Security page and method for thermocompression bonding of laminate

Abstract

To provide a security page with high productivity while suppressing warp or distortion by using a thermoplastic resin having at least either a glass transition point or a softening point lower than that of polycarbonate in an IC substrate layer.SOLUTION: A security page 1 comprises: a hinge layer 13 connected as a security document 2; and an IC substrate layer 21 having an IC chip 23. Substrate surface layers 20, 22 are bonded to a front and back of the IC substrate layer 21. The substrate surface layers 20, 22 are made of polycarbonate. The IC substrate layer 21 is made of the thermoplastic resin having at least either the glass transition point or the softening point lower than that of the polycarbonate.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a security page having an IC substrate layer that holds an IC chip, and to a method of thermocompression bonding of a laminate to form the security page. [Background technology]

[0002] For example, in conventional passport booklets, the security page, or personal information page, is made by using a base material such as perforated paper, and then using a thermal transfer printer to press a laminated film onto which personal information is printed. Meanwhile, the IC chip and antenna are made into a plate using a thermoplastic resin such as PET-G (polyethylene terephthalate), and are then heat-pressed to the paper on both sides of the plate and placed in the center of the passport booklet.

[0003] However, as copying technology has become more advanced, people have begun to peel off the laminated film on the personal information page and falsify the personal information. This has led to a global trend toward changing the personal information page from paper to plastic and using laser technology to add personal information. Accordingly, a method of integrating the personal information by moving the IC chip and antenna, which were previously located in the center of the passport booklet, to the personal information page is becoming mainstream worldwide. Furthermore, polycarbonate is often used as the thermoplastic resin for the personal information page, which has the advantages of transparency, impact resistance, and other physical strength (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2018 / 151238 Summary of the Invention [Problem to be solved by the invention]

[0005] When the personal information page is made of polycarbonate, the most common method is to sandwich a flexible hinge layer, which is used to sew the security page into the passport booklet, and then thermocompress the multi-layer structure, which consists of a protective layer, a printing layer, a laser coloring layer, and a core layer containing an IC chip and antenna, between the multi-layer structure.

[0006] In Patent Document 1, all layers except the hinge layer are made of polycarbonate, thereby suppressing distortion such as warping. However, polycarbonate is expensive and requires high processing temperatures, resulting in poor productivity, and there was a need for equipment that could handle high processing temperatures.

[0007] Typically, when thermocompression bonding multilayer structures made of thermoplastic resin, the mainstream method is to use large sheets to create multiple faces, sandwich the multilayer structures one by one between metal plates called hot plates, stack them in large numbers, and mass-produce them in one batch using a multi-stage heat source device.This method requires time for heating and cooling, and when sewing a multilayer structure made of polycarbonate into a booklet, special processing is required before thermocompression bonding to form a multilayer structure with a hinge layer sandwiched inside.

[0008] Therefore, the present invention aims to provide a security page that can suppress warping and distortion and has high productivity by using a thermoplastic resin that has a lower glass transition point or softening point than polycarbonate for the IC substrate layer. [Means for solving the problem]

[0009] The present invention is a security page having an IC layer equipped with an IC chip and a flexible hinge layer for connecting to a booklet, wherein the IC layer has an IC substrate layer and substrate surface layers made of polycarbonate laminated on the front and back of the IC substrate layer, and the IC substrate layer is made of a thermoplastic resin having at least one of a glass transition point and a softening point lower than that of polycarbonate.

[0010] The present invention is a security page characterized in that a substrate surface layer laminated on the surface of an IC substrate layer is the first substrate surface layer, a laser printing layer is laminated on the first substrate surface layer, and a transparent printing layer is laminated on the laser printing layer, and the laser printing layer and transparent printing layer are made of polycarbonate.

[0011] The present invention is a security page characterized in that a substrate surface layer laminated on the back surface of an IC substrate layer is used as a second substrate surface layer, a colored printed layer made of polycarbonate is laminated on the second substrate surface layer, and the hinge layer has a mesh structure formed from single material fibers or composite material fibers, with a portion of the hinge layer laminated and sandwiched between the second substrate surface layer and the colored printed layer.

[0012] The present invention provides a security page having an opening consisting of a through-punched hole formed at a position where the substrate surface layer and the hinge layer do not overlap, the opening being a transparent window portion formed from a transparent filler material made of polycarbonate.

[0013] The present invention provides a method for thermocompression bonding of laminates, which forms a security page by integrating by thermocompression a laminate comprising an IC layer formed by laminating substrate surface layers made of polycarbonate on the front and back of an IC substrate layer made of a thermoplastic resin having at least one of a glass transition point and a softening point lower than that of polycarbonate, a laser-printed layer made of polycarbonate on one side of the IC layer, a transparent printed layer made of polycarbonate on the laser-printed layer, in that order, and a part of a hinge layer on the other side of the IC layer, sandwiched between colored printed layers made of polycarbonate. The method is characterized by comprising a heating step in which the front and back of the laminate are pressurized by a pair of heating sources at a heating temperature of at least one of the glass transition point or the softening point of the polycarbonate, and a cooling step in which the pair of heating sources are removed from the laminate and then the front and back of the laminate are pressurized by a pair of cooling sources and cooled. [Effects of the Invention]

[0014] According to the security page of the present invention, a thermoplastic resin having a glass transition point or softening point lower than that of polycarbonate is used for the IC substrate layer, and polycarbonate substrate surface layers are laminated on the front and back of the IC substrate layer, thereby suppressing warping and distortion and enabling a highly productive thermocompression bonding method.

[0015] Furthermore, according to the thermocompression bonding method for laminates of the present invention, the laser printing layer, transparent printing layer, colored printing layer, and substrate surface layer, which are on the outside of the laminate, can be thermocompressed at a heating temperature with the required amount of heat, and the IC substrate layer, which is on the inside of the laminate, does not reach the same heating temperature as the outside.Therefore, even if a thermoplastic resin with a lower glass transition point or softening point than polycarbonate is used, deformation due to melting can be suppressed, making it possible to produce at low cost. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 illustrates a security document having a security page according to one embodiment of the present invention. [Figure 2] An explanatory diagram showing the cross-sectional structure of a security page [Figure 3] FIG. 10 is an explanatory diagram showing a cross-sectional structure of a security page according to another embodiment of the present invention; [Figure 4] FIG. 1 is an explanatory diagram showing an example of a method for thermocompression bonding of laminates to produce a security page according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0017] The security page according to the first embodiment of the present invention has substrate surface layers laminated on the front and back of an IC substrate layer, the substrate surface layers being made of polycarbonate, and the IC substrate layer being made of a thermoplastic resin having at least one of a glass transition point and a softening point lower than that of polycarbonate.

[0018] According to this embodiment, a thermoplastic resin having a glass transition point or softening point lower than that of polycarbonate is used for the IC substrate layer, and polycarbonate substrate surface layers are laminated on the front and back of the IC substrate layer, thereby making it possible to suppress warping and distortion and to perform a thermocompression bonding method with high productivity. Note that the glass transition point in the present invention is specified in JIS K7121, and the softening point is specified in JIS K7206.

[0019] The second embodiment of the present invention is the first embodiment, in which the substrate surface layer laminated on the surface of the IC substrate layer is the first substrate surface layer, a laser-printed layer and a transparent printed layer are laminated on the first substrate surface layer, and the laser-printed layer and the transparent printed layer are made of polycarbonate.

[0020] According to this embodiment, the surface of the IC substrate layer has a first substrate surface layer made of polycarbonate, and by laminating a laser-printed layer made of polycarbonate and a transparent printed layer made of polycarbonate on this first substrate surface layer, it is possible to improve the stackability and increase the strength.

[0021] The third embodiment of the present invention is such that, in the first or second embodiment, the substrate surface layer on the back side of the IC substrate layer is the second substrate surface layer, the hinge layer has a mesh structure, a hinge layer is laminated on a part of the second substrate surface layer, a colored printed layer is laminated on the second substrate surface layer or the hinge layer, the colored printed layer is made of polycarbonate, and the hinge layer is sandwiched and integrated between the second substrate surface layer and the colored printed layer.

[0022] According to this embodiment, the hinge layer is sandwiched between the second substrate surface layer, which is made of polycarbonate, and the colored printed layer and thermocompressed, so that the molten polycarbonate penetrates into the gaps in the hinge layer, which has a mesh structure, thereby increasing the connection strength of the hinge layer to the second substrate surface layer and the colored printed layer.

[0023] The fourth embodiment of the present invention is any one of the first to third embodiments, in which a portion of the substrate surface layer and the IC substrate layer overlaps with the hinge layer, and has an opening consisting of a through-punched hole formed in a position of the substrate surface layer and the IC substrate layer that does not overlap with the hinge layer, and has a transparent window portion formed by filling the opening with a transparent material made of polycarbonate.

[0024] According to this embodiment, by not providing the hinge layer on the entire surface of the substrate surface layer and the IC substrate layer, the security page can be made thinner and the synthetic fibers that make up the hinge layer can be prevented from being exposed due to fraying around the periphery of the security page. Furthermore, since the opening made of the through-punched hole is formed in a position that does not overlap with the hinge layer of the substrate surface layer and the IC substrate layer, it is possible to form a transparent window portion filled with a transparent material without being affected by fraying of the synthetic fibers that make up the hinge layer due to the punching process.

[0025] A fifth embodiment of the present invention provides a thermocompression bonding method for a laminate, which comprises: an IC layer formed by laminating substrate surface layers made of polycarbonate on the front and back sides of an IC substrate layer made of a thermoplastic resin having at least one of a glass transition point and a softening point lower than that of polycarbonate; a laser-printed layer made of polycarbonate on one side of the IC layer, a transparent printed layer made of polycarbonate on the laser-printed layer, in that order; and a hinge layer on the other side of the IC layer, with part of the hinge layer sandwiched between colored printed layers made of polycarbonate. The thermocompression bonding method for a laminate comprises a heating step in which the front and back sides of the laminate are pressurized by a pair of heating sources at a heating temperature of at least one of the glass transition point or the softening point of the polycarbonate; and a cooling step in which the pair of heating sources are used to release pressure from the laminate, and then the front and back sides of the laminate are pressed and cooled by a pair of cooling sources.

[0026] According to this embodiment, the laser printing layer, transparent printing layer, colored printing layer, and substrate surface layer, which are on the outside of the laminate, can be thermocompressed at a heating temperature of the required amount of heat, and the IC substrate layer, which is on the inside of the laminate, does not reach the same heating temperature as the outside. Therefore, even if a thermoplastic resin with a lower glass transition point and softening point than polycarbonate is used, deformation due to melting can be suppressed, making it possible to produce at low cost. [Example]

[0027] A security page 1 according to one embodiment of the present invention will be described. FIG. 1 shows a security document 2 having the security page 1. The security document 2 is, for example, a passport, and is made up of multiple pages including the security page 1. The security page 1 comprises an information section 1a and a connecting section 1b, and is connected to the security document 2 and other pages 3 and 4 via the connecting section 1b by stitching. The security page 1 is collated with a content page 4 and an inside page 3 and machine-bound. A cover is then laminated on the inside page 3, folded along the sewing thread, and cut to form the security document 2 as a booklet. The information section 1a is provided with a lenticular lens 31, a hologram 32, and a transparent window 34, and personal information, such as the passport owner's name, date of birth, issue date, expiration date, and photograph, is written in the information section 1a. This information is mainly printed using a laser.

[0028] FIG. 2 is an explanatory diagram showing the cross-sectional structure of a security page. The connecting portion 1b of the security page 1 consists of a hinge layer 13. The hinge layer 13 has a mesh structure and is made of a woven fabric with individual intersecting threads made of single-material fibers or composite material fibers, and is flexible. However, instead of a mesh structure, the hinge layer 13 may be made of a flexible material that can be thermocompressed with other layers, such as polyurethane. A part of the hinge layer 13 is located in the information portion 1a. The security page 1 comprises the flexible hinge layer 13, an IC layer 25, and a laser-printable layer 12.

[0029] The IC chip 23 and the antenna 24 are held in the IC layer 25. The IC layer 25 has an IC substrate layer 21 and a first substrate surface layer 20 and a second substrate surface layer 22 laminated on the front and back of the IC substrate layer 21. The first substrate surface layer 20 is laminated on the front surface of the IC substrate layer 21, and the second substrate surface layer 22 is laminated on the back surface of the IC substrate layer 21. The IC substrate layer 21 is formed by laminating a first substrate 21a and a second substrate 21b. A space for arranging the IC chip 23 and the antenna 24 is formed in the first substrate 21a. The second substrate 21b is laminated on the surface of the first substrate 21a on which the antenna 24 is arranged. By arranging the IC chip 23 and the antenna 24 in the space formed in the first substrate 21a, the thickness of the IC substrate layer 21 is constant, and a flat IC substrate layer 21 is formed.

[0030] A laser-printed layer 12, a transparent printed layer 11, and a protective layer 10 are laminated on the first substrate surface layer 20. FIG. 2 shows the case where the laser-printed layer 12 is laminated on the first substrate surface layer 20, the transparent printed layer 11 is laminated on the laser-printed layer 12, and the protective layer 10 is laminated on the transparent printed layer 11. A hologram 32 is inserted between the laser-printed layer 12 and the transparent printed layer 11. The hologram 32 is arranged so as to partially overlap a photograph or the like in the security page 1. The protective layer 10 is made of transparent polycarbonate, and protects the print 30, such as letters and patterns, on the transparent printed layer 11 from external impacts and scratches. In addition, a concave-convex structure such as a lenticular lens 31 can be added during thermocompression bonding.

[0031] A hinge layer 13 is laminated on a portion of the second substrate surface layer 22, and a colored printed layer 15 is laminated on the second substrate surface layer 22 or the hinge layer 13. The colored printed layer 15 is, for example, white, and has printing 30 of letters, patterns, etc. applied thereto. The hinge layer 13, excluding the connection portion 1b, is sandwiched between the second substrate surface layer 22 and the colored printed layer 15. In areas where the hinge layer 13 is not present, the second substrate surface layer 22 and the colored printed layer 15 are laminated directly together. Figure 2 shows a case where the colored printed layer 15 is laminated on the second substrate surface layer 22, and a protective layer 16 is laminated on the colored printed layer 15. The protective layer 16 is made of transparent polycarbonate and protects the pattern 30 of the colored printed layer 15 from external impacts and scratches.

[0032] Although a portion of the second substrate surface layer 22 overlaps with the hinge layer 13, the area of ​​the second substrate surface layer 22 that does not overlap with the hinge layer 13 is larger than the area of ​​the second substrate surface layer 22 that overlaps with the hinge layer 13. In this way, by not providing the hinge layer 13 on the entire surface of the second substrate surface layer 22, the security page 1 can be made thinner and the fibers that make up the hinge layer 13 can be prevented from being exposed and frayed from the periphery of the security page 1.

[0033] The first substrate surface layer 20, the second substrate surface layer 22, the laser printing layer 12, the transparent printing layer 11, and the colored printing layer 15 are made of polycarbonate, and the polycarbonate in each layer has the same glass transition point or Vicat softening point as the IC substrate layer 21 described later.If the glass transition points or Vicat softening points are different, the adhesion between the layers will be impaired.

[0034] The IC substrate layer 21 is made of a thermoplastic resin having at least one of a glass transition point and a softening point lower than that of polycarbonate. Examples of thermoplastic resins that can be used for the IC substrate layer 21 include polyvinyl chloride, polystyrene, AS resin, ABS resin, methacrylic resin, modified polyphenylene ether, polypropylene, polybutylene terephthalate, and polyethylene terephthalate. The IC substrate layer 21 is formed from a sheet of such a thermoplastic resin, or from a nonwoven fabric made of synthetic fibers such as polyester fiber, polyethylene fiber, nylon fiber, and vinylon fiber, and is made of a resin sheet such as glycol-modified polyethylene terephthalate, which has a glass transition point slightly lower than that of polycarbonate. For example, if the glass transition point or Vicat softening point of polycarbonate is 130 to 170°C, polybutylene terephthalate having a glass transition point or softening point of 80 to 120°C is used. The IC substrate layer 21 and the first substrate surface layer 20, and the IC substrate layer 21 and the second substrate surface layer 22 are laminated by thermocompression bonding or a laminating agent. If the softening points or glass transition points of both resins are too high, the layers will lack flexibility and the adhesion between the layers will be impaired. Conversely, if the softening points or glass transition points are too low, distortion will be large.

[0035] The IC layer 25, the laser printable layer 12, the transparent print layer 11, the color print layer 15, and the protective layers 10 and 16 are integrally molded by thermocompression bonding to form the security page 1 as a plastic card.

[0036] Fig. 3 is an explanatory diagram showing the cross-sectional structure of a security page according to another embodiment of the present invention. In the embodiment shown in Fig. 3, the same parts as those in the embodiments shown in Fig. 1 and Fig. 2 are designated by the same reference numerals and their description will be omitted.

[0037] In this embodiment, an opening consisting of a through-hole is formed by punching through the IC layer 25 and the colored print layer 15, and a transparent filler 33 is inserted into the opening to form the transparent window 34. The transparent filler 33 is made of transparent polycarbonate. By inserting the transparent filler 33 made of transparent polycarbonate inside the security page 1 in this way, it becomes possible to see the transparent window 34 when observing the security page 1.

[0038] Furthermore, by arranging the hologram 32 and the transparent window portion 34 so that they partially overlap, it becomes possible to observe the hologram 32 from both the front and back of the security page 1. Furthermore, the opening formed by the through-punched hole is formed in a position that does not overlap with the hinge layer 13 of the first substrate surface layer 20 and the second substrate surface layer 22, so that the transparent window portion 34 filled with the transparent material 33 can be formed without being affected by fraying of the synthetic fibers that make up the hinge layer 13 due to the punching process.

[0039] FIG. 4 is an explanatory diagram showing an embodiment of a method for thermocompression bonding of a laminate to produce a security page of the present invention.

[0040] The security page 1 of the present invention has a hinge layer 13 for connecting it to a booklet by thread stitching when bound into the booklet as the security document 2, and an IC substrate layer 21 for holding an IC chip 23. The laminate 40 shown in Figure 4 shows the layered structure of the security page 1 at a stage before it is integrated by thermocompression bonding, and is made up of an IC layer 25, a laser-printed layer 12, a transparent printed layer 11, a hinge layer 13, and a colored printed layer 15. Note that while the IC layer 25 and the hinge layer 13 are essential for the laminate 40, the laser-printed layer 12, the transparent printed layer 11, and the colored printed layer 15 are not necessarily included, and the laminate may also have protective layers 10 and 16 made of polycarbonate.

[0041] Here, the IC layer 25 is formed by laminating substrate surface layers 20, 22 made of polycarbonate on the front and back of an IC substrate layer 21 made of a thermoplastic resin having a glass transition point or softening point lower than that of polycarbonate. The laser printable layer 12 and transparent print layer 11 are made of polycarbonate and are disposed on one side of the IC layer 25. The hinge layer 13 is disposed on the other side of the IC layer 25. The colored print layer 15 is made of polycarbonate and is disposed on the other side of the IC layer 25.

[0042] The thermocompression bonding method for the laminate 40 according to this embodiment includes a heating step in which the front and back surfaces of the laminate 40 are heated by applying pressure with a pair of heating heat sources 43, and a cooling step in which the front and back surfaces of the laminate 40 are cooled by applying pressure with a pair of cooling heat sources 44 after the pair of heating heat sources 43 are removed from the laminate 40 and the laminate 40 is no longer in a pressure-removing state.

[0043] A metal plate 41 is placed on the front surface of the laminate 40, and a metal plate 42 is placed on the back surface of the laminate 40. In the conceptual diagram of the device shown in Figure 4, the metal plates 41 and 42 each form a continuous belt-like loop. A heating heat source 43 and a cooling heat source 44 for thermocompression bonding are placed inside each of the metal plates 41 and 42.

[0044] In thermocompression bonding, first, the laminate 40 is sandwiched and pressurized between two upper and lower heating sources 43, and after heating for approximately 30 seconds, the pressure is released to put it into a non-pressurized state. After that, because the laminate 40 is in a layered state with the metal plates 41 and 42, the metal plates 41 and 42 are rotated to move the laminate 40 to a position where it is sandwiched between the cooling heat source 44. The laminate 40 is then cooled, completing the thermocompression bonding and resulting in the security page 1.

[0045] At this time, since only one laminate 40 is heated without stacking multiple laminates 40, the IC layer 25 inside the laminate 40 is not heated sufficiently, and thermocompression bonding can be performed at a heating temperature with a sufficient amount of heat to press-bond the laser printing layer 12, transparent printing layer 11, and colored printing layer 15 located on the front and back of the IC layer 25.

[0046] That is, in the heating process, a heating temperature is applied that is sufficient to thermocompress the laser printing layer 12, the transparent printing layer 11, and the first substrate surface layer 20 that forms one side of the IC layer 25, and to thermocompress the colored printing layer 15, the hinge layer 13, and the second substrate surface layer 22 that forms the other side of the IC layer 25, but is not sufficient to melt the IC substrate layer 21.

[0047] Therefore, the laser printing layer 12, transparent printing layer 11, colored printing layer 15, and substrate surface layers 20, 22, which form the outside of the laminate 40, can be thermocompressed at a heating temperature of the required amount of heat, and since the heating temperature does not reach the inside of the laminate 40 as much as it does the outside, deformation due to melting can be suppressed even if a thermoplastic resin with a lower glass transition point and softening point than polycarbonate is used for the IC substrate layer 21, making it possible to produce at low cost.

[0048] As described above, according to this embodiment, a thermoplastic resin having a lower glass transition point and / or softening point than polycarbonate is used for the IC substrate layer 21, and polycarbonate substrate surface layers 20, 22 are laminated on the front and back of the IC substrate layer 21, thereby making it possible to suppress warping and distortion and to perform a highly productive thermocompression bonding method.

[0049] Furthermore, according to this embodiment, the surface of the IC substrate layer 21 has a first substrate surface layer 20 made of polycarbonate, and by laminating a laser printing layer 12 made of polycarbonate and a transparent printing layer 11 made of polycarbonate on this first substrate surface layer 20, it is possible to improve the lamination property and increase the strength.

[0050] Furthermore, according to this embodiment, the hinge layer 13 is sandwiched between the second substrate surface layer 22 and the colored printed layer 15, which are made of polycarbonate, and thermocompressed, so that the molten polycarbonate penetrates into the gaps in the mesh structure of the hinge layer 13, thereby increasing the connection strength of the hinge layer 13 to the second substrate surface layer 22 and the colored printed layer 15. [Industrial Applicability]

[0051] The present invention is suitable for plastic personal information pages on security documents such as passports. [Explanation of symbols]

[0052] 1. Security Page 1a Information part 1b Connection part 2. Security Documents 3 Inside pages (other pages) 4 Content pages (other pages) 10 protective layer 11 Transparent printing layer 12 Laser printable layer 13 Hinge Layer 15 Colored printing layer 16 Protective layer 20 First substrate surface layer (substrate surface layer) 21 IC board layer 21a First substrate 21b 2nd board 22 2nd substrate surface layer (substrate surface layer) 23 IC chip 24 Antenna 25 IC layer 30 Printing (pattern) 31 Lenticular Lens 32 Hologram 33 Transparent filler 34 Transparent window 40 laminate 41 Metal plate 42 Metal plate 43 Heating heat source 44 Cooling heat source

Claims

1. A security page having an IC layer with an IC chip and a flexible hinge layer for connecting to a booklet, the IC layer has an IC substrate layer and substrate surface layers made of polycarbonate laminated on the front and back sides of the IC substrate layer, the IC substrate layer is made of a thermoplastic resin having at least one of a glass transition point and a softening point lower than that of the polycarbonate; the substrate surface layer laminated on the surface of the IC substrate layer is a first substrate surface layer; a laser-printed layer is laminated on the surface layer of the first substrate, and a transparent print layer is laminated on the laser-printed layer; the laser-printable layer and the transparent print layer are made of the polycarbonate; the substrate surface layer laminated on the rear surface of the IC substrate layer is a second substrate surface layer; a colored print layer made of polycarbonate is laminated on the surface layer of the second substrate; The hinge layer has a network structure formed by single-material fibers or composite-material fibers; a part of the hinge layer is laminated and sandwiched between the second substrate surface layer and the colored print layer; A security page characterized in that the laser printing layer and the transparent printing layer laminated on the first substrate surface layer and the colored printing layer laminated on the second substrate surface layer have different layer structures.

2. an opening formed by a through-punched hole formed at a position where the substrate surface layer and the hinge layer do not overlap; 2. The security page according to claim 1, wherein the opening is a transparent window formed by the transparent filler material made of polycarbonate.

3. A method for thermocompression bonding of a laminate, the method comprising: an IC layer formed by laminating substrate surface layers made of polycarbonate on the front and back sides of an IC substrate layer made of a thermoplastic resin having at least one of a glass transition point and a softening point lower than that of polycarbonate; a laser-printable layer made of polycarbonate, and a transparent printed layer made of polycarbonate, disposed in this order on one side of the IC layer; and a hinge layer disposed on the other side of the IC layer, the hinge layer being sandwiched between colored printed layers made of polycarbonate; and a method for thermocompression bonding of a laminate having different layer structures, the laser-printable layer and the transparent printed layer disposed on one side of the IC layer, and the colored printed layer disposed on the other side of the IC layer, the laser-printable layer and the transparent printed layer disposed on one side of the IC layer being integrated by thermocompression bonding to form a security page, a heating step of pressing the front and back surfaces of the laminate with a pair of heat sources at a heating temperature of at least one of the glass transition point and the softening point of the polycarbonate; A method for thermocompression bonding of a laminate, characterized in that it includes a cooling step in which, after the pair of heating heat sources are removed from the laminate and the laminate is no longer pressurized, the front and back surfaces of the laminate are pressed with a pair of cooling heat sources to cool the laminate.

Images