Method for cleaning machine tools and the machining chamber of machine tools

Abstract

To provide a machine tool that can clean the machining chamber while taking into account the state of chip accumulation within the machining chamber. [Solution] The machine tool includes an imaging means for imaging the inside of the machining chamber of the machine tool that processes a workpiece, a determination means for determining the state of chip accumulation of the workpiece in the machining chamber based on the image obtained by imaging, a first nozzle for discharging coolant into the machining chamber, a pump for supplying coolant to the first nozzle, and a control means for controlling the output of the pump based on the state of chip accumulation.

Description

Technical Field

[0001] The present disclosure relates to a machine tool and a method for cleaning the machining chamber of a machine tool.

Background Art

[0002] For example, Japanese Patent Application Laid-Open No. 2021-102235 (Patent Document 1) discloses a machine tool including an imaging unit, a chip recognition unit that automatically recognizes chips based on an image captured by the imaging unit and detects the position where the chips are deposited, and a coolant discharge unit that discharges coolant in a predetermined path toward the deposition position of the chips when a detection signal is input from the chip recognition unit.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The machine tool of Patent Document 1 above recognizes the position where chips are deposited, but is not configured to remove chips in consideration of the deposition state at that position.

[0005] The present disclosure provides a machine tool capable of cleaning the machining chamber in consideration of the deposition state of chips in the machining chamber and a method for cleaning the machining chamber of a machine tool.

Means for Solving the Problems

[0006] According to a certain aspect of this disclosure, the machine tool includes an imaging means for imaging the inside of the machining chamber of the machine tool that processes a workpiece; a determination means for determining the state of chip accumulation of the workpiece in the machining chamber based on the image obtained by imaging; a first nozzle for discharging coolant into the machining chamber; a pump for supplying coolant to the first nozzle; and a control means for controlling the output of the pump based on the state of chip accumulation.

[0007] According to the above configuration, coolant is discharged from the first nozzle at a pump output based on the chip accumulation state within the machining chamber. Therefore, this configuration makes it possible to clean the machining chamber while taking into account the chip accumulation state within the machining chamber.

[0008] Preferably, the control means sets the pump output to a first output when the accumulation state is at a first level. If the accumulation state is at a second level where more chips have accumulated than at the first level, the control means sets the pump output to a second output which is higher than the first output.

[0009] According to the above configuration, the higher the level of chip accumulation, the higher the pump output. Therefore, when the chip accumulation level in the machining chamber is at the second level, chips can be removed with a higher degree of accuracy compared to when the pump output is the same as at the first level.

[0010] Preferably, the first nozzle discharges coolant toward a first region among a plurality of regions within the processing chamber. The determination means determines the deposition state in the first region. The control means sets the pump output to a first output if the deposition state in the first region is at a first level. The control means sets the pump output to a second output if the deposition state in the first region is at a second level.

[0011] According to the above configuration, the first region can be cleaned while taking into account the state of chip accumulation in the first region. Furthermore, when the chip accumulation state in the first region is at the second level, chips can be removed with a higher degree of accuracy compared to when the pump output is the same as that of the first level.

[0012] Preferably, the machine tool further comprises a second nozzle to which coolant is supplied from a pump and discharged toward a second region of a plurality of regions; a first solenoid valve capable of configuring or blocking a first flow path of coolant from the pump to the first nozzle by a control means; and a second solenoid valve capable of configuring or blocking a second flow path of coolant from the pump to the second nozzle by a control means. The determination means further determines the chip accumulation state in the second region. If the accumulation state in the first region is at a second level and the accumulation state in the second region is at a first level, the control means sets the output of the pump to a second output and blocks only the second flow path of the first and second flow paths for a first period of time.

[0013] With the above configuration, during the first period, coolant can be discharged from only the first nozzle among the first and second nozzles. Therefore, compared to the case where coolant is discharged from both the first and second nozzles at the same time, high-pressure or high-flow coolant can be discharged into the first region. As a result, chips in the first region at the second level can be removed with high accuracy.

[0014] Preferably, if the deposition state in the first region is at the second level and the deposition state in the second region is at the first level, the control means switches the output of the pump from the second output to the first output after the elapsed of the first period and blocks only the first flow path of the first and second flow paths for the second period.

[0015] With the above configuration, during the second period, coolant can be discharged only from the second nozzle of the first and second nozzles. Therefore, chips in the second region at the first level can be removed with coolant at a lower pressure than in the first region. Thus, power consumption can be reduced compared to cleaning the second region with high-pressure or high-flow coolant.

[0016] Preferably, the second output is 90% or more of the maximum output of the pump. According to the above configuration, it becomes possible to discharge a high-pressure or high-flow coolant from the first nozzle.

[0017] According to other aspects of this disclosure, a method for cleaning the machining chamber of a machine tool comprises the steps of: imaging the inside of the machining chamber of a machine tool used to machine a workpiece; and determining the state of chip accumulation of the workpiece in the machining chamber based on the image obtained from the imaging. Coolant is discharged from a nozzle by a pump inside the machining chamber. The method for cleaning the machining chamber of a machine tool further comprises the step of controlling the output of the pump based on the state of chip accumulation.

[0018] According to the method described above, coolant is discharged from the nozzle at a pump output based on the chip accumulation state within the machining chamber. Therefore, this configuration allows for cleaning of the machining chamber while taking into account the chip accumulation state within the machining chamber. [Effects of the Invention]

[0019] According to this disclosure, it becomes possible to clean the processing chamber while taking into account the state of chip accumulation within the processing chamber. [Brief explanation of the drawing]

[0020] [Figure 1] This is a perspective view showing a machine tool. [Figure 2] This is a top view showing the machining interior of a machine tool. [Figure 3] This is a diagram illustrating the configuration of a device for removing chips from a workpiece. [Figure 4] It is a diagram showing a plurality of regions in the processing chamber. [Figure 5] It is a diagram for explaining the regions to be cleaned by each nozzle among the plurality of regions shown in FIG. 4. [Figure 6] It is a diagram showing an example of the chip deposition state. [Figure 7] It is a diagram for explaining the level determination of the regions in the case of FIG. 6. [Figure 8] It is a diagram showing another example of the chip deposition state. [Figure 9] It is a diagram for explaining the level determination of the regions in the case of FIG. 8. [Figure 10] It is a diagram showing yet another example of the chip deposition state. [Figure 11] It is a diagram for explaining the level determination of the regions in the case of FIG. 10. [Figure 12] It is a diagram showing the chip deposition level of each region. [Figure 13] It is a diagram for explaining the cleaning method when the level determination of FIG. 12 is performed. [Figure 14] It is a diagram showing the chip deposition level of each region. [Figure 15] It is a diagram for explaining the cleaning method when the level determination of FIG. 14 is performed. [Figure 16] It is a block diagram for explaining the functional configuration of the machine tool. [Figure 17] It is a flowchart for explaining the flow of the process executed by the machine tool. [Figure 18] It is a flowchart showing the details of the process of step S2 in FIG. 17.

Embodiments for Carrying Out the Invention

[0021] Hereinafter, each embodiment according to the present invention will be described with reference to the drawings.While the following description, the same parts and components are denoted by the same reference numerals. Their names and functions are also the same.Therefore, detailed descriptions thereof will not be repeated.

[0022] <A: Schematic Configuration of Machine Tool> FIG. 1 is a perspective view showing a machine tool according to the present embodiment. FIG. 2 is a top view showing a machining chamber (machining area) of the machine tool of FIG. 1.

[0023] Referring to FIGS. 1 and 2, the machine tool 100 is a machining center that performs workpiece machining by bringing a rotating tool 90 into contact with the workpiece. More specifically, the machine tool 100 is a machining center in which the rotation center axis 101 of the tool extends in the horizontal direction. Specifically, the machine tool 100 is a rotary tilt table type 5-axis machining center. However, the machine tool 100 is not limited to a 5-axis machining center. The machine tool 100 is an NC (Numerical Control) machine tool in which various operations for workpiece machining are automated by computer numerical control.

[0024] In the figure, a Z-axis parallel to the horizontal direction and parallel to the rotation center axis 101 of the tool 90, an X-axis parallel to the horizontal direction and orthogonal to the rotation center axis 101 of the tool 90, and a Y-axis parallel to the vertical direction are shown.

[0025] The machine tool 100 has a tool spindle 21. The tool spindle 21 is rotatable about a rotation center axis 101 parallel to the Z-axis by motor drive. The tool spindle 21 incorporates a clamp mechanism for detachably holding the tool. The tool spindle 21 rotates a tool 90 such as a drill, a reamer or a milling cutter about the rotation center axis 101. The tool spindle 21 is movable in the X-axis direction and the Y-axis direction by various feed mechanisms, guide mechanisms and servo motors, etc.

[0026] The machine tool 100 further includes a table 41. The table 41 is a device for fixing a workpiece. A pallet 42 is detachably mounted on the table 41. The table 41 is movable in the Z-axis direction by various feed mechanisms, guide mechanisms, and servo motors. The table 41 is rotatable around an A-axis (an axis that rotates around the X-axis), which is not shown. The mounting section of the table 41 on which the pallet 42 is mounted is rotatable around a C-axis (not shown).

[0027] The machine tool 100 further includes an Automatic Pallet Changer (APC). The Automatic Pallet Changer 50 exchanges pallets 42 between the machining chamber 110 and the setup station 120. Specifically, the Automatic Pallet Changer 50 has an APC arm 52. The APC arm 52 replaces the pallets 42.

[0028] The machining chamber 110 is the space where the workpiece is machined. The tool spindle 21 and table 41 are located in the machining chamber 110. The machine tool 100 further includes an automatic tool changer (not shown). The automatic tool changer changes the tool 90 mounted on the tool spindle 21.

[0029] The setup station 120 is the space where workpieces are attached to the pallet 42. The setup station 120 is equipped with a pallet mounting platform (not shown) on which the pallet 42 is placed.

[0030] The machine tool 100 further includes a control panel 81. The control panel 81 is a general-purpose computer. The control panel 81 has an upper panel 82 and a lower panel 83. The upper panel 82 includes a touchscreen that displays manuals or various application screens, and is operated when using applications. The lower panel 83 includes a touchscreen that displays the operating status of the machine tool 100 or the machining status of the workpiece, and is operated when operating the machine tool 100, as well as operating parts such as buttons or switches that are operated when operating the machine tool 100.

[0031] The machine tool 100 further includes a cover body 31. The cover body 31 partitions the machining chamber 110 and also forms the exterior of the machine tool 100. The machining chamber 110 is sealed by the cover body 31 to prevent foreign matter such as chips and coolant generated during workpiece processing from leaking out of the machining chamber 110.

[0032] The cover body 31 includes covers 32, 36, 37, 38, 65, 66, telescopic covers 34, 62, 63, a door 35, an ATC shutter 33, a protective cover 61, and a ceiling cover 39. Covers 32, 38 and telescopic covers 34, 63 are erected. Cover 32 and the ATC shutter 33 are positioned opposite each other in the X-axis direction. The ceiling cover 39 is located on the ceiling of the processing room 110.

[0033] Door 35 is positioned in an opening provided in cover 32. Door 35 is capable of sliding to open and close the opening provided in cover 32. ATC shutter 33 is positioned in an opening provided in cover 38. ATC shutter 33 is capable of sliding to open and close the opening provided in cover 38. The automatic tool changer is positioned on the opposite side of the machining chamber 110, with the ATC shutter 33 in between.

[0034] The telescopic cover 34 is configured to be deformable in accordance with the movement of the tool spindle 21 in the X-axis and Y-axis directions. The tool spindle 21 protrudes from the telescopic cover 34 in the Z-axis direction.

[0035] Covers 65 and 66 are located on the side of cover 38. Cover 66 is located above cover 65. Covers 65 and 66 are continuous. Covers 65 and 66 are inclined downward toward the conveyor 46, which will be described later. Cover 65 extends diagonally downward toward the conveyor 46 from the lower end of cover 66. Covers 65 and 66 form a stepped slope. The length of cover 65 in the Z-axis direction is longer than the length of cover 66 in the Z-axis direction. Cover 65 has a first portion 651 on the tool spindle 21 side and a second portion 652 on the opposite side of the first portion 651. The second portion 652 is the lower portion of cover 66.

[0036] Covers 36 and 37 are positioned on the floor of the machining chamber 110. Covers 36 and 37 are spaced apart from each other in the X-axis direction. Cover 36 extends diagonally downward from the lower end of cover 32 toward cover 37. Cover 37 extends diagonally downward from the lower end of cover 38 toward cover 36. Cover 37 is adjacent to covers 65 and 66 in the Z-axis direction. Cover 37 is adjacent to the automatic pallet changer 50. In the Z-axis direction, cover 37 is further away from the tool spindle 21 than covers 65 and 66.

[0037] The machine tool 100 further includes a conveyor 46. The conveyor 46 is located between the telescopic cover 62 and cover 65 in the X-axis direction. The conveyor 46 extends in the Z-axis direction. The conveyor 46 removes chips generated during workpiece processing from the machining chamber 110.

[0038] The telescopic covers 62 and 63 are configured to be deformable in accordance with the movement of the table 41 in the Z-axis direction. The telescopic cover 62 is located on the floor of the machining chamber 110. In the X-axis direction, the telescopic cover 62 is located between the cover 36 and the conveyor 46. The telescopic cover 62 has a first portion 621 on the tool spindle 21 side and a second portion 622 on the opposite side of the first portion 621.

[0039] The protective cover 61 protects the table 41 from above. The protective cover 61 is located between the first part 621 and the second part 622 in the Z-axis direction.

[0040] Figure 3 is a diagram illustrating the configuration of a device for removing chips from a workpiece. As shown in Figure 3, the machine tool 100 further includes a camera 210, a cleaning device 300, a controller 500, an oil conditioner 800, and a valve 850.

[0041] The cleaning device 300 cleans the processing chamber 110 with coolant. The cleaning device 300 includes nozzles 301 to 309, valves 351 to 359, a coolant tank 371, and a pump 372.

[0042] Camera 210 images the processing room 110. Camera 210 periodically transmits image data of the processing room 110 to the controller 500. Camera 210 may be a CCD (Charge Coupled Device) camera or another type of camera. Camera 210 is installed so as to be able to photograph the processing room 110. Camera 210 is installed in the processing room 110. In this example, camera 210 is attached to the ceiling cover 39. Camera 210 is not limited to the ceiling cover 39, and may be attached to, for example, cover 32 or cover 38. Note that the number of cameras is not limited to one, but may be multiple.

[0043] The coolant tank 371 consists of a box-shaped body capable of storing coolant. The coolant tank 371 is placed on the floor of a factory or other facility where the machine tool 100 is installed. Coolant is stored in the coolant tank 371. The pump 372 is installed on the coolant tank 371. When the pump 372 is driven, it sends the coolant stored in the coolant tank 371 to the nozzles 301 to 309 via valves 351 to 359. The pump 372 also supplies coolant to the oil conditioner 800 via valve 850.

[0044] The controller 500 acquires image data from the camera 210. The controller 500 controls the operation of the pump 372. The controller 500 includes a processor and memory that stores programs and various data. The controller 500 controls the operation of valves 351-359 and 850. Details of the controller 500's control will be described later.

[0045] Valves 351-359,850 are solenoid valves. In this example, valves 351-359,850 are solenoid valves. Valves 351-359,850 operate according to commands from controller 500. Valves 351-359,850 can be either open or closed according to commands from controller 500. Valves 351-359,850 can configure or block the flow path of coolant.

[0046] Nozzle 301 is attached to the ceiling cover 39. The nozzle 301 allows for changing the direction of coolant discharge (release). The direction of coolant discharge from nozzle 301 is controlled by controller 500. Nozzle 301 is connected to pump 372 via valve 351. When valve 351 is open, coolant is supplied to nozzle 301 when pump 372 is driven. As a result, coolant is discharged from nozzle 301. When valve 351 is closed, coolant is not supplied to nozzle 301 even if pump 372 is driven. This supply stoppage is the same for the other nozzles 302 to 309, which will be described later.

[0047] Nozzle 302, like nozzle 301, is mounted on the ceiling cover 39. Nozzle 302, like nozzle 301, allows for the change of coolant discharge direction. The coolant discharge direction of nozzle 302 is controlled by controller 500. Nozzle 302 is connected to pump 372 via valve 352. When valve 352 is open, coolant is supplied to nozzle 302 as pump 372 is driven. This causes coolant to be discharged from nozzle 302.

[0048] Nozzle 303, like nozzles 301 and 302, is mounted on the ceiling cover 39. Nozzle 303 has multiple discharge ports arranged at predetermined intervals in the Z-axis direction. Nozzle 303 is connected to pump 372 via valve 353. When valve 353 is open, coolant is supplied to nozzle 303 as pump 372 is driven. As a result, coolant is discharged from each discharge port of nozzle 303.

[0049] The nozzle 304 is attached to the ceiling cover 39. The nozzle 304 has a fixed direction for discharging coolant. The nozzle 304 is connected to the pump 372 via a valve 354. When the valve 354 is open, coolant is supplied to the nozzle 304 as the pump 372 is driven. As a result, coolant is discharged from the nozzle 304.

[0050] Nozzle 305, like nozzle 304, is attached to the ceiling cover 39. Like nozzle 304, the coolant discharge direction of nozzle 305 is fixed. Nozzle 305 is connected to pump 372 via valve 355. When valve 355 is open, coolant is supplied to nozzle 305 as pump 372 is driven. This causes coolant to be discharged from nozzle 305.

[0051] The nozzle 306 is provided on the tool spindle 21. The nozzle 306 includes a first discharge section 306a and a second discharge section 306b located below the first discharge section 306a. The first discharge section 306a is positioned higher than the tool 90 attached to the tip of the tool spindle 21. The second discharge section 306b is positioned lower than the tool 90. The nozzle 306 is connected to a pump 372 via a valve 356. When the valve 356 is open, coolant is supplied to the nozzle 306 as the pump 372 is driven. As a result, coolant is discharged from the first and second discharge sections 306a and 306b of the nozzle 306. Specifically, the first discharge section 306a discharges coolant toward the tool 90 (diagonally downward). The second discharge section 306b discharges coolant toward the tool 90 (diagonally upward).

[0052] The nozzle 307 is located in the machining chamber 110, on the side of the setup station 120. The nozzle 307 is located on the side of the cover 37. The nozzle 307 is connected to the pump 372 via a valve 357. When the valve 357 is open, coolant is supplied to the nozzle 307 as the pump 372 is driven. As a result, coolant is discharged from the nozzle 307.

[0053] The nozzle 308 is located in the machining chamber 110, on the side of the cover 32. The nozzle 308 is installed below the cover 36. The nozzle 308 has multiple discharge ports arranged at predetermined intervals in the Z-axis direction. The nozzle 308 is connected to the pump 372 via a valve 358. When the valve 358 is open, coolant is supplied to the nozzle 308 as the pump 372 is driven. As a result, coolant is discharged from the nozzle 308. Specifically, the nozzle 308 discharges coolant toward the second portion 622 side of the telescopic cover 62.

[0054] The nozzle 309 is arranged on the door 35 side in the processing chamber 110. Similar to the nozzle 308, the nozzle 309 is installed below the cover 36. The nozzle 309 is installed closer to the telescopic cover 34 side than the nozzle 308. The nozzle 309, similar to the nozzle 308, has a plurality of discharge ports arranged at a predetermined interval in the Z-axis direction. The nozzle 309 is connected to the pump 372 via the valve 359. When the valve 359 is in the open state, coolant is supplied to the nozzle 309 as the pump 372 is driven. As a result, the coolant is discharged from the nozzle 309. Specifically, the nozzle 309 discharges the coolant toward the first part 621 side of the telescopic cover 62.

[0055] <B: Relationship between the regions in the processing chamber and the nozzles> FIG. 4 is a diagram showing a plurality of regions in the processing chamber 110. FIG. 5 is a diagram for explaining the regions to be cleaned by each of the nozzles 301 to 309 among the plurality of regions shown in FIG. 4.

[0056] Referring to FIGS. 4 and 2, the region R1 is the region of the surface (upper surface) of the cover 36. The region R2 is the region of the surface of the second part 622 of the telescopic cover 62. The region R3 is the region of the surface (upper surface) of the protect cover 61. The region R4 is the region of the surface of the first part 621 of the telescopic cover 62.

[0057] The region R5 is the region of the surface of the APC arm 52. The region R6 is the region of the surface of the cover 37. The region R7 is the region combining the region of the surface of the cover 66 and the region of the surface of the second part 652 of the cover 65.

[0058] The region R8 is the region of the table 41. The region R8 includes the region on the upper surface side of the table 41. When the pallet 42 is placed on the table 41, the region R8 includes the surface of the pallet 42.

[0059] Region R9 is the region combining the surface of cover 38, the surface of ATC shutter 33, the surface of telescopic cover 63, and the surface of the first part 651 of cover 65. Region R10 is the region of the surface of telescopic cover 34. Region R11 is the region of the upper surface of tool spindle 21. Region R12 is the region of tool 90.

[0060] Referring to FIGS. 3 to 5, as shown in data D1, region R1 is washed by the coolant discharged from nozzle 301. Region R2 is washed by the coolant discharged from nozzle 308. Region R3 is washed by the coolant discharged from nozzle 301 and / or nozzle 302. Region R4 is washed by the coolant discharged from nozzle 302 and / or nozzle 309. Region R5 is washed by the coolant discharged from nozzle 301 and / or nozzle 302. Region R6 is washed by the coolant discharged from nozzle 307.

[0061] Region R7 is washed by the coolant discharged from nozzle 303. Region R8 is washed by the coolant discharged from nozzles 301, 302. Region R9 is washed by the coolant discharged from nozzle 303. Region R10 is washed by the coolant discharged from nozzle 305. Region R11 is washed by the coolant discharged from nozzle 304. Region R12 is washed by the coolant discharged from nozzle 306.

[0062] Controller 500 holds the data showing the relationship between the nozzles and the regions shown in FIG. 5.

[0063] <C: Judgment of Chip Deposition State> The controller 500 determines the chip accumulation state in each region R1 to R12. Specifically, the controller 500 determines the chip accumulation state of the workpiece in the machining chamber 110 for each region R1 to R12 based on the image obtained by the camera 210 and two different judgment criteria #1 and #2. This judgment process is typically achieved by the processor included in the controller 500 executing a program stored in memory.

[0064] Specifically, the controller 500 determines the level of chip accumulation in each region R1 to R12. The controller 500 uses two criteria #1 and #2 to classify the chip accumulation state in each of the multiple regions R1 to R12 into levels. In this example, the controller 500 divides the accumulation state into three levels.

[0065] In the following, the levels of accumulation will be referred to as "Level 0," "Level 1," and "Level 2," in descending order. Level 0 indicates no chips or only a small amount of chips. Level 1 indicates a normal amount of chips (moderate). Level 2 indicates a large amount of chips.

[0066] For the sake of clarity, the following explanation will focus on region R2 among the multiple regions R1 to R12. Three case examples will be provided for further details.

[0067] (Case 1) Figure 6 shows an example of chip deposition. More specifically, Figure 6 shows a state where chips are deposited throughout the entire region R2.

[0068] The controller 500 performs the following processing to determine the level of chip accumulation in region R2. As described above, the controller 500 acquires image data from the camera 210. The controller 500 divides the image of region R2 from the image data into multiple regions (hereinafter referred to as "element regions Ei"). The controller 500 acquires the chip accumulation state in each element region Ei. In this example, as shown in Figure 6, region R2 is divided into 72 element regions Ei. In this case, the value of i is a natural number between 1 and 72.

[0069] The controller 500 divides the deposition state in the element region Ei into three levels, similar to the three levels (levels 0-2) described above. The first level (hereinafter also referred to as "level L") is a state with no chips or only a small amount of chips. The second level (hereinafter also referred to as "level M") is a state with a moderate amount of chips. The third level (hereinafter also referred to as "level H") is a state with a large amount of chips.

[0070] In the example in Figure 6, out of 72 element regions Ei, there were 37 regions at level L, 32 regions at level M, and 3 regions at level H, respectively. Note that in Figure 6, the spacing between hatching lines is narrowed in the order of level L, level M, and level H. This is also the case in Figures 8 and 10, which will be discussed later.

[0071] Figure 7 is a diagram illustrating the level determination of region R2 in this case. Referring to Figure 7, the controller 500 assigns weights to the number of element regions Ei at each level. In this example, the controller 500 assigns weights of 0, 3, and 8 points to the element regions Ei at level L, M, and H, respectively.

[0072] In the example in Figure 6, there are 37 element regions Ei at level L, but the weighting score for these 37 element regions Ei is 0, so the controller 500 does not assign any points. There are 32 element regions Ei at level M, so the controller 500 assigns a weight of 3 points to these 32 element regions Ei, resulting in 96 points (= 3 points × 32). There are 3 element regions Ei at level H, so the controller 500 assigns a weight of 8 points to these 3 element regions Ei, resulting in 24 points (= 8 points × 3).

[0073] The controller 500 calculates the total score of the 72 element regions Ei obtained by the above weighting. In this example, the controller 500 calculates the sum of 0 points, 96 points, and 24 points, obtaining a total score of 120 points.

[0074] Next, the controller 500 determines the level of accumulation in region R2 using two criteria #1 and #2. Criterion #1 is a criterion for determining whether chips have accumulated throughout region R2. Criterion #2 is a criterion for determining whether chips have accumulated locally in region R2.

[0075] Specifically, criterion #1 determines that chips have accumulated throughout the entire region R2 if the score #1 shown in the following formula (1) is equal to or greater than the threshold for criterion #1 (hereinafter also referred to as the "first threshold").

[0076] Score #1 = Total score / (Number of element regions Ei in region R2 × Score with the highest weight) × 100 … (1) In this example, the total score is 120 points, the number of element regions Ei in region R2 is 72, and the highest weighted score is 8 points. Therefore, controller 500 obtains a score of 20.8 (= 120 points / (8 points × 72 elements) × 100) as score #1. Since score #1 is above the first threshold (15 in this example), controller 500 determines that chips have accumulated throughout region R2.

[0077] Criterion #2 is that if the score #2 shown in the following formula (2) is equal to or greater than the threshold for Criterion #2 (hereinafter also referred to as the "second threshold"), then it is determined that chips have accumulated locally in region R2.

[0078] Score #2 = Score of level H obtained by weighting / (Number of element regions Ei in region R2 × Score of the highest weight) × 100 … (2) In this example, the weighted score for level H is 24 points, the number of element regions Ei in region R2 is 72, and the highest weighted score is 8 points. Therefore, the controller 500 obtains a score of 4.2 (=24 points / (8 points × 72 elements) × 100) as score #2. Since score #2 is less than the second threshold (10 in this example), the controller 500 determines that no chips have accumulated locally in region R2.

[0079] The controller 500 uses the above-mentioned determination results based on the two determination criteria #1 and #2 to determine the level of chip accumulation in region R2. The specific determination method is as follows:

[0080] If it is determined that chips are deposited throughout region R2, and that chips are deposited locally within region R2, the controller 500 determines the deposition level of region R2 to be level 2.

[0081] If it is determined that chips are deposited throughout region R2 and that chips are not deposited locally within region R2, the controller 500 determines the deposition level of region R2 to be level 1. Conversely, if it is determined that chips are not deposited throughout region R2 and that chips are deposited locally within region R2, the controller 500 also determines the deposition level of region R2 to be level 1.

[0082] If it is determined that chips are not deposited throughout the entire region R2, and that chips are not deposited locally within region R2, the controller 500 determines the deposition level of region R2 to be level 0.

[0083] In this case, since it was determined that chips were deposited throughout region R2 and that there was no localized accumulation of chips in region R2, the controller 500 determined the accumulation level in region R2 to be level 1.

[0084] (Second case) Figure 8 shows another example of chip accumulation. Specifically, Figure 8 shows a state where chips are locally accumulated in region R2. Figure 9 is a diagram to explain the level determination of region R2 in this case.

[0085] Referring to Figure 8, out of the 72 element regions Ei, there were 61 regions at level L, 3 regions at level M, and 8 regions at level H, respectively.

[0086] In the example in Figure 8, there are 61 element regions Ei at level L, but the weighting score for these 61 element regions Ei is 0, so the controller 500 does not assign any points. There are 3 element regions Ei at level M, so the controller 500 assigns a weight of 3 points to these 3 element regions Ei, resulting in 9 points (= 3 points × 3). There are 8 element regions Ei at level H, so the controller 500 assigns a weight of 8 points to these 8 element regions Ei, resulting in 64 points (= 8 points × 8).

[0087] The controller 500 calculates the total score for the 72 element regions Ei obtained by weighting. In this example, the controller 500 calculates the sum of 0, 9, and 64 points, obtaining a total score of 73 points. Next, the controller 500 determines the deposition level of region R2 using two criteria #1 and #2.

[0088] Regarding criterion #1, the total score is 73 points, the number of element regions Ei in region R2 is 72, and the highest weighted score is 8 points. Therefore, based on equation (1) above, controller 500 obtains score #1 as 12.7 (= 73 points / (8 points × 72 elements) × 100). Since score #1 is less than the first threshold (15 in this example), controller 500 determines that chips have not accumulated throughout the entire region R2.

[0089] Regarding criterion #2, the weighted score for level H is 64 points, the number of element regions Ei in region R2 is 72, and the highest weighted score is 8 points. Therefore, based on equation (2) above, the controller 500 obtains 11.1 (= 64 points / (8 points × 72 elements) × 100) as score #2. Since score #2 is above the second threshold (10 in this example), the controller 500 determines that chips are locally accumulated in region R2.

[0090] Thus, in this case, it was determined that the chips were not deposited throughout the entire region R2, but rather locally deposited within region R2. Therefore, the controller 500 determines the deposition level in region R2 to be level 1.

[0091] (Case 3) Figure 10 shows yet another example of chip accumulation. Specifically, Figure 10 shows chips accumulated both throughout and locally across region R2. Figure 11 is a diagram illustrating the level determination of region R2 in this case.

[0092] Referring to Figure 10, out of the 72 element regions Ei, there were 33 regions at level L, 28 regions at level M, and 11 regions at level H, respectively.

[0093] In the example in Figure 10, there are 33 element regions Ei at level L, but the weighting score for these 33 element regions Ei is 0, so the controller 500 does not assign any points. There are 28 element regions Ei at level M, so the controller 500 assigns a weight of 3 points to these 28 element regions Ei, resulting in 84 points (= 3 points × 28). There are 11 element regions Ei at level H, so the controller 500 assigns a weight of 8 points to these 11 element regions Ei, resulting in 88 points (= 8 points × 11).

[0094] The controller 500 calculates the total score for the 72 element regions Ei obtained by weighting. In this example, the controller 500 calculates the sum of 0, 84, and 88 points, obtaining a total score of 172 points. Next, the controller 500 determines the deposition level of region R2 using two criteria #1 and #2.

[0095] Regarding criterion #1, the total score is 172 points, the number of element regions Ei in region R2 is 72, and the highest weighted score is 8 points. Therefore, based on equation (1) above, controller 500 obtains score #1 as 29.9 (= 172 points / (8 points × 72 elements) × 100). Since score #1 is equal to or greater than the first threshold (15 in this example), controller 500 determines that chips have accumulated throughout region R2.

[0096] Regarding criterion #2, the weighted score for level H is 88 points, the number of element regions Ei in region R2 is 72, and the highest weighted score is 8 points. Therefore, controller 500 obtains a score of 15.3 (= 88 points / (8 points × 72 elements) × 100) as score #2. Since score #2 is equal to or greater than the second threshold (10 in this example), controller 500 determines that chips are locally accumulated in region R2.

[0097] Thus, in this case, it was determined that chips were deposited throughout region R2, and that chips were also deposited locally within region R2. Therefore, the controller 500 determined the deposition level in region R2 to be level 2.

[0098] Note that the above three cases are each an example, and the chip accumulation states in the region R2 are various. Also, although the region R2 was described as an example above, the controller 500 performs the processes described based on the region R2 for each of the other regions R1, R3 to R12. That is, the controller 500 determines the chip accumulation level for each of the twelve regions R1 to R12.

[0099] <D: Cleaning> The controller 500 switches the presence or absence of cleaning according to the chip accumulation level in each of the regions R1 to R12. Further, when cleaning, the controller 500 changes the coolant pressure according to the accumulation level. Specifically, it is as follows.

[0100] The controller 500 does not discharge coolant from the nozzles corresponding to the regions determined to be level 0 among the regions R1 to R12. The controller 500 discharges coolant from the nozzles corresponding to the regions determined to be level 1 or level 2 among the regions R1 to R12.

[0101] The controller 500 discharges a high-pressure or large-flow coolant to the regions determined to be level 2 rather than the regions determined to be level 1 among the regions R1 to R12. At that time, in order to discharge a high-pressure or large-flow coolant, the controller 500 discharges coolant only from the nozzles for the regions determined to be level 2 among the plurality of nozzles 301 to 309. Such control of the coolant discharge pressure is realized by controlling the output of the pump 372 and the switching control of the valves 351 to 359.

[0102] FIG. 12 is a diagram showing the chip accumulation levels of the regions R1 to R12 in a certain aspect. As shown in FIG. 12, the controller 500 temporarily stores in the memory the data D2 indicating the accumulation levels determined for each of the regions R1 to R12.

[0103] In this example, the sediment level in regions R1, R2, R6, R7, and R10 is level 0. The sediment level in regions R3, R5, R8, and R9 is level 1. The sediment level in region R4 is level 2.

[0104] Figure 13 illustrates the cleaning method when the level determination shown in data D2 of Figure 12 is performed. In this example, the controller 500 instructs the cleaning device 300 to preferentially clean the level 2 area. Specifically, in this example, the controller 500 sets the output of the pump 372 to 95% (95% of the maximum output) and instructs the cleaning device 300 to clean area R4 for 10 seconds, from 0 seconds to 10 seconds. Specifically, the controller 500 opens only valve 359 of the valves 351 to 359 and discharges coolant from nozzle 309, thereby instructing the cleaning device 300 to clean area R4.

[0105] Next, the controller 500 keeps the output of the pump 372 at 95% and causes the cleaning device 300 to continuously clean area R4 for 20 seconds, from 10 to 30 seconds. Specifically, the controller 500 opens only valve 352 of the valves 351 to 359 and discharges coolant from nozzle 302, thereby causing the cleaning device 300 to clean area R4.

[0106] Subsequently, the controller 500 changes the output of the pump 372 from 95% to 80%, causing the cleaning device 300 to clean area R9 for 10 seconds, from 30 to 40 seconds. Specifically, the controller 500 opens only valve 353 among valves 351 to 359, causing the cleaning device 300 to clean area R9 by discharging coolant from nozzle 303.

[0107] Subsequently, the controller 500 keeps the output of the pump 372 at 80% and causes the cleaning device 300 to clean area R8 for 20 seconds, from 40 to 60 seconds. Specifically, the controller 500 opens only valves 351 and 352 of the valves 351 to 359 and discharges coolant from nozzles 301 and 302, thereby causing the cleaning device 300 to clean area R8. During this time, the cleaning device 300 cleans one area R8 using the two nozzles 301 and 302.

[0108] Finally, the controller 500 keeps the output of the pump 372 at 80% and causes the cleaning device 300 to simultaneously clean areas R3 and R5 for 15 seconds, from 60 to 75 seconds. Specifically, the controller 500 controls the discharge direction of the coolant from nozzles 301 and 302. Furthermore, the controller 500 opens only valves 351 and 352 of valves 351 to 359, causing the cleaning device 300 to clean area R3 by discharging coolant from nozzle 301, and to clean area R5 by discharging coolant from nozzle 302. During this time, the cleaning device 300 cleans both areas R3 and R5 using the two nozzles 301 and 302. This shortens the cleaning time compared to cleaning the two areas R3 and R5 individually.

[0109] Subsequently, the controller 500 changes the output of the pump 372 from 80% to 65% and continues to supply coolant to the oil conditioner 800 via the valve 850. Note that an output of 80% is an example of the “first output” in this disclosure. An output of 95% is an example of the “second output” in this disclosure.

[0110] Figure 14 shows the chip accumulation levels in each region R1 to R12 in a different configuration than that shown in Figure 12. As shown in Figure 14, the controller 500 temporarily stores data D3, which indicates the accumulation level determined for each region R1 to R12, in memory.

[0111] In this example, the sediment levels in regions R1, R2, R6, R7, and R10 are level 0. The sediment levels in regions R3, R4, R5, R8, and R9 are level 1. There are no regions with a sediment level of level 2.

[0112] Figure 15 illustrates the cleaning method when the level determination shown in data D3 of Figure 14 is performed. As shown in Figure 15, the controller 500 sets the output of the pump 372 to 80% and causes the cleaning device 300 to clean areas R4 and R9 simultaneously for 10 seconds, from 00 seconds to 10 seconds. Specifically, the controller 500 opens only valves 353 and 359 of the valves 351 to 359 and causes the cleaning device 300 to clean area R4 by discharging coolant from nozzle 309, and also causes the cleaning device 300 to clean area R9 by discharging coolant from nozzle 303. During this time, the cleaning device 300 cleans the two areas R4 and R9 using the two nozzles 303 and 309.

[0113] Next, the controller 500 keeps the output of the pump 372 at 80% and causes the cleaning device 300 to clean area R8 for 20 seconds, from 10 to 30 seconds. Specifically, the controller 500 opens only valves 351 and 352 of the valves 351 to 359 and causes the cleaning device 300 to clean area R8 by discharging coolant from nozzles 301 and 302. During this time, the cleaning device 300 cleans one area R8 using the two nozzles 301 and 302.

[0114] Finally, the controller 500 causes the cleaning device 300 to simultaneously clean regions R3 and R5 for 15 seconds from 30 seconds to 45 seconds while keeping the output of the pump 372 at 80%. Specifically, the controller 500 controls the discharge direction of the coolant from the nozzles 301 and 302. Further, the controller 500 keeps only the valves 351 and 352 among the valves 351 to 359 in the open state, discharges the coolant from the nozzle 301 to clean the region R5 of the cleaning device 300, and discharges the coolant from the nozzle 302 to clean the region R3 of the cleaning device 300. In this time period, the cleaning device 300 cleans the two regions R3 and R5 using the two nozzles 301 and 302.

[0115] After that, the controller 500 changes the output of the pump 372 from 80% to 65% and continuously supplies the coolant to the oil conditioner 800 via the valve 850.

[0116] In the above description, 95%, 80%, and 65% are given as examples of the output of the pump 372, but it is not limited thereto. In the case of level 2, it is preferable that the output of the pump 372 be 90% or more. The order of cleaning each region is not limited to the above order. The cleaning time for each region is not limited to the above time.

[0117] <E: Functional Configuration> FIG. 16 is a block diagram for explaining the functional configuration of the machine tool 100. Referring to FIG. 16, the machine tool 100 includes the camera 210, the controller 500, and the cleaning device 300 as described above. The cleaning device 300 has the pump 372, the plurality of valves 351 to 359, and the plurality of nozzles 301 to 309 as described above.

[0118] The controller 500 includes an extraction unit 510, a determination unit 520, a pump control unit 530, and a valve control unit 540. The determination unit 520 includes a division unit 521, a score calculation unit 522, a first individual determination unit 523, and a second individual determination unit 524. The extraction unit 510, the determination unit 520, the pump control unit 530, and the valve control unit 540 are functional blocks realized by the processor executing a program stored in memory.

[0119] The extraction unit 510 extracts image portions corresponding to each of the multiple regions R1 to R12 from the image captured by the camera 210. Specifically, the extraction unit 510 extracts image data (hereinafter referred to as "image data G1 to G12") corresponding to each of the multiple regions R1 to R12 from the image data acquired from the camera 210. The extraction unit 510 sends the extracted multiple image data G1 to G12 to the determination unit 520.

[0120] The determination unit 520 determines the chip accumulation state in each region R1 to R12. Specifically, the determination unit 520 determines the chip accumulation state of the workpiece in the machining chamber 110 for each region R1 to R12 based on the image obtained by the camera 210 and two different determination criteria #1 and #2. In particular, the determination unit 520 determines the chip accumulation level in each region R1 to R12.

[0121] The determination unit 520 receives image data G1 to G12. Based on the image data G1 to G12, the determination unit 520 determines the level of chip accumulation in each region R1 to R12. For example, based on image data G1, the determination unit 520 determines the level of chip accumulation in each region R1. Similarly, based on image data G2, the determination unit 520 determines the level of chip accumulation in each region R2.

[0122] For the sake of clarity, the processing of the determination unit 520 will be explained below using image data G2, which corresponds to region R2, as an example. Note that the same processing is performed on the other regions R1, R3 to R12 as on region R2. Therefore, the processing of the other regions R1, R3 to R12 will not be repeated.

[0123] As shown in Figure 6, the division unit 521 divides the image of region R2 into multiple element regions Ei. The division unit 521 divides the image of region R2 into 72 element regions Ei, each of which is square. Specifically, the division unit 521 extracts element image data (hereinafter referred to as "element image data GE1 to GE72") corresponding to each of the multiple element regions E1 to E72 from the image data of region R2. Each of the multiple element image data GE1 to GE72 contains multiple pixel data (pixel values ​​of multiple pixels).

[0124] The score calculation unit 522 determines the accumulation level of each element region Ei based on multiple element image data GE1 to GE72. Specifically, the score calculation unit 522 determines the accumulation level of each element region Ei to be one of level L, level M, or level H. Furthermore, the score calculation unit 522 calculates the number of element regions Ei at level L, the number of element regions Ei at level M, and the number of element regions Ei at level H.

[0125] Next, the score calculation unit 522 performs the weighting process described above. Specifically, the score calculation unit 522 assigns weights such that element area Ei at level L is 0 points, element area Ei at level M is 3 points, and element area Ei at level H is 8 points. As a result, for example, in the first case described above, the score calculation unit 522 calculates 0 points, 96 points, and 24 points, as shown in Figure 7. Furthermore, the score calculation unit 522 sums the three calculated scores. In the first case, the score calculation unit 522 adds 0 points, 96 points, and 24 points to obtain 120 points.

[0126] (Judgment based on criterion #1) The sum of the three scores is sent to the first individual determination unit 523. In the first case described above, the score calculation unit 522 notifies the first individual determination unit 523 of 120 points. The first individual determination unit 523 makes a determination based on the determination criterion #1 described above. That is, the first individual determination unit 523 determines whether or not chips are accumulated throughout the entire region R2.

[0127] Specifically, the first individual judgment unit 523 calculates score #1 based on the formula (1) described above. In the first case described above, the first individual judgment unit 523 multiplies 72 by 8 points to get 576 points, divides 120 points by this value of "0.208", and multiplies this by 100. As a result, the first individual judgment unit 523 obtains "20.8" as score #1. Furthermore, the first individual judgment unit 523 determines whether the calculated score #1 is equal to or greater than the first threshold (15 points).

[0128] (Judgment based on criterion #2) The total score of the element region Ei at level H after weighting is sent to the second individual determination unit 524. In the first case, the score calculation unit 522 notifies the second individual determination unit 524 of 24 points. The second individual determination unit 524 makes a determination based on the determination criterion #2 described above. That is, the second individual determination unit 524 determines whether or not chips are locally accumulated in region R2.

[0129] Specifically, the second individual judgment unit 524 calculates score #2 based on the above-mentioned formula (2). In the first case described above, the second individual judgment unit 524 multiplies 72 by 8 points to get 576 points, divides 24 points by this value, and multiplies the result "0.042" by 100. As a result, the second individual judgment unit 524 obtains "4.2" as score #1. Furthermore, the second individual judgment unit 524 determines whether the calculated score #2 is equal to or greater than the second threshold (10 points).

[0130] (Overall assessment) The determination unit 520 determines the level of chip accumulation in region R2 based on the determination result from the first individual determination unit 523 and the determination result from the second individual determination unit 524. Specifically, the determination unit 520 identifies the accumulation level in region R2 as one of the above-mentioned "level 0", "level 1", or "level 2".

[0131] Specifically, if the first individual determination unit 523 determines that score #1 is equal to or greater than the first threshold (15 points), and the second individual determination unit 524 determines that score #2 is equal to or greater than the second threshold (10 points), the determination unit 520 identifies the deposition level of region R2 as level 2.

[0132] If score #1 is equal to or greater than the first threshold and score #2 is less than the second threshold, the determination unit 520 identifies the deposition level of region R2 as level 1. Similarly, if score #1 is less than the first threshold and score #2 is equal to or greater than the second threshold, the determination unit 520 identifies the deposition level of region R2 as level 1. If score #1 is less than the first threshold and score #2 is less than the second threshold, the determination unit 520 identifies the deposition level of region R2 as level 0.

[0133] Furthermore, the determination unit 520 determines not only the chip accumulation level in region R2, but also the chip accumulation levels in the other regions R1, R3 to R12.

[0134] (Control of the cleaning device) The pump control unit 530 operates the pump 372. In this example, as shown in Figure 3, coolant is supplied from the pump 372 to the oil conditioner 800 via the valve 850. Therefore, as long as the oil conditioner 800 is operating, the pump control unit 530 will operate the pump 372 regardless of the level of chip accumulation in the machining chamber 110.

[0135] The pump control unit 530 and the valve control unit 540 receive notification of the deposit level in each region R1 to R12 from the determination unit 520.

[0136] The pump control unit 530 controls the output of the pump 372 based on the chip accumulation levels in each of the regions R1 to R12. When the accumulation level in a certain region (for example, region R2) is level 1, the pump control unit 530 sets the output of the pump 372 to 80% of the output at the timing of cleaning the said region. When the accumulation level in the said region is level 2, the pump control unit 530 sets the output of the pump 372 to 95% at the timing of cleaning the said region.

[0137] The valve control unit 540 controls the opening and closing operations of the valves 351 to 359, 850. The valve control unit 540 controls the timing to open and close each of the valves 351 to 359. When the valve is opened by the valve control unit 540, the coolant is discharged from the nozzle connected to the said valve. Thereby, the region (Figure 5) corresponding to the said valve among the plurality of regions R1 to R12 can be cleaned.

[0138] <F: Control Structure> Figure 17 is a flowchart for explaining the flow of the process executed by the machine tool 100. Referring to Figure 17, in step S1, the camera 210 images the machining chamber 110 of the machine tool 100. In step S2, based on the image obtained by imaging and two determination criteria #1 and #2, the controller 500 determines the accumulation state (level) of the chips of the workpiece in each of the regions R1 to R12 in the machining chamber 110.

[0139] In step S3, the controller 500 determines whether there is a region with level 2 among the plurality of regions R1 to R12. If it is determined that there is a region with level 2 (YES in step S3), in step S4, the controller 500 determines whether there is a region with level 1 among the plurality of regions R1 to R12.

[0140] If it is determined that a Level 1 area exists (YES in step S4), the controller 500 instructs the cleaning device 300 to clean the Level 2 area with high pressure or high flow rate in step S5. In this example, the controller 500 sets the output of the pump 372 to 95% and instructs the cleaning device 300 to clean the Level 2 area. If there are multiple Level 2 areas, the controller 500 instructs the cleaning device 300 to clean them one by one in sequence with high pressure or high flow rate.

[0141] Next, in step S6, the controller 500 instructs the cleaning device 300 to clean the level 1 area at normal pressure. In this example, the controller 500 sets the output of the pump 372 to 80% and instructs the cleaning device 300 to clean the level 1 area. If there are multiple level 1 areas, the controller 500 instructs the cleaning device 300 to clean all or part of the level 1 areas simultaneously.

[0142] If it is determined that no Level 1 area exists (NO in step S4), the controller 500, in step S7, causes the cleaning device 300 to clean the Level 2 area with high pressure or high flow rate, similar to step S5.

[0143] If it is determined that no Level 2 areas exist (NO in step S3), the controller 500 determines in step S8 whether or not a Level 1 area exists among the multiple areas R1 to R12. If it is determined that a Level 1 area exists (YES in step S8), the controller 500 causes the cleaning device 300 to clean the Level 1 area at normal pressure in step S9, similar to step S6. If it is determined that no Level 1 areas exist (NO in step S9), the controller 500 terminates the process without causing the cleaning device 300 to clean any area (step S10).

[0144] Figure 18 is a flowchart showing the details of the process in step S2 of Figure 17. Each of steps S21 to S27 shown in FIG. 18 is executed for each of regions R1 to R12. Hereinafter, the description will be given by taking region R2 as an example. In step S21, the controller 500 determines whether the chip deposition state in region R2 satisfies determination criterion #1. When it is determined that the criterion #1 is satisfied (YES in step S21), the controller 500 determines, in step S22, whether the chip deposition state in region R2 satisfies determination criterion #2.

[0145] When it is determined that the criterion #2 is satisfied (YES in step S22), the controller 500 determines, in step S23, that the chip deposition level in region R2 is level 2. When it is determined that the criterion #2 is not satisfied (NO in step S22), the controller 500 determines, in step S24, that the chip deposition level in region R2 is level 1.

[0146] When it is determined that the criterion #1 is not satisfied (NO in step S21), the controller 500 determines, in step S25, whether the chip deposition state in region R2 satisfies determination criterion #2.

[0147] When it is determined that the criterion #2 is satisfied (YES in step S25), the controller 500 determines, in step S26, that the chip deposition level in region R2 is level 1. When it is determined that the criterion #2 is not satisfied (NO in step S25), the controller 500 determines, in step S27, that the chip deposition level in region R2 is level 0. Note that the same processing as described above is also executed for the other regions R1, R3 to R12.

[0148] <G: Parentheses and Advantages> For the sake of explanation, in the following, any one of the multiple nozzles 301 to 309 will be referred to as "Nozzle #1," and any other nozzle as "Nozzle #2." Similarly, the area cleaned by Nozzle #1 will be referred to as "Area #1," and the area cleaned by Nozzle #2 will be referred to as "Area #2." Furthermore, of the valves 351 to 359, the valve connected to Nozzle #1 will be referred to as "Valve #1," and the valve connected to Nozzle #2 will be referred to as "Valve #2."

[0149] (1) The machine tool 100 includes a camera 210 that takes images of the machining chamber 110 of the machine tool 100 that processes a workpiece, a determination unit 520 that determines the state of chip accumulation of the workpiece in area #1 of the machining chamber 110 based on the images obtained by imaging, a nozzle #1 that discharges coolant into the machining chamber 110, a pump 372 that supplies coolant to nozzle #1, and a pump control unit 530 that controls the output of the pump 372 based on the state of chip accumulation.

[0150] With this configuration, coolant is discharged from nozzle #1 at a pump output based on the chip accumulation state in region #1. Therefore, with this configuration, region #1 can be cleaned while taking into account the chip accumulation state in region #1.

[0151] (2) Nozzle #1 discharges coolant toward area #1. The determination unit 520 determines the accumulation state in area #1. The pump control unit 530 sets the output of pump 372 to 80% if the chip accumulation state in area #1 is level 1. The pump control unit 530 sets the output of pump 372 to 95%, which is higher than 80%, if the chip accumulation state in area #1 is level 2, where there is more chip accumulation than level 1.

[0152] With this configuration, the higher the level of chip accumulation, the higher the pump output. Therefore, when the chip accumulation level in region #1 is level 2, chips can be removed with higher accuracy compared to when the output of pump 372 is the same as for level 1.

[0153] (3) The machine tool 100 further includes a nozzle #2 to which coolant is supplied from a pump 372 and to which the coolant is discharged toward region #2 of a plurality of regions R1 to R12; a valve #1 which can be configured or blocked by a valve control unit 540 to configure or block the coolant flow path from the pump 372 to nozzle #1 (hereinafter referred to as "flow path #1"); and a valve #2 which can be configured or blocked by a valve control unit 540 to configure or block the coolant flow path from the pump 372 to nozzle #2 (hereinafter referred to as "flow path #2").

[0154] The determination unit 520 further determines the state of chip accumulation in region #2. If the accumulation state in region #1 is level 2 and the accumulation state in region #2 is level 1, the valve control unit 540 sets the output of the pump 372 to 95% and shuts off only flow path #2 of the flow paths #1 and #2 for a predetermined period (hereinafter, "period #1").

[0155] With the above configuration, during period #1, coolant can be discharged from only nozzle #1 of nozzles #1 and #2. Therefore, compared to the case where coolant is discharged from both nozzles #1 and #2 at the same time, high-pressure or high-flow coolant can be discharged into area #1. As a result, chips in area #1 at level 2 can be removed with high accuracy.

[0156] (4) If the deposit state in region #1 is level 2 and the deposit state in region #2 is level 1, the pump control unit 530 switches the output of the pump 372 from 95% to 80% after the elapsed period #1 and shuts off only flow path #1 of the flow paths #1 and #2 for a predetermined period (hereinafter referred to as "period #2").

[0157] With the above configuration, during period #2, coolant can be discharged only from nozzle #2 of nozzles #1 and #2. Therefore, chips in level 1 area #2 can be removed with coolant at a lower pressure than in area #1. Thus, power consumption can be reduced compared to cleaning area #2 with high-pressure or high-flow coolant.

[0158] <H: Variant Example> (1) In the above description, the case where the processing chamber 110 is divided into a plurality of regions R1 to R12 has been described as an example, but it is not limited thereto. The region of the processing chamber 110 may not be divided into a plurality of regions, but may be regarded as one region and cleaned with one or a plurality of nozzle coolants. That is, the deposition state of the chips of the workpiece in the processing chamber 110 may be determined, and the cleaning device 300 may clean the processing chamber 110 with the coolant based on the determined deposition state.

[0159] (2) In the above description, the configuration including one pump 372 has been described as an example, but it is not limited thereto. The machine tool 100 may include a plurality of pumps. For example, the machine tool 100 may be configured such that a certain pump supplies coolant to one or a plurality of nozzles among the nozzles 301 to 309, and another pump supplies coolant to the remaining nozzles.

[0160] (3) In the above description, the case where the controller 500 executes the processes in the order of "acquisition of an image", "division of the entire area of the image into at least regions R1 to 12", and "division of each region R1 to 12 into each element region Ei" has been described as an example, but it is not limited thereto. For example, the controller 500 may execute the processes in the order of "acquisition of an image", "division of the entire area of the image into each element region Ei", and "division of the entire area into at least regions R1 to 12 by grouping a plurality of element regions Ei".

[0161] (4) In the above description, the case where the first threshold value and the second threshold value are set to constant values has been described as an example, but it is not limited thereto. It is preferable to configure the controller 500 such that the user can arbitrarily change the first threshold value and the second threshold value. Since increasing the first threshold value and the second threshold value reduces the cleaning frequency, power consumption can be reduced. Also, if set small, the cleaning frequency increases and the inside of the machine can be kept cleaner.

[0162] (5) In the above example, we explained the case where there are two nozzles simultaneously discharging coolant when the level is determined to be 1, but this is not the only example. For example, there may be three or more nozzles simultaneously discharging coolant.

[0163] The embodiments disclosed herein are illustrative and not limited to those described herein. The scope of the present invention is defined by the claims, and all modifications within the meaning and scope equivalent to the claims are intended to be included. [Explanation of Symbols]

[0164] 21 Tool spindle, 31 Cover body, 32, 36, 37, 38, 65, 66 Cover, 34, 62, 63 Telescopic cover, 33 ATC shutter, 35 Door, 39 Ceiling cover, 41 Table, 42 Pallet, 46 Conveyor, 50 Automatic pallet changer, 52 Arm, 61 Protective cover, 81 Control panel, 82 Upper panel, 83 Panel, 90 Tool, 100 Machine tool, 101 Rotating central axis, 110 Machining chamber, 120 Setup station, 210 Camera, 300 Cleaning device, 301, 302, 303, 304, 305, 306, 307, 308, 309 Nozzle, 306a First discharge section, 306a Second discharge section, 306a, 306b Second discharge unit, 351, 352, 353, 354, 355, 356, 357, 358, 359, 850 Valve, 371 Coolant tank, 372 Pump, 500 Controller, 510 Extraction unit, 520 Judgment unit, 521 Splitting unit, 522 Score calculation unit, 523 First individual judgment unit, 524 Second individual judgment unit, 530 Pump control unit, 540 Valve control unit, 621, 651 First part, 622, 652 Second part, 800 Oil conditioner, D1, D2, D3 Data, Ei Element area, R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12 Area.

Claims

1. An imaging means for imaging the inside of the machining chamber of a machine tool that processes a workpiece, A determination means for determining the state of chip accumulation of the workpiece in the processing chamber based on the image obtained by the aforementioned imaging, A first nozzle for discharging coolant into the machining chamber, A pump that supplies the coolant to the first nozzle, A machine tool comprising control means for controlling the output of the pump based on the state of chip accumulation.

2. The control means is If the deposition state is at a first level, the output of the pump is set to the first output. The machine tool according to claim 1, wherein if the accumulation state is a second level in which more chips are accumulated than the first level, the output of the pump is set to a second output that is higher than the first output.

3. The first nozzle discharges the coolant toward a first region among a plurality of regions within the processing chamber. The determination means determines the deposition state in the first region, The control means is If the deposition state in the first region is at the first level, the output of the pump is set to the first output. The machine tool according to claim 2, wherein the output of the pump is set to the second output when the deposition state in the first region is at the second level.

4. The pump is supplied with the coolant, and a second nozzle discharges the coolant toward a second region among the plurality of regions, The control means provides a first solenoid valve capable of configuring or blocking the first flow path of the coolant from the pump to the first nozzle, The control means further comprises a second solenoid valve capable of configuring or blocking a second flow path of the coolant from the pump to the second nozzle, The determination means further determines the state of chip accumulation in the second region, The machine tool according to claim 3, wherein, if the deposition state in the first region is at the second level, and the deposition state in the second region is at the first level, the control means sets the output of the pump to the second output and blocks only the second flow path of the first and second flow paths for a first period of time.

5. The machine tool according to claim 4, wherein the control means, when the deposition state in the first region is at the second level and the deposition state in the second region is at the first level, switches the output of the pump from the second output to the first output after the elapsed of the first period and blocks only the first flow path of the first and second flow paths for a second period.

6. The machine tool according to claim 2, wherein the second output is 90% or more of the maximum output of the pump.

7. The steps include: imaging the inside of the machining chamber of a machine tool used to process a workpiece, The process includes the step of determining the state of chip accumulation of the workpiece in the processing chamber based on the image obtained by the aforementioned imaging, In the aforementioned machining chamber, coolant is discharged from a nozzle by a pump. A method for cleaning the machining chamber of a machine tool, further comprising the step of controlling the output of the pump based on the state of chip accumulation.

Images