Internal Recirculating Cooling Module

Abstract

Improved cooling modules and methods are configured to recirculate liquid cooling fluid within the cooling module such that the same liquid cooling fluid impinges on the surface of a heat-generating electronic component (or a cooling plate in thermal communication with the heat-generating electronic component) multiple times before exiting the cooling module, thereby allowing a given flow of cooling fluid to be reused multiple times, each time reducing flow demands and reducing the infrastructure required to achieve higher performance in direct and indirect micro-convection impingement cooling applications.

Description

[Technical Field]

[0001] FIELD OF THE INVENTION The present invention relates generally to the field of liquid cooling modules for data centers, servers, power converters, and other liquid cooled computing assemblies, and more particularly to a micro-convection jet impingement liquid cooling device and method. [Background technology]

[0002] Related technologies The cooling performance of single-phase direct-chip liquid cooling (DLC) devices is typically measured in terms of heat transfer coefficient. Impingement cooling modules provide extremely high local heat transfer coefficients. The performance of a cooling module utilizing impingement cooling is determined by both flow rate and pressure drop. Compared to other more established cooling technologies (e.g., microchannel), impingement cooling performs best when the flow rate of the cooling module is two to four times higher than the established cooling technology. Employing impingement cooling modules offers inherent advantages, particularly a more uniform temperature distribution and no thermal resistance in the processor, even at relatively high flow consumption.

[0003] However, the existing cooling infrastructure in some applications may not be able to accommodate a two- to four-fold increase in flow rate. Therefore, the best performance of jet impingement cooling modules cannot be achieved in such environments. Therefore, jet impingement modules would benefit from the ability to reduce the required flow rate, ensuring more optimal impingement performance even at low flow rates. Summary of the Invention [Means for solving the problem]

[0004] Summary of the Invention Embodiments of the present invention provide improved cooling modules and methods for cooling heat-generating electronic components mounted on printed circuit boards found in servers and other data processing equipment. The improved cooling modules and methods are configured to recirculate liquid cooling fluid within the cooling module such that the same liquid cooling fluid impinges on the surface of the heat-generating electronic component (or a cooling plate in thermal communication with the heat-generating electronic component) multiple times before exiting the cooling module, thereby allowing a given flow of cooling fluid to be reused multiple times. Each reuse of the cooling fluid reduces the flow demand. For example, a single recirculation of cooling fluid in a cooling module constructed and operated in accordance with the devices and techniques described herein typically reduces the flow demand of that cooling module by approximately 50% without significantly reducing cooling performance. Recirculating the cooling fluid three times within the cooling module typically reduces the flow demand by 67%, and so on. Advantageously, internal recirculation implemented in accordance with the present invention does not increase the number of external seals required, reduces pressure losses during internal flow division, and allows for proper staging of impingement areas within the cooling module to address priority cooling areas on the chipset first.

[0005] Generally, embodiments of the present invention reduce the flow demands of a cooling module by implementing internal recirculation of liquid cooling fluid within the cooling module, such that the liquid cooling fluid impinges on the surface to be cooled multiple times before exiting the cooling module. Internal recirculation allows the exhaust fluid from a given section within the cooling module to be routed to the inlet of a second section without having to exit the cooling module housing. This technique of efficiently recovering and redirecting cooling fluid that has already impinged on the cooling surface allows the majority of the liquid cooling fluid to remain within the primary exterior sealing boundary of the cooling module for a longer period of time, with its cooling capacity still being effectively utilized. Thus, advantages of using embodiments of the present invention include, but are not limited to, the following: 1) The cooling fluid can be reused multiple times, significantly reducing flow demand. 2) Efficiently route the cooling fluid to minimize pressure loss in the branch flow. 3) Avoids the additional external seal failure points and pressure losses associated with externally recirculating the cooling fluid.

[0006] Cooling fluid passing through a cooling module constructed and operated in accordance with embodiments of the present invention is internally redirected multiple times after impingement so that it can be "reused" multiple times to cool multiple sections of the cooling surface. The cooling fluid is also accelerated multiple times against the surface to be cooled using micro-convection nozzle arrays. However, rather than being discharged from the cooling module after one impingement, the cooling fluid is recaptured and re-accelerated through additional micro-convection nozzle arrays in one or more additional stages. By connecting multiple micro-convection nozzle arrays of different sections in series, flow rates are reduced. In some embodiments, nozzle arrays of different sections can be connected in series and in parallel with each other.

[0007] The devices and techniques disclosed herein can be implemented in both direct and indirect cooling modules. Direct cooling modules apply coolant directly to the surface of a heat source, causing heat conduction. Indirect cooling modules apply coolant to a plate that is part of the cooling module and is in thermal contact with the heat source, causing heat conduction.

[0008] In one embodiment, the present invention provides a cooling module comprising a jet plate, a housing, a ceiling between the jet plate and the housing, a base plate, a fastening system, and the fastening system for mounting the cooling module to a circuit board (or server) including heat-generating electronic components. The jet plate has an upper surface, a lower surface, a first segment including a first microjet nozzle array extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate, and a second segment including a second microjet nozzle array extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate. The ceiling disposed between the jet plate and the housing comprises a first ceiling mounting boundary extending from the ceiling to the upper surface of the jet plate and a second ceiling mounting boundary extending from the ceiling to the upper surface of the jet plate. The base plate comprises a cooling surface, a first cooling surface mounting boundary extending from the cooling surface to the lower surface of the jet plate, and a second cooling surface mounting boundary extending from the cooling surface to the lower surface of the jet plate.

[0009] The jet plate, ceiling, base plate cooling surface, first ceiling mounting boundary, second ceiling mounting boundary, first cooling surface mounting boundary, and second cooling surface mounting boundary are all arranged to define a first inlet plenum disposed between the ceiling and the first microjet nozzle array, a second inlet plenum disposed between the ceiling and the second microjet nozzle array, a first impingement space disposed between the first microjet nozzle array and the cooling surface, a second impingement space disposed between the second microjet nozzle array and the cooling surface, and a first couch passage fluidly connecting the first impingement space to the second inlet plenum.

[0010] A fastening system (which may include, for example, screws, pins, or a tensioner plate) attaches the cooling module to a circuit board, which has one or more heat-generating electronic components attached to it. In one embodiment, the fastening system attaches the cooling module to the circuit board so that the cooling surface of the base plate is in direct thermal communication with the one or more heat-generating electronic components on the circuit board. In this configuration, the cooling surface of the base plate can absorb heat generated by the heat-generating electronic components during operation of the circuit board.

[0011] The cooling module also includes an inlet fitting attached to the housing, the inlet fitting configured to admit pressurized cooling fluid into the cooling module from an external source, such as an external pump or a central distribution unit (CDU). An inlet flow channel internal to the cooling module carries the pressurized cooling fluid from the inlet fitting to a first inlet plenum. As the pressurized cooling fluid enters the first inlet plenum, a first array of microjet nozzles in a first segment of the jet plate is configured to receive the pressurized cooling fluid from the first inlet plenum, accelerate the pressurized cooling fluid, and, in so doing, direct the accelerated pressurized cooling fluid to enter a first impingement space below the jet plate at high velocity and impact a first portion of a cooling surface of the base plate, thereby removing heat absorbed by the first portion of the cooling surface from the one or more heat-generating electronic components.

[0012] The couch passage is then configured to convey a portion of the pressurized cooling fluid that impacted the first portion of the cooling surface from the first impingement space into the second inlet plenum, and the second microjet nozzle array in the jet plate then draws the pressurized cooling fluid from the second inlet plenum, accelerates the pressurized cooling fluid, and directs the accelerated pressurized cooling fluid at high velocity into the second impingement space to impact the second portion of the cooling surface of the base plate, thereby removing heat absorbed by the second portion of the cooling surface from the one or more heat-producing electronic components.

[0013] In a preferred embodiment, the cooling module of the present invention also includes one or more exhaust collection passages that capture a portion of the pressurized cooling fluid in the first impingement space and the second impingement space and route the captured pressurized cooling fluid to an outlet fitting attached to the housing for discharge from the cooling module.

[0014] In particular, the ceiling may or may not be manufactured as an integral part of the housing. In some embodiments, the cooling module of the present invention may include an intervening plate disposed between the housing and the jet plate, with the ceiling being integrated into the intervening plate instead of the housing.

[0015] In another embodiment, the base plate of the cooling module has openings on its underside instead of a cooling surface, which allows the cooling fluid accelerated by the microjet array in the jet plate to make multiple direct impacts on the surface of the heat-generating electronic component instead of impinging on a cooling surface in thermal contact with the heat-generating electronic component. After the first impact, the cooling fluid is then carried by the couch passage to a downstream inlet plenum where it is accelerated and directed by a second (or third or fourth) microjet nozzle array in the jet plate for a second (or third or fourth) direct impact on another portion of the heat-generating component.

[0016] In yet another embodiment, a method for cooling one or more heat-generating electronic components mounted on a circuit board is provided. Step 1 of the method is to provide a cooling module including a jet plate, a housing, a ceiling disposed between the jet plate and the housing, a base plate having a cooling surface, and a fastening system for fastening the cooling module to the circuit board. In this step, the jet plate includes a first segment including a first microjet nozzle array extending through the jet plate and a second segment including a second microjet nozzle array extending through the jet plate. The jet plate, ceiling, base plate cooling surface, first ceiling mounting boundary, second ceiling mounting boundary, first cooling surface mounting boundary, and second cooling surface mounting boundary are all arranged to define a first inlet plenum disposed between the ceiling and the first microjet nozzle array, a second inlet plenum disposed between the ceiling and the second microjet nozzle array, a first impingement space disposed between the first microjet nozzle array and the cooling surface, a second impingement space disposed between the second microjet nozzle array and the cooling surface, and a first couch passage fluidly connecting the first impingement space to the second inlet plenum.

[0017] Step 2 is mounting the cooling module to the circuit board using a fastening system such that the cooling surface of the base plate is in thermal communication with the one or more heat-generating electronic components on the circuit board and absorbs heat generated by the one or more heat-generating electronic components during operation of the circuit board. Step 3 of the method is connecting an external source of pressurized cooling fluid to an inlet port of the housing of the cooling module. Step 4 is delivering the pressurized cooling fluid received at the inlet port to a first inlet plenum of the jet plate.

[0018] In step 5, a first microjet nozzle array in the first segment of the jet plate receives pressurized cooling fluid from the first inlet plenum, accelerates the pressurized cooling fluid, and directs the accelerated pressurized cooling fluid into a first impingement space at high velocity to impinge on a first portion of the cooling surface of the base plate, thereby removing heat absorbed by the first portion of the cooling surface from the one or more heat-generating electronic components. Typically, but not necessarily, the coolant exits through a boundary of the impingement space. In step 6, a couch passage in the cooling module routes at least a portion of the pressurized cooling fluid that impinged on the first portion of the cooling surface from the first impingement space to a second inlet plenum. And finally, in step 6, the second microjet nozzle array in the jet plate receives the pressurized cooling fluid from the second inlet plenum, accelerates the pressurized cooling fluid, and then directs the accelerated pressurized cooling fluid to enter the second impingement space at high velocity, causing the pressurized cooling fluid to impinge on a second portion of the cooling surface of the base plate without allowing the pressurized cooling fluid to exit the cooling module before entering the second inlet plenum, thereby removing heat absorbed by the second portion of the cooling surface from the one or more heat-generating electronic components.

[0019] BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate several preferred embodiments of the present invention and, together with the following description, serve to explain the principles of the present invention. In the drawings, like reference numbers indicate identical or functionally similar elements. Additionally, the leftmost digit(s) of a reference number identifies the figure in which the reference number first appears. [Brief explanation of the drawings]

[0020] [Figure 1] A cross-sectional view of a prior art cooling module is shown. The cold inlet coolant has access to the entire jet plate and is accelerated through the jet plate towards the surface to be cooled (direct module) or the base plate (indirect module). After heat transfer, the coolant is collected and flows to the outlet. [Figure 2A]1 illustrates, in cross section, an example of an internal recirculation cooling module, in this example, having four stages, according to one embodiment of the present invention. [Figure 2B] 1 illustrates, in cross section, an example of an internal recirculation cooling module, in this example, having four stages, according to one embodiment of the present invention. [Figure 2C] 1 illustrates, in cross section, an example of an internal recirculation cooling module, in this example, having four stages, according to one embodiment of the present invention. [Figure 3] 1 illustrates how the flow path of a conventional prior art cooling module (A) differs from the flow path of a cooling module with internal recirculation (B) according to an embodiment of the present invention. [Figure 4] 1 illustrates that the division of jet plate sections within a given cooling module can be arbitrary. [Figure 5] A schematic diagram of the surface division is shown: the initial central impingement area is connected to two separate subsequent jet plate sections, both of which direct their exhaust into a common annular collection passage and out to the outlet. [Figure 6A] 6 shows an isometric cross-sectional view of an indirect cooling module 600 (Example A) with internal recirculation constructed in accordance with one embodiment of the present invention. [Figure 6B] 6 shows an isometric cross-sectional view of an indirect cooling module 600 (Example A) with internal recirculation constructed in accordance with one embodiment of the present invention. [Figure 7] The same cooling module (Example A) is shown with the housing removed to better identify the couch passages between the impingement space of each jet plate section and the inlet side of the downstream section. In this example, the couch passages at the two ends (A and B) of the cooling module are identical. [Figure 8] An exploded view of another example (Example B) of a cooling module constructed in accordance with another embodiment of the present invention is shown with the housing removed to better illustrate some of the internal components. [Figure 9] 9 shows a partial cross-sectional view of the cooling module 900 (Example B) shown in the exploded view of FIG. 8. [Figure 10] 1 shows a cooling module assembly (Example C) constructed in accordance with the invention described herein. [Figure 11] 1 shows an exploded view of an embodiment C of the present invention. The base plate includes several channel features that together with the jet plate and housing serve to form a couch passageway. [Figure 12] 11 illustrates a partial top view of the exemplary cooling module assembly (Example C) shown in FIG. 10. [Figure 13] 10-12 illustrate more clearly the flow paths in the exemplary cooling module. [Figure 14] 1 illustrates an exploded view of another cooling module (Example D) constructed in accordance with one embodiment of the present invention. The cooling module shown is considered a direct (contact) cooling module because it is attached directly to the heat source. [Figure 15] 15 illustrates the flow configuration for the direct contact cooling module (Example D) shown in FIG. 14. [Figure 16A] 15 shows a partial cross-sectional view of the direct contact cooling module (Example D) shown in FIG. 14. [Figure 16B] 15 shows a partial cross-sectional view of the direct contact cooling module (Example D) shown in FIG. 14. DETAILED DESCRIPTION OF THE INVENTION

[0021] DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS Reference will now be made in detail to preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. In particular, the following drawings and examples are not meant to limit the scope of the invention or its embodiments or equivalents. For the purposes of this detailed description, unless specifically stated otherwise, the terms "section" and "segment" are used interchangeably and can therefore be considered to have the same meaning.

[0022] SUMMARY OF THE INVENTION The present invention uses the geometry of the jet plate, ceiling, and base plate to divide the interior chamber of the cooling module into multiple sections, with the flow passing through at least two sections in series and the discharge from one or more sections being routed to the inlet of a subsequent section within the cooling module. By contacting the cooling surface (base plate cooling surface or heat source) multiple times with the same cooling fluid, the flow consumption of the cooling module is significantly reduced. By re-cooling and re-circulating the cooling fluid without allowing it to leave the cooling module's external seal boundaries, the number of external seals required is reduced and the flow path is more compact, reducing the total pressure loss of the re-circulating cooling module.

[0023] Many internal flow separation possibilities exist for implementing the present invention in the framework of both direct and indirect cooling modules. The flow path that collects the exhaust from one section of the cold plate and routes it to the inlet side of the next section is called a couch passage. The couch passage serves to isolate the exhaust area of the original jet plate section from the exhaust section of any downstream jet plate section. The couch passage can also be sealed to prevent the cooling fluid from passing through to the next jet plate section. The couch passage is formed using a combination of surfaces associated with other internal elements of the cooling module. Thus, the couch passage can be formed, for example, from the walls and structures of: A) Jet plate (possibly with cutouts), ceiling, and base plate. B) A jet plate (optionally with a notch), an interposer plate, and a base plate. C) Jet plate (optionally with notches), housing, and interposer plate. D) Jet plate (optionally with notches) and intervening plate. E) Jet plate (possibly with cutouts), boundary extending from the ceiling, intervening plate, and base plate.

[0024] Each jet plate segment includes an array of microjet nozzles configured to draw cooling fluid from an adjacent inlet plenum and then accelerate the cooling fluid to flow at high velocity through an associated impingement space below the jet plate so that the accelerated cooling fluid impacts a portion of a cooling surface, which may include a cooling surface on a base plate of the cooling module or a cooling surface on a heat source, thereby facilitating heat transfer from the heat source to the cooling fluid.

[0025] When an interposer plate is present, it serves to guide the flow from the outlet of one segment to the inlet plenum of the next segment. Modern manufacturing techniques may allow the jet plate, the ceiling, or both to be constructed as an integral part of the interposer plate. Cooling performance may be improved by sealing the joints between the jet plate and the housing, interposer plate, ceiling, and / or base plate using either gaskets, adhesives, or welding procedures.

[0026] The fastening system can be integrated directly into the housing, meaning the housing has mounting holes that connect the cooling module to the heat source. The fastening system can also use a separate structure, sometimes called a tensioner plate, that transfers the fastener mounting force from the substrate on which the heat-generating component is mounted to the housing.

[0027] Additional geometric features (e.g., walls or boundaries) can be added to direct-cooled modules, indirect-cooled modules, or both to help create couch passages below the jet plate that help ensure flow is not short-circuited between the various exhaust sections. The additional geometric features tend to simplify the geometry required for the base plate, thus reducing manufacturing and assembly costs. Optional assembly of the cooling module and the implementation of the present invention therein can be facilitated by constructing the housing in two parts and fastening, adhering, or welding the two parts together.

[0028] Additionally, it may be beneficial to manufacture multiple segments of the jet plate in separate pieces and have these separate pieces held together in an assembly rather than using one continuous jet plate.

[0029] Referring to the drawings, FIG. 1 illustrates a prior art cooling module 100 in cross section. As shown in FIG. 1, the prior art cooling module 100 typically includes a housing 102, an inlet 104, an outlet 106, and a jet plate 108. The housing 102 is attached to a surface 110 to be cooled. Cryogenic coolant enters the inlet 104, has access to the entire jet plate 108, and is accelerated through the jet plate 108 toward the surface 110 to be cooled (direct module) or a base plate (indirect module). The temperature of the cooling fluid increases due to heat transfer as a result of contact with the cooling surface 110. The cooling fluid is collected and flows to the outlet 106, where it is expelled from the cooling module 100.

[0030] 2A, 2B, and 2C illustrate, in cross section, an example of an internal recirculation cooling module 200, according to one embodiment of the present invention. In this example, the cooling module 200 has four stages, meaning that the same cooling fluid is accelerated four separate times through four distinct segments 210a-210d of the jet plate, each addressing a different area on the surface 212 to be cooled. The surface 212 to be cooled may comprise a base plate in thermal contact with the surface of one or more heat-generating electronic devices, and the base plate is a component of the cooling module 200. In this configuration, the cooling module 200 is referred to as an "indirect" cooling module. Alternatively, the surface 212 to be cooled may comprise the heat-generating electronic device itself, in which case the cooling module 200 may be referred to as a "direct" cooling module.

[0031] As best shown in FIG. 2A, cooling module 200 includes an inlet port 202 connected to housing 206, an outlet port 208 connected to housing 206, and segmented jet plates 210a-210d. Cooling module 200 also includes a ceiling 216 disposed inside the top wall of housing 206. As best shown in FIG. 2B, housing 206 has a set of ceiling mounting boundaries 218a-218d (i.e., walls) that extend downward from ceiling 216 to the upper surfaces of respective ones of the different jet plate segments 210a-210d. When the cooling surface is a base plate (as in the indirectly cooled version of the cooling module), cooling surface 212 has a set of cooling surface mounting boundaries 220a-220d that extend upward from the base plate to the lower surfaces 222 of jet plates 210a-210d.

[0032] The shapes, arrangements, and relative positions of jet plate segments 210a-210d, ceiling 216, ceiling attachment boundaries 218a-218c, cooling surface 212, and cooling surface attachment boundaries 220a-220c collectively serve to define four inlet plenums 222a-222d located above jet plate segments 210a-210d, four impingement spaces 224a-224d located below jet plate segments 210a-210d, and three couch passages 214a-214c (see FIG. 2C). The couch passages 214a-214c are configured to fluidly connect the outlets of the impingement spaces 224a-224c to the inlets of the inlet plenums 222b-222d in the cooling module 200 so that the cooling fluid already entering the impingement spaces 224a-224c for impinging on different portions of the cooling surface 212 is then routed to the inlet plenums 222b-222d where it is drawn into and accelerated by the subsequent microjet arrays of the jet plate segments 210b-210d.

[0033] 3 illustrates how the flow path of a conventional prior art cooling module (A) differs from the flow path of a cooling module with internal recirculation (B) according to an embodiment of the present invention. The couch passages connect the impingement space below each jet plate segment with the inlet plenum of the subsequent jet plate section. While it may be more efficient to create the couch passages by controlling the shape, placement, and relative positions of boundaries extending from the ceiling and cooling surfaces in the cooling module, it should be understood that in alternative embodiments of the present invention, the couch passages may comprise physical pipes or conduits (independent of boundaries extending from the ceiling and cooling surfaces).

[0034] Figure 4 shows that the distribution of jet plate segments within a given cooling module can be arbitrary, with a central inlet connected to a central jet plate section, followed by a ring-shaped segment, an annular outlet collection passage, and finally an outlet.

[0035] Figure 5 shows a schematic diagram of a surface distribution where an initial central impingement area is connected to two separate subsequent jet plate sections, and both sections route their discharge into a common annular collection passage and then to an outlet. The drawing illustrates that not all jet plate sections must be connected in series.

[0036] 6A and 6B show isometric cross-sectional views of an indirect cooling module 600 (Example A) with internal recirculation constructed in accordance with one embodiment of the present invention. The cooling module 600 includes a housing 602, a jet plate 605, a base plate 610, an inlet 615, and an outlet 620. The jet plate 605 is divided into three separate segments 605a-605c. The three segments 605a-605c are separated from each other by two ceiling-mounted boundaries 625a and 625b that extend from a ceiling 630 on the interior top wall of the housing 602. Suitably, seals 635a and 635b are located where ceiling attachment boundaries 625a and 625b join jet plate 605 to prevent cooling fluid from one segment from flowing directly into another segment without flowing through the jet plate or couch passages (best shown in FIGS. 7 and 12 and described in more detail below) formed by the shape, arrangement, and relative positions of jet plate 605, base plate 610, ceiling 630, and ceiling attachment boundaries 625a and 625b. Exhaust collection passage 640 ensures that cooling fluid that has already passed through the microjet nozzle arrays in jet plate segments 605a, 605b, and 605c is channeled to the couch passages and / or outlets of cooling module 600.

[0037] FIG. 7 shows the same cooling module 600 as shown in FIG. 6 (Example A), but with the housing 602 removed to show and identify the couch passages 705a and 705b fluidly connected to the impingement spaces beneath each one of the microjet nozzle arrays 715a, 715b, and 715c in each one of the three jet plate segments, as well as the inlet plenum associated with the microjet nozzle array in the downstream jet plate segment. In this example, there are two couch passages, one on either side (side A and side B) of each one of the microjet arrays in the jet plate segments of the cooling module. As shown in FIG. 7, the two couch passages 705a (side A and side B) are configured to capture and guide the cooling fluid (not shown in FIG. 7) that has undergone a first impingement due to the operation of the first microjet nozzle array 715a in the first segment of the jet plate. Two couch passages 705b (side A and side B) are configured to capture and guide cooling fluid that has undergone a second impingement due to operation of the second microjet nozzle array 715b in the second segment of the jet plate, and two exhaust channels 740 (side A and side B) capture and guide cooling fluid that has undergone a third impingement due to operation of the third microjet nozzle array 715c in the third segment of the jet plate.

[0038] Couch passage 705a directs cooling fluid from an impingement space (not shown in FIG. 7 but shown in FIG. 2) located below microjet nozzle array 715a into an inlet plenum (also not shown in FIG. 7 but shown in FIG. 2) located above microjet nozzle array 715b. Couch passage 705b routes cooling fluid from the impingement space located below microjet nozzle array 715b to an inlet plenum located above microjet nozzle array 715c. Exhaust collection channel 740 is configured to route cooling fluid from the impingement space located below microjet nozzle array 715c toward an outlet of cooling module 700.

[0039] FIG. 8 shows an exploded view of another example (Example B) of a cooling module 800 constructed in accordance with another embodiment of the present invention, with the housing removed to better illustrate some of the internal components. In this embodiment, an interposer plate 805 and a sealing gasket 810 are inserted between a jet plate 815 and a housing (not shown). The jet plate 815 is divided into three segments, each containing a microjet nozzle array 817. After the cooling fluid passes through the first and second microjet nozzle arrays and impinges on the cooling surface 825 of the base plate 820, the cooling fluid is disposed in an impingement space that exists below the plane of the segmented jet plate 815. A couch passage (best shown in FIGS. 7 and 12) is used to move the cooling fluid from the impingement space, which is below the plane of the segmented jet plate 815, into an inlet plenum, which is above the plane of the segmented jet plate 815. Therefore, the couch passages should be configured to move the cooling fluid "up" from a level below the plane of the segmented jet plate 815 to a level disposed above the plane of the segmented jet plate 815 as it moves from the impingement space to the downstream inlet plenum. As such, at least some portions of the couch passages are below the plane of the segmented jet plate 815, and other portions of the couch passages are above the plane of the segmented jet plate 815.

[0040] Creation of a couch passageway in cooling module 800 may be facilitated by the insertion and use of interposer plate 805, which includes a ceiling 807 on its underside, with the ceiling 807 having a ceiling mounting boundary (and / or wall or standoff) extending downward. These ceiling mounting boundaries, in combination with the upper surface of segmented jet plate 815 and the structure of ceiling 807, are advantageously used to form the portion of the couch passageway that resides above the plane of segmented jet plate 815. In some embodiments, ceiling 807 is an integral part of interposer plate 805. If an interposer plate is not used, ceiling 807 features may be formed into the interior top wall of the housing. In still other embodiments, ceiling 807 may comprise a separately manufactured piece that may be inserted beneath interposer plate 805 or the interior top wall of the housing. The base plate 820 includes a cooling surface 825 having an upwardly extending cooling surface mounting boundary 830 suitably shaped and positioned to cooperate with the underside of the segmented jet plate 815 and the structure of the cooling surface 825 to form a portion of the couch passageway that lies below the plane of the segmented jet plate 815.

[0041] Sealing gasket 810 prevents cooling fluid in one segment of split jet plate 815 from flowing directly into a different segment of split jet plate 815 without passing through a couch passage. Notches 840 in the corresponding portion of split jet plate 815 and sealing gasket 810 are portions of couch passages that allow coolant to pass through the plane of split jet plate 815, raising the cooling fluid from a level below the plane of split jet plate 815 to a level above the plane of split jet plate 815.

[0042] Figure 9 shows a partial cross-sectional view of the cooling module 900 (Example B) shown in the exploded view of Figure 8. In this case, an inlet flow channel 905 cut into the top of an interposer plate 910 routes cooling fluid from an inlet port on a housing (not shown) initially to the approximate center 915 of the cooling module 900. A combination of structure associated with the base plate 930, the segmented jet plate 925, and the boundary of the interposer plate 910 forms a first couch passage that directs cooling fluid back toward the inlet side of the segmented jet plate 920 before flowing through the nozzle array in a second segment of the jet plate 925. A second couch passage 935 that carries cooling fluid from the second segment of the divided jet plate 925 to the third segment is also formed by the boundaries at the base plate 930, the jet plate 925, and the intervening plate 910, and in the couch passage 935 the cooling fluid impinges on the third section before being collected in an exhaust collection passage 940 in the intervening plate 910, and can then flow to an outlet port (not shown) via several external flow channels 950 arranged between the underside of the upper wall of the housing and the upper side of the intervening plate 910.

[0043] 10 illustrates a cooling module assembly 1000 (Example C) that uses a cooling module 1005 with internal recirculation constructed in accordance with one embodiment of the present invention. In this example, the base plate 1010 of the cooling module 1005 is attached and secured to the surface 1015 to be cooled (in this case, a processor) using a fastening system that includes a processor mounting bracket 1025 (in this case, a bolster plate) and a tensioner plate 1020 that transfers compression force from the fasteners 1030 to the cooling module housing 1040. An inlet port 1050 attached to the housing 1040 is configured to allow pressurized cooling fluid, supplied by an external source, to enter the cooling module 1005, and an outlet port 1055 attached to the housing 1040 is configured to exhaust the cooling fluid from the cooling module 1005. The cooling module base plate 1010 is in thermal communication with the surface 1015 to be cooled using a thermal interface material (not shown).

[0044] Figure 11 shows an exploded view of the cooling module assembly shown in Figure 10. The cooling surface 1103 of the base plate 1105 includes several cooling surface mounting interfaces 1110 (walls or standoffs or channel forming features) that, together with structures and cutouts incorporated into the jet plate 1015, sealing gasket 1020, and housing 1025, serve to form appropriately configured couch passages for transferring cooling fluid from one segment of the jet plate 1015 to the next.

[0045] FIG. 12 illustrates a partial top view of the exemplary cooling module assembly shown in FIG. 10. For clarity, the housing, inlet ports, and outlet ports have been removed from the drawing image. As shown in FIG. 12, the inlet flow of cooling fluid is split into two parallel sections of the jet plate (Section 1A and Section 1B), each containing a microjet nozzle array with multiple microjet nozzles. The discharge from these parallel sections is collected together through several couch passages to carry the coolant to Section 2. The couch passages in Section 2 route the flow to a fluid headspace connected to an inlet plenum in Section 3. Section 3 then has a couch passage connecting Section 3 to the fourth and final segment. Example C illustrates the ability to combine parallel sections (1A and 1B) into additional serial sections (2, 3, 4). FIG. 12 also illustrates the ability to target specific areas of the processor chip and use these sections to customize heat transfer in each area.

[0046] FIG. 13 more clearly illustrates the flow paths in the exemplary cooling module shown in FIGS. 10-12 by focusing on the formation of the couch passages from Section 1A and Section 1B leading to Section 2. In particular, channel-forming features in the base plate, typically formed from copper, can be used to aid in the formation of the couch passages. These protruding features on the base plate (protruding from the copper) can also be realized using separate pieces. The arrows in FIG. 13 indicate the flow path taken by the cooling fluid traveling through the couch passages connecting the impingement space of Section 1 to the inlet plenum of Section 2.

[0047] Figure 14 shows an exploded view of another cooling module (Example D) constructed in accordance with one embodiment of the present invention. The cooling module shown is considered a direct cooling module because it is attached directly to the heat source. In this case, the internal passages do not have gaskets. The jet plate, in this example, comprises three separate sections manufactured as three separate physical pieces.

[0048] FIG. 15 shows the flow configuration of the direct contact cooling module (Example D) shown in FIG. 14 and demonstrates how a single jet plate section connected to the inlet can be split into two parallel sections (Section 2A and Section 2B) before collecting the discharge from these sections together and sending the discharge to the outlet (not shown).

[0049] Figures 16A and 16B show a partial cross-section of the direct contact cooling module (Example D) shown in Figure 14. This cross-section shows in more detail the flow path from Section 1 to Section 2A. The couch passage in this case is formed by the jet plate, the lower half of the housing, and the surface to be cooled. Figure 16 has an inset that shows a close-up of the flow path through the couch passage from Section 1 to Section 2A.

[0050] The preferred embodiments described above are intended to illustrate the principles of the present invention, not to limit its scope. Various other embodiments, modifications, and equivalents to these preferred embodiments will occur to those skilled in the art upon reading this disclosure or practicing the invention as claimed. All such variations, modifications, and equivalents are intended to be included within the scope of the present invention and the appended claims.

Claims

1. A cooling module comprising: (a) a jet plate having an upper surface, a lower surface, a first segment including a first array of microjet nozzles extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate, and a second segment including a second array of microjet nozzles extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate; (b) a housing; (c) a ceiling disposed between the jet plate and the housing, the ceiling comprising a first ceiling attachment boundary extending from the ceiling to the upper surface of the jet plate and a second ceiling attachment boundary extending from the ceiling to the upper surface of the jet plate; (d) a base plate comprising a cooling surface, a first cooling surface attachment interface extending from the cooling surface to the lower surface of the jet plate, and a second cooling surface attachment interface extending from the cooling surface to the lower surface of the jet plate; Equipped with (e) the jet plate, the ceiling, the cooling surface of the base plate, the first ceiling attachment boundary, the second ceiling attachment boundary, the first cooling surface attachment boundary, and the second cooling surface attachment boundary are all arranged to define a first inlet plenum disposed between the ceiling and the first microjet nozzle array, a second inlet plenum disposed between the ceiling and the second microjet nozzle array, a first impingement space disposed between the first microjet nozzle array and the cooling surface, a second impingement space disposed between the second microjet nozzle array and the cooling surface, and a first couch passage fluidly connecting the first impingement space to the second inlet plenum; (f) a fastening system for mounting the cooling module to the circuit board having one or more heat-generating electronic components secured thereto such that the cooling surface of the base plate is in thermal communication with the one or more heat-generating electronic components on the circuit board and absorbs heat generated by the one or more heat-generating electronic components during operation of the circuit board; (g) an inlet fitting attached to the housing and configured to admit pressurized cooling fluid from an external source into the cooling module; (h) an inlet flow channel conveying the pressurized cooling fluid from the inlet fitting to the first inlet plenum; Equipped with (i) (i) the first microjet nozzle array in the first segment of the jet plate is configured to receive the pressurized cooling fluid from the first inlet plenum, accelerate the pressurized cooling fluid, and direct the accelerated pressurized cooling fluid to enter the first impingement space at a high velocity and impact a first portion of the cooling surface of the base plate, thereby removing the heat absorbed by the first portion of the cooling surface from the one or more heat-producing electronic components; (ii) the couch passage is configured to carry a portion of the pressurized cooling fluid in the first impingement space and within the second inlet plenum; (iii) the second microjet nozzle array in the jet plate is configured to receive the pressurized cooling fluid from the second inlet plenum, accelerate the pressurized cooling fluid, and direct the accelerated pressurized cooling fluid to enter the second impingement space at a high velocity and impact a second portion of the cooling surface of the base plate, thereby removing the heat absorbed by the second portion of the cooling surface from the one or more heat-producing electronic components.

2. (a) an outlet fitting connected to the housing and configured to discharge pressurized cooling fluid from the cooling module; (b) a first waste collection passage configured to capture a portion of the pressurized cooling fluid from the first impingement space and route the captured pressurized cooling fluid to the outlet fitting for discharge from the cooling module; The cooling module of claim 1 further comprising:

3. 3. The cooling module of claim 2, further comprising a second exhaust collection passage configured to capture a portion of the pressurized cooling fluid from the second impingement space and route the captured pressurized cooling fluid to the outlet fitting for discharge from the cooling module.

4. The cooling module of claim 1 , wherein the ceiling is manufactured as an integral part of the housing.

5. The cooling module of claim 1 , wherein the ceiling is not manufactured as an integral part of the housing.

6. (a) an intervening plate disposed between the housing and the jet plate; Further provided with 6. The cooling module of claim 5, wherein (b) said ceiling is manufactured as an integral part of said interposer plate.

7. 2. The cooling module of claim 1, further comprising a sealing gasket that prevents the pressurized cooling fluid entering the first segment of the jet plate from passing directly into the second segment of the jet plate without flowing through the first couch passage.

8. (a) the second segment of the jet plate surrounds the first segment of the jet plate; (b) the second ceiling attachment boundary of the ceiling surrounds the first ceiling attachment boundary; 2. The cooling module of claim 1, wherein: (c) the second cooling surface mounting boundary of the base plate surrounds the first cooling surface mounting boundary.

9. (a) the jet plate further comprises a third segment including a third microjet nozzle array extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate; (b) the ceiling further comprises a third ceiling attachment boundary extending from the ceiling to the upper surface of the jet plate; (c) the base plate further comprises a third cooling surface attachment interface extending from the cooling surface to the lower surface of the jet plate; (d) the jet plate, the ceiling, the cooling surface of the base plate, the first ceiling attachment boundary, the second ceiling attachment boundary, the third ceiling attachment boundary, the first cooling surface attachment boundary, the second cooling surface attachment boundary, and the third cooling surface attachment boundary are all arranged to define a third inlet plenum disposed between the ceiling and the third microjet nozzle array, a third impingement space disposed between the cooling surface and the third microjet nozzle array, and a second couch passage fluidly connecting either the first impingement space or the second impingement space or both to the third inlet plenum; 2. The cooling module of claim 1, wherein: (e) the third micro-jet nozzle array in the jet plate is configured to receive the pressurized cooling fluid from the third inlet plenum, accelerate the pressurized cooling fluid, and direct the accelerated pressurized cooling fluid to enter the third impingement space at a high velocity and impact a third portion of the cooling surface of the base plate, thereby removing the heat absorbed by the third portion of the cooling surface from the one or more heat-producing electronic components.

10. (a) an outlet fitting connected to the housing and configured to discharge pressurized cooling fluid from the cooling module; (b) a first exhaust collection passage configured to capture a portion of the pressurized cooling fluid from the third impingement space and route the captured pressurized cooling fluid to the outlet fitting for discharge from the cooling module; The cooling module of claim 9 further comprising:

11. 10. The cooling module of claim 9, further comprising a sealing gasket that prevents the pressurized cooling fluid entering the first segment of the jet plate from passing directly into the second segment of the jet plate without flowing through the second couch passage.

12. 12. The cooling module of claim 11, wherein the sealing gasket prevents the pressurized cooling fluid entering the second segment of the jet plate from flowing directly into the third segment of the jet plate without flowing through the second couch passage.

13. (a) the third segment of the jet plate surrounds the first segment of the jet plate and the second segment of the jet plate; (b) the third ceiling attachment boundary of the ceiling surrounds the first ceiling attachment boundary and the second ceiling attachment boundary; 10. The cooling module of claim 9, wherein (c) the third cooling surface mounting boundary of the base plate surrounds the first cooling surface mounting boundary and the second cooling surface mounting boundary.

14. The cooling module of claim 9 , wherein the ceiling is manufactured as an integral part of the housing.

15. The cooling module of claim 9 , wherein the ceiling is not manufactured as an integral part of the housing.

16. (a) an intervening plate disposed between the housing and the jet plate; Further provided with 16. The cooling module of claim 15, wherein (b) said ceiling is manufactured as an integral part of said interposer plate.

17. (a) a second jet plate having a third segment including another upper surface, another lower surface, and a third microjet nozzle array extending through the second jet plate from the other upper surface of the second jet plate to the other lower surface of the second jet plate; Further provided with (b) (i) the ceiling further comprises a third ceiling attachment boundary extending from the ceiling to the other upper surface of the second jet plate; (ii) the base plate further comprises a third cooling surface attachment interface extending from the cooling surface to the other lower surface of the second jet plate; (iii) the second jet plate, the ceiling, the cooling surface of the base plate, the first ceiling attachment boundary, the second ceiling attachment boundary, the third ceiling attachment boundary, the first cooling surface attachment boundary, the second cooling surface attachment boundary, and the third cooling surface attachment boundary are all arranged to define a third inlet plenum disposed between the ceiling and the third microjet nozzle array, a third impingement space disposed between the cooling surface and the third microjet nozzle array, and a second couch passage fluidly connecting either the first impingement space or the second impingement space or both to the third inlet plenum; 10. The cooling module of claim 1, wherein (iv) the third micro-jet nozzle array in the second jet plate is configured to receive the pressurized cooling fluid from the third inlet plenum, accelerate the pressurized cooling fluid, and direct the accelerated pressurized cooling fluid to enter the third impingement space at a high velocity and impact a third portion of the cooling surface of the base plate, thereby removing a portion of the heat absorbed by the third portion of the cooling surface from the one or more heat-producing electronic components.

18. 1. A method for cooling one or more heat-generating electronic components mounted on a circuit board, the method comprising: (a) providing a cooling module comprising a jet plate, a housing, a ceiling disposed between the jet plate and the housing, a base plate having a cooling surface, and a fastening system for fastening the cooling module to the circuit board; Including, (b) (i) the jet plate comprises a first segment including a first microjet nozzle array extending through the jet plate and a second segment including a second microjet nozzle array extending through the jet plate; and (ii) the jet plate, the ceiling, the cooling surface of the base plate, a first ceiling mounting boundary, a second ceiling mounting boundary, a first cooling surface mounting boundary, and a second cooling surface mounting boundary are all arranged to define the first inlet plenum disposed between the ceiling and the first microjet nozzle array, a second inlet plenum disposed between the ceiling and the second microjet nozzle array, a first impingement space disposed between the first microjet nozzle array and the cooling surface, a second impingement space disposed between the second microjet nozzle array and the cooling surface, and a first couch passage fluidly connecting the first impingement space to the second inlet plenum; (c) using the fastening system to attach the cooling module to the circuit board such that the cooling surface of the base plate is in thermal communication with the one or more heat-producing electronic components on the circuit board and absorbs heat generated by the one or more heat-producing electronic components during operation of the circuit board; (d) connecting an external source of pressurized cooling fluid to an inlet port on the housing of the cooling module; (e) delivering pressurized cooling fluid received at the inlet port to the first inlet plenum of the jet plate; (f) using the first microjet nozzle array in the first segment of the jet plate to receive the pressurized cooling fluid from the first inlet plenum, accelerate the pressurized cooling fluid, and direct the accelerated pressurized cooling fluid to enter the first impingement space at high velocity and impact a first portion of the cooling surface of the base plate, thereby removing the heat absorbed by the first portion of the cooling surface from the one or more heat-producing electronic components; (g) using the couch passage to channel a portion of the pressurized cooling fluid impinging on the first portion of the cooling surface from the first impingement space to the second inlet plenum; (h) using the second microjet nozzle array in the jet plate to receive the pressurized cooling fluid from the second inlet plenum, accelerate the pressurized cooling fluid, and direct the accelerated pressurized cooling fluid into the second impingement space at a high velocity to impinge the pressurized cooling fluid against a second portion of the cooling surface of the base plate without allowing the pressurized cooling fluid to exit the cooling module before entering the second inlet plenum, thereby removing the heat absorbed by the second portion of the cooling surface from the one or more heat-producing electronic components; A method comprising:

19. (a) capturing a portion of the pressurized cooling fluid in the first impingement space that the couch passage does not deliver to the second inlet plenum; (b) delivering the captured pressurized cooling fluid to an outlet fitting connected to the housing; (c) discharging the pressurized cooling fluid from the cooling module; 20. The method of claim 18, further comprising:

20. 20. The method of claim 18, wherein the ceiling is manufactured as an integral part of the housing.

21. 20. The method of claim 18, wherein the ceiling is not manufactured as an integral part of the housing.

22. A cooling module comprising: (a) a jet plate having an upper surface, a lower surface, a first segment including a first array of microjet nozzles extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate, and a second segment including a second array of microjet nozzles extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate; (b) a housing having a top cover and a base plate; (c) a ceiling disposed between the jet plate and the top cover of the housing, the ceiling comprising a first ceiling attachment boundary extending from the ceiling to the upper surface of the jet plate and a second ceiling attachment boundary extending from the ceiling to the upper surface of the jet plate; and Equipped with (d) the base plate of the housing includes an opening, a flange surrounding the opening, a first flange mounting boundary, and a second flange mounting boundary, both of which extend across the opening in the base plate and abut the lower surface of the jet plate; (e) the jet plate, the ceiling, the flange of the base plate, the first ceiling attachment boundary, the second ceiling attachment boundary, the first flange attachment boundary, and the second flange attachment boundary are all arranged to define a first inlet plenum disposed between the ceiling and the first microjet nozzle array, a second inlet plenum disposed between the ceiling and the second microjet nozzle array, a first impingement space disposed within the opening directly below the first microjet nozzle array, a second impingement space disposed within the opening directly below the second microjet nozzle array, and a first couch passage fluidly connecting the first impingement space to the second inlet plenum; (f) a fastening system for attaching the cooling module to the circuit board having one or more heat-generating electronic components secured thereto such that the one or more heat-generating electronic components on the circuit board are positioned within or directly beneath the first inlet plenum and the second inlet plenum at the opening in the base plate; (g) an inlet fitting attached to the top cover and configured to allow pressurized cooling fluid from an external source to enter the cooling module; (h) an inlet flow channel conveying the pressurized cooling fluid from the inlet fitting to the first inlet plenum; Equipped with (i) the first microjet nozzle array in the first segment of the jet plate is configured to receive the pressurized cooling fluid from the first inlet plenum, accelerate the pressurized cooling fluid, and direct the accelerated pressurized cooling fluid to enter the first impingement space at high velocity and directly impact a first portion of the one or more heat-producing electronic components, thereby removing the heat generated by the first portion of the one or more heat-producing electronic components during operation of the first portion of the one or more heat-producing electronic components; the couch passage is configured to convey a portion of the pressurized cooling fluid that has impinged on the one or more heat-generating electronic components from the first impingement space into the second inlet plenum; the second microjet nozzle array in the jet plate is configured to receive the pressurized cooling fluid from the second inlet plenum, accelerate the pressurized cooling fluid, and direct the accelerated pressurized cooling fluid to enter the second impingement space at high velocity and impact a second portion of the one or more heat-producing electronic components, thereby removing a portion of the heat generated by the second portion of the one or more heat-producing electronic components during operation of the second portion of the one or more heat-producing electronic components.

23. (a) an outlet fitting connected to the top cover and configured to exhaust pressurized cooling fluid from the cooling module; (b) a first waste collection passage configured to capture a portion of the pressurized cooling fluid in the first impingement space and route the captured pressurized cooling fluid to the outlet fitting for discharge from the cooling module; The cooling module of claim 22 further comprising:

24. 24. The cooling module of claim 23, further comprising a second exhaust collection passage configured to capture a portion of the pressurized cooling fluid in the second impingement space and route the captured pressurized cooling fluid to the outlet fitting for discharge from the cooling module.

25. The cooling module of claim 22 , wherein the ceiling is manufactured as an integral part of the top cover.

26. The cooling module of claim 22 , wherein the ceiling is not manufactured as an integral part of the top cover.

27. (a) an intervening plate disposed between the top cover and the jet plate; Further provided with 27. The cooling module of claim 26, wherein (b) said ceiling is manufactured as an integral part of said interposer plate.

28. 23. The cooling module of claim 22, further comprising a sealing gasket that prevents pressurized cooling fluid entering the first segment of the jet plate from passing directly into the second segment of the jet plate without flowing through the first couch passage.

29. (a) the second segment of the jet plate surrounds the first segment of the jet plate; (b) the second ceiling attachment boundary of the ceiling surrounds the first ceiling attachment boundary; 23. The cooling module of claim 22, wherein (c) the second flange mounting boundary of the base plate surrounds the first flange mounting boundary.

30. (a) the jet plate further comprises a third segment including a third microjet nozzle array extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate; (b) the ceiling further comprises a third ceiling attachment boundary extending from the ceiling to the upper surface of the jet plate; (c) the base plate further comprising a third flange mounting interface extending across the opening in the base plate and abutting the lower surface of the jet plate; (d) the jet plate, the ceiling, the flange of the base plate, the first ceiling attachment boundary, the second ceiling attachment boundary, the third ceiling attachment boundary, the first flange attachment boundary, the second flange attachment boundary, and the third flange attachment boundary are all arranged to define a third inlet plenum disposed between the ceiling and the third microjet nozzle array, a third impingement space disposed within the opening directly below the third microjet nozzle array, and a second couch passage fluidly connecting either the first impingement space or the second impingement space, or both, to the third inlet plenum; 23. The cooling module of claim 22, wherein (e) the third micro-jet nozzle array in the jet plate is configured to draw the pressurized cooling fluid from the third inlet plenum, accelerate the pressurized cooling fluid, and direct the accelerated pressurized cooling fluid to enter the third impingement space at high velocity and directly impact a third portion of the one or more heat-producing electronic components, thereby removing the heat generated by the third portion of the one or more heat-producing electronic components during operation of the third portion of the one or more heat-producing electronic components.

31. (a) an outlet fitting connected to the top cover and configured to exhaust pressurized cooling fluid from the cooling module; (b) a first exhaust collection passage configured to capture a portion of the pressurized cooling fluid in the third impingement space and to route the captured pressurized cooling fluid to the outlet fitting for discharge from the cooling module; The cooling module of claim 30 further comprising:

32. 31. The cooling module of claim 30, further comprising a sealing gasket that prevents pressurized cooling fluid entering the first segment of the jet plate from passing directly into the second segment of the jet plate without flowing through the second couch passage.

33. 33. The cooling module of claim 32, wherein the sealing gasket prevents pressurized cooling fluid entering the second segment of the jet plate from flowing directly into the third segment of the jet plate without flowing through the second couch passage.

34. (a) the third segment of the jet plate surrounds the first segment of the jet plate and the second segment of the jet plate; (b) the third ceiling attachment boundary of the ceiling surrounds the first ceiling attachment boundary and the second ceiling attachment boundary; 31. The cooling module of claim 30, wherein (c) the third flange mounting boundary of the base plate surrounds the first flange mounting boundary and the second flange mounting boundary.

35. The cooling module of claim 30, wherein the ceiling is manufactured as an integral part of the top cover.

36. 31. The cooling module of claim 30, wherein the ceiling is not manufactured as an integral part of the top cover.

37. (a) an intervening plate disposed between the top cover and the jet plate; Further provided with 37. The cooling module of claim 36, wherein (b) said ceiling is manufactured as an integral part of said interposer plate.

38. 1. A method for removing heat from heat-generating electronic components mounted on a circuit board of a computer processor, the method comprising: (a) providing a cooling module according to claim 22; (b) attaching the cooling module of claim 22 to an external source of pressurized cooling fluid; (c) removing heat from the heat-producing electronic component using the cooling module of claim 22; A method comprising:

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