Socket assembly

Abstract

To provide a socket assembly.SOLUTION: The socket assembly includes a main body, a plurality of shielding components, and a plurality of retractable probes. The main body has a plurality of through-holes and a plurality of recesses. The through-holes accommodate the retractable probes. At least one recess is formed between any two through-holes adjacent to each other. The plurality of shielding components is inserted into the recesses.SELECTED DRAWING: Figure 2A

Description

Technical Field

[0001] The present disclosure relates to a socket assembly, and more particularly to a socket assembly having a shielding function and adapted to be used with a chip test socket.

Background Art

[0002] Once the packaging of a chip is completed, the packaged chip has to be tested to sort out unsatisfactory packaged chips. Generally, the packaged chip is tested in a socket equipped with test probes, which are usually elastic probes commonly known as pogo pins. To conduct the test, one end of each pogo pin contacts a circuit board on the socket, and the other end of the pogo pin contacts a pin of the packaged chip.

[0003] The socket has through holes for receiving the pogo pins. However, due to the short distance between the through holes, signals associated with adjacent pogo pins interfere with each other during the test, impairing the accuracy of the test results. The interference is particularly serious during high-frequency signal tests. Therefore, it is essential to reduce signal interference and thereby enhance the stability and accuracy of the test.

[0004] The description of the above "Background Art" merely serves to clarify the background art, and it is not intended to admit that the description of the above "Background Art" discloses the subject matter of the present disclosure, constitutes the prior art of the present disclosure, or is part of the present disclosure.

Summary of the Invention

Problems to be Solved by the Invention

[0005] In view of the above-mentioned conventional problem of interference of test signals, the present disclosure provides a socket assembly.

Means for Solving the Problems

[0006] One embodiment of the present disclosure provides a socket assembly for use with a chip test socket, the socket assembly comprising a body, a plurality of first shielding components, a plurality of second shielding components, and a plurality of pogo pins. The body has a top surface, a bottom surface opposite the top surface, a plurality of first through-hole arrays (rows), a plurality of second through-hole arrays, a plurality of first grooves, and a plurality of second grooves. Each first through-hole array comprises a plurality of first through-holes aligned in a first direction. Each second through-hole array comprises a plurality of second through-holes aligned in a second direction. Each first groove extends in a first direction and is located between any two adjacent first through-hole arrays. Each second groove extends in a second direction and is located between any two adjacent second through-hole arrays. Each first shielding component has a first face, and a plurality of first shielding components are inserted into a plurality of first grooves. Each second shielding component has a second face, and a plurality of second shielding components are inserted into a plurality of second grooves. Multiple pogo pins are positioned in multiple first through holes and multiple second through holes. A first distance is defined between the first surface and the bottom surface of each first shielding component. A second distance is defined between the second surface and the bottom surface of each second shielding component.

[0007] Another embodiment of the present disclosure provides a socket assembly comprising a body, a plurality of shielding components, and a plurality of pogo pins. At least a first portion of the plurality of through holes forms a plurality of first through-hole arrays. At least a second portion of the plurality of through holes forms a plurality of second through-hole arrays. At least a first portion of the plurality of grooves is located between any two adjacent first through-hole arrays. At least a second portion of the plurality of grooves is located between any two adjacent second through-hole arrays. The plurality of shielding components are inserted into and positioned in the plurality of grooves. The plurality of pogo pins are located within the plurality of through holes.

[0008] Accordingly, the socket assembly of this disclosure includes shielding components for blocking signal interference between pogo pins during testing, effectively blocking signal interference and thereby improving the stability and accuracy of the test.

[0009] The technical features and advantages of this disclosure are described above in general and extensively in order to enable the understanding of the detailed description of this disclosure below. Other technical features and advantages of the subject matter of the claims of this disclosure are described below. Those skilled in the art will understand that the concepts and specific embodiments presented below can be easily modified or designed to be used to achieve the same purposes as the disclosure. Those skilled in the art will also understand that the equivalent configurations described above cannot deviate from the spirit and scope set forth in the claims attached to this disclosure. [Brief explanation of the drawing]

[0010] Those skilled in the art can gain insights into the present disclosure by referring to the embodiments, claims, and drawings of this disclosure. In the drawings, similar components are given the same reference numerals.

[0011] [Figure 1A] This is a perspective view of a socket assembly according to some embodiments of the present disclosure. [Figure 1B] This is a perspective view of a socket assembly according to some embodiments of the present disclosure. [Figure 1C] This is a cross-sectional view of a socket assembly according to some embodiments of the present disclosure. [Figure 1D] This is a cross-sectional view of a socket assembly according to some embodiments of the present disclosure. [Figure 1E] This is a perspective view of the main body according to some embodiments of the present disclosure. [Figure 1F] This is a perspective view of the main body according to some embodiments of the present disclosure. [Figure 1G] This is a perspective view of the main body according to some embodiments of the present disclosure. [Figure 1H] This is a cross-sectional view of the body according to some embodiments of this disclosure. [Figure 1I] This is a cross-sectional view of the body according to some embodiments of this disclosure. [Figure 2A] This is a perspective view of a socket assembly according to some embodiments of the present disclosure. [Figure 2B] Perspective view of a socket assembly according to some embodiments of the present disclosure. [Figure 2C] Cross-sectional view of a socket assembly according to some embodiments of the present disclosure. [Figure 2D] Cross-sectional view of a socket assembly according to some embodiments of the present disclosure. [Figure 2E] Cross-sectional view of a socket assembly according to some embodiments of the present disclosure. [Figure 2F] Perspective view of a body according to some embodiments of the present disclosure. [Figure 2G] Perspective view of a body according to some embodiments of the present disclosure. [Figure 2H] Perspective view of a body according to some embodiments of the present disclosure. [Figure 2I] Cross-sectional view of a body according to some embodiments of the present disclosure. [Figure 2J] Cross-sectional view of a body according to some embodiments of the present disclosure. [Figure 2K] Cross-sectional view of a body according to some embodiments of the present disclosure. [Figure 2L] Cross-sectional view of a shielding component according to some embodiments of the present disclosure. [Figure 2M] Perspective view of a socket assembly according to some embodiments of the present disclosure. [Figure 2N] Cross-sectional view of a socket assembly according to some embodiments of the present disclosure. [Figure 2O] Cross-sectional view of a socket assembly according to some embodiments of the present disclosure. [Figure 2P] Enlarged cross-sectional view of a socket assembly according to some embodiments of the present disclosure. [Figure 3] Perspective view of a socket assembly according to some embodiments of the present disclosure. [Figure 4A] Perspective view of a socket assembly according to some embodiments of the present disclosure. [Figure 4B]This is a perspective view of a socket assembly according to some embodiments of the present disclosure. [Modes for carrying out the invention]

[0012] The following description is accompanied by drawings incorporated herein and constituting part thereof to illustrate embodiments of the present disclosure. However, the present disclosure is not limited to those embodiments. The embodiments described below may be combined as appropriate to implement any other embodiment.

[0013] The purposes of the expressions “one embodiment,” “embodiment,” “exemplary embodiment,” “other embodiment,” and “another embodiment” as used herein are to state that embodiments of the disclosure may include certain features, structures, or characteristics. However, not all embodiments are required to include those specific features, structures, or characteristics. Furthermore, repeated use of the expression “in one embodiment” does not necessarily mean referring to the same embodiment, but the possibility of referring to the same embodiment should not be ruled out. The socket assemblies as used herein are primarily used in chip testing performed during the semiconductor testing process.

[0014] The following description provides a detailed explanation of the processes and structures to enable a full understanding of the Disclosure. Clearly, the embodiments of the Disclosure do not impose any limitations on specific details well known to those skilled in the art. In addition, well known structures and processes are not repeated herein so as not to unnecessarily limit the Disclosure. Preferred embodiments of the Disclosure are described in detail below. However, in addition to the detailed description, the Disclosure may be extensively implemented in other embodiments. The scope of the Disclosure is defined not by the detailed description but by the appended claims.

[0015] The following description provides different embodiments or examples for use in implementing different features of the Disclosure. Specific embodiments or examples of components and arrangements are described in detail herein for the sake of brevity of the Disclosure. Specific embodiments and examples are illustrative and not limiting to the Disclosure. For example, the dimensions of components are not limited to the disclosed range or values ​​and are based on process criteria and / or expected properties of the device. Embodiments in the following description in which a first feature is formed on or above a second feature include any embodiment in which the first and second features thus formed are in direct contact with each other, or any embodiment in which an additional feature is formed between the first and second features, allowing the first and second features not to be in direct contact with each other. For brevity and clarity, the accompanying drawings are not drawn to scale. For brevity, some layers / features have been omitted from the accompanying drawings.

[0016] In addition, for explanatory purposes, expressions relating to spatial relationships, such as “down,” “below,” “bottom,” “up,” and “top,” are used herein to describe the relationship between one component (or feature) and another component (or feature) as shown in the accompanying drawings. Expressions relating to spatial relationships are intended to indicate any other directions in which the component is used or operated, in addition to the directions shown in the accompanying drawings. The component may have any other orientation (rotated by 90 degrees or aligned with another orientation), and expressions relating to spatial relationships may be interpreted accordingly.

[0017] One embodiment of the present disclosure relates to a socket assembly for a chip test socket, the socket assembly comprising a body, a plurality of shielding components, and a plurality of pogo pins. The plurality of pogo pins are configured to test high-frequency signals. The body is made of an insulating material and has a plurality of through holes and a plurality of grooves. At least one of the grooves is located between two adjacent through holes. The plurality of through holes receive the plurality of pogo pins. The plurality of shielding components are made of a conductive metallic material and are inserted and positioned in the plurality of grooves. Due to the above technical features, the insulating properties of the body prevent electrical contact between the pogo pins, and the insertion and positioning of the metallic shielding components between the through holes into which the pogo pins are received effectively blocks signal interference related to the pogo pins during testing, particularly signal interference during high-frequency signal testing. Thus, when the socket assembly is mounted in a corresponding socket, the socket assembly can effectively block signal interference, thereby improving the stability and accuracy of the test. Details of the necessary structural features are illustrated by the embodiments and described below.

[0018] Refer to Figures 1A to 1D. Figure 1A is a perspective view of a socket assembly 11 according to one embodiment of the present disclosure. Figure 1B is another perspective view of a socket assembly 11 according to one embodiment of the present disclosure. Figure 1C is a cross-sectional view of a socket assembly 11 according to one embodiment of the present disclosure. Figure 1D is another cross-sectional view of a socket assembly 11 according to one embodiment of the present disclosure. Specifically, the socket assembly 11 includes a body 111, a plurality of shielding components 113, and a plurality of pogo pins 13. The body 111 has an upper surface 111S1 and a lower surface 111S2 opposite the upper surface 111S1.

[0019] Refer to Figures 1E to 1I. Figures 1E and 1F are perspective views of a body 111 according to some embodiment of the present disclosure. Figure 1G is another perspective view of a body 111 according to some embodiment of the present disclosure. Figure 1H is a cross-sectional view of a body 111 according to some embodiment of the present disclosure. Figure 1I is another cross-sectional view of a body 111 according to some embodiment of the present disclosure. Specifically, the body 111 has a plurality of through holes 1110 and a plurality of grooves 1112. At least a first portion of the through holes 1110 forms a plurality of first through hole arrays 1110AR1. Each through hole 1110 in each first through hole array 1110AR1 is defined as a first through hole and is aligned in a first direction D13. At least a second portion of the through holes 1110 forms a plurality of second through hole arrays 1110AR2. Each through hole 1110 in each second through hole array 1110AR2 is defined as a second through hole and is aligned in a second direction D14. In some embodiments, one of the first through-holes and one of the second through-holes may be the same through-hole, but the first through-hole is distinguished from the second through-hole by a different through-hole array angle.

[0020] In some embodiments, the plurality of grooves 1112 includes a plurality of first grooves 11120 and a plurality of second grooves 11122. Each first groove 11120 extends in a first direction D13 and is located between two adjacent first through-hole arrays 1110AR1. Each second groove 11122 extends in a second direction D14 and is located between two adjacent second through-hole arrays 1110AR2.

[0021] In some embodiments, the shielding components 113 include a plurality of first shielding components 1131 and a plurality of second shielding components 1133. Each first shielding component 1131 is inserted from its top surface 111S1 into a first groove 11120. Each second shielding component 1133 is inserted from its top surface 111S1 into a second groove 11122. The through holes 1110 receive pogo pins 13. In some embodiments, the first shielding components 1131 and the second shielding components 1133 are staggered by an engagement structure positioned between any two adjacent shielding components.

[0022] In some embodiments, each first shielding component 1131 has a first surface 1131S, and each second shielding component 1133 has a second surface 1133S. The first surface 1131S, the second surface 1133S, and the bottom surface 111S2 are substantially oriented in the same direction. When the first shielding component 1131 and the second shielding component 1133 are inserted into the first and second grooves, respectively, a first distance D11 is defined between the bottom surface 111S2 and each first surface 1131S, and a second distance D12 is defined between the bottom surface 111S2 and each second surface 1133S.

[0023] In some embodiments, the upper surface 111S1 and the lower surface 111S2 are substantially parallel, allowing the first surface 1131S of the first shielding component 1131 to be substantially coplanar, the second surface 1133S of the second shielding component 1133 to be substantially coplanar, the first surface 1131S and the second surface 1133S to be substantially coplanar, and the first distance D11 to be substantially equal to the second distance D12; however, the above technical features do not limit the embodiments of the present disclosure.

[0024] Therefore, due to the structure of the socket assembly 11, when pogo pins 13 received in two adjacent through holes 1110 are used for signal transmission during chip testing, signal interference is effectively blocked by using a shielding component 113 inserted into a groove 1112 located between the two adjacent through holes 1110. Referring to Figure 1A, for example, when pogo pins 13A and 13B received in through holes 1110A and 1110B are used for signal transmission during chip testing, signal interference is effectively blocked by using a shielding component 113A inserted into a groove 1112A located between through holes 1110A and 1110B.

[0025] Refer to Figures 2A to 2E. Figure 2A is a perspective view of a socket assembly 21 according to some embodiment of the present disclosure. Figure 2B is another perspective view of a socket assembly 21 according to some embodiment of the present disclosure. Figures 2C to 2E are cross-sectional views of a socket assembly 21 according to some embodiment of the present disclosure. Specifically, the socket assembly 21 includes a body 211, a plurality of shielding components 213, and a plurality of pogo pins 23. The body 211 has an upper surface 211S1 and a lower surface 211S2 opposite to the upper surface 211S1.

[0026] Refer to Figures 2F to 2K. Figures 2F and 2G are perspective views of a body 211 according to some embodiments of the present disclosure. Figure 2H is another perspective view of a body 211 according to some embodiments of the present disclosure. Figures 2I to 2K are cross-sectional views of a body 211 according to some embodiments of the present disclosure. Specifically, the body 211 is block-shaped (e.g., cubic block-shaped) and has a plurality of first through-hole arrays 2110AR1 and a plurality of second through-hole arrays 2110AR2. Each first through-hole array 2110AR1 includes a plurality of first through-holes 2110-1 aligned in a first direction D23. Each second through-hole array 2110AR2 includes a plurality of second through-holes 2110-2 aligned in a second direction D24. In these embodiments, the first direction D23 and the second direction D24 are basically perpendicular to each other, but the present disclosure is not limited thereto. In some embodiments, one of the first through-holes 2110-1 and one of the second through-holes 2110-2 may be the same through-hole, but the first through-hole is distinguished from the second through-hole by a different through-hole array angle.

[0027] The main body 211 has a plurality of first grooves 21120 and a plurality of second grooves 21122. Each first groove 21120 extends in a first direction D23 and is located between two adjacent first through-hole arrays 2110AR1. Each second groove 21122 extends in a second direction D24 and is located between two adjacent second through-hole arrays 2110AR2. In some embodiments, the first grooves 21120 and the second grooves 21122 are arranged alternately.

[0028] In some embodiments, the shielding components 213 include a plurality of first shielding components 2131 and a plurality of second shielding components 2133. Each of the plurality of first shielding components 2131 is inserted from the top surface 211S1 into a plurality of first grooves 21120 of the body 211. Each of the plurality of second shielding components 2133 is inserted from the top surface 211S1 into a plurality of second grooves 21122 of the body 211. The first shielding components 2131 and the second shielding components 2133 are arranged alternately. A plurality of first through holes 2110-1 and a plurality of second through holes 2110-2 receive a plurality of pogo pins 23.

[0029] In some embodiments, each first shielding component 2131 has a first surface 2131S, and each second shielding component 2133 has a second surface 2133S. The first surface 2131S, the second surface 2133S, and the bottom surface 211S2 are substantially oriented in the same direction. The first groove 21120 and the second groove 21122 share the inner bottom surface 211S3 of the body 211. The body 211 has a thickness D25 between the bottom surface 211S3 and the bottom surface 211S2. When the first shielding component 2131 is inserted into the corresponding groove, the first surface 2131S is adjacent to the bottom surface 211S3 of the body 211, and a first distance D21 is defined between each first surface 2131S and the bottom surface 211S2. When the second shielding component 2133 is inserted into the corresponding groove, the second surface 2133S is adjacent to the bottom surface 211S3 of the main body 211, and a second distance D22 is defined between each second surface 2133S and the bottom surface 211S2. In some embodiments, the thickness D25, the first distance D21, and the second distance D22 are equal to each other.

[0030] In some embodiments, two first grooves 21120 and two second grooves 21122 are arranged in a pattern resembling a number symbol (#), and through holes (e.g., first through hole 2110-1 or second through hole 2110-2) are formed in each of the nine cells of the number symbol. Given the pattern, at least one groove (e.g., first groove 21120 or second groove 21122) is positioned between any two adjacent through holes (e.g., first through hole 2110-1 and second through hole 2110-2). A first shielding component 2131 inserted into the first groove 21120 or a second shielding component 2133 inserted into the second groove 21122 is positioned between pogo pins 23 in any two adjacent through holes (e.g., first through hole 2110-1 and second through hole 2110-2).

[0031] In some embodiments, each first groove 21120 has a first opening 21120X on the upper surface 211S1 of the body 211 and a plurality of second openings 21120Y on the lower surface 211S2 of the body 211. The second openings 21120Y are formed along the extension direction of the first groove 21120 and are spaced apart from each other. The dimensions of each second opening 21120Y are smaller than the dimensions of the first opening 21120X. The first shielding component 2131 has a plurality of projections 2131P. When the first shielding component 2131 is inserted into the first groove 21120 through the first opening 21120X, the projections 2131P protrude from the lower surface 211S2 through the corresponding second openings 21120Y of the first groove 21120 (i.e., the projections 2131P protrude and pass over the lower surface 211S2).

[0032] In some embodiments, each second groove 21122 has a third opening 21122X on the upper surface 211S1 of the body 211, and each has a plurality of fourth openings 21122Y on the lower surface 211S2 of the body 211. The fourth openings 21122Y are formed along the extending direction of the second groove 21122 and are spaced apart from each other. The dimensions of each fourth opening 21122Y are smaller than the dimensions of the third opening 21122X. The second shielding component 2133 has a plurality of projections 2133P. When the second shielding component 2133 is inserted into the second groove 21122 through the third openings 21122X, the projections 2133P protrude from the lower surface 211S2 through the corresponding fourth openings 21122Y of the second groove 21122 (i.e., the projections 2133P protrude and pass over the lower surface 211S2).

[0033] In some embodiments, each first projection 2131P of the first shielding component 2131 has a third surface 2131PS, and all third surfaces 2131PS are substantially coplanar. Each second projection 2133P of the second shielding component 2133 has a fourth surface 2133PS, and all fourth surfaces 2133PS are substantially coplanar. In some embodiments, all of the third surfaces 2131PS and all of the fourth surfaces 2133PS are substantially coplanar.

[0034] Referring to Figure 2L, cross-sectional views of a first shielding component 2131 and a second shielding component 2133 according to some embodiments of the present disclosure are shown. Specifically, each first shielding component 2131 has a plurality of first joints 21310, and each second shielding component 2133 has a plurality of second joints 21330. When the first shielding components 2131 and the second shielding components 2133 are arranged alternately, the first joints 21310 accept the second shielding component 2133, and the second joints 21330 accept the first shielding component 2131.

[0035] In some embodiments, the first joint 21310 and the second joint 21330 are slots that engage with each other. In these embodiments, the depth of the first joint 21310 is substantially equal to half the height of the first shielding component 2131, and the depth of the second joint 21330 is substantially equal to half the height of the second shielding component 2133. If the first shielding component 2131 and the second shielding component 2133 have the same height, the heights of the first and second shielding components 2131 and 2133 that engage with each other are equal to the original height of the first shielding component 2131 or the second shielding component 2133.

[0036] It should be noted that these embodiments do not limit the implementation of the first shielding component 2131 and the second shielding component 2133. In some embodiments, the first shielding component 2131 and the second shielding component 2133 have the same height, and the sum of the depths of the first joint 21310 and the second joint 21330 is substantially equal to the height of the first shielding component 2131 or the second shielding component 2133, and the heights of the first and second shielding components 2131 and 2133 engaging with each other are substantially equal to the original height of the first shielding component 2131 or the second shielding component 2133. In some embodiments, the first shielding component 2131 and the second shielding component 2133 are monolithic (formed as a single unit).

[0037] Accordingly, the structure of the socket assembly 21 effectively blocks signal interference when pogo pins 13, received in two adjacent through-holes (e.g., first through-hole 2110-1 or second through-hole 2110-2), are used for signal transmission during chip testing. This is achieved by the first shielding component 2131 or the second shielding component 2133 (in this case, the first shielding component 2131 and the second shielding component 2133 are inserted into the first groove 21120 and the second groove 21122, respectively) positioned between the two adjacent through-holes (e.g., first through-hole 2110-1 and second through-hole 2110-2). The protrusions 2131P and 2133P of the first shielding component 2131 and the second shielding component 2133 extend the shielding range between the pogo pins 23, improving signal interference shielding.

[0038] Referring to Figure 2A, for example, when pogo pins 23A and 23B, which are received in through holes 2110A and 2110B, are used for signal transmission during chip testing, signal interference is effectively blocked by the second shielding component 2133A, which is inserted into the second groove 21122A located between the through holes 2110A and 2110B. Furthermore, the protrusion 2133P of the second shielding component 2133A extends the shielding area.

[0039] Refer to Figures 2M to 2O. Figure 2M is a perspective view of a socket assembly 21' according to some embodiment of the present disclosure. Figure 2N is a cross-sectional view of a socket assembly 21' according to some embodiment of the present disclosure. Figure 2O is another cross-sectional view of a socket assembly 21' according to some embodiment of the present disclosure. Specifically, the socket assembly 21' further includes a circuit board 25 compared to the socket assembly 21. The circuit board 25 is located on the upper surface 211S1 of the body 211 and is electrically connected to pogo pins 23 to transmit test-related signals. The other end of each pogo pin 23 is configured to contact an object under test (not shown). In some embodiments, a first shielding component 2131, a second shielding component 2133, and the circuit board 25 are electrically connected to form a ground loop.

[0040] In some embodiments, the socket assembly 21' includes a first shielding component 2131'. The first shielding component 2131' has a first fixing structure 2131F compared to the first shielding component 2131. The circuit board 25 has a second fixing structure 251 corresponding to the shape of the first fixing structure 2131F. The first fixing structure 2131F and the second fixing structure 251 can engage with each other, allowing for a firm coupling between the first shielding component 2131' and the circuit board 25. In these embodiments, the first fixing structure 2131F is hook-shaped, and the second fixing structure 251 is notch-shaped, corresponding to the hook-shaped first fixing structure 2131F, but it should be noted that the disclosure is not limited thereto. Thus, in modified embodiments, the second fixing structure 251 is hook-shaped, and the first fixing structure 2131F is notch-shaped, corresponding to the hook-shaped second fixing structure 251. In some embodiments, the first fixing structure 2131F of the first shielding component 2131' and the second fixing structure 251 of the circuit board 25 are electrically connected to form a ground loop. Similarly, the second shielding component 2133 has the aforementioned fixing structure and can therefore engage with the circuit board 25, and the relevant details are not repeated for brevity.

[0041] Referring to Figure 2P, an enlarged view of a portion of Figure 2N is shown. In some embodiments, a third distance D26 is defined between the end 2133E of each projection 2133P of the second shielding component 2133 and the lower surface 211S2 (i.e., between the third surface 2131PS and the lower surface 211S2), and a fourth distance D27 is defined between the lower surface 211S2 and adjacent pogo pins 23 that are respectively received in through holes. The fourth distance D27 is greater than the third distance D26, and the difference is greater than or equal to the compression stroke of the pogo pin 23 so that the compressed pogo pin 23 does not engage with the projection 2133P of the second shielding component 2133. Similarly, the first shielding component 2131 also has the above-described technical features for preventing the compressed pogo pin 23 from engaging with the projection 2131P of the first shielding component 2131, and the relevant details are not repeated for brevity.

[0042] Referring to Figure 3, perspective views of a socket assembly 31 according to several embodiments of the present disclosure are shown. Specifically, the socket assembly 31 includes a body 311 and a plurality of shielding components 313. The body 311 has a top surface 311S1. The body 311 has a plurality of through holes 3110 and a plurality of independent grooves 3112. The grooves 3112 do not communicate with each other. Each groove 3112 is located between two adjacent through holes 3110. The shielding components 313 are inserted into and positioned in the grooves 3112. The through holes 3110 receive a plurality of pogo pins 33.

[0043] Referring to Figure 4A, a perspective view of a socket assembly 41 according to several embodiments of the present disclosure is shown. Specifically, the socket assembly 41 includes a body 411 and a plurality of shielding components 413. The body 411 has a top surface 411S1. The body 411 has a plurality of through holes 4110 and a plurality of grooves 4112. Two grooves 4112 are located between any two adjacent through holes 4110. The plurality of shielding components 413 are inserted into and positioned in the plurality of grooves 4112. The plurality of through holes 4110 receive a plurality of pogo pins 43.

[0044] Referring to Figure 4B, perspective views of socket assemblies 41' according to several embodiments of the present disclosure are shown. Specifically, the difference between socket assembly 41' and socket assembly 41 is that the grooves 4112 and shielding components 413 of socket assembly 41' are interleaved, which also achieves a shielding effect.

[0045] In some embodiments, the width of the groove is smaller than the thickness of the corresponding pogo pin. In some embodiments, the material of the body includes an insulating material to prevent electrical contact between the pogo pins, and the body is monolithic (e.g., by injection molding) to form a block-shaped solid with through holes and grooves. In some embodiments, the material from which the shielding component is made includes a metallic material (e.g., a conductive metallic material) to block signal interference.

[0046] In these embodiments, the shielding component is placed between any two pogo pins, but the disclosure is not limited thereto. As is well known to those skilled in the art, in some embodiments it is not necessary to block the signals generated from all pogo pins, so it is possible to place the shielding component only between the pogo pins that need to be shielded (e.g., pogo pins for detecting high-frequency signals).

[0047] Furthermore, please note that the pogo pins in this disclosure are provided for illustrative purposes only. A variety of probe pins are within the scope intended by this disclosure.

[0048] In embodiments, similar components may be shown in the accompanying drawings, but for the sake of brevity and ease of understanding, only one of these similar components is shown in the accompanying drawings without limiting the disclosure. Those skilled in the art should be able to recognize and understand the similar components shown in the accompanying drawings.

[0049] Accordingly, embodiments of the present disclosure provide a plurality of socket assemblies, each including a shielding component embedded within the socket assembly and adapted to achieve shielding between pogo pins, in order to reduce signal interference during the testing process, thereby effectively improving the stability and accuracy of the testing.

[0050] While the Disclosure and its merits have been described above, those skilled in the art will understand that various modifications, substitutions, and replacements may be made to the Disclosure, without departing from the spirit and scope set forth in the claims attached to the Disclosure. For example, the processes described above may be implemented in different ways and may be replaced by any other processes or combinations thereof.

[0051] The scope of this disclosure is not limited to any specific embodiment of any process, machine, manufacture, composition, means, method, and process described herein. The disclosure described herein enables a person skilled in the art to implement the disclosure using any existing or potential process, machine, manufacture, composition, means, method, or process that has the same function as or can achieve substantially the same results as those disclosed in the embodiments described above. Accordingly, these processes, machines, manufacture, composition, means, method, and process fall within the scope of the appended claims of this disclosure. [Explanation of symbols]

[0052] 11 Socket Assembly 13 Pogopin 111 Main unit 1110 Through hole 1110AR1 First Through-Hole Array 1110AR2 Second Through-Hole Array 111S1 Top 111S2 Bottom side 1112 Groove 11120 First groove 11122 Second groove 113, 113A Shielding components 1131 First shielding component 1131S 1st page 1133 Second shielding component 1133S 2nd side 21 Socket Assembly 211 Main Unit 2110AR1 First Through-Hole Array 2110AR2 Second Through-Hole Array 2110-1 First through hole 2110-2 Second through hole 21120 First groove 21120X 1st opening 21120Y 2nd opening 21122 2nd groove 21122X 3rd opening 21122Y 4th opening 211S1 Top 211S2 Bottom side 211S3 bottom 213 Shielding components 2131 First shielding component 21310 1st joint 2131P protrusion 2131S 1st page 2131PS 3rd page 2133 Second shielding component 21330 Second joint 2133E End 2133P protrusion 2133S 2nd side 2133PS 4th page 21' Socket Assembly 2131' First shielding component 2131F 1st fixed structure 23 Pogopin 25 Circuit boards 251 Second fixed structure 31 Socket Assembly 311 Main Unit 3110 Through hole 3112 Groove 311S1 Top 313 Shielding components 33 Pogopin 41 Socket Assembly 411 Main Unit 4110 Through hole 4112 Groove 411S1 Top 413 Shielding components 41' Socket Assembly 43 Pogopin D11 1st distance D12 2nd distance D13 1st direction D14 2nd direction D21 The first distance between each first surface 2131S and the lower surface 211S2 D22 The second distance between each second surface 2133S and the lower surface 211S2 D23 1st direction D24 2nd direction D25 Thickness between bottom surface 211S3 and bottom surface 211S2 D26 Third distance between the end portion 2133E of each protrusion 2133P and the lower surface 211S2 D27 The fourth distance between the lower surface 211S2 and adjacent pogo pins 23

Claims

1. A socket assembly used with a chip test socket, the socket assembly comprising a body, a plurality of first shielding components, a plurality of second shielding components, and a plurality of pogo pins, The aforementioned main body is Top surface and, The lower surface opposite the upper surface, A plurality of first through-hole arrays, each containing a plurality of first through-holes aligned in a first direction, A plurality of second through-hole arrays, each containing a plurality of second through-holes aligned in a second direction, A plurality of first grooves, each extending in the first direction, wherein any two adjacent arrays of first through-holes have a plurality of first grooves, with one of the first grooves positioned between them. A plurality of second grooves, each extending in the second direction, wherein any two adjacent second through-hole arrays have a plurality of second grooves, one of which is positioned between them. It has, Each of the plurality of first shielding components has a first surface and is inserted into the first groove from the top surface. Each of the plurality of second shielding components has a second surface and is inserted into the second groove from the upper surface. The plurality of pogo pins are arranged in the first through hole and the second through hole, The first distance is defined between each of the first surfaces of the first shielding component and the lower surface. A socket assembly in which a second distance is defined between each of the second surfaces of the second shielding component and the lower surface.

2. The socket assembly according to claim 1, wherein the plurality of first surfaces are on the same plane and the plurality of second surfaces are on the same plane.

3. The socket assembly according to claim 2, wherein the first surface and the second surface are on the same plane.

4. The socket assembly according to claim 1, wherein the first distance is equal to the second distance.

5. The socket assembly according to claim 1, wherein the first direction is perpendicular to the second direction, the first groove and the second groove are arranged alternately, and the first shielding component and the second shielding component are arranged alternately.

6. The socket assembly according to claim 5, wherein each of the first shielding components has a plurality of first joints, the first joints receiving the second shielding component.

7. The socket assembly according to claim 6, wherein each of the second shielding components has a plurality of second joints, the second joints receiving the first shielding component.

8. Each of the first grooves has a first opening on the upper surface of the main body and a plurality of second openings on the lower surface of the main body, and the dimensions of each of the second openings are smaller than the dimensions of the first openings. The socket assembly according to claim 1, wherein each of the second grooves has a third opening on the upper surface of the body, and a plurality of fourth openings on the lower surface of the body, the dimensions of each of the fourth openings being smaller than the dimensions of the third openings.

9. The socket assembly according to claim 8, wherein at least one of the first shielding components has a plurality of first protrusions, each of which is positioned to penetrate the second opening of the first groove, and the first protrusions protrude from the lower surface.

10. The socket assembly according to claim 9, wherein at least one of the second shielding components has a plurality of second protrusions, each of which is positioned to penetrate the fourth opening of the second groove, and the second protrusions protrude from the lower surface.

11. The socket assembly according to claim 10, wherein a third distance is defined between the ends of each of the first and second projections and the lower surface, and when the first pogo pin of the pogo pin is received in the corresponding through hole, a fourth distance is defined between the end of the first pogo pin and the lower surface, and the difference between the fourth distance and the third distance is greater than or equal to the compression stroke of the first pogo pin.

12. The socket assembly according to claim 10, wherein each of the first protrusions has a third surface, the third surfaces of a plurality of first protrusions are on the same plane, and each of the second protrusions has a fourth surface, the fourth surfaces of a plurality of second protrusions are on the same plane.

13. The socket assembly according to claim 12, wherein the third and fourth surfaces are on the same plane.

14. The socket assembly according to claim 1, further comprising a circuit board disposed on the upper surface of the main body, wherein the first shielding component and the second shielding component are electrically connected to the circuit board to form a ground loop.

15. The socket assembly according to claim 1, further comprising a circuit board disposed on the upper surface of the main body, wherein the first shielding component and the second shielding component each have a plurality of first fixing structures that engage with a plurality of second fixing structures of the circuit board.

16. The socket assembly according to claim 15, wherein the first fixing structure is electrically connected to the second fixing structure.

17. The socket assembly according to claim 1, wherein the width of the first groove and the width of the second groove are smaller than the thickness of the pogo pin.

18. The socket assembly according to claim 1, wherein the main body is made of an insulating material, and the materials of the first shielding component and the second shielding component include a conductive metallic material.

19. The socket assembly according to claim 1, wherein the first groove and the second groove share a bottom surface within the main body, and their thickness is defined between the bottom surface within the main body and the lower surface of the main body.

20. A socket assembly comprising a body, a plurality of shielding components, and a plurality of pogo pins, The aforementioned main body is A plurality of through holes, wherein at least a first portion of the through holes forms a plurality of first through hole arrays, and at least a second portion of the through holes forms a plurality of second through hole arrays, A plurality of grooves, wherein at least a first portion of the grooves is located between any two adjacent first through-hole arrays, and at least a second portion of the grooves is located between any two adjacent second through-hole arrays. It has, The aforementioned plurality of shielding components are inserted into and positioned in the grooves. The plurality of pogo pins are arranged in the through holes. A socket assembly in which the main body includes an insulating material and the plurality of shielding components include a conductive metallic material.

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