Optical Transmission Equipment

Abstract

To provide an optical transmission device capable of suppressing upsizing of a packaging board following an increase in optical modules.SOLUTION: An optical transmission device includes: a wiring board having a first surface; a switch integrated circuit chip provided on the first surface; a first connector connected to the switch integrated circuit chip through the wiring board; a second connector that is provided between the switch integrated circuit chip and the first connector and is connected to the switch integrated circuit chip through the wiring board; a first optical module electrically connected to the first connector; a second optical module electrically connected to the second connector; and a cooling plate having a first cooling part for cooling the switch integrated circuit chip and a second cooling part for cooling the first and second optical modules. The second cooling part has a second surface and a third surface that approach the first surface as they approach the switch integrated circuit chip, the second surface is closer to the first surface than the third surface, the first optical module is provided on the second surface, and the second optical module is provided on the third surface.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to an optical transmission device. [Background technology]

[0002] One type of optical transmission device is Co-Packaged Optics (CPO), which has a switch integrated circuit chip (switch IC) and an optical module mounted on a package substrate. In CPO, multiple optical modules are arranged along the four sides of a rectangular package substrate. With CPO, the wiring between the switch IC and the optical module is short, which reduces power consumption. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-49691 [Patent Document 2] Japanese Patent Application Laid-Open No. 2011-257660 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in a conventional CPO configuration, when multiple optical modules are arranged along each side of the package substrate, the package substrate inevitably becomes larger. Furthermore, the components for cooling the switch IC and optical modules also become larger. Furthermore, the distance between the switch IC and the optical modules depends on the size and number of optical modules mounted on the package substrate. Therefore, when multiple optical modules of a certain size are arranged along each side of the package substrate, the wiring between the switch IC and the optical modules becomes longer than the distance between each side of the package substrate and the switch IC.

[0005] An object of the present disclosure is to provide an optical transmission device that can prevent an increase in the size of a package substrate due to an increase in the number of optical modules. [Means for solving the problem]

[0006] According to one embodiment of the present disclosure, there is provided an optical transmission device comprising: a wiring board having a first surface; a switch integrated circuit chip provided on the first surface; a first connector provided on the first surface and connected to the switch integrated circuit chip through the wiring board; a second connector provided on the first surface between the switch integrated circuit chip and the first connector and connected to the switch integrated circuit chip through the wiring board; a first optical module electrically connected to the first connector; a second optical module electrically connected to the second connector; and a cooling plate having a first cooling unit that cools the switch integrated circuit chip and a second cooling unit that cools the first optical module and the second optical module, wherein the second cooling unit has second and third surfaces inclined so as to approach the first surface as it approaches the switch integrated circuit chip in a cross-sectional view parallel to the first surface, the second surface being closer to the first surface than the third surface, the first optical module being provided on the second surface, and the second optical module being provided on the third surface. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to prevent the increase in size of the package substrate due to an increase in the number of optical modules. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a top view showing an optical transmission device according to a first embodiment. [Figure 2] FIG. 1 is an exploded top view showing an optical transmission device according to a first embodiment. [Figure 3] 1 is a cross-sectional view showing an optical transmission device according to a first embodiment. [Figure 4] FIG. 2 is a top view showing the package substrate in the first embodiment. [Figure 5] FIG. 2 is a top view showing the cooling plate in the first embodiment. [Figure 6] FIG. 1 is a cross-sectional view showing an optical module. [Figure 7] FIG. 4 is a top view showing a third connector in the first embodiment. [Figure 8] FIG. 4 is a bottom view showing the third connector in the first embodiment. [Figure 9] FIG. 3 is a cross-sectional view showing a third connector in the first embodiment. [Figure 10] FIG. 10 is a top view showing the fourth connector in the first embodiment. [Figure 11] FIG. 10 is a bottom view showing the fourth connector in the first embodiment. [Figure 12] FIG. 4 is a cross-sectional view showing a fourth connector in the first embodiment. [Figure 13] 1A to 1C are cross-sectional views (part 1) illustrating a method for manufacturing the optical transmission device according to the first embodiment. [Figure 14] 5A and 5B are cross-sectional views (part 2) illustrating the method for manufacturing the optical transmission device according to the first embodiment. [Figure 15] 5A to 5C are cross-sectional views (part 3) illustrating the method for manufacturing the optical transmission device according to the first embodiment. [Figure 16] FIG. 10 is a diagram illustrating the arrangement of optical modules in an optical transmission device according to a reference example. [Figure 17] 10 is a cross-sectional view showing another example of the third connector in the first embodiment. FIG. [Figure 18] FIG. 10 is a top view illustrating an optical transmission device according to a second embodiment. [Figure 19] FIG. 10 is a cross-sectional view showing an optical transmission device according to a second embodiment. [Figure 20] FIG. 10 is a top view illustrating an optical transmission device according to a third embodiment. [Figure 21] FIG. 11 is a bottom view showing the third connector, the fourth connector, etc. in the third embodiment. [Figure 22] FIG. 10 is a cross-sectional view showing an optical transmission device according to a third embodiment. [Figure 23] FIG. 11 is a cross-sectional view showing a third connector in the third embodiment. [Figure 24] 10A to 10C are cross-sectional views illustrating a method for manufacturing an optical transmission device according to a third embodiment. [Figure 25]FIG. 10 is a top view illustrating an optical transmission device according to a fourth embodiment. [Figure 26] FIG. 10 is a cross-sectional view showing an optical transmission device according to a fourth embodiment. [Figure 27] FIG. 10 is a top view showing a package substrate according to a fourth embodiment. [Figure 28] 10A to 10C are cross-sectional views illustrating a method for manufacturing an optical transmission device according to a fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In this specification and drawings, components having substantially the same functional configurations are designated by the same reference numerals, and redundant description may be omitted.

[0010] (First embodiment) A first embodiment will be described. The first embodiment relates to an optical transmission device. FIG. 1 is a top view showing the optical transmission device according to the first embodiment. FIG. 2 is an exploded top view showing the optical transmission device according to the first embodiment. FIG. 3 is a cross-sectional view showing the optical transmission device according to the first embodiment. FIG. 3 corresponds to a cross-sectional view taken along line III-III in FIG. 1.

[0011] As shown in FIGS. 1 to 3 , the optical transmission device 1 according to the first embodiment includes a package substrate 110, a third connector 140, four optical module groups 120A, a cooling plate 160, four optical module groups 120B, and a fourth connector 150. The optical module group 120A includes a plurality of optical modules 120, and the optical module group 120B includes a plurality of optical modules 120. For example, the number of optical modules 120 included in the optical module group 120A and the number of optical modules 120 included in the optical module group 120B are both eight. That is, the optical transmission device 1 includes, for example, 64 optical modules 120. The optical modules 120 included in the optical module group 120A are an example of first optical modules, and the optical modules 120 included in the optical module group 120B are an example of second optical modules.

[0012] FIG. 4 is a top view showing the package substrate 110 in the first embodiment. The package substrate 110 has a rectangular planar shape. The package substrate 110 is a wiring substrate. The package substrate 110 has a top surface 114. A switch integrated circuit chip (switch IC) 113 is mounted at the center of the top surface 114. A plurality of first connectors 111 and a plurality of second connectors 112 are attached to the top surface 114. The number of first connectors 111 is equal to the total number of optical modules 120 included in the four optical module groups 120A, and the number of second connectors 112 is equal to the total number of optical modules 120 included in the four optical module groups 120B. The first connectors 111 and the second connectors 112 are connected to the switch IC 113 through the package substrate 110. The first connectors 111 and the second connectors 112 are, for example, female connectors. The plurality of first connectors 111 and the plurality of second connectors 112 are arranged to form a square-shaped ring surrounding the switch IC 113 in a plan view perpendicular to the top surface 114. For example, the plurality of first connectors 111 and the plurality of second connectors 112 are arranged so that eight connectors each form four sides. The second connector 112 is provided between the switch IC 113 and the first connector 111. The top surface 114 is an example of a first surface.

[0013] FIG. 5 is a top view showing the cooling plate 160. The cooling plate 160 includes a first cooling section 161 that cools the switch IC, a second cooling section 162 that cools the optical module 120, and a connecting section 163 that connects the first cooling section 161 and the second cooling section 162. The first cooling section 161 has a rectangular planar shape. In plan view, the first cooling section 161 is located inside the second connector 112. The second cooling section 162 has a square-shaped annular shape that surrounds the first cooling section 161 in plan view. As shown in FIG. 3, the second cooling section 162 has inclined surfaces 164 and 165 that are inclined toward the top surface 114 as they approach the switch IC 113 in a cross-sectional view parallel to the top surface 114. The inclined surface 164 is closer to the top surface 114 than the inclined surface 165. In this embodiment, the inclined surfaces 164 and 165 are parallel to each other, and the angle θ2 formed between the upper surface 114 and the inclined surface 164 is equal to the angle θ3 formed between the upper surface 114 and the inclined surface 165. The angles θ2 and θ3 are greater than 0° and less than 90°, and preferably greater than or equal to 10° and less than or equal to 80°. The inclined surface 164 is an example of a second surface, and the inclined surface 165 is an example of a third surface.

[0014] The cooling plate 160 further has an inlet 166 and an outlet 167 connected to the second cooling section 162. A refrigerant such as water is supplied to the second cooling section 162 from the inlet 166, and the refrigerant is supplied to the first cooling section 161 through the connecting section 163. The refrigerant supplied to the first cooling section 161 is discharged from the outlet 167 through the connecting section 163 and the second cooling section 162.

[0015] 6 is a cross-sectional view showing the optical module 120. The optical module 120 has a main body 121 and a terminal 122. The main body 121 has flat surfaces 123 and 124 that are parallel to each other. The terminal 122 is provided on the flat surface 123. The flat surface 124 comes into contact with the second cooling section 162 of the cooling plate 160.

[0016] FIG. 7 is a top view showing the third connector 140. FIG. 8 is a bottom view showing the third connector 140. FIG. 9 is a cross-sectional view showing the third connector 140. The third connector 140 has a base 141 and a protrusion 142. The base 141 and the protrusion 142 are made of an engineering plastic, such as polyphenylene sulfide (PPS), polyamide, polybutylene terephthalate (PBT), or liquid crystal polymer (LCP). The base 141 is formed with accommodating sections 143 that accommodate the optical modules 120 included in the optical module group 120A. The number of accommodating sections 143 is the same as the number of optical modules 120 included in the optical module group 120A. The accommodating section 143 has a slope 144 parallel to the slope 164. The slope 144 is inclined so that it approaches the top surface 114 as it approaches the switch IC 113 in a cross-sectional view parallel to the top surface 114. The protrusion 142 protrudes downward from the base 141. The third connector 140 has a terminal 147 on the inclined surface 144, a terminal 148 on the underside of the protrusion 142, and a conductive member 149 that connects the terminals 147 and 148. When the optical module 120 is accommodated in the accommodating section 143, the terminal 122 is connected to the terminal 147. The optical module 120 accommodated in the accommodating section 143 is provided on the inclined surface 164 of the second cooling section 162. The terminal 148 is connected to a terminal of the first connector 111. The protrusion 142 provided with the terminal 148 functions as a male connector that is inserted into the first connector 111. The inclined surface 144 is an example of a fourth surface.

[0017] FIG. 10 is a top view of the fourth connector 150. FIG. 11 is a bottom view of the fourth connector 150. FIG. 12 is a cross-sectional view of the fourth connector 150. The fourth connector 150 has a base 151 and a protruding portion 152. The base 151 and the protruding portion 152 are made of an engineering plastic, such as PPS, polyamide, PBT, or LCP. The base 151 is formed with accommodating portions 153 for accommodating the optical modules 120 included in the optical module group 120B. The number of accommodating portions 153 is the same as the number of optical modules 120 included in the optical module group 120B. The accommodating portion 153 has a slope 154 parallel to the slope 165. The slope 154 is inclined so that it approaches the top surface 114 as it approaches the switch IC 113 in a cross-sectional view parallel to the top surface 114. The protruding portion 152 protrudes downward from the base 151. The fourth connector 150 has a terminal 157 on the inclined surface 154, a terminal 158 on the lower surface of the protruding portion 152, and a conductive member 159 connecting the terminals 157 and 158. When the optical module 120 is accommodated in the accommodating portion 153, the terminal 122 is connected to the terminal 157. The optical module 120 accommodated in the accommodating portion 153 is provided on the inclined surface 165 of the second cooling portion 162. The terminal 158 is connected to a terminal of the second connector 112. The protruding portion 152 provided with the terminal 158 functions as a male connector to be inserted into the second connector 112. The inclined surface 154 is an example of a fifth surface.

[0018] Here, a method for manufacturing the optical transmission device 1 according to the first embodiment will be described. Figures 13 to 15 are cross-sectional views showing the method for manufacturing the optical transmission device 1 according to the first embodiment.

[0019] 13, a package substrate 110 is prepared, to which a first connector 111 and a second connector 112 are attached and a switch IC 113 is mounted. Then, optical modules 120 included in an optical module group 120A are attached to the respective accommodating sections 143 of a third connector 140.

[0020] 14, the protrusion 142 is inserted into the first connector 111. As a result, the optical modules 120 included in the optical module group 120A are mounted on the package substrate 110. After that, the cooling plate 160 is prepared.

[0021] 15, the cooling plate 160 is attached to the package substrate 110 so that the first cooling unit 161 contacts the switch IC 113 and the second cooling unit 162 contacts the optical modules 120 included in the optical module group 120A. Also, as shown in FIG. 15, the optical modules 120 included in the optical module group 120B are attached to the respective housing portions 153 of the fourth connector 150.

[0022] Next, the protrusion 152 is inserted into the second connector 112. As a result, the optical modules 120 included in the optical module group 120B are mounted on the package substrate 110, as shown in FIG.

[0023] In this manner, the optical transmission device 1 according to the first embodiment can be manufactured.

[0024] In the first embodiment, the optical modules 120 are arranged in two rows along each side of the package substrate 110, which is rectangular in plan view. That is, in plan view, 32 optical modules 120 included in four optical module groups 120A are arranged in a ring shape, and inside these 32 optical modules 120, 32 optical modules 120 included in four optical module groups 120B are also arranged in a ring shape. This makes it possible to suppress an increase in the distance between the switch IC 113 and the optical modules 120 that accompanies an increase in the number of optical modules 120. This makes it possible to shorten the wiring between the switch IC 113 and the optical modules 120 provided on the package substrate 110.

[0025] Furthermore, according to the first embodiment, the package substrate 110 can be made smaller. FIG. 16 is a diagram illustrating the arrangement of optical modules in an optical transmission device according to a reference example. In the optical transmission device according to the reference example shown in FIG. 16, 16 optical modules 120 are arranged in a row along each side of a package substrate 110X that is rectangular in plan view. If the longitudinal dimension of the optical module 120 in plan view is 30 mm and the lateral dimension is 14.3 mm, then in the reference example, the length of each side of the package substrate 110X is at least 469 mm. In contrast, in the first embodiment, if the angles θ2 and θ3 are 30° and two rows of eight optical modules 120 are arranged along each side, then the length of each side of the package substrate 110 is at least 304 mm. Therefore, according to the first embodiment, the area of ​​the package substrate can be reduced by approximately 42% compared to the reference example.

[0026] According to this embodiment, even if a large number of optical modules 120 are mounted on the package substrate 110, it is possible to prevent the package substrate 110 from becoming larger and to prevent an increase in the distance between the switch IC 113 and the optical modules 120. Therefore, it is possible to increase the density of the optical modules 120 and improve the bandwidth.

[0027] Furthermore, the third connector 340, the cooling plate 160, and the fourth connector 350 overlap in a concentric quadrangular pyramid shape. This provides high rigidity. Furthermore, during the manufacture of the optical transmission device 1, self-alignment is performed, suppressing misalignment and providing high positional accuracy. This provides excellent adhesion between the optical module 120 and the cooling plate 160, resulting in excellent cooling performance. This provides high reliability for the optical transmission device 1.

[0028] The larger the angles θ2 and θ3, the more compact the package substrate 110 can be, but on the other hand, the height of the optical transmission device 1 increases. Considering the balance between the size of the package substrate 110 and the height of the optical transmission device 1, the angles θ2 and θ3 are more preferably 40° or more and 50° or less. Furthermore, if there are strict restrictions on the height of the optical transmission device 1, the angles θ2 and θ3 are more preferably 10° or more and 30° or less.

[0029] A flexible substrate may be used to connect terminals 147 and 148 in third connector 140. Fig. 17 is a cross-sectional view showing another example of third connector 140. As shown in Fig. 17, flexible substrate 149A including terminals 147 and 148 may be used. Although not shown, flexible substrate 149A includes a wiring layer that connects terminals 147 and 148. Similarly, a flexible substrate may be used to connect terminals 157 and 158 in fourth connector 150. The wiring layer is an example of a conductive member.

[0030] (Second embodiment) Next, a second embodiment will be described. The second embodiment differs from the first embodiment mainly in the configuration of the cooling plate. FIG. 18 is a top view showing an optical transmission device according to the second embodiment. FIG. 19 is a cross-sectional view showing the optical transmission device according to the second embodiment. FIG. 19 corresponds to a cross-sectional view taken along line XIX-XIX in FIG. 18.

[0031] As shown in FIGS. 18 and 19 , the optical transmission device 2 according to the second embodiment has a cooling plate 260 instead of the cooling plate 160. The cooling plate 260 has a second cooling section 262 instead of the second cooling section 162. The second cooling section 262 has a square-shaped annular shape surrounding the first cooling section 161 in a plan view. Also, as shown in FIG. 19 , the second cooling section 262 has slopes 164 and 265 that are inclined toward the top surface 114 as they approach the switch IC 113 in a cross-sectional view parallel to the top surface 114. The slope 164 is closer to the top surface 114 than the slope 265. In this embodiment, the angle θ3 between the top surface 114 and the slope 265 is larger than the angle θ2 between the top surface 114 and the slope 164. The angles θ2 and θ3 are greater than 0° and less than 90°, and preferably greater than or equal to 10° and less than or equal to 80°. The angles θ2 and θ3 are more preferably 40° or more and 50° or less. Furthermore, if there are strict restrictions on the height of the optical transmission device 1, the angles θ2 and θ3 are more preferably 10° or more and 30° or less. The inclined surface 265 is an example of a third surface.

[0032] The other configurations are the same as those in the first embodiment.

[0033] The second embodiment can also achieve the same effects as the first embodiment. Furthermore, in the second embodiment, the volume of the second cooling section 162 can be made larger than in the first embodiment, so that the optical module 120 can be cooled more easily.

[0034] (Third embodiment) Next, a third embodiment will be described. The third embodiment differs from the first embodiment mainly in the configuration of the third connector and the fourth connector. FIG. 20 is a top view showing an optical transmission device according to the third embodiment. FIG. 21 is a bottom view showing the third connector, the fourth connector, etc. in the third embodiment. FIG. 22 is a cross-sectional view showing the optical transmission device according to the third embodiment. FIG. 23 is a cross-sectional view showing the third connector in the third embodiment. FIG. 22 corresponds to a cross-sectional view taken along line XXII-XXII in FIG. 20.

[0035] As shown in FIGS. 20 to 23, the optical transmission device 3 according to the third embodiment has a third connector 340 instead of the third connector 140, and has a fourth connector 350 instead of the fourth connector 150.

[0036] The third connector 340 has a base 341 and a protruding portion 342. The base 341 and the protruding portion 342 are made of an engineering plastic such as PPS, polyamide, PBT, or LCP. The protruding portion 342 protrudes downward from the base 341. The third connector 340 has a flexible substrate 349A including terminals 347 and 348. The terminal 347 is connected to the terminal 122 of the optical module 120. The terminal 348 is provided on the lower surface of the protruding portion 342 and is connected to a terminal of the first connector 111. Although not shown, the flexible substrate 349A includes a wiring layer that connects the terminal 347 and the terminal 348. The protruding portion 342 provided with the terminal 348 functions as a male connector that is inserted into the first connector 111. The wiring layer is an example of a conductive member.

[0037] The fourth connector 350 has a base, a protrusion 352 (see FIG. 24), and a flexible substrate. The flexible substrate has terminals connected to terminals 122 of the optical module 120, terminals 358 connected to terminals of the second connector 112, and a wiring layer connecting these. The terminals 358 are provided on the lower surface of the protrusion 352. The protrusion 352 provided with the terminals 358 functions as a male connector that is inserted into the second connector 112. The wiring layer is an example of a conductive member.

[0038] The optical transmission device 3 has a support bar 371, screws 372, 373, and screws 375. The support bar 371 supports the optical modules included in the optical module group 120B on the slope 165 of the cooling plate 160. The screws 372 fix the support bar 371 to the cooling plate 160. The screws 373 fix the fourth connector 350 to the support bar 371. The screws 375 fix the third connector 340 to the cooling plate 160.

[0039] The other configurations are the same as those in the first embodiment.

[0040] Here, a method for manufacturing the optical transmission device 3 according to the third embodiment will be described. Fig. 24 is a cross-sectional view showing the method for manufacturing the optical transmission device 3 according to the third embodiment.

[0041] 24, a package substrate 110 is prepared, to which a first connector 111 and a second connector 112 are attached and a switch IC 113 is mounted. Also, a cooling plate 160 is prepared, to which the optical modules 120 included in the optical module group 120A are fixed via the third connector 340 and the optical modules 120 included in the optical module group 120B are fixed via the fourth connector 350.

[0042] Next, the protrusion 342 of the third connector 340 is inserted into the first connector 111 together with the terminals 348, and the protrusion 352 of the fourth connector 350 is inserted into the second connector 112 together with the terminals 358. As a result, the optical modules 120 included in the optical module group 120A and the optical modules 120 included in the optical module group 120B are mounted on the package substrate 110, as shown in FIG.

[0043] In this manner, the optical transmission device 3 according to the third embodiment can be manufactured.

[0044] The third embodiment can also achieve the same effects as the first embodiment. Furthermore, the third embodiment can use the third connector 340 and the fourth connector 350 with a simple configuration.

[0045] (Fourth embodiment) Next, a fourth embodiment will be described. The fourth embodiment differs from the third embodiment mainly in the configurations of the third and fourth connectors. FIG. 25 is a top view showing an optical transmission device according to the fourth embodiment. FIG. 26 is a cross-sectional view showing the optical transmission device according to the fourth embodiment. FIG. 26 corresponds to a cross-sectional view taken along line XXVI-XXVI in FIG. 25. FIG. 27 is a top view showing a package substrate in the fourth embodiment.

[0046] As shown in FIGS. 25 to 27, the optical transmission device 4 according to the fourth embodiment has a connector 440 instead of the third connector 340 and the fourth connector 350. The connector 440 has a configuration in which the third connector 340 and the fourth connector 350 are integrated together. The connector 440 has a protrusion 442 (see FIG. 28) instead of the protrusions 342 and 352. The protrusion 442 has a configuration in which the protrusions 342 and 352 are integrated together.

[0047] A plurality of connectors 411, each having a configuration in which the first connector 111 and the second connector 112 are integrated, are attached to the top surface 114 of the package substrate 110. The number of connectors 411 is equal to the total number of optical modules 120 included in the four optical module groups 120A and the total number of optical modules 120 included in the four optical module groups 120B. The connectors 411 are connected to the switch IC 113 through the package substrate 110. The connectors 411 are, for example, female connectors. The multiple connectors 411 are arranged in a square-shaped ring shape surrounding the switch IC 113 in a plan view perpendicular to the top surface 114.

[0048] The other configurations are the same as those of the third embodiment.

[0049] Here, a method for manufacturing the optical transmission device 4 according to the fourth embodiment will be described. Fig. 28 is a cross-sectional view showing the method for manufacturing the optical transmission device 4 according to the fourth embodiment.

[0050] First, as shown in Fig. 28, a package substrate 110 is prepared, to which a connector 411 is attached and a switch IC 113 is mounted. Also, a cooling plate 160 is prepared, to which an optical module 120 included in an optical module group 120A and an optical module 120 included in an optical module group 120B are fixed via a connector 440.

[0051] Next, the protrusion 442 of the connector 440 is inserted into the connector 411 together with the terminals 348 and 358. As a result, the optical modules 120 included in the optical module group 120A and the optical modules 120 included in the optical module group 120B are mounted on the package substrate 110, as shown in FIG.

[0052] In this manner, the optical transmission device 4 according to the fourth embodiment can be manufactured.

[0053] The fourth embodiment can also achieve the same effects as the third embodiment. Furthermore, the fourth embodiment makes it easier to improve connection reliability by reducing the number of connectors.

[0054] The above describes in detail preferred embodiments, but the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

[0055] Various aspects of the present disclosure are summarized below as appendices.

[0056] (Appendix 1) a wiring substrate having a first surface; a switch integrated circuit chip provided on the first surface; a first connector provided on the first surface and connected to the switch integrated circuit chip through the wiring board; a second connector provided on the first surface between the switch integrated circuit chip and the first connector and connected to the switch integrated circuit chip through the wiring substrate; a first optical module electrically connected to the first connector; a second optical module electrically connected to the second connector; a cooling plate having a first cooling unit that cools the switch integrated circuit chip and a second cooling unit that cools the first optical module and the second optical module; and the second cooling section has a second surface and a third surface that are inclined so as to approach the first surface as they approach the switch integrated circuit chip in a cross-sectional view parallel to the first surface, the second surface is closer to the first surface than the third surface; the first optical module is provided on the second surface; The optical transmission device is characterized in that the second optical module is provided on the third surface. (Appendix 2) a third connector provided between the first surface and the second surface and connected to the first connector; the third connector has a fourth surface that is inclined so as to approach the first surface as it approaches the switch integrated circuit chip in a cross section parallel to the first surface, the first optical module is provided between the second surface and the fourth surface, 2. The optical transmission device according to claim 1, wherein the first optical module is connected to the third connector and electrically connected to the first connector via the third connector. (Appendix 3) In a plan view perpendicular to the first surface, the third connector has an annular shape that surrounds the switch integrated circuit chip, 3. The optical transmission device according to claim 2, wherein a plurality of the first optical modules are connected to the third connector in a ring shape. (Appendix 4) a fourth connector provided on the third surface and connected to the second connector; the fourth connector has a fifth surface that is inclined so as to approach the first surface as it approaches the switch integrated circuit chip in a cross section parallel to the first surface, the second optical module is provided between the third surface and the fifth surface, 3. The optical transmission device according to claim 1, wherein the second optical module is connected to the fourth connector and electrically connected to the second connector via the fourth connector. (Appendix 5) In a plan view perpendicular to the first surface, the fourth connector has an annular shape that surrounds the switch integrated circuit chip, 5. The optical transmission device according to claim 4, wherein a plurality of the second optical modules are connected to the fourth connector in a ring shape. (Appendix 6) 3. The optical transmission device according to claim 1, wherein the angle between the first surface and the third surface is larger than the angle between the first surface and the second surface. (Appendix 7) 3. The optical transmission device according to claim 1, wherein the angle between the first surface and the second surface is 10 degrees or more and 80 degrees or less. (Appendix 8) 8. The optical transmission device according to claim 7, wherein the angle between the first surface and the second surface is between 40° and 50°. (Appendix 9) 8. The optical transmission device according to claim 7, wherein the angle formed between the first surface and the second surface is 10° or more and 30° or less. (Appendix 10) 3. The optical transmission device according to claim 1, wherein the first connector and the second connector are integrated. [Explanation of symbols]

[0057] 1, 2, 3, 4: Optical transmission equipment 110: Package substrate 111: First connector 112: Second connector 113: Switch IC 114:Top surface 120: Optical module 120A, 120B: Optical module group 140, 340: 3rd connector 141, 341: Base 142, 342:Protrusion 143: Storage unit 144: Slope 147, 148, 347, 348: Terminals 149: Conductive material 149A, 349A: Flexible board 150, 350: 4th connector 151: Base 152, 352:Protrusion 153: Storage unit 154: Slope 157, 158, 358: Terminals 159: Conductive material 160, 260: Cooling plate 161: 1st cooling section 162, 262: 2nd cooling section 163:Connection part 164, 165, 265: Slopes 411, 440: Connector 442:Protrusion

Claims

1. a wiring substrate having a first surface; a switch integrated circuit chip provided on the first surface; a first connector provided on the first surface and connected to the switch integrated circuit chip through the wiring board; a second connector provided on the first surface between the switch integrated circuit chip and the first connector and connected to the switch integrated circuit chip through the wiring substrate; a first optical module electrically connected to the first connector; a second optical module electrically connected to the second connector; a cooling plate having a first cooling unit that cools the switch integrated circuit chip and a second cooling unit that cools the first optical module and the second optical module; and the second cooling unit has a second surface and a third surface that are inclined so as to approach the first surface as they approach the switch integrated circuit chip in a cross-sectional view parallel to the first surface, the second surface is closer to the first surface than the third surface; the first optical module is provided on the second surface; The optical transmission device is characterized in that the second optical module is provided on the third surface.

2. a third connector provided between the first surface and the second surface and connected to the first connector; the third connector has a fourth surface that is inclined so as to approach the first surface as it approaches the switch integrated circuit chip in a cross section parallel to the first surface, the first optical module is provided between the second surface and the fourth surface, 2. The optical transmission device according to claim 1, wherein the first optical module is connected to the third connector and electrically connected to the first connector via the third connector.

3. a fourth connector provided on the third surface and connected to the second connector; the fourth connector has a fifth surface that is inclined so as to approach the first surface as it approaches the switch integrated circuit chip in a cross section parallel to the first surface, the second optical module is provided between the third surface and the fifth surface, 3. The optical transmission device according to claim 1, wherein the second optical module is connected to the fourth connector and electrically connected to the second connector via the fourth connector.

4. 3. The optical transmission device according to claim 1, wherein the angle formed between the first surface and the third surface is larger than the angle formed between the first surface and the second surface.

5. 3. The optical transmission device according to claim 1, wherein the angle between the first surface and the second surface is 10 degrees or more and 80 degrees or less.

6. 3. The optical transmission device according to claim 1, wherein the first connector and the second connector are integrated.

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