Joining device and joining method
The bonding device enhances substrate alignment and contact accuracy by using controlled deformation units to protrude central portions of wafers, addressing uneven deformation issues in existing technologies.
JP7765155B2Active Publication Date: 2025-11-06TOKYO ELECTRON LTD
Patent Information
- Application Number
- JP2021191029
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-11-25
- Publication Date
- 2025-11-06
- Estimated Expiration
- 2041-11-25
AI Technical Summary
Technical Problem
Existing bonding devices deform the central portion of wafers unevenly, leading to inaccuracies in the contact area between substrates.
Method used
A bonding device that includes first and second holding units, a moving unit, and deformation units to precisely control the protrusion of central portions of substrates, ensuring accurate alignment and contact between wafers.
Benefits of technology
Improves bonding accuracy by ensuring precise alignment and contact between substrates, reducing deviations in reference points and enhancing the bonding process.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 0007765155000001 
Figure 0007765155000002 
Figure 0007765155000003
Abstract
To provide a technique of improving a joint accuracy of both substrates.SOLUTION: A joint device joints a first substrate and a second substrate. The joint device comprises: a first holding part; a second holding part; a movable part; a first deformation part; a second deformation part; and a control part. The first holding part sucks and holds the first substrate from an upper direction. The second holding part sucks and holds the second substrate at a lower direction from the first holding part. The movable part relatively moves the first and second holding parts. The first deformation part makes a center part of the first substrate held by the first holding part project to the lower direction. The second deformation part makes the center part of the second substrate held by the second holding part project to the upper direction. The control part controls the movable part, the first deformation part, and the second deformation part to perform a control for bringing both of the center parts of the first and second substrates into contact with each other. The control part performs the control for changing a projection amount of the center part of the first substrate in accordance with the projection amount of the center part of the second substrate.SELECTED DRAWING: Figure 12
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Bonding device, bonding system, bonding method, program, and computer storage medium
JP2014229787A
Joining device, joining system, joining method, and storage medium
JP2021141115A
Joining device and joining method
WO2021015028A1