Electronic Components

Abstract

To provide an electronic component capable of suppressing occurrence of migration even in a case where an external electrode includes a conductive resin layer.SOLUTION: An element body 3 has: a pair of end surfaces 3e opposed to each other in a first direction D1; principal surfaces 3a and 3b opposed to each other in a second direction D2; and a pair of lateral faces 3c opposed to each other in a third direction D3. A plurality of internal electrodes 7 and 9 are arranged in the element body 3, each being electrically connected with a corresponding external electrode 5 of a plurality of external electrodes 5. A second electrode layer E2 has a portion provided to continuously cover a part of the principal surface 3a and a part close to the principal surface 3a on the lateral face 3c. When seeing the second electrode layer E2 and the internal electrodes 7 and 9 not being electrically connected with the second electrode layer E2 in the third direction D3, the second electrode layer E2 and the internal electrodes 7 and 9 not being electrically connected with the second electrode layer E2 are not overlapped with each other.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] A known electronic component includes a rectangular parallelepiped element body, a plurality of external electrodes, and a plurality of internal electrodes (see, for example, Patent Document 1). The element body has a pair of end faces facing each other in a first direction, first and second main surfaces facing each other in a second direction, and a pair of side surfaces facing each other in a third direction. The multiple external electrodes are respectively arranged on both ends of the element body in the first direction, and have a conductive resin layer. The multiple internal electrodes are arranged within the element body, and are electrically connected to corresponding external electrodes among the multiple external electrodes. The conductive resin layer has a first main surface side portion provided so as to continuously cover a portion of the first main surface and a portion of the side surface close to the first main surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-157029 A Summary of the Invention [Problem to be solved by the invention]

[0004] The conductive resin layer generally contains a plurality of metal particles and resin. In this case, migration may occur in the external electrodes. Migration is considered to occur, for example, due to the following phenomena. The electric field generated between the internal electrode and the conductive resin layer to which the internal electrode is not electrically connected acts on the metal particles, ionizing the atoms of the metal particles. The generated metal ions are attracted to the electric field generated between the external electrodes and migrate from the conductive resin layer. The metal ions that migrate from the conductive resin layer react with electrons supplied from the element body, for example, and are precipitated as metal on the surface of the element body.

[0005] An object of one aspect of the present invention is to provide an electronic component that suppresses the occurrence of migration even when external electrodes include a conductive resin layer. [Means for solving the problem]

[0006] An electronic component according to one aspect of the present invention includes a rectangular parallelepiped body, a plurality of external electrodes, and a plurality of internal electrodes. The body has a pair of end faces facing each other in a first direction, first and second main surfaces facing each other in a second direction, and a pair of side surfaces facing each other in a third direction. The plurality of external electrodes are respectively arranged on both ends of the body in the first direction and have a conductive resin layer. The plurality of internal electrodes are arranged within the body and are electrically connected to corresponding external electrodes among the plurality of external electrodes. The conductive resin layer has a first main surface side portion that is provided so as to continuously cover a part of the first main surface and a part of the side surface close to the first main surface. When the first main surface side portion and the internal electrodes not electrically connected to the first main surface side portion are viewed from a third direction, the first main surface side portion and the internal electrodes not electrically connected to the first main surface side portion do not overlap each other.

[0007] In the above-mentioned one aspect, the first main surface side portion and the internal electrode that is not electrically connected to the first main surface side portion do not face each other in the third direction. Therefore, an electric field is unlikely to be generated between the conductive resin layer of the first main surface side portion and the internal electrode that is not electrically connected to the conductive resin layer. As a result, the above-mentioned one aspect suppresses the occurrence of migration.

[0008] In the above-mentioned one aspect, of the two first main surface side portions located on the first main surface, one first main surface side portion may have an edge facing the other first main surface side portion. The multiple internal electrodes may be arranged in the element body so as to face each other in the second direction. Of the multiple internal electrodes, an outermost internal electrode located closest to the first main surface may be adjacent in the second direction to the first main surface side portion to which the outermost internal electrode is electrically connected. Taking a plane including an end face on which the outermost internal electrode is exposed as a reference plane, a first length of the outermost internal electrode in the first direction from the reference plane may be larger than a second length in the first direction from the reference plane to an edge of the first main surface side portion to which the outermost internal electrode is electrically connected and smaller than a third length from the reference plane to an edge of the first main surface side portion to which the outermost internal electrode is not electrically connected. In a configuration in which the first length is longer than the second length, the internal electrode adjacent to the outermost internal electrode in the second direction and the conductive resin layer of the first main surface side portion adjacent to the same outermost internal electrode in the second direction are not electrically connected to each other, but are unlikely to face each other in the second direction, and an electric field is unlikely to be generated between the conductive resin layer and the internal electrode that are not electrically connected to each other. In a configuration in which the first length is shorter than the third length, the outermost internal electrode is unlikely to face, in the second direction, the conductive resin layer of the first main surface side portion to which the outermost internal electrode is not electrically connected, and an electric field is unlikely to be generated between the conductive resin layer and the outermost internal electrode that are not electrically connected to each other. As a result, a configuration in which the first length is greater than the second length and less than the third length further suppresses the occurrence of migration.

[0009] The one aspect may further include a dummy conductor located in the same layer as the outermost internal electrode and spaced apart from the outermost internal electrode, and the dummy conductor may be electrically connected to an external electrode to which the outermost internal electrode located in the same layer as the dummy conductor is not electrically connected. In a configuration in which the dummy conductor is located in the same layer as the outermost internal electrode, structural defects are unlikely to occur in the element.

[0010] The one aspect may include a dummy conductor adjacent to the first main surface in the second direction. The internal electrodes may be arranged in the element body so as to face each other in the second direction. The dummy conductor may face in the second direction a portion of the first main surface that is not electrically connected to an internal electrode adjacent to the dummy conductor in the second direction. In the configuration in which the dummy conductor is provided, the dummy conductor is located between the conductive resin layer of the first main surface side portion and the internal electrode that is not electrically connected to the conductive resin layer of the first main surface side portion. The dummy conductor separates the conductive resin layer of the first main surface side portion from the internal electrode that is not electrically connected to the conductive resin layer of the first main surface side portion. Therefore, an electric field is unlikely to be generated between the conductive resin layer of the first main surface side portion and the internal electrode that is not electrically connected to the conductive resin layer of the first main surface side portion. Even if an electric field is generated between the conductive resin layer of the first main surface side portion and the internal electrode that is not electrically connected to the conductive resin layer of the first main surface side portion, the strength of the electric field is small. As a result, the configuration in which the dummy conductor is provided further suppresses the occurrence of migration.

[0011] In the above-mentioned one embodiment, the conductive resin layer does not have to cover the second main surface.

[0012] In the above-mentioned one aspect, the element body may have an inner layer portion in which a plurality of internal electrodes are arranged, and a pair of outer layer portions sandwiching the inner layer portion in the second direction. The part of the first main surface and the part of the side surface closer to the first main surface may be included in one of the outer layer portions. The thickness of the other outer layer portion may be smaller than the thickness of the one outer layer portion. A configuration in which the thickness of the other outer layer portion is smaller than the thickness of one outer layer portion can reduce the height of the electronic component.

[0013] In the above-mentioned one aspect, the element body may have an inner layer portion in which a plurality of internal electrodes are arranged, and a pair of outer layer portions sandwiching the inner layer portion in the second direction. A part of the first main surface and a part of the side surface close to the first main surface may be included in one of the outer layer portions. The dielectric constant of the one of the outer layer portions may be lower than the dielectric constant of the inner layer portion. A configuration in which the dielectric constant of one of the outer layers is lower than that of the inner layer makes it difficult to reduce capacitance. In this configuration, it is difficult for current to flow through the surface of one of the outer layers. Therefore, this configuration suppresses the occurrence of leakage current on the surface of one of the outer layers, and further suppresses the occurrence of migration. Leakage current is one of the factors that cause migration. As a result, this configuration further suppresses the occurrence of migration while ensuring the capacitance.

[0014] In the above-mentioned one aspect, the conductive resin layer may have a second main surface side portion that is spaced from the first main surface side portion and is provided so as to continuously cover a part of the second main surface and a part of the side surface close to the second main surface. When the second main surface side portion and the internal electrode that is not electrically connected to the second main surface side portion are viewed from a third direction, the second main surface side portion and the internal electrode that is not electrically connected to the second main surface side portion may not overlap each other. When the second main surface side portion and the internal electrode not electrically connected to the second main surface side portion are viewed from the third direction, in a configuration in which the second main surface side portion and the internal electrode not electrically connected to the second main surface side portion do not overlap each other, the second main surface side portion and the internal electrode not electrically connected to the second main surface side portion do not face each other in the third direction. Therefore, an electric field is unlikely to be generated between the conductive resin layer of the second main surface side portion and the internal electrode not electrically connected to the conductive resin layer. As a result, this configuration suppresses the occurrence of migration.

[0015] In the above-mentioned one aspect, of the two second main surface side portions located on the second main surface, one second main surface side portion may have an edge facing the other second main surface side portion. The multiple internal electrodes may be lined up inside the element body so as to face each other in the second direction. Of the multiple internal electrodes, an outermost internal electrode located closest to the second main surface may be adjacent in the second direction to the second main surface side portion to which the outermost internal electrode is electrically connected. Using a plane including an end face to which the outermost internal electrode is exposed as a reference plane, a fourth length of the outermost internal electrode in a first direction from the reference plane may be greater than a fifth length in the first direction from the reference plane to an edge of the second main surface side portion to which the outermost internal electrode is electrically connected, and may be smaller than a sixth length from the reference plane to an edge of the second main surface side portion to which the outermost internal electrode is not electrically connected. In a configuration in which the fourth length is longer than the fifth length, the internal electrode adjacent to the outermost internal electrode in the second direction and the conductive resin layer of the second main surface side portion adjacent to the same outermost internal electrode in the second direction are not electrically connected to each other, but are unlikely to face each other in the second direction, and an electric field is unlikely to be generated between the conductive resin layer and the internal electrode that are not electrically connected to each other. In a configuration in which the fourth length is shorter than the sixth length, the outermost internal electrode is unlikely to face, in the second direction, the conductive resin layer of the second main surface side portion to which the outermost internal electrode is not electrically connected, and an electric field is unlikely to be generated between the conductive resin layer and the outermost internal electrode that are not electrically connected to each other. As a result, the configuration in which the fourth length is greater than the fifth length and less than the sixth length further suppresses the occurrence of migration.

[0016] The one aspect may further include a dummy conductor located in the same layer as the outermost internal electrode and spaced apart from the outermost internal electrode, and the dummy conductor may be electrically connected to an external electrode to which the outermost internal electrode located in the same layer as the dummy conductor is not electrically connected. In a configuration in which the dummy conductor is located in the same layer as the outermost internal electrode, structural defects are unlikely to occur in the element.

[0017] The one aspect may include a dummy conductor adjacent to the second main surface in the second direction. The internal electrodes may be arranged in the element body so as to face each other in the second direction. The dummy conductor may face in the second direction a portion of the second main surface that is not electrically connected to an internal electrode adjacent to the dummy conductor in the second direction. In the configuration in which the dummy conductor is provided, the dummy conductor is located between the conductive resin layer of the second main surface side portion and the internal electrode that is not electrically connected to the conductive resin layer of the second main surface side portion. The dummy conductor separates the conductive resin layer of the second main surface side portion from the internal electrode that is not electrically connected to the conductive resin layer of the second main surface side portion. Therefore, an electric field is unlikely to be generated between the conductive resin layer of the second main surface side portion and the internal electrode that is not electrically connected to the conductive resin layer of the second main surface side portion. Even if an electric field is generated between the conductive resin layer of the second main surface side portion and the internal electrode that is not electrically connected to the conductive resin layer of the second main surface side portion, the strength of the electric field is small. As a result, the configuration in which the dummy conductor is provided further suppresses the occurrence of migration.

[0018] In the above-mentioned one aspect, the element body may have an inner layer portion in which a plurality of internal electrodes are arranged, and a pair of outer layer portions sandwiching the inner layer portion in the second direction. The part of the second main surface and the part of the side surface closer to the second main surface may be included in the other outer layer portion. The dielectric constant of the other outer layer portion may be lower than the dielectric constant of the inner layer portion. A configuration in which the dielectric constant of the other outer layer is lower than that of the inner layer makes it difficult to reduce capacitance. In this configuration, it is difficult for current to flow through the surface of the other outer layer. Therefore, this configuration suppresses the occurrence of leakage current on the surface of the other outer layer, and further suppresses the occurrence of migration. As a result, this configuration further suppresses the occurrence of migration while ensuring the capacitance.

[0019] In the one aspect described above, the multiple internal electrodes may be arranged side by side within the element body so as to face each other in the third direction.

[0020] In the above-mentioned one aspect, each of the plurality of internal electrodes may have main electrode portions facing each other in the third direction and a connection portion connecting a corresponding one of the plurality of external electrodes to the main electrode portion, The width of the connection portion in the second direction may be smaller than the width of the main electrode portions in the second direction.

[0021] In the one aspect described above, the connection portion may be located closer to the second main surface when viewed from the third direction.

[0022] In the above aspect, each of the plurality of internal electrodes may have an auxiliary electrode portion that overlaps in the third direction with a connection portion of an internal electrode adjacent in the third direction. A configuration in which each of the multiple internal electrodes has an auxiliary electrode portion can increase the capacitance.

[0023] In the above-described one embodiment, the conductive resin layer may contain a plurality of silver particles. Effect of the Invention

[0024] One aspect of the present invention provides an electronic component that suppresses the occurrence of migration even when an external electrode includes a conductive resin layer. [Brief description of the drawings]

[0025] [Figure 1] FIG. 1 is a perspective view of a multilayer capacitor in accordance with one embodiment. [Diagram 2] FIG. 2 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with this embodiment. [Diagram 3] FIG. 3 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with this embodiment. [Figure 4] FIG. 4 is a diagram showing a cross-sectional structure of the multilayer capacitor in accordance with this embodiment. [Diagram 5] FIG. 5 is a diagram showing the configuration of the second electrode layer. [Figure 6] FIG. 6 is a diagram showing the configuration of the second electrode layer. [Figure 7] FIG. 7 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Figure 8] FIG. 8 is a diagram showing a mounting structure of the multilayer capacitor in accordance with this embodiment. [Figure 9] FIG. 9 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Figure 10]FIG. 10 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Figure 11] FIG. 11 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Figure 12] FIG. 12 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Figure 13] FIG. 13 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Figure 14] FIG. 14 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Figure 15] FIG. 15 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Figure 16] FIG. 16 is a diagram showing the configuration of the second electrode layer. [Figure 17] FIG. 17 is a diagram showing the configuration of the second electrode layer. [Figure 18] FIG. 18 is a diagram showing the configuration of the second electrode layer. [Figure 19] FIG. 19 is a diagram showing the configuration of the second electrode layer. [Figure 20] FIG. 20 is a perspective view of a multilayer capacitor according to a modified example of this embodiment. [Figure 21] FIG. 21 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Figure 22] FIG. 22 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Figure 23] FIG. 23 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Figure 24] FIG. 24 is a diagram showing the configuration of the second electrode layer. [Diagram 25] FIG. 25 is a diagram showing the configuration of the second electrode layer. [Figure 26] FIG. 26 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Figure 27]FIG. 27 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Figure 28] FIG. 28 is a diagram showing the configuration of the second electrode layer. [Figure 29] FIG. 29 is a diagram showing the configuration of the second electrode layer. [Diagram 30] FIG. 30 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Diagram 31] FIG. 31 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Diagram 32] FIG. 32 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Diagram 33] FIG. 33 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. [Diagram 34] FIG. 34 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same functions will be denoted by the same reference numerals, and duplicated description will be omitted.

[0027] The configuration of the multilayer capacitor C1 in accordance with this embodiment will be described with reference to Fig. 1 to Fig. 4. Fig. 1 is a perspective view of the multilayer capacitor in accordance with this embodiment. Figs. 2, 3, and 4 are views showing cross-sectional configurations of the multilayer capacitor in accordance with this embodiment. In this embodiment, the electronic component is, for example, the multilayer capacitor C1.

[0028] 1, the multilayer capacitor C1 includes a rectangular parallelepiped element body 3 and a plurality of external electrodes 5. In this embodiment, the multilayer capacitor C1 includes a pair of external electrodes 5. The pair of external electrodes 5 are disposed on the outer surface of the element body 3. The pair of external electrodes 5 are spaced apart from each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges.

[0029] The element body 3 has a pair of main surfaces 3a, 3b facing each other, a pair of side surfaces 3c facing each other, and a pair of end surfaces 3e facing each other. The pair of main surfaces 3a, 3b, the pair of side surfaces 3c, and the pair of end surfaces 3e are rectangular. The direction in which the pair of main surfaces 3a, 3b face each other is the second direction D2. The direction in which the pair of side surfaces 3c face each other is the third direction D3. The direction in which the pair of end surfaces 3e face each other is the first direction D1. The multilayer capacitor C1 is solder-mounted on an electronic device. The electronic device includes, for example, a circuit board or an electronic component. In the multilayer capacitor C1, the main surface 3a faces the electronic device. The main surface 3a is arranged to form a mounting surface. The main surface 3a is the mounting surface. For example, when the main surface 3a forms a first main surface, the main surface 3b forms a second main surface.

[0030] The second direction D2 is a direction perpendicular to each of the main faces 3a, 3b and perpendicular to the third direction D3. The first direction D1 is a direction parallel to each of the main faces 3a, 3b and each of the side faces 3c and perpendicular to the second direction D2 and the third direction D3. The third direction D3 is a direction perpendicular to each of the side faces 3c, and the first direction D1 is a direction perpendicular to each of the end faces 3e. In this embodiment, the length of the element body 3 in the first direction D1 is greater than the length of the element body 3 in the second direction D2 and is greater than the length of the element body 3 in the third direction D3. The first direction D1 is the longitudinal direction of the element body 3. The length of the element body 3 in the second direction D2 and the length of the element body 3 in the third direction D3 may be equal to each other. The length of the element body 3 in the second direction D2 and the length of the element body 3 in the third direction D3 may be different from each other.

[0031] The length of element body 3 in the second direction D2 is the height of element body 3. The length of element body 3 in the third direction D3 is the width of element body 3. The length of element body 3 in the first direction D1 is the length of element body 3. In this embodiment, the height of element body 3 is 0.1 to 2.5 mm, the width of element body 3 is 0.1 to 5.0 mm, and the length of element body 3 is 0.2 to 5.7 mm. For example, the height of element body 3 is 2.5 mm, the width of element body 3 is 2.5 mm, and the length of element body 3 is 3.2 mm.

[0032] The pair of side surfaces 3c extend in the second direction D2 to connect the pair of main surfaces 3a, 3b. The pair of side surfaces 3c also extend in the first direction D1. The pair of end surfaces 3e extend in the second direction D2 to connect the pair of main surfaces 3a, 3b. The pair of end surfaces 3e also extend in the third direction D3.

[0033] The element body 3 has four ridges 3g, four ridges 3i, and four ridges 3j. The ridges 3g are located between the end face 3e and each of the main faces 3a and 3b. The ridges 3i are located between the end face 3e and the side face 3c. The ridges 3j are located between each of the main faces 3a and 3b and the side face 3c. In this embodiment, each of the ridges 3g, 3i, and 3j is rounded so as to be curved. The element body 3 is subjected to so-called R chamfering. The end face 3e and each of the main faces 3a and 3b are indirectly adjacent to each other via the ridges 3g. The end face 3e and the side face 3c are indirectly adjacent to each other via the ridges 3i. The main faces 3a and 3b and the side face 3c are indirectly adjacent to each other via the ridges 3j.

[0034] The element body 3 is configured by stacking a plurality of dielectric layers in the second direction D2. The element body 3 has a plurality of dielectric layers stacked on top of each other. In the element body 3, the stacking direction of the plurality of dielectric layers coincides with the second direction D2. Each dielectric layer is configured, for example, from a sintered body of a ceramic green sheet containing a dielectric material. The dielectric material includes, for example, a BaTiO3-based, Ba(Ti,Zr)O3-based, or (Ba,Ca)TiO3-based dielectric ceramic. In the actual element body 3, the dielectric layers are integrated to such an extent that the boundaries between the dielectric layers are not visible.

[0035] As shown in Figs. 2 to 5, the multilayer capacitor C1 includes a plurality of internal electrodes 7 and a plurality of internal electrodes 9. Each of the internal electrodes 7, 9 is an internal conductor disposed within the element body 3. Each of the internal electrodes 7, 9 is made of a conductive material that is typically used as an internal conductor of a multilayer electronic component. The conductive material includes, for example, a base metal. The conductive material includes, for example, Ni or Cu. The internal electrodes 7, 9 are configured as a sintered body of a conductive paste that includes the conductive material. In this embodiment, the internal electrodes 7, 9 are made of Ni.

[0036] The internal electrodes 7 and the internal electrodes 9 are arranged at different positions (layers) in the second direction D2. The internal electrodes 7 and the internal electrodes 9 are arranged alternately in the element body 3 so as to face each other with a gap in the second direction D2. The internal electrodes 7 and the internal electrodes 9 have mutually different polarities. One end of the internal electrodes 7, 9 is exposed at the corresponding end face 3e. The internal electrodes 7, 9 have one end exposed at the corresponding end face 3e. The multiple internal electrodes 7 and the multiple internal electrodes 9 are arranged alternately in the second direction D2. The multiple internal electrodes 7, 9 are arranged in the element body 3 so as to be aligned in the second direction D2. Each of the internal electrodes 7, 9 is located in a plane approximately parallel to each of the main surfaces 3a, 3b. The internal electrodes 7 and 9 face each other in the second direction D2. The direction in which the internal electrodes 7 and 9 face each other (second direction D2) is perpendicular to the direction parallel to each of the main surfaces 3a, 3b (third direction D3 and first direction D1).

[0037] In this embodiment, the multiple internal electrodes 7 include one internal electrode 7A located outermost in the second direction D2. The internal electrode 7A is the outermost internal electrode. The internal electrode 7A has a pair of ends 7Ae1, 7Ae2 facing each other in the first direction D1. The end 7Ae1 is exposed at the end face 3e. The end 7Ae2 is located within the element body 3. In this embodiment, the multiple internal electrodes 9 include one internal electrode 9A located outermost in the second direction D2. The internal electrode 9A is the outermost internal electrode. The internal electrode 9A has a pair of ends 9Ae1, 9Ae2 facing each other in the first direction D1. The end 9Ae1 is exposed at the end face 3e. The end 9Ae2 is located within the element body 3. For example, if each end 7Ae1, 9Ae1 constitutes a first end, then the ends 7Ae2, 9Ae2 constitute a second end.

[0038] As shown in FIG. 1, the external electrodes 5 are disposed on both ends of the element body 3 in the first direction D1. Each external electrode 5 is disposed on the corresponding end face 3e side of the element body 3. In this embodiment, each external electrode 5 is disposed on a pair of main faces 3a, 3b, a pair of side faces 3c, and one end face 3e. As shown in FIGS. 2 to 4, the external electrode 5 has a plurality of electrode portions 5a, 5b, 5c, 5e. The electrode portion 5a is disposed on the main face 3a and on the ridge portion 3g. The electrode portion 5b is disposed on the main face 3b and on the ridge portion 3g. Each electrode portion 5c is disposed on the side face 3c and on the ridge portion 3i. The electrode portion 5e is disposed on the end face 3e. The external electrode 5 also has an electrode portion disposed on the ridge portion 3j.

[0039] The external electrode 5 is formed on five surfaces, namely, the pair of main surfaces 3a, 3b, one end surface 3e, and the pair of side surfaces 3c, as well as on the ridges 3g, 3i, 3j. The electrode portions 5a, 5b, 5c, 5e adjacent to each other are connected and electrically connected. The electrode portion 5e covers one end of the corresponding internal electrode 7, 9 in its entirety. The electrode portion 5e is directly connected to the corresponding internal electrode 7, 9. The external electrode 5 is electrically connected to the corresponding internal electrode 7, 9. As shown in Figs. 2 to 4, the external electrode 5 has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The third electrode layer E3 constitutes the outermost layer of the external electrode 5. Each of the electrode portions 5a, 5c, 5e has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The electrode portion 5b has a first electrode layer E1 and a third electrode layer E3.

[0040] The first electrode layer E1 of the electrode portion 5a is disposed on the main surface 3a and the ridge portion 3g. The first electrode layer E1 of the electrode portion 5a is formed so as to cover a part of the main surface 3a and the entire ridge portion 3g. The first electrode layer E1 of the electrode portion 5a is in contact with the part of the main surface 3a and the entire ridge portion 3g. That is, in the electrode portion 5a, the first electrode layer E1 is in direct contact with the element body 3. The part of the main surface 3a is covered by the first electrode layer E1, and the remaining part excluding the part is exposed from the first electrode layer E1. The part of the main surface 3a is a partial region of the main surface 3a near the end surface 3e. The first electrode layer E1 of the electrode portion 5a is located on the main surface 3a. The first electrode layer E1 does not have to be formed on the main surface 3a. That is, the first electrode layer E1 does not have to be disposed on the main surface 3a. The second electrode layer E2 of the electrode unit 5a is disposed on the first electrode layer E1 and the main surface 3a. In the electrode unit 5a, the second electrode layer E2 is formed so as to cover the first electrode layer E1 and a part of the main surface 3a. In the electrode unit 5a, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the main surface 3a. The second electrode layer E2 of the electrode unit 5a is formed so as to cover the first electrode layer E1 of the electrode unit 5a. In the electrode unit 5a, the second electrode layer E2 indirectly covers the main surface 3a so that the first electrode layer E1 is located between the second electrode layer E2 and the main surface 3a. The second electrode layer E2 of the electrode unit 5a is located on the main surface 3a. Each second electrode layer E2 located on the same main surface 3a is disposed at the edge E2a. e On the same main surface 3a, the edge E2a of one of the second electrode layers E2 e The edge E2a of the other second electrode layer E2 e and is opposed to. The third electrode layer E3 of the electrode unit 5a is disposed on the second electrode layer E2. In the electrode unit 5a, the third electrode layer E3 covers the second electrode layer E2. In the electrode unit 5a, the third electrode layer E3 is in contact with the second electrode layer E2. That is, in the electrode unit 5a, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode unit 5a, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode unit 5a is located on the main surface 3a.

[0041] The first electrode layer E1 of the electrode portion 5b is disposed on the main surface 3b and the ridge portion 3g. The first electrode layer E1 of the electrode portion 5b is formed so as to cover a part of the main surface 3b and the entire ridge portion 3g. The first electrode layer E1 of the electrode portion 5b is in contact with the part of the main surface 3b and the entire ridge portion 3g. That is, in the electrode portion 5b, the first electrode layer E1 is in direct contact with the element body 3. The part of the main surface 3b is covered by the first electrode layer E1, and the remaining part excluding the part is exposed from the first electrode layer E1. The part of the main surface 3b is a partial region of the main surface 3b near the end surface 3e. The first electrode layer E1 of the electrode portion 5b is located on the main surface 3b. The first electrode layer E1 does not have to be formed on the main surface 3b. That is, the first electrode layer E1 does not have to be disposed on the main surface 3b. The third electrode layer E3 of the electrode unit 5b is disposed on the first electrode layer E1. In the electrode unit 5b, the third electrode layer E3 covers the first electrode layer E1. In the electrode unit 5b, the third electrode layer E3 is in contact with the first electrode layer E1. That is, in the electrode unit 5b, the third electrode layer E3 is in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode unit 5b is located on the main surface 3b. The electrode unit 5b does not have the second electrode layer E2. That is, the main surface 3b is not covered with the second electrode layer E2.

[0042] The first electrode layer E1 of the electrode portion 5c is disposed on the side surface 3c and the ridge portion 3i. The first electrode layer E1 of the electrode portion 5c is formed so as to cover a part of the side surface 3c and the entire ridge portion 3i. The first electrode layer E1 of the electrode portion 5c is in contact with the part of the side surface 3c and the entire ridge portion 3i. That is, in the electrode portion 5c, the first electrode layer E1 is in direct contact with the element body 3. The part of the side surface 3c is covered by the first electrode layer E1, and the remaining part excluding the part is exposed from the first electrode layer E1. The part of the side surface 3c is a partial region of the side surface 3c near the end face 3e. The first electrode layer E1 of the electrode portion 5c is located on the side surface 3c. The first electrode layer E1 does not have to be formed on the side surface 3c. That is, the first electrode layer E1 does not have to be disposed on the side surface 3c. The second electrode layer E2 of the electrode portion 5c is disposed on the first electrode layer E1 and the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is formed so as to cover a part of the first electrode layer E1 and a part of the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is in direct contact with the part of the first electrode layer E1 and the part of the side surface 3c. The second electrode layer E2 of the electrode portion 5c is formed so as to cover the part of the first electrode layer E1 of the electrode portion 5c. The part of the side surface 3c is, for example, a corner region of the side surface 3c near the main surface 3a and the end surface 3e. In the electrode portion 5c, the second electrode layer E2 indirectly covers the part of the side surface 3c so that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3c. The part of the first electrode layer E1 of the electrode portion 5c is covered by the second electrode layer E2, and the remaining part except for the part is exposed from the second electrode layer E2. The second electrode layer E2 of the electrode portion 5c is located on the side surface 3c. Each second electrode layer E2 located on the same side surface 3c has an edge E2c e On the same side surface 3c, the edge E2c of one of the second electrode layers E2 e is the edge E2c of the other second electrode layer E2 e and is opposed to The third electrode layer E3 of the electrode unit 5c is disposed on the first electrode layer E1 and the second electrode layer E2. In the electrode unit 5c, the third electrode layer E3 covers the entire second electrode layer E2 and covers the entire part of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode unit 5c, the third electrode layer E3 is in contact with the entire second electrode layer E2 and is in contact with the entire part of the first electrode layer E1 exposed from the second electrode layer E2. That is, in the electrode unit 5c, the third electrode layer E3 is in direct contact with the first electrode layer E1 and the second electrode layer E2. The third electrode layer E3 of the electrode unit 5c is located on the side surface 3c.

[0043] The electrode portion 5c has a plurality of regions 5c1 and 5c2. In this embodiment, the electrode portion 5c has only two regions 5c1 and 5c2. The region 5c2 is located closer to the main surface 3a than the region 5c1. The region 5c1 has a first electrode layer E1 and a third electrode layer E3. The region 5c1 does not have a second electrode layer E2. The region 5c2 has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The region 5c1 is a region where the first electrode layer E1 is exposed from the second electrode layer E2. The region 5c2 is a region where the first electrode layer E1 is covered with the second electrode layer E2.

[0044] The first electrode layer E1 of the electrode unit 5e is disposed on the end surface 3e. The first electrode layer E1 of the electrode unit 5e is formed so as to cover the entire end surface 3e. The first electrode layer E1 of the electrode unit 5e is in contact with the entire end surface 3e. That is, in the electrode unit 5e, the first electrode layer E1 is in direct contact with the end surface 3e. The second electrode layer E2 of the electrode unit 5e is disposed on the first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 is formed so as to cover a portion of the first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 is in direct contact with the portion of the first electrode layer E1. The second electrode layer E2 of the electrode unit 5e is formed so as to cover the portion of the first electrode layer E1 of the electrode unit 5e. In the electrode unit 5e, the second electrode layer E2 indirectly covers a portion of the end face 3e so that the first electrode layer E1 is located between the second electrode layer E2 and the end face 3e. The portion of the end face 3e is, for example, a portion of the end face 3e near the main face 3a. The first electrode layer E1 of the electrode unit 5e is covered in the portion by the second electrode layer E2, and is exposed from the second electrode layer E2 in the remaining portion excluding the portion. The third electrode layer E3 of the electrode unit 5e is disposed on the first electrode layer E1 and the second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 covers the entire second electrode layer E2 and covers the entire part of the first electrode layer E1 exposed from the second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 is in contact with the entire second electrode layer E2 and is in contact with the entire part of the first electrode layer E1 exposed from the second electrode layer E2. That is, in the electrode unit 5e, the third electrode layer E3 is in direct contact with the first electrode layer E1 and the second electrode layer E2. The third electrode layer E3 of the electrode unit 5e is located on the end surface 3e. The electrode unit 5e may not have the second electrode layer E2. When the electrode unit 5e does not have the second electrode layer E2, in the electrode unit 5e, the third electrode layer E3 covers the entire first electrode layer E1 and is in direct contact with the first electrode layer E1.

[0045] The electrode portion 5e has a plurality of regions 5e1 and 5e2. In this embodiment, the electrode portion 5e has only two regions 5e1 and 5e2. The region 5e2 is located closer to the main surface 3a than the region 5e1. The region 5e1 has a first electrode layer E1 and a third electrode layer E3. The region 5e1 does not have a second electrode layer E2. The region 5e2 has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. In the electrode portion 5e, the third electrode layer E3 is formed so as to cover the entire end surface 3e when viewed from the first direction D1. In this embodiment, the third electrode layer E3 indirectly covers the entire end surface 3e. The region 5e1 is a region where the first electrode layer E1 is exposed from the second electrode layer E2. The region 5e2 is a region where the first electrode layer E1 is covered with the second electrode layer E2.

[0046] The first electrode layer E1 is formed by baking a conductive paste applied to the surface of the element body 3. The first electrode layer E1 is formed so as to cover the above-mentioned parts of the main faces 3a and 3b, the above-mentioned parts of the side faces 3c, one end face 3e, and the ridges 3g, 3i, and 3j. The first electrode layer E1 is formed by sintering a metal component (metal particles) contained in the conductive paste. The first electrode layer E1 is a sintered metal layer. The first electrode layer E1 is a sintered metal layer formed on the element body 3. In this embodiment, the first electrode layer E1 is a sintered metal layer made of Cu. The first electrode layer E1 may be a sintered metal layer made of Ni. The first electrode layer E1 contains a base metal. The conductive paste contains, for example, particles made of Cu or Ni, a glass component, an organic binder, and an organic solvent. The first electrode layer E1 of each electrode portion 5a, 5b, 5c, and 5e is integrally formed.

[0047] The second electrode layer E2 is formed by curing a conductive resin applied onto the first electrode layer E1. The second electrode layer E2 is formed over the first electrode layer E1 and the element body 3. The first electrode layer E1 is a base metal layer for forming the second electrode layer E2. The second electrode layer E2 is a conductive resin layer that covers the first electrode layer E1. The conductive resin contains, for example, a resin, a conductive material, and an organic solvent. The resin is, for example, a thermosetting resin. The conductive material is, for example, metal particles. The metal particles are, for example, silver particles or copper particles. In this embodiment, the second electrode layer E2 contains a plurality of silver particles. The thermosetting resin is, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin. The second electrode layer E2 is in contact with a part of the ridge portion 3j. The second electrode layer E2 of each electrode portion 5a, 5c, 5e is integrally formed.

[0048] The third electrode layer E3 is formed on the second electrode layer E2 and on the first electrode layer E1 (a portion exposed from the second electrode layer E2) by plating. The third electrode layer E3 may have a multi-layer structure. In this case, the third electrode layer E3 has, for example, a Ni plating layer and a solder plating layer. The Ni plating layer is formed on the second electrode layer E2 and the first electrode layer E1. The solder plating layer is formed on the Ni plating layer. The solder plating layer covers the Ni plating layer. The Ni plating layer has better solder erosion resistance than the metal contained in the second electrode layer E2. The third electrode layer E3 may have a Sn plating layer, a Cu plating layer, or a Au plating layer instead of the Ni plating layer. The solder plating layer includes, for example, a Sn plating layer, a Sn-Ag alloy plating layer, a Sn-Bi alloy plating layer, or a Sn-Cu alloy plating layer. The third electrode layer E3 of each of the electrode portions 5a, 5b, 5c, and 5e is integrally formed.

[0049] In the multilayer capacitor C1, the second electrode layer E2 continuously covers only a part of the main surface 3a, only a part of the end surface 3e, and only a part of each of the pair of side surfaces 3c. That is, the second electrode layer E2 has a portion that is provided so as to continuously cover only a part of the main surface 3a, only a part of the end surface 3e, and only a part of each of the pair of side surfaces 3c. This portion constitutes, for example, the first main surface side portion. In this embodiment, the second electrode layer E2 constitutes the first main surface side portion. The above-mentioned portion of the end surface 3e is a part of the end surface 3e closer to the main surface 3a. The above-mentioned portion of each side surface 3c is a part of the side surface 3c closer to the main surface 3a. The second electrode layer E2 covers the entire one of the ridge lines 3g, only a part of the ridge line 3i, and only a part of the ridge line 3j. A part of the portion of the first electrode layer E1 that covers the ridge line 3i is exposed from the second electrode layer E2. For example, the first electrode layer E1 in each of the regions 5c1 and 5e1 is exposed from the second electrode layer E2. In a configuration in which the electrode portion 5e does not have the second electrode layer E2, the second electrode layer E2 continuously covers only a part of the main surface 3a and only a part of each of the pair of side surfaces 3c. That is, the second electrode layer E2 has a portion that is provided so as to continuously cover only a part of the main surface 3a and only a part of each of the pair of side surfaces 3c. This portion also constitutes, for example, a first main surface side portion.

[0050] The internal electrode 7A is adjacent to the electrode portion 5a electrically connected to the internal electrode 7A in the second direction D2. The internal electrode 7A is adjacent to the electrode portion 5b located on the main surface 3b adjacent to the internal electrode 7A in the second direction D2. As described above, the electrode portion 5b does not have the second electrode layer E2. The internal electrode 9A is adjacent to the electrode portion 5a electrically connected to the internal electrode 9A in the second direction D2. The internal electrode 9A is adjacent to the electrode portion 5a located on the main surface 3a adjacent to the internal electrode 9A in the second direction D2. As described above, the electrode portion 5a has the second electrode layer E2.

[0051] As shown in Figures 2 to 4, the multilayer capacitor C1 includes a conductor 13. In Figures 3 and 4, for the sake of explanation, the internal electrodes 7, 9 (internal electrodes 7A, 9A) and the conductor 13 are intentionally illustrated shifted from each other in the third direction D3. The conductor 13 is located in the same layer as the internal electrode 9A and is spaced apart from the internal electrode 9A. The conductor 13 has one end exposed at the corresponding end face 3e. One end of the conductor 13 is exposed at the end face 3e where one end of the internal electrode 7 is exposed. One end of the conductor 13 is entirely covered by the corresponding electrode portion 5e. The conductor 13 is directly connected to the corresponding electrode portion 5e. The conductor 13 is electrically connected to the corresponding external electrode 5. In this embodiment, the conductor 13 is electrically connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 7 is electrically connected. That is, the conductor 13 is electrically connected to the external electrode 5 to which the internal electrode 9 is not electrically connected. The conductor 13 constitutes a dummy conductor that is unlikely to contribute to the formation of capacitance.

[0052] As shown in FIG. 2, the length L11 of the internal electrode 9A in the first direction D1 from the reference plane PL1 is a distance L11 between the edge E2a of the second electrode layer E2 electrically connected to the internal electrode 9A and the reference plane PL1. e Therefore, when the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is electrically connected are viewed in the second direction D2, the end 9Ae2 is exposed from the second electrode layer E2 to which the internal electrode 9A is electrically connected. The length L11 is a distance from the reference plane PL1 to the end edge E2a of the second electrode layer E2 to which the internal electrode 9A is not electrically connected. e The length L31 in the first direction D1 from the internal electrode 9A to the second electrode layer E2 to which the internal electrode 9A is not electrically connected is smaller than the length L31 in the first direction D1 from the internal electrode 9A to the second electrode layer E2 to which the internal electrode 9A is not electrically connected. Therefore, when the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is not electrically connected are viewed from the second direction D2, the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is not electrically connected do not overlap each other. The reference plane PL1 includes an end surface 3e where an end 9Ae1 of the internal electrode 9A is exposed. For example, when the length L11 constitutes a first length, the length L21 constitutes a second length, and the length L31 constitutes a third length.

[0053] As shown in Fig. 5, when the second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 are viewed from the third direction D3, the second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 do not overlap with each other. The second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 do not face each other in the third direction D3. Fig. 5 is a diagram showing the configuration of the second electrode layer. As shown in Fig. 6, when the second electrode layer E2 and the internal electrodes 7 and 9 that are not electrically connected to the second electrode layer E2 are viewed from the second direction D2, the second electrode layer E2 and the internal electrodes 7 and 9 that are not electrically connected to the second electrode layer E2 overlap each other. Fig. 6 is a diagram showing the configuration of the second electrode layer.

[0054] The element body 3 has an inner layer portion 4a and a pair of outer layer portions 4b, 4c. A plurality of internal electrodes 7, 9 are arranged in the inner layer portion 4a. The inner layer portion 4a is located between the pair of outer layer portions 4b, 4c in the second direction D2. The pair of outer layer portions 4b, 4c sandwich the inner layer portion 4a in the second direction D2. A plurality of internal electrodes 7, 9 are not arranged in each of the outer layer portions 4b, 4c. In this embodiment, the boundary between the internal electrode 9A and the outer layer portion 4b constitutes the boundary between the inner layer portion 4a and the outer layer portion 4b, and the boundary between the internal electrode 7A and the outer layer portion 4c constitutes the boundary between the inner layer portion 4a and the outer layer portion 4c. The part of the main surface 3a, the part of the end surface 3e, and the part of each side surface 3c that are continuously covered by the second electrode layer E2 are included in the outer layer portion 4b. In this embodiment, the thickness of the outer layer portion 4c is equal to the thickness of the outer layer portion 4b. The thickness of the outer layer portion 4b is the length of the outer layer portion 4b in the second direction D2. The thickness of the outer layer portion 4c is the length of the outer layer portion 4c in the second direction D2.

[0055] As shown in Fig. 7, the thickness of the outer layer portion 4c may be smaller than the thickness of the outer layer portion 4b. Fig. 7 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the present embodiment. The outer layer portion 4c has a smaller thickness than the outer layer portion 4b, which can reduce the height of the multilayer capacitor C1.

[0056] When the multilayer capacitor C1 is solder-mounted on an electronic device, an external force acting on the multilayer capacitor C1 from the electronic device may act on the element body 3 through the electrode portions 5a, 5c. The external force is transmitted to the electrode portions 5a, 5c from solder fillets formed during solder mounting. The electronic device may include, for example, a circuit board or an electronic component. In the multilayer capacitor C1, the electrode portions 5a, 5c have the second electrode layer E2. Therefore, external force is unlikely to act on the element body 3 from the electrode portions 5a, 5c. As a result, the multilayer capacitor C1 suppresses the occurrence of cracks in the element body 3.

[0057] In the multilayer capacitor C1, the electrode portion 5e has the second electrode layer E2, which reduces the stress acting on the solder fillet formed on the electrode portion 5e. As a result, the multilayer capacitor C1 suppresses the occurrence of solder cracks.

[0058] In the multilayer capacitor C1, the second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 do not face each other in the third direction D3. Therefore, an electric field is unlikely to be generated between the second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2. As a result, the multilayer capacitor C1 suppresses the occurrence of migration.

[0059] In the multilayer capacitor C1, the length L11 is longer than the length L21. Therefore, the internal electrode 7 adjacent to the internal electrode 9A in the second direction D2 and the second electrode layer E2 adjacent to the internal electrode 9A in the second direction D2 are not electrically connected to each other, but are unlikely to face each other in the second direction D2. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 7 that are not electrically connected to each other. The length L11 is shorter than the length L31. Therefore, the internal electrode 9A is unlikely to face, in the second direction D2, the second electrode layer E2 included in the electrode portion 5a to which the internal electrode 9A is not electrically connected. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 9A, which are not electrically connected to each other. As a result, the multilayer capacitor C1 further suppresses the occurrence of migration.

[0060] The multilayer capacitor C1 includes a conductor 13. The conductor 13 is electrically connected to the external electrodes 5 to which the internal electrodes 9A are not electrically connected. In a configuration in which the conductor 13 is located in the same layer as the internal electrodes 7A and 9A, structural defects are unlikely to occur in the element body 3.

[0061] The second electrode layer E2 contains a plurality of silver particles. Silver particles tend to cause migration more easily than, for example, copper particles. The multilayer capacitor C1 reliably suppresses the occurrence of migration even when the second electrode layer E2 contains a plurality of silver particles.

[0062] Next, the mounting structure of the multilayer capacitor C1 will be described with reference to Fig. 8. Fig. 8 is a diagram showing the mounting structure of the multilayer capacitor in accordance with this embodiment.

[0063] As shown in FIG. 8, the electronic component device includes a multilayer capacitor C1 and an electronic device ED. The electronic device ED is, for example, a circuit board or an electronic device. The multilayer capacitor C1 is solder-mounted on the electronic device ED. The electronic device ED has a main surface EDa and two pad electrodes PE. Each pad electrode PE is disposed on the main surface EDa. The two pad electrodes PE are spaced apart from each other. The multilayer capacitor C1 is disposed on the electronic device ED such that the main surface 3a, which is the mounting surface, faces the main surface EDa. Each of the internal electrodes 7, 9 is located in a plane substantially parallel to the main surface EDa.

[0064] When the multilayer capacitor C1 is solder-mounted, molten solder wets and rises up the external electrodes 5 (third electrode layers E3). When the wetted solder solidifies, solder fillets SF are formed on the external electrodes 5. The corresponding external electrodes 5 and pad electrodes PE are connected via the solder fillets SF.

[0065] Next, the configuration of a multilayer capacitor C11 according to a modified example of this embodiment will be described with reference to Fig. 9. Fig. 9 is a diagram showing a cross-sectional configuration of the multilayer capacitor according to the modified example of this embodiment. The multilayer capacitor C11 according to this modified example is generally similar or the same as the multilayer capacitor C1 described above, but this modified example differs from the multilayer capacitor C1 in terms of the configuration of the element body 3. Below, the differences between the multilayer capacitor C1 and this modified example will be mainly described.

[0066] In the multilayer capacitor C11, the dielectric constant of the outer layer portion 4b is lower than that of the inner layer portion 4a. The dielectric constant of the outer layer portion 4c is equal to that of the inner layer portion 4a. The inner layer portion 4a and the outer layer portion 4c are made of, for example, a BaTiO3-based dielectric ceramic. The outer layer portion 4b is made of, for example, a CaZrO3-based or SrTiO3-based dielectric ceramic. The outer layer portion 4b may be made of, for example, a BaTiO3-based dielectric ceramic. In this case, the outer layer portion 4b may contain an additive that reduces the dielectric constant of the outer layer portion 4b below that of the inner layer portion 4a. As described above, in the multilayer capacitor C11, the dielectric constant of the outer layer portion 4b is lower than that of the inner layer portion 4a. In the multilayer capacitor C11, current is less likely to flow through the surface of the outer layer portion 4b than in a configuration in which the dielectric constant of the outer layer portion 4b is equal to that of the inner layer portion 4a. Therefore, the multilayer capacitor C11 suppresses the occurrence of leakage current on the surface of the outer layer portion 4b, and further suppresses the occurrence of migration. In the multilayer capacitor C11, the dielectric constant of the inner layer portion 4a is higher than the dielectric constant of the outer layer portion 4b, and therefore the capacitance of the multilayer capacitor C11 is less likely to decrease. As a result, the multilayer capacitor C11 further suppresses the occurrence of migration while ensuring the capacitance.

[0067] Next, the structure of a multilayer capacitor C12 according to a modified example of this embodiment will be described with reference to Fig. 10 and Fig. 11. Fig. 10 and Fig. 11 are diagrams showing the cross-sectional structure of the multilayer capacitor according to the modified example of this embodiment. The multilayer capacitor C12 according to this modified example is generally similar or the same as the multilayer capacitor C1 described above, but this modified example differs from the multilayer capacitor C1 in the structure of the conductor 13. The following mainly describes the differences between the multilayer capacitor C1 and this modified example.

[0068] The multilayer capacitor C12 includes a conductor 13. In Fig. 11, for the sake of explanation, the internal electrode 9A and the conductor 13 are intentionally illustrated shifted from each other in the third direction D3. In the multilayer capacitor C11 as well, the conductor 13 constitutes a dummy conductor that is unlikely to contribute to the formation of capacitance.

[0069] The conductor 13 is adjacent to the principal surface 3a in the second direction D2. The conductor 13 is adjacent to the internal electrode 7A in the second direction D2. The conductor 13 is located between the principal surface 3a and the internal electrode 7A. The conductor 13 includes a portion 13a and a portion 13b. The portion 13a faces, in the second direction D2, the second electrode layer E2 to which the internal electrode 7A is not electrically connected and which is disposed on the main surface 3a. Thus, the conductor 13 faces, in the second direction D2, the second electrode layer E2 to which the internal electrode 7A is not electrically connected. The portion 13b faces, in the second direction D2, the second electrode layer E2 to which the internal electrode 7A is electrically connected and which is disposed on the principal surface 3a.

[0070] The portion 13a is spaced apart from the portion 13b in the first direction D1 and is not electrically connected to any of the second electrode layers E2. The portion 13a does not have an end exposed on the surface of the element body 3. The portion 13b is electrically connected to the second electrode layer E2 facing the portion 13b in the second direction D2. The portion 13b has an end exposed at the end face 3e where the internal electrode 7A is exposed. The end of the portion 13b exposed at the end face 3e is directly connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 7A is electrically connected. The portion 13b is electrically connected to the external electrode 5 to which the internal electrode 7A is electrically connected. For example, if portion 13a constitutes a first portion, portion 13b constitutes a second portion.

[0071] The end 7Ae2 overlaps with the conductor 13 (portion 13a) when viewed from the second direction D2. In the positional relationship between the internal electrode 7A, the second electrode layer E2 to which the internal electrode 7A is not electrically connected and which is disposed on the main surface 3a, and the conductor 13 (portion 13a), the conductor 13 (portion 13a) is located between the internal electrode 7A and the second electrode layer E2. Therefore, in the above positional relationship, the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is not electrically connected and which is disposed on the main surface 3a do not face each other in the second direction D2.

[0072] In the multilayer capacitor C12, the conductor 13 is located between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2. The conductor 13 separates the second electrode layer E2 from the internal electrode 7A that is not electrically connected to the second electrode layer E2. Therefore, an electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2. Even if an electric field is generated between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2, the strength of the electric field is small. As a result, the multilayer capacitor C12 further suppresses the occurrence of migration.

[0073] In the multilayer capacitor C12, the conductor 13 includes a portion 13a and a portion 13b. The portion 13a faces in the second direction D2 the second electrode layer E2 to which the internal electrode 7A adjacent to the conductor 13 in the second direction D2 is not electrically connected. The portion 13b faces in the second direction D2 the second electrode layer E2 to which the internal electrode 7A is electrically connected. In the multilayer capacitor C11, the configuration on one end face 3e side from the center in the first direction D1 is unlikely to differ from the configuration on the other end face 3e side from the center in the first direction D1. Therefore, structural defects are unlikely to occur in the element body 3.

[0074] In the multilayer capacitor C12, the end 7Ae2 overlaps with the conductor 13 (portion 13a) when viewed from the second direction D2. Therefore, an electric field is even less likely to be generated between the second electrode layer E2 and the internal electrode 7A that is not electrically connected to the second electrode layer E2. As a result, the multilayer capacitor C11 further suppresses the occurrence of migration.

[0075] Next, the structure of a multilayer capacitor C13 according to a modified example of this embodiment will be described with reference to Fig. 12 and Fig. 13. Fig. 12 and Fig. 13 are diagrams showing the cross-sectional structure of the multilayer capacitor according to the modified example of this embodiment. The multilayer capacitor C13 according to this modified example is generally similar or the same as the multilayer capacitor C12 shown in Fig. 10 and Fig. 11, but this modified example differs from the multilayer capacitor C12 in the structure of the conductor 13. Below, the differences between the multilayer capacitor C12 and this modified example will be mainly described.

[0076] In the multilayer capacitor C13, the portion 13a and the portion 13b are integral. The conductor 13 has no end exposed on the surface of the element body 3. The conductor 13 is not connected to any of the external electrodes 5. In other words, the conductor 13 is not electrically connected to the second electrode layer E2 either.

[0077] Next, the structure of a multilayer capacitor C14 according to a modified example of this embodiment will be described with reference to Fig. 14 and Fig. 15. Fig. 14 and Fig. 15 are diagrams showing the cross-sectional structure of the multilayer capacitor according to the modified example of this embodiment. The multilayer capacitor C14 according to this modified example is generally similar or the same as the multilayer capacitor C1 described above, but this modified example differs from the multilayer capacitor C1 in terms of the structure of the internal electrodes 7, 9. Below, the differences between the multilayer capacitor C1 and this modified example will be mainly described.

[0078] The internal electrodes 7 and the internal electrodes 9 are arranged at different positions (layers) in the third direction D3. The internal electrodes 7 and the internal electrodes 9 are arranged alternately in the element body 3 so as to face each other at an interval in the third direction D3. In this case, the element body 3 is configured by stacking a plurality of dielectric layers in the third direction D3. In the multilayer capacitor C14, the stacking direction of the plurality of dielectric layers coincides with the third direction D3. In FIG. 14, for the sake of explanation, the internal electrodes 7 and 9 are intentionally illustrated as being shifted from each other in the second direction D2. The multiple internal electrodes 7 and the multiple internal electrodes 9 are arranged alternately in the third direction D3. The multiple internal electrodes 7, 9 are arranged in the element body 3 so as to be aligned in the third direction D3. Each of the internal electrodes 7, 9 is located in a plane approximately parallel to each side surface 3c. The internal electrodes 7 and 9 face each other in the third direction D3. The direction in which the internal electrodes 7 and 9 face each other (the third direction D3) is perpendicular to the direction parallel to each side surface 3c (the second direction D2 and the first direction D1).

[0079] As shown in Fig. 16, when the second electrode layer E2 and the internal electrodes 7 and 9 that are not electrically connected to the second electrode layer E2 are viewed from the third direction D3, the second electrode layer E2 and the internal electrodes 7 and 9 that are not electrically connected to the second electrode layer E2 do not overlap with each other. Fig. 16 is a diagram showing the configuration of the second electrode layer. In Fig. 16, for the purpose of explanation, the internal electrodes 7 and 9 are intentionally illustrated shifted from each other in the second direction D2. The length L41 of the internal electrode 9 is smaller than the length L51. The length L41 is the length of the internal electrode 9 in the first direction D1 from the reference plane PL1. The length L51 is the distance from the reference plane PL1 to the edge E2c of the second electrode layer E2 to which the internal electrode 9 is not electrically connected. e is the length in the first direction D1 up to The length L42 of the internal electrode 7 is smaller than the length L52. The length L42 is the length of the internal electrode 7 in the first direction D1 from the reference plane PL2. The length L52 is the distance from the reference plane PL2 to the edge E2c of the second electrode layer E2 to which the internal electrode 7 is not electrically connected. e The reference plane PL2 includes an end face 3e at which one end of the internal electrode 7 is exposed.

[0080] As shown in Fig. 17, when the second electrode layer E2 and the internal electrodes 7 and 9 that are not electrically connected to the second electrode layer E2 are viewed from the second direction D2, the second electrode layer E2 and the internal electrodes 7 and 9 that are not electrically connected to the second electrode layer E2 do not overlap with each other. Fig. 17 is a diagram showing the configuration of the second electrode layer. The length L41 of the internal electrode 9 is smaller than the length L61. The length L61 is the distance from the reference plane PL1 to the end edge E2a of the second electrode layer E2 to which the internal electrode 9 is not electrically connected. e is the length in the first direction D1 up to The length L42 of the internal electrode 7 is smaller than the length L62. The length L62 is the distance from the reference plane PL2 to the end edge E2a of the second electrode layer E2 to which the internal electrode 7 is not electrically connected. e is the length in the first direction D1 up to

[0081] The multilayer capacitor C14 suppresses the occurrence of migration, similar to the multilayer capacitor C1.

[0082] As shown in Fig. 18 and Fig. 19, the internal electrode 7 may have a region 8a whose length in the second direction D2 is substantially constant and a region 8b whose length in the second direction D2 gradually decreases. The internal electrode 9 may have a region 10a whose length in the second direction D2 is substantially constant and a region 10b whose length in the second direction D2 gradually decreases. Fig. 18 and Fig. 19 are diagrams showing the configuration of the second electrode layer. In Fig. 18, for the sake of explanation, the internal electrodes 7 and 9 are intentionally shown shifted from each other in the second direction D2.

[0083] The region 8b is an edge 8b adjacent to the main surface 3a. e The edge 8b e The edge 8b in the second direction D2 extends in a direction intersecting the first direction D1 and the second direction D2. e The distance between the edge 8b and the main surface 3a increases with increasing distance from the region 8a in the first direction D1. e In this case, the edge 8b may extend in a substantially arcuate shape. e may be curved so as to be convex toward the main surface 3a. The region 10b is an edge 10b adjacent to the main surface 3a. e The edge 10b e The edge 10b in the second direction D2 extends in a substantially straight line in a direction intersecting the first direction D1 and the second direction D2. eThe distance between the edge 10b and the main surface 3a increases with increasing distance from the region 10a in the first direction D1. e In this case, the edge 10b may extend in a substantially arcuate shape. e may be curved so as to be convex toward the main surface 3a.

[0084] 18, when the second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 are viewed in the third direction D3, the second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 do not overlap with each other. Although the length L41 is greater than the length L51, the length of the region 10a in the first direction D1 is smaller than the length L51. Although the length L42 is greater than the length L52, the length of the region 8a in the first direction D1 is smaller than the length L52.

[0085] As shown in Figure 19, when the second electrode layer E2 and the regions 8a, 10a of the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 are viewed from the second direction D2, the second electrode layer E2 and the regions 8a, 10a that are not electrically connected to the second electrode layer E2 do not overlap with each other. When the second electrode layer E2 and the regions 8b, 10b of the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 are viewed from the second direction D2, the second electrode layer E2 and the regions 8b, 10b that are not electrically connected to the second electrode layer E2 overlap each other. However, as described above, the edge 8b in the second direction D2 e The distance between the edge 10b and the main surface 3a increases as the distance in the first direction D1 increases away from the region 8a. e The distance between the main surface 3a and the region 10a increases with increasing distance from the region 10a in the first direction D1.

[0086] The modifications shown in FIGS. 18 and 19 suppress the occurrence of migration, similar to the multilayer capacitors C1 and C14. In the modification shown in Figures 18 and 19, the length L41 is greater than each of the lengths L51 and L61, and the length L42 is greater than each of the lengths L52 and L62. Therefore, the modification shown in Figures 18 and 19 can increase the capacitance.

[0087] Next, the structure of a multilayer capacitor C15 according to a modified example of this embodiment will be described with reference to Figs. 20 to 23. Fig. 20 is a perspective view of the multilayer capacitor according to the modified example of this embodiment. Figs. 21, 22, and 23 are views showing the cross-sectional structure of the multilayer capacitor according to this modified example. The multilayer capacitor C15 according to this modified example is generally similar to or the same as the multilayer capacitor C1 described above, but this modified example differs from the multilayer capacitor C1 in the structure of the external electrode 5 (second electrode layer E2). The following mainly describes the differences between the multilayer capacitor C1 and this modified example.

[0088] In the multilayer capacitor C15, the electrode portion 5b has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3.

[0089] The second electrode layer E2 of the electrode portion 5b is disposed on the first electrode layer E1 and on the main surface 3b. In the electrode portion 5b, the second electrode layer E2 is formed so as to cover the first electrode layer E1 and a part of the main surface 3b. In the electrode portion 5b, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the main surface 3b. The second electrode layer E2 of the electrode portion 5b is formed so as to cover the first electrode layer E1 of the electrode portion 5b. In the electrode portion 5b, the second electrode layer E2 indirectly covers the main surface 3b such that the first electrode layer E1 is located between the second electrode layer E2 and the main surface 3b. The second electrode layer E2 of the electrode portion 5b is located on the main surface 3b. Each second electrode layer E2 located on the same main surface 3b is disposed at the edge E2b. e On the same main surface 3b, the edge E2b of one of the second electrode layers E2 e is the edge E2b of the other second electrode layer E2. e and is opposed to The third electrode layer E3 of the electrode unit 5b is disposed on the second electrode layer E2. In the electrode unit 5b, the third electrode layer E3 covers the second electrode layer E2. In the electrode unit 5b, the third electrode layer E3 is in contact with the second electrode layer E2. That is, in the electrode unit 5b, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode unit 5b, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode unit 5b is located on the main surface 3b.

[0090] The second electrode layer E2 of the electrode portion 5c is formed so as to cover another part of the first electrode layer E1 and another part of the side surface 3c. In the electrode portion 5c, the second electrode layer E2 is in direct contact with the other part of the first electrode layer E1 and the other part of the side surface 3c. The second electrode layer E2 of the electrode portion 5c is formed so as to cover the other part of the first electrode layer E1 of the electrode portion 5c. The other part of the side surface 3c is, for example, a corner region of the side surface 3c near the main surface 3b and the end surface 3e. In the electrode portion 5c, the second electrode layer E2 indirectly covers the other part of the side surface 3c so that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3c. The first electrode layer E1 of the electrode portion 5c is covered by the second electrode layer E2 in the part and the other part, and is exposed from the second electrode layer E2 in the remaining part except for the part and the other part.

[0091] The electrode portion 5c has a plurality of regions 5c1, 5c2, and 5c3. In this embodiment, the electrode portion 5c has only three regions 5c1, 5c2, and 5c3. The region 5c3 is located closer to the main surface 3b than the region 5c1. The region 5c3 has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The region 5c3 is a region where the first electrode layer E1 is covered with the second electrode layer E2. In the second direction D2, the region 5c1 is located between the region 5c2 and the region 5c3.

[0092] The second electrode layer E2 of the electrode unit 5e is formed so as to cover another part of the first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 is in direct contact with the other part of the first electrode layer E1. The second electrode layer E2 of the electrode unit 5e is formed so as to cover the other part of the first electrode layer E1 of the electrode unit 5e. In the electrode unit 5e, the second electrode layer E2 indirectly covers the other part of the end face 3e so that the first electrode layer E1 is located between the second electrode layer E2 and the end face 3e. The other part of the end face 3e is, for example, a part of the end face 3e near the main face 3b. The first electrode layer E1 of the electrode unit 5e is covered by the second electrode layer E2 in the part and the other part, and is exposed from the second electrode layer E2 in the remaining part excluding the part and the other part.

[0093] The electrode portion 5e has a plurality of regions 5e1, 5e2, and 5e3. In this embodiment, the electrode portion 5e has only three regions 5e1, 5e2, and 5e3. The region 5e3 is located closer to the main surface 3b than the region 5e1. The region 5e3 has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The region 5e3 is a region where the first electrode layer E1 is covered with the second electrode layer E2. In the second direction D2, the region 5e1 is located between the region 5e2 and the region 5e3.

[0094] In the multilayer capacitor C15, the second electrode layer E2 continuously covers only a part of the main surface 3a, only a part of the end surface 3e, and only a part of each of the pair of side surfaces 3c, and also continuously covers only a part of the main surface 3b, only another part of the end surface 3e, and only another part of each of the pair of side surfaces 3c. That is, the second electrode layer E2 has a first part provided so as to continuously cover only a part of the main surface 3a, only a part of the end surface 3e, and only a part of each of the pair of side surfaces 3c, and a second part provided so as to continuously cover only a part of the main surface 3b, only another part of the end surface 3e, and only another part of each of the pair of side surfaces 3c. For example, when the first part of the second electrode layer E2 constitutes the first main surface side part, the second part of the second electrode layer E2 constitutes the second main surface side part. The part of the end surface 3e is a part of the end surface 3e closer to the main surface 3a. The part of each side surface 3c is a part of the side surface 3c closer to the main surface 3a. The other part of end face 3e is a part of end face 3e closer to principal face 3b. The other part of each side face 3c is a part of side face 3c closer to principal face 3b. The second electrode layer E2 covers one ridge line portion 3g in its entirety, only a part of ridge line portion 3i, and only a part of ridge line portion 3j, and covers the other ridge line portion 3g in its entirety, only another part of ridge line portion 3i, and only another part of ridge line portion 3j.

[0095] In a configuration in which the electrode portion 5e does not have the second electrode layer E2, the second electrode layer E2 continuously covers only a part of the main surface 3a and only a part of each of the pair of side surfaces 3c, and also continuously covers only a part of the main surface 3b and each other part of the pair of side surfaces 3c. That is, the second electrode layer E2 has a part that is provided so as to continuously cover only a part of the main surface 3a and only a part of each of the pair of side surfaces 3c, and a part that is provided so as to continuously cover only a part of the main surface 3b and each other part of the pair of side surfaces 3c. For example, when the part that is provided so as to continuously cover only a part of the main surface 3a and only a part of each of the pair of side surfaces 3c constitutes the first main surface side portion, the part that is provided so as to continuously cover only a part of the main surface 3b and each other part of the pair of side surfaces 3c constitutes the second main surface side portion. The other parts of the main surface 3b, the other parts of the end surface 3e, and the other parts of each of the side surfaces 3c that are continuously covered by the second electrode layer E2 are included in the outer layer portion 4c.

[0096] As shown in Figures 21 to 23, the multilayer capacitor C15 includes a conductor 11. In Figures 22 and 23, for the sake of explanation, the internal electrodes 7, 9 (internal electrodes 7A, 9A) and the conductors 11, 13 are intentionally illustrated shifted from each other in the third direction D3. The conductor 11 is located in the same layer as the internal electrode 7A and is spaced apart from the internal electrode 7A. The conductor 11 has one end exposed at the corresponding end face 3e. One end of the conductor 13 is exposed at the end face 3e where one end of the internal electrode 9 is exposed. One end of the conductor 11 is entirely covered by the corresponding electrode portion 5e. The conductor 11 is directly connected to the corresponding electrode portion 5e. The conductor 11 is electrically connected to the corresponding external electrode 5. In this embodiment, the conductor 11 is electrically connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 9 is electrically connected. That is, the conductor 11 is electrically connected to the external electrode 5 to which the internal electrode 7 is not electrically connected. The conductor 11 constitutes a dummy conductor that is unlikely to contribute to the formation of capacitance.

[0097] As shown in FIG. 21, the length L12 of the internal electrode 7A in the first direction D1 from the reference plane PL2 is a distance L12 from the reference plane PL2 to the edge E2b of the second electrode layer E2 electrically connected to the internal electrode 7A. e Therefore, when the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is electrically connected are viewed in the second direction D2, the end 7Ae2 is exposed from the second electrode layer E2 to which the internal electrode 7A is electrically connected. The length L12 is a distance from the reference plane PL2 to the end edge E2b of the second electrode layer E2 to which the internal electrode 7A is not electrically connected. e The length L32 in the first direction D1 from the internal electrode 7A to the second electrode layer E2 to which the internal electrode 7A is not electrically connected is smaller than the length L32 in the first direction D1 from the internal electrode 7A to the second electrode layer E2 to which the internal electrode 7A is not electrically connected. Therefore, when the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is not electrically connected are viewed from the second direction D2, the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is not electrically connected do not overlap each other. The reference plane PL2 includes the end surface 3e where the end 7Ae1 of the internal electrode 7A is exposed. For example, when the length L12 constitutes the fourth length, the length L22 constitutes the fifth length, and the length L32 constitutes the sixth length.

[0098] Length L11 and length L12 may be the same or different. Length L21 and length L22 may be the same or different. Length L31 and length L32 may be the same or different. Length L41 and length L42 may be the same or different.

[0099] As shown in Fig. 24, when the second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 are viewed from the third direction D3, the second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 do not overlap with each other. The second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 do not face each other in the third direction D3. Fig. 24 is a diagram showing the configuration of the second electrode layer. As shown in Fig. 25, when the second electrode layer E2 and the internal electrodes 7 and 9 that are not electrically connected to the second electrode layer E2 are viewed from the second direction D2 (a direction perpendicular to the main surface 3b), the second electrode layer E2 and the internal electrodes 7 and 9 that are not electrically connected to the second electrode layer E2 overlap each other. Fig. 25 is a diagram showing the configuration of the second electrode layer. Although not shown in the figure, when the second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 are viewed from the second direction D2 (a direction perpendicular to the main surface 3a), the second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 overlap each other, as shown in Figure 6.

[0100] The multilayer capacitor C15 also suppresses the occurrence of migration, similar to the multilayer capacitor C1.

[0101] In the multilayer capacitor C15, the length L12 is longer than the length L22. Therefore, the internal electrode 9 adjacent to the internal electrode 7A in the second direction D2 and the second electrode layer E2 adjacent to the internal electrode 7A in the second direction D2 are not electrically connected to each other, but are unlikely to face each other in the second direction D2. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 9 that are not electrically connected to each other. The lengths L11 and L12 are shorter than the lengths L31 and L32. Therefore, the internal electrode 7A is unlikely to face, in the second direction D2, the second electrode layer E2 included in the electrode portion 5b to which the internal electrode 7A is not electrically connected. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 7A, which are not electrically connected to each other. As a result, the multilayer capacitor C15 further suppresses the occurrence of migration.

[0102] The multilayer capacitor C15 includes a conductor 11. The conductor 11 is electrically connected to the external electrodes 5 to which the internal electrodes 7A are not electrically connected. In the multilayer capacitor C15, the element body 3 makes it even more difficult for structural defects to occur.

[0103] Next, the structure of a multilayer capacitor C16 according to a modified example of this embodiment will be described with reference to Fig. 26 and Fig. 27. Fig. 26 and Fig. 27 are diagrams showing the cross-sectional structure of the multilayer capacitor according to the modified example of this embodiment. The multilayer capacitor C16 according to this modified example is generally similar to or the same as the multilayer capacitor C15 described above, but this modified example differs from the multilayer capacitor C15 in terms of the structure of the internal electrodes 7, 9. The following mainly describes the differences between the multilayer capacitor C15 and this modified example.

[0104] In the multilayer capacitor C16, the internal electrodes 7 and the internal electrodes 9 are arranged at different positions (layers) in the third direction D3. The internal electrodes 7 and the internal electrodes 9 are arranged alternately in the element body 3 so as to face each other at an interval in the third direction D3. In this case, the element body 3 is configured by stacking multiple dielectric layers in the third direction D3. In the multilayer capacitor C16, the stacking direction of the multiple dielectric layers coincides with the third direction D3. The multiple internal electrodes 7 and the multiple internal electrodes 9 are arranged alternately in the third direction D3. The multiple internal electrodes 7, 9 are arranged in the element body 3 so as to be aligned in the third direction D3. Each of the internal electrodes 7, 9 is located in a plane approximately parallel to each side surface 3c. The internal electrodes 7 and 9 face each other in the third direction D3. The direction in which the internal electrodes 7 and 9 face each other (the third direction D3) is perpendicular to the direction parallel to each side surface 3c (the second direction D2 and the first direction D1).

[0105] As shown in Fig. 28, when the second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 are viewed from the third direction D3, the second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 do not overlap with each other. The second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 do not face each other in the third direction D3. Fig. 28 is a diagram showing the configuration of the second electrode layer. In Fig. 28, for the purpose of explanation, the internal electrodes 7, 9 are intentionally illustrated shifted from each other in the second direction D2. The length L41 of the internal electrode 9 is smaller than the length L53. The length L53 is the distance from the reference plane PL1 to the end edge E2c of the second electrode layer E2 to which the internal electrode 9 is not electrically connected. e is the length in the first direction D1 up to The length L42 of the internal electrode 7 is smaller than the length L54. The length L54 is the distance from the reference plane PL2 to the end edge E2c of the second electrode layer E2 to which the internal electrode 7 is not electrically connected. e is the length in the first direction D1 up to

[0106] As shown in Fig. 29, when the second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 are viewed from the second direction D2, the second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 do not overlap with each other. The second electrode layer E2 and the internal electrodes 7, 9 that are not electrically connected to the second electrode layer E2 do not face each other in the second direction. Fig. 29 is a diagram showing the configuration of the second electrode layer. The length L41 of the internal electrode 9 is smaller than the length L63. The length L63 is the distance from the reference plane PL1 to the end edge E2a of the second electrode layer E2 to which the internal electrode 9 is not electrically connected. e is the length in the first direction D1 up to The length L42 of the internal electrode 7 is smaller than the length L64. The length L64 is the distance from the reference plane PL2 to the end edge E2a of the second electrode layer E2 to which the internal electrode 7 is not electrically connected. e is the length in the first direction D1 up to

[0107] The multilayer capacitor C16 suppresses the occurrence of migration, similar to the multilayer capacitors C1 and C15.

[0108] Next, the configuration of a multilayer capacitor C17 according to a modified example of this embodiment will be described with reference to Fig. 30. Fig. 30 is a diagram showing a cross-sectional configuration of the multilayer capacitor according to the modified example of this embodiment. The multilayer capacitor C17 according to this modified example is generally similar to or the same as the multilayer capacitor C15 described above, but this modified example differs from the multilayer capacitor C15 in terms of the configuration of the element body 3. The following mainly describes the differences between the multilayer capacitor C15 and this modified example.

[0109] In the multilayer capacitor C17, the dielectric constant of each of the outer layer portions 4b, 4c is lower than that of the inner layer portion 4a. The outer layer portion 4c is made of, for example, a CaZrO3-based or SrTiO3-based dielectric ceramic, similar to the outer layer portion 4b. The outer layer portion 4c may be made of, for example, a BaTiO3-based dielectric ceramic, similar to the outer layer portion 4b. In this case, too, the outer layer portion 4c may contain an additive that reduces the dielectric constant of the outer layer portion 4c below that of the inner layer portion 4a. As described above, in the multilayer capacitor C17, the dielectric constant of each of the outer layer parts 4b, 4c is lower than that of the inner layer part 4a. In the multilayer capacitor C17, current is less likely to flow through the surfaces of the outer layer parts 4b, 4c compared to a configuration in which the dielectric constant of each of the outer layer parts 4b, 4c is equal to that of the inner layer part 4a. Therefore, the multilayer capacitor C17 suppresses the occurrence of leakage current on the surfaces of the outer layer parts 4b, 4c, and further suppresses the occurrence of migration. In the multilayer capacitor C17, the dielectric constant of the inner layer portion 4a is higher than the dielectric constant of each of the outer layer portions 4b and 4c, and therefore the capacitance of the multilayer capacitor C17 is less likely to decrease. As a result, the multilayer capacitor C17 further suppresses the occurrence of migration while ensuring the capacitance.

[0110] Next, the configuration of a multilayer capacitor C18 according to a modified example of this embodiment will be described with reference to Fig. 31. Fig. 31 is a diagram showing a cross-sectional configuration of a multilayer capacitor according to a modified example of this embodiment. The multilayer capacitor C18 is similar to or the same as the above-mentioned multilayer capacitor C14, but the multilayer capacitor C18 differs from the multilayer capacitor C14 in terms of the configuration of each of the internal electrodes 7, 9. The following mainly describes the differences between the multilayer capacitor C14 and this modified example. In Fig. 31, for the sake of explanation, the internal electrodes 7, 9 are intentionally shown shifted from each other at least in the second direction D2.

[0111] Each internal electrode 7 has a main electrode portion 8c and a connection portion 8d. Each internal electrode 9 has a main electrode portion 10c and a connection portion 10d. The multiple internal electrodes 7 and the multiple internal electrodes 9 are alternately arranged in the third direction D3. The internal electrodes 7 and the internal electrodes 9 face each other in the third direction D3. The main electrode portion 8c and the main electrode portion 10c face each other in the third direction D3. The multilayer capacitor C18 exhibits capacitance between the main electrode portion 8c and the main electrode portion 10c. The main electrode portion 8c and the connection portion 8d are integral. The main electrode portion 10c and the connection portion 10d are integral.

[0112] The connection portion 8d connects the main electrode portion 8c to a corresponding one of the plurality of external electrodes 5. The connection portion 8d is directly connected to the corresponding external electrode 5 (electrode portion 5e). The connection portion 8d electrically connects the main electrode portion 8c to the corresponding external electrode 5. The connection portion 8d has one end connected to the main electrode portion 8c and the other end exposed to the corresponding one of the pair of end faces 3e. The other end of the connection portion 8d is directly connected to the electrode portion 5e. In the multilayer capacitor C18, the other end of the connection portion 8d is directly connected to the region 5e1. The width of the connection portion 8d in the second direction D2 is smaller than the width of the main electrode portion 8c in the second direction D2. The connection portion 8d is located closer to the main surface 3b as viewed from the third direction D3. The distance between the connection portion 8d and the main surface 3b in the third direction D3 is smaller than the distance between the connection portion 8d and the main surface 3a in the third direction D3. When the connection portion 8d and the second electrode layer E2 are viewed from the third direction D3, the connection portion 8d and the second electrode layer E2 do not overlap with each other.

[0113] The connection portion 10d connects the main electrode portion 10c to a corresponding one of the plurality of external electrodes 5. The connection portion 10d is directly connected to the corresponding external electrode 5 (electrode portion 5e). The connection portion 10d electrically connects the main electrode portion 10c to the corresponding external electrode 5. The connection portion 10d has one end connected to the main electrode portion 10c and the other end exposed to the corresponding one of the pair of end faces 3e. The other end of the connection portion 10d is directly connected to the electrode portion 5e. In the multilayer capacitor C18, the other end of the connection portion 10d is directly connected to the region 5e1. The width of the connection portion 10d in the second direction D2 is smaller than the width of the main electrode portion 10c in the second direction D2. The connection portion 10d is located closer to the main surface 3b when viewed from the third direction D3. The distance between connection portion 10d and principal surface 3b in third direction D3 is smaller than the distance between connection portion 10d and principal surface 3a in third direction D3. When connection portion 10d and second electrode layer E2 are viewed from third direction D3, connection portion 10d and second electrode layer E2 do not overlap each other.

[0114] The multilayer capacitor C18 suppresses the occurrence of migration, similar to the multilayer capacitor C14.

[0115] Next, the configuration of a multilayer capacitor C19 according to a modified example of this embodiment will be described with reference to Fig. 32. Fig. 32 is a diagram showing a cross-sectional configuration of a multilayer capacitor according to a modified example of this embodiment. The multilayer capacitor C19 is similar to or the same as the multilayer capacitor C18 described above, but the multilayer capacitor C19 differs from the multilayer capacitor C18 in terms of the configuration of each of the internal electrodes 7, 9. The following mainly describes the differences between the multilayer capacitor C18 and this modified example. In Fig. 32, for the sake of explanation, the internal electrodes 7, 9 are intentionally shown shifted from each other at least in the second direction D2.

[0116] Each internal electrode 7 has a main electrode portion 8c, a connection portion 8d, and an auxiliary electrode portion 8e. Each internal electrode 9 has a main electrode portion 10c, a connection portion 10d, and an auxiliary electrode portion 10e. The auxiliary electrode portion 8e and a part of the connection portion 10d face each other in the third direction D3. The part of the connection portion 10d is a part of the connection portion 10d closer to the main electrode portion 10c. The auxiliary electrode portion 10e and a part of the connection portion 8d face each other in the third direction D3. The part of the connection portion 8d is a part of the connection portion 8d closer to the main electrode portion 8c. The multilayer capacitor C19 generates a capacitance between the main electrode portion 8c and the main electrode portion 10c, and generates a capacitance between the auxiliary electrode portion 8e and the connection portion 10d and between the auxiliary electrode portion 10e and the connection portion 8d. The main electrode portion 8c, the connection portion 8d, and the auxiliary electrode portion 8e are integral with each other. The main electrode portion 10c, the connection portion 10d, and the auxiliary electrode portion 10e are integral. When the auxiliary electrode portion 8e and the second electrode layer E2 are viewed from the third direction D3, the auxiliary electrode portion 8e and the second electrode layer E2 do not overlap with each other. When the auxiliary electrode portion 10e and the second electrode layer E2 are viewed from the third direction D3, the auxiliary electrode portion 10e and the second electrode layer E2 do not overlap with each other. Since each internal electrode 7 has the auxiliary electrode portion 8e and each internal electrode 9 has the auxiliary electrode portion 10e, the multilayer capacitor C19 can increase the capacitance.

[0117] The multilayer capacitor C19 suppresses the occurrence of migration, similar to the multilayer capacitors C14 and C18.

[0118] Next, referring to FIG. 33, a multilayer capacitor C1 according to a modified example of this embodiment will be described. 10 33 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of this embodiment. 10 Now, let us consider a multilayer capacitor C1, which is similar or the same as the multilayer capacitor C16 described above. 10 This modification differs from the multilayer capacitor C16 in the configuration of the internal electrodes 7, 9. The following mainly describes the differences between the multilayer capacitor C16 and this modification. In Fig. 33, for the sake of explanation, the internal electrodes 7, 9 are intentionally illustrated as being shifted from each other at least in the second direction D2.

[0119] Each internal electrode 7 has a main electrode portion 8c and a connection portion 8d. Each internal electrode 9 has a main electrode portion 10c and a connection portion 10d. The multiple internal electrodes 7 and the multiple internal electrodes 9 are alternately arranged in the third direction D3. The internal electrodes 7 and the internal electrodes 9 face each other in the third direction D3. The main electrode portion 8c and the main electrode portion 10c face each other in the third direction D3. Multilayer capacitor C1 10 A capacitance is generated between the main electrode portion 8c and the main electrode portion 10c. The main electrode portion 8c and the connection portion 8d are integral with each other. The main electrode portion 10c and the connection portion 10d are integral with each other.

[0120] The connection portion 8d connects the main electrode portion 8c to a corresponding one of the plurality of external electrodes 5. The connection portion 8d is directly connected to the corresponding external electrode 5 (electrode portion 5e). The connection portion 8d electrically connects the main electrode portion 8c to the corresponding external electrode 5. The connection portion 8d has one end connected to the main electrode portion 8c and the other end exposed to the corresponding one of the pair of end faces 3e. The other end of the connection portion 8d is directly connected to the electrode portion 5e. In the multilayer capacitor C18, the other end of the connection portion 8d is directly connected to the region 5e1. The width of the connection portion 8d in the second direction D2 is smaller than the width of the main electrode portion 8c in the second direction D2. The distance between the connection portion 8d and the main surface 3b in the third direction D3 is equal to the distance between the connection portion 8d and the main surface 3a in the third direction D3. When the connection portion 8d and the second electrode layer E2 are viewed from the third direction D3, the connection portion 8d and the second electrode layer E2 do not overlap with each other.

[0121] The connection portion 10d connects the main electrode portion 10c to a corresponding one of the plurality of external electrodes 5. The connection portion 10d is directly connected to the corresponding external electrode 5 (electrode portion 5e). The connection portion 10d electrically connects the main electrode portion 10c to the corresponding external electrode 5. The connection portion 10d has one end connected to the main electrode portion 10c and the other end exposed to the corresponding one of the pair of end faces 3e. The other end of the connection portion 10d is directly connected to the electrode portion 5e. In the multilayer capacitor C18, the other end of the connection portion 10d is directly connected to the region 5e1. The width of the connection portion 10d in the second direction D2 is smaller than the width of the main electrode portion 10c in the second direction D2. The distance between the connection portion 10d and the main surface 3b in the third direction D3 is equal to the distance between the connection portion 10d and the main surface 3a in the third direction D3. When the connection portion 10d and the second electrode layer E2 are viewed from the third direction D3, the connection portion 10d and the second electrode layer E2 do not overlap each other.

[0122] Multilayer capacitor C1 10 Similar to the multilayer capacitor C16, this suppresses the occurrence of migration.

[0123] Next, referring to FIG. 34, a multilayer capacitor C1 according to a modified example of this embodiment will be described. 11 34 is a diagram showing a cross-sectional structure of a multilayer capacitor according to a modified example of the present embodiment. 11 Now, the multilayer capacitor C1 10 Similar or the same as, but the multilayer capacitor C1 11 Regarding the configuration of each of the internal electrodes 7 and 9, the multilayer capacitor C1 10 Hereinafter, the multilayer capacitor C1 10 The following mainly describes the differences between this modified example and the modified example 2. In Fig. 34, for the sake of explanation, the internal electrodes 7 and 9 are intentionally illustrated as being shifted from each other at least in the second direction D2.

[0124] Each internal electrode 7 has a main electrode portion 8c, a connection portion 8d, and an auxiliary electrode portion 8e. Each internal electrode 9 has a main electrode portion 10c, a connection portion 10d, and an auxiliary electrode portion 10e. The auxiliary electrode portion 8e and a portion of the connection portion 10d face each other in the third direction D3. The portion of the connection portion 10d is a portion of the connection portion 10d closer to the main electrode portion 10c. The auxiliary electrode portion 10e and a portion of the connection portion 8d face each other in the third direction D3. The portion of the connection portion 8d is a portion of the connection portion 8d closer to the main electrode portion 8c. Multilayer capacitor C1 11 In the above, capacitance is generated between the main electrode portion 8c and the main electrode portion 10c, and capacitance is generated between the auxiliary electrode portion 8e and the connection portion 10d, and between the auxiliary electrode portion 10e and the connection portion 8d. The main electrode portion 8c, the connection portion 8d, and the auxiliary electrode portion 8e are integral. The main electrode portion 10c, the connection portion 10d, and the auxiliary electrode portion 10e are integral. When the auxiliary electrode portion 8e and the second electrode layer E2 are viewed from the third direction D3, the auxiliary electrode portion 8e and the second electrode layer E2 do not overlap with each other. When the auxiliary electrode portion 10e and the second electrode layer E2 are viewed from the third direction D3, the auxiliary electrode portion 10e and the second electrode layer E2 do not overlap with each other. Since each internal electrode 7 has an auxiliary electrode portion 8e and each internal electrode 9 has an auxiliary electrode portion 10e, the multilayer capacitor C1 11 may increase the capacitance.

[0125] Multilayer capacitor C1 11 are multilayer capacitors C16 and C1 10 Similarly, the occurrence of migration is suppressed.

[0126] Although the embodiment of the present invention has been described above, the present invention is not necessarily limited to the above-described embodiment, and various modifications are possible without departing from the gist of the present invention.

[0127] The multilayer capacitor C1 does not necessarily have to include the conductor 13. When the multilayer capacitor C1 includes the conductor 13, structural defects are less likely to occur in the element body 3, as described above. The multilayer capacitor C15 does not necessarily have to include the conductors 11 and 13. When the multilayer capacitor C15 includes the conductors 11 and 13, structural defects are even less likely to occur in the element body 3, as described above. In the multilayer capacitor C15, the conductor 13 may include a portion 13a and a portion 13b, similar to the multilayer capacitors C12 and C13. In the multilayer capacitor C15, the conductor 11 may include two portions, similar to the conductor 13 in the multilayer capacitors C12 and C13. In this case, one portion faces in the second direction D2 the second electrode layer E2 to which the internal electrode 9A is not electrically connected and which is disposed on the principal surface 3b. The other portion faces in the second direction D2 the second electrode layer E2 to which the internal electrode 9A is electrically connected and which is disposed on the principal surface 3b. In the electronic component device, instead of the multilayer capacitor C1, each of the multilayer capacitors C11 to C1 11 The device may include:

[0128] In this embodiment and the modified example, the electronic components are multilayer capacitors C1, C11 to C1 11 However, the applicable electronic components are not limited to the multilayer capacitor. The applicable electronic components may be, for example, multilayer electronic components such as multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, or multilayer composite components, or electronic components other than multilayer electronic components. [Explanation of symbols]

[0129] 3...Element body, 3a, 3b...Main surface, 3c...Side surface, 3e...End surface, 4a...Inner layer part, 4b,4c...Outer layer part, 5...External electrode, 7,7A,9,9A...Inner electrode, 11,13...Conductor, C11, C11~C1 11 ...Multilayer capacitor, D1...first direction, D2...second direction, D3...third direction, E1...first electrode layer, E2...second electrode layer, E3...third electrode layer.

Claims

1. an element body having a rectangular parallelepiped shape, the element body having a pair of end faces facing each other in a first direction, first and second main surfaces facing each other in a second direction, and a pair of side faces facing each other in a third direction; a plurality of external electrodes each arranged on both ends of the element body in the first direction and each having a conductive resin layer; a plurality of internal electrodes arranged side by side within the element body so as to face each other in the second direction and electrically connected to corresponding ones of the plurality of external electrodes, the conductive resin layer has a first main surface side portion provided so as to continuously cover only a portion of the first main surface, only a portion of a corresponding one of the pair of end surfaces that is close to the first main surface, and only a portion of each of the pair of side surfaces that is close to the first main surface; the element body has an inner layer portion in which the plurality of internal electrodes are arranged, and a pair of outer layer portions sandwiching the inner layer portion in the second direction, the portion of the first main surface, the portion of the corresponding end surface close to the first main surface, and the portions of the pair of side surfaces close to the first main surface are included only in the outer layer portion including the first main surface, an electronic component, wherein when the first main surface side portion and the internal electrode that is not electrically connected to the first main surface side portion are viewed from the third direction, the first main surface side portion and the internal electrode that is not electrically connected to the first main surface side portion do not overlap each other.

2. Among the two first main surface side portions located on the first main surface, one of the first main surface side portions has an edge facing the other first main surface side portion, the internal electrodes are arranged in the body so as to face each other in the second direction, Among the plurality of internal electrodes, an outermost internal electrode located closest to the first main surface is adjacent to the first main surface side portion to which the outermost internal electrode is electrically connected in the second direction, 2. The electronic component according to claim 1, wherein a plane including the end face to which the outermost internal electrode is exposed is taken as a reference plane, and a first length of the outermost internal electrode in the first direction from the reference plane is greater than a second length in the first direction from the reference plane to the edge of the first main surface side portion to which the outermost internal electrode is electrically connected, and is smaller than a third length from the reference plane to the edge of the first main surface side portion to which the outermost internal electrode is not electrically connected.

3. a dummy conductor located in the same layer as the outermost internal electrode and spaced apart from the outermost internal electrode; 3. The electronic component according to claim 2, wherein the dummy conductor is electrically connected to the external electrode to which the outermost internal electrode located in the same layer as the dummy conductor is not electrically connected.

4. a dummy conductor adjacent to the first main surface in the second direction and disposed in the inner layer portion, The electronic component according to claim 1 , wherein the dummy conductor faces in the second direction a portion of the first main surface that is not electrically connected to the internal electrode adjacent to the dummy conductor in the second direction.

5. The electronic component according to any one of claims 1 to 4, wherein the conductive resin layer does not cover the second main surface.

6. An electronic component described in any one of claims 1 to 5, wherein the thickness of the outer layer portion including the second main surface is smaller than the thickness of the outer layer portion including the first main surface.

7. An electronic component described in any one of claims 1 to 5, wherein the dielectric constant of the outer layer portion including the first main surface is lower than the dielectric constant of the inner layer portion.

8. the conductive resin layer further has a second main surface side portion that is spaced apart from the first main surface side portion and is provided so as to continuously cover only a portion of the second main surface, only a portion of a corresponding one of the pair of end surfaces that is close to the second main surface, and only a portion of each of the pair of side surfaces that is close to the second main surface, the portion of the second main surface, the portion of the corresponding end surface close to the second main surface, and the portions of the pair of side surfaces close to the second main surface are included only in the outer layer portion including the second main surface, 2. The electronic component of claim 1, wherein when the second main surface side portion and the internal electrode that is not electrically connected to the second main surface side portion are viewed from the third direction, the second main surface side portion and the internal electrode that is not electrically connected to the second main surface side portion do not overlap with each other.

9. Among the two second main surface side portions located on the second main surface, one of the second main surface side portions has an edge facing the other of the second main surface side portions, the internal electrodes are arranged in the body so as to face each other in the second direction, Among the plurality of internal electrodes, an outermost internal electrode located closest to the second main surface is adjacent to the second main surface side portion to which the outermost internal electrode is electrically connected in the second direction, 9. The electronic component according to claim 8, wherein a plane including the end face to which the outermost internal electrode is exposed is taken as a reference plane, and a fourth length of the outermost internal electrode from the reference plane in the first direction is greater than a fifth length in the first direction from the reference plane to the edge of the second main surface side portion to which the outermost internal electrode is electrically connected, and is smaller than a sixth length from the reference plane to the edge of the second main surface side portion to which the outermost internal electrode is not electrically connected.

10. a dummy conductor located in the same layer as the outermost internal electrode and spaced apart from the outermost internal electrode; 10. The electronic component according to claim 9, wherein the dummy conductor is electrically connected to the external electrode to which the outermost internal electrode located in the same layer as the dummy conductor is not electrically connected.

11. a dummy conductor adjacent to the second main surface in the second direction and disposed in the inner layer portion, The electronic component according to claim 8 , wherein the dummy conductor faces in the second direction a portion of the second main surface that is not electrically connected to the internal electrode adjacent to the dummy conductor in the second direction.

12. An electronic component described in any one of claims 8 to 11, wherein the dielectric constant of the outer layer portion including the second main surface is lower than the dielectric constant of the inner layer portion.

13. A rectangular parallelepiped body having a pair of end faces opposing each other in a first direction, first and second main surfaces opposing each other in a second direction, and a pair of side surfaces opposing each other in a third direction; a plurality of external electrodes each arranged on both ends of the element body in the first direction and each having a conductive resin layer; a plurality of internal electrodes arranged side by side within the element body so as to face each other in the third direction and electrically connected to corresponding ones of the plurality of external electrodes, the conductive resin layer has a first main surface side portion provided so as to continuously cover only a portion of the first main surface, only a portion of a corresponding one of the pair of end surfaces that is close to the first main surface, and only a portion of each of the pair of side surfaces that is close to the first main surface; Each of the plurality of internal electrodes has a first region having a substantially constant length in the second direction and a second region having a gradually decreasing length in the second direction, and is exposed at a corresponding one of the pair of end faces, the second region has an edge adjacent to the first main surface, and a distance between the edge and the first main surface increases with increasing distance from the first region; an electronic component, wherein when the first main surface side portion and the internal electrode that is not electrically connected to the first main surface side portion are viewed from the third direction, the first main surface side portion and the internal electrode that is not electrically connected to the first main surface side portion do not overlap each other.

14. In the two first main surface side portions located on the first main surface, one of the first main surface side portions has an edge facing the other first main surface side portion, a surface including the corresponding end surface is defined as a reference surface, and a length of the internal electrode exposed on the corresponding end surface in the first direction from the reference surface is greater than a length in the first direction from the reference surface to an edge of the first main surface portion to which the internal electrode exposed on the corresponding end surface is not electrically connected, The electronic component described in claim 13, wherein a length in the first direction from the reference surface of the first region of the internal electrode exposed to the corresponding end surface is smaller than a length in the first direction from the reference surface to the edge of the first main surface side portion to which the internal electrode exposed to the corresponding end surface is not electrically connected.

15. An electronic component as described in claim 13 or 14, wherein the edge of the second region extends in an approximately straight line in a direction intersecting the first direction and the second direction when viewed from the third direction.

16. A rectangular parallelepiped body having a pair of end faces opposing each other in a first direction, first and second main surfaces opposing each other in a second direction, and a pair of side surfaces opposing each other in a third direction; a plurality of external electrodes each arranged on both ends of the element body in the first direction and each having a conductive resin layer; a plurality of internal electrodes arranged side by side within the element body so as to face each other in the third direction and electrically connected to corresponding ones of the plurality of external electrodes, the conductive resin layer has a first main surface side portion provided so as to continuously cover only a portion of the first main surface, only a portion of a corresponding one of the pair of end surfaces that is close to the first main surface, and only a portion of each of the pair of side surfaces that is close to the first main surface, and does not cover the second main surface; each of the plurality of internal electrodes has a main electrode portion facing each other in the third direction and a connection portion connecting a corresponding external electrode among the plurality of external electrodes to the main electrode portion; a width of the connection portion in the second direction is smaller than a width of the main electrode portion in the second direction; When viewed from the third direction, the connection portion is located closer to the second main surface, an electronic component, wherein when the first main surface side portion and the internal electrode that is not electrically connected to the first main surface side portion are viewed from the third direction, the first main surface side portion and the internal electrode that is not electrically connected to the first main surface side portion do not overlap each other.

17. The electronic component according to claim 16 , wherein each of the plurality of internal electrodes further includes an auxiliary electrode portion that overlaps in the third direction with the connection portion of the internal electrode adjacent in the third direction.

18. The electronic component according to any one of claims 1 to 17, wherein the conductive resin layer contains a plurality of silver particles.

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