Module support for electrical / electronic components

Description

The invention provides a module holder for electrical / electronic components according to the features of the main claim. A similar module carrier is already known from DE 296 22 806 U1, which provides a conductor structure in the form of a pressed mesh, containing a plurality of electrically conductive metals embedded in an insulating covering material. The conductor structure is pressed out of a metal sheet according to the known method and then coated with plastic in an injection molding process. After pressing, the individual conductors can be connected by thin bridges, which can be separated before or after coating with plastic through openings provided for this purpose in the covering. These module carriers are used, for example, to connect large and heavy electrical components or electrical components operating at high currents to each other or to other electrical components. Contact surfaces are provided on the module carrier for this purpose - these are formed by the contact surfaces of the electrical conductors accessible through openings in the insulating covering.The contacts of electrical or electronic components are soldered, welded or snapped onto the contact surfaces. When the connected components are secured by soldering, the contact surfaces become very hot. The disadvantage of the known design of the pressed mesh module holder is that the heat that spreads to the part of the metal conductor surrounded by the insulating coating in the immediate vicinity of the contact surfaces can damage the insulating coating of the module holder. The module holder according to the invention aims to eliminate the problems known from the state of the art, i.e. to prevent the heat generated during soldering of the contact surface from spreading directly to the parts of the conductor structure coated with insulating material. Due to the special design of the electrical conductor at the openings of the module holder, the heat can only spread through bridges with low heat transfer. The bridges limit the amount of heat spreading to the part of the pressed mesh coated with insulating material. Thanks to this, we can prevent the strong heating of the contact surface of the metal conductor from damaging the module holder. At the same time, we also achieve that when a component is soldered to one of the contact surfaces of the conductor grid, the heat required for soldering does not escape from the soldering site. Thanks to this, we can process the individual soldering sites individually with smaller soldering devices or smaller soldering heads, which results in much better soldering quality.The contacts of the electronic components can be soldered to the contact surfaces in one step. The structural design of the contact surfaces of the module holder can be produced easily and inexpensively, without any additional work. Based on the features set forth in the subclaims, preferred embodiments of the invention and possibilities for further development of the invention are discussed. It is advantageous to design the contact surfaces of the conductive structure to form a solder pad with a central opening, which is designed to receive the electrical or electronic components. Thanks to this modification, the components can be placed on the module holder in a manner similar to the manufacture of printed circuit boards, where the contact of the given component is inserted into the opening of the solder pad and then soldered there. It is also very advantageous if one or more bridges connecting the contact surface to the conductor structure are bent out of the plane of the conductor structure, due to which the contact surface is located on a plane parallel to the plane of the conductor structure inside or outside the opening. This significantly facilitates the soldering of the contacts of the components. Thanks to the bent bridges, the contact surface can be completely inserted into the soldering device during individual soldering with a soldering device, which improves the quality of the soldering. It is also advantageous to bend one or more of the bridges by deep drawing. This not only ensures that the contact surface is brought into a specific position by bending, but also that one or more of the bridges is thinned due to the deep drawing, thus further reducing the cross-section suitable for heat conduction, which further deteriorates the heat dissipation capacity of the bridge. It is also very advantageous if the part of the metal conductor located along the inner wall of the opening is at least partially devoid of insulating material. This ensures that the heat flowing through the bridges is not directly transferred to the parts of the module holder coated with insulating material. According to a particularly simple embodiment of the invention, the part located inside the opening is circular, and the contact surface is located concentrically with the part located along the inner wall of the opening, and one or more bridges connect the circular part to the contact surface in a radial direction. The invention will be described in more detail below with reference to the embodiments shown by way of example in the accompanying drawings. Figure 1 shows a cross-section of a module holder according to the invention near a contact surface during soldering of a component, Figures 2a and 2b show top and side views of a conductor of the conductor structure with a contact surface and bridges, Figure 3 shows the module holder according to the invention together with the mounted components, and Figure 4 shows further embodiments of the contact surface of the module holder. Figure 1 shows a module holder 1, which comprises a conductor structure consisting of a pressed grid with a substantially flat surface, comprising a plurality of metal conductors 2. The conductor structure is produced by pressing from a thin metal sheet, for example 1.2 mm thick. The metal conductors 2 are coated with thermoplastic plastic, thus forming an insulating coating 3 of approximately uniform thickness on them, while leaving openings in the plastic coating at the contact pieces 9 of the metal conductors 2. The module holder 1 has a shape similar to a sheet, which has an upper side 4 and a lower side 5. In Figure 1 HU 226 629 Β1 shows one of the metal conductors 2. One of the contact surfaces 10 of the metal conductor 2 is accessible through an opening 6 extending from the upper side 4 to the lower side 5 of the insulating cover 3, where the contact surface is located entirely within the opening 6 and is connected by thin bridges 11 to the part 12 of the metal conductor 2 located along the inner wall of the opening 6. As can be seen in Fig. 2a, in the embodiment shown here, the part 12 located along the inner wall of the opening 6 is circular, with an outer diameter D1 of, for example, 9.4 mm and an inner diameter D2 of 7.6 mm. The contact surface 10 is formed by a solder pad located concentrically to the part 12, with an outer diameter D3 of, for example, 2.9 mm. The solder pad is connected to the circular portion 12 by four radially arranged bridges 11. The bridges 11 are further bent by deep drawing, as shown in Figures 1 and 2b, as a result of which the contact surface 10 is located within the circular opening 6 on the lower side of the module holder 5, parallel to the plane of the module holder. However, the bridges 11 can also be bent to such an extent that the contact surface 10 extends beyond the lower side of the module holder 5 and is outside the opening 6. If the soldering of the contact surfaces 10 and the contacts 8 of the electrical and / or electronic components 7 is solved individually, the contact is first inserted into a hole 13 in the contact surface 10, and then a soldering pot 20 filled with solder 21 is inserted into the opening 6. By bending the bridges 11 of the metal conductor 2, the contact surface 10 can be completely immersed in the heated and molten solder 21, which results in a better quality soldering between the contact 8 and the contact surface 10. If the contact surface 10 protrudes from the From the lower side of the module holder 5, the contact surfaces 10 can also be soldered using wave soldering. During soldering, part of the heat transmitted to the contact surface 10 is dissipated by the bridges 11. Since these The cross-section of the heat conductor of the II bridges is small, the bridges 11 actually limit the flow of heat towards the part 12 of the metal conductor 2. A pressed mesh of thickness d ensures the proper electrical conduction of the bridges 11 and the limitation of their heat dissipation, where the cross-section of the heat conductor Q of the bridge 11 is d2 <Q<4d2tartományba esik. Ezek az értékek csak irányadó jellegűek. Általában véve a 11 áthidalások hővezető keresztmetszetét a 2 fémvezető többi részéhez kapcsolódó, a 6 nyílásnál található 12 rész hővezető keresztmetszeténél mindig kisebbre kell méretezni. így tudjuk csak csökkenteni a 2 fémvezető szigetelőanyaggal bevont része felé áramló hő mennyiségét. A 9 érintkeződarab ilyenkor ugyanis „hőcsapdaként” működik. A 12 részt az 1. és 3. ábrán látható módon csak részlegesen borítja szigetelőanyag. A kör alakú 12 rész belső részéről elhagytuk a borításra használt szigetelőanyagot.Thanks to this modification, the heat coming from the bridges 11 does not come into direct contact with the plastic cover 3. We can also imagine embodiments in which more or fewer bridges 11 are used. In Figure 3, for example, we can see an embodiment of a module holder in which the contact surfaces 19 are connected to the semicircular part 12 located along the opening 6 by only three bridges 11. In addition, further embodiments, for example with only two or perhaps more than four bridges 11, are also possible. In Figure 4, some of these possible embodiments are also shown. The parts of the metal conductor 2 that are continuously connected to the part 12 are not shown in the figure for the sake of simplicity. The bridges 11, the contact surface 10 and the part 12 can also be produced as separate pieces, which are attached to the metal conductors 2 through the opening 6.

Claims

PATENT CLAIMS 1. Module holder (1) for electrical / electronic components (7), comprising a plurality of metal conductors (2) formed from a pressed mesh and an insulating material covering (3) at least partially covering the metal conductors (2), wherein the metal conductor (2) has one or more contact surfaces (10) for connecting a contact (8) of an electrical / electronic component (7) in an opening (6) of the insulating material covering (3), wherein the one or more contact surfaces (10) are electrically connected only by one or more bridges (11) located in the opening (6) to the part (12) of the metal conductor (2) located along the inner wall of the opening (6), wherein the one or more bridges (11) have a thermally conductive cross-section smaller than the cross-section (12) of the metal conductor (2) located along the inner wall of the opening (6), characterized in that the one or more bridges (11) is bent out of the plane of the guide structure,as a result of which the contact surface (10) connected to them is located in a plane parallel to the guide structure in the opening (6) or outside it., 2. Device according to claim 1, characterized in that the contact surface (10) forms a solder pad having a central hole (13) adapted to receive a contact of an electrical or electronic component.

3. Device according to claim 1, characterized in that the bridges (11) are bent by deep drawing.

4. The device according to claim 1, characterized in that the insulating material is at least partially absent from the part (12) of the metal conductor (2) located along the inner wall of the opening (6).

5. The device according to any one of claims 1-5, characterized in that the portion (12) located along the inner wall of the opening (6) is circular, and the contact surface (10) is located concentrically with respect to the portion (12) located along the inner wall of the opening, and the one or more bridges (11) connect the circular portion to the contact surface (10) in a radial direction.

6. Device according to claim 3, characterized in that the heat-conducting cross-section of one or more bridges (11) is reduced due to the deep drawing.