Semiconductor inspection equipment and semiconductor inspection method

Abstract

This invention provides a semiconductor inspection apparatus and semiconductor inspection method that enable accurate measurement of delay. [Solution] The inspection processing unit 100 comprises a photoelectron pulse generating means 101 that generates photoelectron pulses at time intervals for measuring the signal delay occurring in a semiconductor sample to be measured; an irradiation processing means 102 that irradiates the surface of the semiconductor sample with the photoelectron pulses; a short needle / absorption current acquisition means 103 that extracts the short needle / absorption current flowing through the semiconductor sample irradiated with the photoelectron pulses via a short needle 310 that contacts the semiconductor sample; a timing signal output means 104 that outputs a timing signal for the generation of the photoelectron pulses; and a signal delay information creation means 105 that creates signal delay information at the short needle based on the short needle / absorption current extracted by the short needle / absorption current acquisition means 103 and the timing signal output by the timing signal output means 104.

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