Component loading device, component loading system, and component loading method

Abstract

To provide a component loading device which increases kinds of components which can be loaded on a substrate, a component loading system, and a component loading method.SOLUTION: A component loading device comprises a pressing head, a heat elevation mechanism which elevates the pressing head, a pressure regulation section, and a control section which performs driving control of the head elevation mechanism and the pressure regulation section. The pressing head includes a nozzle which presses a component to a substrate in a state where the component is held by a lower-side end, and a main body part in which a pressure chamber capable of energizing the nozzle toward the substrate is provided. The pressure regulation section regulates a pressure in a pressure chamber. When pressing the component to the substrate with a first load which is smaller than a preset load, the control section controls the pressure regulation section in such a manner that the pressure in the pressure chamber becomes a first pressure which generates the first load. When pressing the component to the substrate with a second load which is a load equal to or higher than the preset load, the control section controls the head elevation mechanism in such a manner that the component is pressed to the substrate with the second load.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting device, a component mounting system, and a component mounting method for mounting components on a substrate. [Background technology]

[0002] In a conventional component mounting device for mounting components on a substrate, the component is sucked by a nozzle on a pressure head, and a piston equipped with a nozzle at its lower end and positioned so that its upper end contacts a balloon is pushed down by a balloon inflated by air pressure, thereby mounting the component on the substrate.

[0003] For example, Patent Document 1 describes a method in which a semiconductor chip is attracted to a nozzle body, the semiconductor chip is positioned on a mounting surface, and air pressure is applied to the nozzle body to press the semiconductor chip. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Utility Model Application Publication No. 5-6838 Summary of the Invention [Problem to be solved by the invention]

[0005] However, with conventional component mounting devices, for example, when fitting components that are secured with claws onto a board, a greater pressure is required than for bottom-mounted components, and the air pressure is too small to insert the claws into the board. Therefore, workers had to fit such components onto the board themselves. If the piston or balloon diameter is increased to increase the air pressure, it becomes impossible to control the small pressure required to mount small bottom-mounted components onto the board.

[0006] Therefore, an object of the present disclosure is to provide a component mounting device, a component mounting system, and a component mounting method that increase the types of components that can be mounted on a board. [Means for solving the problem]

[0007] The component mounting device of the present disclosure includes a press head having a nozzle that presses a component against a substrate while holding the component at its lower end and a main body that has an internal pressure chamber that can urge the nozzle toward the substrate, a head lifting mechanism that raises and lowers the press head, a pressure adjustment unit that adjusts the pressure within the pressure chamber, and a control unit that drives and controls the head lifting mechanism and the pressure adjustment unit. The control unit controls the pressure adjustment unit so that the pressure within the pressure chamber becomes a first pressure that generates the first load when the component is pressed against the substrate with a first load that is smaller than a set load, and controls the head lifting mechanism so that the component is pressed against the substrate with a second load that is equal to or greater than the set load.

[0008] The component mounting system disclosed herein includes a component mounting device and a processing device that communicates with the component mounting device via a communications network. The component mounting device includes a press head having a nozzle for pressing the component against a substrate while holding the component at its lower end and a main body having an internal pressure chamber capable of biasing the nozzle toward the substrate, a head lifting mechanism for raising and lowering the press head, and a pressure adjusting unit for adjusting the pressure within the pressure chamber. The processing device includes a control unit that drives and controls the head lifting mechanism and the pressure adjusting unit. The control unit controls the pressure adjusting unit so that the pressure within the pressure chamber becomes a first pressure that generates the first load when pressing the component against the substrate with a first load that is smaller than a set load, and controls the head lifting mechanism so that the pressure within the pressure chamber becomes a first pressure that generates the first load when pressing the component against the substrate with a second load that is equal to or greater than the set load.

[0009] The component mounting method of the present disclosure includes a determining step in which a control unit determines, based on load data, whether a component to be mounted on a board is a component to be mounted with a first load that is smaller than a set load, or a component to be mounted with a second load that is equal to or greater than the set load, a pressing head lowering step in which a head lifting mechanism lowers a pressing head having a nozzle that has adsorbed the component relative to the board to bring the component into contact with the board, and an air pressure adjusting step in which a pressure adjusting unit in an electro-pneumatic regulator adjusts, in accordance with the type of component, the air pressure in a pressure chamber that can urge the nozzle toward the board before the component comes into contact with the board. If the component is a component to be mounted on the board with the first load, in the air pressure adjusting step, the control unit controls the pressure adjusting unit so that the pressure in the pressure chamber becomes a first pressure that generates the first load, and if the component is a component to be mounted on the board with a second load, the control unit controls the head lifting mechanism so that the component is pressed against the board with the second load. [Effects of the Invention]

[0010] According to the present disclosure, it is possible to provide a component mounting device, a component mounting system, and a component mounting method that increase the types of components that can be mounted on a board. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a plan view showing a schematic configuration of a component mounting device according to an embodiment of the present disclosure. [Figure 2] FIG. 1 is a side view showing a schematic configuration of a head assembly. [Figure 3] Control block diagram [Figure 4] Flowchart showing the process of component mounting [Figure 5] Side view of the head assembly when loading components with low load [Figure 6] Side view of the head assembly when loading components under high load [Figure 7] FIG. 1 is a block diagram of a component mounting system according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0012] A component mounting device according to a first aspect of the present disclosure includes a press head having a nozzle that presses a component against a substrate while holding the component at its lower end and a main body having an internal pressure chamber that can bias the nozzle toward the substrate, a head lifting mechanism that raises and lowers the press head, a pressure adjusting unit that adjusts the pressure within the pressure chamber, and a control unit that drives and controls the head lifting mechanism and the pressure adjusting unit. The control unit controls the pressure adjusting unit so that the pressure within the pressure chamber becomes a first pressure that generates the first load when the component is pressed against the substrate with a first load that is smaller than a set load, and controls the head lifting mechanism so that the component is pressed against the substrate with a second load that is equal to or greater than the set load.

[0013] With this configuration, when a component presses against the board with a load smaller than the set load, the pressure adjustment unit adjusts the pressure in the pressure chamber to adjust the pressure to a small value. Furthermore, when a component presses against the board with a load larger than the set load, the head lift mechanism presses the component against the board, allowing even inset components, which were previously difficult to mount using air pressure, to be mounted onto the board. In this way, a component mounting device can be provided that increases the variety of components that can be mounted onto the board.

[0014] According to a second aspect of the present disclosure, in the component mounting device of the first aspect, the nozzle is displaceable relative to the main body, and when pressed with a second load, the nozzle mounts the component on the board in a state where it is elevated relative to the main body compared to when pressed with the first load.

[0015] According to a third aspect of the present disclosure, in the component mounting device of the first or second aspect, the control unit controls the pressure adjustment unit so that, when pressing with a second load, the pressure in the pressure chamber becomes a second pressure that is smaller than the first pressure.

[0016] According to a fourth aspect of the present disclosure, in the component mounting device of any one of the first to third aspects, when pressed with the second load, the upper end of the nozzle comes into contact with the lower end of the main body portion.

[0017] According to a fifth aspect of the present disclosure, in the component mounting device of the second aspect, when pressing with a second load, the control unit controls the head lifting mechanism so that the pressing head is lowered toward the substrate by an amount that also corresponds to the amount by which the nozzle is raised relative to the main body.

[0018] According to a sixth aspect of the present disclosure, the component mounting device of any one of the first to fifth aspects further includes a memory unit that stores load data linking the type of component to be mounted on the substrate with either a first load value or a second load value set for each type of component. The control unit controls the pressure adjustment unit and the head lifting mechanism based on the load data.

[0019] According to a seventh aspect of the present disclosure, in the component mounting device of any one of the first to sixth aspects, the head lifting mechanism includes a ball screw, a rotary motor that rotates the ball screw, and a nut that engages with the ball screw and moves along the ball screw as the ball screw rotates. The nut supports the pressing head.

[0020] A component mounting system according to an eighth aspect of the present disclosure includes a component mounting device and a processing device that communicates with the component mounting device via a communications network. The component mounting device includes a press head having a nozzle for pressing a component against a substrate while holding the component at its lower end and a main body having an internal pressure chamber capable of biasing the nozzle toward the substrate, a head lifting mechanism for raising and lowering the press head, and a pressure adjusting unit for adjusting the pressure within the pressure chamber. The processing device includes a control unit that drives and controls the head lifting mechanism and the pressure adjusting unit. The control unit controls the pressure adjusting unit so that the pressure within the pressure chamber becomes a first pressure that generates the first load when pressing the component against the substrate with a first load that is smaller than a set load, and controls the head lifting mechanism so that the pressure within the pressure chamber becomes a first pressure that generates the first load when pressing the component against the substrate with a second load that is equal to or greater than the set load.

[0021] With this configuration, when a component presses against the board with a load smaller than the set load, the pressure adjustment unit adjusts the pressure in the pressure chamber to adjust the small pressing force. Furthermore, when a component presses against the board with a load larger than the set load, the head lift mechanism presses the component against the board, making it possible to mount even inset components onto the board, which was previously difficult to do using air pressure. In this way, a component mounting system can be provided that increases the variety of components that can be mounted onto the board.

[0022] According to a ninth aspect of the present disclosure, in the component mounting system of the eighth aspect, the nozzle is displaceable relative to the main body in accordance with the pressure in the pressure chamber, and when pressed with the second load, the nozzle mounts the component on the board in a state where it is elevated relative to the main body compared to when pressed with the first load.

[0023] According to a tenth aspect of the present disclosure, in the component mounting system of the eighth or ninth aspect, the control unit controls the pressure adjustment unit so that when pressing with a second load, the pressure in the pressure chamber becomes a second pressure that is smaller than the first pressure.

[0024] According to an eleventh aspect of the present disclosure, in the component mounting system of any one of the eighth to tenth aspects, when pressed with a second load, the upper end of the nozzle comes into contact with the lower end of the main body portion.

[0025] According to a twelfth aspect of the present disclosure, in the component mounting system of the ninth aspect, when pressing with the second load, the control unit controls the head lifting mechanism so that the pressing head is lowered toward the substrate by the amount that the nozzle is raised relative to the main body.

[0026] According to a thirteenth aspect of the present disclosure, in the component mounting system of any one of the eighth to twelfth aspects, the processing device further includes a memory unit that stores load data linking the type of component to be mounted on the substrate with either a first load value or a second load value set for each type of component. The control unit controls the pressure adjustment unit and the head lifting mechanism based on the load data.

[0027] A component mounting method according to a fourteenth aspect of the present disclosure includes a determining step in which a control unit determines, based on load data, whether a component to be mounted on a board is a component to be mounted with a first load that is smaller than a set load, or a component to be mounted with a second load that is equal to or greater than the set load, a pressing head lowering step in which a head lifting mechanism lowers a pressing head having a nozzle that has adsorbed the component relative to the board to bring the component into contact with the board, and an air pressure adjusting step in which a pressure adjusting unit in an electro-pneumatic regulator adjusts, in accordance with the type of component, the air pressure in a pressure chamber that can urge the nozzle toward the board before the component comes into contact with the board. If the component is a component to be mounted on the board with the first load, in the air pressure adjusting step, the control unit controls the pressure adjusting unit so that the pressure in the pressure chamber becomes a first pressure that generates the first load, and if the component is a component to be mounted on the board with a second load, the control unit controls the head lifting mechanism so that the component is pressed against the board with the second load.

[0028] According to this method, when a component presses against the board with a load smaller than the set load, the pressure adjustment unit adjusts the pressure in the pressure chamber to adjust the small pressing force. Furthermore, when a component presses against the board with a load larger than the set load, the head lift mechanism presses the component against the board, making it possible to mount even inset components onto the board, which was previously difficult to do using air pressure. In this way, a component mounting method can be provided that increases the variety of components that can be mounted on a board.

[0029] According to a 15th aspect of the present disclosure, in the component mounting method of the 14th aspect, the control unit controls the pressure adjustment unit so that when pressing the component with a second load, the pressure in the pressure chamber becomes a second pressure that is smaller than the first pressure.

[0030] Hereinafter, exemplary embodiments of a component mounting device according to the present disclosure will be described with reference to the accompanying drawings. The present disclosure is not limited to the specific configurations of the following embodiments, and configurations based on similar technical ideas are also included in the present disclosure.

[0031] (Embodiment 1) An embodiment of the present disclosure will be described below with reference to Fig. 1. Fig. 1 is a plan view showing a schematic configuration of a component mounting device 1. Hereinafter, the movement direction of the substrate 3 is referred to as the X-axis direction (left-right direction), the direction perpendicular to the movement direction of the substrate 3 is referred to as the Y-axis direction (front-back direction), and the up-down direction is referred to as the Z-axis direction. The X-axis direction, Y-axis direction, and Z-axis direction are perpendicular to each other.

[0032] Component mounting device 1 according to the embodiment of the present disclosure includes base 1a, board transport mechanism 2, component supply unit 4, head assembly 10, electro-pneumatic regulator 40, head camera 13, component recognition camera 14, and control unit 16. Component mounting device 1 mounts components 50 supplied by component supply unit 4 onto board 3 transported by board transport mechanism 2.

[0033] The base 1a is a member that supports the component mounting device 1, which extends in the XY plane. Two Y-axis tables 8 that extend along the Y-axis are arranged on the upper surface of the base 1a, at both ends of the base 1a in the X-axis direction. A beam 9 that extends along the X-axis is connected to the two Y-axis tables 8. The beam 9 can move in the Y direction by moving along the two Y-axis tables 8. The Y-axis tables 8 and the beam 9 are equipped with linear drive mechanisms.

[0034] The board transport mechanism 2 is installed along the X-axis at the center of the base 1a. The board transport mechanism 2 transports the board 3 from upstream along the X-axis, and positions and holds it at a mounting position where the mounting of components 50 is performed. The board transport mechanism 2 also transports the board 3 downstream along the X-axis after the mounting of components 50 has been completed. The board transport mechanism 2 includes, for example, a motor and a conveyor.

[0035] The component supply units 4 are installed on both sides (front and rear directions of the Y axis) of the board transport mechanism 2. Each component supply unit 4 has multiple tape feeders 5 attached in parallel along the X axis. The components supplied by the component supply units 4 include components 50a supplied by the tape feeders 5 and components 50b which are larger than the components 50a and difficult to supply by the tape feeders 5. When the components 50a and 50b are described collectively, they will be simply referred to as components 50.

[0036] One of the component supply units 4 is also equipped with a tray feeder 7. The tray feeder 7 supplies a plurality of trays 6 containing components 50b including connectors to a component pick-up position. Note that the component supply unit 4 may include a component supply device other than the tape feeder 5 and tray feeder 7 described above, such as a stick feeder.

[0037] The tape feeder 5 feeds a carrier tape, on which pockets for storing components 50a are formed, in a direction from outside the component supply unit 4 toward the board transport mechanism 2. When the component 50a stored on the carrier tape reaches the component removal position, the head assembly 10 picks up the component 50a.

[0038] The head assembly 10 is attached to the beam 9 so as to be movable along the X axis. Because the beam 9 is movable along the Y axis, the head assembly 10 is movable in the XY plane relative to the base 1a. The head assembly 10 in the first embodiment has, for example, three pressing heads 11 and three head lifting mechanisms 31 that raise and lower each pressing head 11 in the vertical direction. A nozzle 27 is detachably attached to the tip of the lower end of each pressing head 11.

[0039] The press head 11 holds the components 50 in the component supply unit 4 and mounts the components 50 supplied from the component supply unit 4 onto the board 3. The press head 11 is movable between the component supply position of the component supply unit 4 and the board 3 by the head assembly 10. The structures of the press head 11 and the head lifting mechanism 31 will be described in detail below.

[0040] Here, the Y-axis table 8 and the beam 9 together constitute a head moving mechanism 12. Furthermore, the head moving mechanism 12 and the head assembly 10 constitute a component mounting mechanism that performs a component mounting operation of mounting components 50 taken out from the component supply unit 4 onto the substrate 3.

[0041] The electropneumatic regulator 40 adjusts the amount of air supplied to each pressing head 11 of the head assembly 10, i.e., the air pressure of the balloon 22 arranged inside the pressing head 11, in accordance with the load commanded by the control unit 16.

[0042] Head camera 13 is disposed on the underside of beam 9 and moves integrally with head assembly 10. Head camera 13 recognizes the position of a board mark (not shown) provided on board 3. More specifically, head camera 13 moves together with head assembly 10 above board 3 positioned at the loading operation position of board transport mechanism 2 and recognizes the position of the board mark.

[0043] The component recognition camera 14 is disposed between the board transport mechanism 2 and the component supply unit 4. When the head assembly 10 holding the component 50 taken out from the component supply unit 4 passes above the component recognition camera 14, the component recognition camera 14 captures an image of the component 50 from below. Taking into account the recognition results of the board 3 by the head camera 13 and the recognition results of the component 50 by the component recognition camera 14, the mounting position of the component 50 on the board 3 is corrected.

[0044] The control unit 16 controls each operation of the component mounting device 1. The control unit 16 is a circuit configured with semiconductor elements, such as a CPU, processor, MPU, or FPGA, and also includes a storage unit 17. The storage unit 17 is a storage device configured with at least one of a memory, a hard disk, an SSD (Solid State Device), etc., and stores the processing program of the control unit 16. The control unit 16 may perform each control function of the component mounting operation, etc., by executing the program stored in the storage unit 17. The control unit 16 is not limited to a device that realizes a predetermined function through cooperation between hardware and software, but may also be a hardware circuit designed specifically to realize the predetermined function.

[0045] (Pressing head) Next, the configuration of the pressing head 11 will be described in more detail with reference to Fig. 2. Fig. 2 is a side view of the pressing head 11.

[0046] 2, the pressing head 11 includes a main body 19, a piston 23, and a nozzle 27. The main body 19 includes a housing 20, an air supply hose 21, a balloon 22, a cylinder 24, a bearing 26, a nozzle rotation motor 28, and a rotary joint 29.

[0047] The housing 20 accommodates a balloon 22, a piston 23, a cylinder 24, a bearing 26, and a rotary joint 29. The lower portions of the piston 23 and the cylinder 24 protrude downward from the lower surface of the housing 20.

[0048] The air supply hose 21 is a hose member that supplies air from the electropneumatic regulator 40 to the balloon 22. The air supply hose 21 extends from the top of the housing 20 toward the inside of the housing 20 and is connected to the balloon 22 via a rotary joint 29.

[0049] The balloon 22 is an inflatable, bag-shaped member made of rubber or resin, and constitutes a pressure chamber. The balloon 22 is made of, for example, Bellofram. When air is supplied to the balloon 22 through the air supply hose 21, the air pressure P inside the balloon 22 increases, causing the balloon 22 to expand. Conversely, when the air inside the balloon 22 is exhausted through the air supply hose 21, the air pressure P inside the balloon 22 decreases, causing the balloon 22 to contract.

[0050] Piston 23 is a rod-shaped member, and is disposed inside housing 20 so that the upper end of piston 23 abuts against the lower part of balloon 22. Piston 23 receives a downward force from the lower part of balloon 22 in accordance with the air pressure P inside balloon 22. Stopper 23a is provided on the upper part of piston 23, and when piston 23 receives a downward force from balloon 22 and moves down, the lower end of stopper 23a abuts against step 24b provided inside cylinder 24, restricting the downward movement of piston 23.

[0051] The cylinder 24 holds the piston 23 so that it can move along the Z axis. More specifically, a spline groove is formed on the inner peripheral surface of the cylinder 24, and the piston 23 is held via the spline groove so that it can be displaced in the up and down direction.

[0052] The bearings 26 rotatably hold the cylinder 24 relative to the housing 20. A plurality of bearings 26 are disposed between the cylinder 24 and the housing 20.

[0053] The nozzle rotation motor 28 rotates the cylinder 24, thereby rotating the balloon 22, the piston 23, the nozzle 27, and the component 50 sucked onto the nozzle 27.

[0054] The rotary joint 29 is a rotating device that supplies air flowing through an air supply hose 21 fixed to the main body 19 to a balloon 22 that can rotate together with a cylinder 24.

[0055] Nozzle 27 is provided at the lower end of piston 23 and is a member that suctions component 50. Nozzle 27 includes a cylindrical portion 27a and a suction tube 27b that penetrates cylindrical portion 27a and extends downward from cylindrical portion 27a. A suction opening 27c of nozzle 27 opens at the lower surface of suction tube 27b. The lower end of suction tube 27b abuts against the upper surface of component 50. When control unit 16 connects suction opening 27c to a vacuum source (not shown) while suction tube 27b abuts against the upper surface of component 50, component 50 is sucked onto suction tube 27b.

[0056] (Head lifting mechanism) The head lifting mechanism 31 includes a ball screw 32 , a rotary motor 33 , a nut 34 , and a support member 35 .

[0057] The head lifting mechanism 31 raises and lowers the pressing head 11 in the vertical direction to position the pressing head 11 in the height direction. When the head lifting mechanism 31 presses the component 50b against the substrate 3 with a pressure higher than the air pressure of the balloon 22, the head lifting mechanism 31 presses the nozzle 27 together with the pressing head 11 toward the substrate 3.

[0058] The rotation motor 33 rotates the ball screw 32, thereby displacing the nut 34 engaged with the ball screw 32 in the vertical direction. For example, when the ball screw 32 rotates forward, the nut 34 moves downward, and when the ball screw 32 rotates reversely, the nut 34 moves upward.

[0059] The nut 34 is connected to a support member 35 that supports the press head 11. The support member 35 is, for example, a metal member. Since the nut 34 and the press head 11 are integrated via the support member 35, the press head 11 also moves up and down as the nut 34 moves up and down. As a result, the control unit 16 can control the rotational drive amount of the rotary motor 33, thereby controlling the position of the press head 11 in the height direction.

[0060] (Electro-pneumatic regulator) 2, the pressing head 11 is connected to an electropneumatic regulator 40. The electropneumatic regulator 40 adjusts the air pressure P in the balloon 22 of the pressing head 11 in accordance with an input voltage V. The electropneumatic regulator 40 has a measuring unit 41 and a pressure adjusting unit 42.

[0061] The measuring unit 41 measures the air pressure P inside the balloon 22. The measuring unit 41 is, for example, an air pressure sensor. The measuring unit 41 outputs a detected voltage based on the measured air pressure of the balloon 22 to the pressure adjusting unit 42 and the control unit 16. The detected voltage based on the air pressure is a detected voltage converted from the air pressure in accordance with the proportional relationship between the air pressure inside the balloon 22 and the detected voltage in the electro-pneumatic regulator 40.

[0062] Specifically, the conversion formula between the detected voltage V and the air pressure P can be written as the following formula (1). V=αP+β (α and β are constants)...(1) Therefore, the detected voltage V can be obtained based on the air pressure P. In the first embodiment, the detected voltage V is equal to or greater than 1 V and equal to or less than 5 V, and the air pressure P is equal to or greater than 0 MPa and equal to or less than 0.5 MPa, and can be written as V=8P+1.

[0063] The pressure adjustment unit 42 has a plurality of valves (not shown) and actuators connected to each valve. The valves of the pressure adjustment unit 42 are connected to an air supply source (not shown) to supply air into the balloon 22. Air at a pressure higher than atmospheric pressure, for example, 5 atmospheres, is supplied to the pressure adjustment unit 42 from the air supply source, and the pressure is adjusted by the valve to supply air at 2 to 3 atmospheres to the balloon 22. The valves of the pressure adjustment unit 42 are also connected to the outside air to exhaust air from the inside of the balloon 22. When the first load F1 is determined by the control unit 16, a first voltage V1 corresponding to the commanded first load F1 is input to the pressure adjustment unit 42.

[0064] The pressure adjusting unit 42 adjusts the pressure inside the balloon 22 so that the air pressure P inside the balloon 22 reaches a first air pressure P1 corresponding to a first voltage V1 from the load command unit 52 of the control unit 16. More specifically, the pressure adjusting unit 42 operates the actuator in accordance with the first voltage V1 to change the opening degree of the valve, thereby causing the air pressure P inside the balloon 22 to reach the first air pressure P1. Furthermore, in order to maintain the air pressure P at the first air pressure P1, the pressure adjusting unit 42 performs feedback control based on the detected voltage V output from the measuring unit 41.

[0065] Here, the load F applied to the component 50 corresponds to the detected voltage V in the electro-pneumatic regulator 40 and the air pressure P inside the balloon 22 .

[0066] (Control unit) The control unit 16 will be described with reference to Fig. 3. The control unit 16 is connected to the board transport mechanism 2, the component supply unit 4, the pressing head 11, the head moving mechanism 12, the head camera 13, the component recognition camera 14, the head lifting mechanism 31, and the electro-pneumatic regulator 40 so as to be able to communicate with them.

[0067] The control unit 16 includes a storage unit 17, a component mounting processing unit 51, a load command unit 52, and a head lift control unit 53. The storage unit 17 stores a production program 55.

[0068] In mounting components, component mounting processing unit 51 controls the operations of board transport mechanism 2, component supply unit 4, pressing head 11, head moving mechanism 12, head camera 13, and component recognition camera 14 based on production program 55 in memory unit 17 to align component 50 with board 3 and mount component 50 on board 3. Component mounting processing unit 51 matches the position and orientation of component 50 to the mounting position on the surface of board 3, and mounts component 50 at the mounting position.

[0069] Based on the production program 55, the load command unit 52 determines whether the component 50 to be placed on the board 3 is a component 50a that should be placed with a low load, or a component 50b that should be placed with a higher load. If the load command unit 52 determines that the component 50 is a component 50a that should be placed with a low load, it further determines a first load F1 for the component 50a to be input to the electro-pneumatic regulator 40 based on the production program 55. The first load F1 is the value of the load required to place the component 50a on the board 3.

[0070] Head lift control unit 53 adjusts the height of press head 11 by controlling head lift mechanism 31 based on production program 55. When load command unit 52 determines that component 50 is component 50a that should be mounted with a low load, head lift control unit 53 lowers press head 11 by the amount of lowering to the height position of press head 11 in the case of low load mounting, based on production program 55 and set load data 57.

[0071] When the load command unit 52 determines that the component 50 is a component 50a that should be loaded with a heavy load, the head elevation control unit 53 lowers the press head 11 by the amount of lowering of the press head 11 required for loading with a heavy load, based on the production program 55 and the set load data 57. The amount of lowering for loading with a heavy load also includes the amount of pressing by the press head 11.

[0072] The production program 55 stored in the storage unit 17 includes on-board load data 56 and set load data 57 .

[0073] The applied load data 56 includes applied load data required for mounting each type of component 50 onto the board 3. The applied load data 56 also includes a table 58 of air pressure and load and a table 59 of pressure amount and load.

[0074] The air pressure and load table 58 is data necessary for controlling the electro-pneumatic regulator 40, and is a table that links the air pressure, which is the pressure inside the balloon 22 when a low load is loaded, with the magnitude of the load applied to the substrate 3 from the nozzle 27 when the air pressure inside the balloon 22 is at that level.

[0075] The table 59 of the pushing amount and load is data required when the head lifting mechanism 31 pushes the component 50b into the substrate 3, and is a table that links the pushing amount that the nozzle 27 pushes into the substrate 3 by the head lifting mechanism 31 when a high load is loaded with the magnitude of the applied load.

[0076] The set load data 57 is data that serves as a criterion for determining whether the component 50 to be mounted by the load command unit 52 is a component 50a that should be mounted with a low load or a component 50b that should be mounted with a high load. The set load data 57 is, for example, 25 N. In this case, for a component 50a such as a surface-mount component, the component 50a is pressed onto the board 3 with a load greater than 0 N and less than 25 N. For a component 50b such as a press-fit component, the component 50b is pressed onto the board 3 with a load of 25 N or more. The mounting load data 56 and the set load data 57 for each component 50 are compared to determine whether each component 50 should be mounted with a low load or a high load.

[0077] The production program 55 also includes at least one of information about the component 50, information about the board 3, and information about the component mounting device 1. The information about the component 50 includes, for example, the first load F1 of the component 50 and the type of the component 50. The information about the board 3 includes, for example, the identification information of the board 3, the mounting position of the component 50 on the board 3, the mounting order of the component 50, and the types of components already mounted on the board 3 before the component 50. The information about the component mounting device 1 includes, for example, the type of the nozzle 27, the identification information of the nozzle 27, the suction pressure, etc.

[0078] Although one control unit 16 controls both the head lifting mechanism 31 and the electro-pneumatic regulator 40, a control unit may be provided for each of the head lifting mechanism 31 and the electro-pneumatic regulator 40, and each control unit may control them individually.

[0079] (Mounting operation) Next, referring to Figures 2 and 4 to 6, we will explain the general operation of the press head 11 to mount the component 50 on the substrate 3 depending on the type of component 50. Figure 4 is a flowchart showing the flow of component mounting. Figure 5 is a side view of the head assembly 10 when mounting the component 50a with a low load. Figure 6 is a side view of the head assembly 10 when mounting the component 50b with a high load.

[0080] First, the head assembly 10 moves to the component pick-up position of the component supply unit 4, and in accordance with the production program 55, the nozzle 27 of the pressing head 11 picks up and holds the component 50 that is to be supplied to the component pick-up position.

[0081] In step S1, the load command unit 52 of the control unit 16 refers to the production program 55 and acquires the loading load data of the component 50 based on the loading load data 56 of the component 50 to be mounted on the board 3.

[0082] Next, in step S2, the load command unit 52 compares the acquired applied load data with the set load data 57 to determine whether or not the component 50 to be applied to the board 3 is applied with a low load. If the load command unit 52 determines that the component 50 is a component 50a for low load application (Yes in step S1), the load command unit 52 sends an instruction to the head elevation control unit 53 to apply a low load.

[0083] Next, in step S3, the load command unit 52 determines a first load F1 based on information about the component 50a held by the nozzle 27 and the air pressure-load table 58, and adjusts the air pressure P in the balloon 22 to a first air pressure P1 in accordance with the determined first load F1 (S3). Specifically, the load command unit 52 converts the first load F1 into a first voltage V1 and inputs the first voltage V1 to the electro-pneumatic regulator 40. In accordance with the input first voltage V1, the pressure adjustment unit 42 adjusts the opening of a valve (not shown) connected to an air supply source to adjust the air pressure P inside the balloon 22 to the first air pressure P1.

[0084] In parallel with step S3, the component mounting processing unit 51, based on the production program 55, moves the pressing head 11 holding the component 50a to a descent start position above the mounting position on the substrate 3, rotates it in a predetermined direction, and aligns the component 50a with the mounting position.

[0085] Next, in step S4, upon receiving the instruction to mount a low load, head lift control unit 53 controls and drives head lift mechanism 31 to lower nut 34 and press head 11 from the descent start position to mounting position H1 toward board 3, as shown in Fig. 5. Mounting position H1 is a height set for each component 50a, and is included in production program 55 in association with information about component 50a.

[0086] When the nut 34 and the pressing head 11 reach the mounting position H1, the head elevation control unit 53 stops the supply of current to the rotary motor 33, and the rotary motor 33 stops generating torque. Upon reaching the mounting position H1, the component 50a held by the nozzle 27 comes into contact with the substrate 3. The component 50a receives a reaction force Nd from the substrate 3, which pushes the piston 23 back toward the balloon 22. In other words, in response to the reaction force Nd from the substrate 3, the nozzle 27 rises a distance La relative to the main body 19, and as a result, the air pressure P inside the balloon 22 rises to air pressure P1+ΔP (=P2).

[0087] In step S5, when the measurement unit 41 detects that the air pressure P in the balloon 22 has increased to air pressure P2, the load command unit 52 controls the pressure adjustment unit 42 so that the pressure in the balloon 22 maintains the detected air pressure P2. As a result, the air pressure P in the balloon 22 is maintained at air pressure P2, and the piston 23 receives a force from the balloon 22 from above due to air pressure P2 and a reaction force Nd from the substrate 3 from below. The force from air pressure P2 and the reaction force Nd are balanced. Therefore, the component 50a continues to be pressed against the substrate 3 by air pressure P2 for a certain period of time, and the component 50a is mounted on the substrate 3. Note that the pressure in the balloon 22 may be maintained at air pressure P1 even after the nozzle 27 rises relative to the main body 19. Although the piston 23 is pushed back by the reaction force Nd from the substrate 3 a distance La, it is not pushed back any further, and therefore the component 50a can continue to be pressed against the substrate 3 by air pressure P1 for a certain period of time.

[0088] Next, the component mounting processing unit 51 cuts off the connection between the suction tube 27b and the vacuum source, and when the nozzle 27 stops suctioning the component 50a, in step S6, the head lifting control unit 53 drives and controls the head lifting mechanism 31 to raise the pressing head 11, and the pressing head 11 moves away from the substrate 3.

[0089] In step S2, when the load command unit 52 determines that the component 50 is a component 50b for heavy load application (No in step S1), the load command unit 52 sends an instruction to the head elevation control unit 53 to apply a heavy load.

[0090] Next, in step S7, the load command unit 52 determines a second load F2 based on the applied load data 56. When a heavy load is being applied, the load command unit 52 adjusts the air pressure P in the balloon 22 to a second air pressure P0 (S7). Here, the second air pressure P0 is smaller than the first air pressure P1 when a light load is being applied, and may be, for example, the minimum amount required to maintain a state in which the piston 23 is protruding downward by the balloon 22 in order to act as an air cushion when suctioning the component 50.

[0091] In parallel with step S7, the component mounting processing unit 51, based on the production program 55, moves the pressing head 11 holding the component 50b to a descent start position above the mounting position on the substrate 3, rotates it in a predetermined direction, and aligns the component 50b with the mounting position.

[0092] Next, in step S8, upon receiving the instruction to mount a heavy load, head lift control unit 53 controls the drive of head lift mechanism 31 to lower nut 34 and press head 11 from the descent start position toward substrate 3 to mounting position H2, as shown in FIG. 5. Load command unit 52 controls the amount of current supplied to rotation motor 33 based on table 59 of push-in amount and load in accordance with the determined second load F2, causing rotation motor 33 to generate load F2. Mounting position H2 is a height set for each component 50b, and is included in production program 55 in association with information about component 50b.

[0093] When the nut 34 and the pressing head 11 reach the mounting position H2, the component 50a held by the nozzle 27 comes into contact with the board 3. The component 50a receives a reaction force Nd from the board 3. Because the reaction force Nd is greater than the air pressure P0 inside the balloon 22, the piston 23 is pushed back toward the balloon 22 by the reaction force Nd. That is, the nozzle 27 receives the reaction force Nd from the board 3 and rises relative to the main body 19. At this time, because the air pressure P inside the balloon 22 is a low value, air pressure P0, the upper end of the nozzle 27 pushes up the balloon 22 even if the pressure inside the balloon 22 rises.

[0094] 2, the distance from the lower end 24a of the cylinder 24 to the upper end 27aa of the tubular portion 27a of the nozzle 27 is designated as Lb. When the piston 23 rises the distance Lb relative to the main body 19, the upper end 27aa of the tubular portion 27a of the nozzle 27 comes into contact with the lower end 24a of the cylinder 24, and the rise of the piston 23 stops, as shown in FIG. 6. In this state, the reaction force Nd from the substrate 3 is transmitted to the main body 19 of the pressing head 11 via the upper end of the nozzle 27, preventing the cylinder 24 from crushing the balloon 22 against the upper surface of the cylinder 24 and damaging it.

[0095] In this way, in the case of heavy load mounting, the press head 11 is lowered an additional distance Lb. That is, the mounting position H2 in heavy load mounting is smaller than the mounting position H1 in light load mounting. If the component 50a in light load mounting and the component 50b in heavy load mounting are at the same height, the press head 11 is closer to the board 3 in heavy load mounting than in low load mounting.

[0096] In step S9, when the nut 34 and press head 11 reach mounting position H2, the head lift control unit 53 continues to supply current to the rotary motor 33 according to the type of component 50b based on the table 59 of the pressing amount and load. The rotary motor 33 generates a rotational torque sufficient to move the nut 34 and press head 11 slightly downward from mounting position H2, and maintains torque generation by the rotary motor 33. This prevents the nozzle 27, which has contacted the lower end 24a of the cylinder 24 due to the reaction force Nf, from further rising. The nozzle 27 receives a downward force from above due to the rotational torque of the head lift mechanism 31, and also receives a reaction force Nf from below due to the substrate 3. The force from the head lift mechanism 31 and the reaction force Nf are balanced. Therefore, the component 50b continues to be pressed against the substrate 3 by the head lift mechanism 31 for a certain period of time, and the component 50b is mounted on the substrate 3.

[0097] Next, the component mounting processing unit 51 cuts off the connection between the suction tube 27b and the vacuum source, and when the nozzle 27 stops suctioning the component 50b, in step S6, the head lifting control unit 53 drives and controls the head lifting mechanism 31 to raise the pressing head 11, and the pressing head 11 moves away from the substrate 3.

[0098] (effect) The component mounting device 1 of this embodiment includes a press head 11 having a nozzle 27 that presses the component 50 against the substrate 3 while holding the component 50 at its lower end, and a main body 19 that includes a balloon 22 that can urge the nozzle 27 toward the substrate 3, a head lifting mechanism 31 that raises and lowers the press head 11, a pressure adjusting unit 42 that adjusts the pressure inside the balloon 22, and a control unit 16 that drives and controls the head lifting mechanism 31 and the pressure adjusting unit 42. When pressing the component 50a against the substrate 3 with a first load F1 that is smaller than the set load, the control unit 16 controls the pressure adjusting unit 42 so that the pressure inside the balloon 22 becomes a first air pressure P1 that generates the first load F1, and when pressing the component 50b against the substrate 3 with a second load F2 that is equal to or greater than the set load, the control unit 16 controls the head lifting mechanism 31 so that the component 50b against the substrate 3 is pressed with the second load F2.

[0099] Furthermore, the component mounting method of this embodiment includes a determination step (S2) in which the control unit 16 determines, based on the mounting load data 56, whether the component 50 to be mounted on the substrate 3 is a component 50a to be mounted with a first load F1 that is smaller than the set load, or a component 50b to be mounted with a second load F2 that is equal to or greater than the set load; a press head lowering step (S4, S8) in which the head lifting mechanism 31 lowers the press head 11 having the nozzle 27 that has adsorbed the component 50 toward the substrate 3, bringing the component 50 into contact with the substrate 3; and an air pressure adjustment step (S3, S7) in which the pressure adjustment unit 42 in the electro-pneumatic regulator 40 adjusts the pressure of the balloon 22 that can urge the nozzle 27 toward the substrate 3 in accordance with the type of component 50 before the component 50 comes into contact with the substrate 3. If the component 50 is a component 50a to be mounted on the substrate 3 with a first load F1, in the air pressure adjustment step (S3), the control unit 16 controls the pressure adjustment unit 42 so that the pressure inside the balloon 22 becomes a first air pressure P1 that generates the first load F1, and if the component 50 is a component 50b to be mounted on the substrate 3 with a second load F2, the control unit 16 controls the head lifting mechanism 31 so that the component 50b is pressed against the substrate 3 with the second load F2.

[0100] In the case of component 50a, whose load pressing against substrate 3 is smaller than the set load, pressure adjustment unit 42 adjusts the pressure inside balloon 22, thereby adjusting the small pressing force. In the case of component 50b, whose load pressing against substrate 3 is larger than the set load, head lifting mechanism 31 presses component 50b against substrate 3, making it possible to mount even inset components, which have traditionally been difficult to mount using air pressure, onto the substrate. In this way, a component mounting device 1 can be provided that increases the variety of components 50 that can be mounted on substrate 3.

[0101] Furthermore, nozzle 27 is displaceable relative to main body 19. When component 50b is pressed against board 3 with the second load, nozzle 27 places component 50b on board 3 in a state where it is elevated relative to main body 19 compared to when component 50a is pressed against board 3 with first load F1.

[0102] Furthermore, when the second load F2 is used to press the component 50b against the substrate 3, the control unit 16 controls the pressure adjustment unit 42 so that the pressure inside the balloon 22 becomes a second air pressure P0 that is smaller than the first air pressure P1. By making the pressure inside the balloon 22 smaller than the first air pressure P1 when the head lifting mechanism 31 presses the component 50b against the substrate 3, it is possible to reduce the loss of output from the rotary motor 33 due to the pressure of the balloon 22.

[0103] Furthermore, when the component 50b is pressed against the substrate 3 with the second load F2, the upper end 27aa of the cylindrical portion 27a, which serves as the upper end of the nozzle 27, comes into contact with the lower end 24a of the cylinder 24, which serves as the lower end of the main body 19. This allows the reaction force Nf from the substrate 3 to be received by the main body 19, and prevents the balloon 22 from being damaged by the rise of the nozzle 27.

[0104] Furthermore, when pressing component 50b against substrate 3 with second load F2, control unit 16 controls head lifting mechanism 31 to lower press head 11 toward substrate 3 by a distance Lb that corresponds to the distance by which nozzle 27 is raised relative to main body 19. This allows component 50b to be pressed against substrate 3 appropriately.

[0105] The component mounting device 1 further includes a memory unit 17 that stores a table 58 of air pressures and loads, which associates the types of components 50 to be mounted on the substrate 3 with either the value of the first load F1 or the value of the second load F2 set for each type of component 50. The control unit 16 controls the pressure adjustment unit 42 and the head lifting mechanism 31 based on the table 58 of air pressures and loads. This allows the components 50 to be pressed against the substrate 3 with either the first load F1 or the second load F2 appropriately depending on the type of component 50.

[0106] Furthermore, head lifting mechanism 31 includes ball screw 32, rotary motor 33 that rotates ball screw 32, and nut 34 that engages with ball screw 32 and moves along ball screw 32 as ball screw 32 rotates. Nut 34 supports pressing head 11. By using ball screw 32 in head lifting mechanism 31 that presses component 50b against substrate 3 with the second load, it is possible to output a large load that cannot be output by a linear motor, and this can be achieved with rotary motor 33 that is smaller than a voice coil motor.

[0107] [Embodiment 2] A component mounting system 100 according to a second embodiment of the present disclosure will be described with reference to Fig. 7. In the second embodiment, components that are the same as or equivalent to those in the first embodiment will be denoted by the same reference numerals. Furthermore, in the second embodiment, descriptions that overlap with those in the first embodiment will be omitted. Fig. 12 is a block diagram of the component mounting system 100 according to the second embodiment of the present disclosure.

[0108] In the second embodiment, the control of the load command that was executed by the component mounting device 1 of the first embodiment is executed by a processing device 150 external to the component mounting device 101. In the second embodiment, the component mounting device 101 is the same as the component mounting device 1 of the first embodiment unless otherwise specified.

[0109] 7, the component mounting system 100 includes a component mounting device 101 and a processing device 150. The component mounting device 101 includes a head assembly 10, an electro-pneumatic regulator 40, a control unit 116, and a first communication unit 110.

[0110] The control unit 116 includes a component mounting processing unit 51 and a storage unit. The control unit 116 may further include at least one of a load command unit 52 and a head elevation control unit 53.

[0111] The first communication unit 110 transmits information stored in a memory unit 117 in the control unit 116 via the communication network 120, and receives information stored in a memory unit 153 of the processing device 150. The first communication unit 110 includes a circuit that performs transmission to the second communication unit 151 of the processing device 150 in accordance with a predetermined communication standard (for example, LAN, Wi-Fi (registered trademark), Bluetooth (registered trademark)).

[0112] The processing device 150 includes a second communication unit 151 and a processing unit 152. The processing device 150 is, for example, a computer, a server, or a cloud.

[0113] The second communication unit 151 receives, via the network, the load information transmitted by the first communication unit 110 and information relating to the mounting environment of the component 50. The second communication unit 151 includes a circuit for receiving information from the first communication unit 110 of the component mounting device 101 in accordance with a predetermined communication standard (e.g., LAN, Wi-Fi (registered trademark), Bluetooth (registered trademark)).

[0114] Processing unit 152 includes load command unit 52, head lift control unit 53, and memory unit 17. Based on the information received by second communication unit 151, processing unit 152 performs steps S2, S3, S5, and S7.

[0115] A component mounting system 100 according to the second embodiment includes a component mounting device 101 and a processing device 150 that communicates with the component mounting device 101 via a communication network 120. The component mounting device 101 includes a press head 11 having a nozzle 27 for pressing the component 50 against the substrate 3 while holding the component 50 at its lower end and a main body 19 that includes a balloon 22 therein that can bias the nozzle 27 toward the substrate 3, a head lifting mechanism 31 that raises and lowers the press head 11, and a pressure adjusting unit 42 that adjusts the pressure inside the balloon 22. The processing device 150 includes a processing unit 152 that drives and controls the head lifting mechanism 31 and the pressure adjusting unit 42. When pressing the component 50a against the substrate 3 with a first load F1 that is smaller than the set load, the processing unit 152 controls the pressure adjustment unit 42 so that the pressure inside the balloon 22 becomes a first air pressure P1 that generates the first load F1, and when pressing the component 50b against the substrate 3 with a second load F2 that is equal to or greater than the set load, the processing unit 152 controls the head lifting mechanism 31 so that the component is pressed against the substrate with the second load F2.

[0116] Even if the load command and the control of the head lifting mechanism 31 are executed by a processing device 150 separate from the component mounting device 101, the same effects as those of the component mounting device 1 of the first embodiment can be obtained.

[0117] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various variations and modifications will be apparent to those skilled in the art. Such variations and modifications should be understood to be included within the scope of the present disclosure as defined by the appended claims, unless they depart therefrom. Furthermore, changes in the combination and order of elements in each embodiment may be made without departing from the scope and spirit of the present disclosure.

[0118] Any of the various embodiments and modifications described above may be combined as appropriate to achieve the effects of each. [Industrial Applicability]

[0119] The component mounting device according to the present disclosure is applicable to a component mounting device that mounts components supported by a carrier. [Explanation of symbols]

[0120] 1. Parts mounting device 1a Base 2. Substrate transport mechanism 3. Circuit Board 4. Parts Supply Department 5 Tape Feeder 6 trays 7 Tray Feeder 8 Y-axis table 9 Beam 10 Head Assembly 11 Pressing head 12 Head movement mechanism 13 Head Camera 14 Parts Recognition Camera 15 16 Control Unit 17 Memory section 18 19 Main body 20 Case 21 Air supply hose 22 Balloon 23 Piston 24 cylinders 24a bottom end 26 bearings 27 nozzles 27a Cylinder part 27aa top end 27b Adsorption tube 27c suction opening 28 Nozzle rotation motor 29 Rotary Joint 31 Head lifting mechanism 32 Ball screw 33 Rotary Motor 34 Nut 35 Support member 40 Electro-pneumatic regulator 41 Measurement section 42 Pressure adjustment section 50, 50a, 50b parts 51 Parts mounting processing section 52 Load command section 53 Head lift control section 55 Production Program 56 Load data 57 Set load data 58 Air Pressure and Load Table 59 Push-in and Load Table 100 parts mounting system 101 Parts mounting device 110 First Communications Department 116 Control Unit 117 Memory section 120 Communication Network 150 processing equipment 151 Second Communications Department 152 Processing section 153 Storage section

Claims

1. a press head having a nozzle that holds a component at a lower end and a main body that has a pressure chamber therein that can urge the nozzle toward the substrate; a head lifting mechanism that lifts and lowers the pressing head; a pressure adjusting unit that adjusts the pressure in the pressure chamber; a control unit that drives and controls the head lifting mechanism and the pressure adjusting unit, The control unit when pressing the component against the board with a first load that is smaller than a set load, controlling the pressure adjustment unit so that the pressure in the pressure chamber becomes a first pressure that generates the first load; When the component is pressed against the board with a second load that is equal to or greater than the set load, the head lifting mechanism is controlled so as to press the component against the board with the second load. Parts mounting device.

2. the nozzle is displaceable relative to the body; When pressing with the second load, the nozzle places the component on the board in a state where it is elevated relative to the main body portion compared to when pressing with the first load. The component mounting device according to claim 1 .

3. the control unit controls the pressure adjustment unit so that the pressure in the pressure chamber becomes a second pressure that is smaller than the first pressure when pressing with the second load. The component mounting device according to claim 2 .

4. When pressed with the second load, an upper end of the nozzle comes into contact with a lower end of the main body portion. The component mounting device according to claim 3.

5. the control unit controls the head lifting mechanism to lower the pressing head toward the substrate by an amount corresponding to the lifting of the nozzle relative to the main body when pressing with the second load. The component mounting device according to claim 2 .

6. a storage unit that stores load data that associates the type of the component to be mounted on the board with either the value of the first load or the value of the second load that is set for each type of the component, the control unit controls the pressure adjustment unit and the head lifting mechanism based on the load data.

6. The component mounting device according to claim 1.

7. The head lifting mechanism includes: A ball screw, a rotary motor that rotates the ball screw; a nut that engages with the ball screw and moves along the ball screw as the ball screw rotates; The nut supports the pressing head. The component mounting device according to claim 3.

8. a component mounting device; a processing device that communicates with the component mounting device via a communication network, The component mounting device a press head having a nozzle for pressing a component against a substrate while holding the component at a lower end thereof, and a main body portion having an internal pressure chamber capable of biasing the nozzle toward the substrate; a head lifting mechanism that lifts and lowers the pressing head; a pressure adjusting unit that adjusts the pressure in the pressure chamber, the processing device includes a control unit that controls the drive of the head lifting mechanism and the pressure adjusting unit, The control unit when pressing the component against the board with a first load that is smaller than a set load, controlling the pressure adjustment unit so that the pressure in the pressure chamber becomes a first pressure that generates the first load; When the component is pressed against the board with a second load that is equal to or greater than the set load, the head lifting mechanism is controlled so as to press the component against the board with the second load. Parts mounting system.

9. the nozzle is displaceable relative to the main body in response to pressure in the pressure chamber; When pressing with the second load, the nozzle places the component on the board in a state where it is elevated relative to the main body portion compared to when pressing with the first load. The component mounting system according to claim 8 .

10. the control unit controls the pressure adjustment unit so that the pressure in the pressure chamber becomes a second pressure that is smaller than the first pressure when pressing with the second load. The component mounting system according to claim 9 .

11. When pressed with the second load, an upper end of the nozzle comes into contact with a lower end of the main body portion. The component mounting system according to claim 10.

12. the control unit controls the head lifting mechanism to lower the pressing head toward the substrate by an amount corresponding to the lifting of the nozzle relative to the main body when pressing with the second load. The component mounting system according to claim 9 .

13. the processing device further includes a storage unit that stores load data that associates the type of component to be mounted on the board with either the value of the first load or the value of the second load that is set for each type of component; the control unit controls the pressure adjustment unit and the head lifting mechanism based on the load data.

13. The component mounting system according to claim 8.

14. a determining step in which the control unit determines, based on the load data, whether the component to be mounted on the board is a component to be mounted with a first load that is smaller than a set load, or a component to be mounted with a second load that is equal to or greater than the set load; a press head lowering step in which a head lifting mechanism lowers a press head having a nozzle that has sucked the component onto the substrate, thereby bringing the component into contact with the substrate; an air pressure adjusting step in which, before the component comes into contact with the substrate, a pressure adjusting unit in an electropneumatic regulator adjusts the air pressure in a pressure chamber capable of urging the nozzle toward the substrate in accordance with the type of the component; When the component is a component to be mounted on the substrate with the first load, in the air pressure adjusting step, the control unit controls the pressure adjusting unit so that the pressure in the pressure chamber becomes a first pressure that generates the first load; When the component is a component to be mounted on the board with the second load, the control unit controls the head lifting mechanism to press the component against the board with the second load. Parts mounting method.

15. the control unit controls the pressure adjustment unit so that the pressure in the pressure chamber becomes a second pressure that is smaller than the first pressure when the component is pressed with the second load. The component mounting method according to claim 14.

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