmetry 216).

[0079] The first lifting and holding element 222 is designed such that, in an initial position, it is not in engagement with the carrier element T and the substrates S (Fig. 3 CD). This also applies to the second lifting and holding element 212.

[0080] To begin the processing process, for example, a drying process, the level of the liquid medium within the container must be lowered. As shown in Fig. 3 E and F, this level must be lowered until the first lever element 222 is free of liquid medium.

[0081] The first lifting and holding element 222 is now positioned via the lifting arm 223 such that it can at least almost hold the respective substrates at their periphery. For this purpose, the fixing elements 222a and holders 222b are moved in the direction of arrow 224. Simultaneously with the further lowering of the level of the liquid medium within the container B, the second lifting and holding element 212 is now moved with its lever arm 215 in the direction of arrow 213 (Fig. 3 GH) until a point-like receptacle is reached on the front side of the respective substrate S. The second lifting and holding element 212 guides the substrates S until they come into contact with and against the already positioned first lifting and holding element 222 and its fixing elements 222a, 222b. The first lifting and holding element 222 thus already grips the substrate in the dry area.There is no longer any further system on the flat side, so that complete drying of the respective substrates S can be achieved by further lowering the level of the liquid medium.

[0082] Once the level of the liquid medium within the container B has dropped to such an extent that all contact surfaces of the support element T are dry, the second lifting and holding element 212 can be lowered again. The substrates S are again completely received by the support element T (Fig. 3 IL).

[0083] Container B can now be released by removing the cover element (not shown in detail). Before doing so, the fixing elements 222a and 222b of the lifting and holding element 222 are moved back to their starting position, so that there is no obstacle preventing the carrier element T from being removed from container B. The carrier element T can now be removed from the container along with the substrate S.

[0084] Fourth embodiment (Fig. 4 AG)

[0085] The lifting and holding device 310 in the fourth embodiment consists of two lifting and holding elements 322, 312, each coupled to a lifting arm 323, 315. This lifting and holding device 310 is suitable for carrier elements T, so-called low-mass carriers. The respective substrates S are arranged sequentially in the carrier element T and have multiple contact points and surfaces. The contact points and surfaces are created by receiving the substrates S in the respective comb-like recesses arranged in defined areas within the carrier element T. This means that the respective substrate S rests against the carrier element T at multiple points and / or surfaces and therefore cannot be wetted or can only be insufficiently wetted by the liquid medium, or that liquid medium remains at precisely these points during a drying process. As a rule, the substrates S are slightly tilted relative to their vertical position.

[0086] The support element T stands within the basin B on a stand element 317, which is not stationary compared to the third embodiment, with the lifting arm 323 connected to it. The basin B is completely filled with liquid medium F. The two lifting and holding elements 322, 312 are movable independently of one another in and against the direction of an arrow 324 or arrow 313, at least indirectly by the lifters 323, 315.

[0087] The first lifting and holding element 322 consists of two fixing elements 322a, 322b and the lifting arm 323, wherein the fixing elements 322a, 322b are arranged above the support element T arranged in the basin B. In contrast to the first and second exemplary embodiments, these fixing elements do not perform a lifting function, but exclusively a holding and thus fixing function. When the container B is loaded by the support element T, they are positioned such that they are widely spaced apart, so that positioning within the container B does not cause interference. The fixing elements 322a, 322b are preferably movable in and against the direction of arrow 324 (Fig. 4 A). The second lifting and holding element 312 can rest on or against the respective substrates from the base G of the basin. It has a supporting function and preferably engages the respective substrate on the front side and thus on the circumference of the substrate.It has a point-shaped receptacle that engages the front side of the respective substrate S in the center of the axis (extension of the axis of symmetry 316). Furthermore, a movable and thus non-stationary stand element 317 is provided, which can be moved in the direction of arrow 313 via a lever arm 320.

[0088] The first lifting and holding element 322 is designed such that, in an initial position, it is not in engagement with the carrier element T and the substrates S (Fig. 4 AB). This also applies to the second lifting and holding element 312.

[0089] To begin the processing process, for example a drying process, in this embodiment the level of the liquid medium is not initially lowered, but rather the carrier element T with the holding elements 322, 312 is raised above the level of the liquid medium in the container B by moving the stand element 317 via the lever arm 320 in the direction of arrow 313 (Fig. 4 CF). As soon as the first lifting and holding element 322 is above the level of the liquid medium, i.e. in the dry area, the lifters 322a, 322b move it in the direction of arrow 324 towards the respective substrates S. To reduce the support of the substrate S within the carrier element T during the drying process, the second lifting and holding device 312 is also activated by actuating the lifting arm 315. This is designed such that it rests pointwise on the outer circumference of the substrate S.When lifted in the direction of arrow 313, the respective substrate is pushed into the respective fixing elements 322a, 322b, whose areas are now dry. The carrier element T is further lifted out of the container via the stand element 317 until the substrate is completely outside the liquid medium and thus dry.

[0090] Either the support element T can now be removed after the first lifting and holding device 322 has returned to the starting position or the liquid medium is drained from the basin B, the support element T is moved back to the bottom of the basin with the first and second lifting and holding devices 322, 312 so that the cover element can be opened by a transverse displacement (Fig. 4 G).

[0091] Fifth embodiment (Fig. 5 AE)

[0092] The embodiment of a lifting and holding device 410 shown in Fig. 5 AB can be implemented in two different variants: a first variant in which the carrier element T is lifted out of the basin B for the drying process, and a further variant in which the level of the liquid medium is lowered depending on the process. This is a combination of the previous embodiments. The fifth embodiment shown is suitable for processing, for example, drying, different sizes of substrates, for example, 6-inch or 8-inch sizes, with a single device.

[0093] The lifting and holding device 410 in the fifth embodiment has the identical functions as already shown in embodiments 1 and 2, but with the difference that the respective lifting and holding elements have two different fixing elements, each used for the corresponding sizes. These fixing elements have the function of receiving and lifting the substrates such that the substrates are held in the respective carrier element by these fixing elements alone. This means that there is a lifting and a holding device for the first substrate size, as well as a further lifting and holding device adapted to the size. Advantageously, the first lifting and holding device for the smaller substrate size takes over functions for use with the larger substrate size. The basic principle of the fifth embodiment is shown in Fig. 5A.The lifting and holding device 410 consists of fixing elements 411.1, 412.1, 411.2, 412.2, each coupled to a lifting arm (not shown in these drawings).

[0094] This lifting and holding device 410 is suitable for carrier elements T, so-called standard carriers (a simplified representation provides for the carrier element T not being shown in Fig. 4A). In the carrier element T, the respective substrates S are arranged sequentially and have several contact points and surfaces. The contact points and surfaces are created by receiving the substrates S in the respective comb-like recesses, which are arranged in defined areas within the carrier element T. This means that the respective substrate S rests on the carrier element T at several points and / or surfaces and therefore cannot be wetted or can only be insufficiently wetted by the liquid medium, or that liquid medium remains at precisely these points during a drying process. As a rule, the substrates S are slightly tilted relative to their vertical position.

[0095] Fig. 5 BC shows the treatment of substrates S held in a carrier element T1. The substrates S have a first substrate size that is smaller than the substrate size shown in Fig. 5 DE.

[0096] Variant 1

[0097] The support element T1 stands within the basin B on a stationary base element 417.1. The basin B is completely filled with liquid medium F. The two lifting and holding elements 411.1, 412.1 are movable independently of each other in and against the direction of an arrow 413.

[0098] The first lifting and holding element 411.1, suitable for substrates with a first defined substrate size, consists of two fixing elements 411.1a, 411.1b, wherein the fixing elements 411.1a, 411.1b engage on the side of the substrates S facing the base G outside the respective vertical symmetry axis 416.1 of the substrates S. These serve, on the one hand, to hold the substrates in the area of ​​their outer circumference and, on the other hand, to lift them in the direction of the arrow 413. For the holding, the fixing elements 411.1a, 411.1b each have a line guide 411.1c. This means that the substrate S arranged in the carrier element T1 can rest or abut on the first lifting and holding element 411.1 with its end face over a defined arc. The second lever element 412.1 is also initially engaged externally. The second lifting and holding element 412.1 can also be lifted or lowered from the bottom G of the basin onto the respective substrates.but in contrast to the first lifting and holding element 411.1 with a point-shaped receptacle which engages the front side of the respective substrate S in the center of the axis (extension of the axis of symmetry 416.1) (Fig. 5 BC).

[0099] The first lifting and holding element 411.1 is designed such that, in an initial position, it is not in engagement with the carrier element T and the substrates S. This also applies to the second lifting and holding element 412.1.

[0100] For this variant, the stand element 417.1 is selected such that it is identical to the first lifting and holding element 411.2, which is suitable for the second size and is larger than the first size. This means that the stand element 417.1 is formed by the first lifting and holding element 411.2 for the second substrate size. It can be provided that this lifting and holding element 411.2, and thus the stand element 417.1, remains stationary for the work process for this first substrate size (comparable to the first embodiment) or is movable in the direction of arrow 413 and the opposite direction, thus being comparable to the second embodiment. Variant 2

[0101] The lifting and holding device 410 comprises a second variant intended for processing substrates of a second size that are larger than the first size. The substrates S are arranged in a larger carrier element T.2.

[0102] The first lifting and holding element 411.2 consists of two fixing elements 411.2a, 411.2b. The fixing elements 411.2a, 411.2b engage the side of the substrates S facing the base G, outside the respective vertical axis of symmetry 416.2 of the substrates S, and each have a linear guide 411.2c. This means that the substrate S can rest on or rest against the first lifting and holding element 411.2 with its front side over a defined arc. These elements also have the function of lifting the substrates S. The second lever element 412.2 is also initially engaged externally. The second lifting and holding element 412.2 can also rest on the respective substrates from the bottom G of the basin, but in contrast to the first lifting and holding element 411.2 with a point-shaped holder which is axially central (extension of the axis of symmetry 416.2, wherein the axes of symmetry of the substrate of the first size and that of the second size are different) acts on the front side of the respective substrate S (Fig. 5 BC).

[0103] The first lifting and holding element 411.2 is designed such that, in an initial position, it is not in engagement with the carrier element T.2 and the substrates S. This also applies to the second lifting and holding element 412.2.

[0104] For this variant, the stand element 417.2 is selected such that the fixing elements 411.2a and 411.2b engage the support element T.2 from the base G, thereby lifting the substrates. Preferably, the respective stand element 417.2 is arranged next to the lifting and holding element 411.2. Alternatively, the stand elements can also be integrated, at least partially and at least on one side, into the lifting and holding elements 411.2. The lifting and holding elements 411.1 for the first size retain their external function. It is also intended to design a stand element 417.2 such that it can lift the support element T.2 out of the tank. The functions of the lifting and holding elements 411.2 and 412.2 remain unaffected.

[0105] Sixth embodiment (Fig. 6A-K)

[0106] The further embodiment relates to a further development of the first lifting and holding device 510. In contrast to the previous embodiments, this is arranged on or in the region of the carrier element T.

[0107] The lifting and holding device 510 in the sixth embodiment consists of two lifting and holding elements 511, 512, wherein the second lifting and holding element 512 is coupled to a lifting arm 515. This lifting and holding device 510 is suitable for carrier elements T, so-called low-mass carriers (a simplified illustration provides for the carrier element T not being shown in Fig. 5 BC). The respective substrates S are arranged sequentially in the carrier element T and have multiple contact points and surfaces. The contact points and surfaces are created by receiving the substrates S in the respective comb-like recesses, which are arranged in defined regions within the carrier element T.This means that the respective substrate S rests on the carrier element T at several points and / or surfaces and therefore cannot be wetted or can only be insufficiently wetted by the liquid medium, or that liquid medium remains at precisely these points during a drying process. As a rule, the substrates S are slightly tilted relative to their vertical position. The carrier element stands within the basin B on a stationary stand element 517. The variant illustrated in Fig. 6B-C shows the alternative to a stationary design. In order for the stand element 517 to be able to move in and against the direction of the arrow, an additional lifting arm 520 is provided (comparable to the second exemplary embodiment). This design is used when the carrier element T is to be lifted out of the basin for the drying process.In addition, this embodiment of the movable stand element 517 is coupled so that the second lifting and holding device 512 can also be lifted simultaneously.

[0108] The following description is limited to the embodiment with a stationary support element. However, the invention is not limited to this. Rather, the invention also encompasses a non-stationary support element so that the support element T can be lifted and preferably removed from the pool.

[0109] The basin B is completely filled with liquid medium F. The two lifting and holding elements 511, 512 are independent of each other. The first lifting and holding element 511 is fixedly connected to the support element T as a fixing element 511a, 511b. Its function is to partially encompass and fix the respective substrate over its outer circumference. It is designed such that, in the initial position, it is externally engaged with the respective substrate S.

[0110] The second lever element 512, which is coupled to a holding arm 515, is also initially engaged externally. The second lifting and holding element 512 can also rest on or against the respective substrates from the bottom G of the tank. However, unlike the first lifting and holding element 511, it has a point-shaped receptacle that engages the front side of the respective substrate S in the center of the axis (extension of the axis of symmetry 516) (Fig. 6 BE).

[0111] In order to start the processing process, for example a drying process, the level of the liquid medium F within the container B is lowered until the first lifting and holding element 511 or its fixing elements 511a, 511b are dry and thus not wetted with the liquid medium.

[0112] In order to also enable drying in the areas where the respective substrate previously rested on the carrier element T, the second lifting and holding element 512 is now moved with its lever arm 515 in the direction of arrow 513 (Fig. 6 FG) until a point-like reception is achieved on the front side of the respective substrate S. The second lifting and holding element 12 acts as a support element and guides the substrates S until they at least rest on the fixing elements 511a, 511b, which are already dry, and are picked up by them. In this state, the respective substrate is held in the dry area by the fixing elements 511a, 511b and, while still wet, by the second lifting and holding element 512, which engages the outer circumference of the respective substrate S.

[0113] The level of the liquid medium continues to decrease until the second lifting and holding element 512 is also in the dry area (Fig. 6 HI).

[0114] At this stage of the process, the entire substrate is now dry and, after the level of the liquid medium has been further lowered, can be transferred back into the carrier element T by the second lifting and holding device 512 moving in the opposite direction of the arrow 513. The respective substrate S is released from the fixing device 511a, 511b and, supported by the second lifting and holding device 512, is transferred back into the carrier element T. The now dry substrates S and the dry carrier element T can be removed from the dry basin B.

[0115] With the present invention and the associated lifting and holding device as well as the method, a significantly higher process reliability is achieved while at the same time cost savings are achieved.

Claims

A N S P R Ü C H E 1. Lifting and holding device for treating at least one substrate, in particular wafers, arranged in a support element, wherein at least one lifting and holding device can be used in a basin filled with a liquid medium and can be moved into, in, and out of the basin via at least one manipulator unit, characterized in that the lifting and holding device (10; 110; 210; 310; 410; 510) comprises a first lifting and holding element (11; 111; 211; 311; 411; 511) and a second lifting and holding element (12; 112; 212; 312; 412; 512), wherein a. the first lifting and holding element (11; 111; 211; 311; 411; 511) comprises at least one fixing element (11a, 11b; purple, 111b; 211a, 211b; 311a, 311b; 411a, 411b; 511a, 511b) which can be functionally joined with the substrate S at the end face of the substrate S and has the function of fixing the substrate S and optionally also the function of lifting, b.the second lifting and holding element (12; 112; 212; 312; 412;. 512) is a support element that can functionally engage with the substrate S at the end face of the substrate S at specific points, and c. a support element (17; 117; 217; 317; 417; 517) is provided for receiving the support element (T; TI; T2), which is optionally arranged in a fixed position or movable within the basin B.

2. Lifting and holding device according to claim 1, characterized in that the first lifting and holding element (11; 111; 211; 311; 411) is arranged within the basin and is movable within the basin via at least one lifting arm (14; 114; 214; 314) and is designed as a movable fixing device. Lifting and holding device according to claim 1, characterized in that the first lifting and holding element (511) is arranged on the support element (T) and is designed as a fixing device. Lifting and holding device according to any one of claims 1 to 3, characterized in that the first lifting and holding element (11; 111; 211; 411) has a guide line (11c; 111c; 211c; 411c) which is also comb-like and suitable for partially enclosing the substrate at its end face outer circumference of the substrate S. Lifting and holding device according to any one of the preceding claims, characterized in that the two first lifting and holding elements (411.1, 411.2) and two second lifting and holding elements (412.1, 412.2) are provided within the basin B. Lifting and holding device according to claim 5, characterized in that one of the first lifting and holding elements (411.1) is designed as a support element (417.2) when using the other lifting and holding elements (411.2).Lifting and holding device according to one of the preceding claims, characterized in that the first lifting and holding element (11; 111; 211; 311; 411; 511) is arranged symmetrically to the axis of symmetry (16; 116; 216; 316; 416; 516) of the substrate S to be received, at an equal distance to both sides of the axis of symmetry. Lifting and holding device according to one of the preceding claims, characterized in that the second lifting and holding element... The retaining element (12; 112; 212; 312; 412; 512) is arranged in line with the axis of symmetry (16; 116; 216; 316; 416; 516) of the substrate to be supported.

9. A method for treating substrates, in particular wafers, arranged in at least one support element in a basin filled with a liquid medium, wherein the support element is arranged on a stand element within the basin, characterized by the following process steps: a. Lifting the substrates S located in basin B and arranged in the support element (T; T1; T2) by a first lifting and holding device (11; 111; 211; 311; 411; 511) until there is no contact with the support element (T; T1; T2); b. either partially draining the liquid medium F from the container B or lifting the support element (T; T1; T2) by moving the stand element (17; 117; 217; 317; 417; 517) together with a second lifting and holding device (12; 112; 212; 312; 412; 512), until the first lifting and holding device (11; 111; 211; 311; 411; 511) is still in the liquid medium F; c. Further lifting of the substrates S by the second lifting and holding device (12; 112; 212; 312; 412; 512), such that the substrates S are at least partially outside the liquid medium F and are again held by the support element (T; T1; T2) or another lifting and holding device in the dry area, such that the substrates S are brought out of engagement with the first lifting and holding device (11; 111; 211; 311; 411; 511); d. Optional draining and emptying of the container B; e. External engagement of the second lifting and holding device (12; 112; 212; 312; 412; 512) until the substrates S are again arranged in the support element (T, T1; T.2) and subsequent external engagement of the second lifting and holding device (12; 112; 212; 312; 412; 512).

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