Semiconductor Tool Configuration

Abstract

Various examples of semiconductor processing tool configurations are provided. In one example, the semiconductor processing tool includes a plurality of multi-station modules, each having a plurality of processing stations. At least some of the processing stations are organized in a diamond shaped configuration. A vacuum transfer module is coupled to each of the multi-station modules. The vacuum transfer module has one or more vacuum transfer robots for transferring substrates to and from at least one of the plurality of processing stations. At least one additional processing station is disposed within the vacuum transfer module. Other systems and apparatus are disclosed.

Description

[Technical field]

[0001] Claiming priority This application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 181,036, filed April 28, 2021, which is incorporated by reference in its entirety.

[0002] The disclosed subject matter generally relates to the field of substrate processing tools used in the semiconductor and related industries (e.g., flat panel display and solar cell production facilities). More particularly, in various embodiments, the disclosed subject matter relates to configurations of substrate processing tools used to reduce the footprint of the tool while maintaining multiple processing stations within the tool. [Background technology]

[0003] Semiconductor equipment as capital assets is evaluated on many performance metrics. Two metrics are productivity and footprint. Productivity can be related to substrate thru-out and yield. Footprint relates to the area that a manufacturing tool occupies within the manufacturing environment (fab).

[0004] The background description provided herein is intended to provide a general overview of the state of the disclosed subject matter. To the extent described in this Background section, the inventors' work cited herein, as well as aspects of the present description that may not otherwise be admitted as prior art at the time of filing, are not admitted, expressly or impliedly, as prior art to the present disclosure. Thus, the information provided in this section is provided to present the state of the subject matter disclosed below to those of skill in the art, and should not be considered an admission of prior art. Thus, the information provided in this section is provided to present the state of the subject matter disclosed below to those of skill in the art, and should not be considered an admission of prior art. Summary of the Invention

[0005] In various embodiments, the semiconductor processing tool includes a plurality of multi-station modules each having a plurality of processing stations, at least some of which are organized in a diamond-shaped configuration. A vacuum transfer module is coupled to each of the multi-station modules. The vacuum transfer module has one or more vacuum transfer robots for transferring substrates to and from at least one of the plurality of processing stations. The semiconductor processing tool also includes at least one additional processing station disposed within the vacuum transfer module.

[0006] In various embodiments, the semiconductor processing tool includes a plurality of multi-station modules each having a plurality of processing stations, at least some of which are organized in a diamond-shaped configuration, a vacuum transfer module coupled to each of the multi-station modules, the vacuum transfer module having one or more vacuum transfer robots for transferring substrates to and from at least one of the plurality of processing stations, and at least one additional processing station disposed within the vacuum transfer module.

[0007] In various embodiments, the semiconductor processing tool includes a plurality of multi-station modules. A hybrid configuration of the plurality of processing stations with at least some of the processing stations organized in a diamond-shaped configuration and the remaining processing stations organized in a square-shaped configuration. A vacuum transfer module is coupled to each of the multi-station modules. The vacuum transfer module has one or more vacuum transfer robots for transferring substrates to and from at least one of the plurality of processing stations. The semiconductor processing tool also includes at least one additional processing station disposed within the vacuum transfer module. [Brief description of the drawings]

[0008] [Figure 1]FIG. 1 is a cutaway plan view of a prior art multi-station semiconductor processing tool having a square configuration of processing stations.

[0009] [Figure 2A] 1 is a cutaway plan view of an exemplary embodiment of a multi-station semiconductor processing tool having a diamond shaped configuration of processing stations within each of five modules in accordance with an embodiment of the disclosed subject matter.

[0010] [Figure 2B] 1 is a cutaway plan view of an exemplary embodiment of a multi-station semiconductor processing tool having a diamond shaped configuration of processing stations in each of four modules in accordance with an embodiment of the disclosed subject matter.

[0011] [Figure 2C] 1A-1C illustrate various example configurations of processing stations within a processing module according to various embodiments of the disclosed subject matter. [Figure 2D] 1A-1C illustrate various example configurations of processing stations within a processing module according to various embodiments of the disclosed subject matter. [Figure 2E] 1A-1C illustrate various example configurations of processing stations within a processing module according to various embodiments of the disclosed subject matter. [Figure 2F] 1A-1C illustrate various example configurations of processing stations within a processing module according to various embodiments of the disclosed subject matter. [Figure 2G] 1A-1C illustrate various example configurations of processing stations within a processing module according to various embodiments of the disclosed subject matter. [Figure 2H] 1A-1C illustrate various example configurations of processing stations within a processing module according to various embodiments of the disclosed subject matter.

[0012] [Figure 3A]FIG. 1 is a cutaway plan view of an exemplary embodiment of a multi-station semiconductor processing tool having a square shaped configuration of processing stations including an additional processing station disposed within a vacuum transport module in accordance with an embodiment of the disclosed subject matter.

[0013] [Figure 3B] FIG. 1 is a cutaway plan view of an exemplary embodiment of a multi-station semiconductor processing tool having a diamond shaped configuration of processing stations including an additional processing station disposed within a vacuum transport module in accordance with an embodiment of the disclosed subject matter.

[0014] [Figure 3C] FIG. 13 is a cutaway plan view of an exemplary embodiment of a multi-station semiconductor processing hybrid tool having both square and diamond shaped configurations of processing stations, including an additional processing station disposed within a vacuum transport module in accordance with an embodiment of the disclosed subject matter.

[0015] [Figure 4A] FIG. 1 illustrates an exemplary embodiment of a semiconductor processing tool including a two-level load lock and a transfer station in accordance with an embodiment of the disclosed subject matter.

[0016] [Figure 4B] FIG. 1 illustrates an exemplary embodiment of a semiconductor processing tool including a tandem two-level load lock and a transfer station in accordance with an embodiment of the disclosed subject matter.

[0017] [Figure 4C] 1A-1D illustrate an exemplary embodiment of a semiconductor processing tool showing substrate transport paths at different levels in accordance with various embodiments of the disclosed subject matter.

[0018] [Figure 5A] FIG. 2 shows an example of dimensions that make up a typical footprint of the semiconductor processing tool of FIG. 1.

[0019] [Figure 5B] 2A-4B are diagrams showing example dimensions that make up the footprint of some of the tool configurations contemplated according to various embodiments of the disclosed subject matter provided in specific examples. [Figure 5C] 2A-4B are diagrams showing example dimensions that make up the footprint of some of the tool configurations contemplated according to various embodiments of the disclosed subject matter provided in specific examples.

[0020] [Figure 6A] FIG. 1 illustrates an exemplary top view of an atmospheric transfer-robot that fits into a shallow equipment front-end module (EFEM) that may be used with various embodiments of the disclosed subject matter. [Figure 6B] FIG. 1 illustrates an exemplary elevation view of an atmospheric pressure transfer robot that fits into a shallow equipment front end module (EFEM) that may be used with various embodiments of the disclosed subject matter. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] The following description includes exemplary examples, devices, and instruments embodying various aspects of the disclosed subject matter. In the following description, for purposes of explanation, numerous specific details are set forth to provide an understanding of various embodiments of the subject matter of the present invention. However, it will be apparent to those skilled in the art that various embodiments of the disclosed subject matter may be practiced without these specific details. Moreover, well-known structures, materials, and techniques have not been shown in detail so as not to obscure the various embodiments shown. As used herein, the term "about" or "approximately" may refer to, for example, a value within ±10% of a given value or range of values.

[0022] Prior art multi-station semiconductor processing tools have always included processing stations that are arranged in a rectangular xy configuration relative to the proximal sidewall of the tool (when considered in a plan view from above the tool), which xy configuration is discussed in more detail below, but these configurations are limited in the amount of area reduction that can be achieved.

[0023] 1, there is shown a high level overview of a cutaway plan view of a prior art multi-station semiconductor processing tool 100. The semiconductor processing tool 100 has a rectangular shaped arrangement of processing stations 103, as described in more detail below. The semiconductor processing tool 100 also includes a processing section 115 and an equipment front end module (EFEM) 115. During operation of the semiconductor processing tool 100, the processing section 115 typically operates at below atmospheric pressure (e.g., a low vacuum level of a few Torr or less).

[0024] Within the processing section 115, the semiconductor processing tool 100 includes four four-station modules 101A, 101B, 101C, 101D. Each of the four-station modules 101A-101D includes four processing stations 103. Other numbers of processing stations are possible, but this example is included to help illustrate the significant differences between the prior art semiconductor processing tool 100 and the disclosed subject matter described herein. Each of the processing stations 103 is configured to hold a single substrate (e.g., a 300 mm semiconductor wafer) during a processing step (e.g., a chemical vapor deposition process or an atomic layer deposition process). In this particular example, the dimension along each side of each of the four-station modules 101A-101D is approximately 1.1 meters. Further dimensions of the entire semiconductor processing tool are described in more detail below.

[0025] Each pair of processing stations 103 is either parallel or perpendicular to a sidewall of the semiconductor processing tool 100. For example, the sidewall can be considered to be located between the vacuum transfer robots 105A, 105B and each one of the four-station modules 101A-101D (in which the corresponding pair of processing stations 103 is located). The configuration of processing stations 103 is therefore considered to be a rectangular shaped configuration.

[0026] Continuing to refer to FIG. 1, each of the substrates is loaded into the semiconductor processing tool 100 by an atmospheric transfer robot (ATR) 119 located in the EFEM 117. The ATR 119 loads at least a single substrate at a time from one of the multiple substrate carriers 111 onto the first transfer station 113. As shown in FIG. 1, the ATR 119 has two arms and can load up to two substrates at a time onto the first transfer station 113. Each of the substrate carriers 111 may comprise, for example, a Front Opening Unified Pod (FOUP) or other type of Standard Mechanical Interface (SMIF) substrate container known in the art. Once the ATR 119 has loaded the substrate onto the first transfer station 113, an atmospheric port (not explicitly shown) located between the EFEM 117 and the first transfer station 113 is closed. A load lock area surrounding the first transfer station 113 is pumped down to a vacuum level at or near the processing section 115.

[0027] The semiconductor processing tool 100 also includes a first vacuum transfer robot (VTR) 105A and a second VTR 105B. Each of the vacuum transfer robots 105A, 105B can be considered a substrate handling robot for moving substrates within the processing section 115. For example, the first VTR 105A can move a substrate from the first transfer station 113 to whichever of the processing stations 103 in the four-station modules 101B, 101C is closest to the EFEM 117 (the front of the tool) or the second transfer station 107. The second VTR 105B can move a substrate from the second transfer station 107 to whichever of the processing stations 103 in the four-station modules 101A, 101D is closest to the EFEM 117 (the front of the tool) (the back of the tool).

[0028] 1, the EFEM 117 also includes a significant bump-out region 109. The bump-out region 109 is added to allow a service technician access to portions of the semiconductor processing tool 100. However, the bump-out region 109 itself adds significant area to the semiconductor processing tool 100 (and thus increases the overall footprint of the tool).

[0029] 2A, an exemplary embodiment of a cutaway plan view of a multi-station semiconductor processing tool 200 is shown. The semiconductor processing tool 200 is shown as including a diamond-shaped configuration 215 of processing stations 203 in accordance with an embodiment of the disclosed subject matter. The semiconductor processing tool 200 is also shown to include a vacuum transfer module 221 housing a front vacuum transfer robot (VTR) 205A proximate to the first transfer station 213 and a back VTR 205B disposed at the back of the semiconductor processing tool 200. The semiconductor processing tool 200 is also shown to include a second transfer station 207. Those skilled in the art will appreciate that the front VTR 205A and the back VTR 205B are depicted generally as circles so as not to obscure other components of the disclosed subject matter. As shown, chamber transfer ports 223A-223E (or vacuum gates) are located between the vacuum transfer module 221 and each of the multi-station modules 201A-201E.

[0030] Although five multi-station modules 201A-201E are shown in FIG. 2A, no limitation to five modules is implied. More or fewer than five multi-station modules 201A-201E may be implemented. For example, two, three, four, six, seven, or more modules may be included in the semiconductor processing tool 200. Furthermore, more or fewer than four processing stations 203 may be included within each of the modules. For example, in certain embodiments, two, three, five, or more processing stations may be included. Furthermore, it is not necessary that all modules include the same number of processing stations. Some modules may include one or two processing stations, while other modules may include five or more processing stations. Various processing station configurations are discussed below with reference to FIGS. 2C-2H. Thus, the five multi-station modules 201A-201E, each having four processing stations 203, are shown merely as an aid to explain the disclosed subject matter.

[0031] The diamond shaped configuration 215 indicates that the processing stations 203 are positioned at an angle relative to a corresponding one of the chamber transfer ports 223A-E located in each of the multi-station modules 201A-E. Each chamber transfer port 223A-E allows substrates to be loaded into various ones of the processing stations 203 in the multi-station modules 201A-E by the front VTR 205A or the rear VTR 205B. After all substrates have been loaded into various ones of the processing stations 203 (e.g., from the first transfer station 213 or the second transfer station 207), the appropriate one of the chamber transfer ports 223A-E is closed to prevent any gases, plasma, etc. from moving from one multi-station module to another or from one multi-station module into the vacuum transfer module 221.

[0032] In an embodiment, the angle of a side of the diamond shaped configuration 215 may be, for example, about 45° with respect to the corresponding chamber transfer port 223A-223E. In other embodiments, the angle of a side of the diamond shaped configuration 215 may be, for example, about 30° to about 60° with respect to the corresponding chamber transfer port 223A-223E. In other embodiments, the angle of a side of the diamond shaped configuration 215 may be, for example, about 15° to about 75° with respect to the corresponding chamber transfer port 223A-223E. In other embodiments, the diamond shaped configuration 215 may be, for example, comprised of a diamond with angles between adjacent sides greater than and less than 90°. Upon reading and comprehending the disclosed subject matter, one of ordinary skill in the art will recognize that other geometric shapes (e.g., rhomboids) are also possible. Each of the various angles and angle ranges may be considered with respect to various processing station configurations within a processing module. Various processing station configurations are also discussed below with reference to FIGS. 2C-2H.

[0033] Each of the substrates is loaded into the semiconductor processing tool 200 by a linear atmospheric transfer robot (ATR) 617 located in the shallow EFEM 209. The linear ATR 617 is described in more detail below with reference to Figures 6A and 6B. The linear ATR 617 loads at least one substrate at a time from one of the plurality of substrate carriers 211 onto the first transfer station 213. As in the case of the semiconductor processing tool 100 of Figure 1, each of the substrate carriers 111 may comprise, for example, a Front Opening Unified Pod (FOUP) or other type of Standard Mechanical Interface (SMIF) substrate container known in the art.

[0034] The shallow EFEM 209 helps reduce the overall footprint of the semiconductor processing tool 200. Comparing FIG. 1 with, for example, FIG. 2A, it can be seen that the overhanging area 109 of FIG. 1 has been eliminated. Instead, the linear ATR 617 is placed within the shallow EFEM 209. Even with the shallow EFEM 209, a maintenance technician can still access all areas proximate to the shallow EFEM 209 for repair or maintenance. The steeper angle of the shallow EFEM 209 (opposite the substrate carrier 211) allows access to each of the substrate carriers 211 even from the front VTR 205A.

[0035] In certain embodiments, maintenance-aperture features 225 disposed between one or more of the multi-station modules 201A-201E allow access to various locations within and under adjacent ones of the modules. The maintenance-aperture features 225 may be open as shown, or may include cover plates. Although a single one of the maintenance-aperture features 225 is shown disposed between each of the multi-station modules 201A, 201B and the multi-station modules 201C, 201D, more or fewer maintenance-aperture features 225 may be disposed at different locations within a given processing tool. Upon reading and understanding the disclosed subject matter, one of ordinary skill in the art will recognize where such maintenance-aperture features 225 may be disposed (e.g., in the other embodiments shown in FIGS. 2B-4B).

[0036] 2A, one of ordinary skill in the art will recognize that based on the diamond-shaped configuration 215 of the processing stations 203, adjacent ones of the multi-station modules 201A-201E may be placed closer together than the four-station modules 101A-101D of FIG. 1. That is, the diamond-shaped configuration 215 allows some of the modules to have angled outer surfaces 227. The angled outer surfaces 227 allow for increased packing density of the modules - the multi-station modules 201A-201E may be placed together in a smaller footprint while still including the same number of processing stations 203 within each module.

[0037] 2B, an exemplary embodiment of a cutaway plan view of a multi-station semiconductor processing tool 230 is shown. The semiconductor processing tool 200 is shown to include a front vacuum transfer robot (VTR) 235A proximate a first transfer station 233 and a rear VTR 235B disposed at the rear of the semiconductor processing tool 230. The front VTR 235A and the rear VTR 235B may be the same as or similar to the vacuum transfer robots 205A, 205B of FIG. 2A. Those skilled in the art will appreciate that the front VTR 235A and the rear VTR 235B are depicted generally as circles so as not to obscure other components of the disclosed subject matter. Also shown is a second transfer station 237. Similar to the description above with reference to FIG. 2A, after a substrate is loaded into various ones of the processing stations 203 (e.g., from the first transfer station 233 or the second transfer station 237), the appropriate one of the chamber transfer ports 223A-223D is closed to prevent any gases, plasma, etc. from transferring from one multi-station module to another.

[0038] Consequently, the semiconductor processing tool 230 may be the same as or similar to the semiconductor processing tool 200 of Figure 2A, except that in the embodiment of Figure 2B there are only four multi-station modules 231A-231D, rather than five as shown in Figure 2A. In conclusion, one of ordinary skill in the art will recognize that any number of modules may be included and still remain within the scope of the disclosed subject matter.

[0039] 2C-2H are diagrams illustrating various examples of processing station configurations in a processing module according to various embodiments of the disclosed subject matter. As will be appreciated by those skilled in the art, patent drawings are not drawn to scale. Thus, those skilled in the art will recognize that the width and / or length of each of the processing station configurations may be modified as needed for a particular processing tool. Those skilled in the art will also recognize that any combination of the various examples of processing station configurations in FIGS. 2C-2H may be used as needed for a particular processing tool. This combination may be used to minimize the overall footprint, to combine various processes in one tool, or for various other reasons as will be appreciated by those skilled in the art.

[0040] FIG 2C illustrates a two-station arrangement 240 of a multi-station module 241 having two processing stations 203. FIG 2D illustrates a first three-station arrangement 250 of a multi-station module 251 having three processing stations 203. FIG 2E illustrates a second three-station arrangement 260 of a multi-station module 261 having three processing stations 203. Upon reading and understanding the disclosed subject matter, one of ordinary skill in the art will recognize that, for example, the first three-station arrangement 250 and the second three-station arrangement 260 can be configured in close proximity to one another, again reducing the overall footprint of a process tool using such processing station arrangements.

[0041] Figure 2F shows a five-station arrangement 270 of a multi-station module 271 having five processing stations 203. Figure 2G shows a six-station arrangement 280 of a multi-station module 281 having six processing stations 203. Figure 2H shows a seven-station arrangement 290 of a multi-station module 291 having seven processing stations 203.

[0042] The various example configurations of processing stations within the processing modules of Figures 2C-2H are provided by way of example only, and one of ordinary skill in the art will recognize that various numbers and configurations of processing stations other than those illustrated are contemplated and may still be within the scope of the disclosed subject matter.

[0043] 3A illustrates a cutaway plan view of an exemplary embodiment of a multi-station semiconductor processing tool 300 having a square-shaped configuration 323 of processing stations 203. The semiconductor processing tool 300 is shown to include a plurality of multi-station modules 301A-301D. The plurality of multi-station modules 301A-301D are shown splayed at an angle relative to one another, but such angle is not intended to be limiting. That is, the multi-station modules 301A-301D may be arranged such that at least one edge of one module is parallel to at least one other of the modules. As shown, chamber transfer ports 325A-325D are disposed between the vacuum transfer module 321 and each of the multi-station modules 301A-301D.

[0044] The semiconductor processing tool 300 is also shown to include additional processing stations, including a first processing station 307, a second processing station 309A, and a third processing station 309B. The additional ones of the processing stations 307, 309A, 309B may be exposed to a high vacuum environment (e.g., several Torr or less) because each is disposed within a vacuum transfer module 321. Although three processing stations are shown, upon reading and understanding the disclosed subject matter, one of ordinary skill in the art will recognize that more or fewer processing stations may be accommodated within the vacuum transfer module 321. For example, in an exemplary embodiment, one, two, four, five, or more processing stations may be accommodated within the vacuum transfer module 321. Three processing stations are shown merely as an example to illustrate further aspects of the disclosed subject matter.

[0045] In a manner similar or identical to the semiconductor processing tool 200 of Figure 2A, each of the substrates is loaded into the semiconductor processing tool 300 by a linear ATR 617 disposed in the shallow EFEM 311. The linear ATR 617 loads at least a single substrate at a time from one of the multiple substrate carriers 211 onto the transfer station 313. The transfer station 313 may be the same as or similar to the transfer stations 213, 207, 233, 237 of Figures 2A and 2B.

[0046] The semiconductor processing tool 300 is also shown to include a front vacuum transfer robot (VTR) 305A proximate the transfer station 313 and a back VTR 305B disposed at the back of the semiconductor processing tool 300. Those skilled in the art will appreciate that the front VTR 305A and the back VTR 305B are depicted generally as circles so as not to obscure other components of the disclosed subject matter. The front VTR 305A and the back VTR 305B may be the same as or similar to the vacuum transfer robots 205A, 205B, 235A, 235B of FIGS. 2A and 2B. The front VTR 305A may either transfer the substrate from the transfer station 313 to one of the processing stations 203, or the front VTR 305A may transfer the substrate to one of the processing stations 307, 309A, 309B. Similarly, the back VTR 305B may, for example, either transport a substrate from one of the processing stations 307, 309A, 309B to one of the processing stations 203, or the back VTR 305A may transport a substrate from one of the processing stations 203 to one of the processing stations 307, 309A, 309B. In another possible transport combination, the front VTR 305A may transport a substrate from one of the processing stations 203 to another one of the processing stations 203.

[0047] In certain exemplary embodiments, the first processing station 307 comprises a pre-cleaning station. In semiconductor processing, a pre-cleaning step is often employed to remove, for example, native oxides (e.g., on silicon wafers) and other impurities from one side (or both sides) of a substrate.

[0048] In certain exemplary embodiments, the second processing station 309A and the third processing station 309B each include a degassing station. In an exemplary degassing process, after entering the high vacuum environment of the vacuum transfer module 321, the substrate may undergo a desorption step in the second processing station 309A or the third processing station 309B. The degassing process may be performed under an inert gas environment (e.g., argon (Ar)) and at a temperature significantly (e.g., about 50° C. to about 100° C.) higher than other steps in the processing sequence. In general, the degassing process may remove gaseous and / or liquid substances, such as moisture and films, on the substrate.

[0049] For steps such as pre-cleaning and degassing steps, a certain vacuum level (e.g., pressures of a few Torr or less) is achieved by pumping down the vacuum transfer module 321. Overall, the inclusion of additional types of processing stations within the vacuum transfer module 321 adds significant processing capacity for processing of substrates, greatly improving substrate throughput.

[0050] In various embodiments, the additional processing stations (e.g., first processing station 307, second processing station 309A, and third processing station 309B) may be configured to perform functions other than pre-cleaning or degassing steps. In various embodiments, one or more of the additional processing stations may also be configured to perform post-processing steps, which may include, for example, rapid thermal annealing and other processes known to those skilled in the art. In various embodiments, one or more of the additional processing stations may be configured to alternate between pre-processing and post-processing steps.

[0051] FIG. 3B illustrates a cutaway plan view of an exemplary embodiment of a multi-station semiconductor processing tool 330 having a diamond-shaped configuration of processing stations. The semiconductor processing tool 300 includes additional processing stations 337, 339A, 339B disposed within a vacuum transfer module 321, according to an embodiment of the disclosed subject matter. The processing stations 337, 339A, 339B provide significant additional processing capacity, as described above with reference to FIG. 3A. Although three additional processing stations are shown, as also described with reference to FIG. 3A, upon reading and understanding the disclosed subject matter, one of ordinary skill in the art will recognize that more or fewer additional processing stations may be accommodated within the vacuum transfer module 321. For example, in an exemplary embodiment, one, two, four, five, or more processing stations may be accommodated within the vacuum transfer module 321. Three processing stations are shown merely as an example to illustrate further aspects of the disclosed subject matter. As described above with reference to FIG. 3A, in certain exemplary embodiments, the first processing station 337 comprises a pre-clean station. The second processing station 309A and the third processing station 309B may each comprise a degassing station. In other embodiments, at least one of the processing stations 307, 309A, 309B may comprise a post-processing station. In other embodiments, the processing stations 307, 309A, 309B may include alternating pre-processing and post-processing steps.

[0052] Additionally, as shown, chamber transfer ports 325A-E are disposed between the vacuum transfer module 321 and each of the multi-station modules 331A-E. In a similar or identical manner to the semiconductor processing tool 300 of FIG. 3A, each of the substrates is loaded into the semiconductor processing tool 330 by a linear ATR 617 disposed in the shallow EFEM 311. The linear ATR 617 loads at least a single substrate at a time from one of the substrate carriers 211 onto the transfer station 333. For processes such as pre-cleaning and degassing processes, a certain vacuum level (e.g., a pressure of a few Torr or less) is achieved by pumping down the vacuum transfer module 321.

[0053] The semiconductor processing tool 330 is also shown to include a front vacuum transfer robot (VTR) 335A and a back VTR 335B. Those skilled in the art will appreciate that the front VTR 335A and back VTR 335B are depicted generally as circles so as not to obscure other components of the disclosed subject matter. The front VTR 335A and back VTR 335B may be the same as or similar to the vacuum transfer robots 305A, 305B of FIG. 3A.

[0054] The diamond-shaped configuration 215 (see FIG. 2A) of the processing stations 203 in each of the multi-station modules 331A-331E allows adjacent ones of the modules to be placed closer together than would be possible with the square-shaped configuration 323 of FIG. 3A. With continued reference to FIG. 3B, one skilled in the art will recognize that based on the diamond-shaped configuration of the processing stations 203, adjacent ones of the modules, e.g., the multi-station modules 331A, 331E, 331D located in the portion of the semiconductor processing tool 330 furthest from the shallow EFEM 311 (furthest meaning toward the rear of the tool and shown near the top of the page), can be placed closer together than the four-station modules 101A-101D of FIG. 1. That is, the diamond-shaped configuration allows a portion of the modules to have an angled outer surface 227 (see FIG. 2A). The angled outer surface 227 allows for increased packing density of the modules - multi-station modules 331A-331E can be placed together in a smaller footprint while still including the same number of processing stations 203 within each module.

[0055] 3C illustrates a cutaway plan view of an example embodiment of a multi-station semiconductor processing tool 370 having both a square-shaped configuration 323 and a diamond-shaped configuration 215 of processing stations 203. Due to the square-shaped configuration 323 and diamond-shaped configuration 215 of processing stations 203, the semiconductor processing tool 370 may be considered to have a hybrid configuration of processing stations.

[0056] The semiconductor processing tool 370 is shown as including additional processing stations 377, 379A, 379B disposed within the vacuum transfer module 321, according to an embodiment of the disclosed subject matter. The additional processing stations 377, 379A, 379B provide significant additional processing capabilities, as described above with reference to FIG. 3A. Although three additional processing stations are shown, as also described with reference to FIG. 3A, upon reading and understanding the disclosed subject matter, one of ordinary skill in the art will recognize that more or fewer additional processing stations may be accommodated within the vacuum transfer module 321. For example, in an exemplary embodiment, one, two, four, five, or more processing stations may be accommodated within the vacuum transfer module 321. Three processing stations are shown merely as an example to illustrate further aspects of the disclosed subject matter. As described above with reference to FIG. 3A, in certain exemplary embodiments, the first processing station 377 comprises a pre-cleaning station. The second processing station 379A and the third processing station 379B may each comprise a degassing station. One or more of the additional processing stations 377, 379A, 379B may be configured to perform a post-processing step, or to alternate between pre-processing and post-processing steps.

[0057] Additionally, as shown, chamber transfer ports 325A-E are disposed between the vacuum transfer module 321 and each of the multi-station modules 371A-E. In a similar or identical manner to the semiconductor processing tool 300 of FIG. 3A, each of the substrates is loaded into the semiconductor processing tool 370 by a linear ATR 617 disposed in the shallow EFEM 311. The linear ATR 617 loads at least a single substrate at a time from one of the substrate carriers 211 onto the transfer station 373. For processes such as pre-cleaning and degassing processes, a certain vacuum level (e.g., a pressure of a few Torr or less) is achieved by pumping down the vacuum transfer module 321.

[0058] The semiconductor processing tool 370 is also shown to include a front vacuum transfer robot (VTR) 375A and a back VTR 375B. Those skilled in the art will appreciate that the front VTR 375A and the back VTR 375B are depicted generally as circles so as not to obscure other components of the disclosed subject matter. The front VTR 375A and the back VTR 375B may be the same as or similar to the vacuum transfer robots 305A, 305B of FIG. 3A.

[0059] The diamond-shaped configuration 215 of the processing stations 203 within each of the multi-station modules 371A, 371B, 371C allows adjacent ones of the modules to be placed closer together than would be possible with the square-shaped configuration 323 of FIG. 3A. With continued reference to FIG. 3C, one skilled in the art will recognize that based on the diamond-shaped configuration 215 of the processing stations 203, adjacent ones of the modules, for example, the multi-station modules 371A, 371B, 371C located at the portion of the semiconductor processing tool 370 that is furthest from the shallow EFEM 311 (furthest meaning toward the back of the tool, i.e., toward the top of the page), can be placed closer together than the multi-station modules 381A, 381B. That is, the diamond-shaped configuration 215 allows a portion of the modules to have an angled outer surface 227 (see FIG. 2A). The angled outer surface 227 allows for increased packing density of the modules - multi-station modules 371A-371C can be placed together in a smaller footprint while still including the same number of processing stations 203 within each module.

[0060] Referring now to FIG. 4A, a semiconductor processing tool 400 is shown that includes a two-level load lock and transfer station 401 (or substrate transfer port). The semiconductor processing tool 400 is in accordance with various embodiments of the disclosed subject matter as described above with reference to FIGS. 2A-3C. One skilled in the art will appreciate that one of the transfer stations is disposed above the other. As a result, the two-level load lock and transfer station 401 has a first level load lock disposed in a first xy plane and a second two-level load lock and transfer station disposed in a second xy plane that is either higher or lower than the first xy plane. Thus, in the plan view of FIG. 4A, one of the transfer stations is not explicitly shown. The semiconductor processing tool 400 may otherwise be the same as, for example, the semiconductor processing tool 330 of FIG. 3B. However, the two-level load lock and transfer station 401 may be used with any of the semiconductor processing tools of the disclosed subject matter shown and described herein. Overall, those skilled in the art will recognize that the two level load lock and transfer station 401 can significantly increase substrate throughput.

[0061] FIG. 4B illustrates an exemplary embodiment of a semiconductor processing tool 430 including a tandem two-level load lock and transfer station. The tandem two-level load lock and transfer station includes a pair of transfer stations 431L on the left (one above the other) and a pair of transfer stations 431R (or substrate transfer ports) on the right (one above the other). The semiconductor processing tool 430 is in accordance with an embodiment of the disclosed subject matter as described above with reference to FIGS. 2A-3C. Those skilled in the art will appreciate that since the transfer stations are located one above the other, each pair of transfer stations is therefore not explicitly shown in the plan view of FIG. 4B. As a result, the two-level load lock and transfer stations 431L and 431R each have a first level load lock disposed in a first xy plane and a second two-level load lock and transfer station disposed in a second xy plane that is either higher or lower than the first xy plane. The semiconductor processing tool 430 may otherwise be the same as, for example, the semiconductor processing tool 330 of FIG. 3B. However, the tandem two-level load lock and transfer station 431L, 431R may be used with any of the semiconductor processing tools of the disclosed subject matter shown and described herein. Overall, those skilled in the art will recognize that the tandem two-level load lock and transfer station 431L, 431R may significantly increase substrate throughput. Those skilled in the art will further recognize that three or more two-level load locks and transfer stations may be used side-by-side or stacked one on top of the other.

[0062] FIG. 4C illustrates an exemplary embodiment of a semiconductor processing tool 450 showing substrate transport paths at different levels according to an embodiment of the disclosed subject matter. The semiconductor processing tool 450 of FIG. 4C can be considered in the context of the semiconductor processing tool 430 of FIG. 4B. In FIG. 4B, the two-level load lock and transfer stations 431L and 431R each have a first level load lock disposed in a first xy-plane and a second two-level load lock and transfer station disposed in a second xy-plane that is either higher or lower than the first xy-plane. In FIG. 4C, with reference to the following description, the various substrate transport paths can be considered to be located in a first xy-plane that is higher or lower than the second xy-plane. Thus, the various associated vacuum transfer robots and processing stations disposed within the vacuum transfer modules can also be considered to be located in either the first xy-plane or the second xy-plane. Therefore, reference is made to the following description of Figure 4C with respect to the various vacuum transport robots and processing stations arranged within the vacuum transport modules, which are at substantially the same level in the same xy plane as the substrate transport path.

[0063] For example, in a particular exemplary embodiment, the substrate may be transported from the linear ATR 617 to a lower level version of the transfer station 313 (not explicitly shown) via the first transport path 451. The substrate may then be transported by the lower level version of the front VTR 305A from the lower level version of the transfer station 313 to either: (1) one of the lower level processing stations of the multi-station module 301B via the second transport path 453, (2) one of the lower level processing stations of the multi-station module 301C via the third transport path 455, (3) the lower level implementation of the first processing station 307 via the fourth transport path 461, (4) the lower level implementation of the second processing station 309A via the fifth transport path 457, or (5) the lower level implementation of the third processing station 309B via the sixth transport path 459.

[0064] Similarly, the substrate can then be transported from the first processing station 307 of the lower level version by the rear VTR 305B of the lower level version to either: (1) one of the lower level processing stations of the multi-station module 301A via the seventh transport path 467 and the eighth transport path 469, (2) one of the lower level processing stations of the multi-station module 301D via the seventh transport path 467 and the ninth transport path 471, (3) to the lower level implementation of the second processing station 309A via the tenth transport path 463, or (4) to the lower level implementation of the third processing station 309B via the eleventh transport path 465.

[0065] Upon reading and understanding the disclosed subject matter, one of ordinary skill in the art will recognize that each of the transportation paths may also be used in other combinations not explicitly detailed herein. One of ordinary skill in the art will also recognize that the multi-level arrangement of FIG. 4C may be extended to more than two levels. For example, the multi-level arrangement may be extended to three, four, or more levels and still be considered to be within the scope of the disclosed subject matter.

[0066] In various embodiments, each of the lower level implementations of the first processing station 390, the second processing station 309A, and the third processing station 309B can be the same as or similar to the first processing station 390, the second processing station 309A, and the third processing station 309B of Figure 3A. In various embodiments, each of the lower level implementations of the first processing station 390, the second processing station 309A, and the third processing station 309B can be different from or configured in an alternative arrangement relative to, among other things, the first processing station 390, the second processing station 309A, and the third processing station 309B of Figure 3A.

[0067] Figure 5A shows example dimensions 500 that make up a typical footprint of the semiconductor processing tool 100 of Figure 1. Most or all of the semiconductor processing tool is located within the equipment chase. Primarily only the substrate carriers are located within the manufacturing environment 501 (e.g., a clean room where process engineers interface with the tool). Example dimensional ratios are shown in Table 1 below. [Table 1]

[0068] 5B and 5C show example dimensional ratios that make up the footprints of tool configurations contemplated in accordance with various embodiments of the disclosed subject matter, as provided in the specific examples of FIGS. 2A-4B. The dimensional ratios are provided with reference to the dimensional ratios shown in Table 1 of the prior art. For example, with reference to dimension 530 in FIG. 5B, example dimensional ratios are shown in Table 2 below. However, one of ordinary skill in the art will readily appreciate that these are merely examples. Thus, these example ratios are provided merely as an aid in understanding the increased density of processing stations possible by incorporating at least certain aspects of the disclosed subject matter. [Table 2]

[0069] Referring to dimension 570 in FIG. 5C, which illustrates the semiconductor processing tool 430 of FIG. 4B as an example, dimensional ratios are shown in Table 3 below in comparison to the dimensional ratios shown in Prior Art Table 1. Again, one of ordinary skill in the art will readily appreciate that these are examples only. Thus, these example ratios are provided merely as an aid in understanding the increased density of processing stations possible by incorporating at least certain aspects of the disclosed subject matter.

[0070] In this example, the semiconductor processing tool 430 is located within the equipment chase. Except for the portion 571 of the module that may be co-located with the manufacturing environment 501, primarily only the substrate carrier is located within the manufacturing environment 501. [Table 3]

[0071] 5A-5C simultaneously, upon reading and understanding the disclosed subject matter, one of ordinary skill in the art will recognize that various tool layout configurations using diamond shaped configurations can increase the density of processing stations in various embodiments. In other embodiments, additional processing stations (e.g., pre-cleaning and degassing stations in a vacuum transfer module) can add significant processing capacity for processing substrates and significantly improve substrate throughput. In other embodiments, the combination of diamond shaped configurations and additional processing stations can increase the density of processing stations and / or add significant processing capacity by incorporating additional processing stations.

[0072] 6A and 6B are exemplary plan and elevation views, respectively, of an atmospheric transport robot (ATR) 617 adapted for a shallow equipment front end module (EFEM) 600 that may be used with various embodiments of the disclosed subject matter.

[0073] With reference to the exemplary plan view 601A of FIG. 6A and the elevation view 601B of FIG. 6B, the linear ATR 617 may be mounted on one or more vertical rails 603 in the EFEM 600. The one or more vertical rails 603 are in turn mounted on the horizontal rail 601. The linear ATR 617 is configured to move up and down in the vertical Z direction on the vertical rail 603. For example, the linear ATR 617 may be mounted in a slot (not explicitly shown but understandable to those skilled in the art) of the vertical rail 603. On the other hand, the linear ATR 617 is configured to slide in the horizontal X direction on the vertical rail 603 along the horizontal rail 601. As a result, the position of the linear ATR 617 may be adjusted in the Z and X directions to provide access to the multiple load locks 615 and to the loading station housing the substrate carriers 211 (see FIG. 2A, not explicitly shown in the case of FIG. 6A or FIG. 6B). Both the loading station and the multiple load locks 615 may be at various heights (at different levels in the Z direction).

[0074] In one example, the linear ATR 617 includes two arms 613. In FIG. 6A, one of the two arms 613 overlaps the other (two arms 613 in a folded configuration). Each of the two arms 613 includes an arm segment 605 and an end effector 607. In various embodiments, one of the two arms 613 may be longer than the other. Also, while two arms are shown, those skilled in the art will recognize upon reading and understanding the disclosed subject matter that a single arm or three or more arms may be used in various arrangements. In various embodiments, one of the two arms 613 may be longer than the other depending on, for example, the overall configuration of the EFEM 600 in relation to the substrate carrier 211 (see, for example, FIG. 2A) and various of the multiple load locks 615.

[0075] When the two arms 613 are in the folded configuration as shown, the linear ATR 617 has a relatively narrow profile (e.g., compared to the dimensions of a substrate being transported) relative to the EFEM 600. Accordingly, the EFEM 600 is configured to accommodate at least a portion of the multiple load locks 615 and corresponding ones of the vacuum gates (not explicitly shown).

[0076] In various embodiments, the EFEM 600 may include an integrated substrate aligner 609. In this example, having one of the two arms 613 have a greater overall length than the other allows a counterpart of the end effector 607 to be positioned above the integrated substrate aligner 609 when the linear ATR 617 is in the folded configuration shown in FIG. 6A. For example, the relative lengths of the arm segment 605 and the end effector 607 allow for a relatively linear folded configuration in which the arm segment 605, end effector 607, and integrated substrate aligner 609 are configured on (i.e., coaxial with) line 611.

[0077] With continued reference to FIGS. 6A and 6B, each of the two arms 613 may be mounted in one slot of each of the vertical rails 603. For example, the vertical rails 603 may be moved independently of one another. In other words, although shown in a compact configuration in FIGS. 6A and 6B (i.e., the vertical rails 603 are relatively close to one another), one of the vertical rails 603 may be moved to an opposite end of the EFEM 600 from the other of the vertical rails 603. In this manner, each one of the two arms 613 is configured to access different ones of the loading stations and / or load locks 615 substantially simultaneously. In other examples, the EFEM 600 may include only one of the vertical rails 603 and a corresponding one of the two arms 613.

[0078] In some examples, although not explicitly shown, the additional space within the EFEM 600 achieved by the linear ATR 617 configuration may enable additional substrate processing and transport system components to be placed within the EFEM 600. For example, components may be placed within the EFEM 600, including, but not limited to, metrology stations, storage buffers, notch alignment stations, edge ring storage, etc. In one example, when the two arms 613 are in a folded configuration, the linear ATR 617 occupies, for example, less than 50% of the overall depth of the EFEM 600.

[0079] As used herein, the term "or" may be interpreted in an inclusive or exclusive sense. Moreover, other embodiments will be apparent to those of ordinary skill in the art based on reading and understanding the present disclosure provided. Furthermore, those of ordinary skill in the art will readily appreciate that various combinations of the techniques and examples provided herein may all be applied in various combinations.

[0080] Throughout this specification, a component, operation, or structure described as a single example may be implemented by multiple examples. Although individual operations are illustrated and described as separate operations, one or more of the individual operations may be performed simultaneously, and nothing requires that these operations necessarily be performed in the order described, unless otherwise specified. Structures and functionality presented as multiple separate components in an example configuration may be implemented as one combined structure or component. Similarly, structures and functionality presented as a single component may be implemented as multiple separate components. These and other changes, modifications, additions, and improvements are within the scope of the subject matter described herein.

[0081] Further, although not explicitly shown, one skilled in the art will appreciate that each of the vacuum transport robots depicted in FIGS. 2A-4B has a multi-level transport capability. As a result, each of the VTRs may include an extended Z-range of motion. Thus, each of the transport stations, load lock chambers, processing stations, and associated components may also be of a multi-level design. Further, although not explicitly shown, one skilled in the art will appreciate upon reading and understanding the disclosed subject matter, each of the vacuum transport modules described above may have only a single VTR. In other embodiments, three or more VTRs may be used within each vacuum transport module. Thus, each of the exemplary embodiments described above may accommodate one or more VTRs within each vacuum transport module. Still further, each of the exemplary embodiments shown and described herein is merely representative of one possible configuration and should not be construed as limiting the scope of the present disclosure.

[0082] Each of the vacuum transfer robots of the disclosed subject matter can be any suitable robot capable of moving a substrate during processing. In some embodiments, the vacuum transfer robot can have multiple arms. Each of the multiple arms can be moved independently of the other of the arms. Each of the multiple arms can be moved independently in the xy plane and / or along the z axis (which covers multiple xy planes).

[0083] Additionally, although four or six sides of the vacuum transport module are shown, one skilled in the art will appreciate that the vacuum transport module may have any suitable number of sides depending, for example, on the overall layout of the semiconductor processing tool.

[0084] Also, each of the substrate carriers can hold several substrates, which are processed and returned to the substrate carrier, or alternatively, one of the substrate carriers can hold an unprocessed substrate, which is then transferred to another one of the substrate carriers after processing.

[0085] In various embodiments, the additional processing stations (e.g., first processing station 307, second processing station 309A, and third processing station 309B) may be configured to perform functions other than pre-cleaning or degassing steps. In various embodiments, one or more of the additional processing stations may also be configured to perform a post-processing step. In various embodiments, one or more of the additional processing stations may be configured to alternately perform pre-processing and post-processing steps.

[0086] Although the various embodiments are discussed separately, these individual embodiments are not intended to be considered as independent technologies or designs. As indicated above, each of the various parts may be interrelated and each may be used separately or in combination with other embodiments of the disclosed subject matter discussed herein. For example, although various embodiments of operations, systems, and processes have been described, these methods, operations, systems, and processes may be used separately or in various combinations.

[0087] In conclusion, many modifications and variations are possible, as will be apparent to those skilled in the art upon reading and understanding the disclosure provided herein. From the above description, functionally equivalent methods and devices within the scope of the present disclosure, other than those enumerated herein, will be apparent to those skilled in the art. Portions and features of one embodiment may be included in or substituted for portions and features of other embodiments. Such modifications and variations are intended to fall within the scope of the appended claims. Accordingly, the present disclosure is to be limited only by the terms of the appended claims and the full scope of equivalents to which such claims are entitled. It should also be understood that the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting.

[0088] The Abstract is provided to allow the reader to quickly ascertain the nature of the technical disclosure. The Abstract is submitted with the understanding that it will not be used to interpret or limit the scope of the claims. Moreover, in the above Detailed Description, it can be understood that various features may be grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure should not be construed as limiting the scope of the claims. In this instance, the following claims are incorporated herein into the Detailed Description, with each claim standing on its own as a separate embodiment. The following numbered examples are specific illustrative embodiments of the disclosed subject matter.

[0089] Example 1. In one embodiment of the disclosed subject matter, a semiconductor processing tool is described that includes a plurality of multi-station modules and a plurality of processing stations. At least some of the plurality of processing stations are organized in a diamond-shaped configuration in at least some of the plurality of multi-station modules. A vacuum transfer module is coupled to each of the multi-station modules. The vacuum transfer module has one or more vacuum transfer robots for transferring substrates to and from at least one of the plurality of processing stations. At least one additional processing station is disposed within the vacuum transfer module.

[0090] Example 2. The semiconductor processing tool of example 1, wherein a remainder of the plurality of processing stations are organized in a rectangular shaped configuration in a remainder of the plurality of multi-station modules that do not contain processing stations organized in a diamond shaped configuration.

[0091] Example 3. The semiconductor processing tool of example 1 or example 2, further comprising at least one maintenance opening feature disposed between at least some adjacent ones of the plurality of multi-station modules.

[0092] Example 4. The semiconductor processing tool of any one of Examples 1 to 3, further comprising at least one additional processing station disposed within the vacuum transfer module at a different level than the at least one additional processing station.

[0093] Example 5. The semiconductor processing tool of example 4, wherein the at least one additional processing station is accessible by any of the one or more vacuum transfer robots in the vacuum transfer module.

[0094] Example 6. The semiconductor processing tool of example 4, wherein the at least one additional processing station comprises a pre-clean station.

[0095] Example 7. The semiconductor processing tool of example 4, wherein the at least one additional processing station comprises a degassing station.

[0096] Example 8. The semiconductor processing tool of example 4, wherein the at least one additional processing station comprises a post-processing station.

[0097] Example 9. The semiconductor processing tool of example 4, wherein the at least one additional processing station comprises a station configured to alternate between a pre-clean station and a post-processing station.

[0098] Example 9. The semiconductor processing tool of example 4, wherein the at least one additional processing station comprises three stations.

[0099] Example 10. The semiconductor processing tool of example 9, wherein the three stations comprise at least one pre-clean station and at least one degassing station.

[0100] Example 11. The semiconductor processing tool of any one of Examples 1 to 10, further comprising a two-level load lock and transfer station having a first level load lock disposed in a first xy-plane and a second two-level load lock and transfer station disposed in a second xy-plane, the second xy-plane being either higher or lower than the first xy-plane.

[0101] Example 12. The semiconductor processing tool of any one of Examples 1 to 11, further comprising a tandem two-level load lock and transfer station including a left pair of transfer stations and a right pair of transfer stations. The left pair of transfer stations and the right pair of transfer stations each have a first level load lock disposed in a first xy-plane and a second two-level load lock and transfer station disposed in a second xy-plane. The second xy-plane is either higher or lower than the first xy-plane.

[0102] Example 13. In one embodiment of the disclosed subject matter, a semiconductor processing tool is described that includes a plurality of multi-station modules and a plurality of processing stations disposed within each of the plurality of multi-station modules. A vacuum transfer module is coupled to each of the multi-station modules. The vacuum transfer module has one or more vacuum transfer robots for transferring substrates to and from at least one of the plurality of processing stations. At least one additional processing station is disposed within the vacuum transfer module.

[0103] Example 14. The semiconductor processing tool of example 13, wherein the at least one additional processing station is accessible by any of the one or more vacuum transfer robots in the vacuum transfer module.

[0104] Example 15. The semiconductor processing tool of any one of examples 13 or 14, wherein the at least one additional processing station comprises a pre-clean station.

[0105] Example 16. The semiconductor processing tool of any one of examples 13 to 15, wherein the at least one additional processing station comprises a degassing station.

[0106] Example 17. The semiconductor processing tool of any one of Examples 13 to 16, wherein the at least one additional processing station comprises a post-processing station.

[0107] Example 18. The semiconductor processing tool of any one of Examples 13 to 17, wherein the at least one additional processing station comprises a station configured to alternate between a pre-clean station and a post-processing station.

[0108] Example 19. The semiconductor processing tool of any one of examples 13 to 18, wherein the at least one additional processing station comprises three stations.

[0109] Example 20. The semiconductor processing tool of example 19, wherein the three stations comprise at least one pre-clean station and at least one degassing station.

[0110] Example 21. The semiconductor processing tool of example 19, wherein at least some of the plurality of processing stations are organized in a diamond shaped configuration in at least some of the plurality of multi-station modules.

[0111] Example 22. In an embodiment of the disclosed subject matter, a semiconductor processing tool is described that includes a plurality of multi-station modules and a hybrid configuration of a plurality of processing stations. At least some of the hybrid configuration of the plurality of processing stations are organized in a diamond-shaped configuration in at least some of the plurality of multi-station modules. The remainder of the hybrid configuration of the plurality of processing stations is organized in a square-shaped configuration in the remainder of the plurality of multi-station modules that do not include the processing stations organized in the diamond-shaped configuration. A vacuum transfer module is coupled to each of the multi-station modules. The vacuum transfer module has one or more vacuum transfer robots for transferring substrates to and from at least one of the plurality of processing stations. A plurality of additional processing stations are disposed within the vacuum transfer module.

[0112] Example 23. The semiconductor processing tool of example 22, further comprising at least one additional processing station disposed within the vacuum transfer module.

[0113] Example 24. The semiconductor processing tool of any one of examples 22 or 23, further comprising a linear atmospheric pressure transfer robot disposed within an equipment front end module (EFEM) of the semiconductor processing tool.

[0114] Example 25. The semiconductor processing tool of any one of Examples 22-24, further comprising at least one maintenance opening feature disposed between at least some adjacent ones of the plurality of multi-station modules.

[0115] Example 26. The semiconductor processing tool of any one of examples 22 to 25, further comprising at least one additional processing station disposed in the vacuum transfer module at a different level than the at least one additional processing station.

[0116] Example 27. The semiconductor processing tool of example 26, wherein the at least one additional processing station is accessible by any of the one or more vacuum transfer robots in the vacuum transfer module.

[0117] Example 28. The semiconductor processing tool of example 26, wherein the at least one additional processing station comprises a pre-clean station.

[0118] Example 29. The semiconductor processing tool of example 26, wherein the at least one additional processing station comprises a degassing station.

[0119] Example 30. The semiconductor processing tool of example 26, wherein the at least one additional processing station comprises a post-processing station.

[0120] Example 31. The semiconductor processing tool of example 26, wherein the at least one additional processing station comprises a station configured to alternate between a pre-clean station and a post-processing station.

[0121] Example 32. The semiconductor processing tool of example 26, wherein the at least one additional processing station comprises three stations.

[0122] Example 33. The semiconductor processing tool of example 32, wherein the three stations comprise at least one pre-clean station and at least one degassing station.

[0123] Example 34. The semiconductor processing tool of any one of examples 22 to 33, further comprising a two-level load lock and transfer station having a first level load lock disposed in a first xy-plane and a second two-level load lock and transfer station disposed in a second xy-plane, wherein the second xy-plane is either higher or lower than the first xy-plane.

[0124] Example 35. The semiconductor processing tool of any one of Examples 22 to 34, further comprising a tandem two level load lock and transfer station including a left pair of transfer stations and a right pair of transfer stations, each of the left pair of transfer stations having a first level load lock disposed in a first xy plane and a second two level load lock and transfer station disposed in a second xy plane, the second xy plane being either higher or lower than the first xy plane.

Claims

1. 1. A semiconductor processing tool comprising: A plurality of multi-station modules; a plurality of processing stations, at least some of the plurality of processing stations being organized in a diamond shaped configuration in at least some of the plurality of multi-station modules; a vacuum transfer module coupled to each of the multi-station modules, the vacuum transfer module having one or more vacuum transfer robots for transferring substrates to and from at least one of the plurality of processing stations; at least one additional processing station disposed within the vacuum transport module; A semiconductor processing tool comprising:

2. 10. The semiconductor processing tool of claim 1, a remainder of the plurality of processing stations are organized in a rectangular shaped configuration in a remainder of the plurality of multi-station modules that do not include the processing stations that are organized in the diamond shaped configuration.

3. 10. The semiconductor processing tool of claim 1, The semiconductor processing tool, further comprising at least one maintenance opening feature disposed between adjacent ones of at least some of the plurality of multi-station modules.

4. 10. The semiconductor processing tool of claim 1, The semiconductor processing tool further comprising at least one additional processing station disposed within the vacuum transfer module at a different level than the at least one additional processing station.

5. 5. The semiconductor processing tool of claim 4, The at least one additional processing station is accessible by any of the one or more vacuum transfer robots in the vacuum transfer module.

6. 5. The semiconductor processing tool of claim 4, The at least one additional processing station comprises a pre-clean station.

7. 5. The semiconductor processing tool of claim 4, The at least one additional processing station comprises a degassing station.

8. 5. The semiconductor processing tool of claim 4, The at least one additional processing station comprises a post-processing station.

9. 5. The semiconductor processing tool of claim 4, The at least one additional processing station comprises a station configured to alternate between a pre-clean station and a post-processing station.

10. 5. The semiconductor processing tool of claim 4, The at least one additional processing station comprises three stations.

11. 11. The semiconductor processing tool of claim 10, The three stations include at least one pre-clean station and at least one degassing station.

12. 10. The semiconductor processing tool of claim 1, 11. The semiconductor processing tool further comprising a bi-level load lock and transfer station having a first level load lock disposed in a first xy plane and a second bi-level load lock and transfer station disposed in a second xy plane, the second xy plane being either higher or lower than the first xy plane.

13. 10. The semiconductor processing tool of claim 1, 11. The semiconductor processing tool, further comprising a tandem two-level load lock and transfer station including a left pair of transfer stations and a right pair of transfer stations, the left pair of transfer stations and the right pair of transfer stations each having a first level load lock disposed in a first x-y plane and a second two-level load lock and transfer station disposed in a second x-y plane, the second x-y plane being either higher or lower than the first x-y plane.

14. 1. A semiconductor processing tool comprising: A plurality of multi-station modules; a plurality of processing stations disposed within each of the plurality of multi-station modules; a vacuum transfer module coupled to each of the multi-station modules, the vacuum transfer module having one or more vacuum transfer robots for transferring substrates to and from at least one of the plurality of processing stations; at least one additional processing station disposed within the vacuum transport module; A semiconductor processing tool comprising:

15. 15. The semiconductor processing tool of claim 14, The at least one additional processing station is accessible by any of the one or more vacuum transfer robots in the vacuum transfer module.

16. 15. The semiconductor processing tool of claim 14, The at least one additional processing station comprises a pre-clean station.

17. 15. The semiconductor processing tool of claim 14, The at least one additional processing station comprises a degassing station.

18. 15. The semiconductor processing tool of claim 14, The at least one additional processing station comprises a post-processing station.

19. 15. The semiconductor processing tool of claim 14, The at least one additional processing station comprises a station configured to alternate between a pre-clean station and a post-processing station.

20. 15. The semiconductor processing tool of claim 14, The at least one additional processing station comprises three stations.

21. 21. The semiconductor processing tool of claim 20, The three stations include at least one pre-clean station and at least one degassing station.

22. 21. The semiconductor processing tool of claim 20, A semiconductor processing tool, wherein at least some of the plurality of processing stations are organized in a diamond shaped configuration in at least some of the plurality of multi-station modules.

23. 1. A semiconductor processing tool comprising: A plurality of multi-station modules; a hybrid configuration of a plurality of processing stations, at least a portion of the hybrid configuration of the plurality of processing stations being organized in a diamond shaped configuration in at least some of the plurality of multi-station modules, and a remainder of the hybrid configuration of the plurality of processing stations being organized in a rectangular shaped configuration in a remainder of the plurality of multi-station modules that do not house the processing stations organized in the diamond shaped configuration; a vacuum transfer module coupled to each of the multi-station modules, the vacuum transfer module having one or more vacuum transfer robots for transferring substrates to and from at least one of the plurality of processing stations; a plurality of additional processing stations disposed within the vacuum transport module; A semiconductor processing tool comprising:

24. 24. A semiconductor processing tool according to claim 23, comprising: The semiconductor processing tool further comprising at least one additional processing station disposed within the vacuum transfer module.

25. 24. A semiconductor processing tool according to claim 23, comprising:

1. The semiconductor processing tool, further comprising: a linear atmospheric pressure transfer robot disposed within an equipment front end module (EFEM) of the semiconductor processing tool.

26. 24. A semiconductor processing tool according to claim 23, comprising: The semiconductor processing tool, further comprising at least one maintenance opening feature disposed between adjacent ones of at least some of the plurality of multi-station modules.

27. 24. A semiconductor processing tool according to claim 23, comprising: The semiconductor processing tool further comprising at least one additional processing station disposed within the vacuum transfer module at a different level than the at least one additional processing station.

28. 28. A semiconductor processing tool according to claim 27, comprising: The at least one additional processing station is accessible by any of the one or more vacuum transfer robots in the vacuum transfer module.

29. 28. A semiconductor processing tool according to claim 27, comprising: The at least one additional processing station comprises a pre-clean station.

30. 28. A semiconductor processing tool according to claim 27, comprising: The at least one additional processing station comprises a degassing station.

31. 28. A semiconductor processing tool according to claim 27, comprising: The at least one additional processing station comprises a post-processing station.

32. 28. A semiconductor processing tool according to claim 27, comprising: The at least one additional processing station comprises a station configured to alternate between a pre-clean station and a post-processing station.

33. 28. A semiconductor processing tool according to claim 27, comprising: The at least one additional processing station comprises three stations.

34. 34. The semiconductor processing tool of claim 33, The three stations include at least one pre-clean station and at least one degassing station.

35. 24. A semiconductor processing tool according to claim 23, comprising:

11. The semiconductor processing tool further comprising a bi-level load lock and transfer station having a first level load lock disposed in a first xy plane and a second bi-level load lock and transfer station disposed in a second xy plane, the second xy plane being either higher or lower than the first xy plane.

36. 24. A semiconductor processing tool according to claim 23, comprising:

11. The semiconductor processing tool, further comprising a tandem two-level load lock and transfer station including a left pair of transfer stations and a right pair of transfer stations, the left pair of transfer stations and the right pair of transfer stations each having a first level load lock disposed in a first x-y plane and a second two-level load lock and transfer station disposed in a second x-y plane, the second x-y plane being either higher or lower than the first x-y plane.

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