High-pressure water cutting device and method for cutting brittle materials

The high-pressure water cutting device stabilizes brittle materials with adhesive application and a lattice-shaped catcher, addressing cracking and vibration issues to simplify the cutting process.

JP7812307B2Active Publication Date: 2026-02-09SUGINO MACHINE
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Patent Information

Application Number
JP2022125066
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-08-04
Publication Date
2026-02-09
Estimated Expiration
2042-08-04

AI Technical Summary

Technical Problem

Existing methods for cutting brittle materials like glass or semiconductor wafers face issues with cracking and chipping due to the need for adhesive sheets, which are time-consuming to attach and dispose, and are prone to vibration-induced processing inaccuracies.

Method used

A high-pressure water cutting device with a nozzle head, catcher, and workpiece fixing part that applies adhesive to the back and/or sides of brittle materials, using a lattice-shaped thin plate to stabilize and protect the material during cutting.

Benefits of technology

The device prevents cracking and simplifies the cutting process by stabilizing brittle materials with adhesive application, reducing the need for adhesive sheets and minimizing vibration effects.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a high pressure water cutting device and a cutting method of a brittle material which can prevent the occurrence of cracking and the like of a brittle material by easily applying an adhesive to a rear surface and / or side surface of the brittle material.SOLUTION: A high pressure water cutting device comprises: a nozzle head 2 which jets high pressure water supplied from a high pressure water supply device 1 from a nozzle 2a; a catcher 3 in which a lattice-like thin plate is arranged; and a workpiece fixing part 5 which fixes a brittle material W. An adhesive is applied to a rear surface and / or side surface of the brittle material W.SELECTED DRAWING: Figure 1
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Description

[Technical Field]

[0001] The present invention relates to a high-pressure water cutting device and a method for cutting brittle materials. [Background technology]

[0002] Conventionally, high-pressure water supplied from a high-pressure water supply device (e.g., a high-pressure pump) has been used to process various raw materials, such as cutting and drilling. Furthermore, when processing brittle materials (workpieces) such as glass or semiconductor raw materials, a method has been adopted in which a primary process is performed using high-pressure water at a low pressure, followed by a secondary process using high-pressure water at a higher pressure (piercing). However, even when such a processing method is adopted, brittle materials still exist, and extensive research has been conducted into this issue.

[0003] For example, Patent Document 1 discloses that when semiconductor wafers or semiconductor-related materials are diced with a water jet laser, an adhesive sheet for water jet laser dicing, which has an adhesive layer laminated on a base film, is used to prevent defects such as cracking and chipping when chips or IC components are peeled off. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-060170 Summary of the Invention [Problem to be solved by the invention]

[0005] In the above-mentioned Patent Document 1, it is necessary to attach an adhesive sheet (dicing sheet) between the workpiece and the work table, which requires the time and effort of attaching the sheet and the process (time and effort) of disposing of the sheet after processing. As semiconductors and glass materials used as workpieces tend to become thinner, there has been a demand for devices and methods that can more easily carry out the preparation process.

[0006] Furthermore, in the case of brittle materials, vibration of the brittle material can lead to a deterioration in processing accuracy, so there has been a demand for devices and methods that are as immune to the effects of vibration as possible.

[0007] Therefore, the objective of the present invention is to provide a high-pressure water cutting device and a method for cutting brittle materials that can prevent cracking and other problems from occurring in brittle materials by simply applying an adhesive to the back and / or sides of the brittle material. [Means for solving the problem]

[0008] In order to solve the above problems, the high-pressure water cutting device of the present invention includes a nozzle head that sprays high-pressure water supplied from a high-pressure water supply device from a nozzle, a catcher in which a lattice-shaped thin plate is arranged, and a workpiece fixing part that fixes a brittle material, The workpiece fixing portion is disposed on the upper surface of the thin plate and includes a workpiece table on which the brittle material is placed, a workpiece table support plate disposed on the lower surface of the thin plate, and a workpiece table fastener that fastens the workpiece table and the workpiece table support plate together; Adhesive is applied to the back and / or sides of the brittle material.

[0009] In order to solve the above problems, the processing and cutting of brittle materials according to the present invention comprises the steps of: A work table is placed on the upper surface of the lattice-shaped thin plate of the catcher, a work table support plate is placed on the lower surface of the thin plate, and the work table and the work table support plate are fastened together with a work table fastener; Apply adhesive to the back and / or sides of the brittle material Then, attach the brittle material to the top surface of the work table. High-pressure water spray brittle material Disconnect Then, remove the brittle material from the work table. Remove adhesive from brittle materials 。 [Effects of the Invention]

[0010] To provide a high-pressure water cutting device and a method for cutting brittle materials, which can prevent cracking of brittle materials by simply applying an adhesive to the back and / or side of the brittle materials. [Brief explanation of the drawings]

[0011] [Figure 1] Schematic diagram of the high-pressure water cutting device of this embodiment [Figure 2] 1A is a cross-sectional view of a workpiece fixing portion of this embodiment, and FIG. 1B is a schematic view of the workpiece fixing portion of this embodiment. [Figure 3] Schematic diagram of a modification of the high-pressure water cutting device of this embodiment. [Figure 4] 1A is a cross-sectional view of a modified example of the workpiece fixing portion of this embodiment, and FIG. 1B is a schematic diagram of the modified example of the workpiece fixing portion of this embodiment. [Figure 5] 1A and 1B are top views of a modified example of the work table of the present embodiment when the diameter is expanded and when the diameter is reduced. [Figure 6] 1 is a schematic diagram of a modified example of the work table and the work table support plate of the present embodiment; [Figure 7] Flow of the method for cutting brittle materials according to this embodiment [Figure 8] 1 is a schematic diagram showing a path of cutting a brittle material according to an embodiment of the present invention; [Figure 9] (a) Top view, (b) side view, and (c) bottom view of a brittle material coated with the adhesive of this embodiment. BEST MODE FOR CARRYING OUT THE INVENTION

[0012] Next, an embodiment of the present invention will be described with reference to the accompanying drawings.

[0013] (Configuration of high-pressure water cutting equipment) The high-pressure water cutting device 1 of this embodiment processes a brittle material W. Brittle materials W include a wide variety of materials such as ceramic and glass. The high-pressure water cutting device 1 has a high-pressure water supply device P, an abrasive supply device A, a nozzle head 2, a catcher 3, a workpiece fixing unit 5, and a control unit 20.

[0014] The high-pressure water supply device P is a pump that generates high-pressure water Q. The high-pressure water supply device P can pressurize the high-pressure water within a range of 10 to 300 MPa. Specifically, it is desirable that the device be a plunger pump or the like.

[0015] The abrasive supply device A is a part that supplies the abrasive AB to the nozzle head 2 by pumping it. The abrasive AB supplied from the abrasive supply device A is mixed with high-pressure water Q supplied from the high-pressure water supply device P and sprayed from the nozzle 2a. The abrasive AB may be any abrasive with sufficient hardness, such as sapphire, and the particle size can also be changed as appropriate.

[0016] The nozzle head 2 sprays high-pressure water Q supplied from the high-pressure water supply device P and abrasives supplied from the abrasive supply device A from the nozzle 2a. The nozzle head 2 can be moved in the X, Y and Z directions by a movement mechanism that realizes two-dimensional and three-dimensional movement along the X, Y and Z axes.

[0017] The catcher 3 places the brittle material W inside and collects chips and the like after machining. Although not shown in the specification, it is also possible to fill the catcher 3 with water by connecting a liquid supply pump. By machining the brittle material W under water, it is possible to reduce the effects of heat, which leads to a reduction in the load on the brittle material during machining.

[0018] Additionally, lattice-like thin plates 4 are placed inside the catcher 3. The high-pressure water Q is sprayed downward, but if it collides with a surface, that surface will be damaged. By using the lattice-like thin plates 4, damage to the device caused by the high-pressure water Q can be prevented. The thickness and number of the thin plates 4 are such that the high-pressure water Q can escape, and they are placed at equal intervals on the left and right. Additionally, since the high-pressure water Q contains abrasives, it is desirable to use a metal material with high hardness to avoid damaging the thin plates 4 as much as possible.

[0019] The workpiece fixing portion 5 fixes the brittle material W. The workpiece fixing portion 5 has a workpiece table 6, a workpiece table support plate 7, and a fastener 8.

[0020] The work table 6 is placed on the upper surface of the thin plate 4, and the brittle material W is placed on it. The work table 6 is a cylindrical member. If the shape of the brittle material W is polygonal, for example, rectangular or pentagonal, the shape of the work table 6 may also be polygonal. Furthermore, since the brittle material W is machined gradually from the outer periphery, it is desirable that the diameter of the work table 6 be smaller than that of the brittle material W and also smaller than the machining dimensions.

[0021] As a modified example of the work table 6, as shown in FIGS. 5(a) and 5(b), it is possible to make the outer diameter adjustable according to the size of the brittle material W. A modified example of the work table 6 is composed of a work table main body 6b, an outer diameter adjustment tool 6c, and a work table outer shell 6d. The work table main body 6b is a member on which the brittle material W is placed at the center. The outer diameter adjustment tool 6c is a member connected to the side of the work table main body 6b and whose length is adjusted using screws, springs, etc. Alternatively, a pantograph structure can be adopted. The work table outer shell 6d is a member connected to the outer diameter adjustment tool 6c and on which the outer edge of the underside of the brittle material W is placed. The shape of the work table outer shell 6d may be not only semicircular (crescent) but also cylindrical or polygonal.

[0022] As shown in Figure 5(a), when the outer diameter adjuster 6c is in a long state, the work table outer shell 6d connected to the tip of the outer diameter adjuster 6c expands in diameter, making it possible to set it so that a large brittle material W can be easily placed on it. Also, as shown in Figure 5(b), when the outer diameter adjuster 6c is in a short state, the work table outer shell 6d connected to the tip of the outer diameter adjuster 6c contracts in diameter, making it possible to set it so that a small brittle material W can be easily placed on it.

[0023] The work table support plate 7 is placed on the underside of the thin plate 4. Since the high-pressure water Q sprayed from the nozzle 2a is sprayed so as to pass through the thin plate 4, it is desirable that the work table support plate 7 be smaller than the outer shape of the work table 6. Unlike the work table 6, it is not a plate on which the brittle material W is placed but a plate for fixing, so it is possible to reduce the weight and improve the passability by forming passage holes inside or by adopting a honeycomb structure.

[0024] As a modification of the work table 6 and work table support plate 7, as shown in FIG. 6, a work table fixing claw 6e and a work support plate fixing claw 7a are arranged on the work table 6 and the work table support plate 7, respectively. The work table 6 and the work table support plate 7 are fastened together with the thin plate 4 sandwiched between them, but to suppress misalignment and vibration, the thin plate 4 is primarily fixed with the work table fixing claws 6e and the work support plate fixing claws 7a, and then secondarily fixed with fasteners 8. The work table fixing claws 6e and the work support plate fixing claws 7a may be shaped like a claw that can be hooked onto the thin plate 4 or shaped so that they can be folded inward.

[0025] The fastener 8 fixes the work table 6 and the work table support plate 7 by tightening them together. For example, the fastening is adjusted by forming male and female threads on the work table support column 6a, which is fixed to or connected to the bottom of the work table 6, and the fastener 8. In addition, the fastener 8 can be changed as needed depending on the fastening force by appropriately selecting a screw, spring, cylinder, etc. The number of fasteners 8 is set according to the number and fastening force of the workpiece table supports 6a. The workpiece table supports 6a are rod-shaped members, and the number can be set appropriately to 2 to 10, for example.

[0026] Furthermore, when cutting the brittle material W, a support guide 9 can be arranged on the upper surface of the thin plate 4 so as to surround the outer periphery of the brittle material W, so as to prevent the cut-off brittle material W (unwanted material) from colliding with the main body of the brittle material W (after processing) and causing other adverse effects. By configuring the cut-off brittle material W (unwanted material) to fall downward after falling onto the support guide 9, it is possible to prevent cracks and the like caused by gravity and weight when the brittle material W is cut off (separated from the main body of the brittle material W). The shape of the support guide 9 can be selected from not only a cylindrical shape but also a polygonal shape, a rod shape, etc. Furthermore, a support guide pillar 9a is arranged below the support guide 9. The support guide pillar 9a is a rod-shaped member, and the number of support guide pillars 9a can be set appropriately, such as 2 to 10.

[0027] A support guide 9 arranged on the upper surface of the thin plate 4 and a support guide support plate 10 arranged on the lower surface of the thin plate 4 are fastened together with a support guide fastener 11 to be fixed in place. The support guide 9 and the support guide support plate 10 can be adjusted in diameter according to the size of the brittle material W and can also be designed to increase the clamping force, just like the work table 6 and the work support plate.

[0028] By providing the support guide 9, it becomes possible to identify the location within the catcher 3 where chips of the brittle material W will fall after machining. Also, to ensure a smooth flow of water around the area below the support guide 9, it is possible to provide an accelerator that accelerates the direction of the flow velocity within the catcher 3 or a collection device that is connected to the outside of the catcher 3. As a result, chips of the brittle material W can also be collected efficiently.

[0029] The control unit 20 controls the pressure, speed, etc. of the high-pressure water Q from the high-pressure water supply device P. The control unit 20 also has a numerical control function and cuts the brittle material W according to the rotation, angle, speed, etc. that are set in advance or in real time. Specifically, as shown by the cutting line L in FIG. 8 , the nozzle head 2 (nozzle 2a) moves from above the brittle material W along the outer edge of the brittle material W, repeatedly processing the brittle material W into an arc-shaped curved surface, thereby enabling a smooth cut to be made on the brittle material W. When coming into contact with the brittle material W, the nozzle head 2 (nozzle 2a) starts cutting the brittle material W from an oblique direction while moving in a curved line. After starting the cut, the nozzle head 2 (nozzle 2a) cuts the brittle material W in an arc-shaped manner while moving in a curved line along the outer edge of the cylindrical brittle material W. Then, when passing the cut start point or the cut end point on the brittle material W, the nozzle head 2 (nozzle 2a) also moves in an arc-shaped manner while moving in a curved line.

[0030] When cutting in a straight line, the high-pressure water Q must remain in the same position while it is moving, and by performing curved surface processing in a flowing manner, as in a single stroke, it is possible to reduce the impact on the brittle material W. In addition to such curved surface processing, it is also possible to set the pressure of the high-pressure water Q low until the high-pressure water Q first comes into contact with the brittle material W, as in piercing, and then set the pressure of the high-pressure water Q high once it is on the cutting path.

[0031] As shown in Figures 9(a) to 9(c), adhesive B is applied to the back and / or side of the brittle material W. Figure 9(a) is a top view of the brittle material W with adhesive B applied, Figure 9(b) is a side view of the brittle material W with adhesive B applied, and Figure 9(c) is a bottom view of the brittle material W with adhesive B applied. Adhesive B is applied to the back of the brittle material W so as to cover it evenly. Adhesive B is applied to the side of the brittle material W in a range of adhesive application height H2 relative to the brittle material height H1. Adhesive application height H2 is 1 / 2 or less, preferably 1 / 3 or less, of the brittle material height H1. The thickness of adhesive B is preferably 5 mm or less.

[0032] If the brittle material W is a brittle member, cracking may occur due to the high-pressure water Q, but by applying adhesive B to the brittle material W, it is possible to reduce costs and simplify the process without using something like dicing tape.

[0033] The adhesive B is preferably an epoxy adhesive or an acrylic adhesive that does not peel or shift during processing and has excellent mechanical properties, electrical properties, and durability. It is desirable to use a commercially available epoxy adhesive. For example, a liquid adhesive can be used, and either a two-component epoxy adhesive containing separate epoxy resins and curing agents, or a one-component epoxy adhesive containing a mixture of epoxy resin and curing agent, can be used. It is desirable to use a commercially available adhesive as the acrylic adhesive. For example, a liquid adhesive can be used, and either a two-component epoxy adhesive containing separate acrylic resins and hardeners, or a one-component acrylic adhesive containing a mixture of acrylic resin and hardener, can be used.

[0034] The method for cutting a brittle material according to this embodiment will be described.

[0035] Preparation work is carried out to fix the brittle material W. The workpiece fixing part 5 is placed on top of the thin plate 4 placed inside the catcher 3 of the high-pressure water cutting device 1. Then, adhesive B such as an epoxy adhesive or an acrylic adhesive is applied to the back and / or side of the brittle material W (S1). Then, the brittle material W is placed on the work table 6.

[0036] As shown in Figures 9(a) to 9(c), the adhesive B is applied to the brittle material W so as to uniformly cover the back surface of the brittle material W, and the adhesive B is applied to the side surface of the brittle material W in a range of adhesive application height H2 relative to the brittle material height H1. The adhesive application height H2 is 1 / 2 or less, preferably 1 / 3 or less, of the brittle material height H1. The thickness of the adhesive B is preferably 5 mm or less.

[0037] The high-pressure water supply device P and the abrasive supply device A are operated to prepare the high-pressure water cutting device 1. The nozzle head 2 is moved close to the brittle material W so that high-pressure water Q mixed with abrasives can be sprayed. The spray pressure of the high-pressure water Q is adjusted by spraying the high-pressure water Q mixed with abrasives near the brittle material W before cutting.

[0038] High-pressure water Q mixed with an abrasive is sprayed onto the brittle material W to cut it (S2). In the cutting step S2, as shown by the cutting line L in FIG. 8, the nozzle head 2 (nozzle 2a) moves from above the brittle material W relative to the outer periphery of the brittle material W, repeatedly processing the brittle material W into an arc-shaped curved surface, thereby enabling a smooth cut to be made on the brittle material W. When coming into contact with the brittle material W, the nozzle head 2 (nozzle 2a) starts cutting the brittle material W from an oblique direction while moving in a curved line. After starting the cut, the nozzle head 2 (nozzle 2a) cuts the brittle material W in an arc-shaped manner while moving in a curved line. Then, when passing the cut start point or the cut end point on the brittle material W, the nozzle head 2 (nozzle 2a) also moves in an arc-shaped manner while moving in a curved line.

[0039] When cutting in a straight line, the high-pressure water Q must remain in the same position while it is moving, and by performing curved surface processing in a flowing manner, as in a single stroke, it is possible to reduce the impact on the brittle material W. In addition to such curved surface processing, it is also possible to set the pressure of the high-pressure water Q low until the high-pressure water Q first comes into contact with the brittle material W, as in piercing, and then set the pressure of the high-pressure water Q high once it is on the cutting path.

[0040] After the cutting is completed, the brittle material W placed on the work table 6 is removed, and the adhesive B adhering to the brittle material W is removed (S3).

[0041] As described above, the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be modified appropriately within the scope of the gist of the present invention. [Explanation of symbols]

[0042] 1. High-pressure water cutting device 2 nozzle heads 2a nozzle 3. Catcher 4 thin plate 5 Workpiece fixing part 6 Work table 7 Work table support plate 8 Work table fastener 9 Support Guide 10 Support guide support plate 11 Support guide fastener 20 Control Unit B. Adhesive

Claims

1. The apparatus includes a nozzle head that sprays high-pressure water supplied from a high-pressure water supply device from a nozzle, a catcher in which a lattice-shaped thin plate is arranged, and a workpiece fixing portion that fixes a brittle material, The workpiece fixing portion is arranged on the upper surface of the thin plate and includes a workpiece table on which the brittle material is placed, a workpiece table support plate arranged on the lower surface of the thin plate, and a workpiece table fastener that fastens the workpiece table and the workpiece table support plate, A high-pressure water cutting device, wherein an adhesive is applied to the back and / or side of the brittle material.

2. A support guide is arranged on the upper surface of the thin plate to surround the outer periphery of the brittle material.

2. The high-pressure water cutting device according to claim 1.

3. A support guide support plate is disposed on the lower surface of the thin plate, and a support guide fastener fastens the support guide and the support guide support plate.

3. The high-pressure water cutting device according to claim 2.

4. The adhesive is an epoxy adhesive or an acrylic adhesive.

2. The high-pressure water cutting device according to claim 1.

5. A work table is placed on the top surface of the lattice-shaped thin plate of the catcher, A work table support plate is placed on the underside of the thin plate; The work table and the work table support plate are fastened together by a work table fastener; Applying an adhesive to the back and / or side of the brittle material to attach the brittle material to the top surface of the work table; Cutting the brittle material by jetting high-pressure water; Remove the brittle material from the work table; removing the adhesive adhering to the brittle material; How to cut brittle materials.

6. When cutting the brittle material, arc-shaped curved surface processing is repeatedly performed on the outer periphery of the brittle material. The method for cutting brittle materials according to claim 5.

7. The adhesive is an epoxy adhesive or an acrylic adhesive. The method for cutting brittle materials according to claim 5.

Citation Information

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