Laser processing machine spatter adhesion suppression device, laser processing machine, and laser processing method

Abstract

Provided is a sputter adhesion suppression device for a laser processing machine that can effectively suppress adhesion of sputter to the inner surface of a pipe while suppressing the accumulation of sputter on a sputter guard when laser processing a pipe-shaped workpiece, a laser processing machine, and a laser processing method. [Solution] A sputter adhesion suppression device for a laser processing machine comprises a sputter guard that is inserted into a pipe and has a tip that receives sputter generated due to laser irradiation of the pipe, an injection unit that injects fluid into the tip of the sputter guard, and an injection device that ejects a sputter adhesion prevention agent onto the tip of the sputter guard and the inner surface of the pipe.

Description

[Technical field]

[0001] The present invention relates to a sputter adhesion suppression device for a laser processing machine, a laser processing machine, and a laser processing method. [Background technology]

[0002] 2. Description of the Related Art There is known a technique for preventing molten metal chips from adhering to the inner surface of a pipe when the pipe-shaped workpiece is laser-machined.

[0003] As a related technique, Patent Document 1 discloses a mechanism for removing molten metal scraps in a laser processing device. The mechanism for removing molten metal scraps described in Patent Document 1 includes a receiving member that is inserted into a pipe-shaped workpiece. The receiving member receives the molten metal scraps when the pipe is cut. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] CD-ROM of Japanese Utility Model Application No. 3-88410 (Japanese Utility Model Application No. 5-39783) Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a sputter adhesion suppression device for a laser processing machine that can effectively suppress sputter adhesion to the inner surface of a pipe while suppressing the accumulation of sputter on a sputter guard when laser processing a pipe-shaped workpiece, a laser processing machine, and a laser processing method. [Means for solving the problem]

[0006] An embodiment of the present invention relates to a sputter adhesion suppression device for a laser processing machine, a laser processing machine, and a laser processing method, which are described below.

[0007] (1) a sputter guard that is inserted into a pipe and has a tip that receives sputter generated due to irradiation of the pipe with a laser; an injection unit that injects a fluid onto the tip of the sputter guard; a discharge device that discharges a spatter adhesion inhibitor onto the tip of the spatter guard and onto the inner surface of the pipe; Equipped with A device for suppressing spatter adhesion in laser processing machines. (2) the discharge device includes a first flow path that supplies a mixed fluid containing a gas and the sputter adhesion inhibitor to the ejection part, The discharge device is capable of discharging the mixed fluid from the injection portion onto the inner surface of the pipe. A sputter adhesion suppression device for a laser processing machine as described in (1) above. (3) The ejection device is capable of adjusting the ratio of the sputter adhesion inhibitor in the mixed fluid ejected from the ejection portion. A sputter adhesion suppression device for a laser processing machine as described in (2) above. (4) The discharge device includes a second flow path that supplies the gas to the ejection portion. A sputter adhesion suppression device for a laser processing machine according to (2) or (3) above. (5) The discharge device comprises: a first on-off valve that opens and closes the first flow path; a second on-off valve that opens and closes the second flow path; Equipped A sputter adhesion suppression device for a laser processing machine as described in (4) above. (6) With the injection portion positioned outside the pipe, the ejection device is capable of ejecting the mixed fluid onto the inner surface of the pipe. A sputter adhesion suppression device for a laser processing machine according to any one of (2) to (5) above. (7) The discharge device comprises: a gas supply mode in which only gas is supplied to the ejection portion; a mixed fluid supply mode in which a mixed fluid containing the gas and the sputter adhesion inhibitor is supplied to the injection part; can be selectively executed. A sputter adhesion suppression device for a laser processing machine as described in (1) above. (8) The discharge device includes a lubricator that mixes the sputter adhesion prevention agent into the gas. A sputter adhesion suppression device for a laser processing machine according to any one of (2) to (7) above. (9) The ejection portion is disposed on the sputter guard. A sputter adhesion suppression device for a laser processing machine according to any one of (1) to (8) above. (10) The tip portion has a bottom wall, a first side wall, and a second side wall opposite to the first side wall, when a direction from a base end of the spatter guard to a tip end of the spatter guard is defined as a first direction, an elongated space extending in the first direction is defined by the bottom wall, the first side wall, and the second side wall, The ejection unit ejects the fluid into the elongated space. A sputter adhesion suppression device for a laser processing machine according to any one of (1) to (9) above. (11) A support device for supporting the pipe; A rotary drive device that rotates the pipe about a first axis; a laser irradiation device having a laser head for irradiating the pipe with a laser; A moving device that moves the laser head relative to the pipe; A sputter adhesion suppression device; a control device for controlling the rotation drive device, the laser irradiation device, the moving device, and the sputter adhesion suppression device; Equipped with The sputter adhesion suppression device is a sputter guard inserted into the pipe from a first end thereof and having a tip portion for receiving sputters generated due to irradiation of the pipe with the laser; a sputter guard moving device that moves the sputter guard; an injection unit that injects a fluid onto the tip of the sputter guard; a discharge device that discharges a spatter adhesion inhibitor onto the tip of the spatter guard and onto the inner surface of the pipe; Equipped Laser processing machine. (12) A suction device is provided for suctioning the spatter so that the spatter is discharged from the internal space of the pipe to the outside of the pipe through the second end of the pipe. The laser processing machine according to (11) above. (13) The control device A sputter adhesion prevention agent discharge mode; The first processing mode and It is possible to execute the sputter adhesion preventive agent discharge mode includes transmitting a control command from the control device to at least the sputter adhesion suppression device so as to discharge the sputter adhesion preventive agent onto the tip portion of the sputter guard and the inner surface of the pipe; The first processing mode includes transmitting a control command from the control device to at least the laser irradiation device and the sputter adhesion suppression device so that the laser head irradiates the laser onto the pipe and the sputter is blown off from the tip of the sputter guard onto the inner surface of the pipe. The laser processing machine according to (11) or (12) above. (14) discharging a spatter adhesion inhibitor onto the tip of the spatter guard and the inner surface of the pipe; irradiating the pipe with a laser while the tip of the sputter guard is inserted into the pipe; a step of blowing off sputters generated due to irradiation of the pipe with the laser from the tip of the sputter guard onto the inner surface of the pipe; Equipped with The step of blowing off the spatter is performed by injecting a fluid from an injection portion of the spatter guard onto the tip of the spatter guard. Laser processing method. (15) The step of discharging the sputter adhesion preventive agent includes rotating the pipe about a central axis in a longitudinal direction of the pipe while the sputter adhesion preventive agent is being discharged. The laser processing method according to (14) above. Effect of the Invention

[0008] The present invention provides a sputter adhesion suppression device for a laser processing machine, a laser processing machine, and a laser processing method that can effectively suppress sputter adhesion to the inner surface of a pipe while suppressing the accumulation of sputter on the sputter guard when laser processing a pipe-shaped workpiece. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic cross-sectional view showing a state in which a discharge device discharges a sputter adhesion preventive agent onto the tip of a sputter guard and onto the inner surface of a pipe. [Diagram 2] FIG. 2 is a schematic cross-sectional view showing a state in which spatter is blown off from the tip of the spatter guard onto the inner surface of the pipe during laser processing. [Diagram 3] FIG. 3 is an enlarged view of the area surrounded by a circle A3 in FIG. [Figure 4] FIG. 4 is a schematic diagram showing a state in which the discharge device in the first example discharges a sputter adhesion preventive agent onto the tip of the sputter guard and the inner surface of the pipe. [Diagram 5] FIG. 5 is a schematic diagram showing how spatter is blown off from the tip of the spatter guard onto the inner surface of the pipe during laser processing. [Figure 6] FIG. 6 is a schematic diagram showing how spatter is blown off from the tip of the spatter guard onto the inner surface of the pipe during laser processing. [Figure 7] FIG. 7 is a schematic diagram showing a state in which a discharge device in the second example discharges a sputter adhesion preventive agent onto the tip of a sputter guard and the inner surface of a pipe. [Figure 8] FIG. 8 is a schematic diagram showing how spatter is blown off from the tip of the spatter guard onto the inner surface of the pipe during laser processing. [Figure 9]FIG. 9 is a schematic cross-sectional view showing a state in which the sputter guard is connected to the connector via the first tube. [Figure 10] FIG. 10 is a schematic cross-sectional view showing a state in which the second sputter guard is connected to the connector via another tube. [Figure 11] FIG. 11 is a schematic perspective view showing a pipe and a spatter guard. [Figure 12] FIG. 12 is a cross-sectional view taken along line A2-A2 in FIG. [Figure 13] FIG. 13 is a schematic perspective view showing the pipe and the spatter guard. [Figure 14] FIG. 14 is a schematic perspective view showing the pipe and the spatter guard. [Figure 15] FIG. 15 is a cross-sectional view taken along the line A1-A1 in FIG. [Figure 16] FIG. 16 is a schematic front view showing a state in which the discharge device discharges the sputter adhesion preventive agent onto the tip of the sputter guard and the inner surface of the pipe. [Figure 17] FIG. 17 is a schematic cross-sectional view showing an ejection portion in a modified example. [Figure 18] FIG. 18 is an enlarged view of a portion of FIG. [Figure 19] FIG. 19 is a schematic front view showing a state in which spatter is blown off from the tip of the spatter guard onto the inner surface of the pipe during laser processing. [Figure 20] FIG. 20 is a schematic front view showing a state in which sputters in a pipe are sucked by a suction device during laser processing. [Figure 21] FIG. 21 is a schematic front view showing a state in which sputters in a pipe are sucked by a suction device during laser processing. [Figure 22] FIG. 22 is a schematic front view showing a state in which the tip of the spatter guard is cleaned by the cleaning device. [Diagram 23]FIG. 23 is a diagram illustrating a sputter adhesion suppressing device for a laser processing machine according to the second embodiment. [Figure 24] FIG. 24 is a diagram illustrating a sputter adhesion suppressing device for a laser processing machine according to the second embodiment. [Diagram 25] FIG. 25 is a schematic cross-sectional view showing a state in which sputters are blown off from the tip of the sputter guard onto the inner surface of the pipe during laser processing. [Figure 26] FIG. 26 is a diagram illustrating a sputter adhesion suppressing device for a laser beam machine in the third embodiment. [Figure 27] FIG. 27 is a diagram illustrating a sputter adhesion suppressing device for a laser processing machine in a first modified example of the third embodiment. [Figure 28] FIG. 28 is a schematic front view showing a laser processing machine according to the fourth embodiment. [Figure 29] FIG. 29 is a schematic cross-sectional view showing a state in which the discharge device discharges the sputter adhesion preventive agent onto the tip of the sputter guard and the inner surface of the pipe. [Diagram 30] FIG. 30 is a schematic front view showing a laser processing machine according to the fourth embodiment. [Diagram 31] FIG. 31 is a schematic front view showing a laser processing machine according to the fourth embodiment. [Diagram 32] FIG. 32 is a diagram showing a schematic diagram of a state in which a control device is capable of controlling a plurality of control target devices. [Diagram 33] FIG. 33 is a flowchart showing an example of a laser processing method in the fifth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, a spatter adhesion suppression device 2 for a laser processing machine, a laser processing machine 1, and a laser processing method according to an embodiment will be described with reference to the drawings. In the following description of the embodiment, parts and members having the same functions are given the same reference numerals, and repeated description of parts and members given the same reference numerals will be omitted.

[0011] (Definition of terms) In this specification, of the two ends of the pipe P, the end into which the spatter guard 30 is inserted is defined as a first end Pa. Also, of the two ends of the pipe P, the end opposite the first end Pa is defined as a second end Pb.

[0012] As illustrated in Figure 9, in this specification, the direction from the base end 30d of the sputter guard 30 to the tip 30e of the sputter guard 30 is defined as a first direction DR1, and the direction from the tip 30e of the sputter guard 30 to the base end 30d of the sputter guard 30 is defined as a second direction DR2.

[0013] In this specification, the direction in which the tip 31 of the sputter guard 30 is inserted into the pipe P is defined as a third direction DR3, and the direction opposite to the third direction DR3 is defined as a fourth direction DR4. In the example shown in Fig. 16, the third direction DR3 is the same as the direction from the first end Pa of the pipe P to the second end Pb of the pipe P, and the fourth direction DR4 is the same as the direction from the second end Pb of the pipe P to the first end Pa of the pipe P. Also, in the example shown in Fig. 16, the third direction DR3 is the same as the first direction DR1.

[0014] In this specification, the vertically upward direction is defined as a fifth direction DR5, and the vertically downward direction is defined as a sixth direction DR6.

[0015] (First embodiment) A sputter adhesion suppression device 2A of a laser processing machine in a first embodiment will be described with reference to Figs. 1 to 22. Fig. 1 is a schematic cross-sectional view showing a state in which a discharge device 3 discharges a sputter adhesion prevention agent C1 onto a tip portion 31 of a sputter guard 30 and an inner surface Pn of a pipe P. Fig. 2 is a schematic cross-sectional view showing a state in which sputter B is blown off from a tip portion 31 of a sputter guard 30 onto an inner surface Pn of a pipe P during laser processing. Fig. 3 is an enlarged view of an area surrounded by a circle A3 in Fig. 2. Fig. 4 is a diagram showing a state in which a discharge device 3 in a first example discharges a sputter adhesion prevention agent C1 onto a tip portion 31 of a sputter guard 30 and an inner surface Pn of a pipe P. Figs. 5 and 6 are diagrams showing a state in which sputter B is blown off from a tip portion 31 of a sputter guard 30 onto an inner surface Pn of a pipe P during laser processing. FIG. 7 is a diagram showing a state where the discharge device 3 in the first example discharges the sputter adhesion prevention agent C1 onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P. FIG. 8 is a diagram showing a state where the sputter B is blown off from the tip 31 of the sputter guard 30 onto the inner surface Pn of the pipe P during laser processing. FIG. 9 is a schematic cross-sectional view showing a state where the sputter guard 30 is connected to the connector 48 via the first tube 47a. FIG. 10 is a schematic cross-sectional view showing a state where the second sputter guard 30-2 is connected to the connector 48 via another tube 47a-2. FIG. 11 is a schematic perspective view showing the pipe P and the sputter guard 30. FIG. 12 is a cross-sectional view taken along the line A2-A2 in FIG. 2. FIGS. 13 and 14 are schematic perspective views showing the pipe P and the sputter guard 30. FIG. 15 is a cross-sectional view taken along the line A1-A1 in FIG. 1. Fig. 16 is a schematic front view showing how the discharge device 3 discharges the sputter adhesion prevention agent C1 onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P. Fig. 17 is a schematic cross-sectional view showing an injection part 36 in a modified example. Fig. 18 is an enlarged view of a portion of Fig. 16. Fig. 19 is a schematic front view showing how the sputter B is blown off from the tip 31 of the sputter guard 30 onto the inner surface Pn of the pipe P during laser processing.20 and 21 are schematic front views showing how spatter in pipe P is sucked by suction device 55 during laser processing. Fig. 22 is a schematic front view showing how tip 31 of spatter guard 30 is cleaned by cleaning device 57. In Figs. 2, 3, 5, 6, 8, and 19, the state in which fluid D is being sprayed from spray unit 36 ​​is shown by multiple radial dashed dotted lines.

[0016] As illustrated in FIG. 1, a sputter adhesion suppression device 2A for a laser processing machine includes a sputter guard 30, an ejection unit 36, and a discharge device 3.

[0017] As illustrated in Fig. 2, the sputter guard 30 has a tip 31 that is inserted into the pipe P. In the example illustrated in Fig. 2, the tip 31 of the sputter guard 30 receives sputter B generated due to irradiation of the pipe P with a laser LB. The sputter B is a metal lump generated from the pipe P due to irradiation of the pipe P with the laser LB. In the example illustrated in Fig. 2, the sputter guard 30 receives the sputter B (e.g., sputter B in a molten state) and thereby prevents the sputter B (e.g., sputter B in a molten state) from adhering to the inner surface Pn of the pipe P.

[0018] In this specification, the cross-sectional shape of the pipe P in a plane perpendicular to the longitudinal direction of the pipe P may be circular, rectangular (for example, approximately square or approximately rectangular), or other shapes. In other words, the pipe P processed by the laser LB (in other words, the pipe P that is the object to be processed) may be a circular pipe, a rectangular pipe, or other pipes.

[0019] In the example shown in Fig. 2, the tip 31 of the sputter guard 30 is inserted into the pipe P. In the example shown in Fig. 3, the tip 31 of the sputter guard 30 is disposed on the axis of the laser LB emitted from the laser head 71 (in other words, on the optical axis of the laser LB). Thus, the tip 31 of the sputter guard 30 effectively prevents sputter B generated due to laser irradiation of the pipe P from adhering to the inner surface Pn of the pipe P (see Fig. 2).

[0020] 2, the injector 36 injects fluid D onto the tip 31 of the sputter guard 30. More specifically, the injector 36 injects fluid D onto the tip 31 of the sputter guard 30 so that sputter B is blown off from the tip 31 of the sputter guard 30 onto the inner surface Pn of the pipe P. The fluid D is a blowing fluid that blows off the sputter B. The fluid D (in other words, the blowing fluid) may or may not contain the sputter adhesion preventive agent C1.

[0021] In the example shown in FIG. 1, the discharge device 3 discharges the sputter adhesion preventive agent C1 to the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P. As illustrated in FIG. 1, the discharge device 3 that discharges the sputter adhesion preventive agent C1 to the tip 31 of the sputter guard 30 and the discharge device that discharges the sputter adhesion preventive agent C1 to the inner surface Pn of the pipe P may be the same device. Alternatively, the discharge device that discharges the sputter adhesion preventive agent to the tip 31 of the sputter guard 30 may be a device different from the discharge device that discharges the sputter adhesion preventive agent to the inner surface Pn of the pipe P. The components of the sputter adhesion preventive agent C1 discharged to the tip 31 of the sputter guard 30 may be the same as the components of the sputter adhesion preventive agent C1 discharged to the inner surface Pn of the pipe P. Alternatively, the components of the sputter adhesion preventive agent C1 discharged to the tip 31 of the sputter guard 30 may be different from the components of the sputter adhesion preventive agent discharged to the inner surface Pn of the pipe P.

[0022] The sputter adhesion suppression device 2A for a laser processing machine in the first embodiment includes a sputter guard 30 having a tip 31 to be inserted into a pipe P (see FIG. 2). The tip 31 of the sputter guard 30 prevents sputter B scattered from the pipe P during laser processing from adhering to the inner surface Pn of the pipe P.

[0023] The sputter adhesion suppression device 2A of the laser processing machine in the first embodiment includes an injection unit 36 ​​that injects a fluid D (in other words, a blowing fluid) onto the tip 31 of the sputter guard 30 (see FIG. 2). The fluid D injected onto the tip 31 of the sputter guard 30 blows off the sputter B from the tip 31. In this way, the accumulation of sputter B on the tip 31 of the sputter guard 30 is suppressed. This prevents the tip 31 from being unable to adequately receive the sputter B due to the accumulation of sputter B on the tip 31 of the sputter guard 30. In addition, it prevents a decrease in the effect of the sputter guard 30 in preventing the sputter B from adhering to the inner surface Pn of the pipe P due to the tip 31 being unable to adequately receive the sputter B.

[0024] 2, the sputter guard 30 receives the sputter B at the tip 31. Therefore, the distance between the received sputter B and the tip 30e of the sputter guard 30 is not large. Therefore, the fluid D injected from the injection part 36 can easily blow the sputter B out of the sputter guard 30.

[0025] A sputter adhesion suppression device 2A for a laser processing machine in the first embodiment includes a discharge device 3 that discharges a sputter adhesion preventive agent C1 onto a tip portion 31 of a sputter guard 30 and an inner surface Pn of a pipe P (see FIG. 1).

[0026] Since the sputter adhesion prevention agent C1 is discharged onto the tip 31 of the sputter guard 30, the sputter B scattered from the pipe P during laser processing is prevented from adhering to the tip 31 of the sputter guard 30. More specifically, although the sputter B scattered from the pipe P is received by the tip 31 of the sputter guard 30, the sputter adhesion prevention agent C1 prevents the sputter B from adhering to the tip 31 due to the reception. Since the adhesion of the sputter B to the tip 31 of the sputter guard 30 is prevented, the sputter B can be easily blown off from the tip 31 of the sputter guard 30 to the outside of the sputter guard 30 using the fluid D sprayed from the spray unit 36.

[0027] 2, the sputter adhesion prevention agent C1 is applied to the inner surface Pn of the pipe P, so that the sputter B blown from the tip 31 of the sputter guard 30 to the inner surface Pn of the pipe P is prevented from adhering to the inner surface Pn of the pipe P. More specifically, although the sputter B blown from the tip 31 of the sputter guard 30 is received by the inner surface Pn of the pipe P, the sputter B is prevented from adhering to the inner surface Pn due to the reception by the sputter adhesion prevention agent C1.

[0028] Since the sputter guard 30 is a member that prevents the sputter B from reaching the inner surface Pn of the pipe P, conventionally, the sputter B is not blown off from the sputter guard 30 to the inner surface Pn of the pipe P. In this case, although the adhesion of the sputter B to the inner surface Pn of the pipe is prevented, the accumulation of the sputter B on the sputter guard 30 is unavoidable. In the example shown in FIG. 1 and FIG. 2, the sputter adhesion prevention agent C1 is discharged onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P, and the sputter B is blown off from the tip 31 of the sputter guard 30 to the inner surface Pn of the pipe P. In this way, both the accumulation of the sputter B on the sputter guard 30 and the adhesion of the sputter B to the inner surface Pn of the pipe P are suppressed.

[0029] (Optional configuration) Next, with reference to Figures 1 to 22, optional additional configurations that can be adopted in the first embodiment (or the second embodiment, the third embodiment, the fourth embodiment, or the fifth embodiment) will be described.

[0030] (Spatter adhesion prevention agent C1) In this specification, the sputter adhesion preventive agent C1 is, for example, oil. The sputter adhesion preventive agent C1 may be discharged in the form of oil air onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P. In the oil air, the oil is carried by the air. In other words, in the oil air, the air functions as a carrier fluid that carries the oil. When the sputter adhesion preventive agent C1 is oil, the sputter adhesion preventive agent C1 can be procured at low cost. In addition, the sputter adhesion preventive agent C1 is easy to handle. When the sputter adhesion preventive agent C1 is discharged in the form of oil air onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P, it is easy to apply the oil over a wide range onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P.

[0031] Any known sputter adhesion inhibitor may be adopted as the sputter adhesion inhibitor C1 discharged onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P. The sputter adhesion inhibitor C1 may be a water-soluble sputter adhesion inhibitor (for example, an aqueous solution type sputter adhesion inhibitor containing a water-soluble resin, a water-soluble polymer, an alcohol, and / or a surfactant). The sputter adhesion inhibitor C1 may be a non-water-soluble sputter adhesion inhibitor (for example, an oil-based sputter adhesion inhibitor). The oil-based sputter adhesion inhibitor may contain an organic solvent and a substance that dissolves in the organic solvent. In this specification, the sputter adhesion inhibitor C1 may be a liquid sputter adhesion inhibitor or a powdered sputter adhesion inhibitor. The liquid sputter adhesion inhibitor C1 may or may not contain a powder.

[0032] The sputter adhesion prevention agent C1 discharged onto the inner surface Pn of the pipe P may be removed from the product in a cleaning process before shipping the product manufactured from the pipe P. If there is no problem even if the sputter adhesion prevention agent C1 adheres to the inner surface of the product manufactured from the pipe P, the cleaning process may be omitted.

[0033] (Injection part 36) In the example shown in FIG. 1, the discharge device 3 includes the above-mentioned injection unit 36. The injection unit 36 ​​can also discharge a sputter adhesion prevention agent C1 (e.g., oil) onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P. In this case, the space occupied by the sputter adhesion suppression device 2A can be smaller than when the injection unit that discharges the sputter adhesion prevention agent C1 is provided in a location separate from the injection unit 36 ​​that injects the fluid D (in other words, the fluid for blowing off the sputter). In addition, the manufacturing cost of the sputter adhesion suppression device 2A is reduced. In the example shown in FIG. 1, the injection unit 36 ​​includes an injection hole 36h that injects a mixed fluid D2 containing a gas and the sputter adhesion prevention agent C1 (e.g., oil).

[0034] (Discharge device 3) In the example shown in FIG. 4, the discharge device 3 includes a first flow path 45a that supplies the mixed fluid D2 containing the gas and the sputter adhesion prevention agent C1 to the injection part 36 (more specifically, the injection hole 36h). The discharge device 3 can also discharge the mixed fluid D2 from the injection part 36 (more specifically, the injection hole 36h) to the inner surface Pn of the pipe P. In the example shown in FIG. 4 and FIG. 5, the injection part 36 can discharge the mixed fluid D2 (see FIG. 4), and the injection part 36 can inject the fluid D (in other words, the fluid for blowing off) (see FIG. 5). In this case, the space occupied by the sputter adhesion suppression device 2A can be smaller than when the injection part that discharges the mixed fluid D2 is provided at a different location from the injection part 36 that injects the fluid for blowing off the sputter. In the example shown in FIG. 4 and FIG. 5, the injection hole 36h that injects the mixed fluid D2 is the same as the injection hole 36h that injects the fluid for blowing off the sputter. Alternatively, the injection unit 36 ​​may include an injection hole 36h for injecting the mixed fluid D2 and another injection hole for injecting a fluid for blowing off sputters.

[0035] In the example shown in FIG. 4, the discharge device 3 can adjust the ratio of the sputter adhesion preventive agent C1 (e.g., oil) in the mixed fluid D2 sprayed from the spray unit 36. In this case, the discharge device 3 can spray the mixed fluid D2 having a high content of the sputter adhesion preventive agent C1 onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P (see FIG. 4). The discharge device 3 can also blow off the sputter B from the tip 31 of the sputter guard 30 to the inner surface Pn of the pipe P by using a fluid D having a low content of the sputter adhesion preventive agent C1 or a fluid D having no content of the sputter adhesion preventive agent C1 (see FIG. 5 or FIG. 6).

[0036] 4, the discharge device 3 has a mixer 41 that mixes a gas D1 (e.g., air) and a sputter adhesion preventive agent C1 (e.g., oil). The discharge device 3 adjusts the ratio between the flow rate of the gas D1 (e.g., air) supplied to the mixer 41 and the flow rate of the sputter adhesion preventive agent C1 (e.g., oil) supplied to the mixer 41, thereby adjusting the proportion of the sputter adhesion preventive agent C1 (e.g., oil) in the fluid D injected from the injection part 36.

[0037] 4, the discharge device 3 has an air source AS (e.g., an air compressor), a mixer 41, a tank 42, a pump 43, an air supply pipe 44, and a first flow path 45a. The air source AS may be capable of supplying air to components 12 of the laser processing machine other than the discharge device 3 (e.g., an air cylinder 12a, an actuator as a gripping jaw moving device 66 described later), in addition to the discharge device 3.

[0038] The air source AS supplies air to the mixer 41 through the air supply pipe 44. The pump 43 supplies a sputter adhesion preventive agent C1 (e.g., oil) from the tank 42 to the mixer 41. The mixer 41 mixes the air received from the air source AS through the air supply pipe 44 with the sputter adhesion preventive agent C1 (e.g., oil) received from the tank 42 to form a mixed fluid D2 containing the sputter adhesion preventive agent C1 (e.g., oil) and air. The mixer 41 also sends the mixed fluid D2 to the spray unit 36 ​​through the first flow path 45a. The mixer 41 may be a lubricator (the lubricator will be described later). In this case, the pump 43 may be omitted. The lubricator may be capable of adjusting the ratio of the sputter adhesion preventive agent C1 (e.g., oil) in the mixed fluid D2 sprayed from the spray unit 36.

[0039] In the examples shown in Figures 4 and 5, the discharge device 3 is capable of adjusting the ratio of the sputter adhesion prevention agent C1 (e.g., oil) in the mixed fluid D2 sprayed from the spray section 36 between a first ratio and a second ratio that is greater than zero and smaller than the first ratio.

[0040] 4, the discharge device 3 injects the mixed fluid D2 containing the sputter adhesion preventive agent C1 (e.g., oil) from the injection part 36 toward the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P in a state where the ratio of the sputter adhesion preventive agent C1 (e.g., oil) in the mixed fluid D2 injected from the injection part 36 is a first ratio. By injecting the mixed fluid D2 containing the sputter adhesion preventive agent C1 (e.g., oil) at a first ratio toward the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P, a sufficient amount of the sputter adhesion preventive agent C1 (e.g., oil) is applied to the tip 31 and the inner surface Pn.

[0041] 5, when the pipe P is being laser processed, the discharge device 3 injects the mixed fluid D2 containing the sputter adhesion prevention agent C1 (e.g., oil) from the injection part 36 toward the tip 31 of the sputter guard 30 in a state in which the ratio of the sputter adhesion prevention agent C1 (e.g., oil) in the mixed fluid D2 injected from the injection part 36 is a second ratio. By injecting the mixed fluid D2 containing the sputter adhesion prevention agent C1 (e.g., oil) at the second ratio toward the tip 31 of the sputter guard 30, the sputter B on the tip 31 of the sputter guard 30 can be blown away from the tip 31 while suppressing the consumption of the sputter adhesion prevention agent C1 (e.g., oil).

[0042] Assume that the spatter B is collected by a suction device 55 described later. In the example shown in FIG. 5, the mixed fluid D2 contains a small amount of the spatter adhesion prevention agent C1, so the amount of the spatter adhesion prevention agent C1 collected by the suction device 55 is small. Therefore, the adverse effect of the spatter adhesion prevention agent C1 (e.g., oil) on the suction device 55 is small, and the suction device 55 is less likely to break down. Also, in the example shown in FIG. 5, the mixed fluid D2 containing the spatter adhesion prevention agent C1 (e.g., oil) is additionally discharged onto the inner surface Pn of the pipe P, so that adhesion of the spatter B to the inner surface Pn of the pipe P is more effectively suppressed.

[0043] As illustrated in Fig. 4, the discharge device 3 may have a first on-off valve 49a and / or a first flow rate adjustment valve 49b. In the example illustrated in Fig. 4, the first on-off valve 49a is disposed between the air source AS and the mixer 41, and opens and closes a flow path between the air source AS and the mixer 41. The first flow rate adjustment valve 49b adjusts the flow rate of air flowing through the flow path between the air source AS and the mixer 41. The pump 43 may be capable of adjusting the flow rate of the sputter adhesion prevention agent C1 (e.g., oil) supplied from the tank 42 to the mixer 41 based on a command received from the control device 9.

[0044] In the examples shown in Figures 4 and 6, the discharge device 3 is capable of adjusting the proportion of anti-spatter adhesion agent C1 (e.g., oil) in the fluid D sprayed from the spray section 36 between zero and a first proportion greater than zero.

[0045] 4, the discharge device 3 injects the mixed fluid D2 containing the sputter adhesion preventive agent C1 (e.g., oil) from the injection part 36 toward the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P in a state where the ratio of the sputter adhesion preventive agent C1 (e.g., oil) in the mixed fluid D2 injected from the injection part 36 is a first ratio. By injecting the mixed fluid D2 containing the sputter adhesion preventive agent C1 (e.g., oil) at a first ratio toward the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P, a sufficient amount of the sputter adhesion preventive agent C1 (e.g., oil) is applied to the tip 31 and the inner surface Pn.

[0046] 6, when the pipe P is being laser processed, the discharge device 3 injects the fluid D from the injection part 36 toward the tip 31 of the sputter guard 30 in a state in which the proportion of the sputter adhesion prevention agent C1 (e.g., oil) in the fluid D injected from the injection part 36 is zero. By injecting the fluid D that does not contain the sputter adhesion prevention agent C1 toward the tip 31 of the sputter guard 30, the sputter B on the tip 31 of the sputter guard 30 can be blown away from the tip 31 without consuming the sputter adhesion prevention agent C1.

[0047] Assume that the spatter B is collected by a suction device 55 described below. In the example shown in Fig. 6, the fluid D does not contain the spatter adhesion preventive agent C1, so the amount of the spatter adhesion preventive agent C1 collected by the suction device 55 is even smaller. Therefore, the adverse effect of the spatter adhesion preventive agent C1 (e.g., oil) on the suction device 55 is small, and the suction device 55 is less likely to break down.

[0048] In the example shown in Figures 4 and 6 (or Figures 7 and 8), the discharge device 3 can selectively execute a gas supply mode N2 (see Figure 6 or Figure 8) in which only gas D1 (e.g., air) is supplied to the ejection portion 36, and a mixed fluid supply mode N1 (see Figure 4 or Figure 7) in which a mixed fluid D2 containing gas D1 (e.g., air) and a sputter adhesion prevention agent C1 (e.g., oil) is supplied to the ejection portion 36.

[0049] The discharge device 3 executes a mixed fluid supply mode N1 (see FIG. 4 or FIG. 7) to discharge a mixed fluid D2 containing a gas D1 (e.g., air) and a spatter adhesion prevention agent C1 (e.g., oil) to the tip 31 of the spatter guard 30 and the inner surface Pn of the pipe P. The discharge device 3 also executes a gas supply mode N2 (see FIG. 6 or FIG. 8) to blow the spatter B received by the tip 31 of the spatter guard 30 from the tip 31 of the spatter guard 30 to the inner surface Pn of the pipe P.

[0050] In the example shown in FIG. 7, the discharge device 3 includes a first flow path 45a that supplies a mixed fluid D2 (e.g., oil-air) containing a gas D1 (e.g., air) and a sputter adhesion prevention agent C1 (e.g., oil) to the injection section 36 (more specifically, the injection hole 36h), and a first supply device 46a (e.g., mixer 41) that supplies the mixed fluid D2 (e.g., oil-air) containing a gas D1 (e.g., air) and a sputter adhesion prevention agent C1 (e.g., oil) to the first flow path 45a. The first supply device 46a (e.g., mixer 41) mixes the gas D1 (e.g., air) received from the second supply device 46b (e.g., air source AS) via the air supply pipe 44 with the sputter adhesion prevention agent C1 (e.g., oil) received from the tank 42 to form a mixed fluid D2 containing the gas D1 (e.g., air) and the sputter adhesion prevention agent C1 (e.g., oil).

[0051] In the example shown in FIG. 7, the discharge device 3 (more specifically, the first supply device 46a) includes a lubricator 41a. The lubricator 41a mixes a sputter adhesion preventive agent C1 (e.g., oil) with a gas (e.g., air). The lubricator 41a is one aspect of the mixer 41. The lubricator 41a takes out the sputter adhesion preventive agent C1 (e.g., oil) from the tank 42 by utilizing the pressure of the gas D1 (e.g., air) supplied from the second supply device 46b (e.g., air source AS), and mixes the taken-out sputter adhesion preventive agent C1 (e.g., oil) with the gas D1 (e.g., air). Therefore, a pump for taking out the sputter adhesion preventive agent C1 from the tank 42 can be omitted. In the example shown in FIG. 7, any known lubricator can be adopted as the lubricator 41a.

[0052] Alternatively, the mixer 41 may mix the gas supplied from the second supply device 46b (e.g., air source AS) with the sputter adhesion preventive agent C1 taken out of the tank 42 using a pump. Still alternatively, the mixer 41 may be constituted by a joint that connects a supply pipe that supplies the gas and a supply pipe that supplies the sputter adhesion preventive agent C1.

[0053] 8, the discharge device 3 includes a second flow path 45b that supplies the gas D1 (e.g., air) to the ejection part 36 (more specifically, the ejection hole 36h). The discharge device 3 also includes a second supply device 46b (e.g., an air source AS) that supplies the gas D1 (e.g., air) to the second flow path 45b.

[0054] 7 and 8, a part of the first flow path 45a and a part of the second flow path 45b may be shared. In other words, the discharge device 3 may include a common flow path 45c that functions as a part of the first flow path 45a and also as a part of the second flow path 45b.

[0055] As illustrated in FIG. 7, the discharge device 3 may include a first on-off valve 49a and a second on-off valve 49c. The first on-off valve 49a opens and closes the first flow path 45a. The second on-off valve 49c opens and closes the second flow path 45b. In the example illustrated in FIG. 7, the control device 9 opens the first on-off valve 49a and closes the second on-off valve 49c. With the first on-off valve 49a open and the second on-off valve 49c closed, the first supply device 46a (for example, the mixer 41 such as the lubricator 41a) supplies the mixed fluid D2 containing the gas D1 and the sputter adhesion preventive agent C1 to the injection section 36. In the example illustrated in FIG. 8, the control device 9 closes the first on-off valve 49a and opens the second on-off valve 49c. The first on-off valve 49a is closed and the second on-off valve 49c is opened, so that the second supply device 46b (for example, an air source AS such as an air compressor) supplies the gas D1 to the ejection portion .

[0056] In the example shown in FIG. 7, the first on-off valve 49a is disposed between the air source AS and the mixer 41 (more specifically, the lubricator 41a). Alternatively, as illustrated in FIG. 28, the first on-off valve 49a may be disposed between the mixer 41 (more specifically, the lubricator 41a) and the injection unit 36. In the example shown in FIG. 7, in the mixed fluid supply mode N1 (or the sputter adhesion prevention agent discharge mode M1 shown in FIG. 28), the mixer 41 (more specifically, the lubricator 41a) forms a mixed fluid D2 by mixing a gas D1 (e.g., air) and a sputter adhesion prevention agent C1 (e.g., oil), and supplies the mixed fluid D2 to the first flow path 45a.

[0057] In the example shown in Fig. 8, the second on-off valve 49c is disposed between the air source AS and the spray unit 36. The second on-off valve 49c may be disposed between the air source AS and the common flow path 45c. In the example shown in Fig. 8, in the gas supply mode N2 (or in a first processing mode M2 ​​shown in Fig. 30, which will be described later), the second on-off valve 49c is opened, and air is supplied from the air source AS to the second flow path 45b via the second on-off valve 49c.

[0058] The discharge device 3 may have a second flow rate adjustment valve 49d. The second flow rate adjustment valve 49d adjusts the flow rate of air flowing through the second flow path 45b.

[0059] 7, the discharge device 3 supplies a mixed fluid D2 containing a gas D1 (e.g., air) and a sputter adhesion prevention agent C1 (e.g., oil) to the spray unit 36. The discharge device 3 also sprays the mixed fluid D2 from the spray unit 36 ​​toward the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P. By spraying the mixed fluid D2 toward the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P, the sputter adhesion prevention agent C1 (e.g., oil) is applied to the tip 31 and the inner surface Pn.

[0060] 8, when the pipe P is being laser processed, the discharge device 3 supplies gas D1 that does not contain a sputter adhesion preventive agent to the injection part 36. The discharge device 3 also injects the gas D1 from the injection part 36 toward the tip 31 of the sputter guard 30. By injecting the gas D1 that does not contain a sputter adhesion preventive agent toward the tip 31 of the sputter guard 30, the sputter B on the tip 31 of the sputter guard 30 can be blown away from the tip 31 without consuming the sputter adhesion preventive agent.

[0061] 4 or 7, the discharge device 3 (more specifically, the spray unit 36) can discharge the sputter adhesion prevention agent C1 simultaneously onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P. In this case, the time required to apply the sputter adhesion prevention agent C1 is short, and the preparation time before laser processing is short.

[0062] In the example shown in FIG. 1, with the jetting unit 36 ​​positioned outside the pipe P, the discharge device 3 can discharge the mixed fluid D2 containing the gas D1 and the sputter adhesion preventive agent C1 onto the inner surface Pn of the pipe P. In this case, the sputter adhesion preventive agent C1 can be easily applied to the edge Pe on the fourth direction DR4 side of the inner surface Pn of the pipe P. In addition, when the processing area of ​​the laser processing machine is visible from outside the laser processing machine, the user can easily visually recognize the mixed fluid D2 (e.g., oil air) jetted from the jetting unit 36 ​​toward the inner surface Pn of the pipe P (see FIG. 16).

[0063] The discharge device 3 (more specifically, the spray unit 36) may discharge oil air containing oil and air onto the tip 31 of the spatter guard 30 and the inner surface Pn of the pipe P. By carrying the oil by air, it is easy to apply the oil to the inner surface Pn of the pipe P.

[0064] As illustrated in FIG. 1, a part of the sputter adhesion prevention agent C1 sprayed from the spraying unit 36 ​​may scatter outside the pipe P.

[0065] 1, the ejection unit 36 ​​can eject a sputter adhesion prevention agent C1 (e.g., oil) onto the upper surface 31u of the tip portion 31 of the sputter guard 30. In this case, when the sputter B is received by the upper surface 31u of the tip portion 31, the sputter B is prevented from adhering to the upper surface 31u (see FIG. 2).

[0066] In the example shown in Fig. 2, the ejection portion 36 forms a flow of the fluid D along the upper surface 31u of the tip portion 31 of the sputter guard 30. In the example shown in Fig. 2, the ejection portion 36 has an ejection hole 36h.

[0067] The injection holes 36h may be disposed at approximately the same height as the upper surface 31u of the tip portion 31 of the spatter guard 30. Alternatively, the height of the injection holes 36h may be significantly higher than the height of the upper surface 31u of the tip portion 31 of the spatter guard 30.

[0068] In the example shown in Fig. 2, the extension direction of the injection hole 36h is approximately parallel to the longitudinal direction of the spatter guard 30. Alternatively, the extension direction of the injection hole 36h may be inclined with respect to the longitudinal direction of the spatter guard 30. In the example shown in Fig. 2, the injection part 36 has one injection hole 36h. Alternatively, the injection part 36 may have a plurality of injection holes 36h.

[0069] In the example shown in FIG. 1, the discharge device 3 has a tip portion 31 of the sputter guard 30 and an injection hole 36h for injecting the sputter adhesion preventive agent C1 to the inner surface Pn of the pipe P. In the example shown in FIG. 1, an upper end 360u of the outlet 360 of the injection hole 36h is located on the second direction DR2 side from a lower end 360w of the outlet 360 of the injection hole 36h. In this case, a fluid containing the sputter adhesion preventive agent C1 (for example, a mixed fluid D2 containing the sputter adhesion preventive agent C1 and a gas) is likely to diffuse obliquely upward from the upper end 360u of the outlet 360. As exemplified in FIG. 1, the sputter adhesion preventive agent C1 diffused obliquely upward from the upper end 360u of the outlet 360 is suitably applied to the inner surface Pn of the pipe P.

[0070] (Spatter Guard 30) 2, the ejection unit 36 ​​is disposed in the sputter guard 30. When the ejection unit 36 ​​is disposed in the sputter guard 30, the space occupied by the sputter adhesion suppression device 2A can be smaller than when the ejection unit 36 ​​is provided separately from the sputter guard 30.

[0071] 9, the sputter guard 30 has a tip portion 31, an intermediate portion 35 in which the ejection portion 36 (more specifically, the ejection hole 36h) is disposed, and a base portion 38 that defines a fluid flow path 38v that communicates with the ejection portion 36 (more specifically, the ejection hole 36h). The tip portion 31 is disposed on the first direction DR1 side relative to the intermediate portion 35. The intermediate portion 35 is also disposed on the first direction DR1 side relative to the base portion 38.

[0072] 9, the flow path cross-sectional area of ​​the injection hole 36h is smaller than the flow path cross-sectional area of ​​the fluid flow path 38v of the base end 38. In this case, the injection hole 36h can inject fluid at high speed into the tip end 31. The flow path cross-sectional area may be configured to decrease stepwise or continuously from the fluid flow path 38v of the base end 38 toward the injection hole 36h.

[0073] The sputter guard 30 may be replaceable with a second sputter guard 30-2 having a size different from that of the sputter guard 30. In the example shown in FIG. 9, the sputter adhesion suppression device 2A of the laser processing machine has the sputter guard 30, a first tube 47a (e.g., a rigid tube) that supplies a fluid to the fluid flow path 38v of the sputter guard 30, and a second tube 47b (e.g., a flexible tube) that is connected to the first tube 47a via a connector 48. In the examples shown in FIGS. 9 and 10, the first tube 47a is removable from the connector 48, and the second sputter guard 30-2 is attachable to the connector 48 via a tube 47a-2 that is different from the first tube 47a. The internal flow path defined by the first tube 47a and the second tube 47b may function as a part of the above-mentioned common flow path 45c.

[0074] 11, the tip portion 31 of the sputter guard 30 has a bottom wall 321, a first side wall 323, and a second side wall 325 opposing the first side wall 323. In the example shown in FIG. 12, the first side wall 323 and the second side wall 325 prevent sputter B colliding with the tip portion 31 of the sputter guard 30 from diffusing laterally beyond the first side wall 323 or the second side wall 325. In this way, the sputter B is preferably received by the tip portion 31 of the sputter guard 30.

[0075] 11, a narrow space SP1 extending in a first direction DR1 is defined by a bottom wall 321, a first side wall 323, and a second side wall 325. The narrow space SP1 is open at the top (in other words, a narrow opening OP is present above the narrow space SP1). In the example shown in FIG. 13, sputters generated by irradiation of the pipe P with the laser LB are received in the narrow space SP1 through the narrow opening OP between an upper edge 323e of the first side wall 323 and an upper edge 325e of the second side wall 325.

[0076] 14, the ejection unit 36 ​​(more specifically, the ejection hole 36h) ejects a fluid D (e.g., air) into the elongated space SP1. Since the elongated space SP1 is surrounded on three sides by the bottom wall 321, the first side wall 323, and the second side wall 325, the fluid D ejected from the ejection unit 36 ​​suitably blows away the spatter in the first direction DR1.

[0077] In the example shown in Figure 12, the inner surface 320n that defines the elongated space SP1 of the tip portion 31 of the sputter guard 30 has an approximately U-shape when viewed in a direction along the longitudinal direction of the sputter guard 30 (more specifically, when viewed in a direction along the second direction DR2).

[0078] The upper surface 321u of the bottom wall 321 may have a substantially arcuate shape when viewed in a direction along the longitudinal direction of the sputter guard 30 (more specifically, when viewed in a direction along the second direction DR2). The first side surface 323n of the first side wall 323 facing the elongated space SP1 may have a substantially linear shape when viewed in a direction along the longitudinal direction of the sputter guard 30 (more specifically, when viewed in a direction along the second direction DR2). The second side surface 325n of the second side wall 325 facing the elongated space SP1 may have a substantially linear shape when viewed in a direction along the longitudinal direction of the sputter guard 30 (more specifically, when viewed in a direction along the second direction DR2).

[0079] 12, the upper surface 321u of the bottom wall 321 and the first side surface 323n of the first side wall 323 facing the elongated space SP1 are smoothly connected without any corners. In this case, sputters B are unlikely to adhere between the upper surface 321u of the bottom wall 321 and the first side surface 323n of the first side wall 323.

[0080] 12, the upper surface 321u of the bottom wall 321 and the second side surface 325n of the second side wall 325 facing the elongated space SP1 are smoothly connected without any corners. In this case, sputters B are unlikely to adhere between the upper surface 321u of the bottom wall 321 and the second side surface 325n of the second side wall 325.

[0081] 15, the injection unit 36 ​​(more specifically, the injection hole 36h) can inject the sputter adhesion prevention agent C1 (more specifically, the mixed fluid D2 containing the sputter adhesion prevention agent C1 and a gas) diffusively into the elongated space SP1 so that the sputter adhesion prevention agent C1 is simultaneously ejected onto the upper surface 321u of the bottom wall 321, the first side surface 323n of the first side wall 323, and the second side surface 325n of the second side wall 325. The mixed fluid D2 is, for example, oil-air containing oil and air.

[0082] 15, the injection unit 36 ​​(more specifically, the injection hole 36h) can inject the sputter adhesion prevention agent C1 (more specifically, the mixed fluid D2 containing the sputter adhesion prevention agent C1 and a gas) diffusively into the elongated space SP1 so that the sputter adhesion prevention agent C1 is applied to most of the inner surface 320n that defines the elongated space SP1 (more specifically, substantially the entire inner surface 320n that defines the elongated space SP1) of the tip portion 31 of the sputter guard 30. By applying the sputter adhesion prevention agent C1 to most of the inner surface 320n that defines the elongated space SP1, adhesion of sputter B to the inner surface 320n is suitably suppressed.

[0083] In the example shown in FIG. 15, the injection section 36 (more specifically, the injection hole 36h) is capable of diffusively injecting the sputter adhesion prevention agent C1 (more specifically, the mixed fluid D2 containing the sputter adhesion prevention agent C1 and a gas) into the elongated space SP1 so that the sputter adhesion prevention agent C1 passing through the elongated opening OP above the elongated space SP1 reaches the inner surface Pn of the pipe P.

[0084] 1, the sputter adhesion preventive agent C1 directed from the injection unit 36 ​​(more specifically, the injection hole 36h) toward the inner surface Pn of the pipe P has a momentum component in the first direction DR1 and a momentum component in the fifth direction DR5. In this case, the sputter adhesion preventive agent C1 is applied widely to the inner surface Pn of the pipe P, compared to the case where the sputter adhesion preventive agent C1 has only a momentum component in the fifth direction DR5.

[0085] In the example shown in Figure 15, when viewed in a direction along the longitudinal direction of the sputter guard 30 (more specifically, when viewed in a direction along the second direction DR2), the injection hole 36h is positioned approximately at the center of the tip portion 31 of the sputter guard 30.

[0086] 15, when viewed in the longitudinal direction of the sputter guard 30 (more specifically, when viewed in the second direction DR2), the ejection hole 36h is disposed at a position overlapping the bottom of the elongated space SP1. In this case, a fluid (e.g., air) is ejected from the ejection hole 36h to the bottom of the elongated space SP1. Therefore, the fluid (e.g., air) can suitably blow away the sputters on the bottom wall 321 of the tip portion 31 in the first direction DR1.

[0087] It should be noted that the shape of the tip portion 31 of the spatter guard 30 is not limited to the shapes shown in Figures 14 and 15. For example, the upper surface 31u of the tip portion 31 of the spatter guard 30 may be a flat surface.

[0088] (Rotational drive unit 63) In the example shown in FIG. 16, the sputter adhesion prevention device 2A of the laser processing machine includes a rotation drive device 63 that rotates the pipe P about the longitudinal center axis AT of the pipe. In the example shown in FIG. 16, the rotation drive device 63 can rotate the pipe P about the longitudinal center axis AT while the discharge device 3 (more specifically, the spray unit 36) is spraying the sputter adhesion prevention agent C1 toward the inner surface of the pipe P (see arrow R1). In this case, the sputter adhesion prevention agent C1 can be efficiently applied over the entire circumference of the inner surface Pn of the pipe P (see arrow R1 in FIG. 15).

[0089] In the example shown in FIG. 15, the injection unit 36 ​​has an injection hole 36h capable of injecting the sputter adhesion preventive agent C1 above the sputter guard 30. In the example shown in FIG. 15, the injection hole 36h cannot inject the sputter adhesion preventive agent C1 below the sputter guard 30. Alternatively, as illustrated in FIG. 17, the injection unit 36 ​​may have an auxiliary injection hole 36j capable of injecting the sputter adhesion preventive agent C1 below the sputter guard 30 in addition to the injection hole 36h capable of injecting the sputter adhesion preventive agent C1 above the sputter guard 30. In the example shown in FIG. 17, the injection unit 36 ​​can apply the sputter adhesion preventive agent C1 over the entire circumference of the inner surface Pn of the stationary pipe P. In this case, when the sputter adhesion preventive agent C1 is discharged onto the inner surface Pn of the pipe P, it is not necessary to rotate the pipe P around the central axis in the longitudinal direction of the pipe.

[0090] (Spatter guard moving device 51) 16, the sputter adhesion suppression device 2A of the laser processing machine includes a sputter guard moving device 51 that moves the sputter guard 30. The sputter guard moving device 51 may have a first driving device 51a that moves the sputter guard 30 in a direction substantially parallel to the longitudinal direction of the pipe P (e.g., the third direction DR3 or the fourth direction DR4). The sputter guard moving device 51 may also have a second driving device 51b that moves the sputter guard 30 in a direction substantially parallel to the vertical direction (e.g., the fifth direction DR5 or the sixth direction DR6).

[0091] In the example shown in FIG. 16, the sputter guard moving device 51 has a first slider 52a that holds the first tube 47a. The first driving device 51a moves the first slider 52a in the third direction DR3 (or the fourth direction DR4). When the first slider 52a moves in the third direction DR3 (or the fourth direction DR4), the first tube 47a and the sputter guard 30 move in the third direction DR3 (or the fourth direction DR4) together with the first slider 52a.

[0092] In the example shown in FIG. 16, the sputter guard moving device 51 has a second slider 52b that supports a first slider 52a. The second driving device 51b moves the second slider 52b in a fifth direction DR5 (or a sixth direction DR6). When the second slider 52b moves in the fifth direction DR5 (or the sixth direction DR6), the first slider 52a, the first tube 47a, and the sputter guard 30 move in the fifth direction DR5 (or the sixth direction DR6) together with the second slider 52b.

[0093] In the example shown in FIG. 18 and FIG. 19, the sputter guard moving device 51 (more specifically, the first driving device 51a and the second driving device 51b) can move the sputter guard 30 between the first position P1 and the second position P2. In the example shown in FIG. 18, when the sputter guard 30 is located at the first position P1, the entire sputter guard 30 is located outside the pipe P. In the example shown in FIG. 19, when the sputter guard 30 is located at the second position P2, the tip portion 31 of the sputter guard 30 is inserted into the pipe P. In the example shown in FIG. 18 and FIG. 19, the second position P2 is located on the third direction DR3 side compared to the first position P1. Also, in the example shown in FIG. 18 and FIG. 19, the second position P2 is located above the first position P1 (more specifically, the second position P2 is slightly above the first position P1).

[0094] 18, with the sputter guard 30 located at the first position P1, a fluid containing a sputter adhesion prevention agent C1 (e.g., a mixed fluid D2 containing oil and air) is injected from the injection portion 36 of the sputter guard 30 toward the inner surface Pn of the pipe P. In the example shown in FIG. 19, with the sputter guard 30 located at the second position P2, the sputter guard 30 receives sputter generated due to laser irradiation of the pipe P. Also, with the sputter guard 30 located at the second position P2, a fluid D (e.g., a gas D1 such as air) is injected from the injection portion 36 of the sputter guard 30 toward the inner surface Pn of the pipe P.

[0095] The sputter adhesion suppression device 2A of the laser processing machine may have a guide roller 54 that guides the movement of the first tube 47a in the third direction DR3. In the example shown in Fig. 19, the guide roller 54 is supported by the second slider 52b.

[0096] (Suction device 55) 20, the sputter adhesion suppression device 2A of the laser processing machine may include a suction device 55 that sucks up the sputter B. In the example shown in FIG. 21, the suction device 55 sucks up the sputter B so that the sputter B is discharged from the internal space SP2 of the pipe P to the outside of the pipe P via the second end Pb of the pipe P. By discharging the sputter B to the outside of the pipe P, the adhesion of the sputter B to the inner surface Pn of the pipe P is suppressed.

[0097] 21, the suction device 55 sucks the sputter adhesion prevention agent C1 (e.g., oil) attached to the inner surface Pn of the pipe P in the third direction DR3 (more specifically, the direction toward the first chuck 61). In this way, the sputter adhesion prevention agent C1 applied to the inner surface of the first end Pa of the pipe P moves in the third direction DR3 (see the dashed arrow in FIG. 21). Therefore, the discharge device 3 does not need to discharge the sputter adhesion prevention agent C1 onto the entire inner surface Pn of the pipe P.

[0098] The suction device 55 cannot move the sputter adhesion preventive agent C1 applied to the inner surface Pn of the pipe P in the fourth direction DR4. For this reason, it is preferable for the discharge device 3 to discharge the sputter adhesion preventive agent C1 onto the inner surface Pn of the first end Pa of the pipe P, including the edge Pe on the fourth direction DR4 side of the pipe P. The sputter adhesion preventive agent C1 applied to the edge Pe on the fourth direction DR4 side of the inner surface Pn of the pipe P moves from the edge Pe in the third direction DR3 by suction by the suction device 55.

[0099] (Cleaning device 57) As illustrated in FIG. 22, the sputter adhesion suppression device 2A of the laser processing machine may include a cleaning device 57 (e.g., brush 57b) that removes sputter B that has adhered to the sputter guard 30. In the first embodiment, the sputter adhesion prevention agent C1 is discharged onto the tip 31 of the sputter guard 30, and the sputter B on the tip 31 of the sputter guard 30 is blown away by the fluid. For this reason, a large amount of sputter B does not accumulate on the tip 31 of the sputter guard 30. On the other hand, it is possible that some sputter B adheres to the tip 31 of the sputter guard 30. In the example illustrated in FIG. 22, the sputter B remaining on the tip 31 of the sputter guard 30 is removed by the cleaning device 57 (e.g., brush 57b).

[0100] In the example shown in FIG. 22, the sputter guard moving device 51 (more specifically, the first driving device 51a and the second driving device 51b) can move the sputter guard 30 to a third position P3 where the tip 31 of the sputter guard 30 contacts the cleaning device 57 (e.g., brush 57b). By the sputter guard moving device 51 moving the sputter guard 30, the tip 31 of the sputter guard 30 moves relative to the cleaning device 57 (e.g., brush 57b) while contacting the cleaning device 57 (e.g., brush 57b). In this way, the sputter B remaining on the tip 31 of the sputter guard 30 is removed by the cleaning device 57 (e.g., brush 57b).

[0101] Second Embodiment A sputter adhesion suppression device 2B of a laser processing machine in the second embodiment will be described with reference to Figs. 23 to 25. Figs. 23 and 24 are diagrams that typically show a sputter adhesion suppression device 2B of a laser processing machine in the second embodiment. Fig. 25 is a schematic cross-sectional view that typically shows a state in which sputter B is blown off from the tip 31 of the sputter guard 30 onto the inner surface Pn of the pipe P during laser processing. In Fig. 25, a state in which a fluid D is being sprayed from the spraying part 36 is shown by a plurality of radial dashed lines.

[0102] The sputter adhesion suppression device 2B for the laser processing machine in the second embodiment differs from the sputter adhesion suppression device 2A for the laser processing machine in the first embodiment in that the discharge device 3 that discharges the sputter adhesion prevention agent C1 onto the tip portion 31 of the sputter guard 30 and the inner surface Pn of the pipe P is provided completely independent of the sputter guard 30. In other respects, the sputter adhesion suppression device 2B for the laser processing machine in the second embodiment is similar to the sputter adhesion suppression device 2A for the laser processing machine in the first embodiment.

[0103] In the second embodiment, differences from the first embodiment will be mainly described. On the other hand, in the second embodiment, repeated descriptions of matters already described in the first embodiment will be omitted. Therefore, it goes without saying that the matters already described in the first embodiment can be applied to the second embodiment even if they are not explicitly described in the second embodiment.

[0104] As illustrated in Figures 23 to 25, the sputter adhesion suppression device 2B of a laser processing machine in the second embodiment includes (1) a sputter guard 30 having a tip 31 that is inserted into a pipe P and receives sputter generated due to laser irradiation of the pipe P, (2) an injection section 36 (more specifically, an injection hole) that injects a fluid into the tip 31 of the sputter guard 30, and (3) an injection device 3 (see Figures 23 and 24) that ejects a sputter adhesion prevention agent C1 onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P.

[0105] Therefore, the sputter adhesion suppressing apparatus 2B for a laser processing machine in the second embodiment achieves the same effects as the sputter adhesion suppressing apparatus 2A for a laser processing machine in the first embodiment.

[0106] 23 and 24, the discharge device 3 has a nozzle 301 provided independently of the sputter guard 30. As illustrated in FIG. 23, the nozzle 301 applies a sputter adhesion preventive agent C1 to the inner surface Pn of the pipe P. Also, as illustrated in FIG. 24, the nozzle 301 applies the sputter adhesion preventive agent C1 to the tip portion 31 of the sputter guard 30.

[0107] The fluid sprayed from the nozzle 301 may be a mixed fluid D2 containing oil and air. In this case, the nozzle 301 sprays oil onto the tip 31 of the sputter guard 30. Alternatively, the nozzle 301 may drip a sputter adhesion prevention agent C1 (e.g., oil) onto the tip 31 of the sputter guard 30.

[0108] 23 and 24, the nozzle 301 is tiltably supported by the nozzle support 302. The nozzle 301 is capable of changing its position (more specifically, tilting) between a first position (see FIG. 23) for discharging the sputter adhesion preventive agent C1 onto the inner surface Pn of the pipe P and a second position (see FIG. 24) for discharging the sputter adhesion preventive agent C1 onto the tip portion 31 of the sputter guard 30.

[0109] (Third embodiment) A sputter adhesion suppressing device 2C for a laser processing machine in the third embodiment will be described with reference to Fig. 26 and Fig. 27. Fig. 26 is a diagram showing a sputter adhesion suppressing device 2C for a laser processing machine in the third embodiment. Fig. 27 is a diagram showing a sputter adhesion suppressing device 2C for a laser processing machine in a first modified example of the third embodiment.

[0110] As illustrated in FIG. 26 or FIG. 27, the sputter adhesion suppression device 2C of the laser processing machine in the third embodiment includes a first discharge device 3a that discharges a sputter adhesion preventive agent to the tip 31 of the sputter guard 30, and a second discharge device 3b that discharges the sputter adhesion preventive agent to the inner surface Pn of the pipe P. The sputter adhesion suppression device 2C of the laser processing machine in the third embodiment is different from the sputter adhesion suppression device 2A of the laser processing machine in the first embodiment and the sputter adhesion suppression device 2B of the laser processing machine in the second embodiment in that the first discharge device 3a that discharges the sputter adhesion preventive agent to the tip 31 of the sputter guard 30 is different from the second discharge device 3b that discharges the sputter adhesion preventive agent to the inner surface Pn of the pipe P. In other respects, the sputter adhesion suppression device 2C of the laser processing machine in the third embodiment is similar to the sputter adhesion suppression device 2A of the laser processing machine in the first embodiment or the sputter adhesion suppression device 2B of the laser processing machine in the second embodiment.

[0111] In the example shown in FIG. 26, the second discharge device 3b includes a nozzle 301 provided independently of the sputter guard 30. The nozzle 301 discharges a sputter adhesion prevention agent C1 onto the inner surface Pn of the pipe P. In the example shown in FIG. 26, the first discharge device 3a (more specifically, the spray unit 36 ​​arranged on the sputter guard 30) discharges the sputter adhesion prevention agent C1 onto the tip portion 31 of the sputter guard 30. In addition, when the pipe P is laser processed, the spray unit 36 ​​can spray a blowing fluid for blowing away sputters onto the tip portion 31 of the sputter guard 30.

[0112] In the example shown in FIG. 27, the first discharge device 3a includes a nozzle 301 provided independently of the sputter guard 30. The nozzle 301 discharges a sputter adhesion prevention agent C1 to the tip 31 of the sputter guard 30. In the example shown in FIG. 27, the second discharge device 3b (more specifically, the spray unit 36 ​​arranged on the sputter guard 30) discharges the sputter adhesion prevention agent C1 to the inner surface Pn of the pipe P. In addition, when the pipe P is laser processed, the spray unit 36 ​​can spray a blowing fluid for blowing away the sputter to the tip 31 of the sputter guard 30.

[0113] In the example shown in FIG. 27, the second discharge device 3b includes a first on-off valve 49a that opens and closes the first flow path 45a (more specifically, the first flow path 45a that supplies the mixed fluid D2 containing the gas D1 and the sputter adhesion preventive agent C1 to the injection part 36). In the example shown in FIG. 27, the first on-off valve 49a is disposed between the mixer 41 (more specifically, the lubricator 41a) and the injection part 36. As illustrated in FIG. 27, the first discharge device 3a may include a third flow path 45e that supplies the mixed fluid D2 containing the gas D1 and the sputter adhesion preventive agent C1 to the nozzle 301, and a third on-off valve 49e that opens and closes the third flow path 45e. In the example shown in FIG. 27, the third on-off valve 49e is disposed between the mixer 41 (more specifically, the lubricator 41a) and the nozzle 301.

[0114] In the example shown in FIG. 27, the discharge device including the first discharge device 3a and the second discharge device 3b can simultaneously discharge a sputter adhesion prevention agent C1 (more specifically, a mixed fluid D2 containing a gas and the sputter adhesion prevention agent C1) onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P.

[0115] (Fourth embodiment) A laser processing machine 1 in the fourth embodiment will be described with reference to Figs. 1 to 32. Fig. 28 is a schematic front view showing the laser processing machine 1 in the fourth embodiment. Fig. 29 is a schematic cross-sectional view showing the state where the discharge device 3 discharges the sputter adhesion prevention agent C1 onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P. Figs. 30 and 31 are schematic front views showing the laser processing machine 1 in the fourth embodiment. Fig. 32 is a diagram showing the state where the control device 9 can control a plurality of controlled devices.

[0116] In the fourth embodiment, the differences from the first, second, and third embodiments will be mainly described. On the other hand, in the fourth embodiment, repeated descriptions of matters already described in the first, second, or third embodiments will be omitted. Therefore, it goes without saying that matters already described in the first, second, or third embodiments can be applied to the fourth embodiment even if they are not explicitly described in the fourth embodiment. Conversely, all matters described in the fourth embodiment are applicable to the first, second, and third embodiments.

[0117] As illustrated in FIG. 28, the laser processing machine 1 in the fourth embodiment includes a support device 60, a rotation drive device 63, a laser irradiation device 70, a moving device 75, a sputter adhesion suppression device 2, and a control device 9.

[0118] The support device 60 supports the pipe P. In the example shown in FIG. 28, the support device 60 includes a first chuck 61, and the first chuck 61 has a gripping member 64 that grips the pipe P. In the example shown in FIG. 28, the gripping member 64 grips a second end Pb of the pipe P. The support device 60 may have a second chuck 62 that supports the pipe P. In the example shown in FIG. 28, the second chuck 62 supports a middle portion Pm of the pipe P.

[0119] The rotation drive device 63 rotates the pipe P about the first axis AX. The rotation drive device 63 may include a first rotation drive device 63a that rotates the gripping member 64 about the first axis AX. The rotation drive device 63 may also include a second rotation drive device 63b that rotates the multiple guide rollers 67 of the second chuck 62 about the first axis AX.

[0120] The laser irradiation device 70 has a laser head 71 that irradiates the pipe P with a laser LB.

[0121] The moving device 75 moves the laser head 71 relatively to the pipe P. In the example shown in Fig. 28, the moving device 75 moves the laser head 71 relatively to the support device 60 (more specifically, the first chuck 61 and the second chuck 62).

[0122] The sputter adhesion suppression device 2 may be the sputter adhesion suppression device 2A in the first embodiment, the sputter adhesion suppression device 2B in the second embodiment (see FIG. 23), the sputter adhesion suppression device 2C in the third embodiment (see FIG. 26 or FIG. 27), or another sputter adhesion suppression device. The sputter adhesion suppression devices (2A, 2B, 2C) have been described in the first to third embodiments, so repeated description of the sputter adhesion suppression devices (2A, 2B, 2C) will be omitted.

[0123] The sputter adhesion suppression device 2 includes (1) a sputter guard 30 having a tip 31 that is inserted into the pipe P from a first end Pa of the pipe P and receives sputter generated due to irradiation of the pipe P with a laser, (2) a sputter guard moving device 51 that moves the sputter guard 30, (3) an injection unit 36 ​​that injects a fluid onto the tip 31 of the sputter guard 30, and (4) an ejection device 3 that ejects a sputter adhesion prevention agent C1 onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P. The sputter guard 30, the sputter guard moving device 51, the injection unit 36, and the ejection device 3 have been described in the first to third embodiments, and therefore repeated description of these configurations will be omitted.

[0124] The control device 9 controls the rotation drive device 63, the laser irradiation device 70, the moving device 75, and the sputter adhesion suppression device 2.

[0125] The laser processing machine 1 in the fourth embodiment achieves the same effects as the sputter adhesion suppression device 2A of the laser processing machine in the first embodiment, the sputter adhesion suppression device 2B of the laser processing machine in the second embodiment, or the sputter adhesion suppression device 2C of the laser processing machine in the third embodiment.

[0126] (Optional configuration) Next, with reference to FIGS. 1 to 32, an optional additional configuration that can be adopted in the fourth embodiment (or the first embodiment, the second embodiment, or the third embodiment) will be described.

[0127] (First chuck 61) In the example shown in FIG. 28, the first chuck 61 includes a gripping member 64 having a plurality of gripping jaws 65, a gripping jaw moving device 66, and a first rotation drive device 63a.

[0128] The gripping member 64 has a plurality of gripping claws 65 including a first gripping claw 65a and a second gripping claw 65b. The gripping claw moving device 66 can move the plurality of gripping claws 65 in a direction approaching the first axis AX, and can move the plurality of gripping claws 65 in a direction away from the first axis AX. More specifically, the gripping claw moving device 66 moves the plurality of gripping claws 65 between a gripping position in contact with the pipe P and a release position away from the pipe P.

[0129] The first rotation drive device 63a rotates the gripping member 64 (more specifically, the multiple gripping claws 65) about a first axis AX. In the example shown in Fig. 28, the first axis AX is substantially coaxial with the longitudinal center axis AT of the pipe P.

[0130] (Second chuck 62) 28, the second chuck 62 has a plurality of guide rollers 67, a guide roller moving device 68, and a second rotation drive device 63b. In the example shown in Fig. 28, the second chuck 62 is disposed between the first chuck 61 and the laser head 71 in the direction along the first axis AX.

[0131] The multiple guide rollers 67 guide the movement of the pipe P in a direction parallel to the first axis AX. The guide roller moving device 68 can move the multiple guide rollers 67 in a direction approaching the first axis AX, and can move the multiple guide rollers 67 in a direction away from the first axis AX. More specifically, the guide roller moving device 68 moves the multiple guide rollers 67 between a contact position in contact with the pipe P and a separated position separated from the pipe P.

[0132] The second rotation drive device 63b rotates a plurality of guide rollers 67 about a first axis AX.

[0133] (Mobility Device 75) 28, the moving device 75 includes a first chuck moving device 76 that moves the first chuck 61. The first chuck moving device 76 moves the first chuck 61 in a direction substantially parallel to the first axis AX.

[0134] 28, the moving device 75 includes a laser head moving device 77 that moves the laser head 71. The laser head moving device 77 may be a device that can move the laser head 71 two-dimensionally along a plane substantially perpendicular to the first axis AX. The laser head moving device 77 may be a device that can move the laser head 71 three-dimensionally.

[0135] In the example shown in FIG. 28, the laser head moving device 77 includes a first linear motion device 77a that moves the laser head 71 along the vertical direction. As illustrated in FIG. 28, the laser head moving device 77 may include a second linear motion device 77b that moves the laser head 71 along the first axis AX. As illustrated in FIG. 28, the laser head moving device 77 may include a third linear motion device 77c that moves the laser head 71 along a direction perpendicular to both the vertical direction and the first axis AX. The laser head moving device 77 may also have a tilting device that tilts the laser head 71 around a horizontal axis.

[0136] (Laser irradiation device 70) 28, the laser irradiation device 70 has a laser head 71 that emits a laser. As illustrated in FIG. 12, the laser irradiation device 70 (more specifically, the laser head 71) may have an assist gas injection unit 72 that injects an assist gas G onto the surface of the pipe P.

[0137] In the example shown in FIG. 12, the laser irradiation device 70 simultaneously emits the laser LB and injects the assist gas G. The assist gas G may be nitrogen gas or oxygen gas. The nitrogen gas as the assist gas G is supplied to the surface of the pipe P at a relatively high supply pressure. On the other hand, the oxygen gas as the assist gas G is supplied to the surface of the pipe P at a relatively low supply pressure in order to suppress an excessive oxidation reaction. When nitrogen gas is used as the assist gas G, an oxide film is unlikely to be formed on the cut or perforated portion of the pipe P. On the other hand, when oxygen gas is used as the assist gas G, a pipe P with a larger plate thickness can be suitably laser processed.

[0138] When the assist gas jetting unit 72 jets nitrogen gas onto the surface of the pipe P, the pipe material vaporized or melted due to the irradiation with the laser LB is removed from the laser irradiation area by the nitrogen gas. In this case, the spatter B generated from the pipe P tends to be small. The small spatter B generated from the pipe P moves toward the tip 31 of the spatter guard 30 by the nitrogen gas and gravity, and the small spatter B is blown away from the tip 31 of the spatter guard 30 by the fluid D jetted from the jetting unit 36.

[0139] When the assist gas jetting unit 72 jets oxygen gas onto the surface of the pipe P, the pipe material is melted by the heat input to the pipe P due to the irradiation of the laser LB and the reaction heat due to the chemical reaction between the pipe material and oxygen. In this case, the spatter B generated from the pipe P tends to be large. The large spatter B generated from the pipe P (for example, large spatter B in a molten state) moves toward the tip 31 of the spatter guard 30 due to the oxygen gas and gravity, and the large spatter B is blown away from the tip 31 of the spatter guard 30 by the fluid D jetted from the jetting unit 36.

[0140] The laser irradiation device 70 may be capable of switching the assist gas G injected from the assist gas injection part 72 between nitrogen gas and oxygen gas.

[0141] (Suction device 55) The laser processing machine 1 may include a suction device 55 that sucks the spatter B. In the example shown in Fig. 21, the suction device 55 sucks the spatter B so that the spatter B is discharged from the internal space SP2 of the pipe P to the outside of the pipe P via the second end Pb of the pipe P. By discharging the spatter B to the outside of the pipe P, the spatter B is prevented from adhering to the inner surface Pn of the pipe P.

[0142] As illustrated in Fig. 21, the sputter suction port 56 of the suction device 55 may be disposed in the first chuck 61. As viewed in the direction along the third direction DR3, the sputter suction port 56 may be disposed between the first gripping jaw 65a and the second gripping jaw 65b. In the example illustrated in Fig. 21, when the first chuck 61 grips the second end Pb of the pipe P, the sputter suction port 56 faces the opening of the second end Pb of the pipe P. In other words, when the first chuck 61 performs the operation of gripping the second end Pb of the pipe P, the sputter suction port 56 and the opening of the second end Pb of the pipe P are automatically aligned.

[0143] (Control device 9) In the example described in Figures 28 and 30, the control device 9 controls the rotation drive device 63 (more specifically, the first rotation drive device 63a and the second rotation drive device 63b), the laser irradiation device 70, the moving device 75 (more specifically, the first chuck moving device 76 and the laser head moving device 77), and the sputter adhesion suppression device 2.

[0144] (Spatter adhesion prevention agent discharge mode M1) In the example shown in FIG. 28, the control device 9 can execute a sputter adhesion preventive agent discharge mode M1 in which a sputter adhesion preventive agent C1 is discharged onto the tip portion 31 of the sputter guard 30 and the inner surface Pn of the pipe P.

[0145] In the example shown in FIG. 28, the sputter adhesion prevention agent discharge mode M1 includes transmitting a control command E1 (more specifically, a first group of control commands E1) from the control device 9 to at least the sputter adhesion prevention device 2 so as to discharge a sputter adhesion prevention agent C1 onto the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P.

[0146] The sputter adhesion preventive agent discharge mode M1 may include transmitting a first movement command E1-1 from the control device 9 to the sputter guard moving device 51 of the sputter adhesion suppression device 2 so as to move the sputter guard 30 to the first position P1. In the example shown in FIG. 28, when the sputter guard 30 is located at the first position P1, the entire sputter guard 30 is located outside the pipe P. When the sputter guard 30 is located at the first position P1, it is preferable that the sputter adhesion preventive agent C1 can be discharged from the injection portion 36 of the sputter guard 30 to the edge Pe (see FIG. 1, if necessary) on the fourth direction DR4 side of the inner surface Pn of the pipe P.

[0147] In the example shown in FIG. 28, the sputter adhesion prevention agent ejection mode M1 includes sending a first ejection command E1-2 from the control device 9 to the sputter adhesion suppression device 2 (more specifically, the ejection device 3) so that a fluid (e.g., oil air) containing a sputter adhesion prevention agent C1 is ejected from the ejection portion 36 of the sputter guard 30 located at the first position P1 onto both the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P.

[0148] Additionally, the sputter adhesion preventive agent discharge mode M1 may include transmitting a first rotation command E1-3 from the control device 9 to the rotation drive devices 63 (more specifically, the first rotation drive device 63a and the second rotation drive device 63b) so as to rotate the pipe P about the first axis AX. By simultaneously discharging the sputter adhesion preventive agent C1 onto the inner surface Pn of the pipe P and rotating the pipe P about the first axis AX, the sputter adhesion preventive agent C1 can be efficiently applied over the entire circumference of the inner surface Pn of the pipe P (see arrow R1 in FIG. 15).

[0149] Alternatively, or additionally, the sputter adhesion preventive agent discharge mode M1 may include transmitting an additional movement command E1-4 from the control device 9 to at least one of the sputter guard moving device 51 and the first chuck moving device 76 so that the spray unit 36 ​​of the sputter guard 30 moves relative to the pipe P in the direction along the first axis AX. By discharging the sputter adhesion preventive agent C1 onto the inner surface Pn of the pipe P and moving the spray unit 36 ​​of the sputter guard 30 relative to the pipe P in the direction along the first axis AX, the sputter adhesion preventive agent C1 can be applied to a wider range of the inner surface Pn of the pipe P (see the arrow AR1 in FIG. 29). As illustrated in FIG. 29, when the sputter adhesion preventive agent discharge mode M1 is executed, the spraying of the fluid (e.g., oil air) containing the sputter adhesion preventive agent C1 from the spray unit 36, the rotation of the pipe P about the first axis AX, and the movement of the sputter guard 30 in the direction along the first axis AX may be executed simultaneously.

[0150] (First processing mode M2) 30, the control device 9 can execute a first processing mode M2 ​​in which the laser LB is irradiated onto the pipe P with the tip 31 of the sputter guard 30 inserted into the pipe P. In the example shown in Fig. 30, when the first processing mode M2 ​​is executed, the tip 31 of the sputter guard 30 is located on the axis of the laser LB emitted from the laser head 71 (in other words, on the optical axis of the laser LB).

[0151] 30, the first processing mode M2 ​​includes transmitting control commands E2 (more specifically, a second group of control commands E2) from the control device 9 to at least the laser irradiation device 70 and the sputter adhesion suppression device 2 so as to irradiate the laser LB from the laser head 71 to the pipe P and to blow off the sputter B from the tip portion 31 of the sputter guard 30 to the inner surface Pn of the pipe P. Additionally, the first processing mode M2 ​​may include transmitting control commands E2 to the suction device 55 so as to suck up the sputter B in the internal space SP2 of the pipe P by the suction device 55.

[0152] The first processing mode M2 ​​may include transmitting a second movement command E2-1 from the control device 9 to the sputter guard moving device 51 of the sputter adhesion suppression device 2 so as to move the sputter guard 30 to the second position P2. When the sputter guard 30 is located at the second position P2, the tip portion 31 of the sputter guard 30 is inserted into the pipe P.

[0153] In the example shown in FIG. 30, the first processing mode M2 ​​includes (1) sending a laser emission command E2-2 from the control device 9 to the laser irradiation device 70 so that a laser LB is irradiated from the laser head 71 to the pipe P, and (2) sending a second injection command E2-3 from the control device 9 to the sputter adhesion suppression device 2 (more specifically, the ejection device 3) so that a fluid D (e.g., a gas D1 such as air, or a mixed fluid D2 containing a sputter adhesion prevention agent C1 and gas D1) is injected from the injection portion 36 of the sputter guard 30 located at the second position P2 to the tip portion 31 of the sputter guard 30.

[0154] Additionally, as illustrated in Fig. 30, the first processing mode M2 ​​may include transmitting a second rotation command E2-4 from the control device 9 to the rotation drive device 63 (more specifically, the first rotation drive device 63a and the second rotation drive device 63b) so as to rotate the pipe P about the first axis AX. In other words, in the first processing mode M2, irradiation of the pipe P with the laser LB, rotation of the pipe P about the first axis AX, and injection of a fluid D (for example, a gas D1 such as air, or a mixed fluid D2 containing a sputter adhesion prevention agent C1 and the gas D1) to the tip portion 31 of the sputter guard 30 may be performed simultaneously.

[0155] 30, the first processing mode M2 ​​may include transmitting a third movement command E2-5 from the control device 9 to a moving device 75 (e.g., a first chuck moving device 76 and / or a laser head moving device 77) so as to move the laser head 71 relative to the pipe P. In other words, in the first processing mode M2, irradiation of the laser LB onto the pipe P, relative movement of the laser head 71 with respect to the pipe P, and injection of a fluid D (e.g., a gas D1 such as air, or a mixed fluid D2 containing a sputter adhesion prevention agent C1 and the gas D1) onto the tip portion 31 of the sputter guard 30 may be performed simultaneously.

[0156] 30, the first processing mode M2 ​​may include sending a suction command E2-6 to the suction device 55 so that the sputter B in the internal space SP2 of the pipe P is sucked by the suction device 55. In other words, in the first processing mode M2, irradiation of the laser LB onto the pipe P, injection of a fluid D (for example, a gas D1 such as air, or a mixed fluid D2 containing a sputter adhesion prevention agent C1 and the gas D1) onto the tip portion 31 of the sputter guard 30, and suction of the sputter B from the internal space SP2 of the pipe P to the suction device 55 may be performed simultaneously.

[0157] 28 and 30, the control device 9 can sequentially execute the sputter adhesion preventive agent discharge mode M1 and the first processing mode M2. More specifically, the control device 9 executes the sputter adhesion preventive agent discharge mode M1, and then executes the first processing mode M2.

[0158] (Second machining mode M3) 31, the control device 9 can execute a second processing mode M3 in which the laser LB is irradiated onto the pipe P without the tip 31 of the spatter guard 30 being inserted into the pipe P. In the example shown in FIG. 31, when the second processing mode M3 is executed, the tip 31 of the spatter guard 30 is positioned away from the axis of the laser LB emitted from the laser head 71.

[0159] The control device 9 may be capable of sequentially executing the sputter adhesion prevention agent discharge mode M1 and the second processing mode M3. In this case, the sputter guard 30 is not inserted into the pipe P. However, since the sputter adhesion prevention agent is applied to the inner surface Pn of the pipe P, adhesion of sputters to the inner surface Pn of the pipe P is suppressed.

[0160] In the examples shown in FIGS. 28, 30, and 31, the control device 9 can selectively execute a sputter adhesion prevention agent discharge mode M1, a first processing mode M2, and a second processing mode M3.

[0161] The control device 9 may be configured by one computer or may be configured by multiple computers. As illustrated in FIG. 32, the control device 9 includes a hardware processor 90 (hereinafter, simply referred to as "processor 90"), a memory 92, a communication circuit 94, and an input device 96 (for example, a display 962 with a touch panel). The processor 90, the memory 92, the communication circuit 94, and the input device 96 are connected to each other via a bus 98. Data required for machining the pipe P (for example, work data 926 including shape data of the pipe P and machining position data of the pipe P, etc.) may be input to the control device 9 via the input device 96, or may be input to the control device 9 from another computer via the communication circuit 94. The input device 96 is not limited to the display 962 with a touch panel. For example, the control device 9 may include an input device 96 such as a button, a switch, a lever, a pointing device, a keyboard, etc., and a display that displays the data input to the input device 96 or other information.

[0162] The control device 9 generates a plurality of control commands (for example, the above-mentioned first group of control commands E1 and second group of control commands E2) by executing the machining program 922 stored in the memory 92. In addition, the communication circuit 94 transmits the plurality of control commands generated by the control device 9 to a plurality of control target devices (for example, the rotation drive device 63, the laser irradiation device 70, the moving device 75, the sputter adhesion suppression device 2, the gripping jaw moving device 66, the guide roller moving device 68, etc.). In this way, the control device 9 can control a plurality of control target devices.

[0163] Fifth embodiment A laser processing method in an embodiment will be described with reference to Fig. 1 to Fig. 33. Fig. 33 is a flow chart showing an example of a laser processing method in the fifth embodiment.

[0164] The laser processing machine 1 used in the laser processing method in the fifth embodiment may be the laser processing machine 1 in the fourth embodiment, or may be another laser processing machine. Since each component of the laser processing machine 1 has been described in the first to fourth embodiments, repeated description of each component of the laser processing machine 1 will be omitted.

[0165] In a first step ST1, a sputter adhesion preventive agent C1 is discharged onto the tip portion 31 of the sputter guard 30 and the inner surface Pn of the pipe P. The first step ST1 is a sputter adhesion preventive agent discharge step.

[0166] 1, 4, 7, 15, 16, 17, 18, 27, 28, and 29, the discharge of the sputter adhesion preventive agent C1 onto the tip 31 of the sputter guard 30 and the discharge of the sputter adhesion preventive agent C1 onto the inner surface Pn of the pipe P are performed simultaneously. On the other hand, in the examples shown in Figs. 23, 24, and 26, the discharge of the sputter adhesion preventive agent C1 onto the tip 31 of the sputter guard 30 and the discharge of the sputter adhesion preventive agent C1 onto the inner surface Pn of the pipe P are performed at different times.

[0167] As illustrated in Fig. 1, Fig. 4, Fig. 7, Fig. 15, Fig. 16, Fig. 17, Fig. 18, Fig. 28, Fig. 29, the sputter adhesion preventive agent ejection step (first step ST1) may include ejecting a fluid (e.g., oil-air containing oil and air) containing the sputter adhesion preventive agent C1 from the ejection part 36 of the sputter guard 30 to both the tip part 31 of the sputter guard 30 and the inner surface Pn of the pipe P. In the example described in Fig. 1, Fig. 4, Fig. 7, Fig. 15, Fig. 16, Fig. 17, Fig. 18, Fig. 28, the sputter adhesion preventive agent ejection step (first step ST1) includes ejecting a fluid (e.g., oil-air containing oil and air) containing the sputter adhesion preventive agent C1 from the ejection part 36 located outside the pipe P to both the tip part 31 of the sputter guard 30 and the inner surface Pn of the pipe P. Alternatively, or additionally, as illustrated in FIG. 29, the sputter adhesion prevention agent ejection process (first step ST1) may include injecting a fluid containing a sputter adhesion prevention agent C1 (e.g., oil-air containing oil and air) from an ejection section 36 located inside the pipe P onto both the tip 31 of the sputter guard 30 and the inner surface Pn of the pipe P.

[0168] As illustrated in Figures 15, 16, 26, 28, and 29, the sputter adhesion prevention agent ejection process (first step ST1) may include rotating the pipe P around the longitudinal central axis of the pipe P while the sputter adhesion prevention agent C1 is being ejected (more specifically, while the sputter adhesion prevention agent C1 is being ejected from the ejection portion 36 or nozzle 301 of the sputter guard 30).

[0169] In this case, the sputter adhesion preventive agent C1 can be applied efficiently over the entire circumference of the inner surface Pn of the pipe P.

[0170] In the examples shown in Figures 15, 16, 28, and 29, the sputter adhesion prevention agent ejection process (first step ST1) includes injecting a mixed fluid D2 containing gas and a sputter adhesion prevention agent C1 (e.g., oil-air containing oil and air) onto the inner surface Pn of the pipe P from the ejection portion 36 of the sputter guard 30 while rotating the pipe P around the first axis AX.

[0171] As illustrated in FIG. 1, the sputter adhesion preventive agent discharging step (first step ST1) may include discharging a sputter adhesion preventive agent C1 onto an edge Pe of an inner surface Pn of a pipe P on the fourth direction DR4 side.

[0172] In a second step ST2, the laser LB is irradiated onto the pipe P. The second step ST2 is a laser irradiation process. The pipe P is processed by irradiating the pipe P with the laser LB. A through hole of any shape may be formed in the pipe P by irradiating the pipe P with the laser LB. Alternatively or additionally, a slit may be formed in the pipe P by irradiating the pipe P with the laser LB. Alternatively or additionally, the pipe P may be separated into a first pipe and a second pipe by irradiating the pipe P with the laser LB.

[0173] In the examples described in Figures 2, 3, 5, 6, 8, 12, 13, 14, 19, 20, 21, 25, and 30, the laser irradiation process (second step ST2) is performed with the tip 31 of the sputter guard 30 inserted into the pipe P.

[0174] The laser irradiation step (in other words, irradiating the pipe P with the laser LB while the tip portion 31 of the sputter guard 30 is inserted into the pipe P) and rotating the pipe P about the first axis AX may be performed simultaneously. Alternatively or additionally, the laser irradiation step (in other words, irradiating the pipe P with the laser LB while the tip portion 31 of the sputter guard 30 is inserted into the pipe P) and moving the pipe P in a direction along the first axis AX may be performed simultaneously. Alternatively or additionally, the laser irradiation step (in other words, irradiating the pipe P with the laser LB while the tip portion 31 of the sputter guard 30 is inserted into the pipe P) and moving the laser head 71 may be performed simultaneously.

[0175] The sputter adhesion preventive agent ejection step (first step ST1) is preferably performed before the laser irradiation step (second step ST2). The sputter adhesion preventive agent ejection step (first step ST1) and the laser irradiation step (second step ST2) may be performed alternately. For example, before a first portion of the pipe P is laser processed, the sputter adhesion preventive agent C1 may be ejected onto the inner surface of the first portion. Also, after the first portion of the pipe P is laser processed, the sputter adhesion preventive agent C1 may be ejected onto the inner surface of the second portion before the second portion of the pipe P is laser processed. Furthermore, the second portion of the pipe P may be laser processed thereafter.

[0176] By performing the laser irradiation step (second step ST2), spatter B is generated from the pipe P. The spatter B is received by the tip portion 31 of the spatter guard 30.

[0177] In the third step ST3, sputters B generated due to irradiation of the pipe P with the laser LB are blown off from the tip portion 31 of the sputter guard 30 onto the inner surface Pn of the pipe P. The third step ST3 is a blowing process.

[0178] In the examples described in Figures 2, 3, 5, 6, 8, 12, 13, 14, 19, 20, 21, 25, and 30, the blowing process (in other words, the process of blowing away spatter B) is performed by spraying a fluid D (for example, a gas D1 such as air, or a mixed fluid D2 containing a spatter adhesion prevention agent C1 and gas D1) from the spray portion 36 of the spatter guard 30 onto the tip 31 of the spatter guard 30.

[0179] In the blowing off step (third step ST3), the type of fluid D sprayed from the spraying part 36 of the sputter guard 30 may be different from the type of fluid D sprayed from the spraying part 36 of the sputter guard 30 in the sputter adhesion prevention agent ejection step (first step ST1). For example, in the blowing off step (third step ST3), the fluid D sprayed from the spraying part 36 of the sputter guard 30 is a gas (e.g., air) that does not contain a sputter adhesion prevention agent, and in the sputter adhesion prevention agent ejection step (first step ST1), the fluid D sprayed from the spraying part 36 of the sputter guard 30 is a fluid (e.g., oil air) that contains a sputter adhesion prevention agent C1.

[0180] Alternatively, or additionally, the proportion of the sputter adhesion prevention agent C1 in the fluid D sprayed from the spray portion 36 of the sputter guard 30 in the blowing off process (third step ST3) may be smaller than the proportion of the sputter adhesion prevention agent C1 in the fluid D sprayed from the spray portion 36 of the sputter guard 30 in the sputter adhesion prevention agent ejection process (first step ST1).

[0181] In the blowing off process (third step ST3), if the proportion of the sputter adhesion preventive agent C1 in the fluid D injected from the injection part 36 of the sputter guard 30 is small or zero, the consumption amount of the sputter adhesion preventive agent C1 can be small. Also, if the sputter B is collected by the suction device 55, the amount of the sputter adhesion preventive agent C1 (e.g., oil) collected by the suction device 55 can be small. Therefore, the adverse effect of the sputter adhesion preventive agent C1 (e.g., oil) on the suction device 55 can be small, and the suction device 55 is less likely to break down.

[0182] It is preferable that the blowing-off process (in other words, spraying fluid D from the spray portion 36 of the sputter guard 30 onto the tip 31 of the sputter guard 30) is performed in parallel with the laser irradiation process (in other words, irradiating the pipe P with the laser LB while the tip 31 of the sputter guard 30 is inserted into the pipe P).

[0183] During the laser irradiation process (in other words, irradiating the pipe P with the laser LB while the tip 31 of the sputter guard 30 is inserted into the pipe P), the fluid D (for example, a gas D1 such as air, or a mixed fluid D2 containing the sputter adhesion preventive agent C1 and the gas D1) may be constantly injected from the injection part 36 of the sputter guard 30 to the tip 31 of the sputter guard 30. Alternatively, during the laser irradiation process (in other words, irradiating the pipe P with the laser LB while the tip 31 of the sputter guard 30 is inserted into the pipe P), the fluid D (for example, a gas D1 such as air, or a mixed fluid D2 containing the sputter adhesion preventive agent C1 and the gas D1) may be intermittently injected from the injection part 36 of the sputter guard 30 to the tip 31 of the sputter guard 30.

[0184] The laser processing method in the fifth embodiment may include a suction step of suctioning the sputter B. More specifically, as illustrated in Fig. 21, in a fourth step ST4, the sputter B is sucked from the internal space SP2 of the pipe P into a suction device 55 (suction step). By discharging the sputter B to the outside of the pipe P, the sputter B is prevented from adhering to the inner surface Pn of the pipe P.

[0185] In the example shown in FIG. 21, in the suction step (fourth step ST4), the sputters B are sucked by the suction device 55 so that the sputters B are discharged to the outside of the pipe P through the second end Pb of the pipe P.

[0186] The suction step (in other words, the suction device 55 suctions the spatter B from the internal space SP2 of the pipe P) is preferably performed in parallel with the blowing step (in other words, the fluid D is sprayed from the spray portion 36 of the spatter guard 30 to the tip portion 31 of the spatter guard 30). In the example shown in FIG. 21, the fluid D (for example, a gas D1 such as air, or a mixed fluid D2 containing a spatter adhesion prevention agent C1 and the gas D1) sprayed from the spray portion 36 of the spatter guard 30 blows the spatter B from the tip portion 31 of the spatter guard 30 to the inner surface Pn of the pipe P, and the spatter B is sucked from the internal space SP2 of the pipe P to the suction device 55 via the second end Pb of the pipe P, are performed in parallel.

[0187] 21, the suction step (fourth step ST4) includes sucking the spatters B in the third direction DR3 and sucking in the third direction DR3 the spatter adhesion preventive agent C1 (e.g., oil) adhered to the inner surface Pn of the pipe P. In this case, the spatter adhesion preventive agent C1 discharged onto the inner surface of the first end Pa of the pipe P is diffused in the third direction DR3 (see the dashed arrows in FIG. 21).

[0188] The suction step (fourth step ST4) is preferably performed in parallel with the laser irradiation step (second step ST2). The suction step (fourth step ST4) may be started prior to the laser irradiation step (second step ST2). In this case, prior to the laser processing of the pipe P, the sputter adhesion prevention agent C1 discharged onto the inner surface of the first end Pa of the pipe P is diffused in the third direction DR3.

[0189] In the laser processing method in the fifth embodiment, the pipe P is irradiated with a laser LB in a state in which the tip portion 31 of the sputter guard 30 is inserted into the pipe P. Thus, the tip portion 31 of the sputter guard 30 receives the sputter B scattered from the pipe P during the laser processing of the pipe P, and the sputter B is prevented from adhering to the inner surface Pn of the pipe P.

[0190] In the laser processing method in the fifth embodiment, a sputter adhesion prevention agent C1 is discharged onto the tip portion 31 of the sputter guard 30 and the inner surface Pn of the pipe P.

[0191] Since the sputter adhesion prevention agent C1 is discharged onto the tip 31 of the sputter guard 30, sputter B scattered from the pipe P during laser processing of the pipe P is prevented from adhering to the tip 31 of the sputter guard 30. More specifically, although the sputter B scattered from the pipe P is received by the tip 31 of the sputter guard 30, the sputter adhesion prevention agent C1 prevents the sputter B from adhering to the tip 31 due to the reception.

[0192] In the laser processing method in the fifth embodiment, the fluid D injected onto the tip 31 of the sputter guard 30 blows the sputter B from the tip 31 of the sputter guard 30 onto the inner surface Pn of the pipe P. Thus, the accumulation of the sputter B on the tip 31 of the sputter guard 30 is suppressed.

[0193] In addition, since the sputter adhesion prevention agent C1 is applied to the inner surface Pn of the pipe P, the sputter B blown off from the tip 31 of the sputter guard 30 onto the inner surface Pn of the pipe P is suppressed from adhering to the inner surface Pn of the pipe P. More specifically, although the sputter B blown off from the tip 31 of the sputter guard 30 is received by the inner surface Pn of the pipe P, the sputter B is prevented from adhering to the inner surface Pn due to such reception by the sputter adhesion prevention agent C1.

[0194] The present invention is not limited to the above-mentioned embodiments or modifications, and it is clear that each embodiment or modification can be appropriately modified or changed within the scope of the technical idea of ​​the present invention. In addition, various techniques used in each embodiment or modification can be applied to other embodiments or other modifications as long as no technical contradiction occurs. Furthermore, any additional configuration in each embodiment or modification can be omitted as appropriate. [Explanation of symbols]

[0195] 1...laser processing machine, 2, 2A, 2B, 2C...spatter adhesion suppression device, 3...discharge device, 3a...first discharge device, 3b...second discharge device, 9...control device, 12...component of laser processing machine, 12a...air cylinder, 30...spatter guard, 30-2...second spatter guard, 30d...base end, 30e...tip, 31...tip portion, 31u...upper surface, 35...middle portion, 36...jet portion, 36h...jet hole, 36j...auxiliary jet hole, 38...base end, 38v...fluid flow path, 41...mixer, 41a...lubricator, 42...tank, 43...pump, 44...air supply pipe, 45a...first flow path, 45b... Second flow path, 45c... common flow path, 45e... third flow path, 46a... first supply device, 46b... second supply device, 47a... first tube, 47a-2... tube different from the first tube, 47b... second tube, 48... connector, 49a... first opening / closing valve, 49b... first flow rate adjustment valve, 49c... second opening / closing valve, 49d... second flow rate adjustment valve, 49e... third opening / closing valve, 51... spatter guard moving device, 51a... first driving device, 51b... second driving device, 52a... first slider, 52b... second slider, 54... guide roller, 55... suction device, 56... spatter suction port, 57... cleaning device, 57b... brush, 60... support device , 61...first chuck, 62...second chuck, 63...rotation drive device, 63a...first rotation drive device, 63b...second rotation drive device, 64...gripping member, 65...gripping claw, 65a...first gripping claw, 65b...second gripping claw, 66...gripping claw moving device, 67...guide roller, 68...guide roller moving device, 70...laser irradiation device, 71...laser head, 72...assist gas ejection section, 75...moving device, 76...first chuck moving device, 77...laser head moving device, 77a...first linear motion device, 77b...second linear motion device, 77c...third linear motion device, 90...hardware processor, 92... Memory, 94... communication circuit, 96... input device, 98... bus, 301... nozzle, 302... nozzle support, 320n... inner surface, 321... bottom wall, 321u... upper surface, 323... first side wall, 323e... upper edge, 323n... first side surface, 325... second side wall, 325e... upper edge, 325n... second side surface, 360... outlet, 360u... upper end, 360w... lower end, 922... machining program, 926... work data, 962... display with touch panel, AS... air source, AT... longitudinal center axis of pipe, AX... first axis, B... spatter, C1... spatter adhesion prevention agent, D... fluid, D1... gas,D2...mixed fluid, DR1...first direction, DR2...second direction, DR3...third direction, DR4...fourth direction, DR5...fifth direction, DR6...sixth direction, E1...control command, E1-1...first movement command, E1-2...first injection command, E1-3...First rotation command, E1-4...Movement command, E2...Control command, E2-1...Second movement command, E2-2...Laser injection command, E2-3...Second injection command, E2-4...Second rotation command, E2-5...Third movement command, E2-6 ...Suction command, G...assist gas, LB...laser, M1...spatter adhesion prevention agent discharge mode, M2...first processing mode, M3...second processing mode, N1...mixed fluid supply mode, N2...gas supply mode, OP...opening, P...pipe, P1...first position, P2...second position, P3...third position, Pa...first end, Pb...second end, Pe...edge of the inner surface of the pipe in the fourth direction, Pm...middle part, Pn...inner surface, SP1...elongated space, SP2...internal space,

Claims

1. A sputter guard is inserted into the pipe and has a tip portion for receiving sputters generated due to irradiation of the pipe with a laser; an injection unit that injects a fluid onto the tip of the sputter guard; a discharge device that discharges a spatter adhesion inhibitor onto the tip of the spatter guard and onto the inner surface of the pipe; Equipped with A device for suppressing spatter adhesion in laser processing machines.

2. the discharge device includes a first flow path that supplies a mixed fluid containing a gas and the sputter adhesion inhibitor to the ejection part, The discharge device is capable of discharging the mixed fluid from the injection portion onto the inner surface of the pipe. The sputter adhesion suppression device for a laser processing machine according to claim 1.

3. The ejection device is capable of adjusting a ratio of the sputter adhesion inhibitor in the mixed fluid ejected from the ejection portion. The sputter adhesion suppression device for a laser processing machine according to claim 2.

4. The discharge device includes a second flow path that supplies the gas to the ejection portion. The sputter adhesion suppression device for a laser processing machine according to claim 2.

5. The discharge device includes: a first on-off valve that opens and closes the first flow path; a second on-off valve that opens and closes the second flow path; Equipped The sputter adhesion suppression device for a laser processing machine according to claim 4.

6. The discharge device is capable of discharging the mixed fluid onto the inner surface of the pipe with the injection portion located outside the pipe. The sputter adhesion suppression device for a laser processing machine according to claim 2.

7. The discharge device includes: a gas supply mode in which only gas is supplied to the ejection portion; a mixed fluid supply mode in which a mixed fluid containing the gas and the sputter adhesion inhibitor is supplied to the injection part; can be selectively executed. The sputter adhesion suppression device for a laser processing machine according to claim 1.

8. The discharge device includes a lubricator that mixes the sputter adhesion prevention agent into the gas. The sputter adhesion suppression device for a laser processing machine according to any one of claims 2 to 7.

9. The ejection portion is disposed on the sputter guard. The sputter adhesion suppression device for a laser processing machine according to any one of claims 1 to 7.

10. the tip portion has a bottom wall, a first side wall, and a second side wall opposite the first side wall; when a direction from a base end of the spatter guard toward a tip end of the spatter guard is defined as a first direction, an elongated space extending in the first direction is defined by the bottom wall, the first side wall, and the second side wall, The ejection unit ejects the fluid into the elongated space. The sputter adhesion suppression device for a laser processing machine according to any one of claims 1 to 7.

11. A support device for supporting the pipe; A rotary drive device that rotates the pipe about a first axis; a laser irradiation device having a laser head for irradiating the pipe with a laser; A moving device that moves the laser head relative to the pipe; A sputter adhesion suppression device; a control device for controlling the rotation drive device, the laser irradiation device, the moving device, and the sputter adhesion suppression device; Equipped with The sputter adhesion suppression device is a sputter guard inserted into the pipe from a first end thereof and having a tip portion for receiving sputters generated due to irradiation of the pipe with the laser; a sputter guard moving device that moves the sputter guard; an injection unit that injects a fluid onto the tip of the sputter guard; a discharge device that discharges a spatter adhesion inhibitor onto the tip of the spatter guard and onto the inner surface of the pipe; Equipped Laser processing machine.

12. a suction device that sucks the spatter so that the spatter is discharged from the internal space of the pipe to the outside of the pipe through the second end of the pipe; The laser processing machine according to claim 11.

13. The control device includes: A sputter adhesion prevention agent discharge mode; The first processing mode; It is possible to execute the sputter adhesion preventive agent discharge mode includes transmitting a control command from the control device to at least the sputter adhesion suppression device so as to discharge the sputter adhesion preventive agent onto the tip portion of the sputter guard and the inner surface of the pipe; The first processing mode includes transmitting a control command from the control device to at least the laser irradiation device and the sputter adhesion suppression device so that the laser head irradiates the pipe with the laser and the sputter guard blows off the sputter from the tip of the sputter guard onto the inner surface of the pipe.

13. The laser processing machine according to claim 11 or 12.

14. A step of discharging a spatter adhesion prevention agent onto the tip of the spatter guard and the inner surface of the pipe; irradiating the pipe with a laser while the tip of the sputter guard is inserted into the pipe; a step of blowing off sputters generated due to irradiation of the pipe with the laser from the tip of the sputter guard onto the inner surface of the pipe; Equipped with The step of blowing off the spatter is performed by injecting a fluid from an injection portion of the spatter guard onto the tip of the spatter guard. Laser processing method.

15. The step of discharging the sputter adhesion preventive agent includes rotating the pipe about a central axis in a longitudinal direction of the pipe while the sputter adhesion preventive agent is being discharged. The laser processing method according to claim 14.

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